CN115682767A - Manifold flow distribution layer and manifold micro-column array flat plate heat exchanger thereof - Google Patents
Manifold flow distribution layer and manifold micro-column array flat plate heat exchanger thereof Download PDFInfo
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
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Abstract
The invention provides a manifold flow distribution layer, which comprises an inlet manifold inflow runner and an outlet manifold outflow port which are arranged on the upper surface of the manifold flow distribution layer, and an inlet manifold and an outlet manifold which are arranged on the lower surface of the manifold flow distribution layer, wherein the inlet manifold inflow runner comprises two parallel inlet manifolds which are arranged on two opposite end parts, the extending direction of the inlet manifold inflow runner is vertical to a first direction, and one tail end of each inlet manifold inflow runner is communicated with a fluid inlet runner; the outlet manifold flow outlet is arranged in the middle of the upper surface of the manifold flow splitting layer and is communicated with the fluid outlet flow channel; the inlet manifold is communicated with the inlet manifold inflow runner, and the outlet manifold is communicated with the outlet manifold outflow runner; the inlet manifold and the outlet manifold are arranged at intervals and are arranged between the two inlet manifold inflow runners, the inlet manifold is communicated with the two inlet manifold inflow runners, and the outlet manifold is not communicated with the two inlet manifold inflow runners. The manifold branch flow distribution layer divides the inlet manifold into two inflow runners, so that the impact of fluid on the micro-column array layer can be strengthened, and the integral heat dissipation performance is improved.
Description
Technical Field
The invention relates to a heat exchanger technology, in particular to a flat plate heat exchanger, and belongs to the field of F28d15/02 heat pipes.
Background
The heat exchanger is a device for exchanging heat between cold and hot fluids, and is also called a heat exchanger. Heat exchangers are widely used in many fields. In the fields of electronics, petrochemistry, communication, aerospace and the like, due to the fact that the working scene is special, special requirements are placed on the size and the weight of the heat exchanger, and the heat exchange capacity of the heat exchanger is required to be stronger.
In 1981, scholars propose that micro-channels are used for heat dissipation, so that the volume of the heat exchanger can be reduced, and the heat exchange capacity of the heat exchanger can be greatly improved by utilizing the higher specific surface area of the micro-channels. However, although the heat exchange capacity is strong, the overall pressure loss is high due to the small hydraulic diameter of the micro-channel.
The microchannel is an efficient heat management scheme, and the basic principle of the microchannel is that fluid flows through the microchannel under the action of a driving pump and carries away heat generated by electronic devices in the flowing process to realize a cooling effect. However, its high heat dissipation comes at the expense of a large pump function and power consumption. The special manifold structure of the manifold microchannel not only can greatly reduce the pumping work consumption of the original microchannel heat sink, but also can further strengthen the heat dissipation performance of the manifold microchannel. However, a number of studies have shown that the fluid distribution in the manifold microchannels is not uniform, resulting in non-uniform temperature distribution. It is important to further reduce the pumping work consumption of the manifold microchannel heat sink while enhancing its heat dissipation and improving its temperature distribution characteristics.
Patent CN201811088661.9 discloses a manifold type jet micro-channel heat exchanger, which promotes heat exchange through jet enhanced disturbance and improves the temperature distribution characteristic of the bottom of the heat exchanger. Patent CN202010790271.2 discloses a manifold type microchannel heat exchanger with high aspect ratio, which increases heat exchange area and effectively reduces pressure drop. However, neither patent achieves structural optimization of the manifold microchannel, and has limited effect on solving the main problems thereof.
Disclosure of Invention
In order to solve the problems, the invention provides a manifold micro-column array heat exchanger scheme which can reduce the pump power consumption, strengthen the heat dissipation and realize the uniform temperature distribution.
In order to achieve the purpose, the technical scheme of the invention is as follows:
a manifold flow-splitting layer comprises an inlet manifold inflow channel and an outlet manifold outflow channel which are arranged on the upper surface of the manifold flow-splitting layer, and an inlet manifold and an outlet manifold which are arranged on the lower surface of the manifold flow-splitting layer, wherein the inlet manifold inflow channel comprises two parallel inlet channels which are arranged on two opposite end parts, the extending direction of the inlet manifold inflow channel is vertical to a first direction, and one tail end of each inlet manifold inflow channel is communicated with a fluid inlet channel; the outlet manifold flow outlet is arranged in the middle of the upper surface of the manifold flow distribution layer and is communicated with the fluid outlet flow channel; the inlet manifold is communicated with the inlet manifold inflow runner, and the outlet manifold is communicated with the outlet manifold outflow runner; the inlet manifold and the outlet manifold are arranged at intervals and are arranged between the two inlet manifold inflow runners, the inlet manifold is communicated with the two inlet manifold inflow runners, and the outlet manifold is not communicated with the two inlet manifold inflow runners.
Preferably, the inlet manifold is a tapered structure which gradually shrinks along the flow direction, and the outlet manifold is a tapered structure which gradually enlarges along the flow direction.
Preferably, the heat exchange capacity of the cylinders at the location of the outlet manifold is greater than the heat exchange capacity of the cylinders at the location of the inlet manifold.
Preferably, the fluid outlet flow passage has a tapered configuration, and the flow area gradually increases from the fluid inlet flow passage side along the extending direction.
Preferably, the diameter ratio of the inlet manifold side column to the outlet manifold side column is 1.5 to 2.
A manifold micro-column array flat plate heat exchanger is provided with a fluid inlet and outlet layer, a manifold flow distribution layer and a micro-column array layer from top to bottom in sequence, wherein the fluid inlet and outlet layer comprises an upper surface and a lower surface, a fluid inlet and a fluid outlet are arranged on the upper surface, a fluid inlet flow channel and a fluid outlet flow channel are arranged on the lower surface, the fluid inlet is communicated with the fluid inlet flow channel, the fluid outlet is communicated with the fluid outlet flow channel, the fluid inlet flow channel is arranged at a first end part of the lower surface and extends along a first direction, and the fluid outlet flow channel is arranged at the middle position of the lower surface and extends along a direction perpendicular to the fluid inlet flow channel;
the micro-column array layer comprises a plurality of columns arranged on the upper surface, gap flow channels for fluid to flow are arranged among the columns, and the manifold flow distribution layer is the manifold flow distribution layer.
Preferably, the distribution density of the pillars at the outlet manifold position is greater than the distribution density of the pillars at the inlet manifold position.
Compared with the prior art, the invention has the following advantages:
1) The invention improves the prior flat plate heat exchanger, and the inlet manifold inflow flow channel is arranged into two channels, so that the directions of fluid flowing into the inlet manifold are two, and the fluid is impacted in the inlet manifold, thereby reinforcing the impact of the fluid on the micro-column array layer and improving the integral heat radiation performance.
2) According to the invention, the inlet manifold selects the tapered structure gradually shrinking along the flow direction, and the outlet manifold selects the tapered structure gradually expanding along the flow direction, so that the fluid can be uniformly distributed, the integral flow resistance is reduced, and therefore, the uniformity of the temperature distribution on the bottom surface can be improved, and the pump power consumption can be reduced.
3) The diameter-variable microcolumns are selected through the microcolumns, and the microcolumns on the outlet manifold side have better heat exchange capacity, so that the integral heat exchange is enhanced, and the uniform distribution of the bottom surface temperature is realized.
4) The flat plate heat exchanger has compact structure and large internal heat exchange area, and can realize structural miniaturization.
Drawings
FIG. 1 is an overall configuration of a flat plate heat exchanger according to the present invention;
FIG. 2 is a lower side structure view of the inlet and outlet layers of the flat plate heat exchanger of the present invention;
FIG. 3 is a top view of the manifold of the present invention;
FIG. 4 is a view of the underside of the manifold of the micro-plate heat exchanger according to the present invention;
FIG. 5 is a schematic view of the inlet manifold structure and flow of the micro-plate heat exchanger of the present invention;
FIG. 6 is a schematic view of the outlet manifold structure and flow of the present invention;
FIG. 7 is a view of the entire structure and a part of the micro-column array of the micro-plate heat exchanger according to the present invention;
fig. 8 is a schematic view of the overall flow of the micro-plate heat exchanger of the present invention.
Reference numerals:
1 fluid inlet and outlet layer, 11 fluid inlet, 12 fluid inlet flow channel, 13 fluid outlet flow channel and 14 fluid outlet; 2 manifold split layer, 21 inlet manifold inflow runner, 22 inlet manifold, 23 outlet manifold, 24 outlet manifold outflow; 3 micro-column array layers, 31 micro-columns and 32 micro-column gap flow channels.
Detailed Description
The following detailed description of embodiments of the invention refers to the accompanying drawings.
Fig. 1-8 disclose a manifold micro-column array plate heat exchanger. As shown in fig. 1, the manifold micro-column array flat plate heat exchanger is sequentially provided with a fluid inlet and outlet layer 1, a manifold flow splitting layer 2 and a micro-column array layer 3 from top to bottom, and the three layers are combined to form the complete manifold micro-column array heat exchanger.
As shown in fig. 1 and 2, the fluid inlet/outlet layer 1 includes an upper surface and a lower surface, the upper surface is provided with a fluid inlet 11 and a fluid outlet 14, the lower surface is provided with a fluid inlet flow passage 12 and a fluid outlet flow passage 13, the fluid inlet 11 is communicated with the fluid inlet flow passage 12, the fluid outlet 14 is communicated with the fluid outlet flow passage 13, the fluid inlet flow passage 12 is arranged at a first end of the lower surface and extends along a first end direction, i.e., along a first direction, and the fluid outlet flow passage 12 is arranged at a middle position of the lower surface and extends along a direction (first direction) perpendicular to the fluid inlet flow passage.
As shown in fig. 3 and 4, the manifold flow distribution layer 2 includes an inlet manifold inflow channel 21 and an outlet manifold outflow channel 24 disposed on the upper surface of the manifold flow distribution layer 2, and an inlet manifold 22 and an outlet manifold 23 disposed on the lower surface of the manifold flow distribution layer 2, the inlet manifold inflow channel 21 includes two inlet manifold inflow channels 21 disposed at opposite ends and parallel to each other, the extending direction of the inlet manifold inflow channels 21 is perpendicular to the first direction and one end of each of the inlet manifold inflow channels 21 communicates with the fluid inlet channel 12; the outlet manifold flow outlet 24 is arranged in the middle of the upper surface of the manifold flow-dividing layer and is communicated with the fluid outlet flow channel 13; the inlet manifold 22 is communicated with the inlet manifold inflow channel 21, and the outlet manifold 23 is communicated with the outlet manifold outflow channel 24; the inlet manifold 22 and the outlet manifold 23 are arranged at intervals and between the two inlet manifold inflow channels 21, the inlet manifold 22 is communicated with the two inlet manifold inflow channels, and the outlet manifold 23 is not communicated with the two inlet manifold inflow channels.
As shown in fig. 7, the micropillar array layer 3 includes a plurality of pillars 31 disposed on the upper surface, and interstitial flow channels 32 for fluid flow are disposed between the pillars 31.
The working flow of the invention is as follows as shown in figure 8: the fluid flows into the fluid inlet flow channels 12 from the fluid inlet 11, then flows into the inlet manifold inflow flow channels 21 and is distributed into the inlet manifold 22, the fluid is opposite in flow direction at the inlet manifold 22, so that impact occurs therebetween and is forced to flow into the micro-column gap flow channels 32, and heat conducted by the micro-columns 31 is absorbed in the process, and a cooling effect is achieved. After heat absorption of the fluid is finished, the fluid flows into the outlet manifold 23, flows out through the outlet manifold outflow port 24, then converges into the fluid outlet runner 13, and flows out at the fluid outlet 14, so that the whole flowing heat exchange process is finished, the fluid is driven by an external driving pump and continuously flows into the manifold micropillar array heat sink to continuously absorb heat, and heat exchange is realized.
The invention improves the prior flat plate heat exchanger, and the inlet manifold inflow flow channel is arranged into two channels, so that the directions of fluid flowing into the inlet manifold are two, and the fluid is impacted in the inlet manifold, thereby reinforcing the impact of the fluid on the micro-column array layer and improving the integral heat radiation performance. Because the hydraulic diameter of the inlet manifold is larger, the gap size of the lower micro-column array is smaller, and the flow velocity of the fluid is larger, more fluid can collide in the inlet manifold and then transfer to the lower micro-column array layer.
Preferably, the inlet manifold 22 is selected to have a tapered configuration that gradually tapers in the direction of flow, and the outlet manifold 23 is selected to have a tapered configuration that gradually widens in the direction of flow. Through so setting up, can make fluid evenly distributed reduce whole flow resistance simultaneously, consequently it both can improve bottom surface temperature distribution homogeneity, can reduce the pump work consumption again, promotes the continuous increase of fluidic velocity of flow, and further striking dynamics further strengthens the impact of fluid to the microcolumn array layer, improves whole heat dispersion.
Preferably, the heat exchange capacity of column 31 at the location of outlet manifold 23 is greater than the heat exchange capacity of column 31 at the location of inlet manifold 22. By pertinently reinforcing the heat exchange at the position of the outlet manifold 23, the heat distribution can be more uniform, the integral heat exchange is reinforced, and the uniform distribution of the bottom surface temperature is realized. Because the fluid has not taken place violent heat transfer process with lower floor's micropillar array layer at the entry manifold yet, therefore the fluid temperature is lower this moment, and is great with micropillar array layer heat transfer difference in temperature, and the heat transfer is comparatively violent, and when the fluid stayed export manifold department, because some heat has been absorbed in the flow process before this, the fluid temperature rose, consequently with the heat transfer difference in temperature reduction of lower floor's micropillar layer, heat transfer capacity compares with entry manifold department and reduces by a wide margin, this can lead to the micropillar of entry manifold department to be carried away the heat many, the heat that exit manifold department micropillar was carried away is few, this can cause heat sink bottom surface temperature distribution inequality. When the micro-column is set as a variable-diameter micro-column, the diameter of the micro-column on the inlet manifold side is larger, and the heat conduction and heat resistance is also larger. This inhibits the fluid from absorbing heat therefrom, thereby enhancing heat transfer from the fluid at the outlet manifold to compensate for the impairment of the heat transfer process caused by the gradual rise in fluid temperature. It should be noted that the diameter difference between the inlet and outlet microcolumns may not be too large, which may cause weak heat exchange at the inlet manifold, too strong heat exchange at the outlet manifold, and uneven temperature distribution. Therefore, according to the simulation structure and the practical application thereof, the invention proposes that the diameter ratio of the inlet manifold side microcolumn to the outlet manifold side microcolumn is more suitable between 1.5 to 2.
Preferably, the fluid inlet 11 and the fluid outlet 14 are disposed at opposite ends, respectively. The fluid flow is more uniform and the distribution area is wide.
Preferably, as shown in fig. 2, the fluid outlet channel 13 has a tapered structure, and the flow area gradually increases from the fluid inlet channel 12 side along the extending direction. The inlet manifold of the fluid gradually shrinks along the flowing direction, and the flowing area of the outlet manifold gradually increases along the flowing direction because when the fluid flows through the inlet manifold, the fluid is more prone to flow along the manifold, so that a large amount of fluid is gathered at the tail end, and the micro-column area is also distributed with more fluid, so that the fluid is unevenly distributed. The outlet manifold is selected to be tapered so as to increase gradually in the flow direction because the fluid is increased gradually in the flow direction of the outlet manifold, for example, the fluid flowing through the root region of the outlet manifold is only a part, and the fluid is all collected at the outlet region, so that the overall flow pressure drop can be reduced by adopting the structure, and the structure can be cooperated with the inlet manifold so as to enable the overall fluid distribution to be more uniform, which is proved in simulation work.
Preferably, as shown in fig. 3, a plurality of outlet manifold flow outlets 24 are provided, and each outlet manifold flow outlet 24 corresponds to an outlet manifold of the lower face one by one.
Preferably, as shown in fig. 3, the inlet manifold inlet channels extend vertically through the entire manifold diverter layer.
Preferably, the distribution density of the pillars at the outlet manifold position is greater than the distribution density of the pillars at the inlet manifold position. By pertinently reinforcing the heat exchange at the position of the outlet manifold 23, the heat distribution can be more uniform, the integral heat exchange is reinforced, and the uniform distribution of the bottom surface temperature is realized.
Although the present invention has been described with reference to the preferred embodiments, it is not limited thereto. Various changes and modifications may be effected therein by one skilled in the art without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (7)
1. A manifold flow-splitting layer comprises an inlet manifold inflow channel and an outlet manifold outflow channel which are arranged on the upper surface of the manifold flow-splitting layer, and an inlet manifold and an outlet manifold which are arranged on the lower surface of the manifold flow-splitting layer, wherein the inlet manifold inflow channel comprises two parallel inlet channels which are arranged on two opposite end parts, the extending direction of the inlet manifold inflow channel is vertical to a first direction, and one tail end of each inlet manifold inflow channel is communicated with a fluid inlet channel; the outlet manifold flow outlet is arranged in the middle of the upper surface of the manifold flow splitting layer and is communicated with the fluid outlet flow channel; the inlet manifold is communicated with the inlet manifold inflow runner, and the outlet manifold is communicated with the outlet manifold outflow runner; the inlet manifold and the outlet manifold are arranged at intervals and are arranged between the two inlet manifold inflow runners, the inlet manifold is communicated with the two inlet manifold inflow runners, and the outlet manifold is not communicated with the two inlet manifold inflow runners.
2. The manifold diverter layer according to claim 1 wherein the inlet manifold is tapered to gradually narrow in the direction of flow and the outlet manifold is tapered to gradually expand in the direction of flow.
3. The manifold diverter layer according to claim 1, wherein the heat exchange capacity of the cylinders at the outlet manifold location is greater than the heat exchange capacity of the cylinders at the inlet manifold location.
4. The manifold diverter layer according to claim 1 wherein the fluid outlet channel is tapered to increase in flow area along the extension from the fluid inlet channel side.
5. The manifold branching layer as claimed in claim 1, wherein the diameter ratio of the inlet manifold side cylinder to the outlet manifold side cylinder is 1.5 to 2.
6. A manifold micro-column array flat plate heat exchanger is provided with a fluid inlet and outlet layer, a manifold flow distribution layer and a micro-column array layer from top to bottom in sequence, wherein the fluid inlet and outlet layer comprises an upper surface and a lower surface, a fluid inlet and a fluid outlet are arranged on the upper surface, a fluid inlet runner and a fluid outlet runner are arranged on the lower surface, the fluid inlet is communicated with the fluid inlet runner, the fluid outlet is communicated with the fluid outlet runner, the fluid inlet runner is arranged at a first end of the lower surface and extends along a first direction, and the fluid outlet runner is arranged at the middle position of the lower surface and extends along the direction perpendicular to the fluid inlet runner;
the micropillar array layer comprises a plurality of pillars disposed on the upper surface, interstitial flow channels for fluid flow are disposed between the pillars, and the manifold splitting layer is according to any one of claims 1 to 5.
7. The heat exchanger of claim 6, wherein the distribution density of the columns at the outlet manifold location is greater than the distribution density of the columns at the inlet manifold location.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202211361095.0A CN115682767B (en) | 2021-12-20 | 2021-12-20 | Manifold shunting layer and manifold micro-column array flat plate heat exchanger thereof |
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| CN202111560703.6A CN114136129B (en) | 2021-12-20 | 2021-12-20 | Manifold micro-column array flat plate heat exchanger |
| CN202211361095.0A CN115682767B (en) | 2021-12-20 | 2021-12-20 | Manifold shunting layer and manifold micro-column array flat plate heat exchanger thereof |
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| CN202111560703.6A Division CN114136129B (en) | 2021-12-20 | 2021-12-20 | Manifold micro-column array flat plate heat exchanger |
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| CN115682767B CN115682767B (en) | 2023-09-22 |
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| CN202111560703.6A Active CN114136129B (en) | 2021-12-20 | 2021-12-20 | Manifold micro-column array flat plate heat exchanger |
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| CN115682796B (en) * | 2022-11-04 | 2023-11-10 | 山东高等技术研究院 | 3D printing porous medium cold plate and preparation process thereof |
| CN116428897B (en) * | 2022-11-04 | 2024-01-26 | 山东大学 | Plate heat exchanger of spindle-shaped hot runner |
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| CN114136129B (en) | 2023-02-03 |
| CN114136129A (en) | 2022-03-04 |
| CN115682767B (en) | 2023-09-22 |
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