CN115932044A - Real-time detection method for workpiece defects in laser processing process - Google Patents
Real-time detection method for workpiece defects in laser processing process Download PDFInfo
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- CN115932044A CN115932044A CN202211655709.6A CN202211655709A CN115932044A CN 115932044 A CN115932044 A CN 115932044A CN 202211655709 A CN202211655709 A CN 202211655709A CN 115932044 A CN115932044 A CN 115932044A
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- 238000012545 processing Methods 0.000 title claims abstract description 53
- 230000007547 defect Effects 0.000 title claims abstract description 46
- 238000000034 method Methods 0.000 title claims abstract description 37
- 230000008569 process Effects 0.000 title claims abstract description 19
- 238000011897 real-time detection Methods 0.000 title claims abstract description 14
- 238000001514 detection method Methods 0.000 claims abstract description 30
- 238000009825 accumulation Methods 0.000 claims abstract description 9
- 238000012544 monitoring process Methods 0.000 claims abstract description 6
- 238000003754 machining Methods 0.000 claims description 18
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 239000002699 waste material Substances 0.000 abstract description 3
- 239000000523 sample Substances 0.000 description 7
- 238000010586 diagram Methods 0.000 description 3
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- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000012994 industrial processing Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000399 optical microscopy Methods 0.000 description 1
- 238000002604 ultrasonography Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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Abstract
The invention discloses a real-time detection method for workpiece defects in a laser processing process, which comprises the steps of placing a processing workpiece on a workbench; aligning the laser beam to a point to be processed of a processed workpiece; arranging the detection assembly around the point to be processed in a semi-surrounding or surrounding manner; the point to be processed generates heat accumulation in the processing process to cause the thermal expansion behavior of the processed workpiece, so that the surrounding air is extruded to generate vibration, and the vibration signal is detected through the detection assembly. The method and the device start from the laser processing process, realize real-time monitoring of the processing process, do not need to wait for defect detection after the processing is finished, and effectively avoid waste of time cost; and a detection signal source is not required to be introduced, so that the detection process is successfully simplified.
Description
Technical Field
The invention relates to the technical field of laser processing, in particular to a method for detecting defects of a workpiece in real time in a laser processing process.
Background
With the diversification of industrial processing means, in recent years, laser processing techniques have been applied to various processing occasions, particularly to fine parts and parts with high precision requirements. Since the laser beam emitted energy for machining is generally high due to the variety of materials of the machined parts, and the defects are fatal to the functions of the whole parts, the laser beam machining technology is a hot spot of great concern in the field.
Most of the conventional workpiece defect detection technologies can detect defects of a workpiece only after the workpiece is machined, such as X-ray detection, optical microscopy, ultrasonic detection and the like, which means that if the workpiece has machining defects, not only can the machining stage where the defects appear be not judged, but also the whole machining period is consumed, and on the basis of wasting the workpiece cost, the time cost is also increased invisibly, so that the real-time detection of the workpiece defects becomes a detection technology which is urgently needed in the field of laser machining in the laser machining process.
Disclosure of Invention
The invention aims to provide a method for detecting defects of a workpiece in real time in a laser processing process, which aims to solve the problems in the prior art, can realize real-time monitoring of the workpiece in the laser processing process, reduce cost waste and shorten the processing period.
In order to achieve the purpose, the invention provides the following scheme: the invention provides a real-time detection method for workpiece defects in a laser processing process, which comprises the following steps:
placing a processing workpiece on a workbench; aligning a laser beam to a point to be processed of the processed workpiece; arranging the detection assembly around the point to be processed in a semi-surrounding or surrounding mode; the point to be processed generates heat accumulation in the processing process to cause the thermal expansion behavior of the processed workpiece, so that the surrounding air is extruded to generate vibration, and the vibration signal is detected through the detection assembly.
The monitoring assembly comprises a detector, a signal line and an upper computer; the detectors are arranged in a plurality and are arranged in a semi-surrounding or surrounding manner on the point to be processed; each detector is electrically connected with the upper computer through the signal wire.
When the point to be processed is in a circular hole-shaped rotational symmetric structure, a plurality of detectors are arranged on the periphery of the point to be processed; when the vibration signals detected by each detector are consistent, the processed workpiece has no defect.
When the vibration signal detected by the detector has deviation, and the deviation is maintained for at least three detection periods, the processed workpiece has processing defects.
When the point to be processed is in a strip-shaped non-rotational symmetrical structure, a plurality of detectors are arranged on the periphery of the point to be processed; and when the signals of the detectors close to the point to be processed are consistent, and the signals of the detectors far away from the point to be processed are also consistent, the processed workpiece has no defect.
When the vibration signals detected by each detector are different and the deviation is maintained for at least three detection periods, the peripheral side of the point to be processed has processing defects.
When the signals of the detectors close to the point to be processed are consistent, and the vibration signals detected by the detectors far away from the point to be processed are deviated, the deviation is maintained for at least three detection periods, and the far side of the point to be processed has processing defects.
When the surface of the processed workpiece is also coated with the ultrasonic couplant.
The emergent energy of the laser beam is more than or equal to 10 -6 μJ。
The invention discloses the following technical effects: the method and the device start from the laser processing process, realize real-time monitoring of the processing process, do not need to wait for defect detection after the processing is finished, and effectively avoid waste of time cost; and a detection signal source is not required to be introduced, so that the detection process is successfully simplified.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without creative efforts.
FIG. 1 is a schematic front view of the structure of the present invention;
FIG. 2 is a schematic top view of the inventive structure;
FIG. 3 is a schematic view of a circular hole-shaped rotational symmetric structure being processed in the embodiment 1 of the present invention;
FIG. 4 is a schematic diagram showing defects occurring when a circular hole-shaped rotationally symmetric structure is processed in embodiment 2 of the present invention;
FIG. 5 is a schematic view of a strip-shaped non-rotationally symmetric structure in the embodiment 3 of the present invention;
FIG. 6 is a schematic diagram illustrating defects at processing points when a strip-shaped non-rotationally symmetric structure is processed in embodiment 4 of the present invention;
fig. 7 is a schematic diagram illustrating a defect in a processing structure when a strip-shaped non-rotationally symmetric structure is processed in embodiment 5 of the present invention;
wherein, 1, processing a workpiece; 2. a detector; 3. a signal line; 4. a laser beam; 5. a processing section; 6. and (4) an upper computer.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in further detail below.
The invention provides that a processing workpiece 1 is arranged on a workbench; aligning a laser beam 4 to a point 5 to be processed of the workpiece 1; arranging the detection assembly around the point 5 to be processed in a semi-surrounding or surrounding mode; the point 5 to be processed generates heat accumulation in the processing process, and causes the thermal expansion behavior of the processed workpiece 1, so that the surrounding air is extruded to generate vibration, and the vibration signal is detected through the detection assembly.
The monitoring assembly comprises a detector 2, a signal wire 3 and an upper computer 6; the detectors 2 are arranged in a plurality, and the detectors 2 are arranged in a semi-surrounding manner or in a surrounding manner around the point 5 to be processed; each detector 2 is electrically connected with the upper computer 6 through a signal wire 3.
When the point 5 to be processed is a circular hole-shaped rotational symmetric structure, a plurality of detectors 2 are arranged on the periphery of the point 5 to be processed; when the vibration signals detected by each of the detectors 2 are identical, the processed workpiece 1 is free of defects.
When the vibration signal detected by the detector 2 has a deviation, and the deviation is maintained for at least three detection periods, the processed workpiece 1 has a processing defect.
When the point 5 to be processed is in a strip-shaped non-rotational symmetrical structure, a plurality of detectors 2 are arranged on the periphery of the point 5 to be processed; when the signals of the detectors 2 close to the point 5 to be processed are consistent, and the signals of the detectors 2 far away from the point 5 to be processed are also consistent, the processed workpiece 1 is free of defects.
When the vibration signals detected by each detector 2 are different and the deviation is maintained for at least three detection periods, a processing defect exists on the peripheral side of the point 5 to be processed.
When the signals of the probes 2 close to the point 5 to be processed are consistent, and the vibration signals detected by the probes 2 far away from the point 5 to be processed are deviated, the deviation is maintained for at least three detection periods, and a processing defect exists on the far side of the point 5 to be processed.
When the surface of the workpiece 1 is coated with the ultrasonic couplant.
The emission energy of the laser beam 4 is 10 or more -6 μJ。
In one embodiment of the invention, the probe is a 2-bit ultrasound transducer; and four probes 2 are provided, arranged annularly around the point 5 to be processed.
In one embodiment of the present invention, the laser beam 4 performs welding, cutting, drilling, etching, heat treatment, and surface modification processes on the workpiece 1.
In one embodiment of the invention, the probe 2 is tightly attached to the processed surface side of the processed workpiece 1, and when the roughness of the surface of the processed workpiece 1 is high, the ultrasonic couplant is used for coating the surface of the processed workpiece 1.
Example 1:
when a circular hole-shaped rotational symmetric structure is machined by using laser, 4 probes 2 are selected and placed around a machining point in opposite angles, the machining point generates thermal expansion behavior due to heat accumulation, surrounding air is extruded to cause vibration, ultrasonic waves generated by the vibration are diffused around a point 5 to be machined to the periphery, and ultrasonic signals detected by the 4 probes 2 are kept consistent at the moment, as shown in fig. 3;
when the ultrasonic signals detected by the 4 detectors 2 are kept in a consistent state and maintained until the hole-shaped structure is processed, it is indicated that no processing defect occurs in the processed workpiece 1, and the processing is completed smoothly.
Example 2:
when a circular hole-shaped rotational symmetric structure is machined by using laser, 4 opposite angles of the detectors 2 are selected to be placed around a machining point, the machining point generates thermal expansion behavior due to heat accumulation, surrounding air is extruded to cause vibration, ultrasonic waves generated by the vibration are diffused around the to-be-machined point 5 to the periphery, and if cracks occur in a certain direction of the to-be-machined point 5, ultrasonic signals detected by the 4 detectors 2 are deviated at the moment, as shown in fig. 4;
when the ultrasonic signals detected by the 4 detectors 2 have deviation state and maintain for 3 detection periods, it indicates that the processing defect occurs in the processed workpiece 1, and the processing is terminated.
Example 3:
when a strip-shaped non-rotational symmetric structure is machined by using laser, 4 detectors 2 are selected and placed around a to-be-machined point 5 diagonally, the to-be-machined point 5 generates thermal expansion due to heat accumulation, surrounding air is extruded to cause vibration, ultrasonic waves generated by the vibration are diffused around the to-be-machined point 5 to the periphery, and ultrasonic signals detected by the 2 detectors 2 close to laser beams are strongest and are kept consistent; the ultrasonic signals detected by the 2 detectors 2 far away from the laser beam are relatively weak and can be consistent although certain multiband interference signals exist, as shown in fig. 5;
when the ultrasonic signals detected by the 4 detectors 2 keep consistent pairwise and are maintained until the strip-shaped structure is processed, it is indicated that the processing defect does not occur in the processed workpiece 1, and the processing is completed smoothly.
Example 4:
when a strip-shaped non-rotational symmetric structure is processed by using laser, 4 opposite angles of the detectors 2 are selected and placed around a point 5 to be processed, the point 5 to be processed is subjected to thermal expansion due to heat accumulation, surrounding air is extruded to cause vibration, ultrasonic waves generated by the vibration are diffused around the point 5 to be processed to the periphery, and if cracks appear in a certain direction around the point 5 to be processed by using laser, ultrasonic signals detected by the 4 detectors 2 are different, as shown in fig. 6;
when the ultrasonic signals detected by the 4 detectors 2 are in a deviation state and are maintained for 3 detection periods, the processing defect of the processed workpiece 1 is indicated, and the processing is terminated.
Example 5:
when a strip-shaped non-rotational symmetrical structure is machined by using laser, 4 opposite angles of the detectors 2 are selected to be placed around a point 5 to be machined, the point 5 to be machined generates thermal expansion behavior due to heat accumulation, surrounding air is extruded to cause vibration, ultrasonic waves generated by the vibration are diffused around the point 5 to be machined to the periphery, if a crack occurs in a certain direction of the machining structure far away from the point 5 to be machined, ultrasonic signals detected by the 2 detectors 2 close to the point 5 to be machined by using the laser can be kept consistent at the moment, but the ultrasonic signals detected by the detectors 2 close to the crack direction have obvious deviation, as shown in fig. 7;
when the ultrasonic signals detected by the 4 detectors 2 have deviation state and maintain for 3 detection periods, it indicates that the processing defect occurs in the processed workpiece 1, and the processing is terminated.
In the description of the present invention, it is to be understood that the terms "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on those shown in the drawings, are merely for convenience of description of the present invention, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present invention.
The above-described embodiments are only intended to illustrate the preferred embodiments of the present invention, and not to limit the scope of the present invention, and various modifications and improvements made to the technical solution of the present invention by those skilled in the art without departing from the spirit of the present invention should fall within the protection scope defined by the claims of the present invention.
Claims (9)
1. A real-time detection method for workpiece defects in a laser processing process is characterized by comprising the following steps:
placing a processing workpiece (1) on a workbench; aligning a laser beam (4) to a point (5) to be processed of the workpiece (1); arranging the detection assembly around the point (5) to be processed in a semi-surrounding or surrounding manner; the point (5) to be processed generates heat accumulation in the processing process, the thermal expansion behavior of the processed workpiece (1) is caused, so that the surrounding air is extruded to generate vibration, and the vibration signal is detected through the detection assembly.
2. The method of claim 1 for real-time detection of workpiece defects during laser machining, comprising: the monitoring assembly comprises a detector (2), a signal line (3) and an upper computer (6); the detectors (2) are arranged in a plurality, and the detectors (2) are arranged in a semi-surrounding manner or in a surrounding manner on the point (5) to be processed; each detector (2) is electrically connected with the upper computer (6) through the signal wire (3).
3. The method of claim 1 for real-time detection of workpiece defects during laser machining, comprising: when the point (5) to be processed is in a circular hole-shaped rotational symmetric structure, a plurality of detectors (2) are arranged on the periphery of the point (5) to be processed; when the vibration signals detected by each detector (2) are consistent, the processed workpiece (1) is free of defects.
4. The method of claim 3, wherein the real-time detection of the defects of the workpiece during the laser processing comprises: when the vibration signal detected by the detector (2) has deviation, and the deviation is maintained for at least three detection periods, the processing workpiece (1) has processing defects.
5. The method of claim 1 for real-time detection of workpiece defects during laser machining, comprising: when the point (5) to be processed is of a strip-shaped non-rotational symmetrical structure, a plurality of detectors (2) are arranged on the periphery of the point (5) to be processed; and when the signals of the detectors (2) close to the point (5) to be processed are consistent, and the signals of the detectors (2) far away from the point (5) to be processed are also consistent, the processed workpiece (1) is free of defects.
6. The method of claim 5, wherein the real-time detection of the defects of the workpiece during the laser processing comprises: when the vibration signals detected by each detector (2) are different and the deviation is maintained for at least three detection periods, the peripheral side of the point (5) to be processed has processing defects.
7. The method of claim 5 for real-time detection of workpiece defects during laser machining, wherein: when the signals of the detectors (2) close to the point (5) to be processed are consistent, and the vibration signals detected by the detectors (2) far away from the point (5) to be processed are deviated, the deviation is maintained for at least three detection periods, and the far side of the point (5) to be processed has processing defects.
8. The method of claim 1 for real-time detection of workpiece defects during laser machining, comprising: when the surface of the processing workpiece (1) is coated with an ultrasonic couplant.
9. Root of herbaceous plantThe method for real-time detection of defects in a workpiece during laser machining according to claim 1, wherein: the emergent energy of the laser beam (4) is more than or equal to 10 -6 μJ。
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