CN115294888A - Display module and display device - Google Patents
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- CN115294888A CN115294888A CN202211047480.8A CN202211047480A CN115294888A CN 115294888 A CN115294888 A CN 115294888A CN 202211047480 A CN202211047480 A CN 202211047480A CN 115294888 A CN115294888 A CN 115294888A
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- display module
- driving chip
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Images
Classifications
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
- G09F9/335—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes being organic light emitting diodes [OLED]
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
- G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
- G09G3/22—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
- G09G3/30—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
- G09G3/32—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
- G09G3/3208—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED]
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G2330/00—Aspects of power supply; Aspects of display protection and defect management
- G09G2330/04—Display protection
- G09G2330/045—Protection against panel overheating
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G2330/00—Aspects of power supply; Aspects of display protection and defect management
- G09G2330/12—Test circuits or failure detection circuits included in a display system, as permanent part thereof
Abstract
The disclosure provides a display module and a display device. This display module assembly includes: the display substrate comprises a display area, a bending area and a binding area, wherein the binding area is connected with the display area through the bending area; the driving chip is positioned on one side of the binding region, which is back to the display region; the main flexible circuit board is positioned on one side of the binding area, which is back to the display area, a concave part is arranged on one side of the main flexible circuit board, which faces the binding area, and the driving chip is positioned in the concave part; a processor connected with the main flexible circuit board; the heat detection component is connected with the main flexible circuit board and used for generating first feedback information according to the heat emitted by the driving chip; the processor acquires the first feedback information through the main flexible circuit board and is used for controlling the power of the driving chip according to the first feedback information. This openly can improve display module assembly's durability.
Description
Technical Field
The disclosure relates to the technical field of display, in particular to a display module and a display device.
Background
An OLED (Organic Light Emitting Diode) display device has a series of advantages such as an all-solid structure, self-luminescence, fast response speed, high brightness, a full viewing angle, and flexible display, and thus becomes a display device with high competitiveness and good development prospect. However, the current display devices still need to be improved.
Disclosure of Invention
An object of the present disclosure is to provide a display module and a display device, which can improve the durability of the display module.
According to an aspect of the present disclosure, there is provided a display module including:
the display substrate comprises a display area, a bending area and a binding area, wherein the bending area is arranged on one side of the display area and is bent towards the side away from the light emitting side of the display area, and the binding area is connected with the display area through the bending area;
the driving chip is arranged on the display substrate and is positioned on one side, back to the display area, of the binding area;
the main flexible circuit board is arranged on the display substrate and is positioned on one side of the binding region, which is opposite to the display region, a concave part is arranged on one side of the main flexible circuit board, which faces the binding region, and the driving chip is positioned in the concave part;
a processor connected with the main flexible circuit board;
the heat detection component is arranged on the display substrate, connected with the main flexible circuit board and used for generating first feedback information according to the heat emitted by the driving chip; the processor acquires the first feedback information through the main flexible circuit board and is used for controlling the power of the driving chip according to the first feedback information.
Further, the display module assembly still includes:
and one end of the connecting circuit board is connected with the heat detection part, and the other end of the connecting circuit board is connected with the main flexible circuit board.
Further, the display module assembly still includes:
the back plate is arranged on the backlight side of the display area, and the heat detection component is arranged in an area of the back plate corresponding to the driving chip.
Furthermore, the back plate is provided with a containing groove, and the partial area of the connecting circuit board and the heat detecting component are located in the containing groove.
Furthermore, the accommodating groove is strip-shaped and is parallel to the bending axis of the bending area.
Furthermore, the number of the driving chips is multiple, the main flexible circuit board is provided with a plurality of concave parts, and the driving chips are arranged in the concave parts in a one-to-one correspondence manner.
Further, the heat detecting part comprises a thermistor, and the thermistor is a positive temperature coefficient thermistor or a negative temperature coefficient thermistor.
Further, the thermistor is a positive temperature coefficient thermistor, the processor is used for acquiring the resistance value of the thermistor according to the first feedback information, and the power of the driving chip is reduced when the resistance value is larger than a first preset value; or
The thermistor is a negative temperature coefficient thermistor, and the processor is used for acquiring the resistance value of the thermistor according to the first feedback information and reducing the power of the driving chip when the resistance value is smaller than a second preset value.
Further, the backing plate comprises a stainless steel support layer or a titanium alloy support layer.
According to one aspect of the disclosure, a display device is provided, which comprises the display module.
This disclosed display module assembly and display device, when driver chip's high temperature, the treater can reduce driver chip's temperature according to first feedback information control driver chip's power, solves the problem of the ageing acceleration of display substrate that leads to because driver chip high temperature, improves display module assembly's durability and reliance.
Drawings
Fig. 1 is a schematic plan view of a display module according to an embodiment of the disclosure.
Fig. 2 isbase:Sub>A schematic cross-sectional viewbase:Sub>A-base:Sub>A of the structure shown in fig. 1.
Fig. 3 is a schematic cross-sectional view B-B of the structure shown in fig. 1.
Fig. 4 is a side view of the structure shown in fig. 1.
Fig. 5 is a schematic view of the connection circuit board before being connected to the main flexible circuit board in the structure shown in fig. 1.
Fig. 6 is a schematic view of the backplane and the connection circuit board in the structure shown in fig. 1.
Fig. 7 is a schematic diagram of the display module according to the embodiment of the disclosure.
Description of reference numerals: 1. a display substrate; 2. a protective film; 3. PI glue; 4. a back plate; 5. an adhesive tape; 6. a main flexible circuit board; 7. a driving chip; 8. a device region; 9. back gluing; 10. connecting the circuit board; 11. a heat detecting part; 12. a connection pad; 13. a containing groove; 14. a recessed portion; 100. a display area; 200. a bending zone; 300. a binding region.
Detailed Description
Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated. The implementations described in the exemplary implementations below do not represent all implementations consistent with the present disclosure. Rather, they are merely examples of devices consistent with certain aspects of the present disclosure, as detailed in the appended claims.
The terminology used in the disclosure is for the purpose of describing particular embodiments only and is not intended to be limiting of the disclosure. Unless otherwise defined, technical or scientific terms used herein should have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. The terms "first," "second," and the like, as used in the description and in the claims, do not denote any order, quantity, or importance, but rather are used to distinguish one element from another. Also, the use of the terms "a" or "an" and the like do not denote a limitation of quantity, but rather denote the presence of at least one. "plurality" or "a number" means two or more. Unless otherwise indicated, "front," "back," "lower," and/or "upper," and the like are for convenience of description, and are not limited to one position or one spatial orientation. The word "comprising" or "comprises", and the like, means that the element or item listed after "comprises" or "comprising" is inclusive of the element or item listed after "comprising" or "comprises", and the equivalent thereof, and does not exclude additional elements or items. The terms "connected" or "coupled" and the like are not restricted to physical or mechanical connections, but may include electrical connections, whether direct or indirect. As used in this disclosure and the appended claims, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should also be understood that the term "and/or" as used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items.
The disclosed embodiment provides a display module. As shown in fig. 1 to 4, the display module may include a display substrate 1, a driving chip 7, a main flexible circuit board 6, a processor, and a heat detecting part 11, wherein:
the display substrate 1 includes a display region 100, a bending region 200, and a bonding region 300 (see fig. 3). The bending region 200 is disposed at one side of the display region 100 and is bent toward a side away from the light emitting side of the display region 100. The bonding region 300 is connected to the display region 100 through the bending region 200. The driving chip 7 is disposed on the display substrate 1 and located on a side of the bonding region 300 opposite to the display region 100. The main flexible circuit board 6 is disposed on the display substrate 1 and located on a side of the bonding area 300 opposite to the display area 100. The main flexible circuit board 6 is provided with a recess 14 (see fig. 3) on a side facing the bonding area 300. The driver chip 7 is located in the recess 14. The processor is connected to the main flexible circuit board 6. The heat detecting member 11 (see fig. 2) is provided on the display substrate 1 and connected to the main flexible circuit board 6. The heat detecting part 11 is configured to generate first feedback information according to the heat emitted from the driving chip 7. The processor acquires the first feedback information through the main flexible circuit board 6 and is used for controlling the power of the driving chip 7 according to the first feedback information.
The display module assembly of the embodiment of the present disclosure, when the temperature of the driving chip 7 is too high, the processor controls the power of the driving chip 7 according to the first feedback information, so as to reduce the temperature of the driving chip 7, solve the problem of accelerated aging of the display substrate 1 caused by the too high temperature of the driving chip 7, and improve the durability and reliability of the display module assembly.
The following describes each part of the display module according to the embodiment of the present disclosure in detail:
the display substrate 1 may include a substrate and a light emitting structure. The substrate may be a rigid substrate. The rigid substrate may be a glass substrate or a PMMA (Polymethyl methacrylate) substrate. Of course, the substrate may also be a flexible substrate. The flexible substrate may be a PET (Polyethylene terephthalate) substrate, a PEN (Polyethylene naphthalate) substrate, or a PI (Polyimide) substrate.
The substrate may be provided with a drive transistor. The driving transistor may be a thin film transistor, but the disclosed embodiments are not limited thereto. The thin film transistor may be a top gate thin film transistor, and of course, the thin film transistor may also be a bottom gate thin film transistor. Taking the thin film transistor as a top gate thin film transistor as an example, the thin film transistor may include an active layer, a gate insulating layer, a gate electrode layer, an interlayer insulating layer, and a first source/drain electrode layer. The active layer may be disposed on the substrate. The gate insulating layer may be provided on the substrate and cover the active layer. The gate electrode layer may be provided on a side of the gate insulating layer away from the substrate. The interlayer insulating layer may be provided on the gate insulating layer and cover the gate electrode layer. The first source drain electrode layer may be disposed on the interlayer insulating layer and connected to the active layer via a via hole passing through the interlayer insulating layer and the gate insulating layer. The display substrate 1 may further include a first planarization layer, a second source/drain electrode layer, and a second planarization layer. The first planarization layer covers the first source-drain electrode layer and the interlayer insulating layer. The second source drain electrode layer may be provided on the first planarization layer and be connected to the first source drain electrode layer of the thin film transistor via a via hole passing through the first planarization layer. The second planarization layer may cover the second source-drain electrode layer.
The light emitting structure may include first and second electrodes disposed opposite each other and a light emitting layer between the first and second electrodes. The light emitting layer may be an organic electroluminescent layer, and certainly, may also be a quantum dot light emitting layer, which is not particularly limited in the embodiment of the present disclosure. The first electrode may be an anode and the second electrode may be a cathode, but the disclosure is not limited thereto. The first electrode may be disposed on a side of the second planarization layer facing away from the substrate. The first electrode is connected to the second source-drain electrode layer through a via hole passing through the second planarization layer. The display substrate 1 of the present disclosure may further include a pixel defining layer. The pixel defining layer covers the second planarizing layer and the first electrode. The pixel defining layer is provided with a pixel opening exposing the first electrode. The light emitting layer of the light emitting structure may be disposed on a side of the first electrode facing away from the substrate. The second electrode of the light-emitting structure is arranged on one side of the light-emitting layer, which is opposite to the substrate. The display substrate 1 may further comprise an encapsulation layer. The encapsulation layer may cover the light emitting structure. The encapsulation layer may include a first inorganic encapsulation layer, an organic encapsulation layer, and a second inorganic encapsulation layer. The first inorganic packaging layer and the second inorganic packaging layer are arranged oppositely, and the organic packaging layer is coated between the first inorganic packaging layer and the second inorganic packaging layer.
The display substrate 1 includes a display area 100, a bending area 200, and a bonding area 300. The bending region 200 is disposed at one side of the display region 100 and is bent toward a side away from the light emitting side of the display region 100. The bonding region 300 is connected to the display region 100 through the bending region 200. Wherein the binding area 300 may be disposed opposite to the display area 100. The light emitting structure may be disposed in the display area 100. The binding structure may not be provided with the light emitting structure described above. The bending region 200 may not be provided with the light emitting structure. The outside of the bending zone 200 may be provided with a backing adhesive 9 (see fig. 3).
The driving chip 7 is disposed on the display substrate 1 and located on a side of the bonding region 300 opposite to the display region 100. The driving chip 7 may be a Gate driver IC (Gate driver IC), and the driving chip 7 may also be a Source driver IC (Source driver IC), but the disclosure is not limited thereto, and the Gate driver IC and the Source driver IC may be integrated in the driving chip 7. The driving chip 7 may be connected to the pixel circuit in the display area 100 through a signal line. As shown in fig. 2 and fig. 3, the Main Flexible Printed Circuit board 6 (MFPC) is disposed on the display substrate 1 and located on a side of the bonding region 300 opposite to the display region 100. The main flexible circuit board 6 is provided with a recess 14 on a side facing the bonding area 300. The driver chip 7 is located in the recess 14. The main flexible circuit board 6 may be a circuit board of a multilayer board stack structure. The number of the driving chips 7 may be multiple, the main flexible circuit board 6 may also be provided with a plurality of recessed portions 14, and the plurality of driving chips 7 are correspondingly disposed in the plurality of recessed portions 14 one to one. In addition, the main flexible circuit board 6 may be further provided with a device region 8 for providing a capacitor, an inductor, and the like.
As shown in fig. 2, the heat detecting member 11 is provided on the display substrate 1. The heat detecting member 11 may include a thermistor. The thermistor may be a positive temperature coefficient thermistor (PTC thermistor), the resistance of which increases with increasing temperature. Of course, the thermistor may be a negative temperature coefficient thermistor (NTC thermistor), and the resistance of the negative temperature coefficient thermistor decreases as the temperature increases.
As shown in fig. 2, 4 and 5, the heat detecting member 11 may be connected to the main flexible circuit board 6. For example, the display module may further include a connection circuit board 10. The connection circuit board 10 has one end connected to the heat detecting unit 11 and the other end connected to the main flexible circuit board 6. Wherein the heat detecting member 11 may be bonded to the connection circuit board 10. The connection circuit board 10 may be electrically connected to the main flexible circuit board 6 through the wiring pads 12. The connection circuit board 10 may be a flexible circuit board. The shape of the connection circuit board 10 may be a strip shape, and the connection circuit board 10 may be parallel to the bending axis of the bending region 200, but the embodiment of the disclosure is not limited thereto. In other embodiments of the present disclosure, the heat detecting part 11 may be connected to the main flexible circuit board 6 in wireless communication.
The display module of the embodiment of the present disclosure may further include a back plate 4. The material of the back plate 4 may be stainless steel, titanium alloy, or the like. In one embodiment, the backing plate 4 comprises a stainless steel support layer. In another embodiment, the backing plate 4 comprises a titanium alloy support layer. The back plate 4 may be disposed on the backlight side of the display area 100, and the bonding area 300 may be connected to the back plate 4 by a bonding tape 5 (bonding tape). Wherein, a PI glue 3 and a protective film 2 (U-film) can be further arranged between the back plate 4 and the display area 100. The heat detecting member 11 may be disposed on a side of the back plate 4 facing away from the display area 100, i.e. the heat detecting member 11 may be disposed on a side of the back surface facing the bonding area 300. Specifically, the heat detecting component 11 may be disposed in an area of the back plate 4 corresponding to the driving chip 7, that is, an orthogonal projection of the heat detecting component 11 on the back plate 4 may at least partially coincide with an orthogonal projection of the driving chip 7 on the back plate 4. The connection circuit board 10 may be disposed on a side of the back plate 4 opposite to the display area 100, and the heat detecting member 11 may be disposed on a side of the connection circuit board 10 opposite to the back plate 4.
Further, as shown in fig. 6, the back plate 4 may be provided with a receiving groove 13. The partial area of the connection circuit board 10 and the heat detecting member 11 are located in the receiving groove 13. Taking the connecting circuit board 10 as a bar, the accommodating groove 13 may also be a bar, and the accommodating groove 13 may be parallel to the bending axis of the bending area 200. Taking the example that the heat detecting member 11 is bound to the connecting circuit board 10, the depth of the accommodating groove 13 may be equal to the sum of the thickness of the heat detecting member 11 and the thickness of the connecting circuit board 10, that is, the heat detecting member 11 disposed on the connecting circuit board 10 does not extend out of the accommodating groove 13.
The heat detecting part 11 is configured to generate first feedback information according to the heat emitted by the driving chip 7, and the processor acquires the first feedback information through the main flexible circuit board 6 and is configured to control the power of the driving chip 7 according to the first feedback information. Taking the heat detecting component 11 as a positive temperature coefficient thermistor as an example, the processor is configured to obtain a resistance value of the thermistor according to the first feedback information, and reduce the power of the driving chip 7 when the resistance value is greater than a first preset value, so as to reduce the temperature of the driving chip 7. The first preset value may be determined by experiment. Taking the heat detecting part 11 as a ntc thermistor as an example, the processor is configured to obtain a resistance value of the thermistor according to the first feedback information, and reduce the power of the driving chip 7 when the resistance value is smaller than a second preset value, so as to reduce the temperature of the driving chip 7. This second preset value can be determined experimentally. Specifically, as shown in fig. 7, the driving chip 7 operates to generate heat and transfer the heat to the thermistor; the resistance value of the thermistor changes after being heated and is converted into an electric signal, and the electric signal is the first feedback information; the electrical signals are transmitted on a main flexible circuit board 6 (MFPC) to a processor; the processor judges the resistance value according to the electric signal, and reduces the running performance of the driving chip 7 by forcibly reducing the power of the driving chip 7. Therefore, the processor controls the power of the driving chip 7 according to the first feedback information, so that the temperature of the driving chip 7 can be reduced, the problem that the aging of the display substrate 1 is accelerated due to the overhigh temperature of the driving chip 7 is solved, and the durability and the reliability of the display module are improved.
The embodiment of the disclosure also provides a display device. The display device may include the display module described in any of the above embodiments. The display device may be a mobile phone, a tablet computer, a television, or the like. Since the display module in the display device of the embodiment of the present disclosure is the same as the display module in the embodiment of the display module, the display module has the same beneficial effects, and is not repeated herein.
Although the present disclosure has been described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the disclosure.
Claims (10)
1. A display module, comprising:
the display substrate comprises a display area, a bending area and a binding area, wherein the bending area is arranged on one side of the display area and is bent towards the side away from the light emitting side of the display area, and the binding area is connected with the display area through the bending area;
the driving chip is arranged on the display substrate and is positioned on one side, back to the display area, of the binding area;
the main flexible circuit board is arranged on the display substrate and is positioned on one side of the binding region, which is opposite to the display region, a concave part is arranged on one side of the main flexible circuit board, which faces the binding region, and the driving chip is positioned in the concave part;
a processor connected with the main flexible circuit board;
the heat detection component is arranged on the display substrate, connected with the main flexible circuit board and used for generating first feedback information according to the heat emitted by the driving chip; the processor acquires the first feedback information through the main flexible circuit board and is used for controlling the power of the driving chip according to the first feedback information.
2. The display module assembly of claim 1, wherein the display module assembly further comprises:
and one end of the connecting circuit board is connected with the heat detection part, and the other end of the connecting circuit board is connected with the main flexible circuit board.
3. The display module assembly of claim 2, wherein the display module assembly further comprises:
the back plate is arranged on the backlight side of the display area, and the heat detection component is arranged in an area of the back plate corresponding to the driving chip.
4. The display module according to claim 3, wherein the back plate has a receiving groove, and the heat detecting member and a portion of the connecting circuit board are located in the receiving groove.
5. The display module according to claim 4, wherein the receiving groove is bar-shaped and parallel to the bending axis of the bending region.
6. The display module according to claim 1, wherein the number of the driving chips is plural, the main flexible circuit board is provided with a plurality of recesses, and the plurality of driving chips are disposed in the plurality of recesses in a one-to-one correspondence.
7. The display module according to claim 1, wherein the heat detecting member comprises a thermistor, and the thermistor is a positive temperature coefficient thermistor or a negative temperature coefficient thermistor.
8. The display module according to claim 7, wherein the thermistor is a positive temperature coefficient thermistor, and the processor is configured to obtain a resistance value of the thermistor according to the first feedback information, and reduce the power of the driving chip when the resistance value is greater than a first preset value; or
The thermistor is a negative temperature coefficient thermistor, and the processor is used for acquiring the resistance value of the thermistor according to the first feedback information and reducing the power of the driving chip when the resistance value is smaller than a second preset value.
9. The display module of claim 3, wherein the backplane comprises a stainless steel support layer or a titanium alloy support layer.
10. A display device comprising the display module according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211047480.8A CN115294888A (en) | 2022-08-29 | 2022-08-29 | Display module and display device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211047480.8A CN115294888A (en) | 2022-08-29 | 2022-08-29 | Display module and display device |
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| CN115294888A true CN115294888A (en) | 2022-11-04 |
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| CN202211047480.8A Pending CN115294888A (en) | 2022-08-29 | 2022-08-29 | Display module and display device |
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