CN111681997B - Power package module and electronic device - Google Patents

Power package module and electronic device Download PDF

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Publication number
CN111681997B
CN111681997B CN202010804242.1A CN202010804242A CN111681997B CN 111681997 B CN111681997 B CN 111681997B CN 202010804242 A CN202010804242 A CN 202010804242A CN 111681997 B CN111681997 B CN 111681997B
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Prior art keywords
pin
auxiliary
power
injection molding
pins
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CN202010804242.1A
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CN111681997A (en
Inventor
袁嘉隆
陈祖银
姜贯军
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Semiconductor Manufacturing Electronics Shaoxing Corp SMEC
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SMIC Manufacturing Shaoxing Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49517—Additional leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49575—Assemblies of semiconductor devices on lead frames
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/2612—Auxiliary members for layer connectors, e.g. spacers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
    • H01L2224/331—Disposition
    • H01L2224/3318—Disposition being disposed on at least two different sides of the body, e.g. dual array
    • H01L2224/33181—On opposite sides of the body

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Inverter Devices (AREA)

Abstract

The invention provides a power packaging module and an electronic device. Through the protruding of only inserting of injection moulding direct formation on the injection molding body, can prevent the excessive problem of inserting of auxiliary pin on the PCB board when inserting auxiliary pin to the PCB board, play with the good complex effect of PCB board. And the auxiliary pins can be inserted into the PCB in a straight needle form, so that a bending forming die and a bending forming process are not needed, and the product cost is greatly reduced. In addition, the insertion stopping protrusion can be arranged between the auxiliary pins with high-low voltage difference, so that the creepage distance between the high-low voltage auxiliary pins is greatly increased, the safety is enhanced, and the system application from low voltage to medium-high voltage is met.

Description

Power package module and electronic device
Technical Field
The present invention relates to the field of power module design technologies, and in particular, to a power package module and an electronic device.
Background
With the vigorous development of electric vehicles, the power module, which is the core component of the main drive motor, not only needs to satisfy the high power output of the electric vehicle, but also needs to have the characteristics of compact size and light weight, so as to facilitate the actual installation in application and reduce the overall size and weight of the electric control component. In order to improve the power density and reduce the voltage overshoot, the internal chip has a higher rated output current, which requires the power module to have a better design structure, thereby obtaining the characteristics of low thermal resistance and low stray inductance.
The existing power module in the form of double-sided heat dissipation package generally has the following defects:
1. the functional pins all extend out from the injection molding body of the power module and are exposed in the air, and in normal operation, some pins can bear high voltage, and for this reason, they need to satisfy creepage distance and electric clearance's safety requirement simultaneously, and generally speaking, creepage distance's design value usually can be greater than electric clearance's design value, but, the creepage distance between enlarged pin and the pin can increase the size of packaging body to increase product cost.
2. Usually, a part of auxiliary pins are assembled with the PCB after being bent, and the bent pins can play a role of inserting stopping and prevent the auxiliary pins from being excessively inserted into the PCB.
Disclosure of Invention
The invention aims to provide a power packaging module and an electronic device, which can reduce implementation procedures, can achieve the effect of good matching with a PCB (printed circuit board), and saves cost.
To solve the above technical problem, the present invention provides a power package module, including:
the structure to be plastically packaged is provided with at least one chip;
one end of each power pin is welded to the structure to be plastically packaged;
one end of each auxiliary pin is welded to the structure to be plastically packaged;
the injection molding body is provided with at least one insertion stopping protrusion, the injection molding body wraps the edge area of the plastic packaging structure and the power pin at one end and the auxiliary pin at one end and exposes the heat dissipation surface of the plastic packaging structure, the other end of the power pin and the other end of the auxiliary pin extend out of the injection molding body, each insertion stopping protrusion is integrally formed with the injection molding body and arranged between two adjacent auxiliary pins, and the insertion stopping protrusion length is smaller than the length of the auxiliary pin extending out of the injection molding body.
Optionally, the insertion stopping protrusion is disposed between two adjacent auxiliary pins with a voltage difference different from 0, and a gap is formed between the auxiliary pins adjacent to two sides.
Optionally, a plurality of auxiliary pins welded on the same side of the structure to be plastic-sealed are distributed according to an array and comprise an upper half-bridge pin array and a lower half-bridge pin array which are parallel, and the number of the insertion stopping protrusions clamped in the upper half-bridge pin array and the lower half-bridge pin array is the same.
Optionally, the auxiliary pins of the upper half-bridge pin array and the lower half-bridge pin array each include a voltage sensor output pin and a gate, and the insertion stop protrusion is disposed between the voltage sensor output pin and the gate.
Optionally, the width of the gap between each insertion stop protrusion and the auxiliary pin adjacent to the two sides of the insertion stop protrusion is at least 1 mm.
Optionally, the line width of each insertion stop protrusion is 3 mm-5 mm.
Optionally, the difference between the protruding length of each insertion stop protrusion and the length of the auxiliary pin protruding from the injection molding body is 3.5 mm-4.5 mm.
Optionally, the insertion stop protrusion is a polygonal prism or a cylinder.
Optionally, the structure to be plastically packaged comprises a lower substrate, a chip, a gasket and an upper substrate which are stacked in sequence from bottom to top; the one end of each of the auxiliary pins and the one end of each of the power pins are soldered to the lower substrate; and the heat dissipation surface of the structure to be plastically packaged comprises the upper surface of the upper substrate exposed by the injection molding body and the lower surface of the lower substrate exposed by the injection molding body.
Based on the same inventive concept, the present invention also provides an electronic device, comprising:
a PCB board;
according to the power package module, the other end of each auxiliary pin of the power package module is inserted onto the PCB in a straight needle holding mode, and the insertion stopping protrusion is in contact with the PCB;
and the heat dissipation mechanism is in contact with the upper surface and/or the lower surface of the structure to be subjected to plastic packaging of the power packaging module.
Compared with the prior art, the technical scheme of the invention has at least one of the following beneficial effects:
1. through the protruding of only inserting of injection moulding direct formation on the injection molding body, can prevent the excessive problem of inserting of auxiliary pin on the PCB board when inserting auxiliary pin to the PCB board, play with the good complex effect of PCB board.
2. The auxiliary pins can be inserted into the PCB in a straight needle form, so that a bending forming die and a bending forming process are not needed, and the product cost is greatly reduced.
3. The insertion stopping protrusion can be arranged between the auxiliary pins with high-low voltage difference, so that the creepage distance between the high-low voltage auxiliary pins is greatly increased, and the safety is enhanced, so that the system application from low voltage to medium-high voltage is met.
Drawings
Fig. 1 is a schematic structural diagram of a power package module according to an embodiment of the invention.
Fig. 2 is a schematic cross-sectional view of a power package module according to an embodiment of the invention.
Fig. 3 is an enlarged schematic view of a partial structure of a power package module according to an embodiment of the invention.
Fig. 4 is a schematic diagram of an internal circuit structure of a power package module according to an embodiment of the invention.
Fig. 5 is a schematic front view illustrating an assembled power package module and PCB board according to an embodiment of the invention.
Fig. 6 is a schematic perspective view illustrating an assembled power package module and PCB according to an embodiment of the invention.
Detailed Description
The technical solution proposed by the present invention will be further described in detail with reference to the accompanying drawings and specific embodiments. The advantages and features of the present invention will become more apparent from the following description. It is to be noted that the drawings are in a very simplified form and are not to precise scale, which is merely for the purpose of facilitating and distinctly claiming the embodiments of the present invention. As used herein, "and/or" means either or both.
Referring to fig. 1, an embodiment of the invention provides a power package module, including: the device comprises a structure to be plastic-sealed 22, an injection molding body 21 with at least one insertion stopping protrusion, a plurality of auxiliary pins 1-12 and a plurality of power pins 13-15.
Referring to fig. 2, the structure to be plastic-encapsulated 22 includes a lower substrate 223, at least one chip 224, a spacer 222, and an upper substrate 221 sequentially stacked from bottom to top.
Both the lower substrate 223 and the upper substrate 221 may be obtained by Direct Bonding Copper (DBC) or Active Metal Bonding (AMB), the lower substrate 223 and the upper substrate 221 are made of three layers, the upper and lower layers are conductive layers (e.g., Copper layers), and the middle layer is an insulating layer. The insulating layer may be Al2O3、AlN、Si3N4Or other ceramic materials. The power pins 13-15 and the auxiliary pins 1-12 are all welded on the lower substrate 223 at the periphery of the chip 224. The bottom surface of the lower substrate 223 (also referred to as the lower surface of the lower substrate 223) and the top surface of the upper substrate 221 (also referred to as the upper surface of the upper substrate 221) are exposed by the injection molded body 21 so as to contact with the heat dissipation mechanism, so as to form a double-sided heat dissipation manner for double-sided heat dissipation of the power module. The packaging form of the double-sided heat dissipation mode has the advantages of low thermal resistance and low inductance.
Of course, in other embodiments of the present invention, the injection molded body 21 may be exposed only to the bottom surface of the lower substrate 223 or the top surface of the upper substrate 221, as required, so that the bottom surface of the lower substrate 223 or the top surface of the upper substrate 221 contacts the heat dissipation mechanism to form a single-sided heat dissipation manner.
The pad 222 is typically a metal pad, and is usually made of MoCu alloy or other metal material. The structure to be plastic-encapsulated 22 at least includes one chip 224, and the type of the chip 224 may be any of the following options: insulated Gate Bipolar Transistors (IGBTs), super junction Field Effect Transistors (FETs), Metal Oxide Semiconductor Field Effect Transistors (MOSFETs), silicon carbide MOSFETs, silicon carbide IGBTs, gallium nitride high electron mobility transistors (GaN HEMTs), and the like.
Here, the upper substrate 221, the chips 224, the lead frame to which the power pins 13 to 15 are connected, the auxiliary pins 1 to 12, and the pads 222 are generally assembled on the upper surface of the upper conductive layer of the lower substrate 223 through a corresponding solder layer 225 by a reflow soldering process, a silver sintering process, an ultrasonic soldering process, or the like. Specifically, when a reflow soldering process or a silver sintering process is used, one end of each of the auxiliary pins 1 to 12 and one end of each of the power pins 13 to 15 on the lead frame are respectively soldered to the upper surface of the upper conductive layer of the lower substrate 223 through a corresponding soldering layer 225, and the soldering layer 225 may be a lead-containing or lead-free solder or sintered silver. When the ultrasonic welding process is adopted, the auxiliary pins 1-12, the power pins 13-15 and the metal material of the upper conductive layer of the lower substrate 223 can be utilized to directly weld the auxiliary pins 1-12 and the power pins 13-15 to the lower substrate 223, so that an additional welding layer is not needed, the firmness of the joint of the auxiliary pins 1-12 and the power pins 13-15 with the lower substrate 223 can be enhanced by the mode, and the contact resistance of the joint surface of the auxiliary pins 1-12 and the power pins 13-15 is reduced.
As an example, the ends of the auxiliary pins 1 to 12 and the power pins 13 to 15, which are bonded to the lower substrate 223, are all welding-type ends, and the lower surfaces of the ends are welding surfaces, and the welding surfaces are welded to the lower substrate 223 through an ultrasonic welding process, so that the auxiliary pins 1 to 12 and the power pins 13 to 15 are electrically bonded to the structure to be plastic-encapsulated 22 respectively, and in this way, no additional welding layer is needed, the contact resistance of the auxiliary pins 1 to 12 and the power pins 13 to 15, which are bonded to the lower substrate 223 respectively, can be reduced, and the reliability is higher. As another example, the auxiliary leads 1 to 12 and the power leads 13 to 15 are soldered to the lower substrate 223 at one end, and the lower surface is a soldering surface, and a soldering layer 225 formed by a reflow soldering process or a silver sintering process is soldered to the lower substrate 223, wherein the soldering layer 225 may be one of a lead-containing solder, a lead-free solder and a sintered silver. The other ends of the power pins 13 to 15 are terminals for externally connecting a dc power supply or terminals for externally connecting an ac power supply, and can be connected to a positive electrode or a negative electrode of an external power supply (e.g., a dc power supply) or can be connected to an ac power supply. In this embodiment, the other end of the power pins 13 to 15 is provided with a connecting hole, the connecting hole is suitable for a screw connection mode, and the power pins 13 to 15 and the positive and negative electrodes of the DC power supply can be locked by screws, so that the connection with an external power supply can be facilitated.
In this embodiment, the number of the power pins 13 to 15 is 3, which are a power supply positive power pin, an alternating current output power pin and a power supply negative power pin, and the number of the auxiliary pins 1 to 12 is 12, which includes a voltage sensor output pin, a gate, a current sensor output pin, an auxiliary emitter pin, a temperature sensor negative electrode and a temperature sensor positive electrode. In other embodiments of the present invention, the number of the auxiliary pins 1 to 12 may be more, and may be at least one or more of a temperature sensor anode, a temperature sensor cathode, a current sensor output end, a voltage sensor output end, and a gate. The power module made from the semi-finished power module is connected to the AC side (e.g., motor) and DC side (e.g., battery) through respective power pins 13-15, and to the PCB board through its respective auxiliary pins 1-12 to enable connection to electronics such as gate drivers, current sensors, voltage sensors, etc.
In addition, it should be noted that the layout of the power pins 13-15 and the auxiliary pins 1-12 ensures good balance between the symmetry of the current loop and the power distribution during the operation of the power module.
In the embodiment, all the power pins 13-15 are distributed on one side of the structure to be plastic-packaged 22, one end of each power pin is welded to the structure to be plastic-packaged 22, all the auxiliary pins 1-12 are distributed on the other side of the structure to be plastic-packaged 22, one end of each auxiliary pin is welded to the structure to be plastic-packaged 22, and the other ends of the auxiliary pins 1-12 are aligned and located on the same horizontal plane.
The injection molding body 21 is molded on the structure 22 to be subjected to plastic package through an injection molding process, the edge area of the structure 22 to be subjected to plastic package, one end of each power pin 13-15 and one end of each auxiliary pin 1-12 are wrapped inside the injection molding body, the radiating surface of the structure 22 to be subjected to plastic package is exposed, and the other end of each power pin 13-15 and the other end of each auxiliary pin 1-12 extend out of the injection molding body 21. The material of the injection molded body 21 may include epoxy resin, organic silicon compound, or the like.
Referring to fig. 1 and 4, as an example of the present embodiment, an upper half bridge arm circuit 22A and a lower half bridge arm circuit 22B are formed in a structure 22 to be plastic-sealed, the upper half bridge arm circuit 22A has an IGBT1, diodes D1 and D2, the lower half bridge arm circuit 22B has an IGBT2, a diode D3 and a diode D4, all auxiliary pins 1 to 12 are arranged according to the upper half bridge arm circuit and the lower half bridge arm circuit to be respectively connected to corresponding ends of the IGBTs 1 to 2 and the diodes D1 to D4 to form an array arrangement, specifically an upper half bridge pin array and a lower half bridge pin array are formed, the upper half bridge pin array includes six auxiliary pins, namely a voltage sensor output pin 1, a gate 2, a current sensor output pin 3, an auxiliary emitter pin 4, a temperature sensor cathode 5 and a temperature sensor anode 6, the lower half-bridge pin array comprises six auxiliary pins including a voltage sensor output pin 7, a grid 8, a current sensor output pin 9, an auxiliary emitter pin 10, a temperature sensor cathode 11 and a temperature sensor anode 12. Wherein, the voltage sensor output pin 1 and the power supply positive power pin 13 are simultaneously connected with the collector of the insulated gate bipolar transistor IGBT1 and the anode of the diode D1, the gate 2 is connected with the gate of the insulated gate bipolar transistor IGBT1, the current sensor output pin 3 is connected with the emitter of the insulated gate bipolar transistor IGBT1, the auxiliary emitter pin 4 is connected with the auxiliary emitter terminal of the insulated gate bipolar transistor IGBT1, the temperature sensor cathode 5, the AC output power pin 14, the cathode of the diode D1 and the cathode of the diode D2, the temperature sensor anode 6 is connected with the anode of the diode D2, the voltage sensor output pin 7 is connected with the collector of the insulated gate bipolar transistor IGBT1, the anode of the diode D3 and the AC output power bipolar pin 14, the gate 8 is connected with the gate of the insulated gate bipolar transistor IGBT2, the current sensor output pin 9 is connected with the emitter of the insulated gate transistor IGBT2, the auxiliary emitter terminal 10 is connected to the auxiliary emitter terminal of the IGBT2, the temperature sensor cathode 11, the cathode of the diode D3, the cathode of the diode D4, and the power supply cathode power pin 15, and the temperature sensor anode 12 is connected to the anode of the diode D4.
Injection molding body 21 is last to be provided with integrated into one piece only to insert protruding 23a, 23b, only to insert protruding 23a and set up between voltage sensor output pin 1 and grid 2 in last half-bridge pin array, only to insert protruding 23b and set up between voltage sensor output pin 7 and the grid 8 in half-bridge pin array down, promptly go up half-bridge pin array with the protruding quantity of inserting of ending that presss from both sides in the half-bridge pin array down is the same, in addition, every only to insert protruding 23a, 23 b's outstanding length is the same, and all is less than each auxiliary pin 1~12 follow the length that stretches out in injection molding body 21. And when the power packaging module works normally, a voltage difference which is not zero is formed between the output pin 7 of the voltage sensor and the grid 8.
In this embodiment, the insertion stopping protrusions 23a and 23b are directly formed on the injection molded body 21 through an injection molding process, that is, each insertion stopping protrusion 23a and 23b is integrally formed with the injection molded body 21, and each insertion stopping protrusion 23a and 23b may have a polygonal prism structure such as a rectangular parallelepiped or a square, or may have a cylindrical structure. The insertion-stopping protrusions 23a and 23b are simple in molding process and easy to manufacture, and manufacturing processes are not increased.
Referring to fig. 3, optionally, each insertion stop protrusion is disposed between two adjacent auxiliary pins with a voltage difference different from 0, and a gap D2, D3 is formed between the auxiliary pins adjacent to both sides. The width of the gaps D2 and D3 between each insertion stop protrusion and the auxiliary pins adjacent to the two sides of the insertion stop protrusion is at least 1 mm. The line width D1 of each insertion stopping protrusion is 3 mm-5 mm. The difference H between the protruding length of each insertion stop protrusion and the length of the auxiliary pin extending out of the injection molding body is 3.5 mm-4.5 mm. Taking the insertion stop protrusion 23a as an example, the line width D1 of the insertion stop protrusion 23a itself is 3mm to 5mm, for example, when the insertion stop protrusion 23a is a cylinder, the diameter D1 of the insertion stop protrusion 23a is 3mm to 5 mm. The insertion stop protrusion 23a and the voltage sensor output pin 1 and the gate 2 are provided with a gap therebetween, the width D2 of the gap between the insertion stop protrusion 23a and the voltage sensor output pin 1 is at least 1mm, the width D3 of the gap between the insertion stop protrusion 23a and the gate 2 is at least 1mm, and optionally, D2= D3.
Referring to fig. 5 and 6, the auxiliary leads 1 to 12 can be inserted into the corresponding PCB 30 in a straight manner without adding a bending mold or process, which greatly reduces the product cost, and the insertion-stopping protrusions 23a and 23b can limit the position of the PCB 30 when the auxiliary leads 1 to 12 are inserted into the PCB 30, and when the insertion-stopping protrusions 23a and 23b are pushed against the PCB 30, the maximum insertion position of the auxiliary leads 1 to 12 is reached, thereby preventing the problem of excessive insertion of the auxiliary leads 1 to 12 into the PCB 30. In addition, the insertion stopping protrusions 23a and 23b are arranged between the two auxiliary pins with high-low voltage difference, so that the creepage distance between the high-low voltage auxiliary pins can be greatly increased, the safety is enhanced, and the system application from low voltage to medium-high voltage is met.
Referring to fig. 1 to 6, the present embodiment further provides an electronic device, which includes a PCB 30, the power package module according to the present embodiment, and a heat dissipation mechanism (not shown), wherein each of the auxiliary pins 1 to 12 of the power package module is inserted into the PCB 30 in a straight pin manner. The power package module may be a single-sided heat dissipation package structure, and at this time, the heat dissipation mechanism contacts the upper surface or the lower surface of the structure 22 to be plastic-packaged of the power package module; alternatively, the power package module may be a double-sided heat dissipation package structure, and the upper surface and the lower surface of the structure 22 to be plastic-packaged of the power package module are both in contact with a heat dissipation mechanism.
In summary, in the power package module and the electronic device of the embodiment, the insertion stopping protrusion directly formed on the injection molded body by using the injection molding process can prevent the problem of excessive insertion of the auxiliary pin on the PCB when the auxiliary pin is inserted into the PCB, thereby achieving an effect of good matching with the PCB. And the auxiliary pins can be inserted into the PCB in a straight needle form, so that a bending forming die and a bending forming process are not needed, and the product cost is greatly reduced. In addition, the insertion stopping protrusion can be arranged between the auxiliary pins with high-low voltage difference, so that the creepage distance between the high-low voltage auxiliary pins is greatly increased, the safety is enhanced, and the system application from low voltage to medium-high voltage is met.
The above description is only for the purpose of describing the preferred embodiments of the present invention, and is not intended to limit the scope of the present invention, and any variations and modifications made by those skilled in the art according to the above disclosure are within the scope of the present invention.

Claims (4)

1. A power package module, comprising:
the structure to be plastically packaged is provided with at least one chip;
one end of each power pin is welded to the structure to be plastically packaged;
the auxiliary pins are welded to the structure to be plastic-packaged at one end, the auxiliary pins welded to the same side of the structure to be plastic-packaged are distributed in an array and comprise an upper half-bridge pin array and a lower half-bridge pin array which are parallel, the auxiliary pins of the upper half-bridge pin array and the lower half-bridge pin array respectively comprise an output pin and a grid of a voltage sensor which are adjacently arranged, and the voltage difference between the output pin of the voltage sensor and the grid is not 0;
the injection molding body is provided with two insertion stopping bulges, the injection molding body wraps the edge area of the structure to be plastically packaged, one end of the power pin and one end of the auxiliary pin and exposes the heat dissipation surface of the structure to be plastically packaged, the other end of the power pin and the other end of the auxiliary pin extend outwards from the injection molding body, each insertion stopping bulge and the injection molding body are integrally formed, one insertion stopping bulge is arranged between the voltage sensor output pin of the upper half-bridge pin array and the grid, the other insertion stopping bulge is arranged between the voltage sensor output pin of the lower half-bridge pin array and the grid, the protruding length of each insertion stopping bulge is smaller than the length of the auxiliary pin extending from the injection molding body, and gaps are formed between the voltage sensor output pin and the grid which are adjacent to the insertion stopping bulge and two sides of the insertion stopping bulge, the width of clearance is 1mm at least, every it is 3mm ~5mm to end insert bellied line width, every it is 3.5mm ~4.5mm to end insert bellied protruding length with the difference of auxiliary pin follow the length that stretches out in the injection molding body, it makes to end insert the arch the power encapsulation module can satisfy from low pressure to medium-high pressure system application.
2. The power package module of claim 1, wherein the insertion stop protrusion is a polygonal prism or a cylinder.
3. The power package module of claim 1, wherein the structure to be plastic encapsulated includes a lower substrate, a chip, a gasket, and an upper substrate stacked in sequence from bottom to top; the one end of each of the auxiliary pins and the one end of each of the power pins are soldered to the lower substrate; and the heat dissipation surface of the structure to be plastically packaged comprises the upper surface of the upper substrate exposed by the injection molding body and the lower surface of the lower substrate exposed by the injection molding body.
4. An electronic device, comprising:
a PCB board;
the power package module of any one of claims 1 to 3, the other end of each auxiliary pin of the power package module being plugged onto the PCB in the form of a straight pin, and a plug-stop protrusion being in contact with the PCB;
and the heat dissipation mechanism is in contact with the upper surface and/or the lower surface of the structure to be subjected to plastic packaging of the power packaging module.
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