CN115932044B - Workpiece defect real-time detection method in laser processing process - Google Patents
Workpiece defect real-time detection method in laser processing process Download PDFInfo
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- CN115932044B CN115932044B CN202211655709.6A CN202211655709A CN115932044B CN 115932044 B CN115932044 B CN 115932044B CN 202211655709 A CN202211655709 A CN 202211655709A CN 115932044 B CN115932044 B CN 115932044B
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- 238000012545 processing Methods 0.000 title claims abstract description 55
- 230000007547 defect Effects 0.000 title claims abstract description 39
- 238000000034 method Methods 0.000 title claims abstract description 31
- 230000008569 process Effects 0.000 title claims abstract description 19
- 238000011897 real-time detection Methods 0.000 title abstract description 6
- 238000001514 detection method Methods 0.000 claims abstract description 33
- 238000009825 accumulation Methods 0.000 claims abstract description 9
- 238000003754 machining Methods 0.000 claims description 12
- 239000007822 coupling agent Substances 0.000 claims description 2
- 238000012544 monitoring process Methods 0.000 abstract description 5
- 239000002699 waste material Substances 0.000 abstract description 3
- 238000005516 engineering process Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000012994 industrial processing Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Abstract
The invention discloses a real-time detection method for workpiece defects in a laser processing process, which comprises the steps of placing a processed workpiece on a workbench; aligning the laser beam to a point to be processed of the workpiece; arranging the detection assembly around the point to be processed in a semi-encircling or encircling mode; the point to be processed generates heat accumulation in the processing process, and causes thermal expansion behavior of the processed workpiece, so that surrounding air is extruded to vibrate, and vibration signals are detected through the detection assembly. The method starts from the laser processing process, realizes real-time monitoring of the processing process, does not need to wait for the processing to finish for defect detection, and effectively avoids the waste of time cost; and a detection signal source is not required to be introduced, so that the detection process is successfully simplified.
Description
Technical Field
The invention relates to the technical field of laser processing, in particular to a workpiece defect real-time detection method in the laser processing process.
Background
With the diversification of industrial processing means, laser processing technology has been recently applied to various processing fields, particularly to fine parts and parts with high precision requirements. Since the materials of the processed parts are various, the laser emission energy for processing is generally high, and burn or fine cracks of the processed parts are often caused, and these defects are very fatal to the function of the whole parts, the defect detection technology for the laser processing technology is becoming a great concern in this field.
The existing common workpiece defect detection technology can only detect the workpiece after the workpiece is processed, such as X-ray detection, optical microscopic detection, ultrasonic detection and the like, which means that if the workpiece has processing defects, the processing stage of the defect cannot be judged, the whole processing period is consumed, and the time cost is increased intangibly on the basis of wasting the cost of the workpiece, so that the real-time detection of the workpiece defects becomes a detection technology which needs to be overcome in the laser processing field in the laser processing process.
Disclosure of Invention
The invention aims to provide a real-time detection method for workpiece defects in the laser processing process, so as to solve the problems in the prior art, realize real-time monitoring of the workpiece in the laser processing process, reduce cost waste and shorten processing period.
In order to achieve the above object, the present invention provides the following solutions: the invention provides a method for detecting workpiece defects in real time in a laser processing process, which comprises the following steps:
placing a processed workpiece on a workbench; aligning the laser beam to the point to be processed of the processed workpiece; arranging the detection assembly around the point to be processed in a semi-encircling or encircling mode; the point to be processed generates heat accumulation in the processing process, and causes thermal expansion behavior of the processed workpiece, so that surrounding air is extruded to generate vibration, and vibration signals are detected through the detection assembly.
The monitoring component comprises a detector, a signal wire and an upper computer; the detectors are arranged in a plurality, and the detectors are arranged in a semi-surrounding or surrounding manner on the point to be processed; each detector is electrically connected with the upper computer through the signal wire.
When the point to be processed is in a circular hole-shaped rotationally symmetrical structure, arranging a plurality of detectors on the periphery of the point to be processed; when the vibration signals detected by each detector are consistent, the processed workpiece is free of defects.
When the vibration signal detected by the detector is deviated, the deviation is maintained for at least three detection periods, and the processed workpiece has processing defects.
When the point to be processed is in a strip-shaped non-rotationally symmetrical structure, arranging a plurality of detectors on the periphery of the point to be processed; and when the detector signals close to the point to be processed are consistent and the detector signals far away from the point to be processed are also consistent, the processed workpiece is free of defects.
When the vibration signals detected by each detector are different, the deviation maintains at least three detection periods, and the periphery of the point to be processed has processing defects.
When the signals of the detectors close to the point to be processed are consistent, and the vibration signals detected by the detectors far away from the point to be processed are deviated, the deviation maintains at least three detection periods, and the point to be processed has a processing defect on the far side.
When the surface of the processed workpiece is also coated with an ultrasonic coupling agent.
The emergent energy of the laser beam is more than or equal to 10 -6 μJ。
The invention discloses the following technical effects: the method starts from the laser processing process, realizes real-time monitoring of the processing process, does not need to wait for the processing to finish for defect detection, and effectively avoids the waste of time cost; and a detection signal source is not required to be introduced, so that the detection process is successfully simplified.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions of the prior art, the drawings that are needed in the embodiments will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic elevational view of the structure of the present invention;
FIG. 2 is a schematic top view of the structure of the present invention;
FIG. 3 is a schematic view of the embodiment 1 of the present invention when a circular hole-shaped rotationally symmetrical structure is processed;
FIG. 4 is a schematic diagram showing defects when a circular hole-shaped rotationally symmetrical structure is processed in embodiment 2 of the present invention;
FIG. 5 is a schematic diagram of the embodiment 3 of the present invention when the bar-shaped non-rotationally symmetrical structure is processed;
FIG. 6 is a schematic diagram showing defects at the processing points when processing the bar-shaped non-rotationally symmetrical structure in embodiment 4 of the present invention;
FIG. 7 is a schematic diagram showing defects in the processed structure when processing the bar-shaped non-rotationally symmetrical structure in embodiment 5 of the present invention;
1, machining a workpiece; 2. a detector; 3. a signal line; 4. a laser beam; 5. a processing section; 6. and an upper computer.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
In order that the above-recited objects, features and advantages of the present invention will become more readily apparent, a more particular description of the invention will be rendered by reference to the appended drawings and appended detailed description.
The invention provides that a processing workpiece 1 is placed on a workbench; aligning the laser beam 4 to a point 5 to be processed of the workpiece 1; and arranging the detection assembly in a semi-encircling or encircling manner around the point to be processed 5; the point to be processed 5 generates heat accumulation in the processing process, and causes thermal expansion behavior of the processed workpiece 1, so that surrounding air is extruded to generate vibration, and vibration signals are detected through the detection assembly.
The monitoring component comprises a detector 2, a signal wire 3 and an upper computer 6; the detectors 2 are arranged in a plurality, and the detectors 2 are arranged in a semi-surrounding or surrounding manner to the point 5 to be processed; each detector 2 is electrically connected with the upper computer 6 through a signal wire 3.
When the point to be processed 5 is in a circular hole-shaped rotationally symmetrical structure, arranging a plurality of detectors 2 on the periphery of the point to be processed 5; when the vibration signals detected by each of the probes 2 are identical, the work piece 1 is free from defects.
When the vibration signal detected by the detector 2 is deviated, and the deviation is maintained for at least three detection periods, the processing work piece 1 has processing defects.
When the point to be processed 5 is in a strip-shaped non-rotationally symmetrical structure, arranging a plurality of detectors 2 on the periphery of the point to be processed 5; when the signals of the detectors 2 close to the point to be processed 5 are consistent and the signals of the detectors 2 far away from the point to be processed 5 are also consistent, the processed workpiece 1 is free from defects.
When the vibration signals detected by each detector 2 are different, and the deviation maintains at least three detection periods, the periphery of the point to be processed 5 has processing defects.
When the signals of the detectors 2 close to the point to be processed 5 are consistent, and the vibration signals detected by the detectors 2 far away from the point to be processed 5 deviate, the deviation maintains at least three detection periods, and the point to be processed 5 has processing defects on the far side.
When the surface of the work piece 1 is also coated with an ultrasonic couplant.
The emission energy of the laser beam 4 is greater than or equal to 10 -6 μJ。
In one embodiment of the invention, a 2-bit ultrasonic transducer is provided; and the detectors 2 are provided in four, annular around the point 5 to be machined.
In one embodiment of the invention, the laser beam 4 performs welding, cutting, punching, etching, heat treatment, surface modification, and the like on the work piece 1.
In one embodiment of the invention, the detector 2 is closely attached to the side of the machined surface of the machined workpiece 1, and when the surface roughness of the machined workpiece 1 is high, the surface of the machined workpiece 1 is smeared with an ultrasonic couplant.
Example 1:
when a circular hole-shaped rotationally symmetrical structure is machined by utilizing laser, 4 detectors 2 are selected to be placed around a machining point diagonally, the machining point generates thermal expansion behavior due to heat accumulation, surrounding air is extruded to induce vibration, ultrasonic waves generated by the vibration are diffused around a point to be machined 5, and ultrasonic signals detected by the 4 detectors 2 are kept consistent at the moment, as shown in fig. 3;
when the ultrasonic signals detected by the 4 detectors 2 are kept in a consistent state and are maintained until the machining of the hole-shaped structure is completed, the machining defect does not appear in the machined workpiece 1, and the machining is completed smoothly.
Example 2:
when a circular hole-shaped rotationally symmetrical structure is machined by utilizing laser, 4 detectors 2 are selected to be placed around a machining point diagonally, the machining point generates thermal expansion behavior due to heat accumulation, surrounding air is extruded to induce vibration, ultrasonic waves generated by the vibration diffuse around a point to be machined 5, if cracks appear in a certain direction of the point to be machined 5, at the moment, ultrasonic signals detected by the 4 detectors 2 deviate, as shown in fig. 4;
when the deviation state of the ultrasonic signals detected by the 4 detectors 2 is maintained for 3 detection periods, the processing defect of the processed workpiece 1 is indicated, and the processing is terminated.
Example 3:
when a strip-shaped non-rotationally symmetrical structure is processed by utilizing laser, 4 detectors 2 are diagonally placed around a point to be processed 5, the point to be processed 5 generates thermal expansion behavior due to heat accumulation, surrounding air is extruded to induce vibration, ultrasonic waves generated by the vibration are diffused around the point to be processed 5, and ultrasonic signals detected by the 2 detectors 2 close to a laser beam are strongest and consistent at the moment; the ultrasonic signals detected by the 2 detectors 2 far from the laser beam are relatively weak, and can be kept consistent despite the existence of certain multiband interference signals, as shown in fig. 5;
when the ultrasonic signals detected by the 4 detectors 2 are kept in a consistent state every two, and the ultrasonic signals are maintained until the processing of the strip-shaped structure is completed, the processing defect does not appear in the processed workpiece 1, and the processing is completed smoothly.
Example 4:
when a strip-shaped non-rotationally symmetrical structure is processed by utilizing laser, 4 detectors 2 are selected to be placed around a point to be processed 5 diagonally, the point to be processed 5 generates thermal expansion behavior due to heat accumulation, surrounding air is extruded to induce vibration, ultrasonic waves generated by the vibration are diffused around the point to be processed 5, if cracks appear in a certain direction around the point to be processed 5 by the laser, at the moment, the ultrasonic signals detected by the 4 detectors 2 are all biased and different, as shown in fig. 6;
when the deviation state of the ultrasonic signals detected by the 4 detectors 2 is maintained for 3 detection periods, the processing defect of the processed workpiece 1 is indicated, and the processing is terminated.
Example 5:
when a strip-shaped non-rotationally symmetrical structure is processed by utilizing laser, 4 detectors 2 are selected to be placed at the periphery of a point to be processed 5 in opposite angles, the point to be processed 5 generates thermal expansion action due to heat accumulation, surrounding air is extruded to induce vibration, ultrasonic waves generated by the vibration are diffused around the point to be processed 5, if a crack appears in a certain direction of the processing structure away from the point to be processed 5, ultrasonic signals detected by 2 detectors 2 close to the point to be processed 5 can be kept consistent at the moment, but obvious deviation appears in the ultrasonic signals detected by the detectors 2 close to the crack direction, as shown in fig. 7;
when the deviation state of the ultrasonic signals detected by the 4 detectors 2 is maintained for 3 detection periods, the processing defect of the processed workpiece 1 is indicated, and the processing is terminated.
In the description of the present invention, it should be understood that the terms "longitudinal," "transverse," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like indicate or are based on the orientation or positional relationship shown in the drawings, merely to facilitate description of the present invention, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the present invention.
The above embodiments are only illustrative of the preferred embodiments of the present invention and are not intended to limit the scope of the present invention, and various modifications and improvements made by those skilled in the art to the technical solutions of the present invention should fall within the protection scope defined by the claims of the present invention without departing from the design spirit of the present invention.
Claims (4)
1. A method for detecting workpiece defects in real time in the laser processing process is characterized by comprising the following steps:
placing a processing workpiece (1) on a workbench; directing a laser beam (4) at a point (5) to be machined of the machined workpiece (1); and arranging the detection assembly around the point (5) to be processed in a semi-encircling or encircling manner; the point to be processed (5) generates heat accumulation in the processing process, and causes thermal expansion behavior of the processed workpiece (1), so that surrounding air is extruded to vibrate, and vibration signals are detected through the detection assembly; when the point to be processed (5) is in a round hole-shaped rotationally symmetrical structure, arranging a plurality of detectors (2) on the periphery of the point to be processed (5); when the vibration signals detected by each detector (2) are consistent, the processed workpiece (1) is defect-free; when the vibration signal detected by the detector (2) deviates, maintaining at least three detection periods of the deviation, wherein the machined workpiece (1) has machining defects; when the point (5) to be processed is in a strip-shaped non-rotationally symmetrical structure, arranging a plurality of detectors (2) on the periphery of the point (5) to be processed; when the signals of the detectors (2) close to the point to be processed (5) are consistent and the signals of the detectors (2) far away from the point to be processed (5) are also consistent, the processed workpiece (1) is defect-free; when the vibration signals detected by each detector (2) are different, and the deviation maintains at least three detection periods, the periphery of the point to be processed (5) has processing defects; when the signals of the detectors (2) close to the point to be processed (5) are consistent, and the vibration signals detected by the detectors (2) far away from the point to be processed (5) are deviated, the deviation maintains at least three detection periods, and the point to be processed (5) has processing defects on the far side.
2. The method for detecting workpiece defects in real time in a laser machining process according to claim 1, wherein: the detection assembly comprises a detector (2), a signal wire (3) and an upper computer (6); the detectors (2) are arranged in a plurality, and the detectors (2) are arranged in a semi-encircling or encircling mode at the point (5) to be processed; each detector (2) is electrically connected with the upper computer (6) through the signal wire (3).
3. The method for detecting workpiece defects in real time in a laser machining process according to claim 1, wherein: when the surface of the processing workpiece (1) is also coated with an ultrasonic coupling agent.
4. The method for detecting workpiece defects in real time in a laser machining process according to claim 1, wherein: the emergent energy of the laser beam (4) is more than or equal to 10 -6 μJ。
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