CN106293279A - The self-capacitance contact panel of flexible circuit board and application thereof - Google Patents
The self-capacitance contact panel of flexible circuit board and application thereof Download PDFInfo
- Publication number
- CN106293279A CN106293279A CN201510258886.4A CN201510258886A CN106293279A CN 106293279 A CN106293279 A CN 106293279A CN 201510258886 A CN201510258886 A CN 201510258886A CN 106293279 A CN106293279 A CN 106293279A
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- China
- Prior art keywords
- circuit board
- flexible circuit
- auxiliary mat
- processing unit
- plate body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 239000000203 mixture Substances 0.000 claims abstract description 18
- 239000000463 material Substances 0.000 claims description 16
- 239000000758 substrate Substances 0.000 claims description 14
- 239000004020 conductor Substances 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 230000005611 electricity Effects 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 6
- 229920000728 polyester Polymers 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 239000004642 Polyimide Substances 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 2
- 239000004713 Cyclic olefin copolymer Substances 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 230000006698 induction Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 2
- 239000004926 polymethyl methacrylate Substances 0.000 description 2
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 2
- -1 ITO) Chemical compound 0.000 description 1
- JYMITAMFTJDTAE-UHFFFAOYSA-N aluminum zinc oxygen(2-) Chemical compound [O-2].[Al+3].[Zn+2] JYMITAMFTJDTAE-UHFFFAOYSA-N 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-N carbonic acid Chemical compound OC(O)=O BVKZGUZCCUSVTD-UHFFFAOYSA-N 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- JAONJTDQXUSBGG-UHFFFAOYSA-N dialuminum;dizinc;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Al+3].[Al+3].[Zn+2].[Zn+2] JAONJTDQXUSBGG-UHFFFAOYSA-N 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- MRNHPUHPBOKKQT-UHFFFAOYSA-N indium;tin;hydrate Chemical compound O.[In].[Sn] MRNHPUHPBOKKQT-UHFFFAOYSA-N 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/046—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by electromagnetic means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04102—Flexible digitiser, i.e. constructional details for allowing the whole digitising part of a device to be flexed or rolled like a sheet of paper
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Human Computer Interaction (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Position Input By Displaying (AREA)
- Switches That Are Operated By Magnetic Or Electric Fields (AREA)
Abstract
The open a kind of self-capacitance contact panel of the present invention comprises transparent conductive layer, flexible circuit board and plurality of leads.Flexible circuit board comprises plate body, a plurality of joint sheet and at least one auxiliary mat.Plate body has contrary composition surface and disengaged.Joint sheet is arranged on composition surface.Auxiliary mat is arranged on disengaged.Joint sheet and auxiliary mat are respectively and electrically connected to the different scanning channel of a processing unit.Each lead-in wire is electrically connected with transparent conductive layer and corresponding joint sheet.The design of the present invention, in the case of not causing touch signal to misread, can reduce engaging zones width.
Description
Technical field
The invention relates to contact panel and parts thereof, in particular to a kind of flexible circuit board and its
The self-capacitance contact panel of application.
Background technology
Touch technology has been widely used in various electronic installation now.By the ad-hoc location of touching contact panel,
This ad-hoc location is made to produce sensing, then the transmission by a flexible circuit board being electrically connected with contact panel
Effect, is sent to processing unit by this induced signal, carries out Treatment Analysis for processing unit, and then reach defeated
Enter data or instruct the purpose of so far electronic installation.
Projected capacitive touch panel is the main flow of current touch technology development, and projected capacitive touch panel
According to the difference of its measuring principle, mutual capacitance type touch control panel and self-capacitance contact panel can be divided into again.
Wherein self-capacitance contact panel, because of its simple in construction, low in energy consumption, has well application in some field.
Self-capacitance contact panel is the capacitance variations of detection conductive pattern self, i.e. detection X-axis and Y-axis faradism
Electric capacity (electric capacity that i.e. electrode is constituted with ground, the also referred to as electrostatic capacitance) change of pole self.When finger is close
Or when touching screen, the electric capacity of finger can be superimposed to shield and make total capacitance increase in body capacitance, scans time control
Circuit processed scans X-axis and Y-axis induction electrode successively, and determines touch according to the capacitance variations before and after scanning
The coordinate position of point.
Generally, the contact panel of self-capacitance, it is superimposed to non-in order to avoid finger etc. being touched the electric capacity of conductor
Cause signal to misread on the lead-in wire in touch control operation district, need to be directly joined FPC the conduction of contact panel
Reaching electric connection in end of pattern, this mode is the shortest without lead-in wire or lead-in wire, therefore touches conductor
Its impact can be ignored by electric capacity, it is possible to accurately judge touch signal, but shortcoming is FPC and contact panel
Whole engaging zones wider width, can affect follow-up such as physical button, pictorial trademark arranges arrangement.
Be therefore, how to propose one can solve the problems referred to above (in the case of not causing touch signal to misread,
Reduce engaging zones width) the capacitance type touch-control panel applied with it of flexible circuit board, be current industry urgently
Development resources to be put into carries out one of project of studying.
Summary of the invention
For solving the problems referred to above, the present invention provides a kind of flexible circuit board, comprises: a plate body, has contrary
A composition surface and one disengaged；A plurality of joint sheets, are arranged on composition surface；At least one auxiliary mat,
Being arranged on disengaged, wherein joint sheet is respectively and electrically connected to the different of a processing unit and sweeps from auxiliary mat
Retouch channel.
In one embodiment of the present invention, above-mentioned joint sheet sequentially accepts the scanning of a processing unit and auxiliary
Pad is helped persistently to accept the scanning of processing unit.
In one embodiment of the present invention, the material of above-mentioned auxiliary mat is conductive material.
In one embodiment of the present invention, the material of above-mentioned auxiliary mat is copper.
In one embodiment of the present invention, above-mentioned auxiliary mat position and joint sheet be set position is set
Corresponding across plate body.
In one embodiment of the present invention, the quantity of at least one above-mentioned auxiliary mat be plural number, auxiliary mat that
This is electrically connected with.
In one embodiment of the present invention, above-mentioned auxiliary mat is overlapping with each joint sheet across plate body.
In one embodiment of the present invention, above-mentioned plate body comprises insulating substrate, internal wiring layer and covering
Film, wherein joint sheet and/or auxiliary mat are formed on insulating substrate with same material with internal wiring layer simultaneously,
Coverlay at least covers internal wiring layer.
In one embodiment of the present invention, above-mentioned flexible circuit board, also comprise a processing unit, arrange
On plate body, wherein joint sheet and auxiliary mat are respectively and electrically connected to the different scanning channel of processing unit.
In one embodiment of the present invention, above-mentioned joint sheet sequentially accepts the scanning of processing unit and assists
Pad persistently accepts the scanning of processing unit.
The present invention also provides for a kind of self-capacitance contact panel, and self-capacitance contact panel comprises any of the above-described soft
Property circuit board, also comprises: a transparent conductive layer；Plurality of leads, each lead-in wire is electrically connected with transparent
Conductive pattern layer and corresponding joint sheet.
In one embodiment of the present invention, above-mentioned lead-in wire and transparent conductive layer are identical material.
In one embodiment of the present invention, above-mentioned self-capacitance contact panel, also comprise a transparency carrier,
A Touch Zone and a surrounding zone is defined in surface thereof, in wherein transparent conductive layer is arranged at Touch Zone,
And go between and be arranged in surrounding zone.
In sum, the transparent conductive layer of the capacitance type touch-control panel of the present invention is electrically concentrated via lead-in wire
To engaging zones, and engage with the joint sheet on flexible circuit board composition surface, the therefore joint of flexible circuit board
The overall width in district is reduced.The capacitance type touch-control panel of the present invention is further at flexible circuit board simultaneously
Disengaged upper arranges at least one auxiliary mat, and it can receive point as reference signal, and its position is set can be with
Joint sheet on composition surface to arrange position corresponding, and guide on a reference signal channel of processing unit.
Configure by said structure, when the finger of user is near surrounding zone, can be to lead-in wire and auxiliary adjacent thereto
Pad produces impact (i.e. producing the identical or induced signal of approximation) simultaneously.In other words, reference signal receives some energy
Enough finger near surrounding zone time, receive similar superposition electric capacity, and deliver to locate by reference signal channel
Reason unit is as reference value.Therefore, the joint sheet on flexible circuit board composition surface receives from Touch Zone
After being sent to processing unit with the capacitance signal of surrounding zone, processing unit can be removed auxiliary mat and felt by bales catch
The corresponding reference value (can be by the assistance of operational software) answered, can optimize touch-control effect, thus judge exactly
From the touching signals of Touch Zone, largely avoid the problem that signal is misread.
Accompanying drawing explanation
Fig. 1 is the exploded view of the capacitance type touch-control panel illustrating an embodiment of the present invention.
Fig. 2 is the sectional view illustrating the flexible circuit board in Fig. 1 along line segment 4-4 '.
Fig. 3 is the front view illustrating disengaged of the flexible circuit board in Fig. 2.
Fig. 4 is the sectional view of the flexible circuit board corresponding diagram 3 line segment 5-5 ' illustrating an embodiment of the present invention.
Fig. 5 is the sectional view of the flexible circuit board corresponding diagram 3 line segment 5-5 ' illustrating another embodiment of the present invention.
Fig. 6 is the flexible circuit board corresponding diagram 1 illustrating another embodiment of the present invention section view along line segment 4-4 '
Figure.
Fig. 7 is the front view illustrating disengaged of the flexible circuit board in Fig. 6.
Detailed description of the invention
Hereinafter will schematically disclose some embodiments of the present invention, as clearly stated, in many practices
Details will be explained in the following description.It should be appreciated, however, that the details in these practices is not applied
To limit the present invention.It is to say, the details right and wrong in some embodiments of the present invention, in these practices
Necessary.Additionally, for simplify graphic for the sake of, some known usual structures and assembly in the drawings will be with letters
The mode of single signal illustrates it.
Refer to the exploded view that Fig. 1, Fig. 1 are the capacitance type touch-control panel illustrating invention one embodiment.Such as figure
Shown in 1, in present embodiment, capacitance type touch-control panel 12 comprises transparency carrier 120, electrically conducting transparent figure
Pattern layer 122, flexible circuit board 13 and plurality of leads 126.On the surface of transparency carrier 120, definition has
Touch Zone 120a and be positioned at the surrounding zone 120b of Touch Zone 120a at least side, can depending on successive process demand
In the 120b of surrounding zone, a correct position defines a bonding land 120c, in order to be electrically connected with a flexible circuit board.
Transparent conductive layer 122 is arranged in the 120a of Touch Zone, and lead-in wire 126 is arranged in the 120b of surrounding zone, uses
Each electrode in transparent conductive layer 122 to be electrically concentrated to the bonding land 120c of transparency carrier 120.
Transparent conductive layer 122 can pass through the processing procedure such as sputter, etching and is formed directly into the surface of transparency carrier 120
On, but the present invention is not limited.
It is understood that arrive, above-mentioned Touch Zone, surrounding zone are only for more clearly defining transparent conductive layer 122
With lead-in wire 126 relativenesses each other, the actual surface of transparency carrier 120 might not there is specific mark
Note separates the existence of Touch Zone and surrounding zone.
In an embodiment, lead-in wire 126 is synchronize for identical material with transparent conductive layer 122 to be made,
Therefore adding other metallic conduction cabling forms compared to traditional visible area pattern, present embodiment can reduce
At least one processing procedure and reduce the purpose of cost.But, in reality is applied, lead-in wire 126 is with transparent
Conductive pattern layer 122 is alternatively unlike material.
In an embodiment, transparent conductive layer 122 comprises tin indium oxide with the material of lead-in wire 126
(Indium Tin Oxide, ITO), indium zinc oxide (Indium Zinc Oxide, IZO) and zinc oxide aluminum
(Aluminum Zinc Oxide, AZO), but the present invention is not limited thereto.
In an embodiment, the material of transparency carrier 120 is glass or plastics.The most poly-carbonic acid of plastics
Ester (PC), polyester (PET), polymethyl methacrylate (PMMA) or cyclic olefin copolymer (COC) etc. are made
The transparent thin board become.But, the present invention is not limited thereto.
Although transparent conductive layer 122 is electrically connected with and is concentrated to transparent base by lead-in wire 126 by the present invention
Engage with a flexible circuit board again after the bonding land 120c of plate 120, the width of whole bonding land 120c can be reduced
Degree, and it is beneficial to arrange the position of bonding land 120c, if but engage with tradition flexible circuit board,
The finger of user, but can be because of finger Capacitance Coupled when lead-in wire 126 concentrated areas (near bonding land 120c)
At lead-in wire 126, and phenomenon that touch-control offsets (that is, the position of the actual touch-control of user and conductive pattern layer occurs
Error is produced between 122 position of touch sensed), the problem the most easily producing maloperation.In order to solve
This problem, present invention is particularly directed to flexible circuit board and improves, and explain orally in detail below.
Please in conjunction with Fig. 2 to Fig. 3, Fig. 2 is the section view illustrating the flexible circuit board in Fig. 1 along line segment 4-4 '
Figure；Fig. 3 is the front view illustrating disengaged of the flexible circuit board in Fig. 2.Flexible circuit board 13 comprises plate
Body 131, a plurality of joint sheet 132, a plurality of auxiliary mat 133.Plate body 131 has contrary composition surface 13a
And disengaged 13b, wherein composition surface 13a is to engage with transparency carrier 120, and joint sheet 132 is arranged
On the 13a of composition surface, and it is electrically connected with one end of the lead-in wire 126 on transparency carrier 120.Auxiliary mat 133
It is arranged on disengaged 13b, to be arranged at disengaged 13b near lead-in wire 126 concentrated areas (generally
Near the 120c of bonding land) be advisable, i.e. auxiliary mat 133 position and joint sheet 132 be set position is set
Corresponding across plate body.One end of each lead-in wire 126 is electrically connected to transparent conductive layer 122, and another
End is then electrically connected to the joint sheet 132 of correspondence in the way of the conjunction of ACF glue laminated.Via lead-in wire 126 by transparent
The practice that conductive pattern layer 122 is electrically connected with the joint sheet 132 on the composition surface 13a of flexible circuit board 13,
The overall width that can make the bonding land 120c of flexible circuit board 13 is reduced, and conveniently presses according to physics
The position of the status requirement reasonable arrangement bonding land 120c of key and pictorial trademark.
In one embodiment of the present invention, flexible circuit board 13 can also comprise a processing unit 14, herein
Reason unit 14 is an integrated circuit (Integrated Circuit, IC) chip, but the present invention is not limited thereto.?
In present embodiment, processing unit 14 is e.g. positioned on the composition surface 13a of flexible circuit board 13, then connect
Close pad 132 to be electrically connected to process by the different passages within flexible circuit board 13 respectively from auxiliary mat 133
The different scanning channel of unit 14.Such as, joint sheet 132 is by the line electricity within flexible circuit board 13
Property be connected to the sensing channel of processing unit 14, during scanning, processing unit 14 is scanned successively by sensing channel
The X-axis of transparent conductive layer 122 and Y-axis induction electrode, and come really according to the capacitance variations before and after scanning
Determine the coordinate position of touch point；Auxiliary mat 133 is then electrically connected to by flexible circuit board 13 internal wiring
Processing unit 14 is different from the such as reference channel of sensing channel, scans transparent leading successively at processing unit 14
While electrograph pattern layer 122, continue whether Scanning Detction auxiliary mat exists capacitance variations.But the present invention's
In other embodiments, processing unit 14 can not also be positioned on flexible circuit board, and independent of flexible circuit
Plate and exist, the present invention is not limited thereto.
Furthermore, it is understood that in present embodiment, auxiliary mat 133 is electrically connected to each other with a wire 134.
Be arranged at disengaged 13b near lead-in wire 126 concentrated areas (usually near the 120c of bonding land) be advisable,
I.e. auxiliary mat 133 arrange position and joint sheet 132 to arrange position corresponding across plate body.It is arranged at plate
Disengaged 13b of body 124 is near the side of lead-in wire 126 concentrated areas, usually with joint sheet 132
It is corresponding across plate body 131 that position is set, it is also preferred that the left each auxiliary mat 133 across plate body 131 with right
The joint sheet 132 answered is overlapping, can further shield the impact on joint sheet 132 of the finger electric capacity.By
This structure configures, after flexible circuit board 13 engages with aforementioned contact panel 12, and the finger touching of user
The Touch Zone 120a of contact panel 12 and when the 120b of surrounding zone, can be to lead-in wire 126 and adjacent
Auxiliary mat 133 produce simultaneously impact (i.e. produce identical or approximation induced signal).In other words, auxiliary mat
Reference signal representated by 133 receives point can be at finger touching Touch Zone 120a and near surrounding zone 120b
Time, receive the capacitance that finger is similar to the electric capacity of 126 superpositions that go between, and sent by reference signal channel
To processing unit 14 as reference value.Therefore, the joint sheet on the composition surface 13a of flexible circuit board 13
132 receive after the capacitance signal from Touch Zone Yu surrounding zone is sent to processing unit 14, processing unit
14 can remove the corresponding reference value (can be by the assistance of operational software) that auxiliary mat 133 is sensed by bales catch,
Optimize touch-control effect, thus judge the touching signals from Touch Zone exactly, largely avoid grasping by mistake
The problem made.
In order to illustrate further the structure of flexible circuit board, referring again to Fig. 4, Fig. 4 for illustrating the present invention one
The sectional view of the flexible circuit board corresponding diagram 3 line segment 5-5 ' of embodiment.In the present embodiment, plate body 131
Comprise insulating substrate 131a, internal wiring layer 131b and coverlay 131c.Insulating substrate 131 is the most poly-right
The materials such as PET Polyester (PET), polyimides Polyimide (PI), in order to as whole
The substrate of individual flexible circuit board and support.Internal wiring layer 131b is formed at a surface of insulating substrate 131a
On, for conductive material, the plural bar thin wire that usually Copper Foil is made, in order to electrical conductivity；One
In preferred embodiment, joint sheet 132 (or auxiliary mat 133) and internal wiring layer 131b with identical material and
Synchronize to make, be arranged on insulating substrate 131a with layer.Coverlay 131c, generally also comprises PET, PI
Deng material, it at least covers internal wiring layer 131b, in order to protect internal wiring layer 131b, and exposes and connects
Close pad 132 (or auxiliary mat 133).On another surface of insulating substrate 131a, (or auxiliary with joint sheet 132
Help pad 133) the position that arranges be provided with auxiliary mat 133 across the position that plate body 131a is corresponding and (or engage
Pad 132), auxiliary mat 133 (or joint sheet 132) is conductive material, is the most also made by Copper Foil, its
It is electrically connected with internal wiring layer 131b by the through hole on insulating substrate 131a.
Fig. 5 is the sectional view of the flexible circuit board corresponding diagram 3 line segment 5-5 ' illustrating another embodiment of the present invention.
In another embodiment of the present invention, two surfaces of insulating substrate 131a are provided with internal wiring layer
131b, and relative set coverlay 131c.Double internal wiring layer 131b can be by insulating substrate 131a
On through hole be set and electrically conduct, when the circuit of circuit is the most complicated, lamina cannot connect up or need Copper Foil
During to carry out grounded shield, it is necessary to select the flexible circuit board of this couple of internal wiring layer 131b.Implement at this
In mode, joint sheet 132 and/or auxiliary mat 133 preferably with the internal wiring layer 131b in its face, place with identical
Material and synchronization are made on insulating substrate 131a.
In other embodiments of the present invention, joint sheet 132 and/or felt pad can not also be with internal wirings
Layer 131b is arranged with layer, and is disposed on coverlay 131c, by the through hole on coverlay 131c
It is electrically connected with internal wiring layer 131b.
Refer to Fig. 6 and Fig. 7.Fig. 6 is the flexible circuit board corresponding diagram illustrating another embodiment of the present invention
1 along the sectional view of line segment 4-4 '.Fig. 7 is the front view illustrating disengaged of the flexible circuit board in Fig. 6.
In conjunction with Fig. 1 Yu Fig. 6, Fig. 7, the flexible circuit board 33 of present embodiment comprises plate body 131 equally, answers
Several joint sheets 132 and processing unit 14, therefore the structure of these assemblies and connection each other are closed
System can refer to related content above, does not repeats them here.The soft of present embodiment it is noted that at this
Circuit board 33, compared to flexible circuit board 13 difference of the embodiment shown in Fig. 1 to Fig. 3, is
The flexible circuit board 33 of present embodiment is provided only with single strip on disengaged 13b of plate body 131
Auxiliary mat 333, is arranged at the side of the close lead-in wire of disengaged 13b 126 concentrated areas of plate body 124, logical
Chang Weiyu joint sheet 132 position is set across the corresponding side of plate body 131, configure by this structure,
When the finger of user touches Touch Zone and during near surrounding zone, equally can be to lead-in wire 126 and adjacent thereto
Auxiliary mat 333 produces the identical or induced signal of approximation simultaneously.Therefore, on the composition surface of flexible circuit board 33
The capacitance signal that joint sheet 132 on 13a receives from Touch Zone Yu surrounding zone is sent to processing unit 14
Afterwards, processing unit 14 can be after bales catch removes the induced signal that auxiliary mat 333 is sensed, equally can be excellent
Change touch-control effect.It is also preferred that the left auxiliary mat 333 across plate body 131 with the connecing of each joint sheet 132 place
Close that region is corresponding is advisable, further to shield the impact on joint sheet 132 of the finger electric capacity.
By the detailed description of the above detailed description of the invention for the present invention, it is apparent that the electricity of the present invention
The transparent conductive layer of appearance formula contact panel electrically focuses on engaging zones via going between, and and flexible circuit
Joint sheet on the composition surface of plate engages, and therefore the overall width of the bonding land of flexible circuit board is reduced.
Meanwhile, the capacitance type touch-control panel of the present invention arranges at least one further on disengaged of flexible circuit board
Auxiliary mat, it can receive point as reference signal, and it arranges position and near region in lead set, and can draw
On a reference signal channel of processing unit.Configure by said structure, when the finger of user is near periphery
Qu Shi, can produce impact to lead-in wire and auxiliary mat adjacent thereto simultaneously.In other words, reference signal receives
Point can finger near surrounding zone time, the superposition electric capacity receiving to going between similar, and pass through reference signal
Channel delivers to processing unit as reference value.Therefore, the joint sheet on flexible circuit board composition surface receives
After being sent to processing unit from the capacitance signal of Touch Zone Yu surrounding zone, processing unit can be removed by bales catch
The corresponding reference value that auxiliary mat is sensed, can optimize touch-control effect, thus judge exactly from Touch Zone
Touching signals, the problem largely avoiding maloperation.
Although the present invention is disclosed above with embodiment, so it is not in order to limit the present invention, any is familiar with
This those skilled in the art, without departing from the spirit and scope of the present invention, when being used for a variety of modifications and variations, therefore
Protection scope of the present invention is when being as the criterion depending on the defined person of appended claims.
Claims (13)
1. a flexible circuit board, it is characterised in that comprise:
One plate body, has a contrary composition surface and one disengaged；
A plurality of joint sheets, are arranged on this composition surface；
At least one auxiliary mat, is arranged on this disengaged, and wherein those connect
Conjunction pad is respectively and electrically connected to the different of a processing unit from this auxiliary mat and sweeps
Retouch channel.
2. flexible circuit board as claimed in claim 1, it is characterised in that
Those joint sheets sequentially accept the scanning of a processing unit and this auxiliary mat is held
Continued access is scanned by this processing unit.
3. flexible circuit board as claimed in claim 1, it is characterised in that
The material of this auxiliary mat is conductive material.
4. flexible circuit board as claimed in claim 1, it is characterised in that
The material of this auxiliary mat is copper.
5. flexible circuit board as claimed in claim 1, it is characterised in that
This auxiliary mat position and those joint sheets are set position is set across this
Plate body is corresponding.
6. flexible circuit board as claimed in claim 1, it is characterised in that
The quantity of this at least one auxiliary mat is plural number, and those auxiliary mats the most electrically connect
Connect.
7. flexible circuit board as claimed in claim 6, it is characterised in that
This auxiliary mat is overlapping with those joint sheets each across this plate body.
8. flexible circuit board as claimed in claim 1, it is characterised in that
This plate body comprises insulating substrate, internal wiring layer and coverlay, wherein those
Joint sheet and/or this auxiliary mat and this internal wiring layer are simultaneously with same material
Being formed on this insulating substrate, this coverlay at least covers this internal wiring
Layer.
9. flexible circuit board as claimed in claim 1, it is characterised in that
Also comprise a processing unit, be arranged on this plate body, wherein those joint sheets
With the different scanning letter that this auxiliary mat is respectively and electrically connected to this processing unit
Road.
10. flexible circuit board as claimed in claim 9, it is characterised in that
Those joint sheets sequentially accept the scanning of this processing unit and this auxiliary mat is held
Continued access is scanned by this processing unit.
11. 1 kinds of self-capacitance contact panels, it is characterised in that should be from electricity
Appearance formula contact panel comprises the soft electricity as described in claim 1 to 10 is arbitrary
Road plate, also comprises:
One transparent conductive layer；
Plurality of leads, those lead-in wires each are electrically connected with this electrically conducting transparent figure
Pattern layer and this corresponding joint sheet.
12. self-capacitance contact panels as claimed in claim 11, wherein
Lead-in wire and transparent conductive layer are identical material.
13. self-capacitance contact panels as claimed in claim 11, it is special
Levy and be, also comprise a transparency carrier, surface thereof defines a Touch Zone
And a surrounding zone, wherein this transparent conductive layer is arranged at this Touch Zone
In, and those lead-in wires are arranged in this surrounding zone.
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510258886.4A CN106293279A (en) | 2015-05-15 | 2015-05-15 | The self-capacitance contact panel of flexible circuit board and application thereof |
| TW104123724A TWI621056B (en) | 2015-05-15 | 2015-07-22 | Flexible circuit board and self-capacitive touch panel using the same |
| TW104211830U TWM512750U (en) | 2015-05-15 | 2015-07-22 | Flexible circuit board and self-capacitive touch panel using the same |
| KR1020160057956A KR101900333B1 (en) | 2015-05-15 | 2016-05-12 | Flexible circuit board and self-capacitive touch panel using the same |
| JP2016096678A JP6093897B2 (en) | 2015-05-15 | 2016-05-13 | Flexible circuit board and self-capacitance touch panel using the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510258886.4A CN106293279A (en) | 2015-05-15 | 2015-05-15 | The self-capacitance contact panel of flexible circuit board and application thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106293279A true CN106293279A (en) | 2017-01-04 |
Family
ID=55219915
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510258886.4A Pending CN106293279A (en) | 2015-05-15 | 2015-05-15 | The self-capacitance contact panel of flexible circuit board and application thereof |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6093897B2 (en) |
| KR (1) | KR101900333B1 (en) |
| CN (1) | CN106293279A (en) |
| TW (2) | TWI621056B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110322782A (en) * | 2018-03-28 | 2019-10-11 | 英属开曼群岛商镎创科技股份有限公司 | Display base plate and display panel |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI594165B (en) * | 2016-11-04 | 2017-08-01 | 友達光電股份有限公司 | Touch device |
| CN111751710B (en) | 2020-06-29 | 2023-02-28 | 武汉天马微电子有限公司 | Flexible circuit board mother board and detection method thereof |
| KR20220021976A (en) | 2020-08-14 | 2022-02-23 | 삼성디스플레이 주식회사 | Circuit board and display device comprising thereof |
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- 2015-07-22 TW TW104123724A patent/TWI621056B/en active
- 2015-07-22 TW TW104211830U patent/TWM512750U/en unknown
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2016
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Also Published As
| Publication number | Publication date |
|---|---|
| KR101900333B1 (en) | 2018-09-19 |
| JP2016219009A (en) | 2016-12-22 |
| KR20160134531A (en) | 2016-11-23 |
| TWI621056B (en) | 2018-04-11 |
| JP6093897B2 (en) | 2017-03-08 |
| TW201640308A (en) | 2016-11-16 |
| TWM512750U (en) | 2015-11-21 |
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Effective date of registration: 20240306 Address after: 361101 No. 996 Min'an Avenue, Torch High tech Zone (Xiang'an) Industrial Zone, Xiamen City, Fujian Province Applicant after: TPK GLASS SOLUTIONS (XIAMEN) Inc. Country or region after: China Address before: Floor 3, 4, 5 and 8, 190 Jimei Avenue, Jimei District, Xiamen, Fujian, 361009 Applicant before: TPK Touch Systems (Xiamen) Inc. Country or region before: China |