CN201689399U - Touch pad structure - Google Patents
Touch pad structure Download PDFInfo
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- CN201689399U CN201689399U CN201020176296XU CN201020176296U CN201689399U CN 201689399 U CN201689399 U CN 201689399U CN 201020176296X U CN201020176296X U CN 201020176296XU CN 201020176296 U CN201020176296 U CN 201020176296U CN 201689399 U CN201689399 U CN 201689399U
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- conductor
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- circuit board
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- 239000004020 conductor Substances 0.000 claims abstract description 167
- 239000000463 material Substances 0.000 claims abstract description 20
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 239000011889 copper foil Substances 0.000 claims description 6
- 230000006698 induction Effects 0.000 claims description 5
- 238000005530 etching Methods 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 9
- 239000002699 waste material Substances 0.000 abstract description 4
- 230000000694 effects Effects 0.000 abstract description 3
- 239000010410 layer Substances 0.000 description 7
- 238000012545 processing Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 239000002356 single layer Substances 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- 230000008901 benefit Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000008034 disappearance Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
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- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The utility model provides a touch pad structure comprising a printed circuit board, and a plurality of line conductor groups and row conductor groups, wherein the printed circuit board forms an upper side and a lower side; the line conductor groups and the row conductor groups respectively comprise a plurality of first and second line conductors and a plurality of first and second row conductors; the first line conductors and the first row conductors are arranged at the upper side; and the second line conductors and the second row conductors are respectively arranged at one and the other of the upper side and the lower side and electrically connected respectively through a plurality of line guide holes and a plurality of row guide holes, thus achieving the effects of arranging the conductor groups at the upper side both in line and in row simultaneously to simplify the materials of the circuit board and manufacturing steps, including manufacturing method and material fabrication, further solving the overline problem and simultaneously improving the yield of products and saving materials to avoid waste.
Description
Technical field
The utility model relates to a kind of Contact plate, particularly a kind ofly simplifies the circuit board wafer number, saves cost and promotes the Contact plate structure of product yield.
Background technology
Contact panel is according to the difference of its principle of induction now, mainly divide into four kinds of resistance-type, condenser type, acoustic wave and optical profile types etc., wherein the capacitor-type touch panel structure has characteristics such as dustproof, fire prevention and high-res, thereby be used widely, this capacitance type touch-control panel action principle, mainly be to confirm contacting points position, utilize the approaching of touch control object (as conductors such as fingers), and determine the coordinate of contact point the capacitive electrical variation of generation between electrode according to electric capacitance change.
Chang Yong capacitive touch striking plate mainly is to adopt the biplate four-layer structure on the market, see also shown in Figure 1, it is made up of a first circuit board 1 and a second circuit board 2, on this first circuit board 1 has respectively with second circuit board 2, lower surface, the upper surface of its first circuit board 1 is provided with to go first conductor 11 that arrangement mode etches, this first conductor 11 runs through this first circuit board 1 and is formed with delegation's link 111 in this first circuit board 1 lower surface place in these first circuit board 1 one side edge, the lower surface of its first circuit board 1 is provided with second conductor 12 that etches with the row arrangement mode again, and this second conductor 12 is formed with a row link 121 in the lower surface place of these first circuit board 1 one sides;
And the lower surface of this second circuit board 2 is provided with a control wafer 3, and these second circuit board 2 downside etchings have the capable lead 21 and column wire 22 of control wafer of being connected in 3, wherein, this row lead 21 runs through this second circuit board 2 respectively with column wire 22 1 ends, and be formed with capable closing line 23 and row closing line 24 in the upper surface place of this second circuit board 2, and its row closing line 23 is electrically connected at this row link 111 and row link 121 respectively with row closing line 24;
Via this first circuit board 1 and second circuit board 2 formed four-layer structures, though solved its first conductor 11 and the interlaced problem of second conductor 12, but because the base material of circuit board own has certain thickness, directly limit the Contact plate thickness of forming by two circuit boards, caused the Contact plate of four-layer structure can't satisfy the demand of the frivolous external form of current action electronic product; Also can distinguish to some extent and separate the capacitance variation that the first two-layer conductor 11 and second conductor 12 sensed, except meeting causes the erroneous judgement of signal, for remedying the difference between this, the burden of signal evaluation circuit increased with operation time tediously longly certainly will become the result who is difficult to avoid.
In addition, need elder generation to plate whole Copper Foil altogether on four sides at two circuit boards in the processing procedure of four layers of Contact plate, and then carry out the etched process of light shield, there is most Copper Foil to be rinsed in the middle of this and slatterns, not only can cause the burden of material cost also can cause bad influence environment.
The above, have following shortcoming in the prior art:
1, the thickness limits of four layers of Contact plate the thickness of thin type product;
2, need the material cost of at least two circuit boards and at least twice processing procedure cost;
3, need complicated signal analysis and processing and operation time tediously long.
Be with, how to solve the problem and the disappearance of above-mentioned product commonly used, be designer of the present utility model and desire most ardently the direction place that research improves with the relevant manufacturer that is engaged in the industry.
Summary of the invention
For effectively solving the above problems, fundamental purpose of the present utility model is providing a kind of monolithic printed circuit board (PCB) that uses to simplify the Contact plate structure of circuit board materials used and fabrication steps.
Secondary objective of the present utility model provides existing manufacturing method thereof of a kind of use printed circuit board (PCB) and material, and is improved the monolithic Contact plate structure of yield.
A purpose more of the present utility model provides a kind ofly can effectively utilize the copper foil material ratio, saves the Contact plate structure of waste of material.
For reaching above-mentioned purpose, a kind of Contact plate structure of the utility model, it comprises: a printed circuit board (PCB) has a upside and a downside; A plurality of column conductor groups, these a plurality of column conductor groups include a plurality of first column conductors and are located at this upside, and a plurality of second column conductors are located at wherein either side of this upside and this downside, and connect these a plurality of first column conductors; And a plurality of row conductor groups, these a plurality of row conductor groups include a plurality of first row conductors and are located at this upside, and a plurality of secondary series conductors are located at and correspond to this second column conductor at this upside and this downside opposite side wherein, and connect these a plurality of first row conductors.
Described Contact plate structure, wherein, this first and second column conductor and first and second row conductor are the capacitor-type touch inductor, and produce the capacitive induction signal through touching.
Described Contact plate structure, wherein, this second column conductor is located at this downside, and this secondary series conductor is located at this upside, and this second column conductor and this secondary series conductor are interlaced.
Described Contact plate structure, wherein, this printed circuit board (PCB) has a plurality of capable guide holes, and this row guide hole runs through and electrically conduct described first column conductor and second column conductor, and each second column conductor is electrically connected at the first adjacent column conductor of upside two respectively via at least two row guide holes.
Described Contact plate structure, wherein, this secondary series conductor is located at this downside, and this second column conductor is located at this upside, and this secondary series conductor is staggered relative across this printed circuit board (PCB) with this second column conductor.
Described Contact plate structure, wherein, this printed circuit board (PCB) has a plurality of row guide holes, and its row guide hole runs through and electrically conduct described first row conductor and secondary series conductor, and each secondary series conductor is electrically connected at the first adjacent row conductor of upside two respectively via at least two row guide holes.
Described Contact plate structure, wherein, part second column conductor is located at this upside, remaining second column conductor is located at this downside, and part secondary series conductor is located at this upside, and remaining secondary series conductor is located at downside, and this second column conductor is staggered relative across this printed circuit board (PCB) with the secondary series conductor.
Described Contact plate structure, wherein, this first column conductor is greater than the area of this second column conductor, and the area of this first row conductor is greater than the area of this secondary series conductor.
Described Contact plate structure wherein, more includes a control wafer and is arranged at this downside.
Described Contact plate structure, wherein, these printed circuit board (PCB) two respective side are penetrated with a plurality of wafer row guide holes and a plurality of wafer row guide hole respectively, and each wafer row guide hole is electrically connected to control wafer via one first wafer lead, and each wafer row guide hole is electrically connected to control product sheet via one second wafer lead.
Described Contact plate structure, wherein, described column conductor group and row conductor group are to be formed by the etching of copper foil material one.
Reach thus can be provided with simultaneously in the upside of monolithic printed circuit board (PCB) and arrange and the conductor group of arranging with row with row, to simplify the circuit board materials used and to simplify fabrication steps, and can existing manufacturing method thereof and material, and then solve the cross-line problem and improve product yield and the effect of saving waste of material simultaneously; So the utlity model has following advantage:
1, effectively simplifies circuit board wafer number and the purpose that reaches the product thin typeization;
2, reduce the material cost and the processing procedure cost of circuit board;
3, effectively improve the product yield;
4, simplify the operation time of signal analysis and processing.
Description of drawings
Fig. 1 is the structural representation of existing biplate four-layer structure;
Fig. 2 is the schematic top plan view of the utility model Contact plate structure;
Fig. 3 is the cross-sectional schematic of the utility model Contact plate structure;
Fig. 4 is the elevational schematic view of the utility model Contact plate structure;
Fig. 5 is the schematic top plan view of another embodiment of the utility model Contact plate structure;
Fig. 6 is the elevational schematic view of another embodiment of the utility model Contact plate structure;
Fig. 7 is the schematic top plan view of the another embodiment of the utility model Contact plate structure;
Fig. 8 is the elevational schematic view of the another embodiment of the utility model Contact plate structure;
Description of reference numerals: printed circuit board (PCB) 4; Upside 41; Downside 42; Wafer row guide hole 43; Wafer row guide hole 44; Row guide hole 45; Row guide hole 46; Column conductor group 5; First column conductor 51; Second column conductor 52; Row conductor group 6; First row conductor 61; Secondary series conductor 62; Control wafer 7; The first wafer lead 71; The second wafer lead 72.
Embodiment
Characteristic on above-mentioned purpose of the present utility model and structure thereof and the function will be illustrated according to appended graphic preferred embodiment.
See also Fig. 2, Fig. 3 and shown in Figure 4, Contact plate structure of the present utility model includes a printed circuit board (PCB) 4, a plurality of column conductor groups 5, a plurality of row conductor groups 6 and a control wafer 7, this printed circuit board (PCB) 4 has a upside 41 and a downside 42, and its column conductor group 5 includes a plurality of first column conductors 51 that are arranged at upside 41 and be arranged at upside 41 and this downside 42 a plurality of second column conductors 52 of either side wherein, this is first years old, two column conductors 51,52 is the capacitor-type touch inductor, and through touching generation capacitive induction signal, and the area of this first column conductor 51 is greater than the area of second column conductor 52;
And its row conductor group 6 includes a plurality of first row conductors 61 that are arranged at upside 41 simultaneously and be arranged at and correspond to second column conductor 52 in upside 41 and this downside 42 secondary series conductor 62 of opposite side wherein, this first and second row conductor 61,62 is the capacitor-type touch inductor, and through touching generation capacitive induction signal, and the area of this first row conductor 61 is greater than the area of secondary series conductor 62, and these a plurality of column conductor groups 5 and row conductor group 6 are to be formed by the etching of copper foil material one;
And this control wafer 7 is arranged at the downside 42 of described printed circuit board (PCB) 4, and 4 liang of respective side of this printed circuit board (PCB) are penetrated with a plurality of wafer row guide holes 43 and a plurality of wafer row guide holes 44 respectively, and each wafer row guide hole 43 is electrically connected to control wafer 7 via one first wafer lead 71, and each wafer row guide hole 44 is electrically connected to control wafer 7 via one second wafer lead 72;
In present embodiment, described first column conductor 51, first row conductor 61 and second column conductor 52 all are arranged at the upside 41 of printed circuit board (PCB) 4, its secondary series conductor 62 then corresponds to the downside 42 that second column conductor 52 is arranged at printed circuit board (PCB) 4, and its secondary series conductor 62 is staggered relative across this printed circuit board (PCB) 4 with this second column conductor 52, and this printed circuit board (PCB) 4 is penetrated with a plurality of row guide holes 45 in secondary series conductor 62 positions corresponding to downside 42, described row guide hole 45 runs through and first row conductor 61 of the described upside 41 that electrically conducts and the secondary series conductor 62 of downside 42, and each secondary series conductor 62 is electrically connected at 41 liang of first adjacent row conductors 61 of upside respectively via at least two row guide holes 45, so that the secondary series conductor 62 of this downside 42 can be communicated with first row conductor 61 of permutation via electrically conducting of row guide hole 45, and electrically conduct to wafer row guide hole 44 simultaneously via first row conductor 61 of dual-side, the second wafer lead 72 and control wafer 7, reach the conductor group that can be provided with simultaneously in the upside 41 of single-layer printed circuit plate 4 with this, and the while can solve the purpose of cross-line problem to go arrangement and to arrange with row.
Please consult Fig. 5 simultaneously, shown in Figure 6, be another preferred embodiment of the utility model, element and the connection relationship of itself and a last embodiment and running is roughly the same does not promptly give unnecessary details components identical and component symbol at this, yet this preferred embodiment different is in described first column conductor 51, first row conductor 61 and secondary series conductor 62 all are arranged at the upside 41 of printed circuit board (PCB) 4, its second column conductor 52 then corresponds to the downside 42 that secondary series conductor 62 is arranged at printed circuit board (PCB) 4, and its second column conductor 52 is staggered relative across this printed circuit board (PCB) 4 with this secondary series conductor 62, and this printed circuit board (PCB) 4 is penetrated with a plurality of capable guide holes 46 in second column conductor, 52 positions corresponding to downside 42, described capable guide hole 46 runs through and first column conductor 51 of the described upside 41 that electrically conducts and second column conductor 52 of downside 42, and each second column conductor 52 is electrically connected at 41 liang of first adjacent column conductors 51 of upside respectively via at least two row guide holes 46, so that second column conductor 52 of this downside 42 can be communicated with first column conductor 51 of full line via electrically conducting of row guide hole 46, and electrically conduct to wafer row guide hole 43 simultaneously via first column conductor 51 of dual-side, the second wafer lead 72 and control wafer 7, reach the conductor group that can be provided with simultaneously in the upside 41 of single-layer printed circuit plate 4 with this, and the while can solve the purpose of cross-line problem to go arrangement and to arrange with row.
Please consult Fig. 7 simultaneously, shown in Figure 8, be the another preferred embodiment of the utility model, the element and the connection relationship of itself and previous embodiment and running is roughly the same does not promptly give unnecessary details components identical and component symbol at this, yet this preferred embodiment different be in: wherein part second column conductor 52 is located at this upside 41, remaining second column conductor 52 is located at this downside 42, and part secondary series conductor 62 is located at this upside 41, remaining secondary series conductor 62 is located at downside 42, make this second column conductor 52 staggered relative across this printed circuit board (PCB) 4 with secondary series conductor 62, and electrically conduct in first column conductor 51 and first row conductor 61 of upside 41 via described capable guide hole 46 and row guide hole 45 respectively simultaneously, reach the conductor group that can be provided with simultaneously in the upside 41 of single-layer printed circuit plate 4 with this to go arrangement and to arrange with row, and can solve the purpose of cross-line problem simultaneously, to simplify the circuit board materials used and to simplify fabrication steps, and can existing manufacturing method thereof and material, and have simultaneously and improve product yield and the effect of saving waste of material.
The above, only be best specific embodiment of the present utility model, however feature of the present utility model be not limited thereto, anyly be familiar with this skill person in the utility model field, can think easily and variation or modification, all should be encompassed in the following claim scope of the present utility model.
Claims (11)
1. a Contact plate structure is characterized in that, comprises:
One printed circuit board (PCB) has a upside and a downside;
A plurality of column conductor groups, these a plurality of column conductor groups include a plurality of first column conductors and are located at this upside, and a plurality of second column conductors are located at wherein either side of this upside and this downside, and connect these a plurality of first column conductors; And
A plurality of row conductor groups, these a plurality of row conductor groups include a plurality of first row conductors and are located at this upside, and a plurality of secondary series conductors are located at and correspond to this second column conductor at this upside and this downside opposite side wherein, and connect these a plurality of first row conductors.
2. Contact plate structure as claimed in claim 1 is characterized in that, this first and second column conductor and first and second row conductor are the capacitor-type touch inductor, and produces the capacitive induction signal through touching.
3. Contact plate structure as claimed in claim 1 is characterized in that, this second column conductor is located at this downside, and this secondary series conductor is located at this upside, and this second column conductor and this secondary series conductor are interlaced.
4. Contact plate structure as claimed in claim 3, it is characterized in that, this printed circuit board (PCB) has a plurality of capable guide holes, this row guide hole runs through and electrically conduct described first column conductor and second column conductor, and each second column conductor is electrically connected at the first adjacent column conductor of upside two respectively via at least two row guide holes.
5. Contact plate structure as claimed in claim 1 is characterized in that, this secondary series conductor is located at this downside, and this second column conductor is located at this upside, and this secondary series conductor is staggered relative across this printed circuit board (PCB) with this second column conductor.
6. Contact plate structure as claimed in claim 5, it is characterized in that, this printed circuit board (PCB) has a plurality of row guide holes, its row guide hole runs through and electrically conduct described first row conductor and secondary series conductor, and each secondary series conductor is electrically connected at the first adjacent row conductor of upside two respectively via at least two row guide holes.
7. Contact plate structure as claimed in claim 1, it is characterized in that, part second column conductor is located at this upside, remaining second column conductor is located at this downside, and part secondary series conductor is located at this upside, remaining secondary series conductor is located at downside, and this second column conductor is staggered relative across this printed circuit board (PCB) with the secondary series conductor.
8. Contact plate structure as claimed in claim 1 is characterized in that, this first column conductor is greater than the area of this second column conductor, and the area of this first row conductor is greater than the area of this secondary series conductor.
9. Contact plate structure as claimed in claim 1 is characterized in that, more includes a control wafer and is arranged at this downside.
10. Contact plate structure as claimed in claim 9, it is characterized in that, these printed circuit board (PCB) two respective side are penetrated with a plurality of wafer row guide holes and a plurality of wafer row guide hole respectively, and each wafer row guide hole is electrically connected to control wafer via one first wafer lead, and each wafer row guide hole is electrically connected to control wafer via one second wafer lead.
11. Contact plate structure as claimed in claim 1 is characterized in that, described column conductor group and row conductor group are to be formed by the etching of copper foil material one.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201020176296XU CN201689399U (en) | 2010-04-29 | 2010-04-29 | Touch pad structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201020176296XU CN201689399U (en) | 2010-04-29 | 2010-04-29 | Touch pad structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201689399U true CN201689399U (en) | 2010-12-29 |
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ID=43377677
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201020176296XU Expired - Fee Related CN201689399U (en) | 2010-04-29 | 2010-04-29 | Touch pad structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201689399U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104620208A (en) * | 2012-04-11 | 2015-05-13 | 辛纳普蒂克斯公司 | Two layer capacitive sensor |
-
2010
- 2010-04-29 CN CN201020176296XU patent/CN201689399U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104620208A (en) * | 2012-04-11 | 2015-05-13 | 辛纳普蒂克斯公司 | Two layer capacitive sensor |
| CN104620208B (en) * | 2012-04-11 | 2017-07-04 | 辛纳普蒂克斯公司 | Capacitive input device and the method for forming capacitive input device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20101229 Termination date: 20190429 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |