CN1797275A - Enclosed type cooling system with internal circulation - Google Patents
Enclosed type cooling system with internal circulation Download PDFInfo
- Publication number
- CN1797275A CN1797275A CN 200410091853 CN200410091853A CN1797275A CN 1797275 A CN1797275 A CN 1797275A CN 200410091853 CN200410091853 CN 200410091853 CN 200410091853 A CN200410091853 A CN 200410091853A CN 1797275 A CN1797275 A CN 1797275A
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- Prior art keywords
- cabinet
- internal circulation
- opening
- cooling system
- enclosed type
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Abstract
The invention is a close internal circulation radiating system, comprising a machine box and a radiator, where the radiator comprises a casing and a refrigerating wafer, which has a refrigerating surface and a heating surface and is arranged inside the case, the back plate of the machine box is made with channels, the case is provided with an opening, the refrigerating surface faces the opening, and the side of the case made with the opening is connected with the back plate of the machine box. The invention is close to the external environment, beneficial to improving radiating effect.
Description
[technical field]
The invention relates to a kind of heat dissipation system for computers, be meant a kind of enclosed type cooling system with internal circulation especially.
[background technology]
Along with the integrated level of computer-internal electronic component is more and more higher, travelling speed is more and more faster, and the thermal value of electronic component is also increasing, and the temperature of computer-internal is also more and more higher.For this reason, industry is come the secondary computer heat radiation by the installing fan usually.But, existing computer heat radiation system is all open system, as shown in Figure 1, existing open cooling system sucks cabinet 100 inside by wind hole 10 with the cold air of computer cabinet 100 external environment conditions, by system fan 50 and other fans (as power supply fan) thermal current of computer-internal is discharged to external environment condition again.Because open cooling system is to the opening of external environment condition, cause following adverse consequences: one, influenced by ambient temperature bigger for radiating effect, too high as environment temperature, computer-internal part temperature is understood corresponding rising, has increased the instability of parts work; Two, along with service time is gradually long, external dust can accumulate in computer-internal and fan etc. in a large number and locate, and its fault possibility occurrence is increased, and shorten serviceable life; Three, fan work also can produce suitable noise.Therefore, how to provide a kind of computer heat radiation system that is not subject to the ambient temperature influence to become the technical barrier of industry.
[summary of the invention]
The object of the present invention is to provide a kind of enclosed type cooling system with internal circulation.
The present invention is achieved by the following technical solutions: enclosed type cooling system with internal circulation of the present invention, comprise a cabinet and a heat abstractor, this heat abstractor further comprises a shell and a refrigeration wafer, this cooling wafer has consistent huyashi-chuuka (cold chinese-style noodles) and consistent hot side, this cooling wafer is arranged at this enclosure, and this cabinet backboard offers passage, and this shell is provided with opening, the refrigeration face of this cooling wafer is towards this shell aperture, and the one side that this shell is provided with opening links to each other with this cabinet backboard.
Compared with prior art, the present invention has closure for external environment condition, thereby has following beneficial effect: one, be subjected to external environment influence smaller, can regulate and select only temperature within the specific limits by cooling wafer; Two, the closure of system can significantly reduce inner dust and accumulates, the corresponding reduction of unit failure incidence, and serviceable life is corresponding elongated; Three, inside computer system fan work noise can be isolated by part, reduced the noise of whole computer system; Four, because the closure requirement of system, it is invalid to be that computing machine part wind hole becomes, remove these wind holes after, can reduce the computing machine manufacturing cost.In addition, the present invention has no special requirements to the computer-internal layout, only need carry out simple interface, can realize outside the installation and convenient disassembly.
[description of drawings]
Fig. 1 is the combined planar synoptic diagram of the open cooling system of prior art.
Fig. 2 is the decomposition floor map of enclosed type cooling system with internal circulation first embodiment of the present invention.
Fig. 3 is the combined planar synoptic diagram of enclosed type cooling system with internal circulation first embodiment of the present invention.
Fig. 4 is the decomposition floor map of enclosed type cooling system with internal circulation second embodiment of the present invention.
Fig. 5 is the combined planar synoptic diagram of enclosed type cooling system with internal circulation second embodiment of the present invention.
[embodiment]
See also shown in Fig. 2,3, the present invention includes cabinet 10 and heat abstractor 80, this heat abstractor 80 further comprises shell 70, cooling wafer 50, first heating radiator 40 and second heating radiator 60, this cooling wafer 50 has refrigeration face 501 and pyrogenicity face 502, this refrigeration face 501 is equiped with first heating radiator 40, and this pyrogenicity face 502 is equiped with second heating radiator 60, and this cooling wafer 50, first heating radiator 40 and second heating radiator 60 are arranged at shell 70 inside.These cabinet 10 backboards 101 two ends offer first passage 20 and second channel 30 respectively, and first passage 20 places are equiped with the fan 201 of outlet air surface towards cabinet 10 inside, and first passage 30 places are equiped with the fan 301 of air intake surface towards cabinet 10 inside.701 two ends, bottom of this shell 70 are respectively equipped with first opening 711 and second opening 721, the first passage of offering on this first opening 711 and cabinet 10 backboards 101 20 is corresponding, the second channel of offering on this second opening 721 and cabinet 10 backboards 101 30 is corresponding, this heat abstractor 80 is provided with opening 711 and links to each other with cabinet 10 backboards 101 with 721 bottom 701, forms an airtight system.After blowing to the cooling wafer 50 and first heating radiator 40 by fan 301, the cabinet 10 inner thermal currents that produce become cold airflow, by fan 201 it is blowed to the central processing unit 120 of computing machine again, air-flow finally flows to cooling wafer 50 and forms an enclosed type cooling system with internal circulation (air-flow is shown in Fig. 2 dotted arrow) through cabinet 10 inside subsequently.
Fig. 4,5 is depicted as second embodiment of the invention.Be with first embodiment difference, this shell 70 ' the opening 731 in bottom 701 ' only be provided with, first passage 20 that these cabinet 10 backboards 101 are offered and second channel 30 are all corresponding to this opening 731, an airtight system is formed on the bottom 701 of this heat abstractor 80 ' be provided with opening 731 ' link to each other with cabinet 10 backboards 101.After blowing to the cooling wafer 50 and first heating radiator 40 by fan 301, the cabinet 10 inner thermal currents that produce become cold airflow, by fan 201 it is blowed to the central processing unit 120 of computing machine again, air-flow is through cabinet 10 inside subsequently, finally flow to cooling wafer 50, thereby form an enclosed type cooling system with internal circulation (air-flow is shown in Fig. 4 dotted arrow).
Claims (5)
1. enclosed type cooling system with internal circulation, comprise a cabinet and a heat abstractor, this heat abstractor further comprises a shell and a refrigeration wafer, this cooling wafer has consistent huyashi-chuuka (cold chinese-style noodles) and consistent hot side, this cooling wafer is arranged at this enclosure, it is characterized in that: this cabinet backboard offers passage, and this shell is provided with opening, the refrigeration face of this cooling wafer is towards this shell aperture, and the one side that this shell is provided with opening links to each other with this cabinet backboard.
2. enclosed type cooling system with internal circulation as claimed in claim 1 is characterized in that: the refrigeration face of described cooling wafer is equiped with first heating radiator, and the pyrogenicity face of described cooling wafer is equiped with second heating radiator.
3. enclosed type cooling system with internal circulation as claimed in claim 2, it is characterized in that: described cabinet backboard offers two passages, described outer casing bottom two ends are respectively equipped with two openings, and this two opening is corresponding with first passage and second channel that the cabinet backboard is offered respectively.
4. enclosed type cooling system with internal circulation as claimed in claim 2 is characterized in that: described cabinet backboard offers two passages, and described outer casing bottom is provided with an opening, and this opening is corresponding with first passage and second channel that the cabinet backboard is offered.
5. as claim 3 or 4 described enclosed type cooling system with internal circulation, it is characterized in that: be provided with a central processing unit in the described cabinet, passage place near central processing unit in described two passages is equiped with first fan, this fan outlet air surface is towards cabinet inside, another passage place away from central processing unit in described two passages is equiped with second fan, and this fan air intake surface is towards cabinet inside.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200410091853 CN1797275A (en) | 2004-12-24 | 2004-12-24 | Enclosed type cooling system with internal circulation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200410091853 CN1797275A (en) | 2004-12-24 | 2004-12-24 | Enclosed type cooling system with internal circulation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1797275A true CN1797275A (en) | 2006-07-05 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200410091853 Pending CN1797275A (en) | 2004-12-24 | 2004-12-24 | Enclosed type cooling system with internal circulation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1797275A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103123534A (en) * | 2012-12-31 | 2013-05-29 | 联宝(合肥)电子科技有限公司 | Separating-type heat-dissipation method of heat-dissipation system and heat-dissipation system |
| CN115202448A (en) * | 2022-07-19 | 2022-10-18 | 武汉松泽源科技发展有限公司 | Calculator host with additional heat dissipation assembly arranged outside |
-
2004
- 2004-12-24 CN CN 200410091853 patent/CN1797275A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103123534A (en) * | 2012-12-31 | 2013-05-29 | 联宝(合肥)电子科技有限公司 | Separating-type heat-dissipation method of heat-dissipation system and heat-dissipation system |
| CN103123534B (en) * | 2012-12-31 | 2016-08-03 | 联宝(合肥)电子科技有限公司 | The separate type heat dissipating method of cooling system and cooling system |
| CN115202448A (en) * | 2022-07-19 | 2022-10-18 | 武汉松泽源科技发展有限公司 | Calculator host with additional heat dissipation assembly arranged outside |
| CN115202448B (en) * | 2022-07-19 | 2023-12-12 | 武汉松泽源科技发展有限公司 | Calculator host with additional heat dissipation component externally mounted |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |