CN201698472U - Composite IC card - Google Patents

Composite IC card Download PDF

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Publication number
CN201698472U
CN201698472U CN2010202323724U CN201020232372U CN201698472U CN 201698472 U CN201698472 U CN 201698472U CN 2010202323724 U CN2010202323724 U CN 2010202323724U CN 201020232372 U CN201020232372 U CN 201020232372U CN 201698472 U CN201698472 U CN 201698472U
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CN
China
Prior art keywords
card
frequency
low
chip
pvc substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CN2010202323724U
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Chinese (zh)
Inventor
颜炳军
吴建成
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SHENZHEN SMART CARDY TECHNOLOGY Co Ltd
Original Assignee
SHENZHEN SMART CARDY TECHNOLOGY Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by SHENZHEN SMART CARDY TECHNOLOGY Co Ltd filed Critical SHENZHEN SMART CARDY TECHNOLOGY Co Ltd
Priority to CN2010202323724U priority Critical patent/CN201698472U/en
Application granted granted Critical
Publication of CN201698472U publication Critical patent/CN201698472U/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Abstract

The utility model discloses a composite IC card. The IC card comprises an upper PVC substrate and a lower PVC substrate, wherein a first printing layer is arranged on the outer layer of the upper PVC substrate and covered by an upper film, a second printing layer is arranged on the outer layer of the lower PVC substrate and covered by a lower film, a contact IC chip penetrates the upper film and is arranged on the upper PVC substrate, a core layer is sandwiched between the upper PVC substrate and the lower PVC substrate and adopts a radio frequency identification (RFID) assembly, and the RFID assembly further comprises a low-frequency antenna with the operating frequency ranging from 125 kHz to 135 kHz and a low-frequency chip on board (COB) electrically connected with the low-frequency antenna. By adopting the composite method, the utility model perfectly integrates the RFID chip with the low frequency range and frequency and the contact IC chip on a standard card, so that the service life of the composite IC card can be effectively prolonged due to the complementation between a contactless IC card and a contact IC card.

Description

A kind of compound IC-card
Technical field
The utility model relates to a kind of smart card architecture, relates in particular to a kind of Intelligent Composite IC-card.
Background technology
IC-card is the meaning of integrated circuit card, and IC-card is a kind of plastic cards of built-in large scale integrated circuit, and the magnetic card size of the card phone that it is big or small and original is identical.IC-card can be divided into storage card, encrypted card and smart card three classes usually, storage card is the storer that can directly carry out the reading and writing operation to it, encrypted card is to have increased the reading and writing encryption function on the basis of storage card, when encrypted card is operated, must at first check the password in the card, password correctly just can carry out normal running, and smart card is to have microprocessor (CPU), is also referred to as the CPU card simultaneously.
Traditional IC-card is a Contact Type Ic Card, has advantages such as reliability height, security is good, dirigibility is strong; But, when using, all card reader to be injected in the IC-card contact at every turn, use very inconvenience owing to Contact Type Ic Card.The IC-card contact exists easily defective such as pollutes, easy to wear, thereby shortens its serviceable life, damages the Card Reader or the card writer of this type of card even.
Non-contact IC card claims the RFID radio-frequency card again, and the RFID radio-frequency (RF) identification is a kind of contactless automatic identification technology, and it is by the automatic recognition objective object of radiofrequency signal and obtain related data, and identification work need not manual intervention, can work in various rugged surroundings.Compare with Contact Type Ic Card, non-contact IC card need not plug-in card, and is convenient to operation, has advantages such as reliability height, good airproof performance, anti-collision simultaneously.
Also there is defective in traditional non-contact IC card: when the card curved transitions, card lost efficacy because of the fracture of coil solder joint easily; Be subjected to environmental interference easily and fail in the communication of some occasions; Encryption method is comparatively simple, is easy to crack, and its security is lower.
The utility model content
The technical problems to be solved in the utility model is to overcome technological deficiency recited above, and a kind of compound IC-card is provided.
In order to solve technical matters recited above, the utility model is taked following technical scheme:
The utility model provides a kind of compound IC-card, include upper strata PVC substrate, the PVC of lower floor substrate, have first printed layers and be laminated with topmost thin film, have second printed layers and be laminated with lower film, also include and pass topmost thin film and be arranged at contact IC chip on the PVC substrate of upper strata, be installed in the sandwich layer between the two-layer PVC substrate at lower floor's PVC substrate outer at upper strata PVC substrate outer; Described sandwich layer is a radio frequency identification component, the low frequency COB chip that radio frequency identification component further includes the low-frequency antenna of frequency of operation between 125~135KHz and electrically connects with low-frequency antenna.
Described low frequency COB chip is made up of coupling element and chip.
Described contact IC chip embeds and is arranged on the PVC substrate of upper strata.Offer the embedding mounting groove of contact IC chip on the PVC substrate of described upper strata.
The low-frequency antenna of the low-frequency antenna of stating for making by enameled wire loop.
The frequency of operation of described low-frequency antenna and low frequency COB chip is 125KHz or 134.2KHz.
The utility model passes through composite means, with low-frequency range frequency RFID chip and contact IC chip perfect combination on a standard card, realize the relative merits complementation of contact and non-contact IC card, both overcome Contact Type Ic Card easy pollution, easy to wear, use defective such as inconvenience, also solve non-contact IC card easily because of problems such as the fracture of coil solder joint were lost efficacy, communication is subject to environmental interference, security is lower, prolonged the serviceable life of IC-card effectively.Realize real one card for multiple uses, not only economy but also meet environmental protection concept, practicality is stronger, and function is more, can be widely used in systems such as gate inhibition's control, campus card, animal supervision, cargo tracking, expressway tol lcollection.
Description of drawings
Fig. 1 is a hierarchical chart of the present utility model.
Fig. 2 is a front schematic view of the present utility model.
Fig. 3 is the utility model core structure synoptic diagram.
Among the figure, 1. topmost thin film, 2. first printed layers, 3. upper strata PVC substrate, 4. sandwich layer, 41. low-frequency antennas, 42. low frequency COB chips, 5. the PVC of lower floor substrate, 6. second printed layers, 7. lower film, 8 contact IC chips, 9. embed mounting groove.
Embodiment
See also Fig. 1 to Fig. 3, as shown in the figure, compound IC-card includes upper strata PVC substrate 3, the PVC of lower floor substrate 5, has first printed layers 2 and be laminated with topmost thin film 1, have second printed layers 6 and be laminated with lower film 7 at the skin of the PVC of lower floor substrate 5 at the skin of upper strata PVC substrate 3, passes topmost thin film 1 and is arranged at contact IC chip 8 on the upper strata PVC substrate 3, is installed in the sandwich layer 4 between the two-layer PVC substrate; Sandwich layer 4 is a radio frequency identification component, and radio frequency identification component includes the low-frequency antenna 41 of frequency of operation between 125~135KHz and the low frequency COB chip 42 that electrically connects with low-frequency antenna 41.Contact IC chip 8 embeds and is arranged on the upper strata PVC substrate 3; Offer the embedding mounting groove 9 of contact IC chip 8 on the upper strata PVC substrate 3; Low frequency COB chip 42 is made up of coupling element and chip; The low-frequency antenna of low-frequency antenna 41 for making by enameled wire loop, enameled wire is an insulation paint film of coating one or more layers at the conductive surface of high-purity, high conductivity, drying is shaped, according to coating, film thickness, and characteristic of having nothing in common with each other and purposes; Further, the frequency of operation of radio frequency identification component low-frequency antenna and low frequency COB chip is 125KHz or 134.2KHz, and operating distance is 0~10 millimeter.
Compound IC-card of the present utility model with contact and contactless snapping into together, both can be used for the contact card reader, also can be used for Non-contact Media Reader, and the contact IC chip of composite card and low frequency COB chip are separate.In conjunction with the characteristics of Contact Type Ic Card and non-contact IC card, and the relative merits complementation of realization Contact Type Ic Card and non-contact IC card, for satisfying the tomorrow requirement of one card for multiple uses.

Claims (7)

1. compound IC-card, include upper strata PVC substrate, the PVC of lower floor substrate, have first printed layers and be laminated with topmost thin film, have second printed layers and be laminated with lower film, it is characterized in that: also include and pass topmost thin film and be arranged at contact IC chip on the PVC substrate of upper strata, be installed in the sandwich layer between the two-layer PVC substrate at lower floor's PVC substrate outer at upper strata PVC substrate outer; Described sandwich layer is a radio frequency identification component, the low frequency COB chip that radio frequency identification component further includes the low-frequency antenna of frequency of operation between 125~135KHz and electrically connects with low-frequency antenna.
2. compound IC-card as claimed in claim 1 is characterized in that: described low frequency COB chip is made up of coupling element and chip.
3. compound IC-card as claimed in claim 1 is characterized in that: described contact IC chip embeds and is arranged on the PVC substrate of upper strata.
4. compound IC-card as claimed in claim 3 is characterized in that: the embedding mounting groove that offers contact IC chip on the PVC substrate of described upper strata.
5. compound IC-card as claimed in claim 1 is characterized in that: the low-frequency antenna of described low-frequency antenna for being made by enameled wire loop.
6. as the arbitrary described compound IC-card of claim 1-5, it is characterized in that: the frequency of operation of described low-frequency antenna and low frequency COB chip is 125KHz or 134.2KHz.
7. compound IC-card as claimed in claim 1 is characterized in that: the operating distance of described radio frequency identification component is 0~10 millimeter.
CN2010202323724U 2010-06-22 2010-06-22 Composite IC card Expired - Lifetime CN201698472U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2010202323724U CN201698472U (en) 2010-06-22 2010-06-22 Composite IC card

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2010202323724U CN201698472U (en) 2010-06-22 2010-06-22 Composite IC card

Publications (1)

Publication Number Publication Date
CN201698472U true CN201698472U (en) 2011-01-05

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN2010202323724U Expired - Lifetime CN201698472U (en) 2010-06-22 2010-06-22 Composite IC card

Country Status (1)

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CN (1) CN201698472U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102129598A (en) * 2011-03-10 2011-07-20 北京豹驰智能科技有限公司 Dual-interface integrated circuit (IC) card
CN103106529A (en) * 2012-12-31 2013-05-15 通鼎集团有限公司 Method and device of identification of light connection

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102129598A (en) * 2011-03-10 2011-07-20 北京豹驰智能科技有限公司 Dual-interface integrated circuit (IC) card
CN102129598B (en) * 2011-03-10 2012-12-05 北京豹驰智能科技有限公司 Dual-interface integrated circuit (IC) card
CN103106529A (en) * 2012-12-31 2013-05-15 通鼎集团有限公司 Method and device of identification of light connection

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CX01 Expiry of patent term
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Granted publication date: 20110105