CN115202448A - Calculator host with additional heat dissipation assembly arranged outside - Google Patents
Calculator host with additional heat dissipation assembly arranged outside Download PDFInfo
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- CN115202448A CN115202448A CN202210851323.6A CN202210851323A CN115202448A CN 115202448 A CN115202448 A CN 115202448A CN 202210851323 A CN202210851323 A CN 202210851323A CN 115202448 A CN115202448 A CN 115202448A
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 104
- 210000001503 joint Anatomy 0.000 claims abstract description 17
- 238000001816 cooling Methods 0.000 claims abstract description 14
- 239000000428 dust Substances 0.000 claims abstract description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 26
- 238000010438 heat treatment Methods 0.000 claims description 16
- SZVJSHCCFOBDDC-UHFFFAOYSA-N iron(II,III) oxide Inorganic materials O=[Fe]O[Fe]O[Fe]=O SZVJSHCCFOBDDC-UHFFFAOYSA-N 0.000 claims description 16
- 230000005855 radiation Effects 0.000 claims description 5
- 238000010030 laminating Methods 0.000 claims description 4
- 239000011229 interlayer Substances 0.000 claims description 2
- 206010020649 Hyperkeratosis Diseases 0.000 claims 2
- 238000010521 absorption reaction Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000009825 accumulation Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/181—Enclosures
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention provides a calculator host with an additional heat dissipation assembly arranged outside, which comprises a calculator host body, wherein the calculator host body comprises a host case, a back plate heat dissipation assembly and a flow guide mechanism, an exhaust fan is installed at the top end of the host case, a host back plate is installed at one side of the host case, a heat conduction mechanism is arranged at the middle position of the host back plate, the back plate heat dissipation assembly is installed on the surface of the host back plate, the back plate heat dissipation assembly is in butt joint with the host back plate through the heat conduction mechanism, the back plate heat dissipation assembly is additionally arranged at the side edge, the same air cooling assembly can be used for carrying out wind power heat dissipation treatment on the bottom of the host case and two areas of the back plate heat dissipation assembly, energy sources and heat dissipation equipment are fully utilized, heat dissipation dead corners in the host case are eliminated, an air inlet at the bottom of the host case is extended to the side edge by the flow guide mechanism, so that the host case is far away from the ground area, the problem of dust blockage is reduced, and the air inlet is convenient to clean.
Description
Technical Field
The invention relates to the technical field of electronic equipment, in particular to a calculator host with an additional heat dissipation component arranged outside.
Background
The inside of calculator host computer has a large amount of heating elements, consequently, use corresponding heat-radiating equipment, generally adopt forced air cooling or water-cooling to dispel the heat to the host computer inside among the prior art, but the backplate part of mainframe box is as the support region to mainboard component can't carry out the heat dissipation processing to it, consequently backplate part produces the heat accumulation easily, on the other hand, conventional host computer all adopts from the bottom air inlet, from the wind channel structure of top exhaust, consequently extremely easily because the wind channel causes subaerial dust absorption on the surface bottom of the case, and the bottom is difficult to directly clean the clearance, can only clean through the mode of dismantling, the operation is difficult hard, and because be close to ground, compare in other positions, the dust screen part receives the jam more easily, long-time use can reduce the holistic heat dispersion of quick-witted case.
Disclosure of Invention
Aiming at the defects in the prior art, the invention aims to provide a calculator host with an additional heat dissipation assembly arranged outside to solve the problems in the background art.
In order to achieve the purpose, the invention is realized by the following technical scheme: the utility model provides an outside calculator host computer of installing extra radiator unit additional, includes calculator host computer body, calculator host computer body includes mainframe box, backplate radiator unit and water conservancy diversion mechanism, the exhaust fan is installed on the top of mainframe box, the host computer backplate is installed to one side of mainframe box, the intermediate position of host computer backplate is provided with heat conduction mechanism, backplate radiator unit installs the surface at the host computer backplate, and backplate radiator unit passes through heat conduction mechanism and host computer backplate butt joint, backplate radiator unit's internally mounted has heat radiation fins, forced air cooling subassembly is installed to backplate radiator unit's side, forced air cooling subassembly is connected with terminal water conservancy diversion mechanism through inside channel structure, the top of water conservancy diversion mechanism is provided with first magnetite, the bottom of mainframe box is provided with the second magnetite, water conservancy diversion mechanism adsorbs the laminating in the bottom of mainframe box mutually through surperficial first magnetite and second magnetite, the bottom of water conservancy diversion mechanism is directly placed subaerial.
Furthermore, the backboard heat dissipation assembly comprises a heat dissipation plate and a heat dissipation opening, the heat dissipation fins are installed on the inner side of the heat dissipation plate, the bottom end inside the heat dissipation plate is communicated with the inside of the air cooling assembly through a top heat dissipation channel, a second heat conduction plate is installed at the rear end of the heat dissipation plate, and the second heat conduction plate is connected with the heat conduction mechanism.
Furthermore, the airflow flowing in the top heat dissipation channel passes through the interlayer of the heat dissipation fins upwards, and the surface of the heat dissipation plate is completely attached to the surface of the host backboard.
Further, heat conduction mechanism includes heat conduction draw-in groove and first heat-conducting plate, the inside at first heat-conducting plate is seted up to the heat conduction draw-in groove, heat conduction draw-in groove and first heat-conducting plate all are provided with a plurality ofly, and parallel arrangement each other between every first heat-conducting plate.
Furthermore, the second heat-conducting plate is inserted into the heat-conducting clamping groove, and the height of the heat-conducting clamping groove is larger than that of the second heat-conducting plate.
Further, the air cooling subassembly includes inlet air channel and inlet fan, the inlet fan is installed at inlet air channel's top, inlet air channel's end is provided with the diffluence pass, the bottom of diffluence pass is provided with bottom heat dissipation channel, bottom heat dissipation channel is linked together with water conservancy diversion mechanism.
Furthermore, the bottom heat dissipation channel is communicated with the top heat dissipation channel, the tail end of the air inlet channel is respectively perpendicular to the bottom heat dissipation channel and the top heat dissipation channel, and the top of the air inlet fan is covered with a dust screen structure.
Further, the water conservancy diversion mechanism includes butt joint plate and bottom plate, the air intake has been seted up on the surface of bottom plate, the top edge of bottom plate is provided with the diaphragm, the top of diaphragm is connected with the butt joint plate, first magnetite pastes the surface of dress at the butt joint plate.
Furthermore, the surface mounting of bottom plate has the butt joint post, the constant head tank has been seted up to the bottom of butt joint board, the butt joint post inlays the dress in the inside of constant head tank.
Further, a foot pad is installed at the bottom end of the mainframe box, the flow guide mechanism is installed on the inner side of the foot pad, an anti-slip pad is attached to the bottom end of the bottom plate, and the middle of the butt-joint plate is of a hollow structure.
The invention has the beneficial effects that: the calculator host provided with the additional heat dissipation assembly externally comprises a calculator host body, wherein the calculator host body comprises a host case, a foot pad, an exhaust fan, a back plate heat dissipation assembly, an air cooling assembly, a flow guide mechanism, a heat dissipation port, a heat conduction mechanism, a host back plate, a heat dissipation plate, a bottom plate, a diaphragm, a butt joint plate, a first magnet, a second magnet, an air inlet, a butt joint column, a positioning groove, an air inlet channel, an air inlet fan, a flow distribution port, a top heat dissipation channel, a bottom heat dissipation channel, a second heat conduction plate, a heat conduction clamping groove, a first heat conduction plate, an anti-skidding pad and heat dissipation fins.
1. This calculator host computer of extra radiator unit is installed additional to outside has been through having increased backplate radiator unit at the side, can utilize same group of air-cooled subassembly to carry out wind-force heat dissipation to two regions of the bottom of mainframe box and backplate radiator unit and handle, make full use of the energy and heat-radiating equipment, eliminated the heat dissipation dead angle in the mainframe box.
2. This outside installs extra radiator unit's calculator host computer additional extends the air intake of mainframe bottom portion to the side through utilizing water conservancy diversion mechanism to keep away from the ground region, alleviateed the problem that the dust blockked up, also be convenient for simultaneously clean the air intake.
3. The computer host with the additional external heat dissipation assembly is characterized in that the butt plate and the bottom plate are connected through the diaphragm in the flow guide mechanism, so that the butt plate can only be in contact with the bottom of the host case when the computer host is installed, the whole external heat dissipation device is supported on the ground through the bottom plate, and the additional support protection function is provided for the host case, so that the computer host is convenient to disassemble and assemble.
Drawings
FIG. 1 is a schematic structural diagram of an external form of a computer host with an additional heat dissipation assembly mounted thereon according to the present invention;
FIG. 2 is a schematic structural diagram of a computer host with an additional heat dissipation assembly installed thereon according to the present invention after being disassembled;
FIG. 3 is a schematic view of a computer host with an additional heat sink assembly mounted thereon according to the present invention;
FIG. 4 is a side cross-sectional view of a portion of a heat sink assembly of a back plate of a computer host with an additional heat sink assembly attached externally thereto in accordance with the present invention;
FIG. 5 is a schematic structural diagram of a heat sink assembly of a back plate of a computer host with an additional heat sink assembly mounted thereon according to the present invention;
in the figure: 1. a main chassis; 2. a foot pad; 3. an exhaust fan; 4. a back plate heat dissipation assembly; 5. an air-cooled assembly; 6. a flow guide mechanism; 7. a heat dissipation port; 8. a heat conducting mechanism; 9. a host backplane; 10. a heat dissipation plate; 11. a base plate; 12. a diaphragm; 13. butt-joint plates; 14. a first magnet; 15. a second magnet; 16. an air inlet; 17. butting the columns; 18. positioning a groove; 19. an air inlet channel; 20. a fan inlet; 21. a shunt port; 22. a top heat dissipation channel; 23. a bottom heat dissipation channel; 24. a second heat-conducting plate; 25. a heat conducting clamping groove; 26. a first heat-conducting plate; 27. a non-slip mat; 28. and heat dissipation fins.
Detailed Description
In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the invention easy to understand, the invention is further described with the specific embodiments.
Referring to fig. 1 to 5, the present invention provides a technical solution: the utility model provides an outside is installed extra radiating component's calculator host computer additional, includes calculator host computer body, calculator host computer body includes mainframe box 1, backplate radiating component 4 and water conservancy diversion mechanism 6, exhaust fan 3 is installed on the top of mainframe box 1, host computer backplate 9 is installed to one side of mainframe box 1, the intermediate position of host computer backplate 9 is provided with heat conduction mechanism 8, backplate radiating component 4 is installed on the surface of host computer backplate 9, and backplate radiating component 4 docks with host computer backplate 9 through heat conduction mechanism 8, the internally mounted of backplate radiating component 4 has heat radiation fins 28, forced air cooling subassembly 5 is installed to the side of backplate radiating component 4, forced air cooling subassembly 5 is connected with terminal water conservancy diversion mechanism 6 through inside channel structure, the top of water conservancy diversion mechanism 6 is provided with first magnetite 14, the bottom of mainframe box 1 is provided with second magnetite 15, water conservancy diversion mechanism 6 inhales through first magnetite 14 and the second magnetite 15 on surface and attaches the laminating in the bottom of mainframe box 1, the bottom of water conservancy diversion mechanism 6 directly places the bottom at subaerial, this outside is installed the calculator that extra radiating component's the heat dissipation sets up behind the inside and is installed the heat dissipation mechanism 10 and is through the heat dissipation mechanism 10 to this heat dissipation mechanism 4, and the heat dissipation mechanism can be carried out the heat dissipation mechanism through the heat dissipation mechanism 10 of the heat dissipation mechanism that the heat absorption of this heat absorption, and the heat dissipation effect of the heat dissipation mechanism through the inside heat dissipation mechanism 10, and the heat dissipation mechanism.
This embodiment, backplate thermal module 4 includes heating panel 10 and thermovent 7, cooling fin 28 installs the inboard at heating panel 10, the inside bottom of heating panel 10 is linked together through top heat dissipation channel 22 and air-cooled subassembly 5 is inside, second heat-conducting plate 24 is installed to the rear end of heating panel 10, second heat-conducting plate 24 is connected with heat conduction mechanism 8, the air current that flows upwards passes in top heat dissipation channel 22 from the intermediate layer of cooling fin 28, the surface of heating panel 10 and the surface of host computer backplate 9 are laminated completely, through increased backplate thermal module 4 at the side, can utilize same group air-cooled subassembly 5 to carry out wind-force heat dissipation processing to two regions of the bottom of mainframe box 1 and backplate thermal module 4, make full use of the energy and radiating equipment, eliminated the heat dissipation dead angle in the mainframe box 1, during the use, directly laminate whole heating panel 10 and host computer backplate 9 mutually, through heat conduction mechanism 8 in the middle of host computer backplate 9, can be with the heat that produces on the host computer backplate 9 to the inside transmission of heating panel 10, there is heat dissipation backplate 28 at the internally mounted of heat dissipation backplate, when heating panel 10 through heat conduction mechanism 8 with the inside absorption back of backplate 9, can go up the heat absorption back up the heat dissipation fin 28, can carry out quick heat dissipation effect of contact on the heat dissipation, can realize the heat dissipation fin, can contact on the heat dissipation fin 28.
This embodiment, heat conduction mechanism 8 includes heat conduction draw-in groove 25 and first heat-conducting plate 26, the inside at first heat-conducting plate 26 is seted up to heat conduction draw-in groove 25, heat conduction draw-in groove 25 and first heat-conducting plate 26 all are provided with a plurality ofly, and parallel arrangement each other between every first heat-conducting plate 26, second heat-conducting plate 24 inserts the inside of heat conduction draw-in groove 25, and the height that highly is greater than second heat-conducting plate 24 of heat conduction draw-in groove 25, directly is connected with host computer backplate 9 in first heat-conducting plate 26 both sides, can be with on the heat transfer to first heat-conducting plate 26 on the host computer backplate 9, insert the inside of heat conduction draw-in groove 25 through second heat-conducting plate 24 of heating panel 10 side, can be with on the adsorbed heat re-transfer second heat-conducting plate 24 on first heat-conducting plate 26, and then carry out the inside thermal diffusivity of subsequent heating panel 10 and handle.
This embodiment, air-cooled subassembly 5 includes inlet air channel 19 and air inlet fan 20, inlet air fan 20 installs the top at inlet air channel 19, inlet air channel 19's end is provided with reposition of redundant personnel mouth 21, the bottom of reposition of redundant personnel mouth 21 is provided with bottom heat dissipation channel 23, bottom heat dissipation channel 23 is linked together with water conservancy diversion mechanism 6, bottom heat dissipation channel 23 and top heat dissipation channel 22 are linked together, and inlet air channel 19's end respectively with bottom heat dissipation channel 23, top heat dissipation channel 22 keep perpendicular, inlet air fan 20's top covers has the dust screen structure, air-cooled subassembly 5 is as the common amount of wind source in backplate heat dissipation subassembly 4 and water conservancy diversion mechanism 6 two positions, during the use, after starting air inlet fan 20 at air-cooled subassembly 5 top, can blow in outside cold air from inlet air channel 19, behind reposition of redundant personnel mouth 21, because inlet air channel 19's end is in air current mouth position and bottom heat dissipation channel 23 and top heat dissipation channel 22 keep perpendicular, therefore partial air current upwards flows into the inside of heating panel 10, can upwards drive heat among heat radiation fins 28, finally from the heat dissipation mouth 7 rows of top, realize the inside heat dissipation box 10, and the host computer is inside from the host computer case 1, and the heat dissipation mechanism is used.
This embodiment, water conservancy diversion mechanism 6 includes buttcover plate 13 and bottom plate 11, air intake 16 has been seted up on the surface of bottom plate 11, the top edge of bottom plate 11 is provided with diaphragm 12, the top of diaphragm 12 is connected with buttcover plate 13, first magnetite 14 pastes the surface at buttcover plate 13, extend to the side through utilizing water conservancy diversion mechanism 6 to the air intake 16 of mainframe box 1 bottom, thereby keep away from the ground region, the problem of dust jam has been alleviateed, also be convenient for clean air intake 16 simultaneously, because in water conservancy diversion mechanism 6, through adsorbing the back to first magnetite 14 and second magnetite 15, can press the laminating in the inside of mainframe box 1 with buttcover plate 13, carry out the shutoff through diaphragm 12 with the side in the bottom of buttcover plate 13, thereby will come from the inside cold air of bottom heat dissipation channel 23 only can upwards flow, enter into the inside of mainframe box 1, through the inside channel structure of bottom plate 11, can be with wind channel source control on the air-cooled subassembly 5 of keeping away from, the probability that the dust inflow all is reduced inside of mainframe box 1.
In this embodiment, the surface of the bottom plate 11 is provided with an abutting column 17, the bottom end of the abutting plate 13 is provided with a positioning groove 18, the abutting column 17 is embedded inside the positioning groove 18, the bottom end of the mainframe box 1 is provided with the foot pad 2, the flow guide mechanism 6 is installed on the inner side of the foot pad 2, the bottom end of the bottom plate 11 is attached with the non-slip mat 27, the middle of the abutting plate 13 is of a hollow structure, the abutting plate 13 and the bottom plate 11 are connected through the diaphragm 12 in the flow guide mechanism 6, so that the abutting plate 13 can only be contacted with the bottom of the mainframe box 1 when being installed, the whole external heat dissipation device is supported on the ground through the bottom plate 11, the mainframe box 1 is provided with an additional supporting and protecting function for facilitating disassembly and assembly, when being installed, the whole backboard heat dissipation assembly 4 is directly pulled, and the flow guide mechanism 6 at the bottom is inserted into the mainframe box 1, and the butt joint plate 13 at the top is attached to the bottom end of the mainframe box 1 through a magnet, while the diversion mechanism 6 is inserted, the second heat conduction plate 24 is inserted into the heat conduction clamping groove 25, after the insertion is completed, the backboard heat dissipation assembly 4 can be loosened, and the backboard heat dissipation assembly 4 falls under the action of self gravity, because the height of the heat conduction clamping groove 25 is greater than that of the second heat conduction plate 24, in the falling process of the backboard heat dissipation assembly 4, the second heat conduction plate 24 is still positioned in the heat conduction clamping groove 25, the bottom plate 11 at the bottom moves downwards, the butt joint plate 13 is always attached to the bottom end of the mainframe box 1 due to the adsorption of the magnet, so that the external heat dissipation mechanism is pressed on the ground through the anti-skid pad 27 at the bottom, the butt joint column 17 is inserted into the positioning groove 18 by lifting the backboard heat dissipation assembly 4 during the disassembly, and the whole butt joint plate 13 can be pulled out.
While there have been shown and described what are at present considered the fundamental principles and essential features of the invention and its advantages, it will be apparent to those skilled in the art that the invention is not limited to the details of the foregoing exemplary embodiments, but is capable of other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present specification describes embodiments, not every embodiment includes only a single embodiment, and such description is for clarity purposes only, and it is to be understood that all embodiments may be combined as appropriate by one of ordinary skill in the art to form other embodiments as will be apparent to those of skill in the art from the description herein.
Claims (10)
1. The utility model provides an outside calculator host computer of installing extra radiator unit additional, includes calculator host computer body, its characterized in that: calculator host computer body includes mainframe box (1), backplate radiator unit (4) and water conservancy diversion mechanism (6), exhaust fan (3) are installed on the top of mainframe box (1), host computer backplate (9) are installed to one side of mainframe box (1), the intermediate position of host computer backplate (9) is provided with heat conduction mechanism (8), install on the surface of host computer backplate (9) backplate radiator unit (4), and backplate radiator unit (4) dock with host computer backplate (9) through heat conduction mechanism (8), the internally mounted of backplate radiator unit (4) has heat radiation fin (28), air-cooled subassembly (5) are installed to the side of backplate radiator unit (4), air-cooled subassembly (5) are connected with terminal water conservancy diversion mechanism (6) through inside channel structure, the top of water conservancy diversion mechanism (6) is provided with first magnetite (14), the bottom of mainframe box (1) is provided with second magnetite (15), water conservancy diversion mechanism (6) are inhaled mutually through first magnetite (14) and are attached the laminating in mainframe box (1) bottom, and water conservancy diversion mechanism (6) are placed in the direct bottom of ground.
2. The computer host of claim 1, wherein the computer host is further configured to add an additional heat sink component to the computer host, and wherein: backplate heat dissipation assembly (4) include heating panel (10) and thermovent (7), heat radiation fin (28) are installed in the inboard of heating panel (10), the bottom of heating panel (10) inside is linked together through top heat dissipation passageway (22) and forced air cooling subassembly (5) inside, second heat-conducting plate (24) are installed to the rear end of heating panel (10), second heat-conducting plate (24) are connected with heat-conducting mechanism (8).
3. The computer host of claim 2, wherein the computer host is further configured to add an additional heat sink component to the computer host, and wherein: the airflow flowing in the top heat dissipation channel (22) passes through the interlayer of the heat dissipation fins (28) upwards, and the surface of the heat dissipation plate (10) is completely attached to the surface of the host backboard (9).
4. The computer host as claimed in claim 2, wherein: heat conduction mechanism (8) are including heat conduction draw-in groove (25) and first heat-conducting plate (26), the inside at first heat-conducting plate (26) is seted up in heat conduction draw-in groove (25), heat conduction draw-in groove (25) and first heat-conducting plate (26) all are provided with a plurality ofly, and parallel arrangement each other between every first heat-conducting plate (26).
5. The computer host as claimed in claim 4, wherein: the second heat conduction plate (24) is inserted into the heat conduction clamping groove (25), and the height of the heat conduction clamping groove (25) is larger than that of the second heat conduction plate (24).
6. The computer host as claimed in claim 2, wherein: forced air cooling subassembly (5) include inlet air channel (19) and air inlet fan (20), the top at inlet air channel (19) is installed in inlet air fan (20), the end of inlet air channel (19) is provided with branch flow port (21), the bottom of branch flow port (21) is provided with bottom heat dissipation channel (23), bottom heat dissipation channel (23) are linked together with water conservancy diversion mechanism (6).
7. The computer host of claim 6, wherein the computer host is further configured to add an additional heat sink component to the computer host, and wherein: the bottom heat dissipation channel (23) is communicated with the top heat dissipation channel (22), the tail end of the air inlet channel (19) is perpendicular to the bottom heat dissipation channel (23) and the top heat dissipation channel (22) respectively, and the top of the air inlet fan (20) is covered with a dust screen structure.
8. The computer host as claimed in claim 6, wherein: the water conservancy diversion mechanism (6) includes buttcover plate (13) and bottom plate (11), air intake (16) have been seted up on the surface of bottom plate (11), the top edge of bottom plate (11) is provided with diaphragm (12), the top of diaphragm (12) is connected with buttcover plate (13), first magnetite (14) pastes the surface at buttcover plate (13).
9. The computer host as claimed in claim 8, wherein: the surface mounting of bottom plate (11) has butt joint post (17), constant head tank (18) have been seted up to the bottom of butt joint plate (13), butt joint post (17) inlay the dress and are being equipped with the inside in constant head tank (18).
10. A computer host with an externally mounted heat sink assembly as recited in claim 9, wherein: callus on the sole (2) are installed to the bottom of mainframe box (1), the inboard at callus on the sole (2) is installed in water conservancy diversion mechanism (6), the bottom subsides of bottom plate (11) are equipped with slipmat (27), the centre of butt-joint plate (13) is hollow structure.
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| CN202210851323.6A CN115202448B (en) | 2022-07-19 | 2022-07-19 | Calculator host with additional heat dissipation component externally mounted |
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| CN202210851323.6A CN115202448B (en) | 2022-07-19 | 2022-07-19 | Calculator host with additional heat dissipation component externally mounted |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1797275A (en) * | 2004-12-24 | 2006-07-05 | 富准精密工业(深圳)有限公司 | Enclosed type cooling system with internal circulation |
| TWM523137U (en) * | 2016-03-11 | 2016-06-01 | 飛捷科技股份有限公司 | Electronic device with channel cooling function |
| CN107992174A (en) * | 2017-12-04 | 2018-05-04 | 四川省守望信息科技有限责任公司 | The method for improving main frame radiating efficiency |
| CN213042237U (en) * | 2020-07-08 | 2021-04-23 | 赖坚真 | Computer host heat dissipation system |
| CN213876640U (en) * | 2020-12-31 | 2021-08-03 | 兰州大学 | Heat dissipation mechanism for desktop |
| CN214376305U (en) * | 2021-04-21 | 2021-10-08 | 惠州学院 | Heat abstractor for computer |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN210983287U (en) * | 2019-12-19 | 2020-07-10 | 苏州崇凌信息技术有限公司 | Computer hardware heat dissipation mechanism |
| CN114035665A (en) * | 2021-11-09 | 2022-02-11 | 河南工业职业技术学院 | Computer air-cooled external heat radiation structure |
-
2022
- 2022-07-19 CN CN202210851323.6A patent/CN115202448B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1797275A (en) * | 2004-12-24 | 2006-07-05 | 富准精密工业(深圳)有限公司 | Enclosed type cooling system with internal circulation |
| TWM523137U (en) * | 2016-03-11 | 2016-06-01 | 飛捷科技股份有限公司 | Electronic device with channel cooling function |
| CN107992174A (en) * | 2017-12-04 | 2018-05-04 | 四川省守望信息科技有限责任公司 | The method for improving main frame radiating efficiency |
| CN213042237U (en) * | 2020-07-08 | 2021-04-23 | 赖坚真 | Computer host heat dissipation system |
| CN213876640U (en) * | 2020-12-31 | 2021-08-03 | 兰州大学 | Heat dissipation mechanism for desktop |
| CN214376305U (en) * | 2021-04-21 | 2021-10-08 | 惠州学院 | Heat abstractor for computer |
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| Publication number | Publication date |
|---|---|
| CN115202448B (en) | 2023-12-12 |
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