CN113036829A

CN113036829A - Wireless charging equipment

Info

Publication number: CN113036829A
Application number: CN201911358688.XA
Authority: CN
Inventors: 裴林; 颜龙平
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2019-12-25
Filing date: 2019-12-25
Publication date: 2021-06-25
Also published as: WO2021129443A1; EP4064503A4; EP4064503A1; US20220302757A1

Abstract

The application relates to a wireless charging device, including: the shell is provided with a first air port and a second air port. The coil module and the mainboard module are positioned in the shell. The heat dissipation assembly is used for dissipating heat of the coil module and the mainboard module; the heat dissipation assembly comprises a heat radiator and a fan, the heat radiator comprises a first side and a second side which are arranged in a back-to-back mode, the coil module is arranged on the first side, the fan is arranged on the second side, the fan is provided with a third air opening and a fourth air opening, and the first air opening, the second air opening, the third air opening and the fourth air opening are communicated to form a heat dissipation air channel located on the second side. When the fan works, external air flow can flow through the heat dissipation air duct formed by the first air opening, the second air opening and the fourth air opening of the third air opening, so that heat of the heat dissipation assembly can be transmitted to the outside of the shell, the temperature of the wireless charging equipment is reduced, and the wireless charging equipment has high heat dissipation efficiency.

Description

Wireless charging equipment

Technical Field

The application relates to the technical field of charging, in particular to wireless charging equipment.

Background

Traditional wireless charging equipment's heat dispersion is not good, and when treating charging equipment charging, wireless charging equipment's temperature rises very fast, and the radiating efficiency is lower.

Disclosure of Invention

The embodiment of the application provides a wireless charging device to solve the technical problem that the heat dissipation efficiency of the wireless charging device is low.

A wireless charging device, comprising:

the shell is provided with a first air port and a second air port;

the coil module and the mainboard module are positioned in the shell;

the heat dissipation assembly is used for dissipating heat generated by the coil module and the mainboard module; the heat dissipation assembly comprises a radiator and a fan, the radiator comprises a first side and a second side which are arranged in a back-to-back mode, the coil module is arranged on the first side, the fan is arranged on the second side, the fan is provided with a third air opening and a fourth air opening, and the first air opening, the second air opening, the third air opening and the fourth air opening are communicated to form a heat dissipation air channel located on the second side of the radiator.

According to the wireless charging equipment, the heat dissipation assembly can dissipate the heat of the coil module and the mainboard module, so that the heat of the coil module and the heat of the mainboard module can be transferred, and the coil module and the mainboard module can be cooled; when the fan works, external air flow can flow through the heat dissipation air duct formed by the first air opening, the second air opening and the fourth air opening of the third air opening, so that heat generated by the coil module and the mainboard module can be transmitted to the outside of the shell, the temperature of the wireless charging equipment is reduced, and the wireless charging equipment has high heat dissipation efficiency.

In one embodiment, the heat dissipation assembly further includes a wind scooper connected to the fan for guiding the airflow flowing out of the fan from the fourth air opening to flow through the second side of the heat sink and flow out of the housing from the second air opening.

In one embodiment, the wind scooper includes a connecting member and a wind deflector, one end of the connecting member is connected to one end of the fan, at which the fourth wind gap is opened, and the wind deflector is connected to the other end of the connecting member.

In one embodiment, the connecting piece comprises a top wall, a bottom wall and two side walls, a through groove is formed by the top wall, the bottom wall and the two side walls in an enclosing mode, the through groove is communicated with the fourth air opening, and the air deflector is connected with the bottom wall.

In one embodiment, a through hole is formed in one end, far away from the fan, of the air deflector, and the through hole is communicated with the second air opening.

In one embodiment, the heat dissipation assembly further includes at least two fins, the fins are located between the second side of the heat sink and the air guide plate, an air guide groove is formed between adjacent fins, and two ends of the air guide groove are respectively communicated with the through groove and the through opening.

In one embodiment, the second side of the heat sink is provided with a wind guide wall extending obliquely relative to the wind guide plate, and the wind guide wall is arranged corresponding to the through opening and used for guiding the airflow flowing through the wind guide groove to the through opening and the second air opening.

In one embodiment, the housing comprises a first casing located on a side of the fan facing away from the heat sink; the first tuyere and the second tuyere are located in the first housing.

In one embodiment, the air deflector is protruded out of the outer surface of the first shell and located between the first air opening and the second air opening.

In one embodiment, the outer surface of the first housing is provided with a leg having the same height as the wind deflector.

In one embodiment, the wireless charging device comprises reinforcing ribs arranged at the first air opening and the second air opening, and the reinforcing ribs are positioned on one side of the inner surface of the first shell.

In one embodiment, the heat dissipation assembly includes a thermally conductive element secured to a first side of the heat sink;

at least part of the structure of the coil module is attached to the heat conducting element, and the heat conducting element can absorb the heat of the coil module;

at least partial structure of the mainboard module is attached to the heat conducting element, and the heat conducting element can absorb the heat of the mainboard module.

In one embodiment, a groove is formed in the first side of the heat sink, and the heat conducting element is accommodated in the groove.

In one embodiment, a convex ring is arranged on the first side of the heat sink, and the coil module is accommodated in an area surrounded by the convex ring.

In one embodiment, the main board module is provided with a notch, and the convex ring is located in the notch.

In one embodiment, the motherboard module comprises a heat source region, the heat source region is attached to the heat conducting element, and the heat conducting element can absorb heat of the heat source region.

In one embodiment, the heat source region and the fan are disposed opposite each other on the heat sink.

In one embodiment, the thermally conductive element comprises a heat pipe or a vapor chamber.

In one embodiment, the housing comprises a first shell and a second shell which are connected with each other, and the first air opening and the second air opening are positioned in the first shell; the second housing is used for supporting a device to be charged.

In one embodiment, a heat storage material is attached to the surface of the second shell; alternatively, the first and second electrodes may be,

the surface of the second shell is pasted with a heat insulation material; alternatively, the first and second electrodes may be,

and the surface of the second shell is pasted with a heat conduction material.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

Fig. 1 is a side view of a wireless charging device according to an embodiment, wherein a device to be charged is located on the wireless charging device;

fig. 2 is a perspective view of the wireless charging device shown in fig. 1;

fig. 3 is a perspective view of another angle of the wireless charging device shown in fig. 1;

fig. 4a is an exploded view of the wireless charging device shown in fig. 1;

fig. 4b is a cross-sectional view of the wireless charging device of fig. 1 at an angle with the first housing removed;

fig. 4c is a cross-sectional view of the wireless charging device of fig. 1 at another angle;

fig. 4d is a cross-sectional view of the wireless charging device of fig. 1 at yet another angle;

fig. 5 is a perspective view of a first housing of the wireless charging device shown in fig. 4 a;

FIG. 6 is a main body view of the first housing shown in FIG. 5;

fig. 7 is a top view of the wireless charging device of fig. 2 with the second housing and electronic components removed;

fig. 8 is a perspective view of a heat sink assembly of the wireless charging device shown in fig. 4 a;

fig. 9 is a perspective view of the heat sink assembly and electronic components of the wireless charging device shown in fig. 4a in an assembled state;

fig. 10 is a perspective view of the fan and the wind scooper of the wireless charging device shown in fig. 4 a;

FIG. 11 is a perspective view of the fan and wind scooper shown in FIG. 10 in a separated state;

fig. 12 is a perspective view of the heat sink and fins of the wireless charging device of fig. 4a at another angle;

fig. 13 is a perspective view of the heat sink assembly shown in fig. 8 at another angle.

Detailed Description

To facilitate an understanding of the present application, the present application will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present application are illustrated in the accompanying drawings. This application may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

As shown in fig. 1, in one embodiment, a wireless charging device 10 is provided, the wireless charging device 10 being capable of charging a device to be charged 20.

As shown in fig. 2, in an embodiment, the wireless charging device 10 includes a housing 100, the housing 100 includes a first housing 120 and a second housing 110, and the first housing 120 and the second housing 110 are assembled to form an external structure of the wireless charging device 10. When the wireless charging device 10 is used to charge the device to be charged 20, the device to be charged 20 needs to be placed on the second housing 110.

As shown in fig. 3, in an embodiment, the first casing 120 is provided with a first air opening 121 and a second air opening 122, and an external air flow can enter the casing 100 through one of the first air opening 121 and the second air opening 122 and flow out of the casing 100 from the other one of the first air opening 121 and the second air opening 122, so that heat in the casing 100 can be taken away by the external air flow, thereby reducing the temperature of the wireless charging device 10.

As shown in fig. 4a, in one embodiment, the wireless charging device 10 includes an electronic component 200 and a heat sink component 300 located within the housing 100 and arranged in sequence. The electronic component 200 is capable of charging the device 20 to be charged, and the electronic component 200 generates heat when charging the device 20 to be charged. By providing the heat dissipation assembly 300, the heat generated by the electronic assembly 200 is transferred and dissipated to the external environment.

In one embodiment, the electronic assembly 200 includes a coil module 210 and a motherboard module 220. The heat dissipation assembly 300 includes a heat conducting element 310, a heat sink 320, a fan 410, and an air scooper 420. The heat sink 320 includes a first side 326 and a second side 327 opposite to each other, the coil module 210, the motherboard module 220 and the heat conducting element 310 are fixed on the first side 326, and the fan and wind scooper 420 is fixed on the second side 327. The heat of the coil module 210 and the main board assembly 220 can be transferred to the heat conductive member 310 and the heat sink 320, and the heat of the heat conductive member can be transferred to the heat sink 320. There is a spacing between the wind scooper 420 and the second side 327. The first and

second vents

121 and 122 are located on a side of the fan 410 facing away from the second side 327.

In one embodiment, the fan 410 is a centrifugal fan.

As shown in fig. 4b and 4d, in an embodiment, the fan 410 is provided with a third air opening 411 and a fourth air opening 412. The third air opening 411 is an air inlet of the fan 410, and the fourth air opening 412 is an air outlet of the fan 410. The third tuyere 411 communicates with the first tuyere 121, and the fourth tuyere 412 communicates with the second tuyere 122.

As shown in fig. 4b to 4d, in an embodiment, when the fan 410 operates, the air flow in the external environment can enter the inside of the casing 100 through the first air opening 121, flow through the space between the fan 410, the air guiding cover 420 and the second side 327, and finally exit the outside of the casing 100 through the second air opening 122, so as to take away the heat of the heat sink 320, so that the heat inside the wireless charging device 10 can be transferred to the outside of the casing 100. The first air opening 121, the second air opening 122, the third air opening 411, and the fourth air opening 412 form a heat dissipation air duct 30 located on the second side 327 of the heat sink 320, and the air flow flowing through the heat dissipation air duct 30 flows through the second side 327 of the heat sink 320, so that the heat of the heat sink 320 can be taken away.

In another embodiment, the fan 410 may be positioned to change the direction of airflow. For example, when the fan 410 is operated, the external air flow enters the inside of the fan 410 from the second air opening 122, then flows through the second side 327 of the heat sink 320, carries the heat of the heat sink 320 to the first air opening 121, and flows out of the casing 100, carrying the heat inside the casing 100.

As shown in fig. 4a, in an embodiment, the first casing 120 is a frame-shaped structure with one side open, and the second casing 110 covers the opening of the first casing 120, so that the housing 100 forms a structure with a receiving space. The electronic component 200, the heat sink 320, the fan 410 and the wind scooper 420 are all located in the accommodating space, and in the direction from the second casing 110 to the first casing 120, the electronic component 200, the heat sink 320 and the fan 410 are sequentially arranged, the wind scooper 420 and the fan 410 are both fixed to the second side 327 of the heat sink 320, and the coil module 210 and the motherboard module 220 are both fixed to the first side 326 of the heat sink 320. In one embodiment, the housing 100 has an oval structure, and in other embodiments, the housing 100 may have a square or polygonal structure, which is not limited herein.

As shown in fig. 5, in an embodiment, the first tuyere 121 and the second tuyere 122 are opened on the bottom wall of the first housing 120. The first air opening 121 and the second air opening 122 are respectively located at two ends of the length direction of the bottom wall of the first casing 120, and do not extend to two ends of the width direction of the bottom wall of the first casing 120, that is, two ends of the bottom wall of the first casing 120 in the width direction are of a closed structure, so that the first air opening 121 and the second air opening 122 are prevented from being communicated with each other. In an embodiment, the first air opening 121 is an arc-shaped structure, and the number of the first air openings 121 is multiple, so that the bottom wall of the first air opening 121 is an arc-shaped strip-shaped structure and is spaced from the first air opening 121; the second tuyere 122 is of an arc-shaped structure, and the number of the second tuyere 122 is multiple, so that the bottom wall is of an arc-shaped strip-shaped structure at the part of the second tuyere 122, and is arranged at intervals with the second tuyere 122.

As shown in fig. 5, in an embodiment, the wireless charging device 10 includes a reinforcing rib 123, and the reinforcing rib 123 is an annular structure, is disposed on the inner surface of the bottom wall of the first casing 120, and is located at the positions of the first air opening 121 and the second air opening 122. The reinforcing ribs 123 are staggered with the bottom walls of the first shells 120 with the arc-shaped strip structures at the first air openings 121 and the second air openings 122, so that the strength of the first shells 120 at the first air openings 121 and the second air openings 122 can be enhanced, and the first shells 120 are prevented from being broken at the first air openings 121 or the second air openings 122 due to slight impact.

As shown in fig. 6, in an embodiment, the outer surface of the first casing 120 is provided with legs 125, and the number of the legs 125 is 2, which are respectively located at two ends of the first casing 120 in the length direction. It can be understood that one leg 125 is located at a side of the first tuyere 121 far from the second tuyere 122, the other leg 125 is located at a side of the second tuyere 122 far from the first tuyere 121, and the leg 125 is located outside the region of the first tuyere 121 or the second tuyere 122, preventing the leg 125 from blocking the flow of the air flow of the first tuyere 121 or the second tuyere 122.

In an embodiment, a wind shielding plate 124 is disposed between the first air opening 121 and the second air opening 122, so as to prevent the air with higher temperature flowing out from the second air opening 122 from flowing into the first air opening 121 again, which results in a decrease in heat dissipation effect. In an embodiment, the wind shielding plate 124 is a flat plate structure protruding from the outer surface of the first casing 120 and is located between the first air opening 121 and the second air opening 122. The height of the wind deflector 124 is the same as that of the support leg 125, so that when the wireless charging device 10 is placed on a horizontal plane, the wind deflector 124 can completely isolate the airflow between the first air opening 121 and the second air opening 122, and prevent the airflow of the second air opening 122 from flowing into the first air opening 121.

In another embodiment, as shown in fig. 6, the wind deflector 124 is a disk-shaped structure located between the first air opening 121 and the second air opening 122, and protrudes from the outer surface of the first casing 120. The height of the wind deflector 124 protruding from the outer surface of the first housing 120 is the same as the height of the support leg 125, so that when the wireless charging device 10 is placed on a horizontal plane, the disc-shaped wind deflector 124 can completely isolate the airflow between the first air opening 121 and the second air opening 122, and the airflow of the second air opening 122 is prevented from flowing into the first air opening 121. The disc-shaped wind deflector 124 is more attractive and integrally formed with the first housing 120, so that the strength of the first housing 120 is increased, and the purpose of preventing the airflow of the second air opening 122 from entering the first air opening 121 can be achieved.

As shown in fig. 7, in an embodiment, the wireless charging device is provided with a power cable 230, and the power cable 230 passes through the first housing 120 to be electrically connected with the coil module 210 and the motherboard module 220, so that the wireless charging device 10 can be electrically connected with an external power source. The heat sink 320 covers most of the area of the first housing 120, and the size of the first housing 120 is slightly larger than that of the heat sink 320, so that the space inside the wireless charging device 10 can be effectively utilized.

As shown in fig. 8, in an embodiment, the first side 326 of the heat sink 320 is formed with a groove 322, the heat conducting element 310 is fixed in the groove 322, and the surface of the heat conducting element 310 is flush with the surface of the heat sink 320. It is understood that the surface of the heat conducting element 310 is slightly higher than the surface of the heat sink 320 or slightly lower than the surface of the heat sink 320.

As shown in fig. 9, in one embodiment, the heat conducting element 310 is a heat pipe, one end of which can absorb heat and the other end of which can release heat. That is, part of the structure of the heat conductive member 310 can absorb heat, and the remaining structure can emit heat. The coil module 210 is attached to the heat absorbing portion of the heat conducting element 310, and the heat conducting element 310 is capable of absorbing heat of the coil module 210 and transferring the heat to the heat releasing end of the heat conducting element 310 to complete heat transfer, so that the temperature of the coil module 210 is reduced. The motherboard module 220 includes a heat source area 222, and the electronic components of the motherboard module 220 with large heat generation are mainly located in the heat source area 222. When the motherboard module 220 is in operation, the heat source area 222 generates more heat due to the existence of more heat-generating electronic components, which results in a faster temperature rise. The heat source region 222 of the motherboard module 220 is attached to the heat-absorbing end of the heat-conducting element 310, and the heat-conducting element 310 can absorb heat of the heat source region 222 and can transmit the heat to the heat-emitting end of the heat-conducting element 310 to complete heat transfer, so that the temperature of the heat source region 222 of the motherboard module 220 is reduced, and the temperature of the motherboard module 220 can be reduced.

In one embodiment, the heat source region 222 and the fan 410 are disposed back on the heat sink 320. When the external air flow is set to flow into the casing 100 from the first air opening 121 and flow out of the casing 100 from the second air opening 122, the fan 410 is arranged as shown in fig. 4 b. So that the air flows from the first tuyere 121 into the third tuyere 411, flows out of the fan 410 from the fourth tuyere 412 and flows toward the second tuyere 122. When the external air flow enters the casing 100 from the second air opening 122 and flows out of the casing 100 from the first air opening 121, the fan 410 is vertically arranged relative to the heat sink 320. So that the third tuyere 411 faces the wind scooper 420 and the fourth tuyere 412 faces the first tuyere 121. The air flow enters the inside of the casing 100 from the second tuyere 122, enters the fan 410 from the third tuyere 411, and then flows out of the fan 410 from the fourth tuyere 412 and flows toward the first tuyere 121, thereby flowing out of the casing 100.

As shown in fig. 8, in an embodiment, the number of the heat conducting elements 310 is 2, and the heat conducting elements 310 are arranged along the length direction of the heat sink 320, such that the portion of the heat conducting elements 310 capable of absorbing heat is located at one end of the heat sink 320, and the portion of the heat conducting elements 310 capable of releasing heat is located at the other end of the heat sink 320. In the width direction of the heat sink 320, the 2 heat conductive elements 310 are uniformly distributed, so that the heat of the coil module 210 and the motherboard module 220 can be uniformly absorbed. When the temperature of the heat conducting element 310 is higher than that of the heat sink 320, the heat conducting element 310 can transfer heat to the heat sink 320. The air flow flowing through the heat sink 320 can remove the heat of the heat sink 320, thereby removing the heat generated by the coil module 210 and the motherboard module 220.

In another embodiment, the number of the heat conducting elements 310 may be 1 or more, and is not particularly limited herein.

In an embodiment, the heat conducting element 310 is a heat spreader or a graphite sheet, and is not limited herein. The heat conductive member 310 may have high heat conductive performance.

As shown in fig. 8, in an embodiment, the heat sink 320 is made of metal, so that the heat sink 320 has good heat transfer and heat dissipation effects.

As shown in fig. 9, in an embodiment, a part of the structure of the coil module 210 is attached to the heat conducting element 310, so that the heat conducting element 310 can absorb the heat of the coil module 210 and tends to distribute the heat uniformly on the heat conducting element 310. The remaining structure of the coil module 210 is attached to the heat sink 320, so that the heat sink 320 can absorb the heat of the coil module 210 and tends to distribute the heat uniformly on the heat sink 320. After the heat sink 320 absorbs the heat of the coil module 210, most of the heat is dissipated through the heat dissipation air duct 30, and a part of the heat can be dissipated through the heat sink 320 itself. It is understood that the primary heat dissipation path of the coil module 210 is heat dissipation through the heat conductive element 310, and the secondary heat dissipation path is heat dissipation through the heat sink 320.

As shown in fig. 9, in an embodiment, the outline shape and size of the motherboard module 220 are the same as or similar to the outline shape and size of the heat sink 320, and the motherboard module 220 is disposed on the first side 326 of the heat sink 320. The heat source region 222 of the motherboard module 220 is attached to the heat-absorbing end of the heat-conducting element 310, so that the heat generated by the heat source region 222 can be absorbed by the heat-conducting element 310, and the heat is transferred on the heat-conducting element 310 until the heat is uniformly distributed on the heat-conducting element 310. It can be understood that when the heat conducting element 310 is a heat pipe, the heat conducting element 310 does not completely cover the heat sink 320, and a part of the structure of the heat source region 222 of the motherboard module 220 is attached to the heat sink 320, so that heat generated by the heat source region 222 can be transferred through the heat sink 320 to be uniformly distributed on the heat sink 320. After the heat sink 320 absorbs the heat of the motherboard module 220, most of the heat is dissipated through the heat dissipation air duct 30, and part of the heat can be dissipated through the heat sink 320 itself.

As shown in fig. 8, in an embodiment, a plurality of protruding rings 321 protruding from the heat sink 320 are disposed on a surface of the heat sink 320 facing the coil module 210, and the protruding rings 321 are spaced apart from each other to avoid interference between the protruding rings 321 and the heat conducting element 310 disposed along the length direction of the heat sink 320.

As shown in fig. 9, a plurality of protruding rings 321 are defined to form a circular area, and the coil module 210 can be accommodated in the circular area, so that the coil module 210 is fixed to the heat sink 320. In another embodiment, the area enclosed by the protruding ring 321 is different according to the shape of the coil module 210, for example, if the coil module 210 is square, the area enclosed by the protruding ring 321 is square.

As shown in fig. 9, in one embodiment, the motherboard module 220 is fixed to the first side 326 of the heat sink 320 by screws or bolts. Notch 221 is formed in main board module 220, and coil module 210 and protruding ring 321 are located in notch 221 and electrically connected to main board module 220, so that interference between coil module 210 and main board module 220 in the thickness direction of wireless charging device 10 is avoided, superposition between coil module 210 and main board module 220 in the thickness direction is avoided, and the thickness of wireless charging device 10 is reduced. It can be understood that the portion of the heat conductive element 310 in contact with the coil module 210 can absorb heat, so that the heat of the coil module 210 can be absorbed and transferred by the heat conductive element 310.

As shown in fig. 10 and 11, in one embodiment, the wind scooper 420 includes a connector 430 and a wind deflector 440. One end of the connector 430 is connected to the fan 410, and the other end is connected to the air guide plate 440. More specifically, the connector 430 includes a top wall 431, a bottom wall 432, and two side walls 433. The top wall 431, the bottom wall 432 and the two side walls 433 enclose a through groove 421. The top wall 431 and the bottom wall 432 are respectively clamped at two opposite sides of the fan 410, so that the connecting member 430 is connected to the fan 410, and the through groove 421 is communicated with the fourth air opening 412. The air deflector 440 is connected to the other end of the connecting member 430 and is connected to the bottom wall 432. It is understood that the connection member 430 can be engaged with the fan 410 and can be detached from the fan 410. The end of the air guiding plate 440 away from the connecting member 430 is opened with a through hole 422, so that the air flowing out from the fourth air opening 412 of the fan 410 can flow through the through hole 422 in a direction away from the second side 327. The shape of the through opening 422 may be circular, square, polygonal, or the like.

In one embodiment, the connecting member 430 and the air guiding plate 440 are integrally formed.

As shown in fig. 12 and 13, in one embodiment, the heat dissipation assembly 300 further includes at least two fins 323, which may be a plurality of fins. The fin 323 is provided along the length direction of the wireless charging apparatus 10. The fins 323 are fixed on the second side 327 of the heat sink 320, and the fins 323 are located between the second side 327 and the air guiding plate 440, that is, the air guiding cover 420 covers the fins 323, and no air leakage occurs between the air guiding cover 420 and the fins 323. An air guide groove 423 is formed between two adjacent fins 323, and both ends of the air guide groove 423 are respectively communicated with the through groove 421 and the through hole 422. In one embodiment, the number of the wind guide grooves 423 may be one; in another embodiment, the number of the wind guide grooves 423 is plural. The air flowing through the fan 410 can flow to the air guide groove 423 through the fourth air opening 412 and the through groove 421, and then flow to the second air opening 122 through the through opening 422. When the airflow passes through the air guide groove 423, the heat of the heat sink 320 can be taken away.

The wind scoops 420 and the fins 323 are configured to guide the airflow flowing through the fan 410, so that the airflow flowing through the fan 410 can flow through the second side 327 of the heat sink 320 to remove heat from the heat sink 320. The wind scoops 420 and the fins 323 guide the airflow passing through the heat sink 320 to the second wind opening 122 to flow out of the casing 100. It can be understood that the wind scoops 420 and the fins 323 are provided to prevent the air flow between the fourth tuyere 412 and the second tuyere 122 from irregularly flowing and staying within the casing 100.

In one embodiment, the fins 323 and the heat sink 320 are integrally formed.

As shown in fig. 13, in an embodiment, the second side 327 of the heat sink 320 is provided with a wind guiding wall 328 extending obliquely relative to the wind guiding plate 440, the wind guiding wall 328 is located at an end of the wind guiding groove 423 away from the through groove 421, and the wind guiding wall 328 forms a groove wall of the wind guiding groove 423. One end of the air guiding wall 328 connected to the second side 327 is close to the fan 410, and the other end of the air guiding wall 328 is far away from the fan 410. The air guide wall 328 is disposed corresponding to the through hole 422, and the through hole 422 is disposed corresponding to the second air hole 122. Since the air guide wall 328 is obliquely arranged, the air flow passing through the air guide groove 423 is guided by the air guide wall 328, flows to the through opening 422 and then flows to the second air opening 122, and thus the air resistance of the air flow can be reduced.

As shown in fig. 4c and 4d, in an embodiment, the through opening 422 is located at an end of the heat sink 320 far from the fan 410, and corresponds to the second air opening 122. The air flow passing through the fan 410 enters the air guiding groove 423 through the fourth air opening 412 and the through groove 421, flows to the air guiding wall 328 along the air guiding groove 423, flows to the through opening 422 through the guiding of the air guiding wall 328, and carries away the heat of the heat sink 320. The air flow flows out of the air guide groove 423 through the through hole 422 and is discharged outside the casing 100 through the second tuyere 122, thereby taking away heat inside the casing 100. It can be understood that when the air flow with a relatively low temperature flowing out from the fan 410 flows in the air guiding groove 423, the air flow can take away the heat of the heat sink 320 itself, so that the temperature of the heat sink 320 is reduced.

In an embodiment, the fins 323 are made of metal, so that the heat sink 320 has better heat dissipation performance. When the airflow flows through the air guide groove 423, the airflow can take away heat of the fin 323, so that the heat sink 320 can be cooled. In another embodiment, the fins 323 are made of a composite material of metal and plastic, so that the temperature of the fins 323 is not easily increased, thereby avoiding transmitting the temperature to the housing 100, and when a user touches the housing 100, the temperature of the housing 100 is low, so that the user has a better use experience.

In an embodiment, for the wireless charging device 10 provided with the fan 410 with smaller power, the heat dissipation effect of the wireless charging device 10 is not particularly strong, and the heat storage material may be attached to the outer surface or the inner surface of the second casing 110. The heat storage material can absorb heat of the wireless charging device 10, so that the temperature of the wireless charging device 10 is slowly increased, and the heat is prevented from being transferred to the device to be charged 20. The outer surface or the inner surface of the second casing 110 may also be attached with a thermal insulation material, which can block the heat transfer and prevent the heat of the wireless charging device 10 from transferring to the device to be charged 20.

In another embodiment, for the wireless charging device 10 provided with the fan 410 with larger power, the heat dissipation effect of the wireless charging device 10 is better, and the outer surface or the inner surface of the second casing 110 may be attached with a highly efficient heat conductive material. The high-efficiency heat conduction material can transfer heat quickly. Because the heat dissipation effect of the wireless charging device 10 is better, the temperature of the wireless charging device 10 is lower, and the temperature of the device 20 to be charged may be increased when being charged, so that the temperature is higher than that of the wireless charging device 10. The heat of the device to be charged 20 can be transferred to the wireless charging device 10 through the high-efficiency heat conducting material, and the heat is discharged to the environment through the good heat dissipation air duct 30 of the wireless charging device 10.

The wireless charging equipment 10 of this application sets up heat-conducting element 310 on the radiator 320, and coil module 210 and mainboard module 220 all laminate with heat-conducting element 310 for the heat that coil module 210 and mainboard module 220 produced can be absorbed by heat-conducting element 310, and transmit through heat-conducting element 310, makes heat-conducting element 310 tend to the soaking, makes coil module 210 and mainboard module 220 can cool down. Coil module 210 and mainboard module 220 all laminate with the radiator 320 of metal material, and the heat transfer effect and the radiating effect of radiator 320 are better for the heat of coil module 210 and mainboard module 220 can transmit to radiator 320, and radiator 320 tends towards the soaking, can assist the temperature that reduces coil module 210 and mainboard module 220. The air flow with a lower temperature entering the interior of the housing 100 from the first air opening 121 can be guided by the air guiding groove 423 formed by the fan 410, the air guiding cover 420 and the fins 323 to flow through the heat sink 320, so as to take away the heat of the heat sink 320, so that the wireless charging device 10 can be cooled. The wind shield 124 is designed to separate the second air opening 122 from the first air opening 121, so as to prevent the air flow with higher temperature in the second air opening 122 from entering the first air opening 121. Depending on the power of the fan 410, a heat storage material or a heat insulation material or a heat conduction material may be disposed on the surface of the second housing 110 to avoid the temperature of the device to be charged 20 from rising or better reduce the temperature of the device to be charged 20.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the claims. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims

1. A wireless charging device, comprising:

the shell is provided with a first air port and a second air port;

the coil module and the mainboard module are positioned in the shell;

2. The wireless charging device of claim 1, wherein the heat dissipation assembly further comprises a wind scooper coupled to the fan for directing airflow exiting the fan through the fourth air opening, over the second side of the heat sink, and out of the housing through the second air opening.

3. The wireless charging device according to claim 2, wherein the wind scooper includes a connecting member and a wind deflector, one end of the connecting member is connected to one end of the fan, at which the fourth wind gap is opened, and the wind deflector is connected to the other end of the connecting member.

4. The wireless charging device of claim 3, wherein the connecting member comprises a top wall, a bottom wall and two side walls, the top wall, the bottom wall and the two side walls are enclosed to form a through groove, the through groove is communicated with the fourth air opening, and the air deflector is connected with the bottom wall.

5. The wireless charging device of claim 4, wherein a port is formed at one end of the air deflector, which is far away from the fan, and the port is communicated with the second air opening.

6. The wireless charging device according to claim 5, wherein the heat dissipation assembly further comprises at least two fins, the fins are located between the second side of the heat sink and the air guide plate, an air guide groove is formed between adjacent fins, and two ends of the air guide groove are respectively communicated with the through groove and the through opening.

7. The wireless charging apparatus according to claim 6, wherein the second side of the heat sink is provided with a wind guide wall extending obliquely with respect to the wind guide plate, and the wind guide wall is provided corresponding to the through opening for guiding the airflow flowing through the wind guide groove to the through opening and the second wind opening.

8. The wireless charging device of claim 1, wherein the housing comprises a first casing on a side of the fan facing away from the heat sink; the first tuyere and the second tuyere are located in the first housing.

9. The wireless charging device of claim 8, comprising a wind deflector protruding from an outer surface of the first housing, the wind deflector being positioned between the first air opening and the second air opening.

10. The wireless charging device according to claim 9, wherein an outer surface of the first housing is provided with a leg having the same height as the wind deflector.

11. The wireless charging device of claim 8, comprising a stiffener disposed at the first and second vents, the stiffener being disposed on one side of an inner surface of the first housing.

12. The wireless charging device according to any one of claims 1 to 11, wherein the heat dissipation assembly comprises a heat conducting element, the heat conducting element being fixed to a first side of the heat sink;

13. The wireless charging apparatus of claim 12, wherein the first side of the heat sink defines a recess, and the heat conducting element is received in the recess.

14. The wireless charging apparatus of claim 12, wherein the first side of the heat sink has a raised ring, and the coil module is received in an area surrounded by the raised ring.

15. The wireless charging device of claim 14, wherein the motherboard module has a notch, and the protruding ring is located in the notch.

16. The wireless charging device of claim 12, wherein the motherboard module comprises a heat source region, the heat source region is attached to the heat conducting element, and the heat conducting element is capable of absorbing heat from the heat source region.

17. The wireless charging apparatus of claim 16, wherein the heat source region and the fan are oppositely disposed on the heat sink.

18. The wireless charging device of claim 12, wherein the thermally conductive element comprises a heat pipe or a heat spreader plate.

19. The wireless charging device according to any one of claims 1 to 11, wherein the housing comprises a first housing and a second housing connected to each other, and the first air opening and the second air opening are located in the first housing; the second housing is used for supporting a device to be charged.

20. The wireless charging device of claim 19, wherein a surface of the second housing is affixed with a heat storage material; alternatively, the first and second electrodes may be,

and the surface of the second shell is pasted with a heat conduction material.