CN112908887A - Wafer adjusting device and method and wafer conveying system - Google Patents
Wafer adjusting device and method and wafer conveying system Download PDFInfo
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- CN112908887A CN112908887A CN201911219373.7A CN201911219373A CN112908887A CN 112908887 A CN112908887 A CN 112908887A CN 201911219373 A CN201911219373 A CN 201911219373A CN 112908887 A CN112908887 A CN 112908887A
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
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- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
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- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
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Abstract
The embodiment of the invention relates to a wafer adjusting device, a wafer adjusting method and a wafer transmission system, wherein the wafer adjusting device comprises: the detection device is used for detecting the wafer to obtain detection information; the adjusting device is connected with the first bearing component and the second bearing component in the bearing part and drives the first bearing component to move relative to the second bearing component and drives the second bearing component to move relative to the first bearing component; the analysis controller is connected with the detection device and the adjusting device, receives detection information of the detection device, analyzes and processes the detection information, sends a processing signal to the adjusting device according to a processing result, and drives the first bearing assembly to move relative to the second bearing assembly and drives the second bearing assembly to move relative to the first bearing assembly according to the processing signal. The invention can detect the offset condition of the wafer with offset and carry out corresponding position adjustment according to the offset condition.
Description
Technical Field
The present invention relates to the field of wafer manufacturing, and more particularly, to a wafer adjusting apparatus and method, and a wafer transferring system.
Background
Since the fabrication of a wafer includes a plurality of specific processes, and the fabrication sites of the different processes are different, it is usually necessary to transfer the wafer between the processes through a transfer table. Due to the requirements of the wafer process and the wafer yield, the wafer transfer area is filled with nitrogen, thereby preventing oxygen from reacting with the wafer material.
Currently, when the wafer is shifted during the transferring process, manual adjustment is required. Manual adjustment requires opening a sealing door in the wafer transfer area, and once the sealing door is opened, the wafer is exposed to air, which may cause a problem of wafer yield reduction.
Disclosure of Invention
The embodiment of the invention provides a wafer adjusting device, a wafer adjusting method and a wafer conveying system.
To solve the above technical problem, an embodiment of the present invention provides a wafer adjusting apparatus, including: the bearing component comprises a first bearing component and a second bearing component for bearing wafers, wherein the first bearing component is positioned above the second bearing component, the first bearing component is provided with a containing space for containing the second bearing component, the second bearing component is movable relative to the first bearing component, and the first bearing component is movable relative to the second bearing component; the detecting device is arranged on the bearing part, the first bearing component and the second bearing component are positioned in a detecting range of the detecting device, and the detecting device is used for detecting the wafer to obtain detecting information; the adjusting device is connected with the first bearing component and the second bearing component and drives the first bearing component to move relative to the second bearing component and the second bearing component to move relative to the first bearing component; the analysis controller is connected with the detection device and the adjusting device, receives detection information of the detection device, analyzes and processes the detection information, sends a processing signal to the adjusting device according to a processing result, and the adjusting device drives the first bearing assembly to move relative to the second bearing assembly and drives the second bearing assembly to move relative to the first bearing assembly according to the processing signal.
In addition, the detection device comprises: a light emitting device and a light sensing device respectively located on opposite sides of the carrier; during the operation of the detection device, the transmission path of the detection light emitted by the light emitting device has an intersection point with the edge of the wafer.
In addition, the first bearing assembly can move horizontally relative to the second bearing assembly, and the second bearing assembly can be lifted towards the first bearing assembly and lowered away from the first bearing assembly.
In addition, the detection device comprises a data analysis unit, and the data analysis unit is used for judging whether the initial position coordinate information of the wafer can be obtained according to the currently detected position information of the wafer.
In addition, the wafer adjusting apparatus further includes: the sensing device is arranged on the first bearing component; the analysis controller is connected with the sensing device, receives sensing information of the sensing device and analyzes and processes the sensing information.
Correspondingly, an embodiment of the present invention further provides a wafer adjusting method, including: providing the wafer adjusting device; providing a wafer, wherein the wafer is carried on a first carrying component, the central axis of the wafer is at an initial position, and the central axis of the first carrying component is at a preset position; the detection device acquires the initial position coordinate information of the wafer; the analysis controller calculates the offset of the initial position relative to the preset position based on the initial position coordinate information of the wafer, and sends out an adjusting signal; and the adjusting device receives the adjusting signal and adjusts the first bearing assembly and the second bearing assembly according to the adjusting signal so as to enable the central axis of the first bearing assembly and the central axis of the wafer to be at the preset position.
In addition, the detecting device obtains the initial position coordinate information of the wafer, and specifically includes: the detecting device detects whether the first bearing assembly bears the wafer or not; the analysis controller judges whether the first bearing assembly bears the wafer or not according to the received detection information; if so, the analysis controller sends a processing signal to the adjusting device, transfers the wafer from the first bearing component to a second bearing component, and controls the second bearing component to rotate around a preset position; the detection device detects the position information of the wafer in the rotation process and acquires the initial position coordinate information of the wafer.
In addition, the adjusting device adjusts the first carrier assembly and the second carrier assembly according to the adjusting signal, so that the center position of the first carrier assembly and the center position of the wafer are located at the preset positions, specifically including: the adjusting device drives the first bearing assembly to move relative to the second bearing assembly according to the adjusting signal, so that the central axis of the first bearing assembly moves from the preset position to the initial position; the adjusting device further drives the second bearing assembly to move relative to the first bearing assembly according to the adjusting signal, so that the wafer is transferred from the second bearing assembly to the first bearing assembly after the first bearing assembly moves to the initial position; the adjusting device further drives the first bearing assembly to move to the preset position according to the adjusting signal, so that the wafer moves to the preset position.
In addition, the initial position coordinate information comprises a current angle value, and the analysis controller stores a standard angle value; after the wafer moves to the preset position, the adjusting device further executes the following actions according to the adjusting signal: driving the second bearing component to move relative to the first bearing component, so that the wafer is transferred from the first bearing component to the second bearing component; controlling the second bearing component to rotate so that the current angle value of the wafer is equal to the standard angle value; and driving the second bearing component to move relative to the first bearing component, so that the wafer is transferred from the second bearing component to the first bearing component.
Correspondingly, an embodiment of the present invention further provides a wafer transferring system, including: the wafer adjusting device; further comprising: the wafer conveying table is used for bearing and conveying wafers; the wafer offset detection device is used for detecting whether the wafer on the wafer conveying table is offset or not; and the wafer transfer device is used for transferring the wafer into the wafer adjusting device when the wafer deviation detection device detects that the wafer deviates, and is also used for transferring the wafer from the wafer adjusting device to the wafer transmission platform.
Compared with the prior art, the technical scheme provided by the embodiment of the invention has the following advantages:
in the above technical solution, a new wafer adjusting device is provided, and the wafer adjusting device can detect the offset condition of the wafer with the offset and perform corresponding position adjustment according to the offset.
In addition, the transmission path of the detection light emitted by the light emitting device and the edge of the wafer have an intersection point, and in the rotating process of the first bearing component or the second bearing component, the detection device can obtain the initial position coordinate information of the wafer by detecting the position of the intersection point.
In addition, the data analysis unit enables the detection device to detect less position information and acquire the initial position coordinate information of the wafer, and time consumption for adjustment can be shortened.
Drawings
One or more embodiments are illustrated by corresponding figures in the drawings, which are not to be construed as limiting the embodiments, unless expressly stated otherwise, and the drawings are not to scale.
Fig. 1 is a schematic structural diagram of a wafer adjusting apparatus according to an embodiment of the present invention;
FIG. 2 is a plan view of a wafer site of the structure shown in FIG. 1;
fig. 3 to 4 and fig. 6 to 8 are schematic diagrams illustrating operations corresponding to steps of a wafer adjusting method according to an embodiment of the invention;
fig. 5 is a data graph corresponding to a step in the wafer conditioning method provided in fig. 4.
Detailed Description
The embodiment of the invention provides a wafer adjusting device which can detect the offset condition of an offset wafer and carry out corresponding position adjustment according to the offset.
In order to make the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, it will be appreciated by those of ordinary skill in the art that in various embodiments of the invention, numerous technical details are set forth in order to provide a better understanding of the present application. However, the technical solution claimed in the present application can be implemented without these technical details and various changes and modifications based on the following embodiments.
Fig. 1 is a schematic structural diagram of a wafer adjusting apparatus according to an embodiment of the present invention.
Referring to fig. 1, the wafer conditioning apparatus includes: the carrier 11, the carrier 11 includes a first carrier assembly 111 and a second carrier assembly 112 for carrying the wafer 14, the first carrier assembly 111 is located above the second carrier assembly 112, the first carrier assembly 111 has a receiving space for receiving the second carrier assembly 112, the second carrier assembly 112 is movable relative to the first carrier assembly 111 and the first carrier assembly 111 is movable relative to the second carrier assembly 112; a detecting device 12, wherein the detecting device 12 is disposed on the carrier 11, the first carrier assembly 111 and the second carrier assembly 112 are located within a detecting range of the detecting device 12, and the detecting device 12 is configured to detect the wafer 14 to obtain detecting information; the adjusting device 13 is connected with the first bearing component 111 and the second bearing component 112, and drives the first bearing component 111 to move relative to the second bearing component 112 and drives the second bearing component 112 to move relative to the first bearing component 111; an analysis controller (not shown) connected to the detecting device 12 and the adjusting device 13, the analysis controller receiving the detecting information of the detecting device 12, analyzing the detecting information, and sending a processing signal to the adjusting device 13 according to the processing result, the adjusting device 13 driving the first carrying assembly 111 to move relative to the second carrying assembly 111 and the second carrying assembly 112 to move relative to the first carrying assembly 111 according to the processing signal.
The wafer conditioning apparatus provided in the present embodiment will be described in detail below with reference to the accompanying drawings.
Specifically, the carrier 11 includes a first carrier assembly 111 and a second carrier assembly 112, a central axis of the first carrier assembly 111 is a central axis of the carrier 11, and the first carrier assembly 111 has a receiving space therein for receiving the second carrier assembly 112 and the wafer 14; when the wafer 14 in the transferring state is shifted, the shifted wafer 14 is placed on the first carrying component 111, so that the first carrying component 111 carries the wafer 14; before the position of the wafer 14 is adjusted, the central axis of the wafer 14 is at the initial position, and the central axis of the first carrier assembly 111 is at the predetermined position.
It should be noted that, in other embodiments, after the wafer in the transferring state is shifted, the shifted wafer is placed on the second carrying component; wherein, the second bearing assembly is positioned in the accommodating space.
The first bearing assembly 111 comprises a main body part (not marked) and a plurality of supporting frames (not marked), wherein the central axis of the main body part is the central axis of the bearing part 11; the support frames are connected with the main body part, each support frame is provided with a support part for bearing the wafer 14, and the accommodating space is arranged between the support part and the main body part. Wherein the central axis of the main body coincides with the central axis of the second carrier assembly 112; the second bearer component 112 has scalability.
In this embodiment, the support frame includes a three-point type or a three-jaw type, and the three-point type support frame refers to a support portion that supports at least three points of the wafer 14 to ensure balance of the wafer 14; the three-jaw type support frame is a three-jaw type support frame formed by three support parts, wherein the three support parts have intersection points, generally, the two side jaw-shaped support parts are long and are in plane contact with the wafer 14, and the middle jaw-shaped support part is short.
In this embodiment, the first carrying assembly 111 can move horizontally relative to the second carrying assembly 112; the second carrier assembly 112 can be raised toward the first carrier assembly 111 or lowered away from the first carrier assembly 111, and the raising of the second carrier assembly 112 can separate the wafer 14 from the first carrier assembly 111 and place the wafer 14 in the accommodating space; in addition, the second carriage assembly 112 may also rotate about a preset position.
It should be noted that in other embodiments, the first bearing assembly may rotate around a preset position.
The detecting device 12 is used for detecting the wafer 14 to obtain detection information, and the first carrier assembly 111 and the second carrier assembly 112 are located within a detection range of the detecting device 12. The detection information comprises initial position coordinate information of the wafer 14, and the analysis controller obtains the central position offset condition of the wafer 14 according to the initial position coordinate information and the preset position coordinate information; in addition, a wafer notch is formed in the edge of the wafer 14, the initial position coordinate information comprises a current angle value, the analysis controller stores a standard angle value, and the analysis controller obtains the angle offset of the notch according to the current angle value and the standard angle value. It should be noted that the angular offset of the notch and the offset of the initial position from the preset position are vectors.
In this embodiment, the detecting device 12 includes a data analyzing unit (not shown), which is configured to determine whether the initial position coordinate information of the wafer 14 can be obtained according to the currently detected position information of the wafer 14; and if so, obtaining the initial position coordinate information and sending the initial position coordinate information to the analysis controller.
In this embodiment, the detecting device 12 includes: a light emitting device 121, the light emitting device 121 being for emitting detection light; during the operation of the detection apparatus 12, the light sensing device 122 and the light emitting device 121 are respectively located on two opposite sides of the wafer 14, and the transmission path of the detection light has an intersection with the edge of the wafer 14, and the light sensing device 122 receives the detection light that is not blocked by the wafer 14, and analyzes the initial position coordinate information of the wafer 14 according to the received detection light.
In this embodiment, the light emitting device 121 includes a plurality of light emitting units whose centers are located on the same straight line, and the detection light emitted by the light emitting device 121 has an intersection with the edge of the wafer 14; in other embodiments, the detection light from the light emitting device has multiple intersections with the edge of the wafer, or the detection light from the light emitting device covers the entire edge of the wafer.
In one embodiment, a sensing device (not shown) is disposed on the first carrier assembly 111, and the sensing device is connected to an analysis controller, which analyzes and processes sensing information sent by the sensing device, so as to determine whether the first carrier assembly 111 carries the wafer 14.
In this embodiment, the light-shielding wall 15 is disposed around the photo-sensing device 122, and the light-shielding wall 15 is used to block external light, so as to ensure that light received by the photo-sensing device 122 only originates from the light-emitting device 121.
The moving end of the adjusting device 13 is connected with the main body, and the adjusting device 13 adjusts the position of the first bearing component 111 by driving the main body to move. In this embodiment, the adjusting device 13 comprises two moving arms and corresponding rotating shafts.
For the understanding and description of the wafer conditioning apparatus, the wafer conditioning apparatus will be described in more detail below by way of its operating principle.
In one embodiment, the light emitting device 121 emits the detection light at a fixed frequency or in real time, and the light sensing device 122 receives the detection light; the detecting device 12 sends the received information related to the detected light to the analysis controller, and the analysis controller receives the detected information and performs analysis processing on the detected information.
It is understood that if the detection light is not blocked by the wafer 14 and all the detection light is received by the photo sensor 122, the first supporting member 111 is considered not to support the wafer 14; if the detection light is partially blocked and the photo sensing device 122 can only receive part of the detection light, the first carrier assembly 111 is considered to carry the wafer 14. Therefore, the analysis controller can determine whether the first carrier assembly 111 carries a new wafer 14 according to the information of the detection light received twice consecutively.
If the first carrier assembly 111 carries the wafer 14, the detecting device 12 starts to acquire the initial position coordinate information of the wafer 14, referring to fig. 2 to 5, the carrier component 11 drives the wafer 14 to rotate, and the optical sensor 122 obtains the initial position coordinate information of the wafer 14 according to the received detection light. In this embodiment, the initial position is not coincident with the preset position, and the current angle value is different from the standard angle value as an example:
referring to fig. 2, a solid line circle is a position of the wafer 14 that is shifted, point E is a preset position, point a is a farthest point from point E on the solid line circle, and point B is a closest point from point E on the solid line circle; the dotted circle is the position to which the wafer 14 needs to be adjusted, and point C1 is the position of the notch on the wafer 14; point C2 is the position of the notch after adjustment; point D is the intersection of the detection light from the light emitting device 121 (see fig. 1) and the edge of the wafer 14.
Referring to fig. 3, in the present embodiment, if the analysis controller determines that the first carrier assembly 111 carries the wafer 14, the analysis controller controls the second carrier assembly 112 to lift and support the wafer 14, so that the wafer 14 is located in the accommodating space; in other embodiments, whether the first carrier assembly carries the wafer or not may be determined by other methods or structures, such as a weight sensing device.
Referring to fig. 4, after the analyzing controller determines that the first carrier assembly 111 carries the wafer 14, the photo sensor 122 controls the second carrier assembly 112 to rotate around a predetermined position, so as to drive the wafer 14 to rotate around the predetermined position. In other embodiments, the first carrier assembly may be controlled to rotate around the predetermined position, and accordingly, the second carrier assembly is not required to carry the wafer.
When the second carrier assembly 112 rotates around the predetermined position, the position of the intersection D (refer to fig. 2) of the detection light and the edge of the wafer 14 changes along with the rotation of the wafer 14; the light sensing device 122 determines the distance between the intersection point D and the preset position according to the received detection light, and obtains a functional relationship between the rotation angle and the distance according to the distance parameter obtained by the light sensing device 122 and the rotation angle of the second bearing component 112, so as to obtain the initial position coordinate condition of the wafer 14.
Referring to fig. 5, curve 41 is an angle δ -distance y curve after one rotation of wafer 14; the curve 42 is an angle δ -distance y curve obtained by rotating the ideal wafer position without offset for one circle, the curve 42 is pre-stored in the analysis controller, and the offset of the initial position of the wafer 14 relative to the preset position and the angle offset of the current angle value of the wafer 14 relative to the standard angle value can be obtained by comparing the curve 41 and the curve 42.
Specifically, the rotation direction of the second carrier assembly 112 is set to be clockwise, the rotation angle of the wafer 14 is set to be δ, the distance corresponding to the rotation angle of the wafer 14 is set to be y, and the coordinate of the edge intersection point D is (δ, y). Wherein, the second bearing component 112 rotates for a circle, and then delta is more than or equal to 0 degree and less than 360 degrees; when delta is alpha, y is maximized to ymaxWhen delta is equal to beta, y is minimized to yminThen, the calibration amount ζ of the wafer 14 is ((y)max-ymin)/2×cosα，(ymax-ymin) 2 x sin β), wherein the calibration quantity and the offset are two values with equal magnitude and opposite direction; the angular offset is the difference between the angular value at point C1 and the angular value at point C2.
In this embodiment, the wafer 14 returns to the original position after one rotation, the measured offset is equal to the offset of the rotated position, and the analysis controller adjusts the position of the wafer 14 based on the measured offset.
In another embodiment of the present invention, the detecting device 12 further includes a data analyzing unit, which is configured to determine whether the position offset condition of the wafer 14 can be obtained according to the currently obtained detection light; if yes, the rotation of the second carrier assembly 112 is stopped, and the initial position coordinate information of the wafer 14 is calculated.
Since the initial position coordinate information measured by the data analysis unit is the initial position coordinate information of the wafer 14 before rotation, it is necessary to calculate the initial position coordinate information of the wafer 14 after rotation from the measured initial position coordinate information and the rotation angle of the second carrier module 112 before adjusting the position of the wafer 14, and the analysis controller adjusts the position of the wafer 14 based on the initial position coordinate information after rotation.
It is understood that since the outline of the wafer 14 is generally circular, and the circular outline has a Notch (Notch), the Notch plays a role in positioning in the subsequent manufacturing process. The wafer 14 is rotated with any point in the wafer 14 as the origin, the obtained angle δ -distance y curve is a sine curve except for the notch position, and the formula y of the sine curve is Asin (ω x + Φ) + k has four unknown quantities, so that the optical sensor 122 can obtain the positions of the edge points of the wafer 14 except for the point C1 at least according to the four sets of received data; in addition, since the angle δ -distance y corresponding relationship at the notch does not satisfy the sine curve, the photo sensor 122 needs to obtain the angle δ -distance y parameters of at least six side points, and find the point (i.e., point C1) corresponding to the notch position by establishing an equation for every four values, when the photo sensor 122 receives the position parameter of the point C1, the detecting module 12 can obtain the position of the wafer 14 according to the currently obtained angle δ -distance y parameter, so as to obtain the offset condition of the wafer 14, where the offset condition includes the offset of the initial position relative to the preset position and the angle offset of the current angle value relative to the standard angle value.
After the detecting device 12 obtains the initial position coordinate information of the wafer 14, the analyzing controller obtains an offset condition according to the initial position coordinate information, the preset position coordinate information and the pre-stored standard angle value, and sends a processing signal to the adjusting device 13 based on the offset condition and controls the adjusting device 13, so that the central axis of the first bearing assembly 111 is located at the initial position. Referring to fig. 6 to 8, in the present embodiment, the initial position is not overlapped with the preset position, and the current angle value is not equal to the standard angle value as an example:
referring to fig. 6, the analysis controller controls the adjustment device 13 to move based on the offset between the initial position and the preset position, so that the central axis of the first carrier assembly 111 is at the initial position, and the central axis of the first carrier assembly 111 coincides with the central axis of the wafer 14; referring to fig. 7, the analysis controller controls the second carrier assembly 112 to descend so that the first carrier assembly 111 supports the wafer 14, thereby enabling the first carrier assembly 111 to move with the wafer 14; referring to fig. 8, the analysis controller again controls the adjustment device 13 to move so that the central axis of the first carrier assembly 111 and the central axis of the wafer 14 are at the predetermined positions.
In this way, the position of the central axis of the wafer 14 is corrected; in addition, the central axis of the first carrier assembly 111 is still at the predetermined position, so that the central axis of the first carrier assembly 111 does not need to be obtained in the subsequent wafer 14 transferring step, which is beneficial to realizing the automation of the carrying and transferring of the wafer 14.
It should be noted that the adjusting device 13 can drive the first bearing component 111 to move through its own movement; the movement of the first bearing assembly 111 may also be controlled by command signals or other actions.
After the central axis of the first carrier assembly 111 and the central axis of the wafer 14 are at the preset positions, the angle value of the notch needs to be adjusted, which specifically includes: the analysis controller controls the second carrier assembly 112 to lift and support the wafer 14, the analysis controller controls the second carrier assembly 112 to rotate based on the angle deviation value of the current angle value relative to the standard angle value, and the second carrier assembly 112 rotates to drive the wafer 14 to rotate, so that the angle of the notch is equal to the standard angle value.
It should be noted that, in other embodiments, after the central axis of the first carrier assembly and the central axis of the wafer are at the preset positions, the analysis controller controls the first carrier assembly to rotate, and the first carrier assembly rotates to drive the wafer to rotate, so that the angle of the wafer gap is equal to the standard angle value.
In the embodiment, a novel wafer adjusting device is provided, which can adjust the position of a wafer which is placed on a bearing part and has a deviation so as to correct the position deviation of the wafer.
Correspondingly, an embodiment of the present invention further provides a method for adjusting a wafer by using the above wafer adjusting apparatus, including: providing a wafer conditioning device; providing a wafer, wherein the wafer is carried on a first carrying component, the central axis of the wafer is at an initial position, and the central axis of the first carrying component is at a preset position; the detection device acquires the initial position coordinate information of the wafer; the analysis controller calculates the offset of the initial position relative to the preset position based on the initial position coordinate information of the wafer, and sends out an adjusting signal; and the adjusting device receives the adjusting signal and adjusts the first bearing assembly and the second bearing assembly according to the adjusting signal so as to enable the central axis of the first bearing assembly and the central axis of the wafer to be at the preset position.
The following description will be made in detail with reference to fig. 3 to 4 and 6 to 8 of the drawings. Specifically, the carrier 11 includes a first carrier assembly 111 and a second carrier assembly 112, before the position of the wafer 14 is adjusted, the first carrier assembly 111 carries the wafer 14, the central axis of the wafer 14 is at an initial position, and the central axis of the carrier 11 is at a predetermined position.
The detecting device 12 includes a light emitting device 121 and a light sensing device 122, the light reflecting device 121 is used for emitting detecting light; during the operation of the detection apparatus 12, the light reflection device 121 and the light sensing device 122 are respectively located at two opposite sides of the wafer 14, and the transmission path of the detection light has an intersection with the edge of the wafer 14.
Referring to fig. 3 to 4, the detecting device 12 obtains the initial position coordinate information of the wafer 14, which specifically includes: the detecting device 12 detects whether the first carrier assembly 111 carries the wafer 14; the analysis controller determines whether the first carrier assembly 111 carries the wafer 14 according to the received detection information; the detecting device 12 controls the second carrier assembly 112 to lift and support the wafer 14; the detecting device 12 controls the second supporting member 112 to rotate around a predetermined position to drive the wafer 14 to rotate, and during the rotation of the wafer 14, the optical sensor 122 obtains the initial position coordinate information of the wafer 14 according to the received detection light.
In this embodiment, the wafer 14 has a notch, and the offset condition of the wafer 14 includes an offset of the initial position relative to the preset position and an angle offset of the notch. Specifically, the analysis controller stores a standard angle value, and obtains an angle offset of the gap according to the standard angle value and the current angle value obtained by the light sensing device 122.
In this embodiment, the initial position is not coincident with the preset position, and the current angle value is not equal to the standard angle value, and the specific step of adjusting the position of the wafer 14 to correct the offset of the wafer 14 includes:
referring to fig. 6, the analysis controller controls the adjustment device 13 to move based on the offset of the initial position from the preset position, so that the central axis of the first bearing assembly 111 is at the initial position; referring to fig. 7, the analysis controller controls the second carrier assembly 112 to descend such that the first carrier assembly 111 supports the wafer 14; referring to fig. 8, the analysis controller again controls the adjustment device 13 to move so that the central axis of the first carrier assembly 111 and the central axis of the wafer 14 are at the predetermined positions.
After the central axis of the first carrier assembly 111 and the central axis of the wafer 14 are at the preset positions, the angle value of the notch needs to be adjusted, which specifically includes: the analysis controller stores a standard angle value, controls the second carrier assembly 112 to lift and support the wafer 14, and controls the second carrier assembly 112 to rotate based on an angle deviation value of the current angle value relative to the standard angle value, and the second carrier assembly 112 rotates to drive the wafer 14 to rotate, so that the angle of the notch is equal to the standard angle value.
It should be noted that, in other embodiments, after the central axis of the first carrier assembly and the central axis of the wafer are at the preset positions, the analysis controller controls the first carrier assembly to rotate, and the first carrier assembly rotates to drive the wafer to rotate, so that the angle of the wafer gap is equal to the standard angle value.
The embodiment provides a novel wafer adjusting method, which can detect the offset condition of a wafer with offset and correspondingly adjust the position of the wafer according to the offset condition; and before and after the wafer is adjusted, the central axis of the bearing part is positioned at the same position, which is beneficial to realizing the automation of wafer transfer.
Correspondingly, an embodiment of the present invention further provides a wafer conveying system, including the above wafer adjusting device, further including: the wafer conveying table is used for bearing and conveying wafers; the wafer offset detection device is used for detecting whether the wafer on the wafer conveying table is offset or not; and the wafer transfer device is used for transferring the wafer into the wafer adjusting device when the wafer deviation detection device detects that the wafer deviates, and is also used for transferring the wafer from the wafer adjusting device to the wafer transmission platform.
When the wafer conveying table bears and conveys the wafer, the wafer deviation detection device detects whether the wafer on the wafer conveying table deviates in real time or at a fixed frequency; when the wafer deviation detection device detects that the wafer deviates, the wafer transfer device transfers the wafer with the deviation to a bearing part of the wafer adjusting device; and after the wafer with the offset is adjusted, the transfer device transfers the wafer placed on the bearing part to the wafer conveying table.
It should be noted that the ideal position of the wafer on the conveyor belt (i.e. the position before the wafer is shifted) has a corresponding relationship with the preset position in the wafer adjusting device, and the wafer transferring device transfers the wafer according to the corresponding relationship, that is, the offset of the wafer shifted on the conveyor belt relative to the ideal position is equal to the offset of the wafer after the wafer is transferred relative to the preset position.
In this embodiment, the wafer transfer apparatus can simultaneously transfer a plurality of wafers. Specifically, the wafer transfer device can carry a plurality of wafers which are deviated, and the plurality of wafers in the wafer transfer device are sorted according to a preset rule. When the wafer transfer device transfers the wafer into the wafer adjusting device, the wafer transfer device places the first wafer with the offset into the wafer adjusting device according to a preset sequence; after the wafer with the offset is adjusted, the wafer transfer device bears the wafer again, and a second wafer with the offset is placed in the wafer adjusting device, and the steps are repeated until all the wafers with the offset are adjusted; after all the wafers are reloaded, the wafer transfer device places a plurality of wafers on the conveying table according to a preset sequence.
The embodiment of the invention provides a wafer conveying system, which can correct the position of a wafer which is deviated on a conveying table under the condition of no need of manual intervention, thereby ensuring the yield of the wafer.
It will be understood by those of ordinary skill in the art that the foregoing embodiments are specific examples for carrying out the invention, and that various changes in form and details may be made therein without departing from the spirit and scope of the invention in practice. Various changes and modifications may be effected therein by one skilled in the art without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (10)
1. A wafer conditioning apparatus, comprising:
the bearing component comprises a first bearing component and a second bearing component for bearing wafers, wherein the first bearing component is positioned above the second bearing component, the first bearing component is provided with a containing space for containing the second bearing component, the second bearing component is movable relative to the first bearing component, and the first bearing component is movable relative to the second bearing component;
the detecting device is arranged on the bearing part, the first bearing component and the second bearing component are positioned in a detecting range of the detecting device, and the detecting device is used for detecting the wafer to obtain detecting information;
the adjusting device is connected with the first bearing component and the second bearing component and drives the first bearing component to move relative to the second bearing component and the second bearing component to move relative to the first bearing component;
the analysis controller is connected with the detection device and the adjusting device, receives detection information of the detection device, analyzes and processes the detection information, sends a processing signal to the adjusting device according to a processing result, and the adjusting device drives the first bearing assembly to move relative to the second bearing assembly and drives the second bearing assembly to move relative to the first bearing assembly according to the processing signal.
2. The wafer conditioning device of claim 1, wherein the detecting device comprises: a light emitting device and a light sensing device respectively located on opposite sides of the carrier; during the operation of the detection device, the transmission path of the detection light emitted by the light emitting device has an intersection point with the edge of the wafer.
3. The wafer conditioning apparatus of claim 2, wherein the first carrier assembly is horizontally movable relative to the second carrier assembly, and wherein the second carrier assembly is raised toward the first carrier assembly and lowered away from the first carrier assembly.
4. The wafer adjusting apparatus as claimed in claim 1, wherein the detecting device includes a data analyzing unit, and the data analyzing unit is configured to determine whether the initial position coordinate information of the wafer can be obtained according to the currently detected position information of the wafer.
5. The wafer conditioning device of claim 1, further comprising: the sensing device is arranged on the first bearing component; the analysis controller is connected with the sensing device, receives sensing information of the sensing device and analyzes and processes the sensing information.
6. A method of wafer conditioning, comprising:
providing a wafer conditioning device as claimed in any one of claims 1 to 5;
providing a wafer, wherein the wafer is carried on a first carrying component, the central axis of the wafer is at an initial position, and the central axis of the first carrying component is at a preset position;
the detection device acquires the initial position coordinate information of the wafer;
the analysis controller calculates the offset of the initial position relative to the preset position based on the initial position coordinate information of the wafer, and sends out an adjusting signal;
and the adjusting device receives the adjusting signal and adjusts the first bearing assembly and the second bearing assembly according to the adjusting signal so as to enable the central axis of the first bearing assembly and the central axis of the wafer to be at the preset position.
7. The method as claimed in claim 6, wherein the step of acquiring the initial position coordinate information of the wafer by the detecting device comprises: the detecting device detects whether the first bearing assembly bears the wafer or not; the analysis controller judges whether the first bearing assembly bears the wafer or not according to the received detection information; if so, the analysis controller sends a processing signal to the adjusting device, transfers the wafer from the first bearing component to a second bearing component, and controls the second bearing component to rotate around a preset position; the detection device detects the position information of the wafer in the rotation process and acquires the initial position coordinate information of the wafer.
8. The method as claimed in claim 7, wherein the adjusting device adjusts the first carrier assembly and the second carrier assembly according to the adjustment signal so that the center position of the first carrier assembly and the center position of the wafer are at the predetermined positions, specifically comprising: the adjusting device drives the first bearing assembly to move relative to the second bearing assembly according to the adjusting signal, so that the central axis of the first bearing assembly moves from the preset position to the initial position; the adjusting device further drives the second bearing assembly to move relative to the first bearing assembly according to the adjusting signal, so that the wafer is transferred from the second bearing assembly to the first bearing assembly after the first bearing assembly moves to the initial position; the adjusting device further drives the first bearing assembly to move to the preset position according to the adjusting signal, so that the wafer moves to the preset position.
9. The wafer conditioning method of claim 8, wherein the initial position coordinate information includes a current angle value, and the analysis controller stores a standard angle value; after the wafer moves to the preset position, the adjusting device further executes the following actions according to the adjusting signal: driving the second bearing component to move relative to the first bearing component, so that the wafer is transferred from the first bearing component to the second bearing component; controlling the second bearing component to rotate so that the current angle value of the wafer is equal to the standard angle value; and driving the second bearing component to move relative to the first bearing component, so that the wafer is transferred from the second bearing component to the first bearing component.
10. A wafer transfer system comprising the wafer conditioning apparatus of any of claims 1-5, further comprising:
the wafer conveying table is used for bearing and conveying wafers;
the wafer offset detection device is used for detecting whether the wafer on the wafer conveying table is offset or not;
and the wafer transfer device is used for transferring the wafer into the wafer adjusting device when the wafer deviation detection device detects that the wafer deviates, and is also used for transferring the wafer from the wafer adjusting device to the wafer transmission platform.
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| CN201911219373.7A CN112908887A (en) | 2019-12-03 | 2019-12-03 | Wafer adjusting device and method and wafer conveying system |
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