CN202658220U - Magnetic control sputtering target of magnetic control sputtering film plating machine - Google Patents
Magnetic control sputtering target of magnetic control sputtering film plating machine Download PDFInfo
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- CN202658220U CN202658220U CN 201220236358 CN201220236358U CN202658220U CN 202658220 U CN202658220 U CN 202658220U CN 201220236358 CN201220236358 CN 201220236358 CN 201220236358 U CN201220236358 U CN 201220236358U CN 202658220 U CN202658220 U CN 202658220U
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Abstract
The utility model relates to the technical field of vacuum film plating, in particular to a magnetic control sputtering target of a magnetic control sputtering film plating machine. The magnetic control sputtering target of the magnetic control sputtering film plating machine comprises a target head and a target material, wherein a target core which can rotate is arranged on the target head, one end of the target core stretches out of the target head to penetrate into the internal middle portion of the target material, and magnetic blocks are distributed on the periphery of the portion where the target core penetrates into the target material. One end of the target material is axially in join connection with the target head through a flange, so that an inner cavity of the target material and an inner cavity of the target head form a communicated sealing cavity. The target core is arranged in the sealing cavity, a cooling channel is arranged inside the target core, an entrance of the cooling channel is communicated with the target head which is externally connected with cooling liquid, an exit of the cooling channel is positioned on one end head where the target core penetrates into the target material, and the exit of the cooling channel is communicated with the sealing cavity which is provided with an exit. The magnetic control sputtering target of the magnetic control sputtering film plating machine is provided with the target core which can rotate and a cooling structure which enables sputtering to be uniform and timely cools for a target. The magnetic control sputtering target of the magnetic control sputtering film plating machine has the advantages of improving the film plating effect and being simple in structure, scientific, reasonable, and low in investment cost.
Description
Technical field
The utility model relates to technical field of vacuum plating, especially the magnetron sputtering target of magnetron sputtering coater.
Background technology
Have subsequently the physical vapor deposition (PVD) technology, mainly be under vacuum environment, to carry out surface treatment, physical vapor deposition itself is divided into three kinds: vacuum vapor plating, vacuum sputtering coating and vacuum ion membrane plating, develop quite soon over past ten years, become one of current state-of-the-art surface treatment mode.It is to realize that rete is attached to workpiece surface that vacuum plating is produced, with the workpiece surface characteristic that need to obtain.Vacuum sputtering coating is to utilize target generation sputter, makes the sputter thing be attached to workpiece surface and forms rete, namely reaches plated film; Magnetron sputtering coater is common vacuum sputtering coating equipment, yet, in the magnetron sputtering target that arranges thereon, target is relative with the target core motionless, and the magnetic patch on the target core distributes and to be difficult to relatively evenly, and is difficult to guarantee that the magnetic of different magnetic patch is consistent, so that magneticstrength is variant in producing, sputter is inhomogeneous, affects coating quality, thereby preferential treatment improves.Again, owing to can produce high temperature in the magnetron sputtering process, and prior art fails effectively to lower the temperature, and causes the magnetic control effect to reduce, and is unfavorable for producing.
Summary of the invention
The purpose of this utility model is to overcome the defective of prior art, provides a kind of simple in structure, scientific and reasonable, can make sputter even, and can effectively to the target cooling, promote the magnetron sputtering target of the magnetron sputtering coater of coating effects.
For achieving the above object, the utility model adopts following technical scheme:
The magnetron sputtering target of magnetron sputtering coater includes target head and target, and the target head is provided with rotating target core, and target core one end stretches out the target head and penetrates middle part in the target, and in the part peripheral distribution that penetrates target of target core magnetic patch is arranged; One end of described target axially is engaged togather by flange and target head, just makes the target inner chamber form the annular seal space that is communicated with target head inner chamber, and the target core is arranged in annular seal space; The inside of described target core also is provided with the cooling channel, and the entrance of cooling channel is communicated to the external cooling fluid of target head; And the outlet of cooling channel is positioned at an end termination that penetrates target of target core, the outlet communication seals chamber of cooling channel, and annular seal space is provided with outlet.
Described annular seal space is provided with outlet and is arranged on the target head.
The part periphery that penetrates target of described target core also is arranged with subring, and the external diameter of subring is less than footpath within the annular seal space that is in the target.
Described magnetic patch evenly distributes by target core periphery, and adopts the distribution of high magnetic and low magnetic space.
The rotation of the utility model design target core, and be provided with the structure that cools, thus make sputter more even, in time to the target cooling, promote coating effects, obtain more excellent product.
A utility model again advantage is simple in structure, and scientific and reasonable, cost of investment is low, and Maintenance and Repair are very convenient, installs, easy to use, has greatly improved operation ratio and the operability of equipment.
Description of drawings:
Accompanying drawing 1 is preferred embodiment structural representation of the present utility model;
Embodiment:
Below in conjunction with accompanying drawing the utility model is further specified:
Consult shown in Fig. 1,2, the magnetron sputtering target of magnetron sputtering coater described in the utility model, include target head 1 and target 2, target head 1 is provided with rotating target core 3, target core 3 one ends stretch out target head 1 and penetrate target 2 interior middle parts, and in the part peripheral distribution that penetrates target 2 of target core 3 magnetic patch 4 is arranged, the penetrating on the bench insulator that the termination is positioned at target 2 ends of target core 3; Shown in Figure 2, magnetic patch 4 evenly distributes by target core 3 peripheries, and adopts an end of the described target 2 of high magnetic and low magnetic axially to be engaged togather by flange 5 and target head 1, just makes target 2 inner chambers form the annular seal space 6 that is communicated with target head 1 inner chamber, and target core 3 is arranged in annular seal space 6; The inside of described target core 3 also is provided with cooling channel 31, and the entrance 311 of cooling channel 31 is communicated to target head 1 external cooling fluid, and cooling fluid is water coolant; And the outlet 312 of cooling channel 31 is positioned at an end termination that penetrates target 2 of target core 3, the outlet 312 communication seals chambeies 6 of cooling channel 31; Annular seal space 6 is provided with outlet 61; The outlet 61 of annular seal space is arranged on the target head 1.
During enforcement, by 3 rotations of electric motor driving target core, magnetic patch 4 is followed rotation, makes the magnetic field on the target 2 more even, makes thus sputter coating more even.The entrance 311 of cooling channel 31 connects water coolant by joint, make water coolant enter 3 internal flows of target core, 31 outlet 312 flows to annular seal space 6 from the cooling channel again, outlet 61 outputs from annular seal space circulate again, realize that thus water coolant in time takes away the heat that can produce in the magnetron sputtering process, reach to the target cooling, promote coating effects, obtain more excellent product.
In the present embodiment, the part periphery that penetrates target 2 of target core 3 also is arranged with subring 7, the external diameter of subring 7 is less than footpath within the annular seal space 6 that is in the target 2, subring 7 has auxiliary positioning, prevent that target core 3 rotation from rocking, guarantee the spacing between magnetic patch 4 and the target 2, obtain stable magnetic control effect.
Certainly, above diagram is preferred embodiment of the present utility model only, is not to limit practical range of the present utility model with this, therefore every principle according to the utility model is done the equivalence variation or modified, and all should be covered by in the protection domain of the present utility model.
Claims (4)
1. the magnetron sputtering target of magnetron sputtering coater, include target head (1) and target (2), it is characterized in that: target head (1) is provided with rotating target core (3), target core (3) one ends stretch out target head (1) and penetrate middle part in the target (2), and in the part peripheral distribution that penetrates target (2) of target core (3) magnetic patch (4) are arranged; One end of described target (2) axially is engaged togather by flange (5) and target head (1), just makes target (2) inner chamber form the annular seal space (6) that is communicated with target head (1) inner chamber, and target core (3) is arranged in annular seal space (6); The inside of described target core (3) also is provided with cooling channel (31), and the entrance (311) of cooling channel (31) is communicated to the external cooling fluid of target head (1); And the outlet (312) of cooling channel (31) is positioned at an end termination that penetrates target (2) of target core (3), outlet (312) the communication seals chamber (6) of cooling channel (31), and annular seal space (6) is provided with outlet (61).
2. the magnetron sputtering target of magnetron sputtering coater according to claim 1, it is characterized in that: described annular seal space (6) is provided with outlet (61) and is arranged on the target head (1).
3. the magnetron sputtering target of magnetron sputtering coater according to claim 1, it is characterized in that: the part periphery that penetrates target (2) of target core (3) also is arranged with subring (7), and the external diameter of subring (7) is less than footpath within the annular seal space (6) that is in the target (2).
4. the magnetron sputtering target of magnetron sputtering coater according to claim 1, it is characterized in that: described magnetic patch (4) evenly distributes by target core (3) periphery, and adopts the distribution of high magnetic and low magnetic space.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220236358 CN202658220U (en) | 2012-05-24 | 2012-05-24 | Magnetic control sputtering target of magnetic control sputtering film plating machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220236358 CN202658220U (en) | 2012-05-24 | 2012-05-24 | Magnetic control sputtering target of magnetic control sputtering film plating machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202658220U true CN202658220U (en) | 2013-01-09 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220236358 Expired - Fee Related CN202658220U (en) | 2012-05-24 | 2012-05-24 | Magnetic control sputtering target of magnetic control sputtering film plating machine |
Country Status (1)
| Country | Link |
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| CN (1) | CN202658220U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102703872A (en) * | 2012-05-24 | 2012-10-03 | 广东友通工业有限公司 | Magnetron sputtering target of magnetron sputtering film plating machine |
| CN104775098A (en) * | 2014-01-11 | 2015-07-15 | 烟台力凯电子科技有限公司 | Target-type sputtering coater |
| CN115505889A (en) * | 2022-10-06 | 2022-12-23 | 鹏城半导体技术(深圳)有限公司 | Ultrahigh vacuum magnetron sputtering target and magnetron sputtering device |
-
2012
- 2012-05-24 CN CN 201220236358 patent/CN202658220U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102703872A (en) * | 2012-05-24 | 2012-10-03 | 广东友通工业有限公司 | Magnetron sputtering target of magnetron sputtering film plating machine |
| CN102703872B (en) * | 2012-05-24 | 2014-01-29 | 广东友通工业有限公司 | Magnetron sputtering target of magnetron sputtering film plating machine |
| CN104775098A (en) * | 2014-01-11 | 2015-07-15 | 烟台力凯电子科技有限公司 | Target-type sputtering coater |
| CN115505889A (en) * | 2022-10-06 | 2022-12-23 | 鹏城半导体技术(深圳)有限公司 | Ultrahigh vacuum magnetron sputtering target and magnetron sputtering device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20180502 Address after: 523000 fast track road in the eastern part of deep pit Industrial Zone, Dongguan, Guangdong. Patentee after: Guangdong Bao Bao Intelligent Equipment Technology Co., Ltd. Address before: 523000 fast track road in the eastern part of deep pit Industrial Zone, Dongguan, Guangdong. Patentee before: Guangdong Youtong Industry Co., Ltd. |
|
| TR01 | Transfer of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130109 Termination date: 20180524 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |