CN201698473U - Intelligent compound IC (Integrated Circuit) card structure - Google Patents

Intelligent compound IC (Integrated Circuit) card structure Download PDF

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Publication number
CN201698473U
CN201698473U CN201020232413XU CN201020232413U CN201698473U CN 201698473 U CN201698473 U CN 201698473U CN 201020232413X U CN201020232413X U CN 201020232413XU CN 201020232413 U CN201020232413 U CN 201020232413U CN 201698473 U CN201698473 U CN 201698473U
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China
Prior art keywords
layer
card
chip
pvc substrate
pvc
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Expired - Lifetime
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CN201020232413XU
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Chinese (zh)
Inventor
颜炳军
吴建成
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SHENZHEN SMART CARDY TECHNOLOGY Co Ltd
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SHENZHEN SMART CARDY TECHNOLOGY Co Ltd
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Priority to CN201020232413XU priority Critical patent/CN201698473U/en
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Publication of CN201698473U publication Critical patent/CN201698473U/en
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Abstract

The utility model discloses an intelligent compound IC (Integrated Circuit) card structure, which comprises an upper-layer PVC (Polyvinyl Chloride) substrate, a lower-layer PVC substrate, a contact type IC chip and a chip layer, wherein an outer layer of the upper-layer PVC substrate is provided with a first printing layer and compounded with an upper-layer film; an outer layer of the lower-layer PVC substrate is provided with a second printing layer and is compounded with a lower-layer film; the contact type IC chip penetrates through the upper-layer film and is arranged on the upper-layer PVC substrate; the chip layer is clamped between the two-layer PVC substrates and is a radio-frequency identification module; and the radio-frequency identification module further comprises an ultrahigh frequency antenna and an electronic tag, wherein the work frequency of the ultrahigh frequency antenna is between 870 and 960MHz; and the electronic tag is electrically connected with the ultrahigh frequency antenna. By using a compound means, the ultrahigh frequency antenna RFID (Radio Frequency Identification Devices) chip and the contact type IC chip are perfectly combined on a standard card, so that the utility model realizes the complementation of advantages and disadvantages of the contact type IC cards and the non-contact type IC cards and effectively prolongs the service life of the IC card.

Description

A kind of Intelligent Composite IC-card structure
Technical field
The utility model relates to a kind of smart card architecture, relates in particular to a kind of Intelligent Composite IC-card structure.
Background technology
IC-card is the meaning of integrated circuit card, and IC-card is a kind of plastic cards of built-in large scale integrated circuit, and the magnetic card size of the card phone that it is big or small and original is identical.IC-card can be divided into storage card, encrypted card and smart card three classes usually, storage card is the storer that can directly carry out the reading and writing operation to it, encrypted card is to have increased the reading and writing encryption function on the basis of storage card, when encrypted card is operated, must at first check the password in the card, password correctly just can carry out normal running, and smart card is to have microprocessor (CPU), is also referred to as the CPU card simultaneously.
Traditional IC-card is a Contact Type Ic Card, has advantages such as reliability height, security is good, dirigibility is strong; But, when using, all card reader to be injected in the IC-card contact at every turn, use very inconvenience owing to Contact Type Ic Card.The IC-card contact exists easily defective such as pollutes, easy to wear, thereby shortens its serviceable life, damages the Card Reader or the card writer of this type of card even.
Non-contact IC card claims the RFID radio-frequency card again, and the RFID radio-frequency (RF) identification is a kind of contactless automatic identification technology, and it is by the automatic recognition objective object of radiofrequency signal and obtain related data, and identification work need not manual intervention, can work in various rugged surroundings.Compare with Contact Type Ic Card, non-contact IC card need not plug-in card, and is convenient to operation, has advantages such as reliability height, good airproof performance, anti-collision simultaneously.
Also there is following defective in traditional non-contact IC card: when the card curved transitions, card lost efficacy because of the fracture of coil solder joint easily; Be subjected to environmental interference easily and fail in the communication of some occasions; Encryption method is comparatively simple, is easy to crack, and its security is lower.
The utility model content
The technical problems to be solved in the utility model is to overcome technological deficiency recited above, and a kind of Intelligent Composite IC-card structure is provided.
In order to solve technical matters recited above, the utility model is taked following technical scheme:
The utility model provides a kind of Intelligent Composite IC-card structure, include upper strata PVC substrate, the PVC of lower floor substrate, have first printed layers and be laminated with topmost thin film, have second printed layers and be laminated with lower film, also include and pass topmost thin film and be arranged at contact IC chip on the PVC substrate of upper strata, be installed in the sandwich layer between the two-layer PVC substrate at lower floor's PVC substrate outer at upper strata PVC substrate outer; Described sandwich layer is a radio frequency identification component, and radio frequency identification component further includes frequency of operation and reaches the electronic tag that electrically connects with ultra-high frequency antenna at the ultra-high frequency antenna between 870~960MHz.
Described electronic tag is formed by falling packaged chip.
The antenna of described ultra-high frequency antenna for making by etching aluminum foil.
Described contact IC chip embeds and is arranged on the PVC substrate of upper strata.Offer the embedding mounting groove of contact IC chip on the PVC substrate of described upper strata.
The frequency of operation of described ultra-high frequency antenna and electronic tag is 915MHz.
The utility model passes through composite means, with hyper band frequency RFID chip and contact IC chip perfect combination on a standard card, realize the relative merits complementation of contact and non-contact IC card, both overcome Contact Type Ic Card easy pollution, easy to wear, use defective such as inconvenience, also solve non-contact IC card easily because of problems such as the fracture of coil solder joint were lost efficacy, communication is subject to environmental interference, security is lower, prolonged the serviceable life of IC-card effectively.Realize real one card for multiple uses, not only economy but also meet environmental protection concept, practicality is stronger, and function is more, can be widely used in systems such as gate inhibition's control, campus card, animal supervision, cargo tracking, expressway tol lcollection.
Description of drawings
Fig. 1 is a hierarchical chart of the present utility model.
Fig. 2 is a front schematic view of the present utility model.
Fig. 3 is the utility model core structure synoptic diagram.
Among the figure, 1. topmost thin film, 2. first printed layers, 3. upper strata PVC substrate, 4. sandwich layer, 41. ultra-high frequency antennas, 42. electronic tags, 5. the PVC of lower floor substrate, 6. second printed layers, 7. lower film, 8 contact IC chips, 9. embed mounting groove.
Embodiment
See also Fig. 1 to Fig. 3, be the different hierarchical structure synoptic diagram of the utility model.As shown in the figure, Intelligent Composite IC-card structure includes upper strata PVC substrate 3, the PVC of lower floor substrate 5, has first printed layers 2 and be laminated with topmost thin film 1, have second printed layers 6 and be laminated with lower film 7 at the skin of the PVC of lower floor substrate 5 at the skin of upper strata PVC substrate 3, passes topmost thin film 1 and is arranged at contact IC chip 8 on the upper strata PVC substrate 3, is installed in the sandwich layer 4 between the two- layer PVC substrate 3,5; Sandwich layer 4 is a radio frequency identification component, and radio frequency identification component includes the ultra-high frequency antenna 41 of frequency of operation between 870~960MHz and the electronic tag 42 of frequent antenna 41 electric connections of superelevation.Contact IC chip 8 embeds and is arranged on the upper strata PVC substrate 3; Offer the embedding mounting groove 9 of contact IC chip 8 on the upper strata PVC substrate 3; Electronic tag 42 is formed by falling packaged chip; The antenna of ultra-high frequency antenna 41 for making by etching aluminum foil; Further, the frequency of operation of radio frequency identification component ultra-high frequency antenna and electronic tag is 915MHz, and operating distance is 0~10 meter.
Intelligent Composite IC-card structure of the present utility model with contact and contactless snapping into together, both can be used for the contact card reader, also can be used for Non-contact Media Reader, and the contact IC chip and the electronic tag of composite card are separate.In conjunction with the characteristics of Contact Type Ic Card and non-contact IC card, and the relative merits complementation of realization Contact Type Ic Card and non-contact IC card, for satisfying the tomorrow requirement of one card for multiple uses.

Claims (6)

1. Intelligent Composite IC-card structure, include upper strata PVC substrate, the PVC of lower floor substrate, have first printed layers and be laminated with topmost thin film, have second printed layers and be laminated with lower film, it is characterized in that: also include and pass topmost thin film and be arranged at contact IC chip on the PVC substrate of upper strata, be installed in the sandwich layer between the two-layer PVC substrate at lower floor's PVC substrate outer at upper strata PVC substrate outer; Described sandwich layer is a radio frequency identification component, the electronic tag that radio frequency identification component further includes the ultra-high frequency antenna of frequency of operation between 870~960MHz and electrically connects with ultra-high frequency antenna.
2. Intelligent Composite IC-card structure as claimed in claim 1 is characterized in that: described electronic tag is formed by falling packaged chip.
3. Intelligent Composite IC-card structure as claimed in claim 1 is characterized in that: the antenna of described ultra-high frequency antenna for being made by etching aluminum foil.
4. Intelligent Composite IC-card structure as claimed in claim 1 is characterized in that: described contact IC chip embeds and is arranged on the PVC substrate of upper strata.
5. Intelligent Composite IC-card structure as claimed in claim 3 is characterized in that: the embedding mounting groove that offers contact IC chip on the PVC substrate of described upper strata.
6. as the arbitrary described Intelligent Composite IC-card structure of claim 1-5, it is characterized in that: the frequency of operation of described ultra-high frequency antenna and electronic tag is 915MHz.
CN201020232413XU 2010-06-22 2010-06-22 Intelligent compound IC (Integrated Circuit) card structure Expired - Lifetime CN201698473U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201020232413XU CN201698473U (en) 2010-06-22 2010-06-22 Intelligent compound IC (Integrated Circuit) card structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201020232413XU CN201698473U (en) 2010-06-22 2010-06-22 Intelligent compound IC (Integrated Circuit) card structure

Publications (1)

Publication Number Publication Date
CN201698473U true CN201698473U (en) 2011-01-05

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CN201020232413XU Expired - Lifetime CN201698473U (en) 2010-06-22 2010-06-22 Intelligent compound IC (Integrated Circuit) card structure

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110956247A (en) * 2019-11-29 2020-04-03 金邦达有限公司 Method for manufacturing electrochemical aluminum PVC (polyvinyl chloride) smart card with three-dimensional pattern

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110956247A (en) * 2019-11-29 2020-04-03 金邦达有限公司 Method for manufacturing electrochemical aluminum PVC (polyvinyl chloride) smart card with three-dimensional pattern
CN110956247B (en) * 2019-11-29 2024-02-23 金邦达有限公司 Manufacturing method of electric aluminum PVC smart card with three-dimensional pattern

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Granted publication date: 20110105