CN116794160A

CN116794160A - Ultrasonic nondestructive testing method and device for simultaneously carrying out flaw detection and thickness measurement

Info

Publication number: CN116794160A
Application number: CN202211340886.5A
Authority: CN
Inventors: 周冰
Original assignee: Suzhou Aiserti Technology Co ltd
Current assignee: Suzhou Aiserti Technology Co ltd
Priority date: 2022-10-30
Filing date: 2022-10-30
Publication date: 2023-09-22

Abstract

The invention provides an ultrasonic nondestructive testing method and device for simultaneously carrying out flaw detection and thickness measurement, comprising the following steps: fixing at least one pair (a form of transmitting and receiving, double transmitting and receiving) of ultrasonic transmitting probes and ultrasonic receiving probes and an encoder on a scanner; the scanner scans along the welding seam with an ultrasonic probe, the ultrasonic transmitting probe generates ultrasonic waves to obliquely enter the surface of the material, and the ultrasonic receiving probe receives ultrasonic signals; the ultrasonic flaw detection and the measurement of the thickness of the material are simultaneously carried out by the processing encoder and the ultrasonic signal under the condition of not changing the receiving and transmitting form of the ultrasonic probe. The invention solves the problems that TOFD flaw detection and ultrasonic thickness measurement in the prior art need to be operated by different ultrasonic probe forms respectively and cannot be carried out simultaneously.

Description

Ultrasonic nondestructive testing method and device for simultaneously carrying out flaw detection and thickness measurement

The invention belongs to the field of nondestructive ultrasonic technical detection, and particularly relates to an ultrasonic nondestructive detection method and device for simultaneously carrying out flaw detection and thickness measurement.

Background

The pressure vessel and the pipeline are widely applied to the modern industry, the welding quality affects the use safety, the weld joint of the pressure vessel and the pipeline is required to be detected, and simultaneously, along with the annual growth of the service life of the metal structural part, the crack or corrosion defect is increased, the oil gas pipeline, the pressure vessel and the vehicle body can enter an accident-prone stage, and the defects of the metal structural material are required to be measured and monitored, and the thickness reduction degree, namely thickness measurement, of the metal structural material in the use process is required to be detected, so that the effective and safe operation of the metal structural part is ensured. The material can be detected by an ultrasonic TOFD flaw detector, one or two pairs of ultrasonic transceiver probes are respectively arranged on a scanner, scanning is carried out along two sides of a welding line, and imaging research is carried out on the surface wave reflected by the straight-through wave and the bottom surface and the defect diffraction wave. The thickness measurement is that the thickness of the measured material is obtained by measuring the propagation time from the transmission to the reception of ultrasonic waves by using a thickness meter and reflecting the ultrasonic waves back to the original ultrasonic probe when the ultrasonic waves are transmitted by using a probe integrating the transmission and the reception and the transmission and the reception are perpendicular to the surface of the material. However, the ultrasonic TOFD flaw detector and the ultrasonic thickness gauge are adopted to measure flaw detection and thickness respectively, different equipment and probes are needed, the operation is troublesome, the process is complex, the efficiency is low, the simultaneous detection cannot be realized, and some special places in the field even need to climb up to be detected back and forth, so that the experience is influenced.

The flaw detection and thickness detection of materials are carried out separately and independently by adopting the current ultrasonic TOFD flaw detection and thickness measurement principle, TOFD flaw detection adopts a pair of ultrasonic transmitting probes and ultrasonic receiving probes for oblique incidence reception, and thickness measurement adopts a transceiver integrated probe for vertical incidence reception, and the two processes are required to be separately and independently operated by adopting different probes due to different principles, so that the TOFD flaw detection and thickness measurement are required to be replaced and connected with different ultrasonic probes, equipment parameters are reset, repeated operation detection is carried out, ultrasonic flaw detection and thickness measurement are still not convenient, and the solution of ultrasonic thickness measurement is not proposed by the published materials so far.

Based on this, the present invention has been proposed.

Disclosure of Invention

In order to achieve the above object, according to one aspect of the embodiments of the present invention, there is provided an ultrasonic non-destructive inspection method and apparatus for simultaneously performing flaw detection and thickness measurement, comprising: fixing at least one pair (a form of transmitting and receiving, double transmitting and receiving) of ultrasonic transmitting probes and ultrasonic receiving probes and an encoder on a scanner; the scanner scans along the welding seam with an ultrasonic probe, the ultrasonic transmitting probe generates ultrasonic waves to obliquely enter the surface of the material, and the ultrasonic receiving probe receives ultrasonic signals; the ultrasonic flaw detection and the measurement of the thickness of the material are simultaneously carried out by the processing encoder and the ultrasonic signal under the condition of not changing the receiving and transmitting form of the ultrasonic probe.

Further, the ultrasonic transmitting probe and the ultrasonic receiving probe are fixed on the scanner in a mode of transmitting and receiving or double transmitting and double receiving at a specific angle, so that the angle between the ultrasonic transmitting probe and the surface of the material is theta, the inclined incidence angle theta of ultrasonic waves is ensured to be larger than a first critical angle, the inclined incidence angle range is 30< theta <80 degrees, and a schematic diagram of fixing the ultrasonic transmitting probe and the ultrasonic receiving probe in the mode of transmitting and receiving is shown in fig. 1.

The scanner is characterized in that the scanner is further provided with an encoder which is in contact with the surface of the material, the encoder is used for outputting position information during scanning, the scanner is provided with an ultrasonic transmitting probe and an ultrasonic receiving probe through a wedge block with an inclined surface of an angle theta, the wedge block is provided with a threaded hole channel for installing the ultrasonic probe through a vertical inclined surface, the ultrasonic transmitting probe and the ultrasonic receiving probe are respectively fixed on the wedge block and the scanner through the threaded hole channel, the scanner is further provided with a magnet which is beneficial to being fixed or adsorbed on the surface of the workpiece material, and the scanner comprises a manual type, a chain type and a wall climbing type trolley.

Further, the ultrasonic wave transmitting circuit transmits pulse waveforms, and ultrasonic waves are generated by the ultrasonic wave transmitting probe after excitation; the generated ultrasonic waves are incident on the surface of a material from organic glass, the ultrasonic waves are incident on the surface of a workpiece with the thickness of H at an inclined incidence angle theta, the generated direct wave (ZTW) propagates to the bottom of a medium, multiple reflections occur between the bottom surface and the upper surface, surface wave signals (RSW 1, RSW2 and RSW 3) are generated when the generated ultrasonic waves are reflected to the upper surface each time, ultrasonic echo signals propagated along the surface of the material are received by an ultrasonic receiving probe with the same angle in sequence, the ultrasonic signals are collected by a connected ultrasonic collecting module, fig. 2 shows a schematic diagram of the propagation of the direct wave and the bottom surface reflection wave of the ultrasonic waves in a one-to-one mode, and fig. 3 shows a schematic diagram of the direct wave and the bottom surface emission wave of the ultrasonic waves received in a one-to-one mode.

Above mentioned superThe method for processing the encoder and the ultrasonic signal by the acoustic measurement thickness comprises the following steps: determining the temporary time T0 of the through wave in the ultrasonic signal of the scanning position and the temporary time Tn of the surface wave signal emitted by the nth bottom surface, and substituting T0 and Tn into an ultrasonic thickness measurement formula:and calculating and recording the thickness of the material, and forming an XY graph of the thickness and the scanning position of the encoder after the scanning is completed.

Further, the ultrasonic thickness measurement formula can be converted into according to trigonometric function rules: 。

the thickness measuring formula can change and measure the accurate propagation speed of ultrasonic waves in a medium under the condition that the accurate thickness H of a workpiece material is known:。

wherein H is the thickness of the workpiece material, and θ is the oblique incidence angle of the ultrasonic wave; v is the ultrasonic propagation velocity, n (n=1, 2,3, 4.) is the surface wave number generated by the n-th reflection of the selected ultrasonic incident material back to the upper surface after measurement.

Further, the method for processing the surface waves of the through wave and/or the bottom surface reflection in the ultrasonic signal comprises the following steps: determining waveform data segments where the through wave to be analyzed simultaneously and the surface waveform reflected by at least one bottom surface are selected by adopting a movable vertical free line, a square frame or numerical input or mouse frame selection; analyzing the waveform data segment by adopting a gate control method to determine waveform arrival time corresponding to the straight-through wave and the surface wave; the gate control method comprises the steps of adopting at least one movable horizontal cursor or peak value proportion gate as a threshold value, and considering the time corresponding to the time when the waveform comes when the peak intensity in the waveform data section is larger than the gate threshold value; fig. 4 is a schematic diagram showing the arrival time of the vertical cursor selection determination straight-through wave and bottom surface reflected wave, and fig. 5 is a schematic diagram showing the arrival time of the square frame selection determination straight-through wave and bottom surface reflected wave.

The ultrasonic flaw detection processing encoder and the ultrasonic signal method comprise the following steps: at each scanning position, the received echo signals form a corresponding A scanning image, the corresponding A scanning image is mapped to one row or one column of a B/D scanning image, and a complete B/D scanning echo image is formed after scanning is completed; further, the mode of mapping the A-scan image to one row or one column of the B/D-scan image comprises normalizing the amplitude of each point A-scan to be in the range of 0 to 255, and accumulating a plurality of rows/columns to obtain the B/D-scan image as one column of pixel values of the two-dimensional image.

The method can be used for measuring the thickness of the workpiece material independently, and ultrasonic flaw detection and thickness measurement of the material can be simultaneously carried out under the condition of not changing the receiving and transmitting form of the ultrasonic probe; the mode of receiving and transmitting the ultrasonic probe is the mode of receiving and transmitting the probe and maintaining the position of ultrasonic thickness measurement which is the same as ultrasonic flaw detection.

Further, ultrasonic flaw detection and material thickness measurement under the condition of not changing the receiving and transmitting form of the ultrasonic probe comprise ultrasonic flaw detection A scanning and material thickness measurement, and also comprise scanning and forming a B/D scanning echo image and forming an XY image of thickness and position.

In accordance with another aspect of an embodiment of the present invention, there is provided an ultrasonic nondestructive inspection apparatus for simultaneously performing ultrasonic flaw detection and thickness measurement. The ultrasonic nondestructive testing device for simultaneously carrying out flaw detection and thickness measurement according to the invention comprises: a screen; the ultrasonic probe module is used for fixing at least one pair of ultrasonic transmitting probes, ultrasonic receiving probes and an encoder on the scanner in a one-to-one mode; the ultrasonic transmitting module is used for connecting an ultrasonic transmitting probe to generate ultrasonic waves to obliquely enter the surface of the material; the ultrasonic receiving module is used for connecting an ultrasonic receiving probe to receive ultrasonic echo signals; the signal processing module comprises an ultrasonic flaw detection processing signal module and an ultrasonic thickness measurement signal processing module and is used for processing the ultrasonic flaw detection and measuring the thickness of a material by the encoder and the ultrasonic signal under the condition of not changing the receiving and transmitting form of the ultrasonic probe.

The ultrasonic transmitting probe and the ultrasonic receiving probe are fixed on the scanner in a mode of transmitting and receiving or double transmitting and double receiving at a specific angle, so that the angle between the ultrasonic transmitting probe and the surface of the material is theta, the inclined incidence angle of ultrasonic waves is ensured to be larger than a first critical angle, and the inclined incidence angle range of the ultrasonic waves is 30< theta <80 degrees.

The scanner is also provided with an encoder which is in contact with the surface of the material, and the position information of the encoder is output during scanning; further, the scanner is provided with an ultrasonic transmitting probe and an ultrasonic receiving probe through a wedge block with an inclined surface of an angle theta, the wedge block is provided with a threaded pore canal for installing the ultrasonic probe through a vertical inclined surface, the ultrasonic transmitting probe and the ultrasonic receiving probe are respectively fixed on the wedge block and the scanner through the threaded pore canal, and a magnet is further arranged on the ultrasonic transmitting probe and the ultrasonic receiving probe, so that the ultrasonic transmitting probe and the ultrasonic receiving probe are favorably fixed or adsorbed on the surface of a workpiece material; the scanner includes manual, chain-type, and wall-climbing cart forms.

Further, the ultrasonic wave transmitting module transmits pulse waveforms, and ultrasonic waves are generated by the ultrasonic wave transmitting probe after excitation; the generated ultrasonic waves are incident on the surface of a material from organic glass, the ultrasonic waves are incident on the surface of a workpiece with the thickness of H at an inclined incidence angle theta, direct wave (ZTW) is generated to propagate towards the bottom of a medium, multiple reflections occur between the bottom surface and the upper surface, surface wave signals (RSW 1, RSW2 and RSW 3) are generated when the ultrasonic waves are reflected to the upper surface each time, ultrasonic echo signals propagated along the surface of the material are received by an ultrasonic receiving probe with the same angle in sequence, and the ultrasonic signals are collected by a connected ultrasonic collecting module; fig. 2 is a schematic diagram showing propagation of a through wave and a bottom reflection wave of an ultrasonic wave in a transmitting-receiving mode, and fig. 3 is a schematic diagram showing propagation of a through wave and a bottom emission wave of an ultrasonic wave received in a transmitting-receiving mode.

The ultrasonic measurement thickness processing encoder and the ultrasonic signal module comprise: determining the temporary time T0 of the through wave in the ultrasonic signal of the scanning position and the temporary time Tn of the surface wave signal emitted by the nth bottom surface, and substituting T0 and Tn into an ultrasonic thickness measurement formula:and calculating and recording the thickness of the material, and forming an XY graph of the thickness and the scanning position of the encoder after the scanning is completed.

Further, the ultrasonic thickness measurement formula can be converted into according to trigonometric function rules:

/>。

wherein H is the thickness of the workpiece material, and θ is the oblique incidence angle of the ultrasonic wave; v is the ultrasonic propagation velocity and n (n=1, 2,3, 4.) is the surface wave number generated by the n-th reflection of the selected ultrasonic incident material back to the upper surface after measurement.

Further, the module for determining the through wave and/or the surface wave reflected by the bottom surface in the ultrasonic signal processing module comprises: determining waveform data segments where the through wave to be analyzed simultaneously and the surface waveform reflected by at least one bottom surface are selected by adopting a movable vertical free line, a square frame or numerical input or mouse frame selection; analyzing the waveform data segment by adopting a gate control module to determine waveform arrival time corresponding to the straight-through wave and the surface wave; the gate control module comprises a gate control module, a control module and a control module, wherein the gate control module adopts at least one movable horizontal cursor or peak value proportional gate as a threshold value, and when the peak intensity in the waveform data section is greater than the gate threshold value, the waveform is regarded as the time corresponding to the waveform arrival time; fig. 4 is a schematic diagram showing the arrival time of the vertical cursor selection determination straight-through wave and bottom surface reflected wave, and fig. 5 is a schematic diagram showing the arrival time of the square frame selection determination straight-through wave and bottom surface reflected wave.

The ultrasonic flaw detection processing encoder and the ultrasonic signal module comprise: at each scanning position, the received echo signals form a corresponding A scanning image, the corresponding A scanning image is mapped to one row or one column of a B/D scanning image, and a complete B/D scanning echo image is formed after scanning is completed; further, the mode of mapping the A-scan image to one row or one column of the B/D-scan image comprises normalizing the amplitude of each point A-scan to be in the range of 0 to 255, and accumulating a plurality of rows/columns to obtain the B/D-scan image as one column of pixel values of the two-dimensional image.

The thickness of the workpiece material can be measured independently through the module, and ultrasonic flaw detection and thickness measurement of the material can be simultaneously performed under the condition that the receiving and transmitting form of the ultrasonic probe is not changed. The mode of receiving and transmitting the ultrasonic probe is the mode of receiving and transmitting the probe and maintaining the position of ultrasonic thickness measurement which is the same as ultrasonic flaw detection.

Further, ultrasonic flaw detection and material thickness measurement are carried out under the condition that the receiving and transmitting form of an ultrasonic probe is not changed in the ultrasonic signal processing module, and the method comprises the steps of measuring the material thickness while ultrasonic flaw detection is conducted in an A-scanning mode, and forming an XY image of the thickness and the position while B/D scanning echo images are formed in a scanning mode.

Compared with the existing ultrasonic thickness measurement method of the surface of the vertical incidence material integrated with the transceiver, the invention also provides a brand new method for measuring the thickness of the material by oblique incidence, which comprises the following steps: an ultrasonic transmitting probe and an ultrasonic receiving probe are fixed on a connecting piece in a one-to-one mode at a specific angle; the ultrasonic transmitting probe generates ultrasonic waves to obliquely enter the surface of the material, and the ultrasonic receiving probe receives ultrasonic signals; the ultrasonic signal is processed to measure the thickness of the material.

The ultrasonic transmitting probe and the ultrasonic receiving probe are fixed on the scanner in a mode of transmitting and receiving or double transmitting and double receiving at a specific angle, so that the angle between the ultrasonic transmitting probe and the surface of the material is theta, the inclined incidence angle of ultrasonic waves is ensured to be larger than a first critical angle, and the inclined incidence angle of the ultrasonic waves is ensured to be 30< theta <80 degrees.

The ultrasonic transmitting probe and the ultrasonic receiving probe are arranged on the scanner through the wedge block with the theta-angle inclined plane, the wedge block is provided with a threaded pore canal for installing the ultrasonic probe through the vertical inclined plane, the ultrasonic transmitting probe and the ultrasonic receiving probe are respectively fixed on the wedge block and the scanner through the threaded pore canal, and the scanner is also provided with a magnet which is beneficial to being fixed or adsorbed on the surface of a workpiece material; the scanner includes manual, chained, and wall-climbing trolleys; and the scanner is also provided with an encoder which is in contact with the surface of the material, and the position information of the encoder is output during scanning.

Further, the ultrasonic wave transmitting circuit transmits pulse waveforms, and ultrasonic waves are generated by the ultrasonic wave transmitting probe after excitation; the generated ultrasonic waves are incident on the surface of a material from organic glass, the ultrasonic waves are incident on the surface of a workpiece with the thickness of H at an inclined incidence angle theta, direct wave (ZTW) is generated to propagate towards the bottom of a medium, multiple reflections occur between the bottom surface and the upper surface, surface wave signals (RSW 1, RSW2 and RSW 3) are generated when the ultrasonic waves are reflected to the upper surface each time, ultrasonic echo signals propagated along the surface of the material are received by an ultrasonic receiving probe with the same angle in sequence, and the ultrasonic signals are collected by a connected ultrasonic collecting module; fig. 2 is a schematic diagram showing propagation of a through wave and a bottom reflection wave of an ultrasonic wave in a transmitting-receiving mode, and fig. 3 is a schematic diagram showing propagation of a through wave and a bottom emission wave of an ultrasonic wave received in a transmitting-receiving mode.

The ultrasonic measurement thickness processing encoder and the ultrasonic signal method comprise the following steps: determining the temporary time T0 of the through wave in the ultrasonic signal of the scanning position and the temporary time Tn of the surface wave signal emitted by the nth bottom surface, and substituting T0 and Tn into an ultrasonic thickness measurement formula:and calculating and recording the thickness of the material, and forming an XY graph of the thickness and the scanning position of the encoder after the scanning is completed.

wherein H is the thickness of the workpiece material, and θ is the oblique incidence angle of the ultrasonic wave; v is the propagation speed of the ultrasonic wave, and n (n=1, 2,3, 4.) is the number of the surface wave generated by the surface of the ultrasonic wave incident material after the critical refraction longitudinal wave is generated and the bottom surface is reflected back to the upper surface for a plurality of times.

Further, the method for processing the surface waves of the through wave and/or the bottom surface reflection in the ultrasonic signal comprises the following steps: determining waveform data segments where the through wave to be analyzed simultaneously and the surface waveform reflected by at least one bottom surface are selected by adopting a movable vertical free line, a square frame or numerical input or mouse frame selection; analyzing the waveform data segment by adopting a gate control method to determine waveform arrival time corresponding to the straight-through wave and the surface wave; the gate control method comprises the step of adopting at least one movable horizontal cursor or peak value proportion gate as a threshold value, and considering the time corresponding to the time when the waveform comes when the peak intensity in the waveform data segment is larger than the gate threshold value.

Further, the method for ultrasonically measuring the thickness of the material comprises ultrasonic A scanning and measuring the thickness of the material, and B/D scanning and forming an XY graph of the thickness and the position.

In order to achieve the above purpose, the invention also discloses an ultrasonic thickness measuring device which is completely different from an ultrasonic thickness measuring device which vertically irradiates the surface of a material relative to a single ultrasonic probe which is integrated with the transceiver.

The invention provides a brand new device for measuring the thickness of a material by oblique incidence, which comprises the following components: a screen; the ultrasonic probe module is used for fixing the ultrasonic transmitting probe and the ultrasonic receiving probe on the scanner at a specific angle in a one-to-one mode; the ultrasonic transmitting module is used for connecting an ultrasonic transmitting probe to generate ultrasonic waves to obliquely enter the surface of the material; the ultrasonic receiving module is used for connecting an ultrasonic receiving probe to receive ultrasonic signals; and the ultrasonic thickness measurement signal processing module is used for processing ultrasonic signals to measure the thickness of the material.

The scanner includes manual, chained, and wall-climbing trolleys; the scanner is also provided with an encoder which is in contact with the surface of the material, and the position information of the encoder is output during scanning; further, the scanner is provided with an ultrasonic transmitting probe and an ultrasonic receiving probe through a wedge block with an inclined surface of an angle theta, the wedge block is provided with a threaded pore canal for installing the ultrasonic probe through a vertical inclined surface, the ultrasonic transmitting probe and the ultrasonic receiving probe are respectively fixed on the wedge block and the scanner through the threaded pore canal, and a magnet is further arranged on the ultrasonic transmitting probe and the ultrasonic receiving probe, so that the ultrasonic transmitting probe and the ultrasonic receiving probe are favorably fixed or adsorbed on the surface of a workpiece material.

The module for processing ultrasonic signals by ultrasonic measurement thickness comprises: determining the temporary time T0 of the through wave in the ultrasonic signal of the scanning position and the temporary time Tn of the surface wave signal emitted by the nth bottom surface, and substituting T0 and Tn into an ultrasonic thickness measurement formula:and calculating and recording the thickness of the material, and forming an XY graph of the thickness and the scanning position of the encoder after the scanning is completed.

/>。

wherein H is the thickness of the workpiece material, and θ is the oblique incidence angle of the ultrasonic wave; v is the propagation speed of the ultrasonic wave, n (n=1, 2,3, 4.) is the number of the surface wave generated by the repeated reflection of the through wave and the bottom surface back to the upper surface generated by the surface of the ultrasonic wave incident material; in the formula, tn-T0 can be accurate to nanosecond level, so H thickness measurement can be accurate to nanometer level.

Further, the module for determining the through wave and/or the surface wave reflected by the bottom surface in the ultrasonic thickness measuring processing ultrasonic signal module comprises: determining waveform data segments where the through wave to be analyzed simultaneously and the surface waveform reflected by at least one bottom surface are selected by adopting a movable vertical free line, a square frame or numerical input or mouse frame selection; analyzing the waveform data segment by adopting a gate control module to determine waveform arrival time corresponding to the straight-through wave and the surface wave; the gate control module comprises a gate control module, a control module and a control module, wherein the gate control module adopts at least one movable horizontal cursor or peak value proportional gate as a threshold value, and when the peak intensity in the waveform data section is greater than the gate threshold value, the waveform is regarded as the time corresponding to the waveform arrival time; fig. 4 is a schematic diagram showing the arrival time of the vertical cursor selection determination straight-through wave and bottom surface reflected wave, and fig. 5 is a schematic diagram showing the arrival time of the square frame selection determination straight-through wave and bottom surface reflected wave.

Further, the ultrasonic measuring and processing ultrasonic signal module not only comprises ultrasonic A scanning and measuring the thickness of the material, but also comprises B/D scanning and forming an XY graph of the thickness and the position.

The application also provides a formula for measuring the thickness of the material by ultrasonic oblique incidence, which is characterized in that:the method comprises the steps of carrying out a first treatment on the surface of the Wherein θ is the oblique incidence angle of the ultrasonic probe in a transmit-receive situation; v is the propagation speed of the ultrasonic wave, n (n=1, 2,3, 4.) is the serial number of the surface wave generated by the direct-pass wave generated on the surface of the ultrasonic wave incident material and the multiple reflection of the direct-pass wave and the bottom surface back to the upper surface; the equation can be transformed into: /> 。

Drawings

The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this specification, illustrate embodiments of the application and together with the description serve to explain the application. In the drawings: fig. 1 is a schematic diagram showing the fixing of an ultrasonic transmitting probe and an ultrasonic receiving probe in a one-to-one manner.

Fig. 2 is a schematic diagram showing the propagation of the through wave and the bottom reflection wave of the ultrasonic wave in a transmitting-receiving mode.

Fig. 3 is a schematic diagram of a through wave and a bottom emission wave of an ultrasonic wave received in a transmitting-receiving mode.

FIG. 4 is a schematic view showing the arrival time of the vertical cursor selection determination straight-through wave and bottom reflection wave.

FIG. 5 is a schematic diagram showing the time for the selection of the block to determine the arrival time of the through wave and the bottom reflected wave.

Detailed Description

It should be noted that, without conflict, the embodiments of the present application and features of the embodiments may be combined with each other. The application will be described in detail below with reference to the drawings in connection with embodiments.

It is noted that the terms "first", "second" in the description and claims of the present application and the above-mentioned drawings

Two, etc. are used to distinguish similar objects and are not necessarily used to describe a particular order or precedence. It should be understood that such use

May be interchanged where appropriate in order to describe embodiments of the application herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.

The embodiment of the invention provides an ultrasonic nondestructive testing method for simultaneously carrying out flaw detection and thickness measurement, which comprises the following steps: the ultrasonic transmitting probe and the ultrasonic receiving probe are fixed on the scanner in a one-to-one or two-to-one manner; the scanner scans along the welding seam with an ultrasonic probe, the ultrasonic transmitting probe generates ultrasonic waves to obliquely enter the surface of the material, and the ultrasonic receiving probe receives ultrasonic signals; the ultrasonic flaw detection and the material thickness measurement are carried out by the processing encoder and the ultrasonic signal under the condition of not changing the receiving and transmitting form of the ultrasonic probe.

The ultrasonic transmitting probe and the ultrasonic receiving probe are fixed on the scanner in a mode of transmitting and receiving or double transmitting and double receiving at a specific angle, so that the angle between the ultrasonic transmitting probe and the surface of the material is theta, the inclined incidence angle theta of ultrasonic waves is ensured to be larger than a first critical angle, the incidence angle range is 30< theta <80 degrees, and a schematic diagram of fixing the ultrasonic transmitting probe and the ultrasonic receiving probe in the mode of transmitting and receiving is shown in fig. 1.

The scanner is also provided with an encoder which is in contact with the surface of the material, and the position information of the encoder is output during scanning; the scanner is provided with an ultrasonic transmitting probe and an ultrasonic receiving probe through a wedge block with an inclined surface at an angle theta, the wedge block is provided with a threaded pore canal for installing the ultrasonic probe through a vertical inclined surface, the ultrasonic transmitting probe and the receiving probe are respectively fixed on the wedge block and the scanner through the threaded pore canal, and the scanner is also provided with a magnet which is beneficial to being fixed or adsorbed on the surface of a workpiece material; the scanner includes manual, chain-type, and wall-climbing cart forms.

The ultrasonic wave transmitting circuit transmits pulse waveforms, and ultrasonic waves are generated by the ultrasonic transmitting probe after excitation; generating a direct wave (ZTW) to propagate towards the bottom of a medium, generating multiple reflections between the bottom surface and the upper surface, generating surface wave signals (RSW 1, RSW2 and RSW 3) when each reflection is carried out on the upper surface, receiving ultrasonic echo signals propagated along the surface of the material by an ultrasonic receiving probe with the same angle in sequence, and collecting the ultrasonic signals through a connected ultrasonic collecting module; fig. 2 is a schematic diagram showing propagation of a through wave and a bottom reflection wave of an ultrasonic wave in a transmitting-receiving mode, and fig. 3 is a schematic diagram showing propagation of a through wave and a bottom emission wave of an ultrasonic wave received in a transmitting-receiving mode.

The existing ultrasonic thickness measuring method and equipment adopt a single ultrasonic probe which is integrated with the transceiver to vertically enter the surface of the material, and half of the product of the bottom echo signal and the ultrasonic sound velocity is calculated by timing the time of the bottom echo signal, namely the thickness of the workpiece material. The present disclosure does not address the related methods and apparatus for ultrasonic thickness measurement in a one-shot oblique incidence configuration.

The invention provides a novel ultrasonic measurement thickness processing encoder and an ultrasonic signal method under a one-to-one oblique incidence mode, which comprises the following steps: determining the temporary time T0 of the direct wave in the ultrasonic signal of the scanning position and the temporary time Tn of the surface wave signal reflected by the nth bottom surface, and substituting T0 and Tn into an ultrasonic thickness measuring formula: Calculating and recording the thickness of the material, and forming the thickness and the thickness after scanningThe encoder scans the XY map of the location.

The ultrasonic thickness measurement formula can be converted into according to trigonometric function rules: />。

wherein H is the thickness of the workpiece material, and θ is the oblique incidence angle of the ultrasonic wave in a one-transmission-one-reception mode; v is the ultrasonic propagation velocity, n (n=1, 2,3, 4.) is the surface wave number generated by the n-th reflection of the selected ultrasonic incident material back to the upper surface after measurement.

The method for determining the through wave and/or the surface wave reflected by the bottom surface in the ultrasonic signal comprises the following steps: determining waveform data segments where the through wave to be analyzed simultaneously and the surface waveform reflected by at least one bottom surface are selected by adopting a movable vertical free line, a square frame or numerical input or mouse frame selection; analyzing the waveform data segment by adopting a gate control method to determine waveform arrival time corresponding to the straight-through wave and the surface wave; the gate control method comprises the steps of adopting at least one movable horizontal cursor or peak value proportion gate as a threshold value, and considering the time corresponding to the time when the waveform comes when the peak intensity in the waveform data section is larger than the gate threshold value; fig. 4 is a schematic diagram showing the arrival time of the vertical cursor selection determination straight-through wave and bottom surface reflected wave, and fig. 5 is a schematic diagram showing the arrival time of the square frame selection determination straight-through wave and bottom surface reflected wave.

For example, during testing, two pairs of movable vertical vernier lines are adopted, the first vernier line is selected from waveform data segments where straight-through waves are located, the second vernier line is selected from surface wave data segments reflected by the 1 st bottom surface, and ultrasonic waves pass through the workpiece materialA V-shaped process is traversed, at this time, n=1, a peak value proportional gate is adopted to respectively determine the time T0, T1 corresponding to the arrival of the wave form of the surface wave RSW1 emitted from the bottom surface selected by the first group of cursor lines and the second group of cursor lines, and the wave form is substituted into an ultrasonic thickness measuring formulaObtaining H; if the second group of cursors selects the surface wave data segment reflected by the second bottom surface, the ultrasonic wave undergoes two V-shaped histories in the workpiece material, and n=2 is substituted into the ultrasonic thickness measurement formulaObtaining H; the ultrasonic flaw detection processing encoder and the ultrasonic signal method comprise the following steps: at each scanning position, the received echo signals form a corresponding A scanning image, the corresponding A scanning image is mapped to one row or one column of a B/D scanning image, and a complete B/D scanning echo image is formed after scanning is completed; further, the mode of mapping the A-scan image to one row or one column of the B/D-scan image comprises normalizing the amplitude of each point A-scan to be in the range of 0 to 255, and accumulating a plurality of rows/columns to obtain the B/D-scan image as one column of pixel values of the two-dimensional image.

The ultrasonic flaw detection and the measurement of the thickness of the material under the condition of not changing the receiving and transmitting form of the ultrasonic probe comprise the measurement of the thickness of the material while the ultrasonic flaw detection is conducted by A scanning and the formation of an XY image of the thickness and the position while the B/D scanning echo image is formed by scanning.

Further implementing ultrasonic flaw detection and thickness measurement, wherein an ultrasonic transceiving probe adopts 5MHz, the angle of a wedge inclined plane of a scanner is kept at 60 DEG with the bottom surface, an ultrasonic signal is acquired by adopting a 1GHz acquisition board card, the time T0 and T1 when the straight-through wave and the RSW1 wave of the acquired ultrasonic signal come are respectively determined, and the V is used for taking the transverse wave propagation speed of the ultrasonic wave in the steel and substituting the transverse wave propagation speed into the thickness measurement formula to calculate the thickness of the material; simultaneously normalizing the amplitude of the received ultrasonic signal to be in the range of 0 to 255, and mapping the amplitude to a column of a two-dimensional B/D scanning image; along with the scanning of the scanner, B/D scanned images are obtained through multi-column accumulation, and an XY image of the thickness and the scanning position is obtained.

Before further implementing thickness measurement, the ultrasonic propagation speed can be calibrated by adopting a standard thickness workpiece, an ultrasonic receiving and transmitting probe adopts 5MHz under a first-transmitting and first-receiving mode, the angle of the inclined plane of a connecting piece is kept at 60 DEG with the bottom surface, an ultrasonic signal is acquired by adopting a 1GHz acquisition board card, the time T1-T0 of the straight-through wave and the RSW1 wave of the acquired ultrasonic signal is determined, and the ultrasonic propagation speed of ultrasonic waves in the workpiece material is calculated by substituting the ultrasonic propagation speed into the sound measurement speed formula converted by the thickness measurement formula.

When the invention implements the form of double-emission double-receiving, the scanner uses two pairs of ultrasonic probes with different distances, which are emitted and received, to connect through the wedge block with an angle theta slope formed by the wedge block, the vertical slope of the wedge block is provided with a threaded duct for installing the ultrasonic emission probe and the ultrasonic receiving probe, the connecting piece is also provided with a magnet, and after the coupling agent is coated, the magnet is fixed or adsorbed on the surface of the workpiece material; the ultrasonic wave transmitting circuit transmits pulse waveforms, and is connected with two ultrasonic transmitting probes to generate ultrasonic waves after excitation; ultrasonic waves are incident on the surface of a material to generate a direct wave (ZTW) to propagate to the bottom of a medium, multiple reflections occur between the bottom surface and the upper surface, and surface wave signals (RSW 1, RSW2 and RSW 3) are generated when the ultrasonic waves are reflected to the upper surface each time, and the ultrasonic echo signals propagated along the surface of the material are received by two ultrasonic receiving probes with the same angle in sequence, and the ultrasonic signals are collected through a connected ultrasonic collecting module.

Determining corresponding arrival time of a straight-through wave in ultrasonic signals received by any one of the two channels and surface wave signals reflected by the bottom surface, and determining a waveform data section where the straight-through wave to be analyzed simultaneously and at least one surface waveform reflected by the bottom surface are selected by adopting a movable vertical free line, a square frame or numerical input or mouse frame selection; analyzing the waveform data segment by adopting a gate control method to determine waveform arrival time corresponding to the straight-through wave and the surface wave; the gate control method comprises the steps of adopting at least one movable horizontal cursor or peak value proportion gate as a threshold value, and considering time corresponding to time when a waveform comes when the peak intensity in a waveform data section is larger than the gate threshold value; fig. 4 is a schematic diagram showing the arrival time of the vertical cursor selection determination straight-through wave and bottom surface reflected wave, and fig. 5 is a schematic diagram showing the arrival time of the square frame selection determination straight-through wave and bottom surface reflected wave.

The time T0 for the temporary through wave signal determined by any channel and the time Tn for the temporary surface wave signal emitted by the nth bottom surface are substituted into an ultrasonic thickness measuring formula:according to trigonometric function law, the method can be converted into: / > />。

wherein H is the thickness of the workpiece material, and θ is the oblique incidence angle of the ultrasonic wave; v is the propagation speed of the ultrasonic wave, n (n=1, 2,3, 4.) is the serial number of the surface wave generated by the surface of the ultrasonic wave incident material after generating critical refraction longitudinal wave and repeatedly reflecting the critical refraction longitudinal wave and the bottom surface back to the upper surface; in the formula, tn-T0 can be accurate to nanosecond level, so H thickness measurement can be accurate to nanometer level.

For example, during testing, two pairs of movable boxes are adopted, the first set of boxes select waveform data segments where through waves are located, the second set of boxes select surface wave data segments reflected by the 1 st bottom surface, and ultrasonic waves undergo a V in the workpiece material "At this time, n=1, the peak ratio gate is adopted to respectively determine the time T0, T1 corresponding to the arrival of the wave form of the surface wave RSW1 emitted from the bottom surface selected by the first group of boxes and the second group of boxes, and the wave form is substituted into the ultrasonic thickness measurement formulaObtaining H; if the second set of square boxes selects the surface wave data segment reflected by the second bottom surface, the ultrasonic wave undergoes two V-shaped histories in the workpiece material, and n=2 is substituted into the ultrasonic thickness measurement formula Obtaining H; for the ultrasonic signal detected by any channel, an ultrasonic flaw detection encoder and an ultrasonic signal are adopted, and the method comprises the following steps: at each scanning position, the received echo signals form a corresponding A scanning image, the corresponding A scanning image is mapped to one row or one column of a B/D scanning image, and a complete B/D scanning echo image is formed after scanning is completed; further, the mode of mapping the A-scan image to one row or one column of the B/D-scan image comprises normalizing the amplitude of each point A-scan to be in the range of 0 to 255, and accumulating a plurality of rows/columns to obtain the B/D-scan image as one column of pixel values of the two-dimensional image.

The thickness of the workpiece material under the two-channel condition can be measured respectively through the two pairs of ultrasonic receiving and transmitting probes, and the ultrasonic flaw detection and the thickness measurement of the material can be simultaneously performed under the condition that the receiving and transmitting form of the ultrasonic probes is not changed. The mode of receiving and transmitting the ultrasonic probe is the mode of receiving and transmitting the probe and maintaining the position of ultrasonic thickness measurement which is the same as ultrasonic flaw detection.

The ultrasonic flaw detection and the measurement of the thickness of the material under the condition of not changing the receiving and transmitting forms of the two pairs of ultrasonic probes comprise the step of measuring the thickness of the material while scanning the ultrasonic flaw detection A at the position where the two pairs of ultrasonic probes are positioned, and the step of scanning the B/D scanning echo images corresponding to the two pairs of ultrasonic probes while forming XY images of the corresponding thickness and the position respectively.

Further implementing ultrasonic flaw detection and thickness measurement, adopting two pairs of ultrasonic receiving and transmitting probes of 5MHz to be connected to a scanner wedge according to different distances, wherein the angles of wedge inclined planes are all kept at 60 degrees with the bottom surface, the scanner is a chain scanner, a circular steel pipe is scanned, ultrasonic signals are acquired by adopting a 1GHz double-channel acquisition board card, the time T0, T1 and V when the straight-through waves and RSW1 waves of the acquired ultrasonic signals corresponding to the two channels come are respectively determined, the transverse wave propagation speeds of the ultrasonic waves in the steel are taken, the transverse wave propagation speeds are substituted into the thickness measurement formula to calculate the thickness of the material, and meanwhile, the amplitude of the received ultrasonic signals is normalized to be within a range of 0 to 255 and mapped to a row of two-dimensional B/D scanning images; along with the scanning of the scanner, B/D scanning images under different channels are obtained through multi-column accumulation, and XY images of the thickness and the scanning position corresponding to the different channels are obtained.

Two pairs of ultrasonic receiving and transmitting probes of 5MHz are connected to a scanner wedge according to different distances, the angle of the wedge inclined plane is kept at an included angle of 60 DEG with the bottom surface, ultrasonic signals are acquired by adopting a 1GHz double-channel acquisition board card, the time T0 and T2 when the straight-through wave and the RSW2 wave of the acquired ultrasonic signals corresponding to the two channels come are respectively determined, the transverse wave propagation speed of the ultrasonic waves in steel is taken, n=2 is taken, the n=2 is substituted into the thickness measuring formula to calculate the thickness of the material, the amplitude of the received ultrasonic signals is normalized to be within a range of 0 to 255, and the ultrasonic signals are mapped to a row of two-dimensional B/D scanning images; along with the scanning of the scanner, B/D scanning images under different channels are obtained through multi-column accumulation, and XY images of the thickness and the scanning position corresponding to the different channels are obtained.

Before further implementing thickness measurement, the ultrasonic propagation speed can be calibrated by adopting a standard thickness workpiece, two pairs of ultrasonic receiving and transmitting probes of 5MHz are connected to a scanner wedge according to different distances, the angle of the wedge inclined plane is kept at an included angle of 60 degrees with the bottom surface, ultrasonic signals are acquired by adopting a 1GHz double-channel acquisition board card, the time T0 and T2 when the direct wave and the RSW2 wave of the acquired ultrasonic signals corresponding to the two channels come are respectively determined, n=2 is taken, and the ultrasonic propagation speed is calculated by substituting the ultrasonic propagation speed into the sound measurement speed formula converted by the thickness measurement formula.

In order to achieve the above object, according to another aspect of the embodiments of the present invention, there is provided an ultrasonic nondestructive inspection apparatus that performs ultrasonic flaw detection and thickness measurement simultaneously. The ultrasonic nondestructive testing device for simultaneously carrying out flaw detection and thickness measurement according to the invention comprises: a screen; an ultrasonic probe module fixing at least one pair of ultrasonic transmitting probe and ultrasonic receiving probe and an encoder on the scanner; the ultrasonic transmitting module is used for connecting an ultrasonic transmitting probe to generate ultrasonic waves to obliquely enter the surface of the material; the ultrasonic receiving module is used for connecting an ultrasonic receiving probe to receive ultrasonic echo signals; the signal processing module comprises an ultrasonic flaw detection processing signal module and an ultrasonic thickness measurement signal processing module and is used for processing the ultrasonic flaw detection and measuring the thickness of the material simultaneously by the encoder and the ultrasonic signal under the condition of not changing the receiving and transmitting form of the ultrasonic probe.

The ultrasonic transmitting probe and the ultrasonic receiving probe are fixed on the scanner in a mode of one sending and one receiving or two sending and two receiving at a specific angle, so that the angle between the ultrasonic transmitting probe and the surface of the material is theta, the inclined incidence angle of ultrasonic waves is ensured to be larger than a first critical angle, the inclined incidence angle range is 30< theta <80 degrees, the scanner comprises a manual mode, a chained mode and a wall climbing type trolley mode, an encoder is further arranged on the scanner and is in contact with the surface of the material, and encoder position information is output during scanning; the scanner is provided with an ultrasonic transmitting probe and an ultrasonic receiving probe through a wedge block with an inclined surface at an angle theta, the wedge block is provided with a threaded pore canal for installing the ultrasonic probe through a vertical inclined surface, the ultrasonic transmitting probe and the ultrasonic receiving probe are respectively fixed on the wedge block and the scanner through the threaded pore canal, and a magnet is further arranged on the ultrasonic transmitting probe and the ultrasonic receiving probe, so that the ultrasonic transmitting probe and the ultrasonic receiving probe are favorably fixed or adsorbed on the surface of a workpiece material.

The ultrasonic wave transmitting module transmits pulse waveforms, and ultrasonic waves are generated by the ultrasonic transmitting probe after excitation; the generated ultrasonic waves are incident on the surface of a material from organic glass, the ultrasonic waves are incident on the surface of a workpiece with the thickness of H at an inclined incidence angle theta, direct wave (ZTW) is generated to propagate towards the bottom of a medium, multiple reflections occur between the bottom surface and the upper surface, surface wave signals (RSW 1, RSW2 and RSW 3) are generated when the ultrasonic waves are reflected to the upper surface each time, ultrasonic echo signals propagated along the surface of the material are received by an ultrasonic receiving probe with the same angle in sequence, and the ultrasonic signals are collected by a connected ultrasonic collecting module; fig. 2 is a schematic diagram showing propagation of a through wave and a bottom reflection wave of an ultrasonic wave in a transmitting-receiving mode, and fig. 3 is a schematic diagram showing propagation of a through wave and a bottom emission wave of an ultrasonic wave received in a transmitting-receiving mode.

The existing ultrasonic thickness measuring method and equipment adopt a single ultrasonic probe which is integrated with the transceiver to vertically enter the surface of the material, and half of the product of the bottom echo signal and the ultrasonic sound velocity is calculated by timing the time of the bottom echo signal, namely the thickness of the workpiece material. The present disclosure does not address the related methods and apparatus for ultrasonic thickness measurement in a one-shot oblique incidence configuration. The invention provides a novel ultrasonic measurement thickness processing encoder and an ultrasonic signal module in a one-to-one oblique incidence mode, which comprises the following components: determining the temporary time T0 of the direct wave in the ultrasonic signal of the scanning position and the temporary time Tn of the surface wave signal reflected by the nth bottom surface, and substituting T0 and Tn into an ultrasonic thickness measuring formula:and calculating and recording the thickness of the material, and forming an XY graph of the thickness and the scanning position of the encoder after the scanning is completed.

The method can be converted into the following steps according to trigonometric function rules: />。

the thickness measuring formula can change and measure the accurate propagation speed of ultrasonic waves in a medium under the condition that the accurate thickness H of a workpiece material is known:。/>

wherein H is the thickness of the workpiece material, and θ is the oblique incidence angle of the ultrasonic wave in a one-transmission-one-reception mode; v is the ultrasonic propagation speed, n (n=1, 2,3, 4.) is the surface wave number generated by measuring the n-th reflection of the selected ultrasonic incident material back to the upper surface with the bottom surface; in the formula, tn-T0 can be accurate to nanosecond level, so H thickness measurement can be accurate to nanometer level.

For example, during testing, two pairs of movable vertical vernier lines are adopted, the first vernier line is selected to select a waveform data segment where the straight-through wave is located, the second vernier line is selected to select a surface wave data segment reflected by the 1 st bottom surface, ultrasonic waves undergo a V-shaped process in a workpiece material, n=1 at the moment, peak value proportion gates are adopted to respectively determine the time T0 and T1 corresponding to the straight-through wave selected by the first vernier line and the waveform of the surface wave RSW1 emitted by the bottom surface selected by the second vernier line, and the time T0 and T1 are substituted into an ultrasonic thickness measuring formula Obtaining H; if the second group of cursors selects the surface wave data segment reflected by the second bottom surface, the ultrasonic wave undergoes two V-shaped histories in the workpiece material, and n=2 is substituted into the ultrasonic thickness measurement formulaH was obtained.

Further implementing ultrasonic flaw detection and thickness measurement, wherein an ultrasonic transceiving probe adopts 5MHz, a manual scanner comprises wedge blocks with inclined planes, the angles of the wedge blocks are kept 45 degrees with the bottom surface, a 1GHz acquisition board is used for acquiring ultrasonic signals, the time T0 and T1 when the direct wave and the RSW1 wave of the acquired ultrasonic signals come are respectively determined, the transverse wave propagation speed of ultrasonic waves in steel is taken by V, the transverse wave propagation speed of ultrasonic waves in the steel is substituted into the thickness measurement formula to calculate the thickness of a material, and meanwhile, the amplitude of the received ultrasonic signals is normalized to be within the range of 0 to 255 and is mapped to a row of two-dimensional B/D scanning images; along with the scanning of the scanner, B/D scanned images are obtained through multi-column accumulation, and an XY image of the thickness and the scanning position is obtained.

Before further implementing thickness measurement, the ultrasonic propagation speed can be calibrated by adopting a standard thickness workpiece, an ultrasonic receiving and transmitting probe adopts 5MHz under a first-transmitting and first-receiving mode, the angle of the inclined plane of a connecting piece is kept 45 degrees with the bottom surface, an ultrasonic signal is acquired by adopting a 1GHz acquisition board card, the time T1-T0 of the straight-through wave and the RSW1 wave of the acquired ultrasonic signal is determined, and the ultrasonic propagation speed of ultrasonic waves in the workpiece material is calculated by substituting the ultrasonic propagation speed into the sound measurement speed formula converted by the thickness measurement formula.

Determining corresponding arrival time of a straight-through wave in ultrasonic signals received by any one of the two channels and surface wave signals reflected by the bottom surface, and determining a waveform data section where the straight-through wave to be analyzed simultaneously and at least one surface waveform reflected by the bottom surface are selected by adopting a movable vertical free line, a square frame or numerical input or mouse frame selection; analyzing the waveform data segment by adopting a gate control method to determine waveform arrival time corresponding to the straight-through wave and the surface wave; the gate control method comprises the step of adopting at least one movable horizontal cursor or peak value proportion gate as a threshold value, and considering the time corresponding to the time when the waveform comes when the peak intensity in the waveform data segment is larger than the gate threshold value.

The time T0 for the temporary through wave signal determined by any channel and the time Tn for the temporary surface wave signal emitted by the nth bottom surface are substituted into an ultrasonic thickness measuring formula:according to trigonometric function law, the method can be converted into: /> />。

For example, during testing, two pairs of movable boxes are adopted, the first set of boxes select the waveform data segment where the through wave is located, the second set of boxes select the 1 st surface reflected surface wave data segment, the ultrasonic wave undergoes a V-shaped process in the workpiece material, n=1 at the moment, the peak ratio gate is adopted to respectively determine the corresponding time T0 and T1 when the through wave selected by the first set of boxes and the surface wave RSW1 waveform emitted by the bottom surface selected by the second set of boxes come, and the corresponding time T0 and T1 are substituted into the ultrasonic thickness measuring formulaObtaining H; if the second set of square boxes selects the surface wave data segment reflected by the second bottom surface, the ultrasonic wave undergoes two V-shaped histories in the workpiece material, and n=2 is substituted into the ultrasonic thickness measurement formulaH was obtained.

For the ultrasonic signal that any passageway detected is received to above-mentioned two sending and two, adopt ultrasonic flaw detection to handle encoder and ultrasonic signal's module includes: at each scanning position, the received echo signals form a corresponding A scanning image, the corresponding A scanning image is mapped to one row or one column of a B/D scanning image, and a complete B/D scanning echo image is formed after scanning is completed; further, the mode of mapping the A-scan image to one row or one column of the B/D-scan image comprises normalizing the amplitude of each point A-scan to be in the range of 0 to 255, and accumulating a plurality of rows/columns to obtain the B/D-scan image as one column of pixel values of the two-dimensional image.

Further implementing ultrasonic flaw detection and thickness measurement under a double-emission double-receiving mode, adopting two pairs of ultrasonic receiving and transmitting probes of 5MHz to be connected to a scanner wedge according to different distances, keeping the angle of the wedge inclined plane to be 75 degrees with the bottom surface, adopting a 100MHz double-channel acquisition board card to acquire ultrasonic signals, respectively determining the time T0 and T1 when the direct wave and the RSW1 wave of the acquired ultrasonic signals corresponding to the two channels come, taking the transverse wave propagation speed of the ultrasonic waves in steel, substituting the transverse wave propagation speed into the thickness measurement formula to calculate the thickness of a material, normalizing the amplitude of the received ultrasonic signals to be within a range of 0 to 255, and mapping the amplitude of the received ultrasonic signals to a row of two-dimensional B/D scanning images; along with the scanning of the scanner, B/D scanning images under different channels are obtained through multi-column accumulation, and XY images of the thickness and the scanning position corresponding to the different channels are obtained.

Two pairs of ultrasonic receiving and transmitting probes of 5MHz are connected to a scanner wedge according to different distances, the angles of the wedge inclined planes are kept at 75 degrees with the bottom surface, ultrasonic signals are acquired by adopting a 100MHz double-channel acquisition board card, the time T0 and T2 when the straight-through wave and the RSW2 wave of the acquired ultrasonic signals corresponding to the two channels come are respectively determined, the transverse wave propagation speed of the ultrasonic waves in steel is taken, n=2 is taken, the transverse wave propagation speed is substituted into the thickness measuring formula to calculate the thickness of a material, the amplitude of the received ultrasonic signals is normalized to be within the range of 0 to 255, and the ultrasonic signals are mapped to a row of two-dimensional B/D scanning images; along with the scanning of the scanner, B/D scanning images under different channels are obtained through multi-column accumulation, and XY images of the thickness and the scanning position corresponding to the different channels are obtained.

Further, the ultrasonic propagation speed is calibrated by adopting a standard thickness workpiece, two pairs of ultrasonic receiving and transmitting probes with the thickness of 5MHz are connected to a scanner wedge according to different distances, the angle of the wedge inclined plane is kept at an included angle of 75 degrees with the bottom surface, ultrasonic signals are acquired by adopting a 100MHz double-channel acquisition board card, the time T0 and T2 when the direct wave and the RSW2 wave of the acquired ultrasonic signals corresponding to the two channels come are respectively determined, n=2 is taken, and the ultrasonic propagation speed is calculated by substituting the ultrasonic propagation speed into a sound measurement speed formula converted by the thickness measurement formula.

The embodiment also discloses a completely different brand-new ultrasonic thickness measuring method for carrying out ultrasonic thickness measuring on the surface of the material vertically incident to the single ultrasonic probe which is integrated with the transceiver.

The invention provides a method for measuring the thickness of a material by oblique incidence, which comprises the following steps: an ultrasonic transmitting probe and an ultrasonic receiving probe are fixed on a scanner/connecting piece in a mode of one transmission and one reception at a specific angle; the ultrasonic transmitting probe generates ultrasonic waves to obliquely enter the surface of the material, and the ultrasonic receiving probe receives ultrasonic signals; the ultrasonic signal is processed to measure the thickness of the material.

For example, the ultrasonic transmitting probe and the ultrasonic receiving probe are fixed on the scanner in a mode of one-to-one and one-to-one, so that the angles between the ultrasonic transmitting probe and the surface of the material are theta, the inclined incidence angle of ultrasonic waves is ensured to be more than a first critical angle, and the inclined incidence angle of the ultrasonic waves is ensured to be 30< theta <80 degrees; the scanner is provided with an ultrasonic transmitting probe and an ultrasonic receiving probe through a wedge block with an inclined surface at an angle theta, the wedge block is provided with a threaded pore canal for installing the ultrasonic probe through a vertical inclined surface, the ultrasonic transmitting probe and the receiving probe are respectively fixed on the wedge block and the scanner through the threaded pore canal, and the scanner is also provided with a magnet which is beneficial to being fixed or adsorbed on the surface of a workpiece material; and the scanner is also provided with an encoder which is in contact with the surface of the material, and the position information of the encoder is output during scanning.

During testing, two groups of movable boxes are adopted, the first group of boxes select waveform data segments where critical refraction longitudinal waves are located, the second group of boxes select surface wave data segments reflected by the 1 st bottom surface, ultrasonic waves undergo a V-shaped process in workpiece materials, n=1 at the moment, LCR waves selected by the first group of boxes and surface wave RSW1 waveforms transmitted by the bottom surface selected by the second group of boxes are respectively determined by adopting a movable vernier or a peak value proportion gate to be adjacent to corresponding time T0 and time T1, and are substituted into an ultrasonic thickness measuring formulaObtaining H; if the second set of boxes selects the second surface wave data segment reflected by the second bottom surface, the ultrasonic wave experiences two waves in the workpiece materialThe "V" type history, where n=2, is substituted into the ultrasonic thickness equation +.>H was obtained. Fig. 4 is a schematic diagram of determining arrival time of the through wave and the bottom surface reflected wave by vertical cursor selection, and fig. 5 is a schematic diagram of determining arrival time of the through wave and the bottom surface reflected wave by box selection.

Further, a pair of ultrasonic receiving and transmitting probes of 5MHz are connected to a scanner wedge according to different distances, angles of inclined planes of the wedge are kept at 45 degrees with the bottom surface, ultrasonic signals are collected by a 500MHz collecting board card, time T0 and time T2 when a direct wave and an RSW2 wave of the collected ultrasonic signals come are respectively determined, transverse wave propagation speed of ultrasonic waves in steel is taken, n=2 is taken, the transverse wave propagation speed is substituted into the thickness measuring formula to calculate the thickness of a material, meanwhile, the amplitude of the received ultrasonic signals is normalized to be within a range of 0 to 255, and the ultrasonic signals are mapped to a row of two-dimensional B/D scanning images; along with the scanning of the scanner, B/D scanning images under different channels are obtained through multi-column accumulation, and an XY image of thickness and scanning position is obtained.

Further, the ultrasonic propagation speed is calibrated by adopting a standard thickness workpiece, a pair of ultrasonic receiving and transmitting probes with the thickness of 5MHz are connected to a scanner wedge according to different distances, the angle of the wedge inclined plane is kept at an included angle of 45 degrees with the bottom surface, ultrasonic signals are acquired by adopting a 500MHz acquisition board card, the time T0 and T2 when the direct wave and the RSW2 wave of the acquired ultrasonic signals come are respectively determined, n=2 is taken, and the ultrasonic propagation speed is calculated by substituting the ultrasonic propagation speed into a sound speed measurement formula converted by the thickness measurement formula.

In order to achieve the above object, this embodiment also discloses an ultrasonic thickness measuring device that is completely different from an ultrasonic thickness measuring device that performs ultrasonic thickness measurement with respect to a single ultrasonic probe that is integrated with the transceiver.

The invention provides a brand new device for measuring the thickness of a material by oblique incidence, which comprises the following components: a screen; the ultrasonic probe module is used for fixing the ultrasonic transmitting probe and the ultrasonic receiving probe on the connecting piece/the connecting piece at a specific angle in a mode of one sending and one receiving or one sending and two receiving; the ultrasonic transmitting module is used for connecting an ultrasonic transmitting probe to generate ultrasonic waves to obliquely enter the surface of the material; the ultrasonic receiving module is used for connecting an ultrasonic receiving probe to receive ultrasonic signals; and the ultrasonic thickness measurement signal processing module is used for processing ultrasonic signals to measure the thickness of the material.

For example, the ultrasonic transmitting probe and the ultrasonic receiving probe are fixed on the scanner in a mode of transmitting and receiving or transmitting and receiving at a specific angle, so that the angle between the ultrasonic transmitting probe and the surface of the material is theta, the inclined incidence angle of ultrasonic waves is ensured to be more than a first critical angle, and the inclined incidence angle range of the ultrasonic waves is 30< theta <80 degrees.

The scanner is provided with an ultrasonic transmitting probe and an ultrasonic receiving probe through a wedge block with an inclined surface at an angle theta, the wedge block is provided with a threaded pore canal for installing the ultrasonic probe through a vertical inclined surface, the ultrasonic transmitting probe and the receiving probe are respectively fixed on the wedge block and the scanner through the threaded pore canal, and the scanner is also provided with a magnet which is beneficial to being fixed or adsorbed on the surface of a workpiece material; and the scanner is also provided with an encoder which is in contact with the surface of the material, and the position information of the encoder is output during scanning.

Further, the ultrasonic wave transmitting module transmits pulse waveforms, and ultrasonic waves are generated by the ultrasonic wave transmitting probe after excitation; the generated ultrasonic waves are incident on the surface of the material from organic glass, the ultrasonic waves are incident on the surface of a workpiece with the thickness of H at an inclined incidence angle theta, the generated direct wave (ZTW) propagates to the bottom of the medium, multiple reflections occur between the bottom surface and the upper surface, surface wave signals (RSW 1, RSW2 and RSW 3) are generated when the generated ultrasonic waves are reflected to the upper surface each time, ultrasonic echo signals propagated along the surface of the material are received by an ultrasonic receiving probe with the same angle in sequence, and the ultrasonic signals are collected by a connected ultrasonic collecting module.

The module for processing ultrasonic signals by ultrasonic measurement thickness comprises: determining the temporary time T0 of the through wave in the ultrasonic signal of the scanning position and the temporary time Tn of the surface wave signal emitted by the nth bottom surface, and substituting T0 and Tn into an ultrasonic thickness measurement formula:and calculating and recording the thickness of the material, and forming an XY graph of the thickness and the scanning position of the encoder after the scanning is completed. />

/>。

Further, the module for determining the through wave and/or the surface wave reflected by the bottom surface in the ultrasonic thickness measuring processing ultrasonic signal module comprises: determining waveform data segments where the through wave to be analyzed simultaneously and the surface waveform reflected by at least one bottom surface are selected by adopting a movable vertical free line, a square frame or numerical input or mouse frame selection; analyzing the waveform data segment by adopting a gate control module to determine waveform arrival time corresponding to the straight-through wave and the surface wave; the gate control module includes employing at least one movable horizontal cursor or peak ratio gate as a threshold, and considers a time when a waveform arrives when a peak intensity in a waveform data segment is greater than the gate threshold.

The invention also provides a formula for measuring the thickness of the material by ultrasonic oblique incidence, which is characterized in that:the method comprises the steps of carrying out a first treatment on the surface of the Wherein θ is the oblique incidence angle of the ultrasonic probe in a transmit-receive situation; t0 is the time for temporary through wave in the ultrasonic signal, tn is the time for temporary surface wave signal emitted by the nth bottom surface, V is the ultrasonic propagation speed, and n (n=1, 2,3, 4.) is the serial number of the surface wave generated by the direct through wave generated on the surface of the ultrasonic incident material and the bottom surface reflected back to the upper surface for multiple times; the equation can be transformed into: /> 。

It should be noted that, for simplicity of description, the foregoing method embodiments are all described as a series of acts, but it should be understood by those skilled in the art that the present invention is not limited by the order of acts described, as some steps may be performed in other orders or concurrently in accordance with the present invention. Further, those skilled in the art will also appreciate that the embodiments described in the specification are all preferred embodiments, and that the acts and modules referred to are not necessarily required for the present invention.

In the foregoing embodiments, the descriptions of the embodiments are emphasized, and for parts of one embodiment that are not described in detail, reference may be made to related descriptions of other embodiments.

In the several embodiments provided by the present application, it should be understood that the disclosed apparatus may be implemented in other manners. For example, the apparatus embodiments described above are merely illustrative, such as the division of the units, merely a logical function division, and there may be additional manners of dividing the actual implementation, such as multiple units or components may be combined or integrated into another system, or some features may be omitted, or not performed. Alternatively, the coupling or direct coupling or communication connection shown or discussed with each other may be an indirect coupling or communication connection via some interfaces, devices or units, or may be in electrical or other forms.

The units described as separate units may or may not be physically separate, and units shown as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

In addition, each functional unit in the embodiments of the present invention may be integrated in one processing unit, or each unit may exist alone physically, or two or more units may be integrated in one unit. The integrated units may be implemented in hardware or in software functional units.

The integrated units, if implemented in the form of software functional units and sold or used as stand-alone products, may be stored in a computer readable storage medium. Based on such understanding, the technical solution of the present invention may be embodied essentially or in part or all of the technical solution contributing to the prior art or in the form of a software product stored in a storage medium, comprising several instructions for causing a computer device (which may be a personal computer, a mobile terminal, a server or a network device, etc.) to perform all or part of the steps of the method according to the embodiments of the present invention. And the aforementioned storage medium includes: a U-disk, a Read-Only Memory (ROM), a random access Memory (RAM, random Access Memory), a removable hard disk, a magnetic disk, or an optical disk, or other various media capable of storing program codes.

The above description is only of the preferred embodiments of the present invention and is not intended to limit the present invention, but various modifications and variations can be made to the present invention by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. An ultrasonic nondestructive testing method for simultaneously carrying out flaw detection and thickness measurement is characterized by comprising the following steps of: comprising the following steps:

fixing at least one pair of ultrasonic transmitting probes and ultrasonic receiving probes and an encoder on a scanner in a one-to-one manner;

when scanning, the ultrasonic transmitting probe transmits ultrasonic waves to obliquely enter the material, the ultrasonic waves are reflected or diffracted in the material, and the ultrasonic receiving probe receives ultrasonic signals;

the processing encoder and the ultrasonic signal simultaneously carry out ultrasonic flaw detection and thickness measurement under the condition of not changing the form of the ultrasonic probe.

2. An ultrasonic non-destructive inspection method for simultaneously performing flaw detection and thickness measurement according to claim 1, wherein: the ultrasonic measurement thickness processing encoder and the ultrasonic signal method comprise the following steps: at the scanning position, determining the temporary time T0 of the through wave in the ultrasonic signal and the temporary time Tn of the surface wave signal emitted by the nth bottom surface, and substituting T0 and Tn into an ultrasonic thickness measuring formula: Calculating and recording the thickness of the material, and forming an XY graph of the thickness and the scanning position of the encoder after the scanning is completed; wherein, the ultrasonic thickness measurement formula can be transformed into according to the rule of the triangular function:、the method comprises the steps of carrying out a first treatment on the surface of the Wherein H is the thickness of the workpiece material, and θ is the oblique incidence angle of the ultrasonic wave; v is the ultrasonic propagation velocity, n (n=1, 2,3, 4.) is the measurement choiceThe used ultrasonic waves are reflected back to the surface wave serial number generated on the upper surface with the nth time of the bottom surface after entering the material; the thickness measurement formula can change and measure the accurate propagation speed of ultrasonic waves in a medium under the condition that the accurate thickness H of a workpiece material is known:；

the ultrasonic flaw detection encoder and the ultrasonic signal processing method comprise the following steps: and forming a corresponding A-scan image by the received echo signals at each scanning position, mapping the corresponding A-scan image to one row or one column of the B/D-scan image, and forming a complete B/D-scan echo image after scanning is completed.

3. An ultrasonic non-destructive inspection method for simultaneously performing flaw detection and thickness measurement according to claim 1, wherein:

the ultrasonic transmitting probe and the ultrasonic receiving probe are fixed on the scanner in a mode of transmitting, receiving or double transmitting and double receiving at a specific angle, so that the angle between the ultrasonic transmitting probe and the surface of the material is theta, and the inclined incident angle theta of ultrasonic waves is ensured to be larger than a first critical angle; the scanner is also provided with an encoder which is in contact with the surface of the material, and the position information of the encoder is output during scanning;

The method of processing ultrasonic signals includes determining the arrival time of a through wave and/or a surface wave reflected from a bottom surface: determining waveform data segments where the through wave to be analyzed simultaneously and the surface waveform reflected by at least one bottom surface are selected by adopting a movable vertical free line, a square frame or numerical input or mouse frame selection; analyzing the waveform data segment by adopting a gate control method to determine waveform arrival time corresponding to the straight-through wave and the surface wave; the gate control method comprises the steps of adopting at least one movable horizontal cursor or peak value proportion gate as a threshold value, and considering the time corresponding to the time when the waveform comes when the peak intensity in the waveform data section is larger than the gate threshold value;

the mode of mapping the A-scan image to one row or one column of the B/D-scan image comprises the steps of normalizing the amplitude of each point A-scan to be in a range of 0 to 255, and accumulating a plurality of columns to obtain the B/D-scan image as one column of pixel values of the two-dimensional image;

the ultrasonic flaw detection and the measurement of the thickness of the material under the condition of not changing the receiving and transmitting form of the ultrasonic probe comprise the step of measuring the thickness of the material while carrying out A scanning of the ultrasonic flaw detection and the step of forming an XY image of the thickness and the position while carrying out B/D scanning echo image.

4. A method of measuring material thickness using a one-shot ultrasonic oblique incidence, comprising:

an ultrasonic transmitting probe and an ultrasonic receiving probe are fixed on a scanner at a specific angle in a one-to-one mode;

the ultrasonic transmitting probe generates ultrasonic waves to obliquely enter the surface of the material, and the ultrasonic receiving probe receives ultrasonic signals;

the ultrasonic signal is processed to measure the thickness of the material.

5. The method for measuring the thickness of a material by ultrasonic oblique incidence transreceiving as set forth in claim 4, wherein:

the method for measuring thickness processing ultrasonic signals comprises the following steps: at each scanning position, determining the temporary time T0 of the through wave in the ultrasonic signal and the temporary time Tn of the surface wave signal emitted by the nth bottom surface, and substituting T0 and Tn into an ultrasonic thickness measuring formula:calculating and recording the thickness of the material, and further combining the thickness with the scanning position to form an XY graph of the thickness and the scanning position; wherein, the ultrasonic thickness measurement formula can be transformed into according to the rule of the triangular function:、the method comprises the steps of carrying out a first treatment on the surface of the Wherein the thickness measurement formula can change and measure the accurate propagation speed of ultrasonic waves in a medium under the condition of knowing the accurate thickness H of a workpiece materialDegree:the method comprises the steps of carrying out a first treatment on the surface of the Wherein H is the thickness of the workpiece material, and θ is the oblique incidence angle of the ultrasonic wave; v is the ultrasonic propagation velocity and n (n=1, 2,3, 4.) is the surface wave number generated by the n-th reflection of the selected ultrasonic incident material back to the upper surface after measurement.

6. The method for measuring the thickness of a material by ultrasonic oblique incidence transreceiving as set forth in claim 4, wherein:

the ultrasonic transmitting probe and the ultrasonic receiving probe are fixed on the scanner in a mode of transmitting, receiving or double transmitting and double receiving at a specific angle, so that the angle between the ultrasonic transmitting probe and the surface of the material is theta, and the inclined incident angle of ultrasonic waves is ensured to be larger than a first critical angle; the scanner is also provided with an encoder which is in contact with the surface of the material, and the position information of the encoder is output during scanning;

the method for determining the through wave or the surface wave launched by the bottom surface in the ultrasonic signal comprises the following steps: determining waveform data segments where the through wave to be analyzed simultaneously and the surface waveform reflected by at least one bottom surface are selected by adopting a movable vertical free line, a square frame or numerical input or mouse frame selection; analyzing the waveform data segment by adopting a gate control method to determine waveform arrival time corresponding to the straight-through wave and the surface wave; the gate control method comprises the step of adopting at least one movable horizontal cursor or peak value proportion gate as a threshold value, and considering the time corresponding to the time when the waveform comes when the peak intensity in the waveform data segment is larger than the gate threshold value.

7. An ultrasonic nondestructive testing device for simultaneously carrying out flaw detection and thickness measurement, which is characterized in that: comprising the following steps:

A screen;

an ultrasonic probe module fixing at least one pair of ultrasonic transmitting probe and ultrasonic receiving probe and an encoder on the scanner;

the ultrasonic transmitting module is used for connecting an ultrasonic transmitting probe to generate ultrasonic waves to obliquely enter the surface of the material;

the ultrasonic receiving module is used for connecting an ultrasonic receiving probe to receive ultrasonic echo signals;

the signal processing module comprises a flaw detection processing signal module and a thickness measurement processing signal module and is used for processing an encoder and ultrasonic signals to carry out ultrasonic flaw detection and measuring the thickness of a material under the condition that the receiving and transmitting form of an ultrasonic probe is not changed.

8. An ultrasonic non-destructive inspection apparatus for simultaneously performing inspection and thickness measurement according to claim 7, wherein

The method comprises the following steps: the ultrasonic thickness measurement processing signal module comprises the following functions: determining the temporary time T0 of critical refraction longitudinal wave signals and the temporary time Tn of surface wave signals emitted by the nth bottom surface, and substituting T0 and Tn into an ultrasonic thickness measuring formula:

calculating and recording the thickness of the material, and further combining the thickness with the scanning position to form an XY graph of the thickness and the scanning position; wherein, the ultrasonic thickness measurement formula can be transformed into according to the rule of the triangular function:、the method comprises the steps of carrying out a first treatment on the surface of the The thickness measurement formula can change and measure the accurate propagation speed of ultrasonic waves in a medium under the condition that the accurate thickness H of a workpiece material is known: The method comprises the steps of carrying out a first treatment on the surface of the Wherein H is the thickness of the workpiece material, and θ is the oblique incidence angle of the ultrasonic wave; v is the ultrasonic propagation speed, n (n=1, 2,3, 4.) is the surface wave number generated by the n-th reflection of the selected ultrasonic incident material back to the upper surface with the bottom surface;

the ultrasonic flaw detection processing signal module comprises: and forming a corresponding A-scan image by the received echo signals at each scanning position, mapping the corresponding A-scan image to one row or one column of the B/D-scan image, and forming a complete B/D-scan echo image after scanning is completed.

9. An ultrasonic non-destructive inspection apparatus for simultaneously performing inspection and thickness measurement according to claim 7, wherein: the ultrasonic transmitting probe and the ultrasonic receiving probe are fixed on the scanner in a mode of transmitting, receiving or double transmitting and double receiving at a specific angle, so that the angle between the ultrasonic transmitting probe and the surface of the material is theta, and the inclined incident angle of ultrasonic waves is ensured to be larger than a first critical angle; the scanner is also provided with an encoder which is in contact with the surface of the material, and the position information of the encoder is output during scanning;

the method for determining the through wave and/or the surface wave reflected by the bottom surface in the ultrasonic signal module comprises the following steps: determining waveform data segments where the through wave to be analyzed simultaneously and the surface waveform reflected by at least one bottom surface are selected by adopting a movable vertical free line, a square frame or numerical input or mouse frame selection; analyzing the waveform data segment by adopting a gate control module to determine waveform arrival time corresponding to the straight-through wave and the surface wave; the gate control module comprises a gate control module, a control module and a control module, wherein the gate control module adopts at least one movable horizontal cursor or peak value proportional gate as a threshold value, and when the peak intensity in the waveform data section is greater than the gate threshold value, the waveform is regarded as the time corresponding to the waveform arrival time;

The mode of mapping the A-scan image to one row or one column of the B/D-scan image in the ultrasonic flaw detection processing ultrasonic signal module comprises the steps of normalizing the amplitude of each point A-scan to be in the range of 0 to 255, and using the amplitude as one column of pixel value of a two-dimensional image, and accumulating multiple columns to obtain the B/D-scan image;

the ultrasonic flaw detection and the measurement of the thickness of the material are carried out under the condition that the receiving and transmitting form of the ultrasonic probe is not changed in the signal processing module, and the ultrasonic flaw detection method comprises the steps of measuring the thickness of the material while carrying out A scanning of the ultrasonic flaw detection, and also comprises the steps of forming an XY image of the thickness and the position while carrying out B/D scanning echo image.

10. An apparatus for measuring material thickness by ultrasonic oblique incidence transceiving, comprising:

a screen;

the ultrasonic probe module is used for fixing the ultrasonic transmitting probe and the ultrasonic receiving probe on the scanner at a specific angle in a one-to-one mode;

the ultrasonic receiving module is used for connecting an ultrasonic receiving probe to receive ultrasonic signals;

and the ultrasonic thickness measurement signal processing module is used for processing ultrasonic signals to measure the thickness of the material.

11. An apparatus for measuring material thickness by ultrasonic oblique incidence transreceiving as set forth in claim 10 wherein:

The ultrasonic thickness measurement signal processing module comprises the following functions: at each scanning position, determining the temporary time T0 of the through wave in the ultrasonic signal and the temporary time Tn of the surface wave signal emitted by the nth bottom surface, and substituting T0 and Tn into an ultrasonic thickness measuring formula:calculating and recording the thickness of the material, and further combining the thickness with the scanning position to form an XY graph of the thickness and the scanning position; wherein, the ultrasonic thickness measurement formula can be transformed into according to the rule of the triangular function:、the method comprises the steps of carrying out a first treatment on the surface of the The thickness measurement formula can change and measure the accurate propagation speed of ultrasonic waves in a medium under the condition that the accurate thickness H of a workpiece material is known:the method comprises the steps of carrying out a first treatment on the surface of the Wherein H is the thickness of the workpiece material, and θ is the oblique incidence angle of the ultrasonic waveThe method comprises the steps of carrying out a first treatment on the surface of the V is the ultrasonic propagation velocity and n (n=1, 2,3, 4.) is the surface wave number generated by the n-th reflection of the selected ultrasonic incident material back to the upper surface after measurement.

12. An apparatus for measuring material thickness by ultrasonic oblique incidence transreceiving as set forth in claim 10 wherein:

The method for determining critical refraction longitudinal waves or surface waves emitted by the bottom surface in the ultrasonic thickness measuring processing ultrasonic signal module comprises the following steps: determining waveform data segments where the through wave to be analyzed simultaneously and the surface waveform reflected by at least one bottom surface are selected by adopting a movable vertical free line, a square frame or numerical input or mouse frame selection; analyzing the waveform data segment by adopting a gate control method to determine waveform arrival time corresponding to the straight-through wave and the surface wave; the gate control method includes employing at least one movable gate

Horizontal cursor or peak ratio gate as threshold, waveform is considered to be when peak intensity in waveform data segment is greater than gate threshold

Temporarily corresponding time.

13. An ultrasonic oblique incidence receiving and transmitting formula for measuring material thickness in a receiving and transmitting mode is characterized in that:

the method comprises the steps of carrying out a first treatment on the surface of the Wherein θ is the oblique incidence angle of the ultrasonic probe in a transmitting-receiving mode, T0 is the temporary time of the through wave in the ultrasonic signal, tn is the temporary time of the surface wave signal emitted by the nth bottom surface in the ultrasonic signal, V is the ultrasonic propagation speed, n #n=1, 2,3, 4.) measuring the surface wave number generated by the n-th reflection of the selected ultrasonic incident material back to the upper surface with the bottom surface; the equation can be transformed into: 、。