CN111721426A - Thermopile sensor and control method thereof - Google Patents
Thermopile sensor and control method thereof Download PDFInfo
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- CN111721426A CN111721426A CN202010727788.1A CN202010727788A CN111721426A CN 111721426 A CN111721426 A CN 111721426A CN 202010727788 A CN202010727788 A CN 202010727788A CN 111721426 A CN111721426 A CN 111721426A
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- 238000000034 method Methods 0.000 title claims abstract description 14
- 238000009529 body temperature measurement Methods 0.000 claims abstract description 35
- 238000010438 heat treatment Methods 0.000 claims abstract description 23
- 238000009413 insulation Methods 0.000 claims description 27
- 238000005485 electric heating Methods 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 230000006698 induction Effects 0.000 claims description 2
- 230000002093 peripheral effect Effects 0.000 claims description 2
- 238000001514 detection method Methods 0.000 abstract description 5
- 230000006872 improvement Effects 0.000 description 8
- 239000010408 film Substances 0.000 description 5
- 230000005855 radiation Effects 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 239000004964 aerogel Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 238000004321 preservation Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000001931 thermography Methods 0.000 description 3
- 230000004044 response Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 230000036760 body temperature Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 210000001061 forehead Anatomy 0.000 description 1
- 230000036541 health Effects 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 230000021715 photosynthesis, light harvesting Effects 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 229910052761 rare earth metal Inorganic materials 0.000 description 1
- 150000002910 rare earth metals Chemical class 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
- G01J5/12—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using thermoelectric elements, e.g. thermocouples
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/06—Arrangements for eliminating effects of disturbing radiation; Arrangements for compensating changes in sensitivity
- G01J5/061—Arrangements for eliminating effects of disturbing radiation; Arrangements for compensating changes in sensitivity by controlling the temperature of the apparatus or parts thereof, e.g. using cooling means or thermostats
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/06—Arrangements for eliminating effects of disturbing radiation; Arrangements for compensating changes in sensitivity
- G01J5/061—Arrangements for eliminating effects of disturbing radiation; Arrangements for compensating changes in sensitivity by controlling the temperature of the apparatus or parts thereof, e.g. using cooling means or thermostats
- G01J2005/063—Heating; Thermostating
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
- G01J5/12—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using thermoelectric elements, e.g. thermocouples
- G01J2005/126—Thermoelectric black plate and thermocouple
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- Spectroscopy & Molecular Physics (AREA)
- Radiation Pyrometers (AREA)
- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
Abstract
The invention provides a thermopile sensor and a control method thereof. The thermopile sensor includes thermopile sensor chip, the control assembly that heater and control heater carried out the heating to thermopile sensor chip, the integrated first temperature measurement chip and second temperature measurement chip that has in the thermopile sensor chip, first temperature measurement chip is used for sensing external environment temperature and determinand temperature, the second temperature measurement chip is used for the whole temperature of sensing thermopile sensor chip, when the external environment temperature that first temperature measurement chip sensing was higher than the whole temperature of the thermopile sensor chip that second temperature measurement chip sensing was, the heating power of heater is adjusted to accessible control assembly, make the whole temperature of thermopile sensor chip unanimous with external environment temperature. Compared with the prior art, the thermopile sensor can normally work no matter in any high-temperature environment, and the detection precision and stability can be better guaranteed.
Description
Technical Field
The invention relates to the technical field of temperature sensing, in particular to a thermopile sensor and a control method thereof.
Background
The infrared temperature measuring equipment has the characteristics of non-contact, short measuring time, convenience in digital reading and the like, and is widely used for screening the heat-generating people in public places. The existing common non-contact infrared temperature measuring equipment comprises a forehead temperature gun, an ear temperature gun and infrared thermal imaging equipment, the temperature measuring principle of the infrared thermal imaging equipment is the same, and the infrared thermal imaging equipment is realized through a thermopile sensor or a thermopile sensor array.
The thermopile sensor is a temperature measuring element and is formed by connecting two or more thermocouples in series, and the temperature difference to be measured or the temperature to be measured is obtained by superposing the thermoelectromotive forces on the thermocouples and according to the corresponding relation between the thermoelectromotive forces and the temperature.
Any object above "absolute zero" -273.15 ℃ is the source of the infrared radiation, except for the wavelength of the infrared radiation. The non-contact infrared temperature measuring equipment is manufactured by utilizing the principle that the radiation energy of an object changes along with the temperature. At present, the non-contact infrared temperature measurement equipment is widely used in scenes such as medical systems, family health management, epidemic prevention monitoring and the like, and in the actual use process, the environment temperature determines the measurement accuracy of the non-contact infrared temperature measurement equipment.
In an indoor environment with relatively stable ambient temperature, the detection precision and stability of the non-contact infrared temperature measurement equipment can be well guaranteed, but in a complex environment (such as an outdoor high-temperature environment), the problem of inaccurate measurement data exists.
In view of the above, there is a need for an improved thermopile sensor to solve the above problems.
Disclosure of Invention
The invention aims to provide a thermopile sensor and a control method thereof, which aim to solve the problem that an infrared temperature measuring instrument measures inaccurate data in a high-temperature environment.
In order to achieve the above object, the present invention provides a thermopile sensor, which includes a thermopile sensor chip, a heater, and a control component for controlling the heater to heat the thermopile sensor chip, wherein a first temperature measurement chip and a second temperature measurement chip are integrated in the thermopile sensor chip, the first temperature measurement chip is used for sensing an external environment temperature and a temperature of an object to be measured, the second temperature measurement chip is used for sensing an overall temperature of the thermopile sensor chip, and when the external environment temperature sensed by the first temperature measurement chip is higher than the overall temperature of the thermopile sensor chip sensed by the second temperature measurement chip, the control component adjusts a heating power of the heater, so that the overall temperature of the thermopile sensor chip is consistent with the external environment temperature.
As a further improvement of the invention, the first temperature measuring chip and the second temperature measuring chip are both arranged at the top of the thermopile sensor chip, and the heater ring is arranged on the peripheral side surface of the thermopile sensor chip.
As a further improvement of the present invention, a hot junction region and a cold junction region located at the periphery of the hot junction region are formed on the top surface of the thermopile sensor chip, and the first temperature measuring chip is disposed near the hot junction region so as to sense the external environment temperature and the temperature of the object to be measured; the second temperature measuring chip is arranged close to the cold junction area so as to sense the whole temperature of the thermopile sensor chip.
As a further improvement of the invention, the first temperature measuring chip is an infrared temperature measuring chip, and the second temperature measuring chip is an induction chip.
As a further improvement of the invention, the thermopile sensor further comprises a first heat insulation part annularly arranged at the periphery and the bottom of the heater and a second heat insulation part positioned above the thermopile sensor chip, and a positioning part is further arranged between the second heat insulation part and the thermopile sensor chip to limit the thermopile sensor chip.
As a further improvement of the present invention, the second heat insulating component and the positioning component are both provided with openings, and the openings correspond to the hot junction regions, so that the first temperature measuring chip can sense the external environment temperature and the temperature of the object to be measured through the openings.
As a further improvement of the invention, the thermopile sensor further comprises a shielding cover covering the outer sides of the thermopile sensor chip, the heater and the control component, and the shielding cover comprises a cover body and a metal film plated on the outer side of the cover body.
As a further improvement of the invention, the cover shell body is made of plastic, and the heater is an electric heating coil.
In order to achieve the above object, the present invention further provides a control method of a thermopile sensor, which mainly comprises the following steps:
acquiring the external environment temperature sensed by the first temperature measuring chip;
acquiring the integral temperature of the thermopile sensor chip sensed by the second temperature measuring chip;
and if the external environment temperature is higher than the overall temperature of the thermopile sensor chip, increasing the heating power of the heater until the overall temperature of the thermopile sensor chip is consistent with the external environment temperature.
As a further improvement of the invention, in the heating process of the heater, the first temperature measuring chip monitors the external environment temperature in real time, and the second temperature measuring chip monitors the whole temperature of the thermopile sensor chip in real time.
The invention has the beneficial effects that: according to the thermopile sensor, the first temperature measuring chip and the second temperature measuring chip are integrated in the thermopile sensor chip, so that the external environment temperature can be sensed by using the first temperature measuring chip, the overall temperature of the thermopile sensor chip can be sensed by using the second temperature measuring chip, and further, when the external environment temperature is higher than the overall temperature of the thermopile sensor chip, the heating power of the heater can be adjusted by the control assembly, so that the overall temperature of the thermopile sensor chip is consistent with the external environment temperature, and at the moment, no matter what high-temperature environment is in, the thermopile sensor can normally work, and the detection precision and stability can be well guaranteed.
Drawings
FIG. 1 is a perspective view of a thermopile sensor of the present invention.
Fig. 2 is an exploded view of the thermopile sensor shown in fig. 1.
Fig. 3 is a perspective view of the thermopile sensor chip of fig. 2.
FIG. 4 is another angular perspective view of the thermopile sensor chip shown in FIG. 3.
Fig. 5 is an exploded view of the shield of fig. 2.
FIG. 6 is a flow chart of a control method of the thermopile sensor of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in detail with reference to the accompanying drawings and specific embodiments.
As shown in fig. 1 and 2, the present invention discloses a thermopile sensor 100, which includes a thermopile sensor chip 10, a heater 20, a control unit (not shown) for controlling the heater 20 to heat the thermopile sensor chip 10, a heat insulation member for insulating the thermopile sensor chip 10 and the heater 20, and an infrared filter 30 located above the thermopile sensor chip 10. The thermopile sensor 100 is mainly applied to a high-temperature environment and is used for solving the problems that the high-temperature environment affects the temperature of a human body, so that temperature measurement data is inaccurate and the temperature measurement precision is low.
As shown in fig. 3 and 4, the thermopile sensor chip 10 may be prepared based on a silicon substrate 11, and includes a first temperature measuring chip 12 and a second temperature measuring chip 13 integrated on the silicon substrate 11, where the first temperature measuring chip 12 is configured to sense an external environment temperature and a temperature of an object to be measured, and the second temperature measuring chip 13 is configured to sense an overall temperature of the thermopile sensor chip 10. The first temperature measurement chip 12 and the second temperature measurement chip 13 are integrated on the silicon substrate 11, so that the size of the thermopile sensor chip 10 is reduced, the number of the temperature measurement sensors is reduced, the detection of the environment temperature and the temperature of an object to be detected can be realized at the moment, and meanwhile, a data source and a data support can be provided for the work of the control assembly.
When the external environment temperature sensed by the first temperature measuring chip 12 is higher than the overall temperature of the thermopile sensor chip 10 sensed by the second temperature measuring chip 13, the control component controls the heater 20 to work and adjusts the heating power of the heater 20, so that the overall temperature of the thermopile sensor chip 10 is consistent with the external environment temperature. Preferably, when the temperature difference between the external environment temperature and the overall temperature of the thermopile sensor chip 10 is greater than a set value, the control component may rapidly increase the heating power of the heater 20, so that the heater 20 rapidly heats; when the temperature difference between the external environment temperature and the overall temperature of the thermopile sensor chip 10 is less than the set value, the control component may slowly increase the heating power of the heater 20, so that the heater 20 slowly heats up. The above-mentioned "set value" may be set according to actual conditions, and no limitation is made to a specific numerical value or range.
Through the regulation to the heating power of heater 20, thermopile sensor chip 10 can keep unanimous with external environment temperature, and when external environment changed, heater 20 can quick response carry out thermal balance, prevents that external environment from producing the influence to the temperature test, has improved the temperature measurement precision. Or, because there is heat conduction between the first temperature measuring chip 12 and the second temperature measuring chip 13, the temperature of the first temperature measuring chip 12 is the same as the overall temperature of the thermopile sensor chip 10, and at this time, it can also be understood that: the heater 20 is designed to keep the temperature of the first temperature measuring chip 12 consistent with the temperature of the external environment, so that the temperature of the object to be measured can be measured more accurately.
First temperature measurement chip 12 and second temperature measurement chip 13 all set up the top of thermopile sensor chip 10, in this application, first temperature measurement chip 12 is the infrared ray temperature measurement chip, second temperature measurement chip 13 is the response chip, but should not use this as the limit. The bottom of the silicon substrate 11 is correspondingly provided with a Flexible Printed Circuit (FPC)14, and the first temperature measuring chip 12 and the second temperature measuring chip 13 are both connected with the control assembly through the FPC 14, so that power control and signal transmission between the control assembly and the first temperature measuring chip 12 and between the control assembly and the second temperature measuring chip 13 are realized.
A hot junction region 101 and a cold junction region 102 located at the periphery of the hot junction region 101 are formed on the top surface of the thermopile sensor chip 10, and the first temperature measuring chip 12 is arranged close to the hot junction region 101 so as to conveniently sense the external environment temperature and the temperature of an object to be measured; the second temperature measuring chip 13 is disposed near the cold junction region 102 to sense the overall temperature of the thermopile sensor chip 10.
The thermal junction region 101 may be made of a thin film material, and is configured to absorb infrared rays of an external environment to sense an external environment temperature; the cold junction region 102 is disposed at the periphery of the top surface of the thermopile sensor chip 10, or the cold junction region 102 may be disposed on the side surface of the thermopile sensor chip 10. Of course, it should be noted that in the embodiment of the present application, the thermopile sensor chip 10 may use a substrate made of any other material, and the material and the structural shape of the hot junction region 101 and the cold junction region 102 are not limited in the present application, and in addition, the thermopile sensor chip 10 may also use the hot junction region 101 with a virtual floating structure, which is not described herein again.
As shown in fig. 2, the heater 20 is disposed around the periphery of the thermopile sensor chip 10 for heating the thermopile sensor chip 10. The heater 20 is a controllable heater, such as an electric heating film, a nanometer rare earth heating plate, an electric heating coil, etc.; in the present embodiment, the heater 20 is preferably an electric heating coil, and the heating power is controlled by controlling the current and voltage of the electric heating coil 20.
The infrared filter 30 is located above the thermopile sensor chip 10, and is configured to filter light in an external environment, so that infrared rays are irradiated on the thermal junction region 101.
The heat insulation part comprises a first heat insulation part 41 and a second heat insulation part 42, wherein the first heat insulation part 41 is arranged on the periphery and the bottom of the heater 20 in a surrounding mode, the second heat insulation part 42 is arranged above the thermopile sensor chip 10, and the first heat insulation part 41 and the second heat insulation part 42 are matched with each other to insulate the periphery of the thermopile sensor chip 10 and the periphery of the heater 20. The heat insulation component is made of materials with high heat insulation coefficient, such as aerogel films, aerogel sheets and the like, so that in the working process of the heater 20, heat conduction loss can be reduced, heating times are reduced, power consumption is reduced, and the thermopile sensor 100 is guaranteed to work at a stable temperature.
The first heat insulation component 41 comprises a first part 411 arranged around the heater 20 in a surrounding manner and a second part 412 arranged at the bottom of the heater 20, wherein the second part 412 is connected with the first part 411 to coat the periphery and the bottom of the heater 20 and the thermopile sensor chip 10, so that the heat conduction loss of the heater 20 in the working process is reduced. Of course, in other embodiments, the first heat insulation component 41 may also be integrally disposed, and in this case, only a groove needs to be formed in the center of the first heat insulation component 41 for placing the heater 20 and the thermopile sensor chip 10, so as to achieve the purpose of reducing heat conduction loss.
A positioning part 43 is further disposed between the second heat insulation part 42 and the thermopile sensor chip 10, and the positioning part 43 is used for limiting the thermopile sensor chip 10. The second heat insulation component 42 and the positioning component 43 are both arranged in a sheet or plate shape, and openings are formed in the second heat insulation component 42 and the positioning component 43. The opening of the second heat insulation component 42 is defined as a first opening 421, the opening of the positioning component 43 is defined as a second opening 431, and the first opening 421 and the second opening 431 correspond to the thermal junction region 101, so that the first temperature measuring chip 12 senses the external environment temperature and the temperature of the object to be measured through the first opening 421 and the second opening 431.
Of course, the size of the first opening 421 is smaller than the size of the second opening 431 because: the second opening 431 also limits the thermopile sensor chip 10 to prevent the thermopile sensor chip 10 from moving in the front, rear, left, and right directions, so the size of the second opening 431 needs to be slightly larger than the size of the thermopile sensor chip 10; and the first opening 421 only needs to achieve the exposure of the thermal junction region 101, the size of the first opening 421 may be set to be smaller than that of the second opening 431.
In this application, first portion 411 and second portion 412 are aerogel pieces, second heat-insulating component 42 is the aerogel membrane, and the homoenergetic plays thermal-insulated efficiency. The infrared filter 30 is packaged on top of the second heat insulating member 42 to filter light in the external environment, so that infrared rays are irradiated to the thermal junction region 101.
In order to prevent the thermal shock of the external environment from affecting the thermopile sensor chip 10, the thermopile sensor 100 of the present application further includes a shielding cover 50 covering the outside of the thermopile sensor chip 10, the heater 20, and the control component.
As shown in fig. 5, the shielding case 50 is composed of a case body and a metal film plated on the outer side of the case body, the case body is made of heat-insulating plastic and can play a role in heat preservation, and the metal film can play a role in shielding. Compared with a shielding case made of a metal material, the shielding case 50 of the present invention can simultaneously perform the functions of heat preservation and shielding.
The shielding case 50 comprises an upper case 51 and a lower case 52 which are assembled and fixed with each other, wherein the upper case 51 covers the infrared filter 30, the thermopile sensor chip 10, the heater 20 and the heat insulation component; the lower casing 52 is positioned at the bottom of the first heat insulating member 41 so that the inner wall of the upper casing 51 and the top wall of the lower casing 52 form a hollow closed space. The infrared filter 30, the positioning member 43, the thermopile sensor chip 10, and the heater 20 are all accommodated in the closed space, and the heat insulation member fills up the gap in the closed space, so that the heat insulation and heat preservation effects are optimal, the heat energy dissipation and consumption are reduced, the temperature variation range is reduced, the opening times of the heater 20 are reduced, and the purpose of reducing the overall power consumption is achieved.
The upper cover shell 51 is arranged in a bottom opening shape, the bottoms of two opposite side walls 511 of the upper cover shell 51 are both provided with clamping grooves 512, two opposite side walls of the lower cover shell 52 are correspondingly and convexly provided with convex strips 521, and the convex strips 521 are clamped in the corresponding clamping grooves 512, so that the upper cover shell 51 and the lower cover shell 52 are assembled and fixed.
A circular through hole 513 is formed at the top of the upper casing 51, and the through hole 513 corresponds to the thermal junction region 101, so that light in the external environment can enter the infrared filter 30 through the through hole 513 to be filtered, and infrared rays can be irradiated on the thermal junction region 101.
In order to correspond to the above-described embodiments of the thermopile sensor 100, the present invention also provides a control method of the thermopile sensor 100.
As shown in fig. 6, the control method of the thermopile sensor 100 of the present invention mainly includes the following steps:
s1, acquiring the external environment temperature sensed by the first temperature measuring chip 12;
s2, acquiring the overall temperature of the thermopile sensor chip 10 sensed by the second temperature measuring chip 13;
s3, if the external environment temperature is higher than the overall temperature of the thermopile sensor chip 10, the heating power of the heater 20 is increased until the overall temperature of the thermopile sensor chip 10 is consistent with the external environment temperature.
Step S1 specifically includes: the first temperature measurement chip 12 sends the sensed external environment temperature to the control assembly through the flexible circuit board 14, so that the control assembly can acquire the external environment temperature in real time.
Step S2 specifically includes: the second temperature measurement chip 13 sends the sensed overall temperature of the thermopile sensor chip 10 to the control assembly through the flexible circuit board 14, so that the control assembly can acquire the overall temperature of the thermopile sensor chip 10 in real time. In the initial state, the hot junction region 101 and the cold junction region 102 have the same temperature; only under infrared radiation, the temperature of the hot junction region 101 changes according to the radiation energy of the infrared.
Step S3 specifically includes: when the external environment temperature is higher than the overall temperature of the thermopile sensor chip 10, it indicates that the external environment at this time is a high temperature environment, in order to avoid the influence of the high temperature environment on the human body temperature, which further causes the inaccuracy of the temperature measurement data of the thermopile sensor 100, the control component needs to increase the voltage or current applied to the heater 20, so as to increase the heating power (i.e. rapid heating) of the heater 20, and the overall temperature of the thermopile sensor chip 10 is kept consistent with the external environment temperature.
Of course, in the heating process of the heater 20, the first temperature measurement chip 12 monitors the external environment temperature in real time, and the second temperature measurement chip 13 also monitors the overall temperature of the thermopile sensor chip 10 in real time, so that once the overall temperature of the thermopile sensor chip 10 is consistent with the external environment temperature, the control component can immediately control the heater 20 to stop working or reduce the heating power of the heater 20.
In summary, in the thermopile sensor 100 of the present invention, the first temperature measuring chip 12 and the second temperature measuring chip 13 are integrated inside the thermopile sensor chip 10, so that the first temperature measuring chip 12 can be used to sense the external environment temperature, the second temperature measuring chip 13 can be used to sense the overall temperature of the thermopile sensor chip 10, and further, when the external environment temperature is higher than the overall temperature of the thermopile sensor chip 10, the heating power of the heater 20 can be adjusted by the control component, so that the overall temperature of the thermopile sensor chip 10 is consistent with the external environment temperature, and at this time, no matter in which high temperature environment, the thermopile sensor 100 can work normally, and the detection accuracy and stability can be better guaranteed, thereby solving the problems of inaccurate measurement data and low measurement accuracy of the infrared temperature measuring instrument in the high temperature environment.
Although the present invention has been described in detail with reference to the preferred embodiments, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted for elements thereof without departing from the spirit and scope of the present invention.
Claims (10)
1. A thermopile sensor comprising a thermopile sensor chip, a heater, and a control assembly for controlling the heater to heat the thermopile sensor chip, characterized in that: the temperature measuring device comprises a thermopile sensor chip, and is characterized in that a first temperature measuring chip and a second temperature measuring chip are integrated in the thermopile sensor chip, the first temperature measuring chip is used for sensing the external environment temperature and the temperature of an object to be measured, the second temperature measuring chip is used for sensing the overall temperature of the thermopile sensor chip, when the external environment temperature sensed by the first temperature measuring chip is higher than the overall temperature of the thermopile sensor chip sensed by the second temperature measuring chip, the control component adjusts the heating power of the heater, and the overall temperature of the thermopile sensor chip is consistent with the external environment temperature.
2. The thermopile sensor of claim 1, wherein: the first temperature measuring chip and the second temperature measuring chip are arranged on the top of the thermopile sensor chip, and the heater is annularly arranged on the peripheral side face of the thermopile sensor chip.
3. The thermopile sensor of claim 2, wherein: the top surface of the thermopile sensor chip is provided with a hot junction area and a cold junction area positioned at the periphery of the hot junction area, and the first temperature measuring chip is arranged close to the hot junction area so as to sense the external environment temperature and the temperature of an object to be measured; the second temperature measuring chip is arranged close to the cold junction area so as to sense the whole temperature of the thermopile sensor chip.
4. The thermopile sensor of claim 3, wherein: the first temperature measurement chip is an infrared temperature measurement chip, and the second temperature measurement chip is an induction chip.
5. The thermopile sensor of claim 3, wherein: the thermopile sensor further comprises a first heat insulation part arranged around the heater and at the bottom of the heater and a second heat insulation part arranged above the thermopile sensor chip, and a positioning part is arranged between the second heat insulation part and the thermopile sensor chip to limit the thermopile sensor chip.
6. The thermopile sensor of claim 5, wherein: openings are formed in the second heat insulation part and the positioning piece, and the openings correspond to the hot junction areas, so that the first temperature measurement chip can sense the temperature of the external environment and the temperature of an object to be measured through the openings.
7. The thermopile sensor of claim 1, wherein: the thermopile sensor further comprises a shielding cover which covers the outer sides of the thermopile sensor chip, the heater and the control assembly, and the shielding cover comprises a cover body and a metal film plated on the outer side of the cover body.
8. The thermopile sensor of claim 7, wherein: the shell body is made of plastic, and the heater is an electric heating coil.
9. A control method of a thermopile sensor applying the thermopile sensor described in any one of claims 1-8, characterized by mainly comprising the steps of:
acquiring the external environment temperature sensed by the first temperature measuring chip;
acquiring the integral temperature of the thermopile sensor chip sensed by the second temperature measuring chip;
and if the external environment temperature is higher than the overall temperature of the thermopile sensor chip, increasing the heating power of the heater until the overall temperature of the thermopile sensor chip is consistent with the external environment temperature.
10. The control method of the thermopile sensor according to claim 9, characterized in that: in the heating process of the heater, the first temperature measuring chip monitors the external environment temperature in real time, and the second temperature measuring chip monitors the whole temperature of the thermopile sensor chip in real time.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202010727788.1A CN111721426A (en) | 2020-07-23 | 2020-07-23 | Thermopile sensor and control method thereof |
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| CN202010727788.1A CN111721426A (en) | 2020-07-23 | 2020-07-23 | Thermopile sensor and control method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI811628B (en) * | 2021-02-04 | 2023-08-11 | 緯創資通股份有限公司 | Electronic device and thermal insulation module thereof |
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| CN107389206A (en) * | 2017-06-12 | 2017-11-24 | 上海烨映电子技术有限公司 | A kind of thermopile sensor and its control method |
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Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107389206A (en) * | 2017-06-12 | 2017-11-24 | 上海烨映电子技术有限公司 | A kind of thermopile sensor and its control method |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI811628B (en) * | 2021-02-04 | 2023-08-11 | 緯創資通股份有限公司 | Electronic device and thermal insulation module thereof |
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