CN113494864A - Temperature-equalizing plate and manufacturing method thereof - Google Patents
Temperature-equalizing plate and manufacturing method thereof Download PDFInfo
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- CN113494864A CN113494864A CN202010277027.0A CN202010277027A CN113494864A CN 113494864 A CN113494864 A CN 113494864A CN 202010277027 A CN202010277027 A CN 202010277027A CN 113494864 A CN113494864 A CN 113494864A
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- 238000004519 manufacturing process Methods 0.000 title claims description 17
- 239000012530 fluid Substances 0.000 claims abstract description 29
- 229910052751 metal Inorganic materials 0.000 claims abstract description 23
- 239000002184 metal Substances 0.000 claims abstract description 23
- 239000011148 porous material Substances 0.000 claims abstract description 16
- 239000012466 permeate Substances 0.000 claims abstract description 7
- 238000010438 heat treatment Methods 0.000 claims abstract description 6
- 238000000576 coating method Methods 0.000 claims abstract description 5
- 239000011248 coating agent Substances 0.000 claims abstract description 4
- 238000005530 etching Methods 0.000 claims description 20
- 238000000034 method Methods 0.000 claims description 15
- 238000009713 electroplating Methods 0.000 claims description 14
- 238000007747 plating Methods 0.000 claims description 12
- 238000002347 injection Methods 0.000 claims description 9
- 239000007924 injection Substances 0.000 claims description 9
- 230000001681 protective effect Effects 0.000 claims description 9
- 238000007789 sealing Methods 0.000 claims description 6
- 238000005260 corrosion Methods 0.000 claims description 3
- 230000007797 corrosion Effects 0.000 claims description 3
- 230000005764 inhibitory process Effects 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 abstract description 12
- 230000000694 effects Effects 0.000 abstract description 5
- 239000000843 powder Substances 0.000 description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 239000000243 solution Substances 0.000 description 6
- 230000001680 brushing effect Effects 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 239000007769 metal material Substances 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
- F28F3/04—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
- F28F3/042—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element in the form of local deformations of the element
- F28F3/044—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element in the form of local deformations of the element the deformations being pontual, e.g. dimples
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
- F28F9/007—Auxiliary supports for elements
- F28F9/0075—Supports for plates or plate assemblies
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a temperature-equalizing plate for heat dissipation of heating electronic components, which comprises: the lower surface of the upper plate is provided with a plurality of first grooves and a plurality of first lugs which are alternately distributed, each first lug is provided with a first abutting surface, and the first abutting surfaces are flush with the lower surface of the upper plate; the upper surface of the lower plate is concavely provided with a second groove, the lower surface of the lower plate is used for contacting with the heating electronic element, and the upper surface of the lower plate is correspondingly sealed with the lower surface of the upper plate; the first capillary structure is a metal coating with pores, the first capillary structure is positioned in the second groove, the upper surface of the first capillary structure is flush with the upper surface of the lower plate, the first abutting surface is just abutted against the upper surface of the first capillary structure, and the working fluid is positioned in the first grooves and permeates into the pores of the first capillary structure. The design ensures that the plate at the position of the upper plate corresponding to the first groove and the plate at the position of the lower plate corresponding to the second groove do not collapse or expand, so that the temperature-equalizing plate has good heat dissipation effect.
Description
[ technical field ] A method for producing a semiconductor device
The present invention relates to a vapor chamber and a method for manufacturing the same, and more particularly, to a vapor chamber with improved heat dissipation efficiency and a method for manufacturing the same.
[ background of the invention ]
There is a conventional vapor chamber having an upper plate and a lower plate. The lower surface of the upper plate is provided with a plurality of first convex blocks and a plurality of first grooves which are alternately distributed. Each first bump is provided with a first abutting surface, the upper plate is also provided with at least one first mounting surface, and the first mounting surface is higher than the first abutting surface in the vertical direction. The lower plate is provided with a second groove, a layer of capillary structure is formed in the second groove in a sintering mode, and the upper surface of the capillary structure is lower than the upper surface of the lower plate. When the upper plate and the lower plate are installed, the first installation surface is abutted against the upper surface of the lower plate, and the first abutting surface is abutted against the upper surface of the capillary structure in the second groove. The first grooves are communicated with the second grooves to form a containing cavity, and a heat dissipation fluid is arranged in the containing cavity. Thus, an external heating element of the temperature equalizing plate can dissipate heat.
However, since the first mounting surface and the first abutting surface are two reference surfaces having different heights in the vertical direction, a tolerance therebetween may be relatively large. Therefore, once the distance between the first mounting surface and the first abutting surface deviates, the first abutting surface cannot abut against the upper surface of the capillary structure, or the first mounting surface cannot abut against the upper surface of the lower plate, or the abutting force between the first abutting surface and the capillary structure is too large. If the first abutting surface cannot abut against the upper surface of the capillary structure, the plate at the position of the upper plate corresponding to the cavity collapses downwards or expands upwards due to the fact that the air pressure in the cavity is different from the air pressure in the air, and therefore the service life of the temperature equalizing plate is affected. If the first mounting surface cannot abut against the upper surface of the lower plate, the temperature-equalizing plate cannot be sealed, and therefore the heat dissipation effect of the temperature-equalizing plate is affected. If the abutting force between the first abutting surface and the capillary structure is too large, the capillary structure is distorted and deformed, so that the return path of the heat dissipation fluid is bent and lengthened, and even blocked, thereby affecting the heat dissipation effect of the temperature equalization plate.
Therefore, it is necessary to design a vapor chamber and a method for manufacturing the same to overcome the above problems.
[ summary of the invention ]
The invention aims to provide a temperature-uniforming plate for improving heat dissipation efficiency and a manufacturing method thereof.
In order to achieve the purpose, the temperature-equalizing plate adopts the following technical scheme:
a vapor chamber for dissipating heat from a heat generating electronic component, comprising: the upper plate is provided with a plurality of first grooves in a concave mode, a first convex block is formed between the two first grooves, each first convex block is provided with a first abutting surface, and the first abutting surfaces are flush with the lower surface of the upper plate; a second groove is concavely arranged on the upper surface of a lower plate, the lower surface of the lower plate is used for contacting with the heating electronic element, and the upper surface of the lower plate is correspondingly sealed with the lower surface of the upper plate; and the first capillary structure is a metal coating with pores, the first capillary structure is positioned in the second groove, the upper surface of the first capillary structure is flush with the upper surface of the lower plate, the first abutting surface is just abutted against the upper surface of the first capillary structure, and the working fluid is positioned in the first grooves and permeates into the pores of the first capillary structure.
Furthermore, each first groove is provided with a first plane, a second capillary structure is attached to the first plane, the second capillary structure does not exceed the lower surface of the upper plate, each first bump is provided with at least one side face, a third capillary structure is attached to the side face, the lower surface of the third capillary structure is flush with the first abutting face, and the third capillary structure is connected with the second capillary structure.
Further, in the vertical direction, there is a gap between the working fluid and the second capillary structure.
Furthermore, the upper plate is provided with a plurality of first lugs at intervals along the transverse direction and the longitudinal direction.
Furthermore, the plurality of first grooves, the plurality of first bumps and the plurality of second grooves are all formed by etching, the depth of each first groove in the vertical direction is equal to one half of the thickness of the upper plate, and the depth of each second groove is equal to one half of the thickness of the lower plate.
In addition, the invention also provides a manufacturing method of the temperature-uniforming plate, which is characterized by comprising the following steps: step 1, providing an upper plate and a lower plate, wherein the upper plate is provided with an area to be etched and a non-etched area, the lower plate is provided with an area to be etched and a non-etched area, and the non-etched areas of the upper plate and the lower plate are both subjected to corrosion inhibition treatment; step 2, etching the area to be etched of the upper plate from the lower surface of the upper plate to form a plurality of first bumps and a plurality of first grooves on the upper plate, and etching the area to be etched of the lower plate from the upper surface of the lower plate to form a second groove on the lower plate; step 3, plating a first capillary structure in the second groove, wherein the first capillary structure is a metal plating layer with pores, and the upper surface of the first capillary structure is just level with the upper surface of the lower plate; step 4, sealing the lower surface of the upper plate and the upper surface of the lower plate and reserving an injection hole, wherein the first bump is just abutted against the upper surface of the first capillary structure; step 5, working fluid enters the plurality of first grooves through the injection hole and permeates pores of the first capillary structure; and 6, sealing the injection hole.
Further, in step 1, a plurality of protective films are respectively placed in the non-etching area on the lower surface of the upper plate and the non-etching area on the upper surface of the lower plate, wherein the protective films are used for preventing the non-etching areas from being etched and for performing plating resistance on a first abutting surface of the first bump.
Further, in step 3, the first groove has a first plane, the first bump has at least one side surface, the first plane is electroplated to form a second capillary structure, the second capillary structure does not exceed the lower surface of the upper plate in the vertical direction, the side surface is electroplated to form a third capillary structure, the third capillary structure is flush with the lower surface of the upper plate in the vertical direction, and the third capillary structure is connected with the second capillary structure.
Further, in step 3, a plurality of burrs protruding from the lower surface of the upper plate and the upper surface of the lower plate are formed by electroplating, and after step 3, the plurality of burrs protruding from the lower surface of the upper plate and the plurality of burrs protruding from the upper surface of the lower plate are brushed, and then step 4 is performed.
Further, in step 4, the first capillary structures are arranged in the forward direction of the first bumps and the first grooves
Compared with the prior art, the temperature-uniforming plate has the following beneficial effects:
according to the invention, the first abutting surface is flush with the lower surface of the upper plate, so that the reference surfaces of the first abutting surface and the lower surface of the upper plate are the same plane, and the manufacturing tolerance between the first abutting surface and the lower surface of the upper plate is reduced. And the upper surface of the first capillary structure in the second groove is flush with the upper surface of the lower plate, and the first abutting surface abuts against the upper surface of the first capillary structure. Therefore, when the lower surface of the upper plate and the upper surface of the lower plate are sealed, the first capillary structure can also abut against the first abutting surface, so that even if the air pressure in the first groove and the second groove is different from the air pressure in the air, the first capillary structure can be ensured to abut against the first abutting surface, so that the plate at the position of the upper plate corresponding to the first groove and the plate at the position of the lower plate corresponding to the second groove cannot collapse or expand, and the uniform temperature plate has a good heat dissipation effect.
[ description of the drawings ]
FIG. 1 is a perspective view of a first embodiment of a vapor chamber of the present invention;
FIG. 2 is a schematic perspective view of the vapor chamber of the present invention before electroplating;
FIG. 3 is a perspective view of the lower plate of the vapor chamber of the present invention before electroplating;
FIG. 4 is a cross-sectional view taken along A-A of FIG. 1;
FIG. 5 is an enlarged view of position B of FIG. 4;
FIG. 6 is a flow chart illustrating the manufacturing process of the first embodiment of the method for manufacturing the upper plate of the vapor chamber of the present invention;
FIG. 7 is a flow chart illustrating the manufacturing process of the lower plate of the vapor chamber according to the first embodiment of the present invention;
figure 8 is a cross-sectional view of a second embodiment of the vapor plate of the present invention.
Detailed description of the embodiments reference is made to the accompanying drawings in which:
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| Burr 3 | Non-etched |
Region to be etched 5 |
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[ detailed description ] embodiments
For a better understanding of the objects, structure, features, and functions of the invention, reference should be made to the drawings and detailed description that follow.
Referring to fig. 1, fig. 2, fig. 3 and fig. 4, a temperature equalization plate 1000 for a heat generating electronic device (not shown, the same below) to dissipate heat according to the present invention includes an upper plate 1 and a lower plate 2, wherein the upper plate 1 has a plurality of first grooves 13 and a plurality of first bumps 12, the lower plate 2 has a second groove 22, and a first capillary structure 23 is further disposed in the second groove 22. When the upper plate 1 and the lower plate 2 are sealed in a matching manner, the plurality of first grooves 13 are communicated with the plurality of second grooves 22, and the working fluid 7 is disposed in the first grooves 13 and the second grooves 22, so that the heat-generating electronic component is dissipated by the uniform temperature plate 1000.
As shown in fig. 2, 4, 5 and 6, the upper plate 1 is made of a copper metal plate (in other embodiments, the upper plate 1 may also be made of a metal material such as aluminum), and the upper plate 1 is arranged in a rectangular shape (in other embodiments, the upper plate 1 may also be in other shapes such as a circular shape). The upper surface of the upper plate 1 is a horizontal surface for connecting with an external component (not shown, the same below). Four first installation parts 11 are arranged on the periphery of the lower surface of the upper plate 1, and the four first installation parts 11 are connected with each other. Each of the first mounting portions 11 has a first mounting surface 111 and a first inner sidewall 112, and the first inner sidewall 112 is connected to the first mounting surface 111. The four first mounting surfaces 111 are flush with the lower surface of the upper plate 1 in the vertical direction, and the four first mounting surfaces 111 are used for being matched and mounted with the upper surface of the lower plate 2. The lower surface of the upper plate 1 is further provided with a plurality of first protruding blocks 12, and the first protruding blocks 12 are all located in the space enclosed by the four first mounting portions 11. Each of the first bumps 12 has a first abutting surface 121 and four side surfaces 122 connected to the first abutting surface 121 (in other embodiments, one side surface 122 may be connected to the first abutting surface 121). The first abutting surface 121 is a horizontal surface, the first abutting surface 121 is flush with the first mounting surface 111 in the vertical direction, and the first abutting surface 121 is used for abutting against the first capillary structure 23 in the second groove 22. The lower surface of the upper plate 1 is etched to form a plurality of first grooves 13, the plurality of first grooves 13 and the plurality of first protrusions 12 are alternately arranged, and the plurality of first grooves 13 are communicated with each other in the front-rear and left-right directions, so that the working fluid 7 can flow between the plurality of first grooves 13. The first groove 13 further has a first plane 131, and the first plane 131 is located above the first abutting surface 121. The first plane 131 is connected to both the first inner sidewall 112 and the side surface 122, and the depth of the first groove 13 in the vertical direction is substantially equal to one-half of the thickness of the upper plate 1 (of course, the depth of the first groove 13 may be greater than or less than one-half of the thickness of the upper plate 1). In other words, the distance between the first plane 131 and the upper surface of the upper plate 1 is equal to the distance between the first plane 131 and the lower surface of the upper plate 1 (of course, the distance between the first plane 131 and the upper surface of the upper plate 1 may be smaller or larger than the distance between the first plane 131 and the lower surface of the upper plate 1). The upper plate 1 further has a condensation area located above the plurality of first grooves 13 for condensing the working fluid 7 evaporated into a gas after being heated into a liquid, so that the working fluid 7 can be recycled.
As shown in fig. 4, 5 and 6, a second capillary structure 14 is plated on the first plane 131, and the second capillary structure 14 is a metal plating layer with pores made of metal powder plating (in this embodiment, the metal powder is copper powder, but may be other metal powder in other embodiments). The second capillary structure 14 does not exceed the first abutting surface 121 in the vertical direction, and a plurality of burrs 3 are also formed on the second capillary structure 14 in the electroplating process, and the burrs 3 are located in the first groove 13. A third capillary structure 15 is plated on the side surface 122 and the first inner side wall 112, and the third capillary structure 15 is a metal plating layer with pores made of metal powder by plating (in this embodiment, the metal powder is copper powder, but other metal powders may be used in other embodiments). The third capillary structure 15 is flush with the first abutting surface 121 in the vertical direction, the third capillary structure 15 also forms a plurality of burrs 3 in the electroplating process, a part of the burrs 3 protrudes from the first abutting surface 121, and the other part of the burrs 3 is arranged in the first groove 13. The third capillary structure 15 is connected to the second capillary structures 14, and the thickness of the third capillary structure 15 is equal to the thickness of the second capillary structures 14 (of course, in other embodiments, the thickness of the third capillary structure 15 may be greater than or less than the thickness between the second capillary structures 14).
As shown in fig. 2, 3, 4, 5 and 7, the lower plate 2 is made of a copper metal plate (in other embodiments, the upper plate 1 may be made of a metal material such as aluminum), and the lower plate 2 is arranged in a rectangular shape (in other embodiments, the upper plate 1 may be in other shapes such as a circular shape). The lower surface of the lower plate 2 is a horizontal plane, and the lower surface of the lower plate 2 is used for dissipating heat with the heating electronic component. Four second mounting portions 21 are formed around the upper surface of the lower plate 2, and the four second mounting surface portions 21 are connected to each other. Each of the second mounting portions 21 has a second mounting surface 211 and a second inner sidewall 212, and the second inner sidewall 212 is connected to the second mounting surface 211. The four second mounting surfaces 211 are flush with the upper surface of the lower plate 2 in the vertical direction, and the four second mounting surfaces 211 are sealed with the four first mounting surfaces 111. The lower plate 2 is further etched to form the second groove 22, no protrusion is disposed in the second groove 22, and the second groove 22 is located between the four second mounting surfaces 211. The depth of the second recess 22 in the vertical direction is substantially equal to one-half the thickness of the lower plate 2 (although the thickness of the first recess 13 may be greater or less than one-half the thickness of the upper plate 1). The first capillary structure 23 is filled in the second groove 22 by electroplating, and the first capillary structure 23 is flush with the second mounting surface 211 in the vertical direction. The first capillary structure 23 is a metal coating with pores formed by electroplating metal powder (in the present embodiment, the metal powder is copper powder, but other metal powders may be used in other embodiments). The first capillary structure 23 further forms a plurality of burrs 3 in the electroplating process, and the burrs 3 protrude from the second mounting surface 211. The lower plate 2 also has an evaporation zone located below the second groove 22 and in contact with the heat-generating electronic components. As shown in fig. 6, before the upper plate 1 and the lower plate 2 are sealed, the burr 3 of the first capillary structure 23 is brushed flat by a brushing tool, and the burr 3 of the third capillary structure 15 protruding from the first abutting surface 121 is brushed flat by the brushing tool.
As shown in fig. 4, 5, 6 and 7, when the upper plate 1 and the lower plate 2 are sealed, the four first mounting surfaces 111 correspond to the four second mounting surfaces 211 one by one, and are sealed by welding, the first abutting surfaces 121 of the first bumps 12 abut against the first capillary structures 23, and the first grooves 13 communicate with the second grooves 22, so that the first capillary structures 23, the second capillary structures 14 and the third capillary structures 15 communicate with each other, and a plurality of return paths are formed for the working fluid 7 to flow. The working fluid 7 is contained in the first groove 13 and permeates into the gap of the first capillary structure 23, and a gap 71 is formed between the working fluid 7 and the first capillary structure 23 of the first plane 131 in the vertical direction, and the working fluid 7 is heated and evaporated in the gap 71, so that the working fluid 7 circularly flows in the first capillary structure 23, the second capillary structure 14 and the third capillary structure 15 (as shown in fig. 4, the direction of an arrow is the flow direction of the working fluid 7, and of course, the flow direction thereof is not limited, and the flow direction thereof may be clockwise or counterclockwise).
As shown in fig. 4, 6 and 7, a first embodiment of a method of fabricating the vapor chamber 1000 is described below (for convenience, some steps are omitted in fig. 4, 6 and 7):
step 1, providing the upper plate 1 and the lower plate 2, where the upper plate 1 and the lower plate 2 are both metal copper plates (in other embodiments, aluminum plates, etc.), the upper plate 1 has a plurality of non-etching regions 4 and a plurality of regions to be etched 5, and the lower plate 2 also has a plurality of non-etching regions 4 and one region to be etched 5. A plurality of protective films 6 (which may be other objects that can prevent the non-etched region 4 of the upper plate 1 from being etched in other embodiments) are placed on the plurality of non-etched regions 4 of the lower surface of the upper plate 1 to thereby etch-block the plurality of non-etched regions 4 of the lower surface of the upper plate 1, and a plurality of protective films 6 (which may be other objects that can prevent the non-etched region 4 of the lower plate 2 from being etched in other embodiments) are placed on the plurality of non-etched regions 4 of the upper surface of the lower plate 2 to thereby etch-block the plurality of non-etched regions 4 of the upper surface of the lower plate 2. The protective film 6 can perform both corrosion resistance and plating resistance.
And 3, placing the upper plate 1 in an electroplating solution added with metal powder for electroplating, so that a layer of the second capillary structure 14 is electroplated on the first plane 131 of each first groove 13, wherein a plurality of burrs 3 are formed on the second capillary structure 14 in the electroplating process, and the burrs 3 are positioned in the first grooves 13. A third capillary structure 15 is electroplated on the side surface 122 of each first bump 12 and the first inner side wall 112 of each first mounting portion 11, a plurality of burrs 3 are formed during the electroplating process of the third capillary structure 15, a part of the burrs 3 are arranged in the first groove 13, another part of the burrs 3 protrude from the first abutting surface 121, and the second capillary structure 14 is connected with the third capillary structure 15. The lower plate 2 is placed in a plating solution added with metal powder to be plated, so that the first capillary structures 23 are plated in the second grooves 22, and the first capillary structures 23 are flush with the upper surface of the lower plate 2. The first capillary structure 23 also forms a plurality of burrs 3 in the electroplating process, and the burrs 3 protrude from the second mounting surface 211. After that, the protective films 6 disposed on the upper plate 1 and the lower plate 2 are removed, the burrs 3 protruding from the first abutting surfaces 121 are ground by a brushing tool so that the lower surface of the upper plate 1 is flush, and the burrs 3 protruding from the second mounting surface 211 are ground by the brushing tool so that the upper surface of the lower plate 2 is flush.
And step 4, aligning the upper plate 1 with the lower plate 2, so that the four first mounting surfaces 111 correspond to the four second mounting surfaces 211 one by one, and sealing the first mounting surfaces 111 and the second mounting surfaces 211 through welding. In addition, an injection hole (not shown, the same below) and an exhaust hole (not shown, the same below) are reserved when the first mounting surface 111 and the second mounting surface 211 are sealed. At this time, the first abutting surface 121 of the first bump 12 abuts against the first capillary structure 23.
Step 5, the working fluid 7 is injected into the plurality of first grooves 13 through the injection hole (not shown, the same applies below) and permeates into the pores of the first capillary structure 23, so that the gap 71 exists between the working fluid 7 and the second capillary structure 14 in the vertical direction. After that, the air in the first grooves 13 and the second grooves 22 is evacuated through the air evacuation holes (not shown, the same applies hereinafter), so that the first grooves 13 and the second grooves 22 are in a vacuum state.
And step 6, sealing the injection hole (not shown, the same below) and the extraction hole (not shown, the same below) by welding.
As shown in fig. 8, a second embodiment of the temperature equalization plate 1000 is different from the temperature equalization plate 1000 of the first embodiment in that: the first plane 131 of the plurality of first grooves 13 is not plated with the second capillary structure 14, the side surface 122 of the first bump 12 is not plated with the third capillary structure 15, the first inner sidewall 112 of the first mounting portion 11 is also plated with the third capillary structure 15, the gap 71 is formed between the working fluid 7 and the first plane 131 of the first groove 13, and the working fluid 7 is heated to evaporate in the gap 71. Other structures are substantially the same as those of the first embodiment, and are not described herein again.
A second embodiment of the method for manufacturing the vapor chamber 1000: the manufacturing method of the second embodiment is different from that of the first embodiment in that the upper plate 1 is not plated in step 3, but only plated at the corresponding position of the lower plate 2.
In summary, the electrical connector of the present invention has the following advantages:
(1) the first abutting surface 121 is flush with the lower surface of the upper plate 1, so that the reference surfaces of the first abutting surface 121 and the lower surface of the upper plate 1 are the same plane, thereby reducing the manufacturing tolerance between the first abutting surface 121 and the lower surface of the upper plate 1. And the upper surface of the first capillary structure 23 in the second groove 22 is flush with the upper surface of the lower plate 2, and the first abutting surface 121 abuts against the upper surface of the first capillary structure. In this way, when the lower surface of the upper plate 1 and the upper surface of the lower plate 2 are sealed, the first capillary structure 23 can also abut against the first abutting surface 121, so that even if the air pressure in the first groove 13 and the second groove 22 is different from the air pressure in the air, the first capillary structure 23 can be ensured to abut against the first abutting surface 121, so that the plate at the position of the upper plate 1 corresponding to the first groove 13 and the plate at the position of the lower plate 2 corresponding to the second groove 22 cannot collapse or expand, and the temperature-uniforming plate 1000 has a good heat dissipation effect.
(2) In the vertical direction, the gap 71 is formed between the working fluid 7 and the second capillary structure 14, and the gap 71 is used for the working fluid 7 to be heated and evaporated in the gap 71, so that the temperature equalization plate 1000 has good heat dissipation capability, and the working fluid 7 can be recycled.
(3) The first capillary structure 23, the second capillary structure 14, and the third capillary structure 15 are all metal coatings with pores, and the three are connected to each other. Therefore, the first capillary structure 23, the second capillary structure 14 and the third capillary structure 15 all have the characteristics of small pores and high density, so that the diffusion speed of the working fluid 7 can be increased, and the working fluid 7 has a plurality of backflow paths due to the mutual connection of the first capillary structure, the second capillary structure and the third capillary structure, so that the heat dissipation efficiency of the temperature equalization plate 1000 is improved.
(4) In the vertical direction, the depth of the first recess 13 is substantially equal to one half of the thickness of the upper plate 1, and the depth of the second recess 22 is substantially equal to one half of the thickness of the lower plate 2. This prevents the depth of the first groove 13 and the second groove 22 from being too deep, which results in the plate body of the upper plate 1 corresponding to the first groove 13 being too thin, and the plate body of the lower plate 2 corresponding to the second groove 22 being too thin, which results in bending deformation of the upper plate 1 or the lower plate 2.
The above detailed description is only for the purpose of illustrating the preferred embodiments of the present invention, and not for the purpose of limiting the scope of the present invention, therefore, all technical changes that can be made by applying the present specification and drawings are included in the scope of the present invention.
Claims (10)
1. A vapor chamber for dissipating heat from a heat generating electronic component, comprising:
the upper plate is provided with a plurality of first grooves in a concave mode, a first convex block is formed between the two first grooves, each first convex block is provided with a first abutting surface, and the first abutting surfaces are flush with the lower surface of the upper plate;
a second groove is concavely arranged on the upper surface of a lower plate, the lower surface of the lower plate is used for contacting with the heating electronic element, and the upper surface of the lower plate is correspondingly sealed with the lower surface of the upper plate;
and the first capillary structure is a metal coating with pores, the first capillary structure is positioned in the second groove, the upper surface of the first capillary structure is flush with the upper surface of the lower plate, the first abutting surface is just abutted against the upper surface of the first capillary structure, and the working fluid is positioned in the first grooves and permeates into the pores of the first capillary structure.
2. The vapor chamber of claim 1, wherein each of the first recesses has a first plane, the first plane has a second capillary structure attached thereto, the second capillary structure does not extend beyond the lower surface of the upper plate, each of the first protrusions has at least one side surface, the side surface has a third capillary structure attached thereto, the lower surface of the third capillary structure is flush with the first abutting surface, and the third capillary structure is connected to the second capillary structure.
3. The vapor chamber of claim 2, wherein a gap is provided between the working fluid and the second capillary structure in a vertical direction.
4. The temperature-uniforming plate according to claim 2, wherein the upper plate is provided with a plurality of the first protrusions at intervals in both the lateral and longitudinal directions.
5. The vapor chamber of claim 1, wherein the first recesses, the first protrusions, and the second recesses are formed by etching, and the depth of the first recesses is equal to one-half of the thickness of the upper plate and the depth of the second recesses is equal to one-half of the thickness of the lower plate in the vertical direction.
6. The manufacturing method of the temperature-uniforming plate is characterized by comprising the following steps:
step 1, providing an upper plate and a lower plate, wherein the upper plate is provided with an area to be etched and a non-etched area, the lower plate is provided with an area to be etched and a non-etched area, and the non-etched areas of the upper plate and the lower plate are both subjected to corrosion inhibition treatment;
step 2, etching the area to be etched of the upper plate from the lower surface of the upper plate to form a plurality of first bumps and a plurality of first grooves on the upper plate, and etching the area to be etched of the lower plate from the upper surface of the lower plate to form a second groove on the lower plate;
step 3, plating a first capillary structure in the second groove, wherein the first capillary structure is a metal plating layer with pores, and the upper surface of the first capillary structure is just level with the upper surface of the lower plate;
step 4, sealing the lower surface of the upper plate and the upper surface of the lower plate and reserving an injection hole, wherein the first bump is just abutted against the upper surface of the first capillary structure;
step 5, working fluid enters the plurality of first grooves through the injection hole and permeates pores of the first capillary structure;
and 6, sealing the injection hole.
7. The method according to claim 6, wherein in step 1, a plurality of protective films are respectively disposed on the non-etching region of the lower surface of the upper plate and the non-etching region of the upper surface of the lower plate, wherein the protective films are used for preventing the non-etching regions from being etched and for performing the plating resist on a first contact surface of the first bump.
8. The method according to claim 6, wherein in step 3, the first recess has a first plane, the first protrusion has at least one side surface, the first plane is plated to form a second capillary structure, the second capillary structure does not extend beyond the lower surface of the upper plate in the vertical direction, the side surface is plated to form a third capillary structure, the third capillary structure is flush with the lower surface of the upper plate in the vertical direction, and the third capillary structure is connected to the second capillary structure.
9. The method of claim 6, wherein a plurality of burrs protruding from the lower surface of the upper plate and the upper surface of the lower plate are formed by electroplating in step 3, and after step 3, the plurality of burrs protruding from the lower surface of the upper plate and the plurality of burrs protruding from the upper surface of the lower plate are brushed, and then step 4 is performed.
10. The method according to claim 6, wherein in step 4, the first capillary structure is formed in the forward direction of the first protrusions and the first grooves.
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| CN202010277027.0A CN113494864A (en) | 2020-04-03 | 2020-04-03 | Temperature-equalizing plate and manufacturing method thereof |
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Cited By (1)
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| CN114894015A (en) * | 2022-03-24 | 2022-08-12 | 山东大学 | Heat pipe temperature equalizing plate and heat exchange system thereof |
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