CN114613711A - Wafer adjusting device, adjusting method and semiconductor manufacturing equipment - Google Patents
Wafer adjusting device, adjusting method and semiconductor manufacturing equipment Download PDFInfo
- Publication number
- CN114613711A CN114613711A CN202011409721.XA CN202011409721A CN114613711A CN 114613711 A CN114613711 A CN 114613711A CN 202011409721 A CN202011409721 A CN 202011409721A CN 114613711 A CN114613711 A CN 114613711A
- Authority
- CN
- China
- Prior art keywords
- wafer
- distance
- adjusting
- sensor assembly
- sensor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a wafer adjusting device, an adjusting method and semiconductor manufacturing equipment, relates to the technical field of semiconductor processing, and is used for enabling a wafer to be in a correct position relative to a wafer bearing table. The wafer adjusting device comprises: used for adjusting the position of the wafer relative to the wafer bearing platform. The wafer adjusting device comprises: and the sensor component is used for detecting the inclination angle and the offset of the wafer relative to the wafer bearing table. A plurality of adjusting components and a controller for adjusting the inclination angle and/or the offset. The controller is in communication connection with the sensor assembly and the plurality of adjusting assemblies and is used for controlling at least one adjusting assembly to adjust the position of the wafer according to the inclination angle and the offset detected by the sensor assembly so that the wafer is located at a correct position relative to the wafer bearing table. The semiconductor manufacturing equipment comprises the wafer adjusting device. The wafer adjusting method is used for the wafer adjusting device so that the wafer is in the correct position.
Description
Technical Field
The invention relates to the technical field of semiconductor processing, in particular to a wafer adjusting device, an adjusting method and semiconductor manufacturing equipment.
Background
In a semiconductor manufacturing process, a wafer is subjected to a plurality of processes to form a desired semiconductor structure. In a multi-pass process for processing wafers, a robot is typically used to transfer the wafers between the various process chambers. A wafer stage is typically disposed within each process chamber for supporting a wafer. In the process of transferring the wafer, the wafer is separated from the wafer bearing table or placed on the wafer bearing table through the mechanical arm, and at the moment, whether the wafer is in the correct position relative to the wafer bearing table or not can affect the subsequent process. For example: if the wafer is not located at the correct position of the wafer carrier, the wafer may be dropped off from the robot arm due to the shift of the center of gravity of the wafer when the robot arm grips the wafer. Therefore, it is critical that the wafer be in the correct position on the wafer carrier.
Disclosure of Invention
The invention aims to provide a wafer adjusting device, an adjusting method and semiconductor manufacturing equipment, which are used for enabling a wafer to be in a correct position relative to a wafer bearing table.
In a first aspect, the present invention provides a wafer adjusting apparatus for adjusting a position of a wafer relative to a wafer stage. The wafer adjusting device comprises: the device comprises a sensor component, a plurality of adjusting components and a controller, wherein the sensor component is used for detecting the inclination angle and the offset of a wafer relative to a wafer bearing table. The controller is in communication connection with the sensor assembly and the plurality of adjusting assemblies and is used for controlling the at least one adjusting assembly to adjust the position of the wafer according to the inclination angle and the offset detected by the sensor assembly so that the wafer is located at the correct position relative to the wafer bearing table.
Compared with the prior art, in the wafer adjusting device provided by the invention, the wafer is arranged on the wafer bearing table, and the plurality of adjusting components are used for adjusting the distance between the wafer and the wafer bearing table. The sensor assembly is used for detecting the inclination angle and the offset of the wafer relative to the wafer bearing table. The controller is used for receiving the current inclination angle and the offset of the wafer and judging whether the wafer is in the correct position according to the inclination angle and the offset. If the wafer is not in the correct position, the controller controls one end of the at least one adjusting component, which is in contact with the wafer, to move in a direction close to or away from the wafer bearing table so as to adjust the position of the wafer relative to the wafer bearing table and enable the wafer to be in the correct position relative to the wafer bearing table. Therefore, the wafer adjusting device provided by the invention can enable the wafer to be in the correct position relative to the wafer bearing table, so that the situation that the wafer slides from the manipulator due to the gravity center offset of the wafer in the process of transferring the wafer by the manipulator is avoided.
In a second aspect, the present invention also provides a semiconductor manufacturing apparatus, comprising the wafer conditioning device described in the first aspect.
The beneficial effects of the semiconductor manufacturing equipment provided by the second aspect of the present invention are the same as the beneficial effects of the wafer conditioning apparatus described in the first aspect, and are not described herein again.
In a third aspect, the present invention further provides a wafer adjusting method for adjusting the position of the wafer relative to the wafer stage. The wafer adjusting method comprises the following steps:
acquiring the inclination angle of the wafer relative to the wafer bearing table;
obtaining the offset of the wafer relative to the wafer bearing table;
and adjusting the position of the wafer based on the inclination angle and/or the offset so that the wafer is in the correct position relative to the wafer bearing table.
The beneficial effects of the wafer adjusting method provided by the third aspect of the present invention are the same as the beneficial effects of the wafer adjusting device described in the first aspect, and are not described herein again.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention and not to limit the invention. In the drawings:
FIG. 1 is a schematic structural view of a wafer in a correct position relative to a wafer stage according to an embodiment of the present invention;
FIG. 2 is a schematic structural diagram of a wafer tilted with respect to a wafer stage according to an embodiment of the present invention;
FIG. 3 is a first schematic view of a wafer offset with respect to a wafer stage according to an embodiment of the present invention;
FIG. 4 is a second schematic view of a structure of a wafer having an offset with respect to a wafer stage according to an embodiment of the present invention;
fig. 5 is a schematic top view of a wafer and a sensor assembly according to an embodiment of the invention.
Detailed Description
In order to make the technical problems, technical solutions and advantageous effects to be solved by the present invention more clearly apparent, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or to implicitly indicate the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise. The meaning of "a number" is one or more unless specifically limited otherwise.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In a semiconductor manufacturing process, a wafer needs to undergo a plurality of processes. Electrochemical polishing of the wafer is described below as an example.
In the electrochemical polishing process of the wafer, the front side of the wafer is placed on the wafer bearing platform by the mechanical arm downwards, and then the wafer is taken away from the wafer bearing platform by the vacuum chuck for electrochemical polishing. After the electrochemical polishing is finished, the vacuum chuck unloads the wafer on the wafer bearing platform with the front surface facing downwards, and finally the wafer after the electrochemical polishing is taken away from the wafer bearing platform by the manipulator. According to the process, whether the mechanical arm or the vacuum chuck can be placed at the correct position of the wafer bearing table plays an important role in the subsequent operation of the vacuum chuck or the mechanical arm. For example: after the electrochemical polishing is finished, if the vacuum chuck does not unload the wafer to the correct position of the wafer bearing platform, when the manipulator clamps the wafer, the wafer can slide off the manipulator due to the shift of the center of gravity of the wafer.
In view of the above-mentioned technical problems, embodiments of the present invention provide a wafer adjusting apparatus. FIG. 1 illustrates a schematic structural diagram of a wafer 1 relative to a wafer stage 2 when the wafer 1 is at a correct position; FIG. 2 illustrates a schematic structural diagram of the wafer 1 having an inclination angle smaller than 90 ° with respect to the wafer stage 2 when the wafer 1 is at an incorrect position; FIG. 3 is a schematic diagram illustrating a structure of a wafer 1 having an offset to the left with respect to the wafer stage 2 when the wafer 1 is at an incorrect position; fig. 4 is a schematic diagram illustrating a structure in which the wafer 1 has a right offset with respect to the wafer stage 2 when the wafer 1 is at an incorrect position.
Referring to fig. 1, a wafer adjusting apparatus according to an embodiment of the present invention is used for adjusting a position of a wafer 1 relative to a wafer stage 2. The wafer adjusting device comprises: the controller and the sensor component are used for detecting the inclination angle and the offset of the wafer 1 relative to the wafer bearing platform 2. A plurality of adjusting components 5 for adjusting the inclination angle and the offset.
Referring to fig. 1, the controller is communicatively connected to the sensor assembly and the plurality of adjustment assemblies 5, respectively. The controller may control the plurality of adjustment assemblies 5 to position the wafer 1 in the correct position relative to the wafer carrier 2 based on the offset angle and the offset amount detected by the sensor assembly. The controller may be a controller in a broad sense, and the embodiment of the present invention is not particularly limited thereto.
Referring to fig. 2, the inclination angle may be an included angle between a plane of the wafer 1 and a plane of the wafer susceptor 2. The included angle may range from 0 to 180. Referring to fig. 3 and 4, the offset may be a distance between an axis of the wafer 1 and an axis of the wafer stage 2. The distance may be greater than or equal to 0.
Referring to fig. 1, the correct position may be a distance between the axis of the wafer 1 and the axis of the wafer carrier 2 within a distance deviation range, and an included angle between a plane of the wafer 1 and a plane of the wafer carrier 2 within an angle deviation range. In the practical application process, the distance deviation range and the angle deviation range can be determined according to the practical situation.
Referring to fig. 1, the sensor assembly may include a first sensor assembly 3 and a second sensor assembly 4. The first sensor assembly 3 is used for detecting the inclination angle of the wafer 1 relative to the wafer bearing table 2. And the second sensor assembly 4 is used for detecting the offset of the wafer 1 relative to the wafer bearing platform 2.
Referring to fig. 1, the first sensor assembly 3 may be disposed in the target plane and located outside the wafer 1. The target plane may be the plane of the wafer 1 when the wafer 1 is in the correct position. That is, the first sensor assembly 3 may be disposed at the outer periphery of the wafer 1, and an included angle between a plane of the first sensor assembly 3 and a plane of the wafer stage 2 may be 0 ° or 180 °.
Fig. 5 illustrates a top view of the wafer 1 and the sensor assembly when the wafer 1 is in the correct position.
Referring to fig. 5, in one example, the first sensor assembly 3 may include at least one first distance sensor for detecting a horizontal distance between the respective first distance sensor and the wafer 1. For example: the first sensor assembly 3 may include four first distance sensors, and the four first distance sensors may be uniformly disposed along the outer circumferential direction of the wafer 1. For example: referring to fig. 5, four second distance sensors may be respectively located at upper, lower, left, and right sides of the wafer 1.
Referring to fig. 1, when the wafer 1 is at the correct position, the horizontal distance detected by the first distance sensor located at the left side of the wafer 1 is the first horizontal distance. The horizontal distance detected by the first distance sensor located on the right side of the wafer 1 is a second horizontal distance. The horizontal distance detected by the first distance sensor located on the upper side of the wafer 1 is a third horizontal distance. The horizontal distance detected by the first distance sensor located at the lower side of the wafer 1 is the fourth horizontal distance. The first horizontal distance, the second horizontal distance, the third horizontal distance, and the fourth horizontal distance may all be equal. At this time, the first horizontal distance, the second horizontal distance, the third horizontal distance, and the fourth horizontal distance may be standard horizontal distances. That is, when the wafer 1 is at the correct position, the horizontal distance detected by any one of the first distance sensors is the standard horizontal distance.
Referring to fig. 2 to 4, when the wafer 1 is in other positions, the first horizontal distance or the second horizontal distance or the third horizontal distance or the fourth horizontal distance may be greater than the standard horizontal distance.
Referring to fig. 2 to 4, it can be understood that the standard horizontal distance may have a certain error distance. The error distance can be determined according to actual conditions.
It is understood that the first sensor assembly 3 may be other types of sensors, and the embodiment of the present invention is not limited thereto.
Referring to fig. 1, the second sensor assembly 4 may include a plurality of photosensors. The emitter end of each photosensor may be located on a first side of the wafer 1. The receiving end of each photosensor may be located at the second side of the wafer 1. When the wafer 1 is in the correct position, the second sensor assembly 4 sends a first detection signal to the controller. When the wafer 1 is at another position, the second sensor assembly 4 sends a second detection signal to the controller.
Referring to fig. 5, in one example, the second sensor assembly 4 may include two sets of photosensor assemblies. One group of photoelectric sensor components comprises a first photoelectric sensor and a second photoelectric sensor, and the other group of photoelectric sensor components comprises a third photoelectric sensor and a fourth photoelectric sensor. The two sets of photosensor assemblies may be uniformly arranged along the outer circumference of the wafer 1. For example: referring to fig. 5, a first photosensor is located on the left side of the wafer 1, a second photosensor is located on the right side of the wafer 1, a third photosensor is located on the upper side of the wafer 1, and a fourth photosensor is located on the lower side of the wafer 1. The transmitting end of each photoelectric sensor is used for transmitting signals to the corresponding receiving end, and the receiving end of each photoelectric sensor can be in communication connection with the controller.
Referring to fig. 1, when the wafer 1 is in the correct position, the receiving end of each of the photosensors may receive the signal sent by the transmitting end, and the second sensor assembly 4 sends a first detection signal to the controller. That is, when any portion of the wafer 1 does not block the transmitting end and the receiving end of any of the photosensors.
Referring to fig. 2 to 4, when the wafer 1 is located at another position, the receiving end of the at least one electrical sensor cannot receive the signal sent by the transmitting end, and at this time, the second sensor assembly 4 sends a second detection signal to the controller. That is, when the wafer 1 blocks the transmitting end and the receiving end of any one of the photoelectric sensors, the second sensor assembly sends a second detection signal to the controller.
Referring to fig. 5, the second sensor assembly 4 may also include a plurality of second distance sensors, each of which may be located on the first side of the wafer 1. The second sensor assembly 4 may include four second distance sensors, and the four second distance sensors may be uniformly located on the first side of the wafer 1 along the outer circumferential direction of the wafer 1. Of course, each of the second distance sensors may also be located on the second side of the wafer 1, and the embodiment of the present invention is described by taking the example that each of the second distance sensors is located on the first side of the wafer 1. For example: referring to fig. 5, four second distance sensors may be respectively located at upper, lower, left, and right sides of the wafer 1.
Referring to fig. 1, when the wafer 1 is at the correct position, the vertical distance detected by the second distance sensor located at the left side of the wafer 1 is the first vertical distance. The vertical distance detected by the second distance sensor located on the right side of the wafer 1 is the second vertical distance. The vertical distance detected by the second distance sensor located on the upper side of the wafer 1 is a third vertical distance. The vertical distance detected by the second distance sensor located on the lower side of the wafer 1 is a fourth vertical distance. The first vertical distance, the second vertical distance, the third vertical distance, and the fourth vertical distance may all be equal. At this time, the first vertical distance, the second vertical distance, the third vertical distance, and the fourth vertical distance may be standard vertical distances. That is, when the wafer 1 is at the correct position, the vertical distance detected by any one of the second distance sensors is the standard vertical distance.
Referring to fig. 2 to 4, when the wafer 1 is at other positions, the first vertical distance or the second vertical distance or the third vertical distance or the fourth vertical distance may be greater than the standard vertical distance.
Referring to fig. 1, it is understood that the standard vertical distance may have a certain error distance. The error distance can be determined according to actual conditions.
It is understood that other types of sensors may be selected for the second sensor assembly 4, and the embodiment of the present invention is not limited thereto.
Referring to fig. 1, when the first sensor elements 3 are four first distance sensors and the second sensor elements 4 are four photosensors. When the wafer 1 is in the correct position, the first horizontal distance, the second horizontal distance, the third horizontal distance and the fourth horizontal distance may be equal. The receiving end of each photoelectric sensor can receive the signal transmitted by the corresponding transmitting end. At this time, the receiving end of each photoelectric sensor can send a first detection signal to the controller. That is to say, when any part of the wafer 1 does not block the transmitting end and the receiving end of any photoelectric sensor, the second sensor assembly 4 sends a first detection signal to the controller. At other locations of the wafer 1, any horizontal distance may be greater than the standard horizontal distance. The receiving end of at least one photoelectric sensor cannot receive the signal sent by the corresponding transmitting end, and at the moment, the receiving end of at least one photoelectric sensor sends a second detection signal to the controller. That is, when the wafer 1 blocks the transmitting end and the receiving end of any one of the photoelectric sensors, the second sensor assembly sends a second detection signal to the controller.
Referring to fig. 2 to 4, in an example, when the wafer 1 is located at another position, and the wafer 1 has an inclination angle smaller than 90 ° with respect to the wafer stage 2, that is, when the wafer 1 is inclined to the left with respect to the wafer stage 2, the first horizontal distance is larger than the standard horizontal distance, the receiving end of the first photosensor cannot receive the signal transmitted by the transmitting end of the first photosensor, and the receiving end of the second photosensor can receive the signal transmitted by the transmitting end of the second photosensor.
Referring to fig. 2 to 4, in another example, the wafer 1 is located at another position, when the wafer 1 has an offset amount to the left with respect to the wafer stage 2, that is, when the wafer 1 is offset to the left with respect to the wafer stage 2, the first horizontal distance is smaller than the standard horizontal distance, and the second horizontal distance is larger than the standard horizontal distance; the receiving end of the first photoelectric sensor cannot receive the signal transmitted by the transmitting end of the first photoelectric sensor, and the receiving end of the second photoelectric sensor can receive the signal transmitted by the transmitting end of the second photoelectric sensor.
Referring to fig. 2 to 4, in another example, the wafer 1 is located at another position, when the wafer 1 has a right offset with respect to the wafer stage 2, that is, when the wafer 1 is offset to the right with respect to the wafer stage 2, the first horizontal distance is greater than the standard horizontal distance, and the second horizontal distance is less than the standard horizontal distance; the receiving end of the first photoelectric sensor can receive the signal transmitted by the transmitting end of the first photoelectric sensor, and the receiving end of the second photoelectric sensor cannot receive the signal transmitted by the transmitting end of the second photoelectric sensor.
Referring to fig. 1, when the first sensor assembly 3 is four first distance sensors and the second sensor assembly 4 is four second distance sensors. When the wafer 1 is at the correct position, the first horizontal distance, the second horizontal distance, the third horizontal distance and the fourth horizontal distance may be equal. The first vertical distance, the second vertical distance, the third vertical distance, and the fourth vertical distance may all be equal. At other locations of the wafer 1, any horizontal distance may be greater than the standard horizontal distance, and any vertical distance may be greater than the standard vertical distance.
Referring to fig. 2 to 4, in an example, the wafer 1 is located at other positions, when the wafer 1 has an inclination angle smaller than 90 ° with respect to the wafer stage 2, that is, when the wafer 1 is inclined to the left with respect to the wafer stage 2, the first horizontal distance is larger than the standard horizontal distance, and the first vertical distance and the second vertical distance are both larger than the standard vertical distance.
Referring to fig. 2 to 4, in another example, the wafer 1 is located at another position, when the wafer 1 has an offset amount to the left with respect to the wafer stage 2, that is, when the wafer 1 is offset to the left with respect to the wafer stage 2, the first horizontal distance is smaller than the standard horizontal distance, and the second horizontal distance is larger than the standard horizontal distance; the first vertical distance is equal to the standard horizontal distance and the second vertical distance is greater than the standard vertical distance.
Referring to fig. 2 to 4, in another example, the wafer 1 is located at another position, when the wafer 1 has a right offset with respect to the wafer stage 2, that is, when the wafer 1 is offset to the right with respect to the wafer stage 2, the first horizontal distance is greater than the standard horizontal distance, and the second horizontal distance is less than the standard horizontal distance; the first vertical distance is greater than the standard horizontal distance and the second vertical distance is equal to the standard vertical distance.
Referring to fig. 1, each of the above-mentioned adjusting assemblies 5 may include a cylinder and a lift pin connected to a piston rod of the cylinder. Wherein the cylinder may be in communication with the controller, and the wafer 1 may be in contact with the plurality of lift pins. Under the control of the controller, the cylinder drives the lifting pin to move so as to adjust the position of the wafer 1 relative to the wafer bearing table 2.
Referring to fig. 1, the lift pin may have a rod-shaped structure, and may include a cylindrical rod-shaped structure or a square-cylindrical rod-shaped structure, but is not limited thereto. Each lift pin is in contact with the bottom end of the wafer 1. Under the control of the controller, the corresponding air cylinder drives the positioning pin connected with the corresponding air cylinder to move in the direction close to or away from the wafer bearing table 2 so as to adjust the distance between the corresponding positioning pin and the wafer bearing table 2, and therefore the wafer 1 can be located at the correct position.
Referring to fig. 2, in practical application, when the included angle between the plane of the wafer 1 and the plane of the wafer carrier 2 is greater than 0 ° and smaller than 180 ° and/or the distance between the axis of the wafer 1 and the axis of the wafer carrier 2 is greater than 0. Under the control of the controller, the corresponding adjustment assembly 5 adjusts the position of the wafer 1 relative to the wafer stage 2 so that the wafer 1 is at the correct position, as described below by way of example where the first sensor assembly 3 includes four first distance sensors and the second sensor assembly 4 includes four second distance sensors.
Referring to fig. 2, in one example, the wafer 1 is tilted to the left with respect to the wafer stage 2, that is, the wafer 1 has a tilt angle of less than 90 ° with respect to the wafer stage 2. The controller can control the adjusting component 5 contacted with the left side of the wafer 1 to move along the direction departing from the wafer bearing platform 2, so that the height of the adjusting component 5 contacted with the left side of the wafer 1 is gradually equal to the height of other adjusting components 5. In this process, the first distance sensor located at the left side of the wafer 1 detects the first horizontal distance, and the second distance sensor located at the left side of the wafer 1 detects the first vertical distance until the first horizontal distance is equal to the standard horizontal distance, and the first vertical distance is equal to the standard vertical distance. The angle of inclination between the wafer 1 and the wafer stage 2 is 0 °. Of course, the controller may also control the adjusting component 5 contacting the right side of the wafer 1 to move in a direction approaching the wafer stage 2, so that the height of the adjusting component 5 contacting the right side of the wafer 1 is gradually equal to the height of the other adjusting components 5.
Referring to fig. 3, in another example, the wafer 1 is offset to the left with respect to the wafer stage 2, that is, the wafer 1 has an offset to the left with respect to the wafer stage 2. The controller can control the adjusting component 5 contacted with the left side of the wafer 1 to move along the direction departing from the wafer bearing platform 2, so that the height of the adjusting component 5 contacted with the left side of the wafer 1 is gradually equal to the height of other adjusting components 5. In the process, the first distance sensor located on the left side of the wafer 1 detects a first horizontal distance, the second distance sensor located on the right side of the wafer 1 detects a second horizontal distance, and the second distance sensor located on the left side of the wafer 1 detects a first vertical distance until the first horizontal distance and the second horizontal distance are equal to a standard horizontal distance, and the first vertical distance and the second vertical distance are equal to the standard vertical distance. The offset between the wafer 1 and the wafer stage 2 is 0.
Referring to fig. 1, the wafer stage 2 may be an electrostatic chuck. The electrostatic chuck may have a structure matched with the wafer 1 so that the wafer 1 can be stably placed on the electrostatic chuck.
Referring to fig. 1, compared with the prior art, in the wafer adjusting apparatus provided by the present invention, a wafer 1 is disposed on a wafer stage 2, and a plurality of adjusting elements 5 are used for adjusting a distance between the wafer 1 and the wafer stage 2. The sensor assembly is used for detecting the inclination angle and the offset of the wafer 1 relative to the wafer bearing table 2. The controller is used for receiving the current inclination angle and the offset of the wafer 1 and judging whether the wafer 1 is in the correct position according to the inclination angle and the offset. If the wafer 1 is not in the correct position, the controller controls one end of the at least one adjusting component 5, which is in contact with the wafer 1, to move in a direction close to or away from the wafer bearing table 2, so as to adjust the position of the wafer 1 relative to the wafer bearing table 2, and enable the wafer 1 to be in the correct position relative to the wafer bearing table 2. Based on this, the wafer adjusting device provided by the invention can enable the wafer 1 to be in the correct position relative to the wafer bearing table 2, thereby avoiding the situation that the wafer 1 slides off the manipulator due to the gravity center shift of the wafer 1 in the process of transferring the wafer 1 by the manipulator.
Referring to fig. 1 to 4, an embodiment of the present invention further provides a semiconductor manufacturing apparatus including the wafer conditioning device according to the above technical solution.
Referring to fig. 1, the semiconductor manufacturing apparatus may further include a process chamber 6, and the wafer conditioning device may be disposed in the process chamber 6. For example: the axis of the wafer conditioning device may coincide with the axis of the process chamber 6. The first sensor assembly 3 and the second sensor assembly 4 may be provided on a sidewall of the process chamber 6.
Referring to fig. 3, the semiconductor manufacturing apparatus may further include an alarm assembly, which may be communicatively coupled to the controller. When the wafer 1 is not in the correct position, the controller can control the alarm assembly to send out an alarm signal, so that an operator can know the condition in time.
The semiconductor manufacturing apparatus according to the embodiment of the present invention has the advantages of the wafer adjusting apparatus according to the above embodiment, which are not described herein again.
The embodiment of the invention also provides a wafer adjusting method which is applied to the wafer adjusting device, and the wafer adjusting device comprises: a first sensor assembly 3 for detecting the tilt angle of the wafer 1 relative to the wafer stage 2. A second sensor assembly 4 for detecting the offset of the wafer 1 relative to the wafer stage 2. A plurality of adjusting components 5 and a controller for adjusting the inclination angle and the offset.
The wafer adjusting method comprises the following steps:
acquiring the inclination angle of the wafer 1 relative to the wafer bearing table 2;
obtaining the offset of the wafer 1 relative to the wafer bearing table 2;
based on the tilt angle and/or offset, the position of the wafer 1 is adjusted so that the wafer 1 is in the correct position relative to the wafer stage 2.
The wafer adjusting method provided by the embodiment of the invention has the beneficial effects that the beneficial effects of the wafer adjusting device provided by the embodiment can be referred to, and are not described herein again.
In the foregoing description of embodiments, the particular features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments or examples.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention, and all the changes or substitutions should be covered within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the appended claims.
Claims (10)
1. A wafer adjusting device, for adjusting the position of a wafer relative to a wafer carrier, the wafer adjusting device comprising: the sensor component is used for detecting the inclination angle and the offset of the wafer relative to the wafer bearing table, and the plurality of adjusting components and the controller are used for controlling the wafer bearing table to rotate;
the controller is in communication connection with the sensor assembly and the plurality of adjusting assemblies and is used for controlling at least one adjusting assembly to adjust the position of the wafer according to the inclination angle and the offset detected by the sensor assembly so that the wafer is in a correct position relative to the wafer bearing table.
2. The wafer conditioning device of claim 1, wherein the sensor assembly comprises a first sensor assembly and a second sensor assembly;
the first sensor assembly is used for detecting the inclination angle of the wafer relative to the wafer bearing table;
the second sensor assembly is used for detecting the offset of the wafer relative to the wafer bearing table.
3. The wafer conditioning device of claim 2, wherein the first sensor assembly is disposed in a target plane and the first sensor assembly is located outside of the wafer; and the target plane is the plane where the wafer is located when the wafer is located at the correct position.
4. The wafer conditioning device of claim 2, wherein the first sensor assembly comprises at least one first distance sensor for detecting a horizontal distance between the respective first distance sensor and the wafer;
when the wafer is at the correct position, the horizontal distance detected by each first distance sensor is a standard horizontal distance; when the wafer is at other positions, the horizontal distance detected by at least one first distance sensor is greater than the standard horizontal distance.
5. The wafer conditioning device of claim 2, wherein the second sensor assembly comprises a plurality of photosensors; the transmitting end of each photoelectric sensor is positioned at the first side of the wafer, and the receiving end of each photoelectric sensor is positioned at the second side of the wafer;
when the wafer is at the correct position, the second sensor assembly sends a first detection signal to the controller; when the wafer is at other positions, the second sensor assembly sends a second detection signal to the controller.
6. The wafer conditioning device of claim 2, wherein the second sensor assembly comprises a plurality of second distance sensors, each of the second distance sensors being located on a first side of the wafer;
when the wafer is at the correct position, the vertical distance detected by each second distance sensor is a standard vertical distance; when the wafer is at other positions, the vertical distance detected by at least one second distance sensor is larger than the standard vertical distance.
7. The wafer adjusting device according to any one of claims 1 to 6, wherein the tilt angle is an included angle between a plane on which the wafer is located and a plane on which the wafer carrier is located;
the offset is the distance between the axis of the wafer and the axis of the wafer bearing table.
8. The wafer conditioning device of claim 7, wherein each of the conditioning assemblies comprises a cylinder and a lift pin connected to a piston rod of the cylinder;
the air cylinder is in communication connection with the controller, and the wafer is in contact with the plurality of lifting pins; under the control of the controller, the cylinder drives the lifting pin to move so as to adjust the position of the wafer relative to the wafer bearing table.
9. A semiconductor manufacturing apparatus comprising the wafer conditioning device of any one of claims 1-8.
10. A wafer adjusting method is used for adjusting the position of a wafer relative to a wafer bearing table, and comprises the following steps:
acquiring the inclination angle of the wafer relative to the wafer bearing table;
obtaining the offset of the wafer relative to the wafer bearing table;
and adjusting the position of the wafer based on the inclination angle and/or the offset so as to enable the wafer to be in a correct position relative to the wafer bearing platform.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011409721.XA CN114613711A (en) | 2020-12-04 | 2020-12-04 | Wafer adjusting device, adjusting method and semiconductor manufacturing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011409721.XA CN114613711A (en) | 2020-12-04 | 2020-12-04 | Wafer adjusting device, adjusting method and semiconductor manufacturing equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114613711A true CN114613711A (en) | 2022-06-10 |
Family
ID=81856129
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011409721.XA Pending CN114613711A (en) | 2020-12-04 | 2020-12-04 | Wafer adjusting device, adjusting method and semiconductor manufacturing equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114613711A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116714121A (en) * | 2023-08-09 | 2023-09-08 | 江苏京创先进电子科技有限公司 | Wafer loading method, wafer processing method and wafer processing equipment |
-
2020
- 2020-12-04 CN CN202011409721.XA patent/CN114613711A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116714121A (en) * | 2023-08-09 | 2023-09-08 | 江苏京创先进电子科技有限公司 | Wafer loading method, wafer processing method and wafer processing equipment |
| CN116714121B (en) * | 2023-08-09 | 2023-11-03 | 江苏京创先进电子科技有限公司 | Wafer loading method, wafer processing method and wafer processing equipment |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR102433436B1 (en) | Substrate processing system, edge rign inspection method in the substrate processing system, and disk-type vision sensor performing for the same | |
| KR101197426B1 (en) | Method of adjusting moving position of transfer arm and position detecting jig | |
| US20220254666A1 (en) | Integrated adaptive positioning systems and routines for automated wafer-handling robot teach and health check | |
| CN107818932B (en) | Turntable positioning device, loading and conveying system and plasma processing equipment | |
| US6895831B2 (en) | Sensor device for non-intrusive diagnosis of a semiconductor processing system | |
| JP5889581B2 (en) | Wafer inspection equipment | |
| US20190172742A1 (en) | Teaching method | |
| US11913777B2 (en) | Detector for process kit ring wear | |
| CN113305841B (en) | Correction method of mechanical arm | |
| JP2013033809A (en) | Wafer transfer apparatus | |
| CN114613711A (en) | Wafer adjusting device, adjusting method and semiconductor manufacturing equipment | |
| CN110729225B (en) | Wafer handling apparatus and method thereof | |
| CN113257729A (en) | Teaching method | |
| CN210668297U (en) | Wafer adjusting device and wafer conveying system | |
| KR20210120848A (en) | Aligner apparatus and method for correcting positional deviation of workpiece | |
| CN219457555U (en) | Alignment mechanism | |
| CN117253835B (en) | Graphite disc positioning mechanism for loading wafer | |
| JP7474688B2 (en) | Correction method and substrate transport device | |
| WO2023019656A1 (en) | Wafer conveying apparatus and conveying method, and wafer conveying control apparatus | |
| CN116544160A (en) | Automatic wafer transmission method | |
| JP2023032305A (en) | Aligner device and positional deviation correction method for tabular work-piece | |
| KR20230058670A (en) | Robot system and offset acquisition method | |
| CN116581084A (en) | Mechanical arm for wafer conveying and control method thereof | |
| CN115401672A (en) | Correcting device of mechanical arm | |
| CN116417379A (en) | Wafer detection structure and wafer detection method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |