CN115682767B - Manifold shunting layer and manifold micro-column array flat plate heat exchanger thereof - Google Patents
Manifold shunting layer and manifold micro-column array flat plate heat exchanger thereof Download PDFInfo
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- CN115682767B CN115682767B CN202211361095.0A CN202211361095A CN115682767B CN 115682767 B CN115682767 B CN 115682767B CN 202211361095 A CN202211361095 A CN 202211361095A CN 115682767 B CN115682767 B CN 115682767B
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
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- Thermal Sciences (AREA)
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- General Engineering & Computer Science (AREA)
- Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention provides a manifold split layer, which comprises an inlet manifold inflow channel and an outlet manifold outflow opening which are arranged on the upper surface of the manifold split layer, and an inlet manifold and an outlet manifold which are arranged on the lower surface of the manifold split layer, wherein the inlet manifold inflow channel comprises two mutually parallel inlet manifold inflow channels which are arranged on two opposite ends, the extending direction of the inlet manifold inflow channel is perpendicular to a first direction, and one tail end of each inlet manifold inflow channel is communicated with a fluid inlet channel; the outlet manifold outflow port is arranged at the middle position of the upper surface of the manifold flow dividing layer and is communicated with the fluid outlet flow passage; the inlet manifold is communicated with the inlet manifold inflow channel, and the outlet manifold is communicated with the outlet manifold outflow channel; the inlet manifold and the outlet manifold are arranged at intervals and between the two inlet manifold inflow channels, the inlet manifold is communicated with the two inlet manifold inflow channels, and the outlet manifold is not communicated with the two inlet manifold inflow channels. The manifold split layer divides the inlet manifold inflow channels into two channels, so that impact of fluid on the micro-column array layer can be enhanced, and the overall heat dissipation performance is improved.
Description
Technical Field
The invention relates to a heat exchanger technology, in particular to a flat plate heat exchanger, and belongs to the field of heat pipes of F28d 15/02.
Background
A heat exchanger is a device that exchanges heat with a hot and cold fluid, also known as a heat exchanger. Heat exchangers are widely used in many fields. Because the working scene is special in the fields such as electronics, petrifaction, communication, aerospace and the like, the heat exchanger has special requirements on the size and the weight, and the heat exchange capability is required to be stronger.
In 1981, a learner proposed to utilize a micro-channel to dissipate heat, so that the volume of the heat exchanger can be reduced, and the heat exchange capacity of the heat exchanger can be greatly improved by utilizing the higher specific surface area of the micro-channel. However, although the heat exchange capacity is strong, the overall pressure loss is also high due to the small hydraulic diameter of the microchannels.
The micro-channel is a high-efficiency heat management scheme, and the basic principle is that fluid flows through the micro-channel under the action of a driving pump and carries heat generated by electronic devices in the flowing process, so that a cooling effect is realized. However, the high heat dissipation performance is at the cost of huge pumping power and electric energy consumption. The special manifold structure of the manifold micro-channel not only can greatly reduce the pumping power consumption of the original micro-channel heat sink, but also can further strengthen the heat dissipation performance of the manifold micro-channel heat sink. However, extensive research has shown that the distribution of fluid within the manifold microchannels is not uniform, resulting in a non-uniform temperature distribution. It is important to further reduce the pumping power consumption of the manifold microchannel heat sink while enhancing its heat dissipation and improving its temperature profile.
Patent CN201811088661.9 discloses a manifold type jet micro-channel heat exchanger, which promotes heat exchange by jet enhanced disturbance and improves the temperature distribution characteristic of the bottom thereof. Patent CN202010790271.2 discloses a manifold type microchannel heat exchanger with high aspect ratio, which improves heat exchange area and effectively reduces pressure drop. However, both of these patents do not achieve structural optimization of the manifold microchannels, and have limited utility in addressing their primary problems.
Disclosure of Invention
In order to solve the problems, the invention provides a manifold micro-column array heat exchanger scheme which can reduce pumping power consumption, strengthen heat dissipation and realize uniform temperature distribution.
In order to achieve the above object, the technical scheme of the present invention is as follows:
a manifold branching layer including an inlet manifold inflow channel and an outlet manifold outflow opening provided at an upper face of the manifold branching layer, and an inlet manifold and an outlet manifold provided at a lower face of the manifold branching layer, the inlet manifold inflow channel including two mutually parallel pieces provided at opposite ends, an extending direction of the inlet manifold inflow channel being perpendicular to the first direction and one end of each of the inlet manifold inflow channels communicating with the fluid inlet channel; the outlet manifold outflow port is arranged at the middle position of the upper surface of the manifold flow dividing layer and is communicated with the fluid outlet flow passage; the inlet manifold is communicated with the inlet manifold inflow channel, and the outlet manifold is communicated with the outlet manifold outflow channel; the inlet manifold and the outlet manifold are arranged at intervals and between the two inlet manifold inflow channels, the inlet manifold is communicated with the two inlet manifold inflow channels, and the outlet manifold is not communicated with the two inlet manifold inflow channels.
Preferably, the inlet manifold is selected to have a tapered configuration that gradually tapers in the direction of flow and the outlet manifold is selected to have a tapered configuration that gradually tapers in the direction of flow.
Preferably, the heat exchange capacity of the column at the outlet manifold location is greater than the heat exchange capacity of the column at the inlet manifold location.
Preferably, the fluid outlet flow passage has a tapered structure, and the flow area gradually increases from the fluid inlet flow passage side in the extending direction.
Preferably, the diameter ratio of the inlet manifold side cylinder to the outlet manifold side cylinder should be 1.5-2.
The manifold micro-column array flat plate heat exchanger is characterized in that a fluid inlet and outlet layer, a manifold flow dividing layer and a micro-column array layer are sequentially arranged from top to bottom, the fluid inlet and outlet layer comprises an upper surface and a lower surface, a fluid inlet channel and a fluid outlet channel are arranged on the lower surface, the fluid inlet is communicated with the fluid inlet channel, the fluid outlet is communicated with the fluid outlet channel, the fluid inlet channel is arranged at a first end part of the lower surface and extends along the first end along a first direction, and the fluid outlet channel is arranged at the middle position of the lower surface and extends along a direction perpendicular to the fluid inlet channel;
the micro-column array layer comprises a plurality of columns arranged on the upper surface, gap flow channels for fluid flow are arranged between the columns, and the manifold split layer is the manifold split layer.
Preferably, the distribution density of the columns at the outlet manifold location is greater than the distribution density of the columns at the inlet manifold location.
Compared with the prior art, the invention has the following advantages:
1) The invention improves the prior flat plate heat exchanger, and the number of the inflow channels of the inlet manifold is two, so that the directions of fluid flowing into the inlet manifold are two, and the fluid is impacted in the inlet manifold, thereby strengthening the impact of the fluid on the micro-column array layer and improving the overall heat dissipation performance.
2) The invention selects the tapered structure gradually shrinking along the flowing direction through the inlet manifold, and the tapered structure gradually expanding along the flowing direction through the outlet manifold, which can promote the uniform distribution of fluid and reduce the whole flowing resistance, thus not only improving the uniformity of the temperature distribution of the bottom surface, but also reducing the pumping power consumption.
3) According to the invention, the microcolumn with variable diameter is selected, so that the microcolumn heat exchange capacity at the outlet manifold side is better, the overall heat exchange is enhanced, and the uniform distribution of the bottom surface temperature is realized.
4) The flat plate heat exchanger has the advantages of compact structure and large internal heat exchange area, and can realize structural miniaturization.
Drawings
FIG. 1 is a block diagram of the plate heat exchanger of the present invention;
FIG. 2 is a view showing the structure of the underside of the inlet/outlet layer of the flat plate heat exchanger according to the present invention;
FIG. 3 is a diagram of the upper side of the manifold split layer of the flat plate heat exchanger of the present invention;
FIG. 4 is a diagram of the underside of the manifold split layer of the miniature flat plate heat exchanger of the present invention;
FIG. 5 is a schematic view of the inlet manifold structure and flow of the miniature flat plate heat exchanger of the present invention;
FIG. 6 is a schematic view of the outlet manifold structure and flow of the present invention;
FIG. 7 is a diagram of the entire and partial construction of a micropillar array of a miniature plate heat exchanger of the present invention;
fig. 8 is a schematic overall flow diagram of a miniature flat plate heat exchanger of the present invention.
Reference numerals:
1 a fluid inlet and outlet layer, 11 a fluid inlet, 12 a fluid inlet flow channel, 13 a fluid outlet flow channel and 14 a fluid outlet; 2 manifold split layer, 21 inlet manifold inflow channel, 22 inlet manifold, 23 outlet manifold, 24 outlet manifold outflow; 3 micro-column array layer, 31 micro-columns, 32 micro-column gap flow channels.
Detailed Description
The following describes the embodiments of the present invention in detail with reference to the drawings.
Figures 1-8 disclose a manifold micro-column array plate heat exchanger. As shown in fig. 1, the manifold micro-column array plate heat exchanger is provided with a fluid inlet and outlet layer 1, a manifold shunt layer 2 and a micro-column array layer 3 from top to bottom in sequence, and the three layers are combined to form the complete manifold micro-column array heat exchanger.
As shown in fig. 1 and 2, the fluid inlet and outlet layer 1 includes an upper face provided with a fluid inlet 11 and a fluid outlet 14, and a lower face provided with a fluid inlet flow channel 12 and a fluid outlet flow channel 13, the fluid inlet 11 being in communication with the fluid inlet flow channel 12, the fluid outlet 14 being in communication with the fluid outlet flow channel 13, the fluid inlet flow channel 12 being provided at a first end portion of the lower face and extending in a first end direction, i.e., in a first direction, and the fluid outlet flow channel 12 being provided at a middle position of the lower face and extending in a direction perpendicular to the fluid inlet flow channel (first direction).
As shown in fig. 3 and 4, the manifold branching layer 2 includes an inlet manifold inflow channel 21 and an outlet manifold outflow port 24 provided at an upper face of the manifold branching layer 2, and an inlet manifold 22 and an outlet manifold 23 provided at a lower face of the manifold branching layer 2, the inlet manifold inflow channel 21 including two inlet manifold inflow channels 21 provided at opposite ends in parallel to each other, the extending direction of the inlet manifold inflow channels 21 being perpendicular to the first direction and one end of each inlet manifold inflow channel 21 communicating with the fluid inlet channel 12; the outlet manifold outflow port 24 is provided at an intermediate position of the manifold split layer upper face and communicates with the fluid outlet flow passage 13; the inlet manifold 22 communicates with the inlet manifold inflow channel 21, and the outlet manifold 23 communicates with the outlet manifold outflow channel 24; the inlet manifold 22 and the outlet manifold 23 are arranged at intervals and between the two inlet manifold inflow channels 21, the inlet manifold 22 communicates with the two inlet manifold inflow channels, and the outlet manifold 23 does not communicate with the two inlet manifold inflow channels.
As shown in fig. 7, the micro-column array layer 3 includes a plurality of columns 31 provided on an upper face, and gap flow channels 32 for fluid flow are provided between the columns 31.
The workflow of the present invention is as follows in fig. 8: fluid flows from the fluid inlet 11 into the fluid inlet flow channel 12 and then into the inlet manifold inflow flow channel 21 and is distributed into the inlet manifold 22, and the fluid is forced to flow into the microcolumn gap flow channel 32 by impact in the middle of the inlet manifold 22 due to the opposite flow direction, and absorbs heat conducted by the microcolumns 31 in the process, thereby realizing a cooling effect. After the heat absorption of the fluid is finished, the fluid flows into the outlet manifold 23, flows out through the outlet manifold outflow port 24, then flows into the fluid outlet runner 13 and flows out from the fluid outlet 14, so that the whole flow heat exchange process is finished, the fluid is driven by an external driving pump and continuously flows into the manifold micro-column array heat sink, and the heat is continuously absorbed, so that the heat exchange is realized.
The invention improves the prior flat plate heat exchanger, and the number of the inflow channels of the inlet manifold is two, so that the directions of fluid flowing into the inlet manifold are two, and the fluid is impacted in the inlet manifold, thereby strengthening the impact of the fluid on the micro-column array layer and improving the overall heat dissipation performance. Because the inlet manifold has a larger hydraulic diameter and the gap size of the underlying micropillar array is smaller, plus the flow rate of the fluid is greater, more fluid will impinge within the inlet manifold and then transfer to the underlying micropillar array.
Preferably, the inlet manifold 22 is selected to have a tapered configuration that gradually narrows in the flow direction, and the outlet manifold 23 is selected to have a tapered configuration that gradually expands in the flow direction. Through the arrangement, the fluid can be uniformly distributed, and meanwhile, the overall flow resistance is reduced, so that the bottom surface temperature distribution uniformity can be improved, the pumping power consumption can be reduced, the continuous increase of the flow speed of the fluid is promoted, the impact force is further enhanced, the impact of the fluid on the micro-column array layer is further enhanced, and the overall heat dissipation performance is improved.
Preferably, the heat exchange capacity of the column 31 at the location of the outlet manifold 23 is greater than the heat exchange capacity of the column 31 at the location of the inlet manifold 22. The heat exchange at the position of the outlet manifold 23 is intensified in a targeted manner, so that the heat distribution is more uniform, the overall heat exchange is intensified, and the uniform distribution of the bottom surface temperature is realized. The fluid has lower temperature and has larger heat exchange temperature difference with the micro-column array layer, and has stronger heat exchange, while when the fluid is left at the outlet manifold, the fluid has higher temperature due to the fact that part of heat is absorbed in the previous flowing process, so the heat exchange temperature difference with the lower micro-column layer is reduced, and the heat exchange capacity is greatly reduced compared with that of the inlet manifold, so that the micro-column at the inlet manifold has more heat carried away, and the micro-column at the outlet manifold has less heat carried away, and the heat distribution of the bottom surface of the heat sink is uneven. When the micropillars are arranged into variable-diameter micropillars, the diameter of the micropillars at the inlet manifold side is larger, and the heat conduction resistance is also larger. This inhibits the fluid from absorbing heat there, thereby enhancing the heat transfer of the fluid at the outlet manifold to compensate for the attenuation of the heat transfer process caused by the gradual rise in fluid temperature. It should be noted that the diameter difference between the inlet and outlet micropillars may not be too large, which may make the heat exchange at the inlet manifold weak, and the heat exchange at the outlet manifold too intense, which may also cause uneven distribution of temperature. Therefore, according to the simulation structure and the practical application, the invention provides that the diameter ratio of the inlet manifold side micro-column to the outlet manifold side micro-column is preferably 1.5-2.
Preferably, the fluid inlet 11 and the fluid outlet 14 are provided at opposite ends, respectively. The fluid flow is more uniform, and the distribution area is wide.
Preferably, as shown in fig. 2, the fluid outlet flow passage 13 has a tapered structure, and the flow area gradually increases from the fluid inlet flow passage 12 side in the extending direction. The inlet manifold of the fluid gradually contracts along the flow direction, and the outlet manifold gradually increases in the flow area along the flow direction, because when the fluid flows through the inlet manifold, the fluid tends to flow along the manifold, so that a large amount of fluid gathers at the tail end, the micro-column area is also distributed with more fluid, and thus the maldistribution of the fluid is caused, the inlet manifold adopts a conical contraction structure, so that the fluid collides with the surface at the upper part of the manifold in the flow process, the fluid momentum changes, the downward speed is generated, the fluid distribution is more uniform, and the overall temperature distribution of the heat sink is also more uniform. The tapered configuration of the outlet manifold, which increases progressively in the direction of flow, is chosen because the fluid is progressively more in the direction of flow of the outlet manifold, such as where the flow through the root region of the outlet manifold is only a portion and where the flow is all after pooling, so that with this configuration the overall flow pressure drop can be reduced and, in conjunction with the inlet manifold, the overall fluid distribution can be more uniform, as demonstrated in the simulation.
Preferably, as shown in fig. 3, a plurality of outlet manifold outlets 24 are provided, and each outlet manifold outlet 24 corresponds to the outlet manifold of the lower face one by one.
Preferably, as shown in fig. 3, the inlet manifold inflow channels penetrate the entire manifold split layer in the up-down direction.
Preferably, the distribution density of the columns at the outlet manifold location is greater than the distribution density of the columns at the inlet manifold location. The heat exchange at the position of the outlet manifold 23 is intensified in a targeted manner, so that the heat distribution is more uniform, the overall heat exchange is intensified, and the uniform distribution of the bottom surface temperature is realized.
While the invention has been described in terms of preferred embodiments, the invention is not so limited. Various changes and modifications may be made by one skilled in the art without departing from the spirit and scope of the invention, and the scope of the invention should be assessed accordingly to that of the appended claims.
Claims (5)
1. The manifold micro-column array flat plate heat exchanger is characterized in that a fluid inlet and outlet layer, a manifold flow dividing layer and a micro-column array layer are sequentially arranged from top to bottom, the fluid inlet and outlet layer comprises an upper surface and a lower surface, a fluid inlet runner and a fluid outlet runner are arranged on the lower surface, the fluid inlet is communicated with the fluid inlet runner, the fluid outlet is communicated with the fluid outlet runner, the fluid inlet runner is arranged at a first end part of the lower surface and extends along the first end along a first direction, and the fluid outlet runner is arranged at the middle position of the lower surface and extends along a direction perpendicular to the fluid inlet runner;
the micro-column array layer includes a plurality of columns disposed at an upper face, gap flow channels for fluid flow are disposed between the columns, the manifold split layer includes inlet manifold inflow channels and outlet manifold outflow channels disposed at an upper face of the manifold split layer, and inlet manifold and outlet manifold disposed at a lower face of the manifold split layer, the inlet manifold inflow channels include two mutually parallel strips disposed at opposite ends, an extending direction of the inlet manifold inflow channels is perpendicular to a first direction and one end of each inlet manifold inflow channel is in communication with the fluid inlet channels; the outlet manifold outflow port is arranged at the middle position of the upper surface of the manifold flow dividing layer and is communicated with the fluid outlet flow passage; the inlet manifold is communicated with the inlet manifold inflow channel, and the outlet manifold is communicated with the outlet manifold outflow channel; the inlet manifold and the outlet manifold are arranged at intervals and between the two inlet manifold inflow channels, the inlet manifold is communicated with the two inlet manifold inflow channels, and the outlet manifold is not communicated with the two inlet manifold inflow channels; the heat exchange capacity of the column at the outlet manifold location is greater than the heat exchange capacity of the column at the inlet manifold location.
2. The manifold micro-column array plate heat exchanger of claim 1, wherein the inlet manifold selects a tapered configuration that gradually narrows in the flow direction and the outlet manifold selects a tapered configuration that gradually expands in the flow direction.
3. The manifold micro-column array plate heat exchanger of claim 1, wherein the fluid outlet flow channel has a tapered structure, and the flow area gradually increases from the fluid inlet flow channel side along the extending direction.
4. The manifold micro-column array plate heat exchanger of claim 1, wherein the ratio of the diameters of the inlet manifold side column and the outlet manifold side column is 1.5-2.
5. The manifold micro-column array plate heat exchanger of claim 1, wherein the distribution density of columns at the outlet manifold location is greater than the distribution density of columns at the inlet manifold location.
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| CN202211361095.0A CN115682767B (en) | 2021-12-20 | 2021-12-20 | Manifold shunting layer and manifold micro-column array flat plate heat exchanger thereof |
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| CN202111560703.6A CN114136129B (en) | 2021-12-20 | 2021-12-20 | Manifold micro-column array flat plate heat exchanger |
| CN202211361095.0A CN115682767B (en) | 2021-12-20 | 2021-12-20 | Manifold shunting layer and manifold micro-column array flat plate heat exchanger thereof |
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| CN202111560703.6A Division CN114136129B (en) | 2021-12-20 | 2021-12-20 | Manifold micro-column array flat plate heat exchanger |
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| CN115682767A CN115682767A (en) | 2023-02-03 |
| CN115682767B true CN115682767B (en) | 2023-09-22 |
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| CN202111560703.6A Active CN114136129B (en) | 2021-12-20 | 2021-12-20 | Manifold micro-column array flat plate heat exchanger |
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| CN115682796B (en) * | 2022-11-04 | 2023-11-10 | 山东高等技术研究院 | 3D printing porous medium cold plate and preparation process thereof |
| CN116428897B (en) * | 2022-11-04 | 2024-01-26 | 山东大学 | Plate heat exchanger of spindle-shaped hot runner |
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Also Published As
| Publication number | Publication date |
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| CN114136129B (en) | 2023-02-03 |
| CN114136129A (en) | 2022-03-04 |
| CN115682767A (en) | 2023-02-03 |
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