CN111868510A - Temperature adjustment device for stone surface plate and examination device provided with same - Google Patents
Temperature adjustment device for stone surface plate and examination device provided with same Download PDFInfo
- Publication number
- CN111868510A CN111868510A CN201980016331.5A CN201980016331A CN111868510A CN 111868510 A CN111868510 A CN 111868510A CN 201980016331 A CN201980016331 A CN 201980016331A CN 111868510 A CN111868510 A CN 111868510A
- Authority
- CN
- China
- Prior art keywords
- temperature
- panel
- stone
- temperature adjustment
- pipe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004575 stone Substances 0.000 title claims abstract description 147
- 239000003507 refrigerant Substances 0.000 claims description 48
- 230000005855 radiation Effects 0.000 claims description 28
- 238000009434 installation Methods 0.000 claims description 23
- 238000012360 testing method Methods 0.000 claims description 18
- 239000000498 cooling water Substances 0.000 claims description 14
- 238000009413 insulation Methods 0.000 claims description 10
- 238000001514 detection method Methods 0.000 claims description 5
- 238000005192 partition Methods 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 238000001816 cooling Methods 0.000 claims 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 77
- 238000007689 inspection Methods 0.000 description 24
- 238000013016 damping Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 7
- 238000009826 distribution Methods 0.000 description 4
- 239000010438 granite Substances 0.000 description 4
- 238000003384 imaging method Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000008399 tap water Substances 0.000 description 3
- 235000020679 tap water Nutrition 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000009924 canning Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
Images
Landscapes
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Waste-Gas Treatment And Other Accessory Devices For Furnaces (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
- Paper (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Testing Resistance To Weather, Investigating Materials By Mechanical Methods (AREA)
Abstract
The invention provides a temperature adjustment device for a stone platform and a checking device provided with the same. The temperature control unit controls the temperature of the lower surface temperature adjustment panel so that a temperature difference between the upper surface of the stone surface plate and the surface side of the lower surface temperature adjustment panel becomes a set value.
Description
Technical Field
The present invention relates to a temperature adjustment device for a stone surface plate and a testing device provided with the same.
Background
In recent years, in Flat Panel Displays (FPDs) such as Liquid Crystal Display (LCD) panels and organic EL panels, the size of glass substrates has been increasing with the increase in the size of displays. In the manufacture of large FPDs, a photomask for exposing the glass substrate to light of an equal magnification is used. Therefore, the photomask and the blank to be a master for forming an electronic circuit on the photomask are significantly increased in size with the increase in size of the LCD panel or mother glass.
In order to test a pattern arrangement or the like in a large photomask, for example, a test device disclosed in patent document 1 is used. This examination device includes a stone platform serving as a table that serves as a base of the device. The stone table is provided with a mask support portion that is capable of reciprocating relative to a stroke direction. The photomask is supported by the mask support portion and moved in the stroke direction. At this time, the photomask is supported by the mask support portion in an upright state such that the mask surface is parallel to the stroke direction and the vertical direction. That is, the photomask is placed on the stone surface plate in a so-called vertical state.
Prior art documents
Patent document
Patent document 1: japanese patent laid-open publication No. 2017-102074
Disclosure of Invention
Summary of the invention
Problems to be solved by the invention
In such a test device, it is very important to ensure the planar accuracy of the stone surface plate. As shown in fig. 14, when the stone stage 200 is tilted about an axis of a horizontal axis not shown, which intersects perpendicularly with the stroke direction S, the photomask 201 is curved on the mask surface. The pattern 202 on the panel surface is also shifted in position due to the curvature of the photomask 201 on the mask surface. Therefore, when pitching occurs in the stone surface plate 200, there is a problem that accurate examination cannot be performed.
In the manufacture of the stone surface plate, the temperature environment in which polishing is performed to form the plane accuracy of the stone surface plate does not necessarily coincide with the temperature environment in which the inspection device is used. That is, the environment temperature of the test device differs for each user environment. For example, when a stone table having a thickness of 400mm and a length of 4.5m is fabricated from granite (granite) and the temperature difference between the upper and lower surfaces of the stone table (upper surface temperature > lower surface temperature) is 0.1 ℃, a pitch error close to a 0.2-second angle (1-second angle: 1/3600 degrees) occurs. The stone surface plate ground in winter is easy to manufacture in an environment where the lower surface is cold, and when the use environment cannot keep the lower surface at a low temperature, the plane accuracy cannot be reproduced.
In general, in the inspection device, the temperature of the upper surface side of the stone surface plate is often adjusted because the upper surface side is exposed to the heat chamber, but the temperature of the lower surface side of the stone surface plate is often not adjusted. The lower surface of the stone platform is greatly affected by the temperature of the floor surface facing it. When the installation floor surface is cooler than the lower surface of the stone surface, the infrared rays emitted from the lower surface of the stone surface are absorbed by the installation floor surface, and do not return to the same amount of infrared rays as the amount of infrared rays emitted from the lower surface of the stone surface, and thus become cold. On the other hand, when the installation floor surface is higher in temperature than the lower surface of the stone surface plate, infrared rays of an amount equal to or greater than the amount of infrared rays emitted from the lower surface of the stone surface plate return to the lower surface of the stone surface plate, and therefore the temperature of the lower surface of the stone surface plate tends to rise.
Here, a case where the temperature of the lower surface of the stone platform is directly heated or cooled to adjust the temperature is considered. In this case, since a rapid response is required on the side of the stone platform due to direct temperature adjustment, it is considered that the shape stabilization of the stone platform becomes difficult. Further, even if the lower surface of the stone surface plate is directly heated or cooled, the influence of heat from the installation floor surface cannot be eliminated, and it is considered difficult to accurately control the shape of the stone surface plate.
Therefore, in the inspection device including the stone surface, it is required to suppress occurrence of an error in pattern inspection of the photomask due to deformation of the stone surface caused by a temperature environment of the floor surface.
The present invention has been made in view of the above-described problems, and an object thereof is to provide a temperature adjustment device for a stone surface plate that can easily maintain the accuracy of the flatness of the stone surface plate regardless of the installation location, and a examination device that includes the temperature adjustment device and can improve the examination accuracy of an examination panel.
Means for solving the problems
In order to solve the above problems and achieve the object, an aspect of the present invention provides a temperature adjustment device for a stone surface plate, which is disposed with a gap from a floor surface, the temperature adjustment device comprising: a lower surface temperature adjustment panel disposed on the installation floor surface so as to face a lower surface of the stone surface; and a temperature control unit that controls a temperature of the lower surface temperature adjustment panel, the lower surface temperature adjustment panel including: an insulating panel disposed on the installation floor surface; and a heat radiation panel disposed on the heat insulation panel, provided with a temperature adjustment portion, and supplying or absorbing heat through the temperature adjustment portion, wherein the temperature control portion controls the temperature of the heat radiation panel such that a temperature difference between the upper surface of the stone platform and the surface of the heat radiation panel becomes a set value.
In the above aspect, it is preferable that an occupied area of the installation floor surface where the stone surface plate is installed is divided into a plurality of divided areas along a longitudinal direction of the stone surface plate, and the lower surface temperature control panel is disposed in each of the divided areas.
In the above aspect, it is preferable that a panel side temperature sensor is provided on the lower surface temperature adjustment panel, an upper surface side temperature sensor paired with the panel side temperature sensor is provided on an upper surface of the stone surface plate corresponding to the panel side temperature sensor, and the temperature controller controls the temperature of the temperature adjuster of each of the lower surface temperature adjustment panels based on temperature detection values of the panel side temperature sensor and the upper surface side temperature sensor paired in correspondence in the up-down direction.
In the above aspect, it is preferable that a periphery of a gap between the lower surface temperature control panel and the lower surface of the stone surface plate is surrounded by a partition wall.
In the above aspect, the heat insulation panel is preferably formed of a resin sheet having a self-contained foamed structure.
As the above, preferably, the heat radiation panel is formed of a metal plate.
In the above aspect, the temperature adjustment unit is preferably a pipe through which a refrigerant flows.
In the above aspect, it is preferable that the tube has a pair of refrigerant flow paths parallel to each other, and the refrigerant flows in the refrigerant flow paths of the pair of refrigerant flow paths in opposite directions to each other.
As described above, the temperature adjustment device for a stone surface plate preferably includes: a tank configured to supply a refrigerant, which is adjusted to a reference temperature lower than the temperature of the stone surface heated by the lower surface temperature adjustment panel, to the temperature adjustment pipe; and a heat exchanger that cools the refrigerant that has returned through the temperature adjustment pipe by using cooling water having a temperature lower than the reference temperature so as to lower the temperature of the refrigerant to the reference temperature, and supplies the refrigerant cooled by the heat exchanger to the tank.
Another aspect of the present invention is characterized by comprising: a stone platform which is arranged with a gap with the floor surface and is used for loading the panel to be inspected; a test camera for shooting the state of the panel surface of the test panel; and a temperature control device for the stone surface plate, the temperature control device including a lower surface temperature adjustment panel arranged on the installation floor surface so as to face the lower surface of the stone surface plate, and a temperature control unit for controlling the temperature of the lower surface temperature adjustment panel, the lower surface temperature adjustment panel including a heat insulation panel arranged on the installation floor surface, and a heat radiation panel arranged on the heat insulation panel, embedded with a temperature adjustment unit, and supplying and absorbing heat through the temperature adjustment unit, the temperature control unit controlling the temperature of the heat radiation panel so that a temperature difference between the upper surface of the stone surface plate and the surface of the heat radiation panel becomes a set value.
Effects of the invention
According to the present invention, it is possible to realize a temperature adjustment device for a stone surface plate that can suppress deformation of the stone surface plate, particularly, can easily maintain plane accuracy, regardless of the installation location, and a examination device that includes the temperature adjustment device for a stone surface plate and can improve examination accuracy of an examination panel.
Drawings
Fig. 1 is a schematic cross-sectional view illustrating a test device according to a first embodiment of the present invention.
Fig. 2 is an exploded perspective view of a main portion of the inspection device according to the first embodiment of the present invention.
Fig. 3 is a top explanatory view showing a state other than the stone surface plate of the inspection device according to the first embodiment of the present invention.
Fig. 4 is a schematic configuration diagram of the detection device and the temperature adjustment device according to the first embodiment of the present invention.
Fig. 5 is a sectional view of a first lower surface temperature control panel used in the temperature control device according to the first embodiment of the present invention.
Fig. 6-1 is an explanatory view schematically showing a state in which deformation due to temperature distribution occurs in the stone surface plate in the examination device according to the first embodiment of the present invention.
Fig. 6-2 is an explanatory diagram illustrating a state of the stone surface plate when the temperature is controlled by the temperature adjustment device in the examination device according to the first embodiment of the present invention.
Fig. 7 is an explanatory diagram illustrating a state of the photomask in a state where the temperature of the stone surface plate is controlled by the inspection device according to the first embodiment of the present invention.
Fig. 8-1 is an explanatory view schematically showing a state in which deformation due to temperature distribution occurs in the stone surface plate in the examination device according to the second embodiment of the present invention.
Fig. 8-2 is an explanatory diagram illustrating a state of the stone surface plate when the temperature is controlled by the temperature adjustment device in the examination device according to the second embodiment of the present invention.
Fig. 9-1 is an explanatory view schematically showing a state in which deformation due to temperature distribution occurs in the stone surface plate in the examination device according to the third embodiment of the present invention.
Fig. 9-2 is an explanatory diagram illustrating a state of the stone surface plate when the temperature is controlled by the temperature adjustment device in the examination device according to the third embodiment of the present invention.
Fig. 10 is a sectional view of a first lower temperature-regulating panel used in a test device and a temperature-adjusting device according to a fourth embodiment of the present invention.
Fig. 11 is a plan illustrative view of a lower temperature-regulating panel used in the inspection device and the temperature-regulating device according to the fifth embodiment of the present invention.
Fig. 12 is a cross-sectional view XII-XII of fig. 11.
Fig. 13 is a schematic configuration diagram of a temperature control device according to a sixth embodiment of the present invention.
Fig. 14 is an explanatory diagram showing a state in which a pitch bending around an axis of a horizontal axis that perpendicularly intersects the stroke direction is generated in the stone stage and the pattern of the photomask is deformed.
Detailed Description
Hereinafter, a temperature adjustment device and a detection device for a stone surface plate according to an embodiment of the present invention will be described in detail with reference to the drawings. However, it should be noted that the drawings are schematic drawings, and the size, the ratio of the size, the shape, the degree of deformation, and the like of each member are different from those in the actual case. The drawings also include portions having different numbers, dimensional relationships, ratios, or shapes of the respective members.
[ first embodiment ]
Fig. 1 shows a examination device 1 including a temperature adjustment device for a stone surface platform according to a first embodiment of the present invention. The inspection device 1 of the present embodiment is used for inspecting a pattern arrangement of a photomask M as an inspection panel shown in fig. 1. This inspection device 1 can detect position data of a mask pattern formed on the mask surface of the photomask M, and can detect defects in the mask pattern of the photomask M, correct the mask pattern, and the like by comparing the position data with design data.
[ schematic configuration of examination device ]
As shown in fig. 1, the inspection device 1 according to the present embodiment is disposed on a floor surface F. The inspection device 1 includes a stone surface plate 2 serving as a stage that serves as a base of the device, a mask support portion 3 serving as a panel support portion, a plurality of (six in the present embodiment as shown in fig. 3) vibration dampers 4, 5, 6, 7, 8, and 9 that support the stone surface plate 2, an imaging unit 10, and a temperature adjustment device 11.
(Stone platform)
The stone platform 2 is made of granite (granite), for example. As shown in fig. 1 and 2, the stone surface plate 2 has a substantially rectangular parallelepiped shape, and has an upper surface 21, a lower surface 22, side surfaces 23 and 24 on both sides, and side surfaces 25 and 26 on both ends in the longitudinal direction. The stone surface plate 2 has a substantially rectangular parallelepiped shape having a width of, for example, about 1,200mm, a length of about 4, 500mm, and a thickness of about 400 mm. The size of the stone surface plate 2 is appropriately changed according to the size of the photomask M to be processed.
As shown in fig. 2, a guide groove 2A extending in the longitudinal direction is formed in the center of the upper surface 21 in the width direction W of the upper surface 21 of the stone surface plate 2. Recesses 2B are formed at four corners of the lower surface 22 of the stone surface plate 2. Further, recesses 2C are formed on both sides in the width direction W at the center in the longitudinal direction of the lower surface of the stone surface plate 2.
The six vibration damping tables 4, 5, 6, 7, 8, and 9 are provided on the installation floor surface F so as to correspond to the recesses 2B and 2C of the stone surface plate 2. The stone surface plate 2 is disposed so that the bottom surfaces of the recesses 2B and 2C (the top surfaces of the spaces in the recesses) abut on the upper surfaces 4A, 5A, 6A, 7A, 8A, and 9A of the corresponding vibration absorbing tables 4, 5, 6, 7, 8, and 9, respectively. As shown in fig. 1, in a state where the stone surface plate 2 is supported by the vibration damping tables 4, 5, 6, 7, 8, 9, a gap C having a predetermined height dimension is formed between the lower surface 22 of the stone surface plate 2 and the installation floor surface F.
(mask support)
As shown in fig. 1, a mask support portion 3 that is movable in a stroke direction S of the stone surface plate 2 (a longitudinal direction of the stone surface plate 2) is provided in the guide groove 2A of the stone surface plate 2. The mask support portion 3 includes a support frame 3A that supports an edge portion of the photomask M.
(vibration damping table)
In the present embodiment, the vibration absorbing tables 4, 6, 7, and 9 corresponding to the concave portion 2B of the stone surface plate 2 are active vibration absorbing tables, and the vibration absorbing tables 5 and 8 corresponding to the concave portion 2C of the stone surface plate 2 are passive vibration absorbing tables. In the present invention, the structure of the vibration damping table is not limited to this.
(imaging part)
As shown in fig. 1, the imaging unit 10 includes a vertical guide support 10A and a examination camera 10B. The examination camera 10B is provided to be movable in the vertical direction along the vertical guide support 10A. The upper and lower guide pillars are provided on the upper surface 21 of the stone platform 2. The test camera 10B is set to move up and down by a control device and a drive device, not shown.
[ Structure of temperature adjusting device ]
As shown in fig. 4, the temperature control device 11 includes a first upper surface side temperature sensor 31, a second upper surface side temperature sensor 32, a third upper surface side temperature sensor 33, a fourth upper surface side temperature sensor 34, a first lower surface temperature control panel 12, a second lower surface temperature control panel 13, a third lower surface temperature control panel 14, a fourth lower surface temperature control panel 15, a first panel side temperature sensor 41, a second panel side temperature sensor 42, a third panel side temperature sensor 43, a fourth panel side temperature sensor 44, water temperature control heaters 17, 18, 19, 20, a temperature control pipe 37 as a temperature control unit, a temperature control unit 16 for controlling the temperature of the lower surface temperature control panel, and a curtain 50 (see fig. 2) as a partition wall.
(Upper surface side temperature sensor)
In the present embodiment, as shown in fig. 4, the first upper surface side temperature sensor 31, the second upper surface side temperature sensor 32, the third upper surface side temperature sensor 33, and the fourth upper surface side temperature sensor 34 are provided in this order with respect to the regions a1, a2, A3, and a4 that divide the upper surface 21 of the stone surface plate 2 into four in the longitudinal direction. The first upper surface side temperature sensor 31, the second upper surface side temperature sensor 32, the third upper surface side temperature sensor 33, and the fourth upper surface side temperature sensor 34 are connected to the temperature control unit 16, and temperature detection values in the respective regions a1, a2, A3, and a4 are output to the temperature control unit 16.
(lower surface temperature adjustment panel)
The first lower surface temperature control panel 12, the second lower surface temperature control panel 13, the third lower surface temperature control panel 14, and the fourth lower surface temperature control panel 15 are disposed on the installation floor surface F below the stone surface plate 2 so as to correspond to the four regions a1, a2, A3, and a4 (see fig. 4) of the stone surface plate 2 in the vertical direction in this order.
As shown in fig. 5, the first lower surface temperature control panel 12 is formed by laminating an insulating panel 35 and a heat radiating panel 36. Although fig. 5 shows only the first lower temperature control panel 12, the second lower temperature control panel 13, the third lower temperature control panel 14, and the fourth lower temperature control panel 15 have the same configuration and are composed of the heat insulating panel 35 and the heat radiating panel 36.
The heat insulating panel 35 is made of a resin sheet having a self-contained foamed structure with high heat insulating properties. As shown in fig. 1, the heat insulation panel 35 is disposed in contact with the installation floor surface F. In particular, since the heat insulating panel 35 has an independent foamed structure, the heat insulating effect is higher than that of a heat insulating material having a continuous foamed structure. However, in the present invention, another heat insulating member capable of suppressing the conduction of heat from the installation floor surface F side may be applied.
The heat radiation panel 36 is formed of a metal plate having high thermal conductivity. In the present embodiment, the heat radiation panel 36 is constituted by an aluminum plate. As shown in fig. 5, the heat radiation panel 36 is laminated on the heat insulation panel 35. A temperature adjustment pipe 37, which is a pipe as a temperature adjustment unit, is embedded in the surface of the heat radiation panel 36. Therefore, the heat radiation panel 36 is temperature-controlled by heat supply or heat absorption by the temperature adjustment pipe 37, and radiates heat of the controlled temperature to the lower surface 22 of the stone surface plate 2.
(temperature adjustment section)
As shown in fig. 2, 3, and 5, the temperature adjustment pipe 37 is integrally formed such that a pair of refrigerant flow paths 37A and 37B are parallel to each other. In the present embodiment, in order to improve the temperature uniformity in the temperature adjustment pipe 37, water at the same temperature is set to flow in opposite directions in the refrigerant flow paths 37A and 37B.
In the present embodiment, the temperature adjustment pipe 37 is made of, for example, a fluororesin. By forming the temperature control pipe 23 with a fluororesin, the pressure resistance can be improved, and the effect of preventing water leakage can be improved. As shown in fig. 2 and 3, the temperature adjustment pipe 37 is laid in a meandering manner in relation to the heat radiation panels 36 of the first, second, third, and fourth lower temperature control panels 12, 13, 14, and 15. The arrangement density of the temperature adjustment pipes 37 with respect to the heat radiation panel 36 is preferably uniform, and may be determined in consideration of the heat distribution due to heat transfer or the like caused by the arrangement state of the vibration damping stages 4, 5, 6, 7, 8, 9.
As shown in fig. 4, the temperature adjusting pipes 37 provided in the first, second, third, and fourth lower temperature control panels 12, 13, 14, and 15 are supplied with water having adjusted water temperature from the water temperature adjusting heaters 17, 18, 19, and 20 in sequence. In the present embodiment, since one temperature adjustment pipe 37 has the refrigerant flow paths 37A and 37B, the water temperature adjusted water is set to be supplied from the water temperature adjustment heaters 17, 18, 19, and 20 to the two refrigerant flow paths 37A and 37B, respectively.
(Panel side temperature sensor)
A first panel side temperature sensor 41, a second panel side temperature sensor 42, a third panel side temperature sensor 43, and a fourth panel side temperature sensor 44 are disposed in this order on the upper surface of each of the first, second, third, and fourth lower temperature control panels 12, 13, 14, and 15. It is preferable that the first panel side temperature sensor 41, the second panel side temperature sensor 42, the third panel side temperature sensor 43, and the fourth panel side temperature sensor 44 be disposed in this order at positions on the stone platform 2 corresponding to the first upper surface side temperature sensor 31, the second upper surface side temperature sensor 32, the third upper surface side temperature sensor 33, and the fourth upper surface side temperature sensor 34 in the vertical direction.
The first panel side temperature sensor 41, the second panel side temperature sensor 42, the third panel side temperature sensor 43, and the fourth panel side temperature sensor 44 are connected to the temperature controller 16. The detected values of the temperatures of the upper surfaces of the first lower temperature control panel 12, the second lower temperature control panel 13, the third lower temperature control panel 14, and the fourth lower temperature control panel 15 detected by the first panel side temperature sensor 41, the second panel side temperature sensor 42, the third panel side temperature sensor 43, and the fourth panel side temperature sensor 44 are output to the temperature control unit 16.
(Water temperature adjusting Heater)
As shown in fig. 4, the water temperature adjusting heaters 17, 18, 19, and 20 perform an operation of raising the temperature of the water supplied at the reference temperature (T) to predetermined control temperatures (T + a), (T + B), (T + C), and (T + D) based on the control signal from the temperature control unit 16. Here, the reference temperature (T) is set to a constant temperature that is always lower than the temperature of the upper surface 21 of the stone surface plate 2 in the environment in which the inspection device 1 is operated.
(temperature control section)
As shown in fig. 4, the temperature controller 16 is connected to the first upper surface side temperature sensor 31, the second upper surface side temperature sensor 32, the third upper surface side temperature sensor 33, and the fourth upper surface side temperature sensor 34 on the upper surface 21 side of the stone table 2, and the first panel side temperature sensor 41, the second panel side temperature sensor 42, the third panel side temperature sensor 43, and the fourth panel side temperature sensor 44 on the lower surface temperature control panel side. The temperature control unit 16 is connected to water temperature adjusting heaters 17, 18, 19, and 20.
The temperature control unit 16 is configured as a device having an arithmetic device and a storage unit, such as a personal computer. The temperature control unit 16 controls the water temperature adjusting heaters 17, 18, 19, and 20 by determining the degree of heating by the water temperature adjusting heaters 17, 18, 19, and 20 to which the reference temperature (T) is added so that the difference between the upper surface side temperature and the lower surface side temperature of the stone surface plate 2 becomes a preset temperature. The difference between the upper surface side temperature and the lower surface side temperature (upper surface side temperature — lower surface side temperature) may be set to, for example, about 0.2 ℃. The difference between the upper surface side temperature and the lower surface side temperature may be determined according to the characteristics of each stone surface plate 2.
By controlling the water temperature adjusting heaters 17, 18, 19, and 20 in this way, the temperature of the water flowing through the temperature adjusting pipes 37 provided in the first, second, third, and fourth lower temperature adjusting panels 12, 13, 14, and 15 can be changed. Therefore, the heat radiation panels 36 of the respective lower surface temperature control panels are individually temperature-controlled.
(dividing wall)
As shown in fig. 2, in the present embodiment, a curtain 50 as a partition wall is disposed along the periphery of each of the first, second, and third lower temperature control panels 12, 13, and 14. In the present embodiment, for example, an antistatic vinyl chloride sheet or the like is used as the curtain 50. Note that the curtain 50 is used for the purpose of blocking the gap between the stone surface 2 and the floor surface F. The curtain 50 partitions a space (gap C) above each of the first, second, and third lower temperature control panels 12, 13, and 14. Therefore, the curtain 50 can prevent convection of air between the lower surface temperature control panels. Therefore, the curtain 50 functions to prevent the temperature of the respective lower surface temperature control panels from being affected by the temperature of the adjacent panels.
(action and action)
In the examination device 1 and the temperature adjustment device 11 of the present embodiment, the temperature control unit 16 detects the temperature of each of the regions a1, a2, A3, and a4 of the upper surface 21 of the stone table 2 and the temperature of each of the lower surface temperature control panels below the stone table 2 corresponding to the regions a1, a2, A3, and a4, and controls the temperature of the water temperature adjustment heaters 17, 18, 19, and 20.
Therefore, in the present embodiment, the temperature difference between the temperature on the upper surface 21 side and the temperature on the lower side of each of the regions a1, a2, A3, a4 of the stone surface plate 2 can be maintained at the set temperature difference, and therefore, the deformation of the stone surface plate 2 can be suppressed. Fig. 6-1 schematically shows a state in which the stone surface plate 2 has a plurality of points in which the vertical temperature difference changes due to the installation environment and pitching occurs. In the present embodiment, by performing the above-described temperature control, as shown in fig. 6-2, the deformation of the stone surface plate 2 can be suppressed. Therefore, as shown in fig. 7, the photomask M placed on the stone surface plate 2 can be prevented from being deformed, and a test error caused by the deformation of the mask pattern Mp of the photomask M can be prevented.
Since the temperature control device 11 of the present embodiment performs the above-described operation and action, the deformation of the stone surface plate 2 can be suppressed regardless of the installation place, and particularly, the planar accuracy of the upper surface 21 can be easily maintained. Therefore, in the inspection device 1 including the temperature adjustment device 11, the accuracy of inspection of the photomask M can be improved.
As the installation environment of the examination device 1, there are a hot chamber in which temperature control is performed, a clean room in which temperature management of the upper surface 21 of the stone surface plate 2 is not performed only by causing clean air to move downward, and the like. According to the inspection device 1 and the temperature adjustment device 11 of the present embodiment, the influence of the temperature on the installation floor surface F side can be suppressed in any of the installation environments described above. In the present embodiment, even in summer when the temperature is high or in winter when the temperature is low, the stone surface plate 2 can be prevented from deforming.
In the inspection device 1 and the temperature adjustment device 11 according to the present embodiment, the temperature control on the lower surface 22 side of the stone table 2 is performed only so that the temperature having a certain difference from the temperature of the upper surface of the stone table 2 becomes a target value, and therefore the control flow as a whole becomes open-loop control, and the stability of the control system can be easily ensured.
In the inspection device 1 and the temperature adjustment device 11 of the present embodiment, the complex curvature of the stone surface plate 2 can be corrected by adjusting the temperature of the first lower surface temperature adjustment panel 12, the second lower surface temperature adjustment panel 13, the third lower surface temperature adjustment panel 14, and the fourth lower surface temperature adjustment panel 15 corresponding to the four-divided regions a1, a2, A3, and a4, respectively.
In the inspection device 1 and the temperature adjustment device 11 of the present embodiment, the temperature of the lower surface 22 of the stone bed 2 is controlled by the heat radiation from the heat radiation panels 36 of the first, second, third, and fourth lower surface temperature control panels 12, 13, 14, and 15, and therefore, stress due to direct heating is not applied to the stone bed 2.
[ second embodiment ]
Fig. 8-1 and 8-2 schematically illustrate the stone surface plate 2 and the lower surface temperature adjustment panel used in the examination device 1 and the temperature adjustment device 11 according to the second embodiment of the present invention. In the present embodiment, the first upper surface side temperature sensor 31, the second upper surface side temperature sensor 32, and the third upper surface side temperature sensor 33 are provided in the regions a1, a2, and A3 that divide the stone surface plate 2 into three in the longitudinal direction. Correspondingly, the first, second, and third lower temperature control panels 12, 13, and 14 are provided as the lower temperature control panels. The other configurations in the present embodiment are substantially the same as those in the first embodiment described above.
In the present embodiment, a flat upper surface shape can be ensured as shown in fig. 8-2 while suppressing a plurality of deformations of the stone surface plate 2 shown in fig. 8-1.
[ third embodiment ]
Fig. 9-1 and 9-2 schematically illustrate the stone bed 2 and the lower surface temperature adjustment panel used in the inspection device 1 and the temperature adjustment device 11 according to the third embodiment of the present invention. In the present embodiment, the first upper surface side temperature sensor 31 and the second upper surface side temperature sensor 32 are provided in the regions a1 and a2 that divide the stone surface plate 2 into two in the longitudinal direction. Correspondingly, a first lower surface temperature control panel 12 and a second lower surface temperature control panel 13 are provided as the lower surface temperature control panels. The other configurations in the present embodiment are substantially the same as those in the first embodiment described above.
In the present embodiment, the deformation of the stone surface plate 2 shown in fig. 9-1 can be suppressed, and a flat upper surface shape can be secured as shown in fig. 9-2.
[ fourth embodiment ]
Fig. 10 illustrates a first lower temperature-regulating panel 12A used in the test device 1 and the temperature adjustment device 11 according to the fourth embodiment of the present invention. In this embodiment, the heat radiation panel 36 of the first lower temperature control panel 12 of the first embodiment is laminated on the heat insulation panel 35 by reversing the front and back. Therefore, the temperature adjustment pipe 37 is located near the interface of the heat insulation panel 35 and the heat radiation panel 36. The other configurations of the present embodiment are the same as those of the first embodiment described above.
In the present embodiment, the temperature adjustment pipe 37 is disposed below the heat radiation panel 36, so that when the heat transferred from the temperature adjustment pipe 37 is transferred to the upper surface of the heat radiation panel 36, the uniformity of the temperature can be further improved on the upper surface.
[ fifth embodiment ]
Fig. 11 and 12 show a lower surface temperature control panel 60 according to a fifth embodiment of the present invention. As shown in fig. 12, the structure of the lower surface temperature control panel 60 in which the heat insulating panel 35 and the heat radiating panel 36 are laminated is the same as that of the first embodiment. In the present embodiment, the temperature adjustment pipe 38 as a temperature adjustment portion embedded in the surface of the heat radiation panel 36 is a pipe having one flow path. The other configurations of the present embodiment are the same as those of the first embodiment described above.
[ sixth embodiment ]
Fig. 13 shows a schematic configuration of a temperature control device 11A according to a sixth embodiment of the present invention. In the present embodiment, the water returned from each temperature adjustment pipe 37 to the water supplied to the water temperature adjustment heaters 17, 18, 19, and 20 is lowered to an appropriate temperature, stored in the tank 71, and recycled. In the present embodiment, the first panel side temperature sensor 41, the second panel side temperature sensor 42, the third panel side temperature sensor 43, and the fourth panel side temperature sensor 44 are disposed on the lower surface of the stone surface plate 2. Since other configurations of the present embodiment are substantially the same as those of the first embodiment described above, the description will be given by appropriately using the drawings corresponding to the first embodiment.
The temperature adjustment device 11A of the present embodiment will be described below with reference to fig. 1 to 4 and 13. The temperature control device 11A includes a first upper surface side temperature sensor 31, a second upper surface side temperature sensor 32, a third upper surface side temperature sensor 33, a fourth upper surface side temperature sensor 34, a first panel side temperature sensor 41, a second panel side temperature sensor 42, a third panel side temperature sensor 43, a fourth panel side temperature sensor 44, water temperature adjusting heaters 17, 18, 19, 20, a temperature adjusting pipe 37 as a temperature adjusting portion, a first lower surface temperature adjusting panel 12, a second lower surface temperature adjusting panel 13, a third lower surface temperature adjusting panel 14, a fourth lower surface temperature adjusting panel 15 each including the temperature adjusting pipe 37, a temperature control portion 16 for controlling the temperature of each temperature adjusting pipe 37, a tank 71, a heat exchanger 72, and a three-way valve 73.
The temperature adjustment pipe 37 is integrally formed by a pair of refrigerant flow paths 37A and 37B in parallel with each other (see fig. 2 and 3). The temperature adjustment pipe 37 is set so that water at the same temperature flows in the refrigerant flow paths 37A and 37B in opposite directions to each other.
As shown in fig. 13, the water temperature adjusted by the water temperature adjusting heaters 17, 18, 19, and 20 is supplied to the temperature adjusting pipes 37. In the present embodiment, since one temperature adjustment pipe 37 has a pair of refrigerant flow paths 37A and 37B, water having adjusted water temperatures is supplied from the water temperature adjustment heaters 17, 18, 19, and 20 to the two refrigerant flow paths 37A and 37B, respectively.
Specifically, the pipe 81 is connected to the downstream side of the water temperature adjusting heater 17. The downstream end of the pipe 81 branches into two pipes 81A and 81B. The pipe 81A is connected to the refrigerant flow path 37A (see fig. 2 and 3) provided in the corresponding first lower temperature control panel 12. The pipe 81B is connected to the refrigerant passage 37B so that the flow of water in the refrigerant passage 37B is in the opposite direction to the flow of water in the refrigerant passage 37A.
A pipe 82 is connected to the downstream side of the water temperature adjusting heater 18. The downstream end of the pipe 82 branches into two pipes 82A and 82B. The pipe 82A is connected to the refrigerant flow path 37A (see fig. 2 and 3) provided in the corresponding second lower temperature control panel 13. The pipe 82B is connected to the refrigerant flow path 37B so that the flow of water in the refrigerant flow path 37B is in the opposite direction to the flow of water in the refrigerant flow path 37A.
A pipe 83 is connected to the downstream side of the water temperature adjusting heater 19. The downstream end of the pipe 83 branches into two pipes 83A and 83B. The pipe 83A is connected to the refrigerant flow path 37A (see fig. 2 and 3) provided in the corresponding third lower temperature control panel 14. The pipe 83B is connected to the refrigerant flow path 37B so that the flow of water in the refrigerant flow path 37B is in the opposite direction to the flow of water in the refrigerant flow path 37A.
A pipe 84 is connected to the downstream side of the water temperature adjusting heater 20. The downstream end of the pipe 84 branches into two pipes 84A and 84B. The pipe 84A is connected to the refrigerant flow path 37A (see fig. 2 and 3) provided in the corresponding fourth lower temperature control panel 15. The pipe 84B is connected to the refrigerant flow path 37B so that the flow of water in the refrigerant flow path 37B is in the opposite direction to the flow of water in the refrigerant flow path 37A.
As shown in fig. 13, the downstream ends of the pair of refrigerant flow paths 37A and 37B provided in the temperature adjustment pipe 37 of the first lower temperature control panel 12 shown in fig. 3 are connected to the pipes 85A and 85B in this order. The downstream ends of these pipes 85A and 85B are connected to and joined to the pipe 85.
As shown in fig. 13, the downstream ends of the pair of refrigerant flow paths 37A and 37B in the temperature adjustment pipe 37 provided in the second lower temperature adjustment panel 13 are connected to pipes 86A and 86B in this order. The downstream ends of these pipes 86A and 86B are connected to and joined to the pipe 86.
As shown in fig. 13, the downstream ends of the pair of refrigerant flow paths 37A and 37B in the temperature adjustment pipe 37 provided in the third lower temperature adjustment panel 14 are connected to pipes 87A and 87B in this order. The downstream ends of the pipes 87A and 87B are connected to and joined to the pipe 87.
As shown in fig. 13, the downstream ends of the pair of refrigerant flow paths 37A and 37B in the temperature adjustment pipe 37 provided in the fourth lower temperature adjustment panel 15 are connected to pipes 88A and 88B in this order. The downstream ends of the pipes 88A and 88B are connected to and joined with the upstream end of the pipe 89. The downstream end of the pipe 89 is connected to the heat exchanger 72.
The pipes 85, 86, 87, 88 are connected to and joined with a pipe 89. The pipe 89 is connected to the heat exchanger 72. The water supplied from the pipe 89 and heat-exchanged by the heat exchanger 72 is supplied to the tank 71 through the pipe 89A. The pipe 89A is provided with a temperature sensor 92.
A circulating water supply pipe 93 is connected to the tank 71. The circulating water supply pipe 93 is provided with a circulating pump 94 and a pressure gauge 96. The tank 71 is provided with a tank level gauge 95. A pipe 97 connected to the water temperature adjusting heater 17, a pipe 98 connected to the water temperature adjusting heater 18, a pipe 99 connected to the water temperature adjusting heater 19, and a pipe 100 connected to the water temperature adjusting heater 20 are connected to the downstream end of the circulating water supply pipe 93.
As shown in fig. 13, a pipe 90 for supplying cooling water is connected to the heat exchanger 72. The water supplied from the pipe 90 and heat-exchanged by the heat exchanger 72 is guided to the cooling water outlet via the pipe 90A. The three-way valve 73 is interposed in the pipe 90. The three-way valve 73 is connected to a bypass pipe 91 connected to the pipe 90A.
In the present embodiment, cooling water such as tap water having a low temperature (for example, a temperature of about 10 ℃) is supplied from the pipe 90, and control is performed to lower the circulating water supplied from the pipe 89 to the reference temperature (T) in the heat exchanger 72.
As shown in fig. 13, the temperature controller 16 is connected to a first upper surface side temperature sensor 31, a second upper surface side temperature sensor 32, a third upper surface side temperature sensor 33, a fourth upper surface side temperature sensor 34, a first panel side temperature sensor 41, a second panel side temperature sensor 42, a third panel side temperature sensor 43, and a fourth panel side temperature sensor 44 on the lower surface 22 side of the stone surface plate 2. The temperature controller 16 is connected to the water temperature adjusting heaters 17, 18, 19, and 20, the three-way valve 73, and the temperature sensor 92.
The temperature control unit 16 controls the water temperature adjusting heaters 17, 18, 19, and 20 by determining the degree of heating by the water temperature adjusting heaters 17, 18, 19, and 20 to which the reference temperature (T) is added so that the difference between the upper surface side temperature and the lower surface side temperature of the stone surface plate 2 becomes a preset temperature. The difference between the upper surface side temperature and the lower surface side temperature (upper surface side temperature — lower surface side temperature) can be set to, for example, about 0.2 ℃. The difference between the upper surface side temperature and the lower surface side temperature may be determined according to the characteristics of each stone surface plate 2. In the present embodiment, the first panel side temperature sensor 41, the second panel side temperature sensor 42, the third panel side temperature sensor 43, and the fourth panel side temperature sensor 44 are disposed on the lower surface 22 of the stone surface plate 2, but may be disposed on the surfaces of the first lower surface temperature control panel 12, the second lower surface temperature control panel 13, the third lower surface temperature control panel 14, and the fourth lower surface temperature control panel 15 as in the first embodiment. In short, the temperature difference between the upper surface 21 side and the lower surface 22 side may be set in each region of the stone surface plate 2.
By controlling the water temperature adjusting heaters 17, 18, 19, and 20 in this way, the temperature of the water flowing through the temperature adjusting pipes 37 provided in the first, second, third, and fourth lower temperature adjusting panels 12, 13, 14, and 15 can be changed. Therefore, the heat radiation panels 36 of the respective lower surface temperature control panels are temperature-controlled.
As shown in fig. 13, the water temperature adjusting heaters 17, 18, 19, and 20 perform an operation of raising the temperature of the water supplied at the reference temperature (T) to predetermined control temperatures (T + a), (T + B), (T + C), and (T + D) based on the control signal from the temperature control unit 16. Here, the reference temperature (T) is set to a constant temperature which is always lower than the temperature of the upper surface 21 of the stone surface plate 2 in the environment in which the apparatus is operated. In the present embodiment, the reference temperature (T) is set to, for example, 20 ℃. That is, in the present embodiment, the reference temperature (T) of the water stored in the tank 71 is set to 20 ℃.
In the present embodiment, cooling water of, for example, 11 ℃ is supplied to the pipe 90. The water heated to a temperature higher than 20 ℃ (T + a), (T + B), (T + C), (T + D), etc. is supplied to the heat exchanger 72 through the pipe 89. Specifically, the temperature of the water supplied to the heat exchanger 72 through the pipe 89 is, for example, about 23 ℃.
The temperature control unit 16 controls the three-way valve 73 based on the temperature detected by the temperature sensor 92 to flow the cooling water to the bypass pipe 91, to flow the cooling water to the heat exchanger 72, or to control the flow rate of the cooling water. Thus, in the heat exchanger 72, the temperature of the water supplied from the pipe 89 can be reduced from 23 ℃ to 20 ℃ by the cooling water having the water temperature of 11 ℃, and the temperature of the water stored in the tank 71 can be set to 20 ℃. Thus, in the present embodiment, it is not necessary to raise the temperature of the low-temperature (11 ℃) cooling water to 20 ℃, and therefore, large electric power is not consumed.
It should be noted that the first upper surface temperature sensor 31 and the first panel side temperature sensor 41, the second upper surface temperature sensor 32 and the second panel side temperature sensor 42, the third upper surface temperature sensor 33 and the third panel side temperature sensor 43, and the fourth upper surface temperature sensor 34 and the fourth panel side temperature sensor 44 may be configured as thermocouples, respectively.
In the present embodiment, it is not necessary to raise the temperature of a refrigerant such as tap water at about 11 ℃ to a temperature of 20 ℃ or higher, for example, and power consumption can be greatly suppressed. That is, in the present embodiment, since the temperature difference from the reference temperature (T) to the control temperatures (T + a), (T + B), (T + C), and (T + D) can be reduced, the power consumption can be significantly suppressed. In the present embodiment, the reference temperature (T) is set to be slightly lower than the lowest control temperature of the first, second, third, and fourth lower temperature control panels 12, 13, 14, and 15, whereby the amount of cooling water used can be significantly reduced.
In the present embodiment, water is used as the refrigerant circulating through the water temperature adjusting heaters 17, 18, 19, and 20, the temperature adjusting pipe 37, the heat exchanger 72, and the tank 71, but the present invention is not limited thereto. In the present embodiment, since the water is circulated to the tank 71, even if water leakage occurs, water leakage greater than or equal to the capacity of the tank 71 does not occur. In addition, the present embodiment has an advantage that water leakage can be detected from a drop in the amount of water in the tank. On the other hand, in the case of the configuration (comparative example) in which the cooling water (primary cooling water) such as tap water is directly heated by the water temperature adjusting heaters 17, 18, 19, and 20 without circulating water to the tank, it is difficult to dispose the water leakage sensors on the first lower surface temperature adjusting panel 12, the second lower surface temperature adjusting panel 13, the third lower surface temperature adjusting panel 14, the fourth lower surface temperature adjusting panel 15, and the like. Therefore, in this comparative example, when water leakage occurs, the amount of water leakage may become large. Therefore, by configuring to circulate to the tank 71 as in the present embodiment, occurrence of water leakage can be greatly suppressed.
[ other embodiments ]
Although the first to sixth embodiments have been described above, the description and drawings constituting a part of the disclosure of these embodiments should not be construed as limiting the present invention. Various alternative embodiments, examples, and techniques of use will be apparent to those skilled in the art in light of this disclosure.
For example, although the photomask M is applied as the test panel in the above-described embodiment, a blank serving as a master of the photomask on which an electronic circuit is formed may be applied.
In the above embodiment, the heat insulating panel 35 and the heat radiating panel 36 are laminated and integrated, but the heat radiating panel 36 may be laminated on the heat insulating panel 35. It is to be noted that the heat insulating panel 35 may be a panel having a size and shape over the entire occupied area where the stone surface plate 2 is disposed, and a plurality of heat radiating panels 36 may be continuously disposed thereon along the longitudinal direction.
In the above embodiment, the photomask M is moved in the stroke direction S on the stone surface plate 2, but the photomask M may be fixed on the stone surface plate 2 and the imaging unit 10 may be moved in the stroke direction S.
In the inspection device 1 of the above-described embodiment, the light mask M is inspected in a vertical state, but an inspection panel such as the light mask M may be horizontally inspected, that is, in a horizontal state.
Description of the symbols:
a1, a2, A3, a 4: an area; c: a gap; f: setting a floor surface; m: a photomask (inspection panel); s: a direction of travel; 1: a test device; 2: a stone platform; 2A: a guide groove; 2B: a recess (for an active damping table); 2C: a recess (for passive damping mount); 4. 5, 6, 7, 8, 9: a vibration damping table; 10B: a test camera; 11. 11A: a temperature adjusting device; 12. 12A: a first lower surface temperature adjustment panel; 13: a second lower surface temperature adjustment panel; 14: a third lower surface temperature adjustment panel; 15: a fourth lower surface temperature adjustment panel; 16: a temperature control unit; 17. 18, 19, 20: a water temperature adjusting heater; 21: an upper surface; 22: a lower surface; 23: a side surface (a side surface on one end side in the width direction W of the stone surface plate); 24: a side surface (a side surface on the other end side in the width direction W of the stone surface plate); 25: a side surface (a side surface on one end side in the stroke direction S of the stone surface plate); 26: a side surface (a side surface on the other end side in the stroke direction S of the stone surface plate); 31: a first upper surface side temperature sensor; 32: a second upper surface side temperature sensor; 33: a third upper surface side temperature sensor; 34: a fourth upper surface side temperature sensor; 35: an insulating panel; 36: a heat radiation panel; 37. 38: a temperature adjustment tube (temperature adjustment unit); 37A, 37B: a refrigerant flow path; 41: a first panel side temperature sensor; 42: a second panel-side temperature sensor; 43: a third panel side temperature sensor; 44: a fourth panel side temperature sensor; 50: curtains (dividing walls); 60: a lower surface temperature adjusting panel; 71: and (4) canning: 72: a heat exchanger; 73: and a three-way valve.
Claims (10)
1. A temperature adjustment device for a stone surface plate, which is disposed with a gap from a floor surface, comprising:
a lower surface temperature adjustment panel disposed on the installation floor surface so as to face a lower surface of the stone surface; and
a temperature control unit for controlling the temperature of the lower surface temperature adjustment panel,
the lower surface temperature adjustment panel includes:
an insulating panel disposed on the installation floor surface; and
a heat radiation panel which is disposed on the heat insulation panel, is provided with a temperature adjustment portion, and supplies or absorbs heat through the temperature adjustment portion,
the temperature control unit controls the temperature of the heat radiation panel so that a temperature difference between the upper surface of the stone surface plate and the surface of the heat radiation panel becomes a set value.
2. The temperature adjustment device of a stone platform of claim 1,
and dividing an occupied area of the stone platform on the floor surface into a plurality of divided areas along the length direction of the stone platform, wherein the lower surface temperature adjusting panel is configured in each divided area.
3. Temperature adjustment device of a stone platform according to claim 1 or 2,
A panel side temperature sensor is arranged on the lower surface temperature adjusting panel,
an upper surface side temperature sensor paired with the panel side temperature sensor is provided on an upper surface of the stone surface plate corresponding to the panel side temperature sensor,
the temperature control unit controls the temperature of the temperature adjustment unit of each lower surface temperature adjustment panel based on temperature detection values of the pair of panel side temperature sensors and the upper surface side temperature sensor corresponding in the vertical direction.
4. The temperature adjustment device of a stone platform of any one of claims 1 to 3,
the periphery of a gap between the lower surface temperature adjustment panel and the lower surface of the stone surface plate is surrounded by a partition wall.
5. The temperature adjustment device of a stone platform of any one of claims 1 to 4,
the insulation panel is constructed of a resin sheet of an individually foamed structure.
6. The temperature adjustment device of a stone platform of any one of claims 1 to 5,
the heat radiation panel is composed of a metal plate.
7. The temperature adjustment device of a stone platform of any one of claims 1 to 6,
the temperature adjusting part is a temperature adjusting pipe for circulating the refrigerant.
8. The temperature adjustment device of a stone platform of claim 7,
the temperature adjustment pipe has a pair of refrigerant flow paths parallel to each other,
the refrigerant is set to flow in opposite directions in each of the pair of refrigerant flow paths.
9. Temperature adjustment device of a stone platform according to claim 7 or 8,
the temperature adjustment device for a stone surface plate is provided with:
a tank configured to supply a refrigerant, which is adjusted to a reference temperature lower than the temperature of the stone surface heated by the lower surface temperature adjustment panel, to the temperature adjustment pipe; and
a heat exchanger for cooling the refrigerant returned through the temperature adjustment pipe with cooling water having a temperature lower than the reference temperature so as to lower the refrigerant returned through the temperature adjustment pipe to the reference temperature,
and supplying the refrigerant cooled by the heat exchanger to the tank.
10. A examination device is provided with:
a temperature adjustment device for a stone platform according to any one of claims 1 to 9;
the stone platform is arranged with a gap with the floor surface and used for carrying the panel to be inspected; and
And a test camera that moves relative to the test panel and that captures a state of a surface of the test panel.
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018071843 | 2018-04-03 | ||
| JP2018-071843 | 2018-04-03 | ||
| JP2018178799A JP7105482B2 (en) | 2018-04-03 | 2018-09-25 | Stone surface plate temperature adjustment device and inspection device equipped with the same |
| JP2018-178799 | 2018-09-25 | ||
| PCT/JP2019/014502 WO2019194139A1 (en) | 2018-04-03 | 2019-04-01 | Temperature adjusting device for stone surface plate, and inspection device provided with same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111868510A true CN111868510A (en) | 2020-10-30 |
Family
ID=68340867
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201980016331.5A Pending CN111868510A (en) | 2018-04-03 | 2019-04-01 | Temperature adjustment device for stone surface plate and examination device provided with same |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP7105482B2 (en) |
| CN (1) | CN111868510A (en) |
| TW (1) | TWI783138B (en) |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10139452A (en) * | 1996-11-08 | 1998-05-26 | Nippon Electric Glass Co Ltd | Molding machine for glass product |
| WO1999041778A1 (en) * | 1998-02-16 | 1999-08-19 | Komatsu Ltd. | Apparatus for controlling temperature of substrate |
| JP2006066687A (en) * | 2004-08-27 | 2006-03-09 | Nikon Corp | Method of regulating temperature, stage device, exposure device and method of manufacturing device |
| CN101076886A (en) * | 2004-12-16 | 2007-11-21 | 芝浦机械电子株式会社 | Thermo-compression bonding tool and thermo-compression bonding device |
| CN101738851A (en) * | 2008-11-04 | 2010-06-16 | Hoya株式会社 | Method of manufacturing photomask, lithography apparatus, method and apparatus for inspecting photomask |
| CN101799631A (en) * | 2009-02-04 | 2010-08-11 | Hoya株式会社 | Worktable cleaner, drawing apparatus and substrate board treatment |
| CN203773225U (en) * | 2014-03-24 | 2014-08-13 | 上海华力微电子有限公司 | Temperature control device |
| CN105225984A (en) * | 2014-06-27 | 2016-01-06 | 东京毅力科创株式会社 | Comprise the temperature-controlled process of the system of the machine table of temperature controllable, semiconductor-fabricating device and machine table |
| JP2017102074A (en) * | 2015-12-04 | 2017-06-08 | 株式会社ブイ・テクノロジー | Inspection device |
| CN107078092A (en) * | 2014-10-30 | 2017-08-18 | 东京毅力科创株式会社 | Substrate-placing platform |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62218837A (en) * | 1986-03-20 | 1987-09-26 | Fujitsu Ltd | Precision optical measuring surface plate |
| JPH09126703A (en) * | 1995-10-31 | 1997-05-16 | Naruko Denki Seisakusho:Kk | Precise constant temperature surface plate |
| JP4352445B2 (en) * | 1998-03-19 | 2009-10-28 | 株式会社ニコン | Planar motor apparatus, stage apparatus, exposure apparatus and manufacturing method thereof, and device and manufacturing method thereof |
| JP4906412B2 (en) * | 2006-06-29 | 2012-03-28 | 株式会社東京精密 | Prober |
| DE102010056039B4 (en) | 2010-12-16 | 2015-01-15 | Carl Zeiss Industrielle Messtechnik Gmbh | Coordinate measuring machine and method for operating a coordinate measuring machine |
| CN107615169B (en) * | 2015-05-28 | 2021-02-23 | 株式会社尼康 | Object holding apparatus, exposure apparatus, method for manufacturing flat panel display, and method for manufacturing device |
| TWI762610B (en) * | 2017-03-31 | 2022-05-01 | 日商尼康股份有限公司 | Object holding device, processing device, manufacturing method of flat panel display, component manufacturing method, and object holding method |
| JP7148250B2 (en) | 2018-03-16 | 2022-10-05 | 芝浦メカトロニクス株式会社 | Substrate mounting stage and mounting device |
-
2018
- 2018-09-25 JP JP2018178799A patent/JP7105482B2/en active Active
-
2019
- 2019-04-01 TW TW108111451A patent/TWI783138B/en active
- 2019-04-01 CN CN201980016331.5A patent/CN111868510A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10139452A (en) * | 1996-11-08 | 1998-05-26 | Nippon Electric Glass Co Ltd | Molding machine for glass product |
| WO1999041778A1 (en) * | 1998-02-16 | 1999-08-19 | Komatsu Ltd. | Apparatus for controlling temperature of substrate |
| JP2006066687A (en) * | 2004-08-27 | 2006-03-09 | Nikon Corp | Method of regulating temperature, stage device, exposure device and method of manufacturing device |
| CN101076886A (en) * | 2004-12-16 | 2007-11-21 | 芝浦机械电子株式会社 | Thermo-compression bonding tool and thermo-compression bonding device |
| CN101738851A (en) * | 2008-11-04 | 2010-06-16 | Hoya株式会社 | Method of manufacturing photomask, lithography apparatus, method and apparatus for inspecting photomask |
| CN101799631A (en) * | 2009-02-04 | 2010-08-11 | Hoya株式会社 | Worktable cleaner, drawing apparatus and substrate board treatment |
| CN203773225U (en) * | 2014-03-24 | 2014-08-13 | 上海华力微电子有限公司 | Temperature control device |
| CN105225984A (en) * | 2014-06-27 | 2016-01-06 | 东京毅力科创株式会社 | Comprise the temperature-controlled process of the system of the machine table of temperature controllable, semiconductor-fabricating device and machine table |
| CN107078092A (en) * | 2014-10-30 | 2017-08-18 | 东京毅力科创株式会社 | Substrate-placing platform |
| JP2017102074A (en) * | 2015-12-04 | 2017-06-08 | 株式会社ブイ・テクノロジー | Inspection device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP7105482B2 (en) | 2022-07-25 |
| JP2019184562A (en) | 2019-10-24 |
| TWI783138B (en) | 2022-11-11 |
| TW201945837A (en) | 2019-12-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6583638B2 (en) | Temperature-controlled semiconductor wafer chuck system | |
| KR101750811B1 (en) | Apparatus for testing reliability of semiconductor component in which air flows efficiently | |
| CN100570488C (en) | Cooler of static chuck of extreme ultraviolet photolithographic mask platform | |
| TWI609173B (en) | Heat flux sensor manufacturing method and heat flow generation device therefor | |
| Verzicco | Sidewall finite-conductivity effects in confined turbulent thermal convection | |
| JP6388041B2 (en) | Heating apparatus and heating method | |
| CN108352343A (en) | Substrate support in Millisecond annealing system | |
| US20150037018A1 (en) | Temperature Control Pin, and The Device and Method For Supporting Substrate In UV Curing Process | |
| JP5535872B2 (en) | Data center or computer system | |
| US6347535B2 (en) | Heating apparatus and method | |
| CN111868510A (en) | Temperature adjustment device for stone surface plate and examination device provided with same | |
| JP2013026561A (en) | Temperature control unit, substrate placement table, substrate processing apparatus, temperature control system, and substrate processing method | |
| WO2019194139A1 (en) | Temperature adjusting device for stone surface plate, and inspection device provided with same | |
| JP2010139124A (en) | Air-circulation type cooling/heating system | |
| JP2016053863A (en) | Temperature regulator | |
| CN109175366A (en) | A kind of protection of optics heating power and cooling system for the sintering of high-temperature laser constituency | |
| JP5135911B2 (en) | Temperature test booth and environment generation method in the temperature test booth | |
| KR20170023339A (en) | Apparatus for testing reliability of semiconductor component having vertical loading direction | |
| JP2013181692A (en) | Heat accumulation apparatus, and air conditioning system | |
| CN113701983A (en) | Device applied to temperature field simulation in environmental wind tunnel | |
| JP7457426B2 (en) | heating device | |
| JP6332493B2 (en) | Cooling system | |
| KR101740653B1 (en) | Apparatus for testing reliability of semiconductor component comprising detachable cooling member | |
| JP6194504B2 (en) | Cooling system | |
| CN107272233A (en) | Alignment device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |