CN1393929A - Thermal radiator for IC - Google Patents
Thermal radiator for IC Download PDFInfo
- Publication number
- CN1393929A CN1393929A CN 01113105 CN01113105A CN1393929A CN 1393929 A CN1393929 A CN 1393929A CN 01113105 CN01113105 CN 01113105 CN 01113105 A CN01113105 A CN 01113105A CN 1393929 A CN1393929 A CN 1393929A
- Authority
- CN
- China
- Prior art keywords
- parallel
- metab
- fans
- metal base
- heat radiation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The ivnented heating radiator used for integrated circuit consists of the metal base and two fans. There are four more parallel heat radiation slots on the metal base. The said two fans are parallel installed on the two sides of the metal base respectively. The direction of the air supply is parallel to the direction of the parallel heat radiation slots on the metal base. The direction of the two fans are same. The gold layer is coated on the bottom part of the metal base in order to make the air pass the parallel heat radiation slots rapidly and effectively so as to quicken the heat exchange and enhance the heat radiation efficiency.
Description
The present invention relates to a kind of radiator that is used for integrated circuit, particularly a kind of metal heat sink that installs fan.
The metal heat sink that has installed fan of the prior art is made up of a metab and a fan, make metab and adopt aluminum metal more, thermal conductivity is low, fan assembly is on metab simultaneously, to the air-supply of the bottom of metab, such radiator air turbulence, radiating efficiency is not high.
The object of the present invention is to provide a kind of chip radiator that can overcome above-mentioned shortcoming in the prior art, described this chip radiator can improve radiating efficiency.
The present invention is achieved in that a kind of radiator that is used for integrated circuit of the present invention, form by a metab and two fans, wherein said metab is provided with the parallel radiating groove more than four, described two fans are set in parallel in the both sides of described metab respectively, the direction of the parallel radiating groove on direction and the metab of air-supply is parallel, the air supply direction of described two fans is identical, simultaneously be coated with one deck gold in the bottom of described metab, the thickness of coating is between the 1-10 micron.
The present invention is because be made up of a metab and two fans, be coated with one deck gold in the bottom of described metab, improved the capacity of heat transmission of chip and metab bottom, while, two fans were set in parallel in the both sides of described metab respectively, the direction of the parallel radiating groove on direction and the metab of air-supply is parallel, the air supply direction of described two fans is identical, so can effectively air be passed through parallel radiating groove fast, accelerate heat exchange, improve radiating efficiency, reached purpose of the present invention.
The present invention is further illustrated below in conjunction with drawings and Examples:
Fig. 1 is a kind of schematic diagram that is used for the radiator of integrated circuit of the present invention.
As shown in Figure 1, a kind of radiator that is used for integrated circuit of the present invention is made up of a metab 1 and fan 2, a fan 3, wherein, is coated with one deck gold in the bottom of described metab, and the thickness of coating is between the 1-10 micron.Described metab 1 is provided with the parallel radiating groove 4 more than four, described fan 2, fan 3 are set in parallel in the both sides of described metab 1 respectively, the direction of the parallel radiating groove 4 on direction and the metab 1 of air-supply is parallel, and the air supply direction of described fan 2, fan 3 is identical.In the present embodiment, fan 2, fan 3 are screwed on metab 1.
Claims (1)
1, a kind of radiator that is used for integrated circuit, form by metab and fan, it is characterized in that: described metab is provided with at least four parallel radiating grooves, have at least two fans to be set in parallel in the both sides of described metab respectively, the direction of the parallel radiating groove on the direction of air-supply and the metab is parallel, and the air supply direction of described two fans is identical, be coated with one deck gold in the bottom of described metab, the thickness of coating is between the 1-10 micron.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 01113105 CN1393929A (en) | 2001-06-25 | 2001-06-25 | Thermal radiator for IC |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 01113105 CN1393929A (en) | 2001-06-25 | 2001-06-25 | Thermal radiator for IC |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1393929A true CN1393929A (en) | 2003-01-29 |
Family
ID=4659847
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 01113105 Pending CN1393929A (en) | 2001-06-25 | 2001-06-25 | Thermal radiator for IC |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1393929A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007112662A1 (en) * | 2006-03-31 | 2007-10-11 | Hongkong Applied Science And Technology Research Institute Co., Ltd. | Heat exchange enhancement |
| WO2007112664A1 (en) * | 2006-03-31 | 2007-10-11 | Hong Kong Applied Science and Technology Research Institute Co. Ltd | Heat exchange enhancement |
| WO2007112661A1 (en) * | 2006-03-31 | 2007-10-11 | Hong Kong Applied Science And Technology Research Institute Co. Ltd. | Heat exchange enhancement |
| CN104717877A (en) * | 2015-04-13 | 2015-06-17 | 蓝思科技（长沙）有限公司 | Cooling device used in servo controller or frequency converter |
-
2001
- 2001-06-25 CN CN 01113105 patent/CN1393929A/en active Pending
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007112662A1 (en) * | 2006-03-31 | 2007-10-11 | Hongkong Applied Science And Technology Research Institute Co., Ltd. | Heat exchange enhancement |
| WO2007112664A1 (en) * | 2006-03-31 | 2007-10-11 | Hong Kong Applied Science and Technology Research Institute Co. Ltd | Heat exchange enhancement |
| WO2007112661A1 (en) * | 2006-03-31 | 2007-10-11 | Hong Kong Applied Science And Technology Research Institute Co. Ltd. | Heat exchange enhancement |
| US7440280B2 (en) | 2006-03-31 | 2008-10-21 | Hong Kong Applied Science & Technology Research Institute Co., Ltd | Heat exchange enhancement |
| US7593229B2 (en) | 2006-03-31 | 2009-09-22 | Hong Kong Applied Science & Technology Research Institute Co. Ltd | Heat exchange enhancement |
| US7651253B2 (en) | 2006-03-31 | 2010-01-26 | Hong Kong Applied Science & Technology Research Institute Co., Ltd | Heat exchange enhancement |
| CN101310382B (en) * | 2006-03-31 | 2010-06-09 | 香港应用科技研究院有限公司 | Heat exchange enhancement |
| CN101213660B (en) * | 2006-03-31 | 2010-08-25 | 香港应用科技研究院有限公司 | Heat exchange device and MR-16 lamp and wall-washing lamp, vehicle lamp and heat radiation method |
| US7800898B2 (en) | 2006-03-31 | 2010-09-21 | Hong Kong Applied Science And Technology Research Institute Co. Ltd. | Heat exchange enhancement |
| US7826214B2 (en) | 2006-03-31 | 2010-11-02 | Hong Kong Applied Science And Technology Research Institute Co., Ltd. | Heat exchange enhancement |
| CN104717877A (en) * | 2015-04-13 | 2015-06-17 | 蓝思科技（长沙）有限公司 | Cooling device used in servo controller or frequency converter |
| CN104717877B (en) * | 2015-04-13 | 2017-08-04 | 蓝思科技（长沙）有限公司 | A kind of cooling device in servo controller or frequency converter |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |