CN110602863A

CN110602863A - Circuit board assembly and electronic equipment with same

Info

Publication number: CN110602863A
Application number: CN201810606279.6A
Authority: CN
Inventors: 杨冬笋
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2018-06-13
Filing date: 2018-06-13
Publication date: 2019-12-20

Abstract

The present disclosure discloses a circuit board assembly and an electronic device having the same, the circuit board assembly including: base plate, intermediate layer spare, air supply arrangement and updraft ventilator, the base plate is a plurality of and arranges in proper order, every adjacent two all possess the accommodation gap between the base plate, the intermediate layer spare is established in the accommodation gap, air supply arrangement is used for to at least one the accommodation gap air supply, updraft ventilator is used for following at least one the accommodation gap convulsions. According to the circuit board assembly disclosed herein, through setting up air supply arrangement and updraft ventilator, the circulation of air speed of circuit board assembly can be accelerated, make circuit board assembly can dispel the heat fast, effectively, ensure that circuit board assembly can work for a long time high-efficiently, promote user experience.

Description

Circuit board assembly and electronic equipment with same

Technical Field

The present disclosure relates to the field of electronic device technologies, and in particular, to a circuit board assembly and an electronic device having the same.

Background

To the circuit board stack structure of sandwich plate structure, components and parts in the middle of the intermediate layer lean against together face to face, and the heat is piled up, generates heat seriously, influences the working effect.

BRIEF SUMMARY OF THE PRESENT DISCLOSURE

The present disclosure is directed to solving at least one of the technical problems of the prior art. Therefore, the present disclosure provides a circuit board assembly, which has a good heat dissipation effect and high operational reliability. In addition, this disclosure also provides an electronic device with the circuit board assembly.

A circuit board assembly according to a first aspect of the present disclosure, comprising: the substrate comprises a plurality of substrates which are sequentially arranged, and an accommodating gap is formed between every two adjacent substrates; the interlayer piece is arranged in the accommodating gap; the air supply device is used for supplying air to at least one accommodating gap; an air extraction device for extracting air from at least one of the receiving gaps.

According to the circuit board assembly disclosed herein, through setting up air supply arrangement and updraft ventilator, the circulation of air speed of circuit board assembly can be accelerated, make circuit board assembly can dispel the heat fast, effectively, ensure that circuit board assembly can work for a long time high-efficiently, promote user experience.

An electronic device according to a second aspect of the present disclosure includes a circuit board assembly according to the first aspect of the present disclosure.

According to the electronic equipment disclosed by the invention, the circuit board assembly is arranged, so that the overall working reliability and the user experience of the electronic equipment are improved.

Additional aspects and advantages of the disclosure will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the disclosure.

Drawings

Fig. 1 is an exploded view of a circuit board assembly according to one embodiment of the present disclosure;

fig. 2 is a cross-sectional view of a circuit board assembly according to one embodiment of the present disclosure;

fig. 3 is a cross-sectional view of a circuit board assembly according to one embodiment of the present disclosure;

fig. 4 is a cross-sectional view of a circuit board assembly according to one embodiment of the present disclosure;

FIG. 5 is a schematic view of an electronic device according to one embodiment of the present disclosure.

Reference numerals:

an electronic device 1000;

a circuit board assembly 100;

a substrate 1; the accommodation gap 10; a ventilation opening 11;

an electrical component 2;

an interlayer 3; an air inlet 31; an air outlet 32;

an air supply device 4; an air draft device 5; a heat sink 6.

Detailed Description

Reference will now be made in detail to the embodiments of the present disclosure, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the drawings are exemplary and intended to be illustrative of the present disclosure, and should not be construed as limiting the present disclosure.

The following disclosure provides many different embodiments, or examples, for implementing different features of the disclosure. To simplify the disclosure of the present disclosure, specific example components and arrangements are described below. Of course, they are merely examples and are not intended to limit the present disclosure. Further, the present disclosure may repeat reference numerals and/or letters in the various examples. This repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. In addition, the present disclosure provides examples of various specific processes and materials, but one of ordinary skill in the art may recognize the applicability of other processes and/or the use of other materials.

Referring now to fig. 1-4, a circuit board assembly 100 according to an embodiment of the first aspect of the present disclosure is described.

As shown in fig. 1 and 2, the circuit board assembly 100 includes: base plate 1, electrical components 2, intermediate layer piece 3, air supply arrangement 4, updraft ventilator 5, base plate 1 be a plurality of and arrange in proper order, all has accommodation gap 10 between every two adjacent base plates 1, and intermediate layer piece 3 establishes in accommodation gap 10, and air supply arrangement 4 is used for supplying air to at least one accommodation gap 10, and updraft ventilator 5 is used for following at least one accommodation gap 10 convulsions. From this, through setting up air supply arrangement 4 and updraft ventilator 5, can accelerate the circulation of air speed in the corresponding accommodation gap 10, make electrical components 2 in the corresponding accommodation gap 10 can dispel the heat fast, effectively to ensure that circuit board assembly 100 can long-time high-efficient work.

As shown in fig. 2, the at least one receiving space 10 can be both supplied with air by the air supply device 4 and also drawn with air by the air extraction device 5. Thereby, the ventilation efficiency of the receiving space 10 is higher, so that the electrical components 2 in the receiving space 10 can be more quickly and effectively radiated, thereby ensuring that the circuit board assembly 100 can work efficiently for a long time.

As shown in fig. 3, at least one receiving space 10 can be supplied with air by a plurality of air supply devices 4. In this case, the plurality of air blowing devices 4 may be all opposed to a certain position of the accommodation gap 10, or the plurality of air blowing devices 4 may be provided so as to surround the accommodation gap 10 in half. From this, on the one hand, under the unchangeable prerequisite of guaranteeing whole ventilation cooling effect, can reduce every air supply arrangement 4's running power to can prolong every air supply arrangement 4's life, on the other hand, under the unchangeable prerequisite of guaranteeing every air supply arrangement 4's running power, can improve holistic ventilation cooling effect, on the other hand again, under the condition that one of them air supply arrangement 4 is out of order, make the heat dissipation can continue to go on, improve radiating reliability.

As shown in fig. 3, at least one receiving space 10 can be drafted by a plurality of drafters 5. At this time, the plurality of air draft devices 5 may be all opposed to a certain position of the accommodation gap 10, or the plurality of air draft devices 5 may be provided so as to half surround the accommodation gap 10. From this, on the one hand, under the unchangeable prerequisite of guaranteeing whole ventilation cooling effect, can reduce every updraft ventilator 5's operating power to can prolong every updraft ventilator 5's life, on the other hand, under the unchangeable prerequisite of guaranteeing every updraft ventilator 5's operating power, can improve holistic ventilation cooling effect, on the other hand again, under the condition that one of them updraft ventilator 5 is out of order, make the heat dissipation can continue to go on, improve radiating reliability.

As shown in fig. 4, at least one air blowing device 4 can blow air to a plurality of accommodation gaps 10 at the same time. Therefore, on the premise of ensuring that the whole ventilation and heat dissipation effect is not changed, the quantity of the air supply devices 4 can be reduced, the whole input cost of the air supply devices 4 is reduced, and the whole installation efficiency of the air supply devices 4 is improved.

As shown in fig. 4, at least one air extraction device 5 can extract air from a plurality of receiving gaps 10 simultaneously. From this, under the unchangeable prerequisite of whole ventilation cooling effect, can reduce updraft ventilator 5's quantity, reduce the holistic input cost of updraft ventilator 5, improve the holistic installation effectiveness of updraft ventilator 5.

Referring now to fig. 1-2, a circuit board assembly 100 according to one specific example of the present disclosure is described.

As shown in fig. 1 and 2, there are two substrates 1, an annular interlayer member 3 is disposed between the two substrates 1, the interlayer member 3 has an air inlet 31 and an air outlet 32, the air supply device 4 is disposed opposite to the air inlet 31, and the air exhaust device 5 is disposed opposite to the air outlet 32. Here, it should be noted that "annular" as used herein refers to a closed ring, but is not limited to a circular ring shape, and may also be a rectangular ring shape, a polygonal ring shape, and the like. Further, the present disclosure is not limited thereto, and the sandwich member 3 may also be configured in other shapes, for example, may be an open ring shape or the like.

Specifically, in the related art, there is a sandwich plate structure composed of two base plates and a sandwich member, and the electrical components on the opposite surfaces of the two base plates can be abutted face to face without convection with the outer air of the sandwich member, and the heat generation is relatively serious. According to the circuit board assembly 100 of the embodiment of the invention, the air draft device 5 and the air supply device 4 are added on the basis of the existing sandwich plate structure, the air inlet 31 and the air outlet 32 are formed in the sandwich piece 3, the air supply device 4 can supply cold air into the sandwich piece 3 through the air inlet 31, and the air draft device 5 can exhaust hot air in the sandwich piece 3 through the air outlet 32, so that the heat dissipation effect in the sandwich piece 3 can be improved, and the overall working reliability of the circuit board assembly 100 is further improved. In short, according to the circuit board assembly 100 of the embodiment of the invention, the electrical component 2 disposed between the two substrates 1 can obtain good heat dissipation and cooling effects, thereby ensuring that the circuit board assembly 100 can work efficiently for a long time.

As shown in fig. 2, the inlet opening 31 and the outlet opening 32 may be located on both sides of the length of the sandwich member 3. Therefore, the airflow circulation path can be extended, so that the airflow can more completely flow through the annular space of the interlayer 3, and the electrical component 2 arranged in the interlayer 3 can be well cooled.

Referring to fig. 1, at least one of the air inlet 31 and the air outlet 32 is plural, that is, the air inlet 31 may be plural, and the air outlet 32 may also be plural, so that the ventilation efficiency may be further improved. Moreover, it can be understood that the effect of the interlayer member 3 is usually for supporting, shielding and signal connection, and on the premise of ensuring the whole air inlet area to be unchanged, the air inlets 31 are set to be a plurality of, which can effectively reduce the area of each air inlet 31, thereby ensuring the reliable shielding effect, and similarly, on the premise of ensuring the whole air outlet area to be unchanged, the air outlets 32 are set to be a plurality of, which can effectively reduce the area of each air outlet 32, thereby ensuring the reliable shielding effect. Furthermore, for the convenience of connection, the two substrates 1 and the interlayer member 3 may be bonded together by bonding pads.

As shown in fig. 2, at least one of the substrates 1 has a vent 11 formed thereon. Therefore, when the blower 4 and the air draft device 5 are operated, the air flow in the accommodating gap 10 can also flow out of the accommodating gap 10 (above the upper substrate 1 and below the lower substrate 1 as shown in fig. 2) through the vent 11, so that the ventilation efficiency can be further improved, and the heat dissipation effect can be improved.

As shown in fig. 2, at least one of the air supply device 4 and the air extraction device 5 is provided outside the ring of the sandwich member 3. That is, the air supply device 4 and the air exhaust device 5 may be both arranged outside the ring of the sandwich member 3, and one of the air supply device 4 and the air exhaust device 5 may be arranged outside the ring of the sandwich member 3. Therefore, installation and subsequent maintenance are convenient. Of course, the present disclosure is not limited thereto, and at least one of the air blowing device 4 and the air extracting device 5 may be provided in the ring of the sandwich member 3, thereby improving the structural compactness of the whole circuit board assembly 100.

As shown in fig. 2, the air blowing device 4 and the air extracting device 5 may be both mounted on the base plate 1. Therefore, the air supply device 4 and the air exhaust device 5 can be conveniently installed, the ideal and reliable installation positions of the air supply device 4 and the air exhaust device 5 can be simply and effectively ensured, and the optimal ventilation effect can be exerted. Moreover, by mounting the air supply device 4 and the air exhaust device 5 on the base plate 1, the circuit board assembly 100 can also be formed into an integrated module, thereby facilitating the application of the circuit board assembly 100. Of course, the present disclosure is not limited thereto, and the air blowing device 4 and the air draft device 5 may be installed at other positions, for example, a housing of the electronic device 1000 to which the circuit board assembly 100 is applied, or the like, so as to meet different practical requirements.

As shown in fig. 2, a heat sink 6 may be further provided between the two substrates 1. For example, the heat sink 6 may be a heat sink fin, a liquid-cooled heat sink, a thermoelectric cooling heat sink, or the like. Therefore, the radiator 6 can work in cooperation with the air supply device 4 and the air exhaust device 5, and a better ventilation and heat dissipation effect is achieved. In addition, it should be noted that the air supply device 4 and the air exhaust device 5 according to the embodiment of the present invention may work simultaneously or may not work simultaneously, and these may be specifically selected according to actual requirements, and are not described herein again. In addition, the air blowing device 4 and the air extracting device 5 can be both pneumatic devices such as a micro fan.

Next, referring to fig. 5, an electronic device 1000 according to an embodiment of the second aspect of the present disclosure is described.

As shown in fig. 5, an electronic device 1000 according to an embodiment of the present disclosure may include the circuit board assembly 100 of the first aspect embodiment described above. Therefore, according to the electronic device 1000 of the embodiment of the present disclosure, by setting the above circuit board assembly 100, since the circuit board assembly 100 can obtain an effective heat dissipation effect, the circuit board assembly 100 can always work within a suitable temperature range to keep the best working performance, thereby improving the overall working performance of the electronic device 1000, and further improving the user experience.

In addition, the electronic device 1000 according to the embodiment of the present disclosure is not limited in kind, and may be, for example, a mobile phone, a tablet computer, a display, a smart watch, a smart speaker, a smart headset, etc., and other configurations, such as a battery, etc., and operations of the electronic device 1000 according to the embodiment of the present disclosure are known to those skilled in the art and will not be described in detail herein.

In the description of the present disclosure, it is to be understood that the terms "first", "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present disclosure, "a plurality" means two or more unless specifically limited otherwise.

In the present disclosure, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integral; the connection can be mechanical connection, electrical connection or communication; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present disclosure can be understood by those of ordinary skill in the art as appropriate. In the present disclosure, unless otherwise expressly stated or limited, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through an intermediate.

In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present disclosure. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.

While embodiments of the present disclosure have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the disclosure, the scope of which is defined by the claims and their equivalents.

Claims

1. A circuit board assembly, comprising:

the substrate comprises a plurality of substrates which are sequentially arranged, and an accommodating gap is formed between every two adjacent substrates;

the interlayer piece is arranged in the accommodating gap;

the air supply device is used for supplying air to at least one accommodating gap;

an air extraction device for extracting air from at least one of the receiving gaps.

2. The circuit board assembly of claim 1, wherein at least one of the receiving gaps is both supplied with air by the air supply and drawn with air by the air extractor.

3. The circuit board assembly of claim 1, wherein at least one of said receiving gaps blows air through a plurality of said air blowing devices.

4. The circuit board assembly of claim 1, wherein at least one of the receiving gaps is drafted by a plurality of the drafters.

5. The circuit board assembly of claim 1, wherein at least one of the air blowing devices blows air to a plurality of the receiving gaps simultaneously.

6. The circuit board assembly of claim 1, wherein at least one of the air extractors extracts air from a plurality of the receiving gaps simultaneously.

7. The circuit board assembly of claim 1, wherein the number of the base plates is two, an annular interlayer is arranged between the two base plates, the interlayer is provided with an air inlet and an air outlet, the air supply device is arranged opposite to the air inlet, and the air exhaust device is arranged opposite to the air outlet.

8. The circuit board assembly of claim 7, wherein the air inlet and the air outlet are located on opposite sides of a length of the sandwich.

9. The circuit board assembly of claim 7, wherein at least one of the intake vent and the outtake vent is plural.

10. The circuit board assembly of claim 7, wherein at least one of the substrates has a vent opening therein.

11. The circuit board assembly of claim 7, wherein at least one of the air-moving device and the air-extracting device is disposed outside the loop of the sandwich.

12. The circuit board assembly of claim 7, wherein a heat sink is further disposed between the two substrates.

13. The circuit board assembly of claim 12, wherein the heat sink is a heat sink fin, or a liquid-cooled heat sink, or a thermoelectric cooling heat sink.

14. The circuit board assembly of any of claims 1-13, wherein the air mover and the air extractor are both mounted on the base plate.

15. An electronic device, characterized in that it comprises a circuit board assembly according to any one of claims 1-14.