CN111564466B - Display substrate, manufacturing method thereof and display device - Google Patents
Display substrate, manufacturing method thereof and display device Download PDFInfo
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- CN111564466B CN111564466B CN202010447638.5A CN202010447638A CN111564466B CN 111564466 B CN111564466 B CN 111564466B CN 202010447638 A CN202010447638 A CN 202010447638A CN 111564466 B CN111564466 B CN 111564466B
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- layer
- electrode
- conductive layer
- conductive
- display substrate
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- 239000000758 substrate Substances 0.000 title claims abstract description 82
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 35
- 238000000034 method Methods 0.000 claims abstract description 47
- 239000000463 material Substances 0.000 claims abstract description 23
- 238000005530 etching Methods 0.000 claims description 20
- 238000000059 patterning Methods 0.000 claims description 11
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical group [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 claims description 4
- 238000010586 diagram Methods 0.000 description 8
- 229920002120 photoresistant polymer Polymers 0.000 description 3
- 239000012780 transparent material Substances 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical group [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission in a repetitive configuration, e.g. LED bars
- H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/1201—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
Abstract
The invention provides a display substrate, a manufacturing method thereof and a display device. The display substrate comprises a substrate, a driving circuit layer and a light-emitting unit, wherein the driving circuit layer is arranged on the substrate, the driving circuit layer comprises a first conductive layer, the light-emitting unit comprises a first electrode layer, the first conductive layer and the first electrode layer are arranged at intervals through an insulating layer in an insulating mode, the display substrate further comprises a second conductive layer, the second conductive layer is respectively and electrically connected with the first conductive layer and the first electrode layer, and at least part of the second conductive layer and the first electrode layer are arranged with the same material. In this way, in the embodiment of the invention, since at least part of the second conductive layer and the first electrode layer are arranged with the same material, the alignment mark of the second conductive layer does not need to be identified separately in the subsequent process, so that the risk that the alignment mark cannot be identified due to separately manufacturing the second conductive layer can be reduced, and the reliability of the display panel can be improved.
Description
Technical Field
The invention relates to the technical field of display, in particular to a display substrate, a manufacturing method thereof and a display device.
Background
In the related art, the short reduction layer (Short reduction layer, SRL) of the display substrate is typically manufactured separately, but the second conductive layer is typically made of a transparent material, such as ITO (indium tin oxide), which leads to an unrecognizable risk of alignment marks in the subsequent process, possibly resulting in a reduced reliability of the display panel.
Disclosure of Invention
The embodiment of the invention provides a display substrate, a manufacturing method thereof and a display device, which are used for solving the problem that the reliability of the existing display substrate is reduced due to the alignment identification of the subsequent process of a short circuit reduction layer.
In order to solve the technical problems, the invention is realized as follows:
in a first aspect, an embodiment of the present invention provides a display substrate, including a substrate, a driving circuit layer located on the substrate, and a light emitting unit, where the driving circuit layer includes a first conductive layer, the light emitting unit includes a first electrode layer, the first conductive layer and the first electrode layer are spaced apart by an insulating layer and are arranged in an insulating manner, and the display substrate further includes a second conductive layer, where the second conductive layer is electrically connected to the first conductive layer and the first electrode layer, and at least a part of the second conductive layer and the first electrode layer are arranged in the same layer and the same material.
Optionally, the first electrode layer includes a plurality of electrode sub-layers that are stacked, and the second conductive layer and one of the electrode sub-layers are disposed in the same layer and the same material.
Optionally, the first electrode layer includes a first electrode sub-layer, a second electrode sub-layer and a third electrode sub-layer that are sequentially stacked along a direction away from the substrate, and the second conductive layer and the first electrode sub-layer are disposed with the same material.
Optionally, the material of the first electrode sub-layer is indium tin oxide.
Optionally, the first electrode layer includes a plurality of first electrode patterns independent of each other, the second conductive layer includes a plurality of second conductive patterns independent of each other, the second conductive patterns are in one-to-one correspondence with the first electrode patterns, and each of the second conductive patterns extends along an edge of the corresponding first electrode pattern.
In a second aspect, an embodiment of the present invention further provides a display device, including the display substrate described in any one of the above.
In a third aspect, an embodiment of the present invention further provides a method for manufacturing a display substrate, including a step of manufacturing a second conductive layer, where the display substrate includes a substrate, a driving circuit layer located on the substrate, and a light emitting unit, the driving circuit layer includes a first conductive layer, the light emitting unit includes a first electrode layer, and the display substrate further includes a second conductive layer, where the second conductive layer is electrically connected to the first conductive layer and the first electrode layer, respectively;
the step of fabricating the second conductive layer includes:
at least part of the first electrode layer and the second conductive layer are fabricated by a one-time patterning process.
Optionally, before the first electrode layer and the second conductive layer are manufactured by a one-time patterning process, the method further includes:
providing a substrate base plate;
manufacturing the first conductive layer on the substrate;
and manufacturing an insulating layer for isolating the first conductive layer and the first electrode layer.
Optionally, the fabricating the first electrode layer and the second conductive layer through a one-time patterning process includes:
sequentially forming a first electrode sub-layer, a second electrode sub-layer and a third electrode sub-layer on the substrate;
removing the parts of the second electrode sub-layer and the third electrode sub-layer, which are positioned outside the corresponding areas of the second conductive layer and the first electrode layer, through a first etching process;
and removing the parts of the second electrode sub-layer and the third electrode sub-layer corresponding to the second conductive layer and the parts of the first electrode sub-layer outside the areas corresponding to the second conductive layer and the first electrode layer through a second etching process so as to form the second conductive layer and the first electrode layer.
Optionally, removing, by the first etching process, a portion of the second electrode sub-layer and the third electrode sub-layer located outside the regions corresponding to the second conductive layer and the first electrode layer, including:
and exposing and etching the second electrode sub-layer and the third electrode sub-layer by using a semitransparent mask, wherein the transparency of the region of the semitransparent mask corresponding to the second conductive layer is larger than that of the region corresponding to the first electrode layer and smaller than that of the region outside the region corresponding to the second conductive layer and the first electrode layer.
In this way, in the embodiment of the invention, since at least part of the second conductive layer and the first electrode layer are arranged with the same material, the alignment mark of the second conductive layer does not need to be identified separately in the subsequent process, so that the risk that the alignment mark cannot be identified due to separately manufacturing the second conductive layer can be reduced, and the reliability of the display panel can be improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed in the description of the embodiments of the present invention will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings may be obtained according to these drawings without inventive effort to a person of ordinary skill in the art.
FIG. 1A is a schematic view of a display substrate in the related art;
FIG. 1B is a cross-sectional view taken along line A-A' of FIG. 1A;
FIG. 2A is a schematic diagram of a display substrate according to an embodiment of the invention;
FIG. 2B is a cross-sectional view of the solid line portion of FIG. 2A taken along the direction B-B';
FIG. 3A1 is a schematic diagram of an intermediate process for manufacturing a substrate according to an embodiment of the invention;
FIG. 3A2 is a cross-sectional view of the solid line portion of FIG. 3A1 taken along the direction C-C';
FIG. 3B1 is a schematic diagram of another intermediate process of the display substrate according to an embodiment of the invention;
FIG. 3B2 is a cross-sectional view of the solid line portion of FIG. 3B1 in the direction D-D';
FIG. 3C1 is a schematic diagram of another intermediate process of a display substrate according to an embodiment of the invention;
FIG. 3C2 is a cross-sectional view of the solid line portion of FIG. 3C1 in the direction E-E';
FIG. 4A is a schematic diagram of another intermediate process of the display substrate according to an embodiment of the invention;
FIG. 4B is a schematic diagram of another intermediate process of the display substrate according to an embodiment of the invention;
FIG. 4C is a schematic diagram of another intermediate process of the display substrate according to an embodiment of the invention;
FIG. 4D is a schematic diagram of another intermediate process of the display substrate according to an embodiment of the invention.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are some, but not all embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to fig. 1A and 1B, the related art display substrate shown in fig. 1A and 1B includes a substrate 101, a first conductive layer 102, a second conductive layer 103, an insulating layer 104, a pixel defining layer 105, and a first electrode layer 106 of a light emitting unit. As shown in fig. 1A, in the related art, the second conductive layer 103 is located between the first conductive layer 102 and the substrate base 101, and is electrically connected to the first conductive layer 102 and the first electrode layer 106, respectively.
The second conductive layer 103 in the related art needs to be fabricated before the first conductive layer 102 and the first electrode layer 106 are fabricated, and the second conductive layer 103 is typically fabricated using a transparent material, such as ITO (indium tin oxide), so that the alignment mark (mark) may be inaccurate during the subsequent exposure process.
The invention provides a display substrate.
As shown in fig. 2A and 2B, in one embodiment of the present invention, the display substrate includes a substrate 201, a driving circuit layer on the substrate 201, the driving circuit layer including a first conductive layer 202, and a light emitting unit including a first electrode layer 203, the first conductive layer 202 and the first electrode layer 203 being spaced apart and insulated by an insulating layer 205, and further, the display substrate includes a pixel defining layer 206.
The display substrate further comprises a second conductive layer 204, wherein the second conductive layer 204 is electrically connected with the first conductive layer 202 and the first electrode layer 203 respectively, and at least part of the second conductive layer 204 and the first electrode layer 203 are arranged with the same material, that is, the second conductive layer 204 and the first electrode layer 203 are manufactured simultaneously.
In this way, in the embodiment of the present invention, since at least part of the second conductive layer 204 and the first electrode layer 203 are disposed with the same material, in the subsequent process, it is not necessary to identify the alignment mark of the second conductive layer 204 alone, which can reduce the risk that the alignment mark cannot be identified due to the second conductive layer 204 alone being manufactured, and is helpful to improve the reliability of the display panel.
Optionally, the first electrode layer 203 includes a plurality of electrode sub-layers stacked, and the second conductive layer 204 is disposed with one of the electrode sub-layers and the same material.
It should be appreciated that the second conductive layer 204 is also called a short reduction layer (Short reduction layer, abbreviated as SRL) and is mainly used for providing a resistance connected between the first conductive layer 202 and the first electrode layer 203 and having a certain size. Thus, in the case where the second conductive layer 204 is provided in the same material as one electrode sub-layer of the first electrode layer 203, the cross-sectional area of the first electrode layer 203 is also relatively small, the resistivity is relatively high, and in the case where the extension length is constant, the second conductive layer 204 can provide a higher resistance.
In an alternative embodiment, the first electrode layer 203 includes a first electrode sub-layer 203A, a second electrode sub-layer 203B, and a third electrode sub-layer 203C that are sequentially stacked in a direction away from the substrate 201, and the second conductive layer 204 is provided with the same material as the first electrode sub-layer 203A.
Optionally, the first electrode layer 203 includes a plurality of first electrode patterns that are independent of each other, and the second conductive layer 204 includes a plurality of second conductive patterns that are independent of each other, where the second conductive patterns are in one-to-one correspondence with the first electrode patterns, and each of the second conductive patterns extends along an edge of the corresponding first electrode pattern.
It should be appreciated that each of the second conductive patterns corresponds to a resistance connected between the first conductive layer 202 and one of the first electrode patterns.
In the case where the cross-sectional area of the second conductive pattern perpendicular to the extending direction is constant, the length of the second conductive pattern directly affects the resistance of the conductive pattern, and thus, the length of each second conductive pattern can be adjusted as needed.
It should be understood that only the solid line portion in the B-B' direction of fig. 2A is shown in fig. 2B, and the dotted line portion is actually the extending direction of the second conductive pattern, and the extending length of the second conductive pattern may be adjusted as needed when implemented. For example, if it is desired to provide a second conductive pattern with a larger resistance, the extending direction of the second conductive pattern may be adjusted to extend longer; if it is desired to provide a relatively small resistance, the extension length of the second conductive pattern may be controlled to be relatively short.
The embodiment of the invention also provides a display device, which comprises the display substrate.
Because the technical solution of the present embodiment includes all the technical solutions of the embodiments of the display substrate, at least all the technical effects can be achieved, and the description is omitted herein.
The embodiment of the invention also provides a manufacturing method of the display substrate, which is used for manufacturing the display substrate in the embodiment of the display substrate, and the structure of the manufactured display substrate can be specifically referred to the embodiment of the display substrate and is not repeated herein.
The method for manufacturing the display substrate includes a step of manufacturing the second conductive layer 204, and the step of manufacturing the second conductive layer 204 specifically includes:
at least part of the first electrode layer and the second conductive layer are fabricated by a one-time patterning process.
In this embodiment, the fabrication of at least a portion of the first electrode layer 203 and the second conductive layer 204 is completed through one patterning process, that is, the second conductive layer 204 is not required to be completed through a single exposure etching process, so that not only the process steps are reduced, but also the use of one mask is saved, which is helpful for saving the cost.
Optionally, before the first electrode layer and the second conductive layer are manufactured by a one-time patterning process, the method further includes:
providing a substrate base plate;
manufacturing the first conductive layer on the substrate;
and manufacturing an insulating layer for isolating the first conductive layer and the first electrode layer.
As shown in fig. 3A1 and 3A2, unlike the display substrate in the related art shown in fig. 1A and 1B, in the manufacturing process of the display substrate in this embodiment, first, the first conductive layer 202 is manufactured on the substrate 201.
As shown in fig. 3B1 and 3B2, an insulating layer 205 that separates the first conductive layer 202 and the first electrode layer 203 is next fabricated.
As shown in fig. 3C1 and fig. 3C2, next, the fabrication of at least a portion of the first electrode layer 203 and the second conductive layer 204 is completed by one patterning process in one pass of the insulating layer 205 away from the substrate 201, so that one mask exposure etching process can be saved, thereby reducing the fabrication steps and helping to reduce the fabrication cost.
Finally, as shown in fig. 2A and 2B, the fabrication of the pixel defining layer 206 is completed.
Optionally, the fabricating the first electrode layer and the second conductive layer through a one-time patterning process includes:
sequentially forming a first electrode sub-layer, a second electrode sub-layer and a third electrode sub-layer on the substrate;
removing the parts of the second electrode sub-layer and the third electrode sub-layer, which are positioned outside the corresponding areas of the second conductive layer and the first electrode layer, through a first etching process;
and removing the parts of the second electrode sub-layer and the third electrode sub-layer corresponding to the second conductive layer and the parts of the first electrode sub-layer outside the areas corresponding to the second conductive layer and the first electrode layer through a second etching process so as to form the second conductive layer and the first electrode layer.
As shown in fig. 4A to 4D, it should be understood that other structures of the display substrate are omitted in fig. 4A to 4D. In the technical solution of this embodiment, the first electrode layer 203 includes a first electrode sub-layer 203A, a second electrode sub-layer 203B, and a third electrode sub-layer 203C that are sequentially stacked in a direction away from the substrate 201.
In the manufacturing process, the materials of the three electrode sublayers are formed in sequence first, in this embodiment, the materials of the first electrode sublayer 203A and the third electrode sublayer 203C are ITO, and the material of the second electrode sublayer 203B is silver (Ag) as an example.
As shown in fig. 4A, an ITO layer, an Ag layer, and an ITO layer are first formed in this order on a substrate base 201. Obviously, in practical implementation, the material may be selected according to the needs, and is not limited to this.
First, a first etching process is performed, specifically, as shown in fig. 4A, a photoresist 401 (PR) is first coated on the region corresponding to each conductive pattern of the second conductive layer 204 and the region corresponding to the first electrode layer 203.
As shown in fig. 4B, next, the second electrode sub-layer 203B and the third electrode sub-layer 203C of the region where the photoresist 401 is not coated are removed by an exposure etching process.
In an alternative embodiment, the first etching process specifically includes:
and exposing and etching the second electrode sub-layer and the third electrode sub-layer by using a semitransparent mask.
In this step, the transparency of the region of the semitransparent mask corresponding to the second conductive layer 204 is greater than the region corresponding to the first electrode layer 203 and is smaller than the region outside the region corresponding to the second conductive layer 204 and the first electrode layer 203.
It may be understood that the mask used in the first etching process is an opaque portion in the region corresponding to the first electrode layer 203, a translucent portion in the region corresponding to the second conductive layer 204, and a transparent portion in the other regions. In this way, by the first etching process, the portion corresponding to the second conductive layer 204 can be left, and the second electrode sub-layer 203B and the third electrode sub-layer 203C in the region other than the region corresponding to the second conductive layer 204 and the first electrode layer 203 can be removed.
As shown in fig. 4C, after the first etching process, the photoresist 401 of the region corresponding to the second conductive layer 204 is stripped.
Further, as shown in fig. 4D, a second etching process is performed, in which the material of the second electrode sub-layer 203B and the material of the third electrode sub-layer 203C above the second conductive layer 204 are etched away, and the remaining material of the first electrode sub-layer 203A forms each second conductive pattern of the second conductive layer 204. The areas other than the second conductive layer 204 and the first electrode layer 203 are entirely etched away so that each second conductive pattern is electrically connected to each first electrode pattern of the first electrode layer 203 only at a specific position.
The above description is only of the specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art can easily think within the technical scope of the present invention
Variations and alternatives are intended to be within the scope of the present invention. Therefore, the protection scope of the invention is subject to the protection scope of the claims.
Claims (9)
1. The display substrate is characterized by comprising a substrate, a driving circuit layer and a light-emitting unit, wherein the driving circuit layer is positioned on the substrate, the driving circuit layer comprises a first conductive layer, the light-emitting unit comprises a first electrode layer, the first conductive layer and the first electrode layer are arranged at intervals through an insulating layer in an insulating manner, the display substrate further comprises a second conductive layer, the second conductive layer is respectively and electrically connected with the first conductive layer and the first electrode layer, and at least part of the second conductive layer and the first electrode layer are arranged in the same layer and the same material;
the first electrode layer comprises a plurality of mutually independent first electrode patterns, the second conductive layer comprises a plurality of mutually independent second conductive patterns, the second conductive patterns are in one-to-one correspondence with the first electrode patterns, each second conductive pattern extends along the edge of the corresponding first electrode pattern, and the length of each second conductive pattern is determined by the required resistance connected between the first conductive layer and the first electrode pattern.
2. The display substrate of claim 1, wherein the first electrode layer comprises a plurality of electrode sublayers arranged in a stacked manner, and the second conductive layer is arranged in the same material as one of the electrode sublayers.
3. The display substrate according to claim 2, wherein the first electrode layer includes a first electrode sub-layer, a second electrode sub-layer, and a third electrode sub-layer which are sequentially stacked in a direction away from the substrate, and the second conductive layer is provided with the same material as the first electrode sub-layer.
4. The display substrate of claim 3, wherein the material of the first electrode sub-layer is indium tin oxide.
5. A display device comprising the display substrate according to any one of claims 1 to 4.
6. The manufacturing method of the display substrate is characterized by comprising the step of manufacturing a second conductive layer, wherein the display substrate comprises a substrate, a driving circuit layer and a light-emitting unit, the driving circuit layer is positioned on the substrate, the driving circuit layer comprises a first conductive layer, the light-emitting unit comprises a first electrode layer, the display substrate further comprises a second conductive layer, and the second conductive layer is respectively and electrically connected with the first conductive layer and the first electrode layer;
the step of fabricating the second conductive layer includes:
manufacturing at least part of the first electrode layer and the second conductive layer through a one-time patterning process;
the first electrode layer comprises a plurality of mutually independent first electrode patterns, the second conductive layer comprises a plurality of mutually independent second conductive patterns, the second conductive patterns are in one-to-one correspondence with the first electrode patterns, each second conductive pattern extends along the edge of the corresponding first electrode pattern, and the length of each second conductive pattern is determined by the required resistance connected between the first conductive layer and the first electrode pattern.
7. The method of manufacturing a display substrate according to claim 6, wherein before the first electrode layer and the second conductive layer are manufactured by a one-time patterning process, further comprising:
providing a substrate base plate;
manufacturing the first conductive layer on the substrate;
and manufacturing an insulating layer for isolating the first conductive layer and the first electrode layer.
8. The method of manufacturing a display substrate according to claim 6 or 7, wherein the manufacturing the first electrode layer and the second conductive layer by a one-time patterning process includes:
sequentially forming a first electrode sub-layer, a second electrode sub-layer and a third electrode sub-layer on the substrate;
removing the parts of the second electrode sub-layer and the third electrode sub-layer, which are positioned outside the corresponding areas of the second conductive layer and the first electrode layer, through a first etching process;
and removing the parts of the second electrode sub-layer and the third electrode sub-layer corresponding to the second conductive layer and the parts of the first electrode sub-layer outside the areas corresponding to the second conductive layer and the first electrode layer through a second etching process so as to form the second conductive layer and the first electrode layer.
9. The method for manufacturing a display substrate according to claim 8, wherein the removing, by the first etching process, the portions of the second electrode sub-layer and the third electrode sub-layer located outside the areas corresponding to the second conductive layer and the first electrode layer comprises:
and exposing and etching the second electrode sub-layer and the third electrode sub-layer by using a semitransparent mask, wherein the transparency of the region of the semitransparent mask corresponding to the second conductive layer is larger than that of the region corresponding to the first electrode layer and smaller than that of the region outside the region corresponding to the second conductive layer and the first electrode layer.
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1969384A (en) * | 2004-04-12 | 2007-05-23 | 伊斯曼柯达公司 | OLED device with short circuit reduction |
| CN110729337A (en) * | 2019-11-15 | 2020-01-24 | 京东方科技集团股份有限公司 | Display substrate, manufacturing method thereof and electronic device |
| CN210245502U (en) * | 2019-09-27 | 2020-04-03 | 昆山国显光电有限公司 | Display substrate, display panel and display device |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102564349B1 (en) * | 2016-09-30 | 2023-08-04 | 엘지디스플레이 주식회사 | Organic light emitting display apparatus |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1969384A (en) * | 2004-04-12 | 2007-05-23 | 伊斯曼柯达公司 | OLED device with short circuit reduction |
| CN210245502U (en) * | 2019-09-27 | 2020-04-03 | 昆山国显光电有限公司 | Display substrate, display panel and display device |
| CN110729337A (en) * | 2019-11-15 | 2020-01-24 | 京东方科技集团股份有限公司 | Display substrate, manufacturing method thereof and electronic device |
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