CN113042350A - Piezoelectric micro-mechanical transducer - Google Patents
Piezoelectric micro-mechanical transducer Download PDFInfo
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- CN113042350A CN113042350A CN202110423696.9A CN202110423696A CN113042350A CN 113042350 A CN113042350 A CN 113042350A CN 202110423696 A CN202110423696 A CN 202110423696A CN 113042350 A CN113042350 A CN 113042350A
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- 238000002955 isolation Methods 0.000 claims abstract description 25
- 239000000463 material Substances 0.000 claims description 21
- 229910052751 metal Inorganic materials 0.000 claims description 18
- 239000002184 metal Substances 0.000 claims description 18
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 14
- 229910052710 silicon Inorganic materials 0.000 claims description 14
- 239000010703 silicon Substances 0.000 claims description 14
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 9
- 229910052760 oxygen Inorganic materials 0.000 claims description 9
- 239000001301 oxygen Substances 0.000 claims description 9
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 8
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 8
- 239000000758 substrate Substances 0.000 claims description 8
- 239000010936 titanium Substances 0.000 claims description 5
- 229910002113 barium titanate Inorganic materials 0.000 claims description 4
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 4
- 229910052451 lead zirconate titanate Inorganic materials 0.000 claims description 4
- 239000011787 zinc oxide Substances 0.000 claims description 4
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 3
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 claims description 3
- 229910052750 molybdenum Inorganic materials 0.000 claims description 3
- 239000011733 molybdenum Substances 0.000 claims description 3
- 229910052697 platinum Inorganic materials 0.000 claims description 3
- BITYAPCSNKJESK-UHFFFAOYSA-N potassiosodium Chemical compound [Na].[K] BITYAPCSNKJESK-UHFFFAOYSA-N 0.000 claims description 3
- 229910052719 titanium Inorganic materials 0.000 claims description 3
- 230000005284 excitation Effects 0.000 description 8
- 238000006073 displacement reaction Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000035945 sensitivity Effects 0.000 description 3
- 229910002328 LaMnO3 Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- HBAGRTDVSXKKDO-UHFFFAOYSA-N dioxido(dioxo)manganese lanthanum(3+) Chemical compound [La+3].[La+3].[O-][Mn]([O-])(=O)=O.[O-][Mn]([O-])(=O)=O.[O-][Mn]([O-])(=O)=O HBAGRTDVSXKKDO-UHFFFAOYSA-N 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 230000000644 propagated effect Effects 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
- B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
- B06B1/0611—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements in a pile
- B06B1/0618—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements in a pile of piezo- and non-piezoelectric elements, e.g. 'Tonpilz'
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/10—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of mechanical energy
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Transducers For Ultrasonic Waves (AREA)
Abstract
The invention discloses a piezoelectric micromechanical transducer, which belongs to the technical field of transducers and solves the problems of large volume and high cost of devices caused by the fact that a plurality of transducers are adopted to form an array. The invention divides the electrode of the diaphragm area into the inner side and the outer side through the isolation groove, thereby realizing the high-performance self-generating and self-receiving work of a single transducer.
Description
Technical Field
The invention belongs to the technical field of transducers, and particularly relates to a piezoelectric micro-mechanical transducer.
Background
The piezoelectric micro-mechanical transducer completes electromechanical coupling through the piezoelectric material layer to realize the mutual conversion of mechanical signals and electrical signals. When the transducer is not externally connected with a power supply, mechanical vibration from the outside is transmitted to the piezoelectric material layer, so that the piezoelectric material is slightly deformed, the upper surface and the lower surface of the piezoelectric material generate a potential difference, the detection of the potential difference can be realized through the upper metal layer and the lower metal layer of the piezoelectric material layer, and an external mechanical signal is converted into an electrical signal in the process, namely the piezoelectric effect. When the upper and lower metal layers of the piezoelectric material are connected with an external power supply, the piezoelectric material will be slightly deformed, so as to generate vibration, mechanical waves are generated and propagated outwards in the vibration process, and the process converts electrical signals into mechanical signals, which is called inverse piezoelectric effect.
The transducer is used for converting an electrical signal and a mechanical signal into each other, namely, the transducer is used as a transmitter and a receiver. Due to the different performance criteria of the transmitter and the receiver, it is often difficult to compromise the performance required for both modes of operation for a transducer of the same configuration. Therefore, the traditional transducer system adopts a plurality of transducers to realize transceiving work, namely, a part of transducers are only used for a transmitter, and the structure of the part of transducers is finely adjusted, so that the transmitting performance of the part of transducers is more excellent; and the other part of the transducer is only used for a receiver, and the structure of the transducer is also finely adjusted, so that the receiving performance of the part of the transducer is more excellent. Therefore, the conventional transducer system is implemented by using multiple transducers to form an array, so that the device size is large, the circuit and the signal processing algorithm are complex, and the cost is high due to the use of multiple transducers.
Disclosure of Invention
The invention aims to:
in order to solve the problems of large device volume and high cost caused by adopting a plurality of transducers to form an array in the prior art, the piezoelectric micro-mechanical transducer is provided.
The technical scheme adopted by the invention is as follows:
the utility model provides a piezoelectricity micromechanical transducer, includes the basement, the basement includes end silicon layer and sets up the oxygen burying layer on end silicon layer, oxygen burying layer top is by supreme top silicon layer, bottom metal level, piezoelectric material layer and the top metal level of having connected gradually down, the basement central point that end silicon layer and oxygen burying layer department puts and is provided with the back cavity, form on the piezoelectric material layer with the back cavity shape the same, the size of a dimension the same, the corresponding vibrating diaphragm region in position, piezoelectric material layer in the vibrating diaphragm region is including installing the vibrating diaphragm outside electrode in the outside, vibrating diaphragm outside electrode internally mounted has the inboard electrode of vibrating diaphragm, is provided with the isolation slot between vibrating diaphragm outside electrode and the inboard electrode of vibrating diaphragm.
Furthermore, the vibrating diaphragm outer side electrode, the vibrating diaphragm inner side electrode and the isolation groove are equally divided into four mutually independent parts by two crossed air gaps, and the air gaps are formed by connecting straight sections at two ends and arc sections between the two straight sections. The vibrating diaphragm area of the piezoelectric micro-mechanical transducer is designed to be circular, and is divided into four areas by the air gap with the center rotationally symmetrical to form four independent fan-like vibrating diaphragms, so that the tail ends of the fan-like vibrating diaphragms obtain the maximum vibration displacement under fixed excitation.
Further, be provided with two air gaps on vibrating diaphragm outside electrode, the inboard electrode of vibrating diaphragm and the isolation slot, two air gaps are around the central point central symmetry in vibrating diaphragm region, and the air gap is connected by the outside outer arc section of intercommunication vibrating diaphragm outside electrode and the interior segmental arc that is located inside and is formed, interior segmental arc is quarter arc shape or eighth arc shape, outer segmental arc is eighth arc shape, and the radius of outer segmental arc is greater than the radius of interior segmental arc.
Furthermore, four air gaps are arranged on the outer electrode of the diaphragm, the inner electrode of the diaphragm and the isolation groove, the four air gaps are centrosymmetric around the central point of the diaphragm area, and the air gaps are all in an eighth arc shape.
The design of the air gap of the transducer is to improve the vibration amplitude or vibration sensitivity of the transducer and adjust the resonant frequency of the device, so that the device can work in a frequency band range meeting the application requirement.
Furthermore, the outer side electrode of the diaphragm is connected with an outer side electrode pad, the inner side electrode of the diaphragm is connected with an inner side electrode pad, isolation grooves are formed between the outer side electrode pad and the inner side electrode pad, the outer side electrode pad and the inner side electrode pad are installed inside the substrate, and an earth electrode pad is further installed in the substrate.
Further, the diaphragm area is circular or square, the isolation groove in the circular diaphragm area is circular, and the isolation groove in the square diaphragm area is square.
Further, the piezoelectric material layer is composed of aluminum nitride, zinc oxide, lead zirconate titanate, potassium sodium niobate, or barium titanate.
Further, the top metal layer and the bottom metal layer are composed of gold, platinum, molybdenum, titanium or conductive oxide.
In summary, due to the adoption of the technical scheme, the invention has the beneficial effects that:
1. the invention divides the electrode of the diaphragm area into an inner part and an outer part through the isolation groove and realizes independent excitation inside and outside, so that the transducer can switch two working modes of the transmitter and the receiver according to requirements, thereby realizing high-performance self-generating and self-receiving work of a single transducer.
2. The invention reduces the rigidity of the micro-mechanical structure through various different air gap designs, so that the transducer has larger vibration amplitude during working, and the transmitting sensitivity, the receiving sensitivity and the working linearity of the device are improved.
3. The invention sets a smaller air gap in the electrode to limit the air flow, so that the four fan-shaped diaphragms are represented as a single diaphragm in motion, and the problem of sound leakage of the air gap is solved.
Drawings
FIG. 1 is a top view of a transducer with a circular diaphragm region according to the present invention;
FIG. 2 is a front view cross-section of a transducer of the present invention;
FIG. 3 is an angle, radius plot of the transducer of FIG. 1;
FIG. 4 is a top view of a transducer with a square diaphragm region according to the present invention;
FIG. 5 is a schematic view of one embodiment of an air gap of the present invention;
FIG. 6 is a schematic view of one embodiment of an air gap of the present invention;
FIG. 7 is a schematic view of one embodiment of an air gap of the present invention.
The labels in the figure are: 1-bottom silicon layer, 2-buried oxide layer, 3-top silicon layer, 4-bottom metal layer, 5-piezoelectric material layer, 6-top metal layer, 7-back cavity, 8-diaphragm region, 9-diaphragm outer electrode, 10-diaphragm inner electrode, 11-isolation trench, 12-air gap, 13-outer electrode pad, 14-inner electrode pad, 15-substrate, 16-grounding electrode pad.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail with reference to the following embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
The basic scheme of the invention is as follows:
the utility model provides a piezoelectric micro-mechanical transducer, including basement 15, basement 15 includes bottom silicon layer 1 and sets up the buried oxygen layer 2 on bottom silicon layer 1, buried oxygen layer 2 top has connected gradually top silicon layer 3 from lower supreme, bottom metal level 4, piezoelectric material layer 5 and top metal level 6, bottom silicon layer 1 and the 15 central point of basement of buried oxygen layer 2 department put and are provided with back cavity 7, form on the piezoelectric material layer 5 and the back cavity 7 shape the same, the size of a dimension the same, the corresponding vibrating diaphragm region 8 in position, piezoelectric material layer 5 in the vibrating diaphragm region 8 is including installing in the vibrating diaphragm outside electrode 9 in the outside, vibrating diaphragm outside electrode 9 internally mounted has vibrating diaphragm inside electrode 10, be provided with between vibrating diaphragm outside electrode 9 and the vibrating diaphragm inside electrode 10 and keep apart slot 11.
The isolation trenches 11 are formed by etching away the top metal layer 6 at corresponding pattern locations during the fabrication process. The width of the isolation trench 11 should be moderate, and too small will cause the diaphragm inner electrode 10 and the diaphragm outer electrode 9 to form a capacitance effect, and too large will reduce the driving area and reduce the device performance.
As shown in fig. 1 to 7, the following are preferred embodiments of the present invention in the basic aspect:
example 1
As shown in fig. 1, the diaphragm outer electrode 9, the diaphragm inner electrode 10 and the isolation trench 11 are divided into four independent parts by two intersecting air gaps 12, and each air gap 12 is formed by connecting a straight section at two ends with an arc section between the two straight sections. The diaphragm area 8 of the piezoelectric micro-mechanical transducer is designed to be circular, and is divided into four areas by the air gap 12 with the center rotationally symmetrical to form four independent fan-like diaphragms, so that the tail ends of the fan-like diaphragms obtain the maximum vibration displacement under fixed excitation.
As shown in fig. 3, the radius and center position of the circle R1 affect the vibration states of four independent fan-like diaphragms, and are designed according to the principle that the end M1 of the fan-like diaphragm S1 obtains the maximum vibration displacement under fixed excitation. The angle inside the circle R2 has a large influence on the vibration frequency of the four independent fan-like diaphragms, the larger the angle, the lower the resonance frequency.
The radius of the circle R3 plays a crucial role in the distribution of the operating performance of the transducer, i.e. the area of the diaphragm inner electrode 10 and the diaphragm outer electrode 9. The areas of the inner electrode 10 and the outer electrode 9 of the diaphragm are greatly changed in different application scenes and different working frequencies. Furthermore, the width of the air gap 12 should be as small as possible, so that the loss of thermal tack during vibration restricts the flow of air, so that the four fan-like diaphragms behave kinematically as a single diaphragm.
Example 2
As shown in fig. 4, the diaphragm region 8 and the isolation trench 11 are both designed to be square, the diaphragm outer electrode 9, the diaphragm inner electrode 10 and the isolation trench 11 are divided into four independent parts by two intersecting air gaps 12, and the air gaps 12 are formed by connecting straight sections at two ends and an arc section between the two straight sections. The diaphragm area 8 of the piezoelectric micro-mechanical transducer is designed to be circular, and is divided into four areas by the air gap 12 with the center rotationally symmetrical to form four independent fan-like diaphragms, so that the tail ends of the fan-like diaphragms obtain the maximum vibration displacement under fixed excitation.
Example 3
As shown in fig. 5, two air gaps 12 are arranged on the diaphragm outer electrode 9, the diaphragm inner electrode 10 and the isolation groove 11, the two air gaps 12 are centrosymmetric around the central point of the diaphragm region 8, the air gaps 12 are formed by connecting an outer arc section communicated with the outside of the diaphragm outer electrode 9 and an inner arc section located inside, the inner arc section is a quarter arc shape, the outer arc section is an eighth arc shape, and the radius of the outer arc section is greater than that of the inner arc section.
Example 4
As shown in fig. 6, two air gaps 12 are arranged on the diaphragm outer electrode 9, the diaphragm inner electrode 10 and the isolation trench 11, the two air gaps 12 are centrosymmetric around the central point of the diaphragm region 8, the air gaps 12 are formed by connecting an outer arc section communicated with the outside of the diaphragm outer electrode 9 and an inner arc section located inside, the inner arc section is in an eighth arc shape, the outer arc section is in an eighth arc shape, and the radius of the outer arc section is greater than that of the inner arc section.
Example 5
As shown in fig. 7, four air gaps 12 are disposed on the diaphragm outer electrode 9, the diaphragm inner electrode 10 and the isolation trench 11, the four air gaps 12 are symmetric around the center of the diaphragm region 8, and the air gaps 12 are all one-eighth arc-shaped.
The working principle of the transducer of the invention is as follows:
the transducer can work in a transmitter mode and a receiver mode, wherein in the transmitter working mode, the areas of the inner electrode 10 and the outer electrode 9 of the diaphragm are excited by two paths with the phase difference of 180 degrees; in the receiver mode of operation, the diaphragm inner electrode 10 is not connected to an external circuit, and the diaphragm outer electrode 9 is connected to an external circuit.
When the transducer works in a mode of converting an electrical signal into a mechanical signal, namely a transmitter, the excitation mode is that excitation signals with opposite phases are applied to the vibrating diaphragm inner electrode 10 and the vibrating diaphragm outer electrode 9 so as to improve the vibration amplitude to the maximum extent; when the transducer is operated in a mode for converting an external mechanical signal into an electrical signal, i.e. a receiver, the diaphragm inner electrode 10 is suspended and the diaphragm outer electrode 9 acts as a sensing electrode.
The high-performance self-transmitting and self-receiving work of a single transducer can be realized by applying excitation to switch the working mode according to a specific working mode, and the cost of the transducer system is greatly reduced.
For the piezoelectric material layer in fig. 2, the piezoelectric material may be aluminum nitride AlN and scandium-doped aluminum nitride ScAlN, zinc oxide ZnO, lead zirconate titanate PbZr1-xTixO3PZT and its doped compounds, potassium sodium niobate (K, Na) NbO3KNN and its doped compounds or barium titanate BaTiO3. For the top metal layer and the bottom metal layer, the metal material may be gold Pt, platinum Pt, molybdenum Mo, titanium Ti, etc., or may be conductive oxide, such as lanthanum manganate LaMnO3And doping compounds thereof.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.
Claims (8)
1. A piezoelectric micro-mechanical transducer is characterized by comprising a substrate (15), wherein the substrate (15) comprises a bottom silicon layer (1) and an oxygen burying layer (2) arranged on the bottom silicon layer (1), a top silicon layer (3), a bottom metal layer (4), a piezoelectric material layer (5) and a top metal layer (6) are sequentially connected to the upper portion of the oxygen burying layer (2) from bottom to top, a back cavity (7) is arranged at the central position of the substrate (15) at the positions of the bottom silicon layer (1) and the oxygen burying layer (2), a vibrating diaphragm area (8) which is the same as the back cavity (7) in shape, the same in size and corresponding in position is formed on the piezoelectric material layer (5), the piezoelectric material layer (5) in the vibrating diaphragm area (8) comprises a vibrating diaphragm outer side electrode (9) arranged on the outer side, and a vibrating diaphragm inner side electrode (10) is arranged inside the vibrating diaphragm outer side, an isolation groove (11) is arranged between the diaphragm outer side electrode (9) and the diaphragm inner side electrode (10).
2. A piezoelectric micromechanical transducer according to claim 1, characterized in that the diaphragm outer electrode (9), the diaphragm inner electrode (10) and the isolation trench (11) are divided into four mutually independent parts by two intersecting air gaps (12), and the air gaps (12) are each formed by a straight section at both ends and an arc section between the two straight sections.
3. The piezoelectric micromechanical transducer according to claim 1, wherein two air gaps (12) are disposed on the diaphragm outer electrode (9), the diaphragm inner electrode (10) and the isolation trench (11), the two air gaps (12) are centrosymmetric around the center point of the diaphragm region (8), each air gap (12) is formed by connecting an outer arc section and an inner arc section, the outer arc section is communicated with the outside of the diaphragm outer electrode (9), the inner arc section is a quarter arc shape or an eighth arc shape, the outer arc section is an eighth arc shape, and the radius of the outer arc section is greater than that of the inner arc section.
4. A piezoelectric micromechanical transducer according to claim 1, characterized in that four air gaps (12) are arranged on the diaphragm outer electrode (9), the diaphragm inner electrode (10) and the isolation trench (11), the four air gaps (12) are centrosymmetric around the center point of the diaphragm region (8), and the air gaps (12) are each in the shape of an eighth of a circular arc.
5. A piezoelectric micromechanical transducer according to claim 1, characterized in that the diaphragm outer electrode (9) is connected to an outer electrode pad (13), the diaphragm inner electrode (10) is connected to an inner electrode pad (14), an isolation trench (11) is provided between the outer electrode pad (13) and the inner electrode pad (14), the outer electrode pad (13) and the inner electrode pad (14) are both mounted inside the substrate (15), and a ground electrode pad (16) is further mounted inside the substrate (15).
6. A piezoelectric micromechanical transducer according to claim 1, characterized in that the diaphragm region (8) is circular or square in shape, the isolation trenches (11) in the circular diaphragm region (8) are circular, and the isolation trenches (11) in the square diaphragm region (8) are square.
7. A piezoelectric micromechanical transducer according to claim 1, characterized in that the piezoelectric material layer (5) consists of aluminum nitride, zinc oxide, lead zirconate titanate, potassium-sodium niobate or barium titanate.
8. A piezoelectric micromechanical transducer according to claim 1, characterized in that the top metal layer (6) and the bottom metal layer (4) consist of gold, platinum, molybdenum, titanium or conductive oxides.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202110423696.9A CN113042350A (en) | 2021-04-20 | 2021-04-20 | Piezoelectric micro-mechanical transducer |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110423696.9A CN113042350A (en) | 2021-04-20 | 2021-04-20 | Piezoelectric micro-mechanical transducer |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114950926A (en) * | 2022-06-24 | 2022-08-30 | 江苏英特神斯科技有限公司 | Piezoelectric micro-mechanical ultrasonic transducer array and manufacturing method thereof |
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- 2021-04-20 CN CN202110423696.9A patent/CN113042350A/en active Pending
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| US20170320093A1 (en) * | 2016-05-03 | 2017-11-09 | Globalfoundries Singapore Pte. Ltd. | ELECTRODE ARRANGEMENT FOR A pMUT and pMUT TRANSDUCER ARRAY |
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