CN113301784B - Heat sink device - Google Patents
Heat sink device Download PDFInfo
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- CN113301784B CN113301784B CN202110708241.1A CN202110708241A CN113301784B CN 113301784 B CN113301784 B CN 113301784B CN 202110708241 A CN202110708241 A CN 202110708241A CN 113301784 B CN113301784 B CN 113301784B
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- heat
- air
- heat dissipation
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- shell
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0213—Venting apertures; Constructional details thereof
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The embodiment of the application provides a heat dissipation device. The heat dissipating double-fuselage includes: the electronic equipment comprises a shell, wherein an air duct is arranged in the shell, the air duct is provided with a first air inlet and a first air outlet, a clamping part is arranged on the shell, the electronic equipment is suitable for being detachably arranged on the clamping part, and the first air outlet faces the electronic equipment under the condition that the electronic equipment is arranged on the clamping part; a first heat conductor mounted on the housing, the first heat conductor being adjacent to the electronic device in a state where the electronic device is mounted on the holder; the first heat dissipation fan is arranged on the shell and is positioned at the first air inlet, and the heat dissipation fan is used for accelerating the air flow in the air channel; and the second heat radiation fan is arranged on one side of the first heat conduction piece, which is far away from the electronic equipment, and is used for radiating heat for the first heat conduction piece.
Description
Technical Field
The application relates to the technical field of electronic equipment, in particular to a heat dissipation device.
Background
With the progress of science and technology, the functions of electronic equipment are more and more complete, and radio frequency, images and the like can be watched through the electronic equipment. However, in the process of using the electronic device, the electronic device may generate heat, and if the heat generated by the electronic device is not dissipated in time, the electronic device may be turned off, which may affect the use of the user. Generally, the heat dissipation device is mounted on the electronic device to dissipate heat generated by the electronic device, but in the related art, the heat dissipation device has low heat dissipation efficiency for the electronic device.
Content of application
The embodiment of the application provides a heat dissipation device, which aims to solve the problem that the heat dissipation efficiency of the heat dissipation device on electronic equipment in the related art is low.
In order to solve the technical problem, the present application is implemented as follows:
an embodiment of the present application provides a heat dissipation device, including:
the electronic equipment comprises a shell, wherein an air duct is arranged in the shell, the air duct is provided with a first air inlet and a first air outlet, a clamping part is arranged on the shell, the electronic equipment is suitable for being detachably arranged on the clamping part, and the first air outlet faces the electronic equipment under the condition that the electronic equipment is arranged on the clamping part;
a first heat conductor mounted on the case, the first heat conductor being adjacent to the electronic device in a state where the electronic device is mounted on the clamping portion;
the first heat dissipation fan is arranged on the shell and positioned at the first air inlet, and the heat dissipation fan is used for accelerating the air flow in the air channel;
the second heat dissipation fan is arranged on one side, far away from the electronic equipment, of the first heat conduction piece, and the second heat dissipation fan is used for dissipating heat of the first heat conduction piece.
In this application embodiment, through set up the wind channel in the casing, set up first radiator fan on the casing, first radiator fan is located the first air intake second air outlet in wind channel and faces electronic equipment for after the heat that electronic equipment produced transmits to the casing, can make heat transmission as early as possible to dispel from the second air outlet through first radiator fan. By arranging the first heat conduction piece and the second heat dissipation fan on the shell, after heat generated by the electronic equipment is transferred into the shell, the heat can be transferred to the second heat dissipation fan through the first heat conduction piece, and the heat can be dissipated through the second heat dissipation fan. Namely, after the heat generated by the electronic equipment is transferred to the shell, the heat can be dissipated as soon as possible through the two paths, so that the heat dissipation efficiency for heat dissipation of the electronic equipment is improved. In addition, first air outlet is towards electronic equipment, can make the surface of the air current that comes out from first air outlet to electronic equipment cool down, further improves the radiating efficiency to electronic equipment. That is, in the embodiment of the present application, after the heat of the electronic device is transferred to the housing, the heat can be dissipated as soon as possible through the two paths, and in addition, the surface of the electronic device can be dissipated, so that the heat dissipation efficiency for dissipating the heat of the electronic device is improved.
Drawings
Fig. 1 is a schematic view of a heat dissipation device according to an embodiment of the present disclosure;
fig. 2 is a schematic view illustrating a second heat dissipation fan according to an embodiment of the present disclosure mounted on a heat sink;
FIG. 3 illustrates a schematic view of a protective case according to an embodiment of the present application;
FIG. 4 is a schematic view of a first heat-conducting member mounted to a heat sink according to an embodiment of the present disclosure;
FIG. 5 illustrates a top view of a thermally conductive block according to an embodiment of the present application;
fig. 6 is a top view of a thermal pad according to an embodiment of the present application.
Reference numerals:
10: a housing; 20: a first heat conductor; 30: a first heat dissipation fan; 40: a second heat dissipation fan; 50: a control circuit; 60: a heat sink; 70: a protective shell; 11: an air duct; 12: a clamping portion; 13: a heat conducting block; 14: a thermally conductive pad; 61: a heat-dissipating substrate; 62: a heat-dissipating column; 71: a second air inlet; 72: a second air outlet; 111: a first air duct; 112: a first air duct; 100: an electronic device.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some, but not all, embodiments of the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
It should be appreciated that reference throughout this specification to "one embodiment" or "an embodiment" means that a particular feature, structure or characteristic described in connection with the embodiment is included in at least one embodiment of the present application. Thus, the appearances of the phrases "in one embodiment" or "in an embodiment" in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.
Referring to fig. 1, a schematic diagram of a heat dissipation apparatus provided in an embodiment of the present application is shown, referring to fig. 2, a schematic diagram of a second cooling fan provided in an embodiment of the present application being mounted on a heat sink is shown, referring to fig. 3, a schematic diagram of a protective shell provided in an embodiment of the present application is shown, referring to fig. 4, a schematic diagram of a first heat conduction member provided in an embodiment of the present application being mounted on a heat sink is shown, referring to fig. 5, a top view of a heat conduction block provided in an embodiment of the present application is shown, referring to fig. 6, a top view of a heat conduction pad provided in an embodiment of the present application is shown, and as shown in fig. 1 to fig. 6, the heat dissipation apparatus includes: the electronic device comprises a housing 10, wherein an air duct 11 is arranged in the housing 10, the air duct 11 has a first air inlet and a first air outlet, a clamping portion 12 is arranged on the housing 10, the electronic device 100 is suitable for being detachably mounted on the clamping portion 12, and the first air outlet faces the electronic device 100 when the electronic device 100 is mounted on the clamping portion 12.
A first heat conductor 20, the first heat conductor 20 being mounted on the housing 10, the first heat conductor 20 being adjacent to the electronic apparatus 100 in a state where the electronic apparatus 100 is mounted on the clamping portion 12. The first heat dissipation fan 30 is installed on the housing 10, the first heat dissipation fan 30 is located at the first air inlet, and the heat dissipation fan is used for accelerating the air flow in the air duct 11. And a second heat dissipation fan 40, wherein the second heat dissipation fan 40 is installed at a side of the first heat conduction member 20 far away from the electronic device 100, and the second heat dissipation fan 40 is used for dissipating heat of the first heat conduction member 20.
In the embodiment of the present application, since the first heat conductor 20 is mounted on the case 10, in the case where the electronic apparatus 100 is mounted on the clamping portion 12, the first heat conductor 20 is adjacent to the electronic apparatus 100, and therefore, after heat generated by the electronic apparatus 100 is transferred into the case 10, the heat can be transferred to the first heat conductor 20. Since the second heat dissipation fan 40 is installed at a side of the first heat conduction member 20 far away from the electronic device 100, after the heat generated by the electronic device 100 is transferred to the first heat conduction member 20, the second heat dissipation fan 40 can operate to dissipate the heat to the first heat conduction member 20, so that the heat transferred to the first heat conduction member 20 can be dissipated as soon as possible. Because the air duct 11 is disposed in the casing 10, the clamping portion 12 is disposed on the casing 10, and when the electronic device 100 is mounted on the clamping portion 12, the first air outlet faces the electronic device 100, the first cooling fan 30 is mounted on the casing 10, and the first cooling fan 30 is located at the first air inlet, therefore, after heat generated by the electronic device 100 is transferred to the casing 10, the first cooling fan 30 can move to transfer wind power into the air duct 11, so as to accelerate airflow in the air duct 11, so that the flow rate of the airflow in the air duct 11 is accelerated, and the airflow in the air duct 11 can take the heat in the casing 10 out of the second air outlet 72, so that the heat in the casing 10 is dissipated as soon as possible. In addition, since the second air outlet 72 faces the electronic device 100, after the air flow in the air duct 11 flows out from the second air outlet 72, the air flow can also flow to the surface of the electronic device 100, so that heat can be dissipated from the surface of the electronic device 100.
That is, in the embodiment of the present application, the air duct 11 is disposed in the casing 10, the first cooling fan 30 is disposed on the casing 10, and the first cooling fan 30 is located at the first air inlet and the second air outlet 72 of the air duct 11 and faces the electronic device 100, so that after heat generated by the electronic device 100 is transferred into the casing 10, the heat can be transferred as quickly as possible by the first cooling fan 30 and dissipated from the second air outlet 72. After the first heat conduction member 20 and the second heat dissipation fan 40 are disposed on the housing 10, heat generated by the electronic device 100 is transferred into the housing 10, and then the heat can be transferred to the second heat dissipation fan 40 through the first heat conduction member 20, so that the heat can be dissipated through the second heat dissipation fan 40. That is, after the heat generated by the electronic device 100 is transferred to the housing 10, the heat can be dissipated as quickly as possible through two paths, so that the heat dissipation efficiency for dissipating the heat of the electronic device 100 is improved. In addition, the first air outlet faces the electronic device 100, so that the surface of the electronic device 100 is cooled by the airflow coming out of the first air outlet, and the heat dissipation efficiency of the electronic device 100 is further improved. That is, in the embodiment of the present application, after the heat of the electronic device 100 is transferred to the housing 10, the heat can be dissipated as quickly as possible through two paths, and in addition, the surface of the electronic device 100 can be dissipated, so that the heat dissipation efficiency for dissipating the heat of the electronic device 100 is improved.
It should be noted that, in the embodiment of the present application, the first heat dissipation fan 30 may be a centrifugal fan, and the second heat dissipation fan 40 may be an axial fan. Of course, the first heat dissipation fan 30 and the second heat dissipation fan 40 may also be other types of fans, and the embodiments of the present application are not limited herein.
In addition, in the embodiment of the present application, when the electronic device 100 is mounted on the clamping portion 12, the first air outlet may be oriented parallel to the surface of the electronic device 100, and at this time, the airflow flowing out of the first air outlet may flow along the surface of the electronic device 100 to the greatest extent, so that the heat dissipation effect for dissipating heat from the surface of the electronic device 100 is better. Of course, the orientation of the first air outlet may also form a certain included angle with the surface of the electronic device 100, that is, the orientation of the first air outlet is not parallel to the surface of the electronic device 100, which is not limited herein.
In addition, in the embodiment of the present application, as shown in fig. 1 and 4, the first thermal conductive element 20 may be a semiconductor refrigerator, the first thermal conductive element 20 includes a cold end and a hot end, the cold end is adjacent to the electronic device 100, and the heat dissipation device may further include: and the control circuit 50 is electrically connected with the first heat conduction member 20, and the control circuit 50 controls the first heat conduction member 20 to be powered on or powered off.
Since the first heat conducting element 20 is a semiconductor cooler, and the first heat conducting element 20 includes a cold end and a hot end, and the cold end is adjacent to the electronic device 100, when heat generated by the electronic device 100 is transferred to the housing 10, the cold end can rapidly absorb heat in the housing 10 and transfer the heat to the hot end. That is, the first heat conduction member 20 can perform a heat conduction function to rapidly transfer heat. Since the control circuit 50 is electrically connected to the first heat conduction member 20, the control circuit 50 can control the first heat conduction member 20 to be powered on or powered off, and when the first heat conduction member 20 is powered on, the cold end of the first heat conduction member 20 starts absorbing heat and transfers the heat to the hot end. When the first heat conduction member 20 is powered off, the cold end of the first heat conduction member 20 stops absorbing heat and stops transferring heat to the hot end. That is, by providing the control circuit 50, it is possible to control the first heat conductor 20 to perform heat transfer conveniently.
In the embodiment of the present application, in order to facilitate the installation of the control Circuit 50, the control Circuit 50 may be integrated on a Printed Circuit Board (PCB), and of course, the control Circuit 50 may be integrated on a Flexible Printed Circuit (FPC), which is not limited herein.
Additionally, in some embodiments, the heat dissipation device may further include a heat sink 60, as shown in fig. 1. The heat sink 60 is mounted on a side of the first heat conductor 20 away from the electronic device 100, and the second heat dissipation fan 40 is mounted on the heat sink 60.
Since the heat sink 60 is installed on the side of the first heat conductor 20 away from the electronic device 100, and the second heat dissipation fan 40 is installed on the heat sink 60, the first heat conductor 20 can transfer the heat in the housing 10 to the heat sink 60, the heat sink 60 can quickly dissipate the heat, and the second heat dissipation fan 40 can generate an air flow to dissipate the heat dissipated by the heat sink 60. That is, by providing the heat sink 60, when the first heat conducting member 20 transfers heat in the housing 10, that is, heat generated by the electronic device 100, the heat sink 60 can quickly dissipate the heat transferred by the first heat conducting member 20, and then the second cooling fan 40 can dissipate the heat, thereby further improving the heat dissipation efficiency of the electronic device 100 for heat dissipation.
In addition, in the embodiment of the present application, as shown in fig. 2, the heat sink 60 may include a heat dissipation substrate 61 and a heat dissipation pillar 62, the heat dissipation substrate 61 has a first surface and a second surface opposite to each other, the heat dissipation pillar 62 is disposed on the first surface of the heat dissipation substrate 61, and the first heat conduction member 20 and the second surface of the heat dissipation substrate 61. The second heat conduction member transfers heat to the heat dissipation substrate 61, and then the heat is transferred to the heat dissipation column 62 through the heat dissipation substrate 61, the heat dissipation column 62 dissipates the heat, the second heat dissipation fan 40 generates air flow, and the heat can be quickly taken away through the air flow, so that heat dissipation of the electronic device 100 is realized.
In addition, in this embodiment of the application, the number of the heat dissipation pillars 62 may be multiple, the second cooling fan 40 may be disposed on the second surface, the heat dissipation pillars 62 are disposed on the second surface, and the heat dissipation pillars 62 surround the second fan, at this time, the heat dissipated by the heat dissipation pillars 62 may be quickly taken away by the airflow generated by the second cooling fan 40, so as to achieve the effect of quick heat dissipation.
In addition, in the embodiment of the present application, when the first heat conductive member 20 includes a cold end and a hot end, the hot end may be connected to the heat dissipation substrate 61.
In addition, in some embodiments, as shown in fig. 1, the air duct 11 may include a first air duct 111, the first air duct 111 extends along an extending direction of the casing 10, and the first air outlet is located at one side of the casing 10.
When the air duct 11 includes the first air duct 111, and the first air duct 111 extends along the extending direction of the casing 10, at this time, when the first heat dissipation fan 30 is operated, the airflow generated by the first heat dissipation fan 30 may flow along the extending direction of the casing 10 as much as possible, so that the distance that the airflow flows in the casing 10 is long, and thus the heat in the casing 10 is taken away by the airflow along with the flow of the airflow as much as possible, and thus the heat generated for the electronic device 100 can be dissipated as much as possible after being transferred to the casing 10. That is, by disposing the first air duct 111 along the extending direction of the housing 10, the radiation efficiency with respect to the heat radiation in the housing 10 can be made high.
In addition, in some embodiments, the air duct 11 may further include a second air duct 112, the second air duct 112 penetrates through the housing 10 and faces the electronic device 100, and the first cooling fan 30 is located between the first air duct 111 and the second air duct 112.
When the air duct 11 includes the second air duct 112, the second air duct 112 penetrates the housing 10 and faces the electronic device 100, and the first cooling fan 30 is located between the first air duct 111 and the second air duct 112, at this time, heat generated by the electronic device 100 is transferred to the housing 10, and air flow generated by the first cooling fan 30 can flow through the first air duct 111 and the second air duct 112, so that the air flow in the first air duct 111 and the second air duct 112 takes away heat in the housing 10, and thus the cooling efficiency for cooling heat in the housing 10 is further improved. That is, by providing the second air duct 112, the heat dissipation efficiency can be further improved.
Additionally, in some embodiments, as shown in FIG. 1, a thermally conductive mass 13 may be disposed within the housing 10. The heat conducting block 13 is located between the first air inlet and the first air outlet, at least one ventilation channel is arranged in the heat conducting block 13, and the ventilation channel is communicated with the air channel 11. The first heat conductor 20 is connected to the heat conduction block 13.
Since the heat conduction block 13 is disposed in the housing 10, and the first heat conduction member 20 is connected to the heat conduction block 13, heat of the electronic device 100 can be transferred to the heat conduction block 13, the heat generated by the electronic device 100 is transferred to the first heat conduction member 20 through the heat conduction block 13, and then the first heat conduction member 20 transfers the heat to the second heat dissipation fan 40. That is, by providing the heat conduction block 13, the heat generated from the electronic device 100 can be easily transferred to the first heat conduction member 20. Because the heat conduction block 13 is located between the first air inlet and the first air outlet, at least one ventilation channel is arranged in the heat conduction block 13, and the ventilation channel is communicated with the air channel 11, when the heat of the electronic device 100 is transferred to the housing 10, and the first cooling fan 30 transfers the air flow into the first air channel 111 through the first air inlet, the ventilation channel in the heat conduction block 13 is communicated with the air channel 11, so that the air flow can flow through the heat conduction block 13, and further the heat transfer of the heat conduction block 13 is accelerated. That is, by providing the heat conduction block 13 in the housing 10 and providing at least one ventilation channel in the heat conduction block 13, the heat conduction block 13 not only can facilitate the heat transfer of the electronic device 100 to the first heat conduction member 20, but also the heat conduction block 13 does not affect the effect of the first cooling fan 30 on the heat dissipation of the electronic device 100 through the air channel 11.
It should be noted that, in the embodiment of the present application, the material of the heat conducting block 13 may be a copper alloy, and of course, other materials for facilitating heat conduction may also be used, and the embodiment of the present application is not limited herein. In addition, the number of the air ducts may be set according to actual needs, for example, the number of the air ducts may be two, and the specific number of the air ducts is not limited herein in the embodiments of the present application.
Additionally, in some embodiments, as shown in fig. 1, a flexible thermal pad 14 may also be provided on the side of the housing 10 facing away from the first thermally conductive member 20. In a state where the electronic apparatus 100 is mounted on the holding portion 12, the electronic apparatus 100 abuts against the flexible thermal pad 14.
Since the flexible thermal pad 14 is further disposed on the side of the housing 10 away from the first thermal conductor 20, when the electronic device 100 is mounted in the clamping portion 12, the electronic device 100 is stopped against the flexible thermal pad 14, at this time, the flexible thermal pad 14 can adapt to the shape of the electronic device 100, so that the surface of the electronic device 100 mounted in the clamping portion 12 contacts with the flexible thermal pad 14 as much as possible, and when the electronic device 100 generates heat, the heat can be transferred to the flexible thermal pad 14 as much as possible, and the heat is transferred to the housing 10 through the flexible thermal pad 14. That is, by providing the flexible thermal pad 14, it is possible to transfer as much heat generated from the electronic device 100 into the housing 10 as possible, thereby radiating the heat through the heat radiating member such as the first thermal conductor 20 of the housing 10.
It should be noted that, in the embodiment of the present application, the flexible heat conducting pad 14 may be a silicone pad, and certainly, may also be a flexible member made of other heat conducting materials, which is not limited herein.
In addition, in the embodiment of the present application, when the heat conduction block 13 is disposed in the housing 10, at this time, the flexible heat conduction pad 14 may be connected to the heat conduction block 13, and the flexible heat conduction pad 14 may transfer heat to the heat conduction block 13, thereby transferring heat to the first heat conduction member 20 through the heat conduction block 13.
Additionally, in some embodiments, at least one channel may be disposed in the flexible thermal pad 14 for deforming the flexible thermal pad 14.
When at least one channel is disposed in the flexible thermal pad 14, in this case, the flexible thermal pad 14 is similar to a grid structure, and when the electronic device 100 is stopped against the flexible thermal pad 14, due to the existence of the channel, the flexible thermal pad 14 is easily deformed and then easily adapted to the surface of the electronic device 100, so that heat of the electronic device 100 can be transferred to the flexible thermal pad 14 over a large area and then transferred into the housing 10 through the flexible thermal pad 14.
Additionally, in some embodiments, as shown in fig. 3, the heat sink may further include a protective shell 70. The protective shell 70 is connected to the housing 10, and the protective shell 70 and the housing 10 form an accommodating space, in which the first heat conductor 20 and the second heat dissipation fan 40 are located. The protective shell 70 is provided with a second air inlet 71 and a second air outlet 72, the first air inlet and the second air outlet 72 both face the second heat dissipation fan 40, and the second air inlet 71 is used for enabling air in the space outside the protective shell 70 to enter the protective shell 70, so that the second heat dissipation fan 40 forms air flow to dissipate heat of the first heat conduction member 20.
Because the protective shell 70 and the housing 10 form an accommodating space, and the first heat conduction piece 20 and the second heat dissipation fan 40 are both located in the accommodating space, the protective shell 70 can protect the first heat conduction piece 20 and the second heat dissipation fan 40, and the problem that the first heat conduction piece 20 and the second heat dissipation fan 40 are damaged due to collision is avoided. Because the protective shell 70 is provided with the second air inlet 71 and the second air outlet 72, and the second air inlet 71 and the second air outlet 72 both face the second heat dissipation fan 40, air in the space outside the protective shell 70 can enter the protective shell 70 along the second air inlet 71, and when the second heat dissipation fan 40 operates, the second heat dissipation fan 40 can enable the air in the protective shell 70 to form an air flow and flow out from the second air outlet 72, so that heat transferred by the first heat conduction member 20 can be taken away by the air flow generated by the second heat dissipation fan 40, and the second heat dissipation fan 40 can have a heat dissipation effect.
In the embodiment of the present application, the air duct 11 is disposed in the casing 10, the first cooling fan 30 is disposed on the casing 10, and the first cooling fan 30 is located at the first air inlet and the second air outlet 72 of the air duct 11 and faces the electronic device 100, so that after heat generated by the electronic device 100 is transferred into the casing 10, the heat can be transferred as quickly as possible by the first cooling fan 30 and dissipated from the second air outlet 72. After the first heat conduction member 20 and the second heat dissipation fan 40 are disposed on the housing 10, heat generated by the electronic device 100 is transferred into the housing 10, and then the heat can be transferred to the second heat dissipation fan 40 through the first heat conduction member 20, so that the heat can be dissipated through the second heat dissipation fan 40. That is, after the heat generated by the electronic device 100 is transferred to the housing 10, the heat can be dissipated as quickly as possible through two paths, so that the heat dissipation efficiency for dissipating the heat of the electronic device 100 is improved. In addition, the first air outlet faces the electronic device 100, so that the surface of the electronic device 100 can be cooled by the airflow coming out of the first air outlet, and the heat dissipation efficiency of the electronic device 100 is further improved. That is, in the embodiment of the present application, after the heat of the electronic device 100 is transferred to the housing 10, the heat can be dissipated as quickly as possible through two paths, and in addition, the surface of the electronic device 100 can be dissipated, so that the heat dissipation efficiency for dissipating the heat of the electronic device 100 is improved.
It should be noted that, in the embodiment of the present application, the electronic device includes, but is not limited to, a mobile phone, a tablet computer, a notebook computer, a palm computer, a vehicle-mounted terminal, a wearable device, a pedometer, and the like.
It should be noted that, in the present specification, the embodiments are all described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments may be referred to each other.
While alternative embodiments of the present application have been described, additional variations and modifications of these embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. It is therefore intended that the following claims be interpreted as including alternative embodiments and all such alterations and modifications as fall within the true scope of the embodiments of the application.
Finally, it should also be noted that, in this document, relational terms such as first and second, and the like may be used solely to distinguish one entity from another entity without necessarily requiring or implying any actual such relationship or order between such entities. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that an article or terminal apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such article or terminal apparatus. Without further limitation, an element defined by the phrases "comprising one of \8230;" does not exclude the presence of additional like elements in an article or terminal device comprising the element.
The technical solutions provided in the present application are described in detail above, and the principles and embodiments of the present application are described herein by using specific examples, and meanwhile, for a person of ordinary skill in the art, according to the principles and implementation manners of the present application, changes may be made in the specific embodiments and application ranges.
Claims (7)
1. A heat dissipation device for an electronic device, comprising:
the electronic equipment comprises a shell, wherein an air duct is arranged in the shell, the air duct is provided with a first air inlet and a first air outlet, a clamping part is arranged on the shell, the electronic equipment is suitable for being detachably arranged on the clamping part, and the first air outlet faces the electronic equipment under the condition that the electronic equipment is arranged on the clamping part;
a first heat conductor mounted on the housing, the first heat conductor being adjacent to the electronic device with the electronic device mounted on the clamping portion;
the first heat dissipation fan is arranged on the shell and is positioned at the first air inlet, and the heat dissipation fan is used for accelerating the airflow in the air channel;
the second heat dissipation fan is arranged on one side, away from the electronic equipment, of the first heat conduction piece and used for dissipating heat of the first heat conduction piece;
the air duct comprises a first air duct and a second air duct, the first air duct extends along the extension direction of the shell, and the first air outlet is positioned on one side of the shell; the second air duct penetrates through the shell and faces the electronic equipment, and the first cooling fan is located between the first air duct and the second air duct.
2. The heat dissipation device of claim 1, wherein the first thermal conductor is a semiconductor refrigerator, the first thermal conductor comprising a cold end and a hot end, the cold end being adjacent to the electronic device, the heat dissipation device further comprising:
the control circuit is electrically connected with the first heat conduction piece and controls the first heat conduction piece to be powered on or powered off.
3. The heat dissipating device of claim 1, further comprising a heat sink;
the radiator is arranged on one side, far away from the electronic equipment, of the first heat conduction piece, and the second heat dissipation fan is arranged on the radiator.
4. The heat dissipating device of claim 1, wherein the housing has a thermally conductive mass disposed therein;
the heat conduction block is positioned between the first air inlet and the first air outlet, at least one ventilation channel is arranged in the heat conduction block, and the ventilation channel is communicated with the air channel;
the first heat conduction piece is connected with the heat conduction block.
5. The heat dissipating device of claim 1, wherein a flexible thermal pad is further disposed on a side of the housing facing away from the first thermal conductor;
the electronic device is stopped against the flexible heat conducting pad under the condition that the electronic device is installed on the clamping part.
6. The heat dissipating device of claim 5, wherein said flexible thermal pad has at least one channel disposed therein for deforming said flexible thermal pad.
7. The heat dissipating device of claim 1, further comprising a protective shell;
the protective shell is connected with the shell, an accommodating space is formed by the protective shell and the shell, and the first heat conduction piece and the second heat dissipation fan are both positioned in the accommodating space;
the protective shell is provided with a second air inlet and a second air outlet, the second air inlet and the second air outlet face the second heat dissipation fan, and the second air inlet is used for enabling air in the outer space of the protective shell to enter the protective shell, so that the second heat dissipation fan forms air flow, and the first heat conduction piece dissipates heat.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110708241.1A CN113301784B (en) | 2021-06-24 | 2021-06-24 | Heat sink device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110708241.1A CN113301784B (en) | 2021-06-24 | 2021-06-24 | Heat sink device |
Publications (2)
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| CN220108542U (en) * | 2022-10-20 | 2023-11-28 | 北京嘉楠捷思信息技术有限公司 | Electronic equipment |
| CN116185155B (en) * | 2023-04-21 | 2023-09-01 | 荣耀终端有限公司 | Heat dissipation system and electronic equipment |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN206821138U (en) * | 2017-06-07 | 2017-12-29 | 陈玉水 | A kind of mobile phone back splint with radiator structure |
| WO2020118629A1 (en) * | 2018-12-13 | 2020-06-18 | 深圳市大疆创新科技有限公司 | Electronic device |
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| CN207766038U (en) * | 2018-01-12 | 2018-08-24 | 深圳市迪奥科科技有限公司 | The wireless charger of included heat sinking function |
| CN209895297U (en) * | 2019-07-10 | 2020-01-03 | 仇焕青 | Convenient radiating machine case structure for computer |
| CN211744148U (en) * | 2019-11-05 | 2020-10-23 | 华为技术有限公司 | Wireless charging base |
| CN212305991U (en) * | 2020-06-30 | 2021-01-05 | 深圳市蓝禾技术有限公司 | Hand-held mobile terminal radiator |
| CN112020279B (en) * | 2020-08-31 | 2022-11-18 | 维沃移动通信有限公司 | Heat sink device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN206821138U (en) * | 2017-06-07 | 2017-12-29 | 陈玉水 | A kind of mobile phone back splint with radiator structure |
| WO2020118629A1 (en) * | 2018-12-13 | 2020-06-18 | 深圳市大疆创新科技有限公司 | Electronic device |
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