CN115052421A - Display panel and display device - Google Patents
Display panel and display device Download PDFInfo
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- CN115052421A CN115052421A CN202210772956.8A CN202210772956A CN115052421A CN 115052421 A CN115052421 A CN 115052421A CN 202210772956 A CN202210772956 A CN 202210772956A CN 115052421 A CN115052421 A CN 115052421A
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- Prior art keywords
- circuit board
- main
- lead group
- display panel
- lap joint
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/59—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/59—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
- H01R12/61—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures connecting to flexible printed circuits, flat or ribbon cables or like structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/77—Coupling devices for flexible printed circuits, flat or ribbon cables or like structures
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/77—Coupling devices for flexible printed circuits, flat or ribbon cables or like structures
- H01R12/78—Coupling devices for flexible printed circuits, flat or ribbon cables or like structures connecting to other flexible printed circuits, flat or ribbon cables or like structures
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/05—Flexible printed circuits [FPCs]
- H05K2201/058—Direct connection between two or more FPCs or between flexible parts of rigid PCBs
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/1034—Edge terminals, i.e. separate pieces of metal attached to the edge of the PCB
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
The invention relates to the technical field of display, and provides a display panel and a display device, wherein the display panel comprises a circuit board structure, and the circuit board structure comprises: main circuit board, switching circuit board, connector. The main circuit board is provided with a main board lap joint end and a second lead group; the adapter circuit board is provided with a first device overlapping end, a first lead group and an adapter plate overlapping end; the connector is used for connecting the main board overlapping end and the adapter plate overlapping end; the switching circuit board covers a part of the second lead group; the main board overlapping end comprises two sub-main board overlapping ends which are respectively arranged on two opposite sides of the second lead group; the adapter plate overlapping end comprises two sub adapter plate overlapping ends; the lap joint ends of the sub-main boards and the lap joint ends of the sub-adapter boards are correspondingly connected one by one through connectors; the first device group is a touch chip, at least part of leads in the first lead group are used for transmitting touch related signals, and the second lead group is used for transmitting display related signals. The circuit board structure in the display panel is stable in structure and low in cost.
Description
The application is a divisional application of an invention application with the application date of 2019, 11/19/month, the Chinese application number of 201911136276.1 and the invention name of 'circuit board structure and display panel'.
Technical Field
The invention relates to the technical field of display, in particular to a display panel and a display device.
Background
The FPC (flexible circuit board) in the OLED display panel generally includes a display-related circuit and a touch-related circuit, and is limited to the volume of the display panel, and it is necessary to reduce the occupied space of the FPC as much as possible.
In the related art, the FPC generally adopts a six-layer soft-hard combined design scheme. The display related circuit and the touch related circuit can be respectively arranged in different laminated structures, so that the effect of reducing the occupied space of the FPC is achieved.
However, the six-layer FPC has a difficult structure design, a complicated process and a high cost. At present, six-layer plate supply channels are mainly provided by foreign manufacturers, but the six-layer plate supply channels are long in delivery period and inconvenient for flexible operation of projects.
It is to be noted that the information invented in the above background section is only for enhancing the understanding of the background of the present invention, and therefore, may include information that does not constitute prior art known to those of ordinary skill in the art.
Disclosure of Invention
The invention aims to provide a display panel and a display device, wherein the circuit board structure in the display panel can solve the technical problems of high design difficulty, complex manufacturing process and higher cost of a six-layer board in the related technology.
Additional features and advantages of the invention will be set forth in the detailed description which follows, or may be learned by practice of the invention.
According to an aspect of the present invention, there is provided a display panel including a circuit board structure including: main circuit board, switching circuit board, connector. The main circuit board has a double-layer structure and bears a main board lap joint end; the adapter circuit board is of a double-layer structure, is stacked on the main circuit board, and is provided with a first device lap joint end for lapping a first device group, a first lead group connected with the first device lap joint end, and an adapter board lap joint end connected with the first lead group; the connector is used for connecting the main board overlapping end and the adapter plate overlapping end; the main circuit board also carries a second lead group; the adapter circuit board at least covers part of the second lead group in orthographic projection of the main circuit board; the main board lap joint end comprises two sub main board lap joint ends which are respectively arranged at two opposite sides of the second lead group; the switching plate lapping end comprises two sub switching plate lapping ends, and the first device lapping end is arranged between the two sub switching plate lapping ends; the lap joint ends of the sub main boards are correspondingly connected with the lap joint ends of the sub adapter boards one by one through the connectors; the first device group is a touch chip, at least part of leads in the first lead group are used for transmitting touch related signals, and the second lead group is used for transmitting display related signals.
In an exemplary embodiment of the present invention, further comprising: and the shielding layer is arranged between the main circuit board and the adapter circuit board in a laminated manner.
In an exemplary embodiment of the invention, the main circuit board further carries a first external pin group; part of the first external pin group is connected with the lap joint end of the mainboard so as to connect part of the first lead group, and part of the first external pin group is connected with the second lead group.
In an exemplary embodiment of the invention, the first external pin group is used for connecting a signal terminal of a display panel.
In an exemplary embodiment of the present invention, the main circuit board further carries a second external pin group; part of the second external lead group is connected with the second lead group, and part of the second external lead group is connected with the main board lapping terminal to connect part of the first lead group.
In an exemplary embodiment of the invention, the second external pin group is used for connecting an external chip.
In an exemplary embodiment of the present invention, the main circuit board and the adaptor circuit board are flexible circuit boards.
In an exemplary embodiment of the present invention, the main circuit board includes a first substrate, and circuit layers stacked on both sides or one side of the first substrate; the adapter circuit board comprises a second substrate and circuit layers which are arranged on two sides or one side of the second substrate in a stacked mode.
In an exemplary embodiment of the present invention, the connector is any one of a plug connector, a snap connector, and a soldering connector.
According to an aspect of the present invention, there is provided a display device including the display panel described above.
The present disclosure provides a display panel and a display device, the circuit board structure includes: main circuit board, switching circuit board, connector. The main circuit board has a double-layer structure and bears a main board lap joint end; the adapter circuit board is of a double-layer structure, is stacked on the main circuit board, and is provided with a first device lap joint end for lapping a first device group, a first lead group connected with the first device lap joint end, and an adapter board lap joint end connected with the first lead group; the connector is used for connecting the main board overlapping end and the adapter plate overlapping end; the main circuit board also carries a second lead group; the adapter circuit board at least covers a part of the second lead group in the orthographic projection of the main circuit board; the main board overlapping end comprises two sub main board overlapping ends which are respectively arranged at two opposite sides of the second lead group; the switching plate lapping end comprises two sub switching plate lapping ends, and the first device lapping end is arranged between the two sub switching plate lapping ends; the lap joint ends of the sub-main boards are correspondingly connected with the lap joint ends of the sub-adapter boards one by one through the connectors; the first device group is a touch chip, at least part of leads in the first lead group are used for transmitting touch related signals, and the second lead group is used for transmitting display related signals. On one hand, the circuit board structure in the display panel provided by the disclosure can reduce the occupied space of the circuit board structure through the arrangement of the double-layer circuit boards in a laminated manner; on the other hand, the double-layer circuit board is mature in manufacturing process and simple in structural design, so that the design cost of the circuit board can be reduced.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the invention, as claimed.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and together with the description, serve to explain the principles of the invention. It is obvious that the drawings in the following description are only some embodiments of the invention, and that for a person skilled in the art, other drawings can be derived from them without inventive effort.
FIG. 1 is a schematic diagram of a main circuit board in an exemplary embodiment of a circuit board structure of the present disclosure;
FIG. 2 is a schematic diagram of an exemplary embodiment of a patch circuit board according to the circuit board structure of the present disclosure;
FIG. 3 is a schematic diagram of an exemplary embodiment of a circuit board structure according to the present disclosure;
FIG. 4 is a schematic diagram of another exemplary embodiment of a circuit board structure according to the present disclosure;
FIG. 5 is a schematic diagram of an exemplary embodiment of a circuit board structure according to the present disclosure;
FIG. 6 is a schematic diagram of the structure of a main circuit board in an exemplary embodiment of the circuit board structure of the present disclosure;
FIG. 7 is a schematic diagram of an exemplary embodiment of a patch circuit board according to the circuit board structure of the present disclosure;
fig. 8 is a schematic structural diagram of an exemplary embodiment of a circuit board structure according to the present disclosure.
Detailed Description
Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments may, however, be embodied in many different forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and thus their detailed description will be omitted.
Although relative terms, such as "upper" and "lower," may be used in this specification to describe one element of an icon relative to another, these terms are used in this specification for convenience only, e.g., in accordance with the orientation of the examples described in the figures. It will be appreciated that if the device of the icon were turned upside down, the element described as "upper" would become the element "lower". Other relative terms, such as "high," "low," "top," "bottom," "left," "right," and the like are also intended to have similar meanings. When a structure is "on" another structure, it may mean that the structure is integrally formed with the other structure, or that the structure is "directly" disposed on the other structure, or that the structure is "indirectly" disposed on the other structure via another structure.
The terms "a," "an," "the," and the like are used to denote the presence of one or more elements/components/parts; the terms "comprising" and "having" are intended to be inclusive and mean that there may be additional elements/components/etc. other than the listed elements/components/etc.
Fig. 1, 2 and 3 show a schematic diagram of a main circuit board in an exemplary embodiment of the circuit board structure of the present disclosure, fig. 1 shows a schematic diagram of a structure of an adaptor circuit board in an exemplary embodiment of the circuit board structure of the present disclosure, fig. 2 shows a schematic diagram of a structure of an adaptor circuit board in an exemplary embodiment of the circuit board structure of the present disclosure, and fig. 3 shows a schematic diagram of a structure of an exemplary embodiment of the circuit board structure of the present disclosure. A schematic diagram of an exemplary embodiment of a circuit board structure of the present disclosure. The circuit board structure comprises a main circuit board 1, an adapter circuit board 2 and a connector 3. The main circuit board has a double-layer structure and bears a main board lap joint end 4; the adapter circuit board 2 has a double-layer structure, is arranged on the main circuit board 1 in a stacked manner, and is provided with a first device lap joint end 51 for lapping a first device group, a first lead group 61 connected with the first device lap joint end 51, and an adapter plate lap joint end 7 connected with the first lead group 61; the connector 3 is arranged between the main circuit board 1 and the adapter circuit board 2 and is used for connecting the main board overlapping end 4 and the adapter board overlapping end 7.
In the circuit board structure provided by the present disclosure, circuit layers may be disposed on both the main circuit board and the adaptor circuit board, and the circuit layers may include circuit leads and device bonding terminals. On one hand, the circuit board structure provided by the disclosure can realize the stacking arrangement of the circuit layers through the stacking arrangement of the main circuit board layer and the adapter circuit board, thereby reducing the occupied space of the circuit board structure; on the other hand, the double-layer circuit board is mature in manufacturing process and simple in structural design, so that the design cost of the circuit board can be reduced.
In the present exemplary embodiment, there is one relay circuit board, and it should be understood that there may be a plurality of relay circuit boards in other exemplary embodiments.
In the present exemplary embodiment, the interposer bonding terminals 7 and the motherboard bonding terminals 4 may be pin groups, respectively. When the switching circuit board and the main circuit board are stacked, the main board overlapping end 4 can be arranged on one side of the main circuit board facing the switching circuit board; the connecting plate overlapping end 7 can be arranged on one side of the connecting circuit board, which is far away from the main circuit board, and also can be arranged on one side of the connecting circuit board, which faces the main circuit board. The connectors may be plug connectors, snap connectors, solder connectors, and the like. For example, the connector may be a snap-fit connector, and the interposer landing terminals 7 may be disposed on a side of the interposer circuit board facing the main circuit board. The snap connector may include a first connection portion that may be fixed to a side of the adapting circuit board facing the main circuit board to connect the adapting board landing terminal 7, and a second connection portion that may be fixed to the main circuit board to connect the main board landing terminal 4. The connection adapter board overlapping end 7 and the main board overlapping end 4 can be electrically connected by fastening the first connecting part and the second connecting part. For another example, the connector may be a solder connector, and the interposer bonding end 7 may be disposed on a side of the interposer circuit board facing away from the main circuit board. The connecting mode can be used for welding the corresponding pins in the adapter plate overlapping end 7 and the main board overlapping end 4 through solder paste.
In the present exemplary embodiment, as shown in fig. 4, a schematic structural diagram of another exemplary embodiment of the circuit board structure of the present disclosure is shown. The main circuit board may be provided with a second lead group 62, and the relay circuit board 2 may cover at least a part of the second lead group 62 in an orthographic projection of the main circuit board 1. The first and second lead groups 61 and 62 are stacked to reduce the occupied space of the circuit board structure.
In the present exemplary embodiment, as shown in fig. 4, the main circuit board may further carry a second device bond terminal 52 for bonding a second device group, and the second device bond terminal 52 may be connected to a second lead group 62. The second device bonding end 52 may be located at a position of the transition circuit board outside the orthographic projection of the main circuit board.
In the exemplary embodiment, the connector can be a ZIF connector or a BTB connector, the impedance of the lap joint of the ZIF connector and the BTB connector is small, the performance is stable, the lap resistance value can be smaller than 10 Ω, and the impedance consistency of each lap joint channel is good. The circuit board structure provided by the exemplary embodiment of the present invention has almost no difference in test data of power consumption with respect to the six-board circuit board structure.
In the present exemplary embodiment, as shown in fig. 4, the main circuit board further carries a first external pin group 91; part of the first external lead group 91 is connected to the main board bonding terminal 4 to connect part of the first lead group 61, and part of the first external lead group 91 is connected to the second lead group 62. In the present exemplary embodiment, as shown in fig. 4, the main circuit board also carries a second external pin group 92; part of the second external pin group 92 is connected to the second lead group 62, and part of the second external pin group 92 is connected to the main board bonding terminal 4 to connect part of the first lead group.
In the present exemplary embodiment, the first external pin group 91 and the second external pin group 92 may be externally connected to a signal terminal. For example, the circuit board structure may be applied to a display panel, the first external pin group 91 may be connected to a signal terminal of the display panel, and the second external pin group 92 may be connected to an external chip. The first lead group 61 may be used to transmit touch related signals, the second lead group 62 may be used to transmit display related signals, the first device landing terminal 51 may be used to land touch related chips, and the second device landing terminal 52 may be used to land display related chips. For the transmission of the touch related signal, the display panel outputs the touch related signal, the touch related signal is transmitted to the first device bonding terminal 51 through a part of the first external lead group 91, the main board bonding terminal, the connector, the adapter board bonding terminal, and a part of the first lead group 61, the touch related chip connected to the first device bonding terminal 51 receives the touch related signal and outputs another touch related signal, and the other touch related signal is output to the second external lead group 92 through a part of the first lead group 61, the adapter board bonding terminal, the connector, and the main board bonding terminal. For the transmission of the display-related signal, the display-related signal is transmitted to the second device bonding terminal 52 through a part of the first external pin group 91 and the second pin group 62, the display-related chip connected to the second device bonding terminal 52 receives the display-related signal and outputs another display-related signal, and the other display-related signal is output to the second external pin group 92.
It should be understood that the first lead set may also be used to transmit other related signals, such as a fingerprint unlock related signal, a brightness sensing related signal, etc. The circuit board structure can also be applied to other technical fields besides the display panel, and all belong to the protection scope of the present disclosure.
In the present exemplary embodiment, as shown in fig. 5, a schematic structural diagram of an exemplary embodiment of the circuit board structure of the present disclosure is shown. The circuit board structure may further include a shielding layer 8, and the shielding layer 8 may be laminated between the main circuit board 1 and the relay circuit board 2. The orthographic projection of the relay circuit board 2 may be on a shield layer 8 which may be used to shield signals from the circuits on the main circuit board and the relay circuit board. The shielding layer may be an EMI shielding layer.
In the exemplary embodiment, the main board overlapping end includes a plurality of sub main board overlapping ends, the adapter board overlapping end includes a plurality of sub adapter board overlapping ends, and the number of the connectors is plural; the lap joint ends of the sub-main boards are connected with the lap joint ends of the sub-lap joint boards in a one-to-one correspondence mode through the connectors. Wherein, the quantity of sub-mainboard overlap joint end can set up according to actual conditions. For example, as shown in fig. 6, 7 and 8, fig. 6 is a schematic structural diagram of a main circuit board in an exemplary embodiment of the circuit board structure of the present disclosure, fig. 7 is a schematic structural diagram of an interposer circuit board in an exemplary embodiment of the circuit board structure of the present disclosure, and fig. 8 is a schematic structural diagram of an exemplary embodiment of the circuit board structure of the present disclosure. The main board strap terminal 4 may include two sub-main board strap terminals 41, 42, and the two sub-main board strap terminals 41, 42 may be respectively disposed at opposite sides of the second lead group 62. Accordingly, the patch panel crossover 7 may include two sub-patch panel crossover ends 71, 72. The daughter board strap terminals 41 are connected to the daughter interposer strap terminals 71 through the connectors 31, and the daughter board strap terminals 42 are connected to the daughter interposer strap terminals 72 through the connectors 32.
In the present exemplary embodiment, the main circuit board and the adaptor circuit board may be flexible circuit boards, and it should be understood that in other exemplary embodiments, the main circuit board and the adaptor circuit board may also be non-flexible circuit boards, which all fall within the protection scope of the present disclosure.
In the exemplary embodiment, the main circuit board may include a first substrate and circuit layers on two sides or one side of the first substrate, wherein the circuit layers on two sides of the first substrate may be electrically connected through vias on the substrate; the patch circuit board may include a second substrate and circuit layers on two sides or one side of the second substrate, wherein the circuit layers on two sides of the second substrate may be electrically connected through vias on the substrate.
The present exemplary embodiment also provides a display panel including the above circuit board structure. The display panel can be applied to display devices such as televisions, mobile phones and tablet computers.
Other embodiments of the disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure disclosed herein. This application is intended to cover any variations, uses, or adaptations of the disclosure following, in general, the principles of the disclosure and including such departures from the present disclosure as come within known or customary practice within the art to which the disclosure pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the disclosure being indicated by the following claims.
It will be understood that the present disclosure is not limited to the precise arrangements described above and shown in the drawings and that various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is to be limited only by the terms of the appended claims.
Claims (10)
1. A display panel comprising a circuit board structure, wherein the circuit board structure comprises:
the main circuit board is of a double-layer structure and bears a main board lap joint end;
the adapter circuit board is of a double-layer structure, is stacked on the main circuit board, and is provided with a first device lap joint end for lapping a first device group, a first lead group connected with the first device lap joint end, and an adapter plate lap joint end connected with the first lead group;
the connector is used for connecting the main board overlapping end and the adapter plate overlapping end;
the main circuit board also carries a second lead group; the adapter circuit board at least covers a part of the second lead group in the orthographic projection of the main circuit board;
the main board lap joint end comprises two sub main board lap joint ends which are respectively arranged at two opposite sides of the second lead group; the switching plate lapping end comprises two sub switching plate lapping ends, and the first device lapping end is arranged between the two sub switching plate lapping ends; the lap joint ends of the sub-main boards are correspondingly connected with the lap joint ends of the sub-adapter boards one by one through the connectors;
the first device group is a touch chip, at least part of leads in the first lead group are used for transmitting touch related signals, and the second lead group is used for transmitting display related signals.
2. The display panel according to claim 1, further comprising:
and the shielding layer is arranged between the main circuit board and the adapter circuit board in a laminated mode.
3. The display panel of claim 1 wherein the main circuit board also carries a first set of external pins;
part of the first external pin group is connected with the lap joint end of the mainboard so as to connect part of the first lead group, and part of the first external pin group is connected with the second lead group.
4. The display panel of claim 3, wherein the first external pin set is used for connecting signal terminals of the display panel.
5. The display panel of claim 1 wherein the main circuit board also carries a second set of external pins;
part of the second external lead group is connected with the second lead group, and part of the second external lead group is connected with the main board lapping terminal to connect part of the first lead group.
6. The display panel of claim 5, wherein the second external pin set is used for connecting an external chip.
7. The display panel according to any one of claims 1 to 6, wherein the main circuit board and the relay circuit board are flexible circuit boards.
8. The display panel according to any one of claims 1 to 6,
the main circuit board comprises a first substrate and circuit layers which are arranged on two sides or one side of the first substrate in a laminated mode;
the adapter circuit board comprises a second substrate and circuit layers which are arranged on two sides or one side of the second substrate in a stacked mode.
9. The display panel according to any one of claims 1 to 6, wherein the connector is any one of a plug connector, a snap connector, and a solder connector.
10. A display device characterized by comprising the display panel according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210772956.8A CN115052421A (en) | 2019-11-19 | 2019-11-19 | Display panel and display device |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911136276.1A CN110831328A (en) | 2019-11-19 | 2019-11-19 | Circuit board structure and display panel |
| CN202210772956.8A CN115052421A (en) | 2019-11-19 | 2019-11-19 | Display panel and display device |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911136276.1A Division CN110831328A (en) | 2019-01-30 | 2019-11-19 | Circuit board structure and display panel |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115052421A true CN115052421A (en) | 2022-09-13 |
Family
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Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210772956.8A Pending CN115052421A (en) | 2019-11-19 | 2019-11-19 | Display panel and display device |
| CN201911136276.1A Pending CN110831328A (en) | 2019-01-30 | 2019-11-19 | Circuit board structure and display panel |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911136276.1A Pending CN110831328A (en) | 2019-01-30 | 2019-11-19 | Circuit board structure and display panel |
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| WO2020156595A2 (en) * | 2019-01-30 | 2020-08-06 | 京东方科技集团股份有限公司 | Flexible circuit board and manufacturing method, display device, circuit board structure and display panel thereof |
| CN111511109B (en) | 2019-01-30 | 2021-11-23 | 京东方科技集团股份有限公司 | Flexible circuit board and manufacturing method thereof, electronic device module and electronic device |
| EP3920671B1 (en) | 2019-01-30 | 2024-03-13 | BOE Technology Group Co., Ltd. | Flexible circuit board and manufacturing method, display device, circuit board structure and display panel thereof |
| CN113301710B (en) * | 2020-02-24 | 2022-09-09 | 京东方科技集团股份有限公司 | Display device and method for manufacturing the same |
| CN113391715B (en) * | 2020-03-13 | 2023-07-21 | 京东方科技集团股份有限公司 | Display device |
| CN113795075B (en) * | 2020-05-28 | 2023-09-12 | 华为技术有限公司 | Electronic equipment |
| CN215526628U (en) * | 2020-12-26 | 2022-01-14 | 京东方科技集团股份有限公司 | Flexible circuit board, touch display module and touch display device |
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| US20170295648A1 (en) * | 2014-12-02 | 2017-10-12 | Konica Minota, Inc. | Electronic device |
| US10178763B2 (en) * | 2015-12-21 | 2019-01-08 | Intel Corporation | Warpage mitigation in printed circuit board assemblies |
| CN205829726U (en) * | 2016-06-30 | 2016-12-21 | Tcl显示科技（惠州）有限公司 | Circuit unit, the display module applying this circuit unit and mobile phone |
| CN206181557U (en) * | 2016-11-30 | 2017-05-17 | 深圳天珑无线科技有限公司 | Mobile terminal's circuit board and mobile terminal |
| JP2019139073A (en) * | 2018-02-09 | 2019-08-22 | 株式会社ジャパンディスプレイ | Display device and wiring board |
| CN108770182B (en) * | 2018-04-17 | 2019-08-06 | 胜宏科技（惠州）股份有限公司 | A kind of double ladder portable antenna PCB and production method |
| US10440813B1 (en) * | 2018-06-28 | 2019-10-08 | Nxp Usa, Inc. | Microelectronic modules including thermal extension levels and methods for the fabrication thereof |
| CN109121285B (en) * | 2018-09-29 | 2020-05-26 | 维沃移动通信有限公司 | Circuit board structure and electronic equipment |
| CN109600939B (en) * | 2018-10-30 | 2019-09-20 | 庆鼎精密电子（淮安）有限公司 | The production method of thin type antenna circuit board |
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