CN111855040A - Pressure sensor, manufacturing method thereof and electronic equipment - Google Patents
Pressure sensor, manufacturing method thereof and electronic equipment Download PDFInfo
- Publication number
- CN111855040A CN111855040A CN202010732219.6A CN202010732219A CN111855040A CN 111855040 A CN111855040 A CN 111855040A CN 202010732219 A CN202010732219 A CN 202010732219A CN 111855040 A CN111855040 A CN 111855040A
- Authority
- CN
- China
- Prior art keywords
- substrate
- pressure sensitive
- sensitive layer
- pressure
- electrode layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/20—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress
- G01L1/22—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/02—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in ohmic resistance, e.g. of potentiometers, electric circuits therefor, e.g. bridges, amplifiers or signal conditioning
- G01L9/04—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in ohmic resistance, e.g. of potentiometers, electric circuits therefor, e.g. bridges, amplifiers or signal conditioning of resistance-strain gauges
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Force Measurement Appropriate To Specific Purposes (AREA)
Abstract
The disclosure relates to a pressure sensor, a manufacturing method thereof and electronic equipment, and belongs to the field of detection. The pressure sensor includes a first substrate, a second substrate, and a pressure sensing structure. The pressure sensing structure comprises a first electrode layer and a first pressure sensitive layer which are sequentially stacked on a first substrate, and a second electrode layer and a second pressure sensitive layer which are sequentially stacked on a second substrate. The first pressure sensitive layer and the second pressure sensitive layer have a gap therebetween. The electrical resistance between the first pressure sensitive layer and the second pressure sensitive layer is inversely related to the contact area of the first pressure sensitive layer and the second pressure sensitive layer. Due to the existence of the first pressure sensitive layer and the second pressure sensitive layer, when the pressure sensors are subjected to different pressures, the contact areas between the first pressure sensitive layer and the second pressure sensitive layer are different, and the resistances of the pressure sensors are different, so that the pressure sensors can output different electric signals, and the sensitivity of the pressure sensors is improved.
Description
Technical Field
The disclosure relates to the field of detection, and in particular, to a pressure sensor, a manufacturing method thereof, and an electronic device.
Background
A pressure sensor is a device that detects pressure and outputs the pressure as an electrical signal.
Sensitivity is an important evaluation index of pressure sensors. The sensitivity of the pressure sensor is a ratio of a variation of the output electrical signal to a variation of the input pressure, and the more sensitive the pressure sensor is to a pressure variation, the higher the sensitivity of the pressure sensor. In the related art, the sensitivity of the pressure sensor is low.
Disclosure of Invention
The embodiment of the disclosure provides a pressure sensor, a manufacturing method thereof and electronic equipment, which can improve the sensitivity of the pressure sensor. The technical scheme is as follows:
in one aspect, the present disclosure provides a pressure sensor comprising:
a first substrate;
a second substrate disposed opposite to the first substrate;
a pressure sensing structure located between the first substrate and the second substrate;
the pressure sensing structure comprises a first electrode layer and a first pressure sensitive layer which are sequentially stacked on the first substrate, and a second electrode layer and a second pressure sensitive layer which are sequentially stacked on the second substrate; the first pressure sensitive layer and the second pressure sensitive layer are provided with gaps, and the resistance between the first pressure sensitive layer and the second pressure sensitive layer is inversely related to the contact area of the first pressure sensitive layer and the second pressure sensitive layer.
In one implementation of the embodiments of the present disclosure, the first pressure-sensitive layer and the second pressure-sensitive layer are both layers of polypyrrole granules.
In one implementation of the disclosed embodiments, the polypyrrole granules have a particle size between 100 nm and 300 nm.
In one implementation of the disclosed embodiment, the first substrate has a first groove, and the second substrate has a second groove disposed opposite to the first groove;
the first electrode layer and the first pressure sensitive layer are located in the first groove, and the second electrode layer and the second pressure sensitive layer are located in the second groove.
In one implementation manner of the embodiment of the present disclosure, the first substrate and the second substrate are attached to each other, the first substrate has a plurality of first grooves, the second substrate has a plurality of second grooves, and the first grooves and the second grooves disposed opposite to each other form a cavity;
the pressure sensor includes a plurality of pressure sensing structures, one of the pressure sensing structures being disposed in one of the cavities.
In one implementation of the disclosed embodiment, the pressure sensor further comprises a saturated mylar film located in at least one of the following positions:
between the first electrode layer and the first substrate, an
The second electrode layer and the second substrate.
In another aspect, the present disclosure provides a method of making a pressure sensor, the method comprising:
sequentially forming a first electrode layer and a first pressure sensitive layer on a first substrate;
sequentially forming a second electrode layer and a second pressure sensitive layer on a second substrate;
the first substrate and the second substrate are arranged oppositely, the first electrode layer, the first pressure sensitive layer, the second electrode layer and the second pressure sensitive layer form a pressure sensing structure located between the first substrate and the second substrate, a gap is formed between the first pressure sensitive layer and the second pressure sensitive layer, and the resistance between the first pressure sensitive layer and the second pressure sensitive layer is in negative correlation with the contact area of the first pressure sensitive layer and the second pressure sensitive layer.
In one implementation manner of the embodiment of the present disclosure, the sequentially forming a first electrode layer and a first pressure sensitive layer on a first substrate includes:
providing a first glass substrate;
attaching double-sided adhesive tapes arranged at intervals to the first glass substrate;
attaching a first electrode on the double-sided adhesive to form a first electrode layer;
forming a first substrate covering the first electrode layer on the first glass substrate, wherein the first substrate is provided with a first groove, and the first electrode layer is positioned in the first groove;
peeling the first glass substrate and the double-sided adhesive tape;
a first pressure sensitive layer is formed on the first electrode layer.
In one implementation of the disclosed embodiment, forming a first pressure sensitive layer on the first electrode layer includes:
preparing polypyrrole granules by a microfluidic technology;
adding the polypyrrole granules into an ethanol solution;
and spraying an ethanol solution dissolved with the polypyrrole granules on the first electrode layer, and forming the first pressure sensitive layer after ethanol is evaporated.
In another aspect, the present disclosure provides an electronic device including the pressure sensor of any one of the above aspects.
The technical scheme provided by the embodiment of the disclosure has the following beneficial effects:
in the embodiments of the present disclosure, the first substrate and the second substrate provide support for the pressure sensor while serving as pressing sites for pressing the pressure sensor. For example, after the first substrate is extruded, the first electrode layer located in the first groove is extruded, and meanwhile, the first electrode layer extrudes the first pressure sensitive layer, so that the first pressure sensitive layer moves towards the second pressure sensitive layer, a gap between the first pressure sensitive layer and the second pressure sensitive layer is reduced until the first pressure sensitive layer contacts the second pressure sensitive layer, the first pressure sensitive layer and the second pressure sensitive layer are both conductive, and further the two electrode layers and the two pressure sensitive layers are conducted, and the electrode layers conduct an electric signal. Because the resistance between the first pressure sensitive layer and the second pressure sensitive layer is in negative correlation with the contact area of the first pressure sensitive layer and the second pressure sensitive layer, when the pressure sensor is subjected to different pressures, the contact areas of the first pressure sensitive layer and the second pressure sensitive layer are different, so that the resistance between the first pressure sensitive layer and the second pressure sensitive layer is changed, and the pressure sensor can transmit different electric signals. Therefore, the pressure sensor can respond to pressure control and output an electric signal to realize the pressure sensing function of the pressure sensor. After the pressure is removed, the first substrate is restored to the original position under the elastic action of the first substrate, so that the first pressure sensitive layer and the second pressure sensitive layer are separated, the electric connection between the first electrode layer and the second electrode layer is disconnected, and the pressure sensor does not transmit electric signals any more. Due to the existence of the first pressure sensitive layer and the second pressure sensitive layer, when the pressure sensors are subjected to different pressures, the contact areas between the first pressure sensitive layer and the second pressure sensitive layer are different, and the resistances of the pressure sensors are different, so that the pressure sensors can output different electric signals, and the sensitivity of the pressure sensors is improved.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present disclosure, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present disclosure, and it is obvious for those skilled in the art to obtain other drawings based on the drawings without creative efforts.
FIG. 1 is a top view of a pressure sensor provided by embodiments of the present disclosure;
FIG. 2 is a schematic cross-sectional view of a pressure sensor provided by an embodiment of the present disclosure;
FIG. 3 is a schematic diagram of a pressure sensor provided by an embodiment of the present disclosure;
FIG. 4 is a schematic diagram of a pressure sensor provided by an embodiment of the present disclosure;
FIG. 5 is a schematic diagram of a pressure sensor provided by an embodiment of the present disclosure;
FIG. 6 is a schematic cross-sectional view of a pressure sensor provided by an embodiment of the present disclosure;
FIG. 7 is a graph of pressure sensor deactivation response time versus current provided by an embodiment of the present disclosure;
FIG. 8 is a graph of the relationship between the pressure experienced by a pressure sensor and the sensitivity of the pressure sensor provided by an embodiment of the present disclosure;
FIG. 9 is a graph of the relationship between the pressure experienced by a pressure sensor and the resistance of the pressure sensor provided by an embodiment of the present disclosure;
FIG. 10 is a flow chart of a method of fabricating a pressure sensor provided by an embodiment of the present disclosure;
FIG. 11 is a flow chart of a method of fabricating a pressure sensor provided by an embodiment of the present disclosure;
FIG. 12 is a diagram illustrating a process for fabricating a pressure sensor according to an embodiment of the present disclosure;
FIG. 13 is a diagram illustrating a process for fabricating a pressure sensor according to an embodiment of the present disclosure;
FIG. 14 is a diagram illustrating a process for fabricating a pressure sensor according to an embodiment of the present disclosure;
FIG. 15 is a diagram illustrating a process for fabricating a pressure sensor according to an embodiment of the present disclosure;
FIG. 16 is a diagram illustrating a process for fabricating a pressure sensor according to an embodiment of the present disclosure;
FIG. 17 is a diagram illustrating a process for fabricating a pressure sensor according to an embodiment of the present disclosure;
fig. 18 is a diagram of an experimental apparatus for preparing polypyrrole granules by a microfluidic technology according to an embodiment of the present disclosure.
Detailed Description
To make the objects, technical solutions and advantages of the present disclosure more apparent, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings.
Fig. 1 is a top view of a pressure sensor provided in an embodiment of the present disclosure. Referring to fig. 1, the pressure sensor includes a substrate 10, a pressure sensing structure 20, a plurality of first traces 206 and a plurality of second traces 207. The pressure sensing structures 20 are spaced apart within the substrate 10, and the pressure sensing structures 20 are used for sensing pressure and transmitting the pressure as an electrical signal.
Fig. 2 is a schematic cross-sectional view of a pressure sensor provided in an embodiment of the present disclosure. Wherein figure 2 is a schematic cross-sectional view taken along plane a-a of figure 1. Referring to fig. 2, the substrate 10 includes a first substrate 101 and a second substrate 102 disposed oppositely, and the pressure sensing structure 20 includes a first electrode layer 201, a first pressure sensitive layer 202, a second electrode layer 203, and a second pressure sensitive layer 204. The first electrode layer 201 and the first pressure sensitive layer 202 are sequentially stacked on the first substrate 101, and the second electrode layer 203 and the second pressure sensitive layer 204 are sequentially stacked on the second substrate 102. The first pressure sensitive layer 202 and the second pressure sensitive layer 204 have a gap 205 therebetween. The electrical resistance between the first pressure sensitive layer 202 and the second pressure sensitive layer 204 is inversely related to the contact area of the first pressure sensitive layer 202 and the second pressure sensitive layer 204.
In the disclosed embodiment, the first substrate 101 provides support for the first electrode layer 201 and the first pressure sensitive layer 202, and the second substrate 102 provides support for the second electrode layer 203 and the second pressure sensitive layer 204. The first electrode layer 201 and the second electrode layer 203 are used to conduct electrical signals. The first pressure sensitive layer 202 and the second pressure sensitive layer 204 are used to sense pressure.
In the disclosed embodiments, the first substrate and the second substrate provide support for the pressure sensor while serving as pressing sites for pressing the pressure sensor. For example, after the first substrate is extruded, the first electrode layer located in the first groove is extruded, and meanwhile, the first electrode layer extrudes the first pressure sensitive layer, so that the first pressure sensitive layer moves towards the second pressure sensitive layer, a gap between the first pressure sensitive layer and the second pressure sensitive layer is reduced until the first pressure sensitive layer contacts the second pressure sensitive layer, the first pressure sensitive layer and the second pressure sensitive layer are both conductive, and further the two electrode layers and the two pressure sensitive layers are conducted, and the electrode layers conduct an electric signal. Because the resistance between the first pressure sensitive layer and the second pressure sensitive layer is in negative correlation with the contact area of the first pressure sensitive layer and the second pressure sensitive layer, when the pressure sensor is subjected to different pressures, the contact areas of the first pressure sensitive layer and the second pressure sensitive layer are different, so that the resistance between the first pressure sensitive layer and the second pressure sensitive layer is changed, and the pressure sensor can transmit different electric signals. Therefore, the pressure sensor can respond to pressure control and output an electric signal to realize the pressure sensing function of the pressure sensor. After the pressure is removed, the first substrate is restored to the original position under the elastic action of the first substrate, so that the first pressure sensitive layer and the second pressure sensitive layer are separated, the electric connection between the first electrode layer and the second electrode layer is disconnected, and the pressure sensor does not transmit electric signals any more. Due to the existence of the first pressure sensitive layer and the second pressure sensitive layer, when the pressure sensors are subjected to different pressures, the contact areas between the first pressure sensitive layer and the second pressure sensitive layer are different, and the resistances of the pressure sensors are different, so that the pressure sensors can output different electric signals, and the sensitivity of the pressure sensors is improved.
In the disclosed embodiment, the electrical resistance between the first pressure sensitive layer 202 and the second pressure sensitive layer 204 is inversely related to the contact area of the first pressure sensitive layer 202 and the second pressure sensitive layer 204, meaning that the greater the contact area of the first pressure sensitive layer 202 and the second pressure sensitive layer 204, the less the electrical resistance between the first pressure sensitive layer 202 and the second pressure sensitive layer 204. For example, when the first substrate 101 is subjected to a larger pressure, the first pressure sensitive layer 202 deforms more, so that the contact area between the first pressure sensitive layer 202 and the second pressure sensitive layer 204 is larger. When the first pressure sensitive layer 202 and the second pressure sensitive layer 204 are in contact, current passes through the first pressure sensitive layer 202 and the second pressure sensitive layer 204, that is, the first pressure sensitive layer 202 and the second pressure sensitive layer 204 form a structure of a wire, and since the cross-sectional area of the wire is inversely proportional to the resistance of the wire, the resistance between the first pressure sensitive layer 202 and the second pressure sensitive layer 204 is smaller.
Referring again to fig. 2, the first substrate 101 has a first groove 111, and the second substrate 102 has a second groove 121 disposed opposite to the first groove 111. The first electrode layer 201 and the first pressure sensitive layer 202 are located in the first groove 111, and the second electrode layer 203 and the second pressure sensitive layer 204 are located in the second groove 121.
In this implementation, the first groove 111 is disposed on the first substrate 101, the second groove 121 is disposed on the second substrate 102, and when the first substrate 101 and the second substrate 102 are attached to each other, the first groove 111 and the second groove 121 form the cavity 103, and the pressure sensing structure 20 is disposed in the cavity 103, so as to facilitate forming the gap 205 between the first pressure-sensitive layer 202 and the second pressure-sensitive layer 204.
In other embodiments, a spacer may be disposed between the first substrate 101 and the second substrate 102 for supporting the first substrate 101 and the second substrate 102 with the gap 205 between the first pressure sensitive layer 202 and the second pressure sensitive layer 204.
In the implementation of the present disclosure, the first trace 206 is located on the surface of the first substrate 101 where the first groove 111 is arranged, and the first electrode layer 201 is connected to the first trace 206; the second trace 207 is located on the surface of the second substrate 102 where the second groove 121 is disposed, and the second electrode layer 203 is connected to the second trace 207. When the first electrode layer 201 and the second electrode layer 203 are conducted, one of the first wire 206 and the second wire 207 provides a current to the first electrode layer 201 and the second electrode layer 203, and one of the first wire 206 and the second wire 207 provides a voltage signal to the detection device, so that the pressure applied to the pressure sensor is measured.
In the embodiment of the present disclosure, one of the first trace 206 and the second trace 207 is connected to a power source, and the other of the first trace 206 and the second trace 207 is connected to a detection device for detecting an electrical signal.
Illustratively, the first electrode layer 201 is connected to a power source through a first wire 206, and the second electrode layer 203 is connected to a detection device through a second wire 207.
In the embodiment of the present disclosure, the first trace 206 and the second trace 207 are metal wires.
As shown in fig. 1 and 2, the pressure sensor includes a plurality of pressure sensing structures 20. A pressure sensing structure 20 is disposed in one of the cavities 103.
In this implementation, the plurality of pressure sensing structures 20 are disposed in the pressure sensor, so that the pressure sensing structures 20 can be uniformly distributed at different positions of the substrate 10, the size of each place of the substrate 10 can be measured, and the detection accuracy of the pressure sensor can be improved.
As shown in fig. 2, the first substrate 101 is arranged with a plurality of first grooves 111, each of which has 1 pressure sensing structure 20 disposed therein; in other implementations, at least 2 pressure sensing structures 20 can be disposed in each groove, and in such implementations, the number of the first grooves 111 can be 1 or more.
In the embodiment of the present disclosure, when the first substrate 101 is arranged with the plurality of first grooves 111, the array of first grooves 111 is arranged on the first substrate 101.
In the embodiment of the present disclosure, the first electrode layer 201 in each row of the first groove 111 is connected to one first trace 206, and the second electrode layer 203 in each column of the second groove 121 is connected to one second trace 207.
In other implementation manners, one first electrode layer 201 in one first groove 111 is connected to one first trace 206, and different first electrode layers 201 are connected to different first traces 206. Similarly, one second electrode layer 203 in one second groove 121 is connected to one second trace 207, and a different second electrode layer 203 is connected to a different second trace 207.
In the embodiment of the present disclosure, a portion of the first trace 206 is located in the first groove 111, another portion of the first trace 206 is located on the protrusion between the first grooves 111, and the first trace 206 located in the first groove 111 is located between the first electrode layer 201 and the first pressure sensitive layer 202.
Similarly, one portion of the second trace 207 is located in the second groove 121, another portion of the second trace 207 is located on the protrusion between the second grooves 121, and the second trace 207 located in the second groove 121 is located between the second electrode layer 203 and the second pressure sensitive layer 204.
In the embodiment of the present disclosure, the first substrate 101 and the second substrate 102 both have elasticity, that is, the first substrate 101 and the second substrate 102 are both flexible substrates.
As shown in fig. 1 and fig. 2, the pressure sensing structures 20 are distributed at intervals in the substrate 10, that is, a part of the substrate 10 has no pressure sensing structure 20, when the part of the substrate 10 presses the first substrate 101, since the first substrate 101 and the second substrate 102 have elasticity, the first substrate 101 and the second substrate 102 are pressed against each other, and at the same time, the other area of the first substrate 101 is driven to move towards the second substrate 102, so that the whole first substrate 101 moves towards the second substrate 102, and the first pressure sensitive layer 202 and the second pressure sensitive layer 204 are in contact with each other, so that the first electrode layer 201 and the second electrode layer 203 are communicated with each other, and an electrical signal is generated.
In the disclosed embodiment, a projection of one pressure sensing structure 20 onto the surface of the first substrate 101 is rectangular, with the length of the rectangle being between 0.3 centimeters (cm) and 0.7 cm and the width of the rectangle being between 0.3 cm and 0.7 cm.
Illustratively, the rectangle is 0.5 cm long and 0.5 cm wide. The distance between adjacent pressure sensing structures 20 is 0.5 cm.
In the embodiment of the present disclosure, the first electrode layer 201 may be fixed in the first groove, that is, the first electrode layer 201 is fixedly connected to the first substrate 101, so as to prevent the first electrode layer 201 from being conducted with the second electrode layer when not pressed. Likewise, the second electrode layer 203 may also be fixed in the second recess.
In the embodiment of the present disclosure, the first substrate 101 and the second substrate 102 are Polydimethylsiloxane (PDMS) substrates, respectively.
In this implementation, the polydimethylsiloxane has good ductility and is easily bonded to other materials, so as to ensure the firmness of the connection between the first substrate 101 and the first electrode layer 201 and the firmness of the connection between the second substrate 102 and the second electrode layer 203.
In other implementation manners, the first substrate 101 and the second substrate 102 may also be other flexible substrates, so as to ensure the elasticity of the first substrate 101 and the second substrate 102.
Since the first substrate 101 and the second substrate 102 are flexible substrates, the pressure sensor provided by the embodiment of the present disclosure may also be referred to as a flexible pressure sensor.
In the embodiment of the present disclosure, the thickness of the first substrate 101 and the thickness of the second substrate 102 are each between 300 micrometers (μm) and 400 micrometers in a direction a perpendicular to the surface of the first substrate 101.
Illustratively, the thickness of the first substrate 101 and the thickness of the second substrate 102 are both 350 microns.
In one implementation manner of the embodiment of the present disclosure, the first electrode layer 201 and the second electrode layer 203 are both Indium Tin Oxide (ITO) layers, which ensure the conductivity of the first electrode layer 201 and the second electrode layer 203.
In other implementations, the first electrode layer 201 and the second electrode layer 203 may also be metal layers.
In the embodiment of the present disclosure, the thickness of the first electrode layer 201 and the thickness of the second electrode layer 203 are both between 80 micrometers and 120 micrometers in the direction a perpendicular to the surface of the first substrate 101.
Illustratively, the thickness of the first electrode layer 201 and the thickness of the second electrode layer 203 are both 100 microns.
In one implementation of the disclosed embodiment, the first pressure sensitive layer 202 and the second pressure sensitive layer 204 are both layers of polypyrrole particles.
In this implementation manner, on one hand, polypyrrole has higher conductivity, which ensures the conductivity of the first pressure sensitive layer 202 and the second pressure sensitive layer 204, and because the conductivity of polypyrrole is higher, when polypyrrole particles in two polypyrrole particle layers slightly contact with each other, the first electrode layer 201 and the second electrode layer 203 can be conducted, so that the sensitivity of the pressure sensor is improved. And on the other hand, the polypyrrole has good stability, and the stability of the pressure sensor is ensured. Meanwhile, the raw materials for preparing the polypyrrole are cheap and easily available, and the preparation cost is reduced.
In one implementation of the disclosed embodiments, the polypyrrole granules have a particle size between 100 nanometers (nm) and 300 nm.
In this implementation, the polypyrrole particles are sized such that the polypyrrole particles can be uniformly distributed on the electrode layer, increasing sensitivity. Since the particle size of the polypyrrole particles is in the order of nanometers, the polypyrrole particles can also be referred to as polypyrrole nanoparticles.
Illustratively, the particle size of the polypyrrole granules is 200 nm.
In the embodiment of the present disclosure, the thickness of the first pressure sensitive layer 202 and the thickness of the second pressure sensitive layer 204 in the direction a perpendicular to the surface of the first substrate 101 are both between 80 micrometers and 120 micrometers.
Illustratively, the thickness of the first pressure sensitive layer 202 and the thickness of the second pressure sensitive layer 204 are both 100 microns.
Fig. 3 is a schematic diagram of a pressure sensor provided in an embodiment of the present disclosure. Referring to fig. 3, in an initial state, a gap 205 is formed between two polypyrrole particle layers, and the first pressure sensitive layer 202 and the second pressure sensitive layer 204 are not in contact, so that the first electrode layer 201 and the second electrode layer 203 are in an off state. When the pressure sensor is not in operation, no electrical signal is transmitted.
Fig. 4 is a schematic diagram of a pressure sensor provided in an embodiment of the present disclosure. Referring to fig. 4, when the first electrode layer 201 is pressed, air in the gap 205 is compressed, and a distance between the first pressure sensitive layer 202 and the second pressure sensitive layer 204 is decreased.
Fig. 5 is a schematic diagram of a pressure sensor provided in an embodiment of the present disclosure. Referring to fig. 5, when the distance between the first pressure-sensitive layer 202 and the second pressure-sensitive layer 204 continues to decrease, the polypyrrole particles in the two polypyrrole particle layers contact, so that the first electrode layer 201 and the second electrode layer 203 are conducted, and an electrical signal is generated.
As shown in fig. 2, the maximum distance H1 between the first pressure sensitive layer 202 and the second pressure sensitive layer 204 in the direction a perpendicular to the surface of the first substrate 101 is between 80 microns and 120 microns.
In this implementation, the distance between the first pressure sensitive layer 202 and the second pressure sensitive layer 204 is defined, and on one hand, it is ensured that the first electrode layer 201 and the second electrode layer 203 are in an open circuit state when the substrate is not pressed, and the function of the pressure sensor is not affected. On the other hand, the situation that the distance between the first pressure sensitive layer 202 and the second pressure sensitive layer 204 is too large, the first pressure sensitive layer 202 and the second pressure sensitive layer 204 are difficult to contact, and the sensitivity of the pressure sensor is reduced is avoided.
Illustratively, the maximum distance H1 between the first pressure sensitive layer 202 and the second pressure sensitive layer 204 is 100 microns.
As shown in fig. 2, the first recess 111 of the first substrate 101 is not completely filled, and the second recess 121 of the second substrate 102 is not completely filled. When the first substrate 101 and the second substrate 102 are disposed opposite to each other, the vacant portions in the first groove 111 and the vacant portions in the second groove 121 collectively constitute the gap 205 in fig. 2.
In the embodiment of the present disclosure, the thickness of the cavity in the first groove 111 of the first substrate 101 is equal to the thickness of the cavity in the second groove 121 of the second substrate 102. In other implementations, the thickness of the cavity in the first groove 111 of the first substrate 101 and the thickness of the cavity in the second groove 121 of the second substrate 102 may not be equal, which is not limited by the present disclosure.
In one implementation manner of the embodiment of the present disclosure, at least one of the first electrode layer 201 and the bottom surface of the first groove 111 and the second electrode layer 203 and the bottom surface of the second groove 121 is provided with a saturated Polyester (PET) film.
Fig. 6 is a cross-sectional view of a pressure sensor provided by an embodiment of the present disclosure. Referring to fig. 6, a first saturated mylar film 208 is disposed between the first electrode layer 201 and the bottom surface of the first groove 111, and a second saturated mylar film 209 is disposed between the second electrode layer 203 and the bottom surface of the second groove 121.
In this implementation mode, the saturated polyester has high elasticity, and the saturated polyester film is arranged on the first electrode layer 201 and the second electrode layer 203, so that when the pressure sensor is subjected to pressure relief, the first electrode layer 201 or the second electrode layer 203 can be quickly restored to the initial state, the circuit is quickly cut off, and the sensitivity of the pressure sensor is increased.
In other implementations, a saturated polyester film may be disposed between the first electrode layer 201 and the bottom surface of the first groove 111, and between the second electrode layer 203 and the bottom surface of the second groove 121.
In the disclosed embodiment, it is measured by the implementation that when the pressure sensor is subjected to pressure withdrawal, the time when the first electrode layer 201 or the second electrode layer 203 is restored to the initial state is between 40 milliseconds (ms) and 60 ms. This time may also be referred to as the deactivation response time of the pressure sensor, which can be derived by detecting the current, and the time consumed when the current of the pressure sensor decreases from the maximum value to 0 is the deactivation response time of the pressure sensor.
In the embodiment of the present disclosure, when different pressures are applied to a substrate (e.g., the first substrate 101) of the pressure sensor, the deformation of the first electrode layer 201 is different, the contact area between the first pressure sensitive layer 202 and the second pressure sensitive layer 204 is different, the resistance of the pressure sensor is different, and thus the current between the first electrode layer 201 and the second electrode layer 203 is different, and the time taken for the first electrode layer 201 to return to the original state is different due to the different deformation of the first electrode layer 201.
Illustratively, a pressure sensor may be placed on the testing device, for example, ESM303(Mark-10), ESM303 having a platform that moves in a vertical direction, the pressure sensor being placed on the platform, and the pressure sensor being moved during the movement of the platform, bringing the substrate of the pressure sensor into contact with another platform, and effecting a pressing of the pressure sensor. The electrode layer in the pressure sensor is then connected by a lead to a current test instrument in the ESM303 to detect the change in current in the pressure sensor.
In the disclosed embodiment, ESM303 may be an ESM303(Mark-10) test equipment. ESM303(Mark-10) may provide a pressure of between 0.5N and 10 KN. The pressure adjustment accuracy was 0.1 newton. During the test process, the pressure, the current and the withdrawal response time received by the pressure sensor can be directly obtained from the test device.
In the embodiment of the disclosure, the moving speed, the cycle number and the moving number of the platform can be set according to actual requirements.
Fig. 7 is a graph of pressure sensor deactivation response time versus current provided by an embodiment of the present disclosure. Referring to fig. 7, when the deactivation response time of the pressure sensor is between 26300 ms and 26500 ms, the current between the first electrode layer 201 and the second electrode layer 203 does not change much, around 0.22 microampere (μ a). When the deactivation time of the pressure sensor is between 26500 to 26650 ms, the current between the first electrode layer 201 and the second electrode layer 203 is between 0.4 to 0.45 micro-amperes. When the deactivation time of the pressure sensor is between 26500 to 26650 ms, the current between the first electrode layer 201 and the second electrode layer 203 is between 0.4 to 0.45 micro-amperes.
In the embodiment of the present disclosure, the sensitivity of the pressure sensor is not only related to the material of the internal device of the pressure sensor, but also the sensitivity of the pressure sensor per time can be changed for the same pressure sensor when the pressure applied to the pressure sensor is different. When the pressure applied to the pressure sensor is too large, the withdrawal response time of the sensor becomes long, which may reduce the sensitivity of the sensor.
The substrate area of the pressure sensor is constant for the same pressure sensor, so that the pressure applied to the pressure sensor can be converted into pressure.
Fig. 8 is a graph illustrating a relationship between a pressure experienced by a pressure sensor and a sensitivity of the pressure sensor according to an embodiment of the disclosure. Referring to fig. 8, embodiments of the present disclosure provide a pressure sensor with a sensitivity of up to 102 kilopascals (KPa)-1). When the pressure of the pressure sensor is increased to about 10KPa to 30KPa, the sensitivity of the pressure sensor begins to decrease, and the lowest pressure is decreased to 0.1KPa-1However, this sensitivity is still high compared to a typical pressure sensor. As the pressure of the pressure sensor continues to increase, the sensitivity of the pressure sensor tends to stabilize because the first pressure sensitive layer 202 and the second pressure sensitive layer 204 are now in full contact and the deformation is maximized, so the sensitivity of the pressure sensor does not continue to decrease.
In the embodiment of the disclosure, in the experimental test process, the electrode layer in the pressure sensor can be connected with a multimeter through a lead to detect the change of the resistance in the pressure sensor. For example, the multimeter can be a Keysight2400 digital multimeter.
Fig. 9 is a graph illustrating a relationship between a pressure applied to a pressure sensor and a resistance of the pressure sensor according to an embodiment of the disclosure. Referring to fig. 9, when the pressure of the pressure sensor increases from 0 to 10KPa, the resistance of the pressure sensor decreases by orders of magnitude, that is, a small pressure change may decrease the resistance of the pressure sensor by a large amount, which also means that the pressure sensor provided by the embodiment of the present disclosure has extremely high sensitivity.
Fig. 10 is a flowchart of a method for manufacturing a pressure sensor according to an embodiment of the disclosure. Referring to fig. 10, the method includes:
step S11: a first electrode layer and a first pressure sensitive layer are formed on a first substrate.
Step S12: a second electrode layer and a second pressure sensitive layer are formed on a second substrate.
In the embodiments of the present disclosure, the first substrate and the second substrate may be polydimethylsiloxane, which ensures the first substrate and the second substrate to be elastic.
In the embodiments of the present disclosure, the first electrode layer and the second electrode layer may be indium tin oxide layers, which ensure conductivity of the first electrode layer and the second electrode layer.
Illustratively, saturated polyester films are arranged between the first electrode layer and the first substrate and between the second electrode layer and the second substrate. When the pressure sensor is subjected to pressure withdrawal, the first electrode layer or the second electrode layer can be quickly restored to the initial state, the circuit is quickly cut off, and the sensitivity of the pressure sensor is increased.
In embodiments of the present disclosure, the first pressure sensitive layer and the second pressure sensitive layer are both layers of polypyrrole particles. The polypyrrole has higher conductivity, ensures the conductivity of the first pressure sensitive layer and the second pressure sensitive layer, improves the sensitivity of the pressure sensor and reduces the manufacturing cost.
Step S13: the first substrate and the second substrate are arranged oppositely, the first electrode layer, the first pressure sensitive layer, the second electrode layer and the second pressure sensitive layer form a pressure sensing structure located between the first substrate and the second substrate, and a gap is formed between the first pressure sensitive layer and the second pressure sensitive layer. The electrical resistance between the first pressure sensitive layer and the second pressure sensitive layer is inversely related to the contact area of the first pressure sensitive layer and the second pressure sensitive layer.
In the embodiment of the disclosure, a gap is formed between the first pressure sensitive layer and the second pressure sensitive layer, when the pressure is removed, the first pressure sensitive layer and the second pressure sensitive layer are separated, and air is arranged in the gap, so that the electrical connection between the first electrode layer and the second electrode layer is broken, and the pressure sensor cannot transmit an electrical signal.
Fig. 11 is a flowchart of a method for manufacturing a pressure sensor according to an embodiment of the present disclosure. Referring to fig. 11, the method includes:
step S21: a first glass substrate is provided.
Fig. 12 to 17 are diagrams illustrating a process for manufacturing a pressure sensor according to an embodiment of the present disclosure.
Referring to fig. 12, a first glass substrate 30 is provided.
Step S22: and attaching double-sided adhesive tapes arranged at intervals on the first glass substrate.
Referring to fig. 13, a double-sided tape 40 is attached on the first glass substrate 30.
Illustratively, the double-sided tape may be cut to a size of 0.5 cm × 0.5 cm and attached to the surface of the first glass substrate 30. The spacing between adjacent double-sided adhesive tapes may be 0.5 cm.
Step S23: and attaching a first electrode on the double-sided adhesive to form a first electrode layer.
Referring to fig. 14, a first electrode is attached on the double-sided tape 40 to form a first electrode layer 201.
For example, PET may be attached to one surface of the conductive film, and the elasticity of the first electrode layer may be increased by the PET. And cutting the conductive film attached with the PET into the same size with the double-sided adhesive tape, and attaching the conductive surface to the surface of the double-sided adhesive tape.
Step S24: and forming a first substrate covering the first electrode layer on the first glass substrate, wherein the first substrate is provided with a first groove, and the first electrode layer is positioned in the first groove.
Referring to fig. 15, a first substrate 101 is formed on a first glass substrate 30, and the first substrate 101 covers the first glass substrate 30 and a first electrode layer 201. That is, the first substrate 101 wraps the first electrode layer 201, and the first groove 111 is formed on the first substrate 101, and the first electrode layer 201 is located in the first groove 111.
For example, the first substrate 101 may be formed on the first glass substrate 30 by a spin coating method, which ensures uniformity of the formed first substrate 101. Illustratively, the first substrate 101 is PDMS.
Illustratively, the rotational speed of the rotary spray is 500 revolutions per minute (r/min) and the spray time is 10 seconds(s). After the completion of the spraying, the entire first glass substrate 30 and the first substrate 101 are placed at a temperature of 80 degrees celsius (° c) and heated for 20 minutes, so that the first substrate 101 is cured, and the first substrate 101 having a supporting function is formed.
Step S25: and peeling the first glass substrate and the double-sided adhesive tape.
Referring to fig. 16, the first glass substrate 30 and the double-sided tape 40 are peeled off, leaving the first substrate 101 and the first electrode layer 201. Since the double-sided tape 40 has a certain thickness, the surface of the first electrode layer 201 is lower than the surface of the first substrate 101, resulting in the structure shown in fig. 16.
In the embodiment of the present disclosure, since the adhesion between the PDMS and the PET is strong, it is ensured that the first electrode layer 201 is not peeled off along with the double-sided tape 40.
In the embodiment of the disclosure, after the first glass substrate 30 and the double-sided tape 40 are peeled off, the first wire may be disposed on the first electrode layer 201, the first wire connects the first electrode layers in the row of first grooves through the grooves and the protrusions between the grooves, and the first electrode layer is connected to the power supply or the detection device through the first wire.
Illustratively, the first trace is a metal line.
Step S26: a first pressure sensitive layer is formed on the first electrode layer.
Referring to fig. 17, a first pressure sensitive layer 202 is formed on the first electrode layer 201.
Wherein forming a first pressure sensitive layer on the first electrode layer comprises:
preparing polypyrrole granules by a microfluidic technology; adding polypyrrole granules into an ethanol solution; and spraying an ethanol solution dissolved with polypyrrole particles on the first electrode layer, and forming the first pressure sensitive layer after ethanol is evaporated.
Illustratively, polypyrrole granules were added to the ethanol solution and sonicated for 2 hours to uniformly disperse the granules into the ethanol solution. Manufacturing a corresponding mask plate according to the position of the electrode, covering the mask plate on the surface of the first electrode layer 201, spraying the solution on the first electrode layer 201 through a spray gun, and after the ethanol is evaporated, keeping polypyrrole particles on the surface of the first electrode layer 201 to obtain the pattern of the first pressure sensitive layer 202.
The polypyrrole granules prepared by the microfluidic technology are described below. Fig. 18 is a diagram of an experimental apparatus for preparing polypyrrole granules by a microfluidic technology according to an embodiment of the present disclosure.
Referring to fig. 18, the polypyrrole nanoparticle preparation method includes:
the first step is as follows: two syringes 60 are placed on the surface of two micro pumps 70.
As shown in fig. 18, the micro pump 70 has a support base 701, a moving rod 702 and a support rod 703. The injector 60 is placed on the support 701, the injection rod 601 of the injector 60 is connected with the moving rod 702, and the injection head 602 of the injector 60 is connected with the support rod 703, so that the stability of the injector 60 is ensured.
Illustratively, the volume of the syringe 60 is between 8 milliliters (ml) and 15 ml.
For example: the syringe 60 has a volume of 10 ml.
In the disclosed example, 0.91g ammonium persulfate was first dissolved in 10ml of water and 0.81ml of a 50% strength phytic acid aqueous solution was added to inject the resulting solute into syringe A (one of syringes 60). The solution in syringe B (another syringe 60) was a mixed solution of 112 microliters (μ l) of pyrrole and 2 milliliters (ml) of n-octanol.
As shown in fig. 18, the injector head 602 of the injector 60 is connected to the capillary 80. The two capillaries 80 are connected to one another 80 via a T-junction 90, and the other 80 is raised into a flask 100.
Illustratively, the diameter of the capillary 80 is between 8 and 15 micrometers (μm).
For example: the diameter of the capillary 80 is 10 microns.
The second step is that: the moving rod 702 of the micro pump 70 is controlled to move.
The moving rod 702 moves toward the syringe 60 to move the injection rod 601, so that the solution in the syringe 60 flows into the capillary 80, and when the two solutions come into contact, a reaction occurs to produce polypyrrole granules.
In the disclosed embodiment, the speed of movement of the travel bar 702 is adjustable to control the flow rate of the liquid within the capillary tube 80. The size of the nanoparticles can be controlled by controlling the composition, flow rate, etc. of the two solutions.
Illustratively, for both solutions, the flow rate of the solution for syringe A is 1ml/min and the flow rate of the solution for syringe B is 0.2 ml/min.
In the disclosed embodiments, for the two solutions described above, ammonium sulfate: pyrrole: the volume ratio of n-octanol is: 625:7:125, wherein the concentration of ammonium persulfate is 9.1 percent.
The third step: the product in flask 100 was poured onto filter paper and most of the solvent was filtered off by suction filtration.
The fourth step: the polypyrrole on the filter paper was washed continuously with ethanol. The polypyrrole obtained was left in ethanol for 12 hours and then washed again with deionized water, again with most of the solvent being filtered off by suction filtration.
The fifth step: and finally, putting the obtained product into a vacuum oven for drying (12h, 50 ℃) to obtain the polypyrrole nano particles.
Step S27: and forming a second electrode layer in the second groove of the second substrate, and manufacturing a second pressure sensitive layer on the second electrode layer.
The manufacturing steps are the same as steps S22-S26.
Step S28: the manufactured first substrate and the second substrate are arranged oppositely, and the first grooves and the second grooves are arranged oppositely one by one, so that the pressure sensor shown in fig. 2 can be formed.
For example, a layer of liquid PDMS may be applied to the first substrate, the first substrate and the second substrate are attached, and the first substrate and the second substrate are connected after the PDMS is cured.
The present disclosure provides an electronic device comprising a pressure sensor as shown in any of the above figures.
Illustratively, the electronic device may include any electronic device having a pressure sensing function, such as a pulse taking device, an electronic blood pressure monitor, and an alarm device.
The above description is intended to be exemplary only and not to limit the present disclosure, and any modification, equivalent replacement, or improvement made without departing from the spirit and scope of the present disclosure is to be considered as the same as the present disclosure.
Claims (10)
1. A pressure sensor, characterized in that the pressure sensor comprises:
a first substrate (101);
a second substrate (102) disposed opposite to the first substrate (101);
a pressure sensing structure (20) located between the first substrate (101) and the second substrate (102);
the pressure sensing structure (20) comprises a first electrode layer (201) and a first pressure sensitive layer (202) which are sequentially stacked and arranged on the first substrate (101), and a second electrode layer (203) and a second pressure sensitive layer (204) which are sequentially stacked and arranged on the second substrate (102); a gap (205) is formed between the first pressure sensitive layer (202) and the second pressure sensitive layer (204), and the resistance between the first pressure sensitive layer (202) and the second pressure sensitive layer (204) is inversely related to the contact area of the first pressure sensitive layer (202) and the second pressure sensitive layer (204).
2. The pressure sensor of claim 1, wherein the first pressure sensitive layer (202) and the second pressure sensitive layer (204) are both layers of polypyrrole particles.
3. A pressure sensor according to claim 2, wherein the polypyrrole granules have a particle size between 100 nm and 300 nm.
4. A pressure sensor according to claim 1, characterized in that the first substrate (101) has a first recess (111) and the second substrate (102) has a second recess (121) arranged opposite to the first recess (111);
the first electrode layer (201) and the first pressure sensitive layer (202) are located in the first recess (111), and the second electrode layer (203) and the second pressure sensitive layer (204) are located in the second recess (121).
5. The pressure sensor according to claim 4, wherein the first substrate (101) and the second substrate (102) are attached to each other, the first substrate (101) has a plurality of first grooves (111), the second substrate (102) has a plurality of second grooves (121), and the first grooves (111) and the second grooves (121) arranged opposite to each other form a cavity (103);
the pressure sensor comprises a plurality of pressure sensing structures (20), one pressure sensing structure (20) being arranged in one of the cavities (103).
6. The pressure sensor of any of claims 1 to 5, further comprising a saturated mylar film positioned in at least one of the following locations:
between the first electrode layer (201) and the first substrate (101), and
between the second electrode layer (203) and the second substrate (102).
7. A method of making a pressure sensor, the method comprising:
sequentially forming a first electrode layer and a first pressure sensitive layer on a first substrate;
sequentially forming a second electrode layer and a second pressure sensitive layer on a second substrate;
the first substrate and the second substrate are arranged oppositely, the first electrode layer, the first pressure sensitive layer, the second electrode layer and the second pressure sensitive layer form a pressure sensing structure located between the first substrate and the second substrate, a gap is formed between the first pressure sensitive layer and the second pressure sensitive layer, and the resistance between the first pressure sensitive layer and the second pressure sensitive layer is in negative correlation with the contact area of the first pressure sensitive layer and the second pressure sensitive layer.
8. The method of claim 7, wherein the sequentially forming a first electrode layer and a first pressure sensitive layer on a first substrate comprises:
providing a first glass substrate;
attaching double-sided adhesive tapes arranged at intervals to the first glass substrate;
attaching a first electrode on the double-sided adhesive to form a first electrode layer;
forming a first substrate covering the first electrode layer on the first glass substrate, wherein the first substrate is provided with a first groove, and the first electrode layer is positioned in the first groove;
peeling the first glass substrate and the double-sided adhesive tape;
a first pressure sensitive layer is formed on the first electrode layer.
9. The method of claim 8, wherein forming a first pressure sensitive layer on the first electrode layer comprises:
preparing polypyrrole granules by a microfluidic technology;
adding the polypyrrole granules into an ethanol solution;
and spraying an ethanol solution dissolved with the polypyrrole granules on the first electrode layer, and forming the first pressure sensitive layer after ethanol is evaporated.
10. An electronic device, characterized in that it comprises a pressure sensor according to any one of claims 1 to 6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010732219.6A CN111855040A (en) | 2020-07-27 | 2020-07-27 | Pressure sensor, manufacturing method thereof and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010732219.6A CN111855040A (en) | 2020-07-27 | 2020-07-27 | Pressure sensor, manufacturing method thereof and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111855040A true CN111855040A (en) | 2020-10-30 |
Family
ID=72947219
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010732219.6A Pending CN111855040A (en) | 2020-07-27 | 2020-07-27 | Pressure sensor, manufacturing method thereof and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111855040A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112835468A (en) * | 2020-12-31 | 2021-05-25 | 瑞态常州高分子科技有限公司 | Dielectric film layer, preparation method and application |
| CN114224306A (en) * | 2021-11-11 | 2022-03-25 | 煤炭科学研究总院 | Heart rate detection sensor, protective clothing and manufacturing method of sensor |
Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1879230A (en) * | 2004-10-28 | 2006-12-13 | 松下电器产业株式会社 | Piezoelectric element and method for manufacturing the same |
| JP2010085233A (en) * | 2008-09-30 | 2010-04-15 | Nissha Printing Co Ltd | Pressure sensitive sensor |
| CN103411710A (en) * | 2013-08-12 | 2013-11-27 | 国家纳米科学中心 | Pressure sensor, electronic skin and touch screen equipment |
| CN204576454U (en) * | 2014-01-13 | 2015-08-19 | 苹果公司 | There is the temperature compensation transparent force of flexible layer |
| CN106531733A (en) * | 2016-12-21 | 2017-03-22 | 清华大学 | Flexible pressure sensor and preparation method therefor |
| CN107153483A (en) * | 2017-05-09 | 2017-09-12 | 京东方科技集团股份有限公司 | A kind of touch-control display module, display device and its driving method |
| KR20170111150A (en) * | 2016-03-25 | 2017-10-12 | 양천근 | Pressure sensor |
| CN107560766A (en) * | 2016-07-01 | 2018-01-09 | 南昌欧菲光科技有限公司 | Piezoresistance sensor and the pressure cell for piezoresistance sensor |
| CN108775979A (en) * | 2018-05-10 | 2018-11-09 | 西安建筑科技大学 | A kind of high sensitivity pliable pressure sensor and preparation method thereof |
| CN108955994A (en) * | 2018-06-13 | 2018-12-07 | 中国科学院电子学研究所 | Touch sensor and preparation method thereof |
| CN109883584A (en) * | 2017-12-06 | 2019-06-14 | 中国科学院苏州纳米技术与纳米仿生研究所 | Flexible bionic touch sensor based on micro-structure and preparation method thereof |
| CN109945999A (en) * | 2019-03-15 | 2019-06-28 | 电子科技大学 | A kind of preparation method of fexible film pressure sensor |
| CN209131870U (en) * | 2018-12-10 | 2019-07-19 | 亿联线路板有限公司 | Pressure sensor |
-
2020
- 2020-07-27 CN CN202010732219.6A patent/CN111855040A/en active Pending
Patent Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1879230A (en) * | 2004-10-28 | 2006-12-13 | 松下电器产业株式会社 | Piezoelectric element and method for manufacturing the same |
| JP2010085233A (en) * | 2008-09-30 | 2010-04-15 | Nissha Printing Co Ltd | Pressure sensitive sensor |
| CN103411710A (en) * | 2013-08-12 | 2013-11-27 | 国家纳米科学中心 | Pressure sensor, electronic skin and touch screen equipment |
| CN204576454U (en) * | 2014-01-13 | 2015-08-19 | 苹果公司 | There is the temperature compensation transparent force of flexible layer |
| KR20170111150A (en) * | 2016-03-25 | 2017-10-12 | 양천근 | Pressure sensor |
| CN107560766A (en) * | 2016-07-01 | 2018-01-09 | 南昌欧菲光科技有限公司 | Piezoresistance sensor and the pressure cell for piezoresistance sensor |
| CN106531733A (en) * | 2016-12-21 | 2017-03-22 | 清华大学 | Flexible pressure sensor and preparation method therefor |
| CN107153483A (en) * | 2017-05-09 | 2017-09-12 | 京东方科技集团股份有限公司 | A kind of touch-control display module, display device and its driving method |
| CN109883584A (en) * | 2017-12-06 | 2019-06-14 | 中国科学院苏州纳米技术与纳米仿生研究所 | Flexible bionic touch sensor based on micro-structure and preparation method thereof |
| CN108775979A (en) * | 2018-05-10 | 2018-11-09 | 西安建筑科技大学 | A kind of high sensitivity pliable pressure sensor and preparation method thereof |
| CN108955994A (en) * | 2018-06-13 | 2018-12-07 | 中国科学院电子学研究所 | Touch sensor and preparation method thereof |
| CN209131870U (en) * | 2018-12-10 | 2019-07-19 | 亿联线路板有限公司 | Pressure sensor |
| CN109945999A (en) * | 2019-03-15 | 2019-06-28 | 电子科技大学 | A kind of preparation method of fexible film pressure sensor |
Non-Patent Citations (1)
| Title |
|---|
| 吴赞敏: "《纺织品清洁染整加工技术》", 31 January 2007, 中国纺织出版社 * |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112835468A (en) * | 2020-12-31 | 2021-05-25 | 瑞态常州高分子科技有限公司 | Dielectric film layer, preparation method and application |
| WO2022143073A1 (en) * | 2020-12-31 | 2022-07-07 | 瑞态常州高分子科技有限公司 | Dielectric film layer, preparation method and application |
| CN114224306A (en) * | 2021-11-11 | 2022-03-25 | 煤炭科学研究总院 | Heart rate detection sensor, protective clothing and manufacturing method of sensor |
| CN114224306B (en) * | 2021-11-11 | 2024-03-22 | 煤炭科学研究总院有限公司 | Heart rate detecting sensor, protective clothing and method for manufacturing sensor |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN111855040A (en) | Pressure sensor, manufacturing method thereof and electronic equipment | |
| CN100585352C (en) | Array type ultra-thin submissive force sensor and preparation method thereof | |
| US4717673A (en) | Microelectrochemical devices | |
| US9380979B2 (en) | Apparatus and method of assembling an apparatus for sensing pressure | |
| CN101871912B (en) | Full-solid potassium ion sensor and preparation method thereof | |
| JP4547852B2 (en) | Manufacturing method of electrical parts | |
| CN111248888B (en) | Elastomer film with surface multilevel microstructure, preparation method thereof and flexible pressure sensor containing elastomer film | |
| CN104599878A (en) | pressure-sensitive switch, manufacturing method for same, touch panel including pressure-sensitive switch, and manufacturing method for touch panel | |
| CN104598066A (en) | Pressure-sensitive switch, manufacturing method for same, touch panel including pressure-sensitive switch, and manufacturing method for touch panel | |
| CN107560766A (en) | Piezoresistance sensor and the pressure cell for piezoresistance sensor | |
| KR101884395B1 (en) | Capacitive pressure sensor comprising ionic liquid and graphene, and method for manufacturing of the same | |
| CN114608716B (en) | Flexible temperature and pressure bimodal sensor and preparation and testing method thereof | |
| EP3845880B1 (en) | Capacitance detection device capable of calculating shearing force | |
| CN109188819A (en) | A kind of flexible electro-chromic device and preparation method thereof | |
| CN110926663A (en) | Preparation method of washable wearable high-sensitivity pressure sensor | |
| CN112697857A (en) | Glucose electrode, microfluidic chip, microfluidic passive sweat patch and preparation method and application thereof | |
| CN113720501B (en) | Large-area-array flexible film sensor and full-printing preparation method thereof | |
| CN103759866B (en) | Coplanar small electrode type soft pressure sensitive probe and method of production thereof | |
| KR20180024969A (en) | Flexible circuit board manufacturing method and sensor for detecting touch pressure applied flexible circuit board manufactured by the method | |
| CN107389234B (en) | A kind of piezoresistive transducer and preparation method thereof for making separation layer based on nano wire | |
| CN114136512A (en) | Transparent pressure sensor, manufacturing method thereof and switch | |
| CN209783781U (en) | Flexible sensor | |
| CN114279600A (en) | Flexible pressure sensor of composite material dielectric layer based on laser-induced graphene | |
| CN114674465A (en) | Flexible material-based capacitive pressure sensor and manufacturing method thereof | |
| CN209764303U (en) | Pressure-sensitive film and micro-pressure sensor |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20201030 |
|
| RJ01 | Rejection of invention patent application after publication |