CN111564466A - Display substrate, manufacturing method thereof and display device - Google Patents
Display substrate, manufacturing method thereof and display device Download PDFInfo
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- CN111564466A CN111564466A CN202010447638.5A CN202010447638A CN111564466A CN 111564466 A CN111564466 A CN 111564466A CN 202010447638 A CN202010447638 A CN 202010447638A CN 111564466 A CN111564466 A CN 111564466A
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- 239000000758 substrate Substances 0.000 title claims abstract description 83
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 40
- 238000000034 method Methods 0.000 claims abstract description 46
- 239000000463 material Substances 0.000 claims abstract description 22
- 238000005530 etching Methods 0.000 claims description 20
- 238000000059 patterning Methods 0.000 claims description 11
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical group [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 claims description 4
- 238000010586 diagram Methods 0.000 description 4
- 229920002120 photoresistant polymer Polymers 0.000 description 3
- 238000006467 substitution reaction Methods 0.000 description 2
- 239000012780 transparent material Substances 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical group [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
- H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/1201—Manufacture or treatment
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The invention provides a display substrate, a manufacturing method thereof and a display device. The display substrate comprises a substrate base plate, a driving circuit layer and a light-emitting unit, wherein the driving circuit layer and the light-emitting unit are positioned on the substrate base plate, the driving circuit layer comprises a first conducting layer, the light-emitting unit comprises a first electrode layer, the first conducting layer and the first electrode layer are arranged at intervals through an insulating layer in an insulating mode, the display substrate further comprises a second conducting layer, the second conducting layer is respectively electrically connected with the first conducting layer and the first electrode layer, and at least part of the second conducting layer and at least part of the first electrode layer are arranged on the same layer and are made of the same material. In this way, in the embodiment of the present invention, since at least a part of the same layer of the second conductive layer and the first electrode layer is disposed on the same material, in the subsequent process, it is not necessary to separately identify the alignment mark of the second conductive layer, so that the risk that the alignment mark cannot be identified due to the separate fabrication of the second conductive layer can be reduced, and the improvement of the reliability of the display panel is facilitated.
Description
Technical Field
The invention relates to the technical field of display, in particular to a display substrate, a manufacturing method thereof and a display device.
Background
In the related art, when a Short Reduction Layer (SRL) of a display substrate is manufactured, the SRL is usually manufactured separately, but the second conductive layer is usually made of a transparent material, such as ITO (indium tin oxide), which may cause a risk that alignment marks in a subsequent process cannot be identified, and may cause a reduction in reliability of the display panel.
Disclosure of Invention
The embodiment of the invention provides a display substrate, a manufacturing method thereof and a display device, and aims to solve the problem that the reliability of the conventional display substrate is reduced due to the subsequent process alignment identification of a short circuit reduction layer.
In order to solve the technical problem, the invention is realized as follows:
in a first aspect, an embodiment of the present invention provides a display substrate, including a substrate, a driving circuit layer and a light emitting unit, where the driving circuit layer includes a first conductive layer, the light emitting unit includes a first electrode layer, the first conductive layer and the first electrode layer are spaced and insulated by an insulating layer, the display substrate further includes a second conductive layer, the second conductive layer is electrically connected to the first conductive layer and the first electrode layer, and at least a part of the second conductive layer and at least a part of the first electrode layer are disposed in the same layer as a material.
Optionally, the first electrode layer includes a plurality of electrode sublayers arranged in a stacked manner, and the second conductive layer and one of the electrode sublayers are arranged in the same layer and the same material.
Optionally, the first electrode layer includes a first electrode sublayer, a second electrode sublayer and a third electrode sublayer sequentially stacked in a direction away from the substrate, and the second conductive layer and the first electrode sublayer are disposed in the same layer and in the same material.
Optionally, the material of the first electrode sublayer is indium tin oxide.
Optionally, the first electrode layer includes a plurality of mutually independent first electrode patterns, the second conductive layer includes a plurality of mutually independent second conductive patterns, the second conductive patterns correspond to the first electrode patterns one to one, and each of the second conductive patterns extends along an edge of the corresponding first electrode pattern.
In a second aspect, an embodiment of the present invention further provides a display device, including the display substrate described in any one of the above.
In a third aspect, an embodiment of the present invention further provides a method for manufacturing a display substrate, including a step of manufacturing a second conductive layer, where the display substrate includes a substrate, a driving circuit layer and a light emitting unit, the driving circuit layer includes a first conductive layer, the light emitting unit includes a first electrode layer, the display substrate further includes a second conductive layer, and the second conductive layer is electrically connected to the first conductive layer and the first electrode layer, respectively;
the step of manufacturing the second conductive layer comprises the following steps:
and manufacturing at least part of the first electrode layer and the second conductive layer by a one-time patterning process.
Optionally, before the first electrode layer and the second conductive layer are manufactured by a single patterning process, the method further includes:
providing a substrate base plate;
manufacturing the first conducting layer on the substrate base plate;
and manufacturing an insulating layer for isolating the first conductive layer and the first electrode layer.
Optionally, the manufacturing the first electrode layer and the second conductive layer by a one-step patterning process includes:
sequentially forming a first electrode sublayer, a second electrode sublayer and a third electrode sublayer on the substrate base plate;
removing the second electrode sublayer and the third electrode sublayer outside the corresponding region of the second conducting layer and the first electrode layer by a first etching process;
and removing parts of the second electrode sublayer and the third electrode sublayer in the region corresponding to the second conductive layer and parts of the first electrode sublayer outside the region corresponding to the second conductive layer and the first electrode layer by a second etching process to form the second conductive layer and the first electrode layer.
Optionally, the removing, by the first etching process, portions of the second electrode sublayer and the third electrode sublayer, which are located outside the region corresponding to the second conductive layer and the first electrode layer, includes:
and exposing and etching the second electrode sublayer and the third electrode sublayer by using a semitransparent mask, wherein the transparency of a region of the semitransparent mask corresponding to the second conducting layer is greater than that of a region corresponding to the first electrode layer and is smaller than that of a region except for the region corresponding to the second conducting layer and the first electrode layer.
In this way, in the embodiment of the present invention, since at least a part of the same layer of the second conductive layer and the first electrode layer is disposed on the same material, in the subsequent process, it is not necessary to separately identify the alignment mark of the second conductive layer, so that the risk that the alignment mark cannot be identified due to separately manufacturing the second conductive layer can be reduced, and the reliability of the display panel can be improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the description of the embodiments of the present invention will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without inventive exercise.
FIG. 1A is a schematic view of a display substrate according to the related art;
FIG. 1B is a cross-sectional view taken along line A-A' of FIG. 1A;
FIG. 2A is a schematic view of a display substrate according to an embodiment of the present invention;
FIG. 2B is a cross-sectional view of the solid line portion in the direction B-B' of FIG. 2A;
FIG. 3A1 is a schematic diagram illustrating an intermediate processing of a substrate according to an embodiment of the present invention;
FIG. 3A2 is a cross-sectional view of the solid line portion in the direction C-C' of FIG. 3A 1;
FIG. 3B1 is a schematic diagram illustrating yet another intermediate processing of a substrate in accordance with an embodiment of the present invention;
FIG. 3B2 is a cross-sectional view of the solid line segment in the direction D-D' of FIG. 3B 1;
FIG. 3C1 is a schematic diagram illustrating yet another intermediate processing of a substrate in accordance with an embodiment of the present invention;
FIG. 3C2 is a cross-sectional view of the solid line portion in the direction E-E' of FIG. 3C 1;
FIG. 4A is a schematic view of a display substrate illustrating yet another intermediate process in accordance with an embodiment of the present invention;
FIG. 4B is a schematic view of a display substrate illustrating yet another intermediate process in accordance with an embodiment of the present invention;
FIG. 4C is a schematic view of a structure of a display substrate illustrating yet another intermediate process in accordance with an embodiment of the present invention;
FIG. 4D is a schematic diagram illustrating a structure of a display substrate in yet another intermediate process according to an embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without any inventive step, are within the scope of the present invention.
Referring to fig. 1A and 1B, the display substrate of the related art shown in fig. 1A and 1B includes a substrate 101, a first conductive layer 102, a second conductive layer 103, an insulating layer 104, a pixel defining layer 105, and a first electrode layer 106 of a light emitting unit. As shown in fig. 1A, in the related art, the second conductive layer 103 is located between the first conductive layer 102 and the base substrate 101, and is electrically connected to the first conductive layer 102 and the first electrode layer 106, respectively.
The second conductive layer 103 in the related art needs to be formed before forming the first conductive layer 102 and the first electrode layer 106, and the second conductive layer 103 is usually formed by a transparent material, such as ITO (indium tin oxide), so that the alignment mark (mark) may not be aligned accurately during the subsequent exposure process.
The invention provides a display substrate.
As shown in fig. 2A and 2B, in one embodiment of the present invention, a display substrate includes a substrate base substrate 201, a driving circuit layer on the substrate base substrate 201, the driving circuit layer including a first conductive layer 202, and a light emitting unit including a first electrode layer 203, the first conductive layer 202 and the first electrode layer 203 being spaced and insulated by an insulating layer 205, and further includes a pixel defining layer 206.
The display substrate further comprises a second conductive layer 204, the second conductive layer 204 is electrically connected with the first conductive layer 202 and the first electrode layer 203 respectively, at least a part of the second conductive layer 204 and the first electrode layer 203 are arranged in the same layer of the same material, that is, the second conductive layer 204 and the first electrode layer 203 are manufactured simultaneously.
Thus, in the embodiment of the invention, since at least part of the second conductive layer 204 and the first electrode layer 203 are formed of the same material, in the subsequent process, it is not necessary to separately identify the alignment mark of the second conductive layer 204, so that the risk that the alignment mark cannot be identified due to the separate manufacture of the second conductive layer 204 can be reduced, and the reliability of the display panel can be improved.
Optionally, the first electrode layer 203 includes a plurality of electrode sublayers arranged in a stacked manner, and the second conductive layer 204 is arranged in the same layer as one of the electrode sublayers.
It should be understood that the second conductive layer 204 is also called a Short Reduction Layer (SRL) and is mainly used to provide a certain amount of resistance connected between the first conductive layer 202 and the first electrode layer 203. In this way, in the case where the second conductive layer 204 is formed of the same material as one electrode sublayer of the first electrode layer 203, the cross-sectional area of the first electrode layer 203 is relatively small, and the resistivity is relatively high, and in the case where the extension length is constant, the second conductive layer 204 can provide higher resistance.
In an alternative embodiment, the first electrode layer 203 includes a first electrode sub-layer 203A, a second electrode sub-layer 203B, and a third electrode sub-layer 203C stacked in sequence along a direction away from the substrate 201, and the second conductive layer 204 and the first electrode sub-layer 203A are disposed in the same layer and the same material.
Optionally, the first electrode layer 203 includes a plurality of mutually independent first electrode patterns, the second conductive layer 204 includes a plurality of mutually independent second conductive patterns, the second conductive patterns correspond to the first electrode patterns one by one, and each second conductive pattern extends along an edge of the corresponding first electrode pattern.
It should be understood that each second conductive pattern corresponds to a resistance connected between first conductive layer 202 and a first electrode pattern.
In the case that the cross-sectional area of the second conductive pattern perpendicular to the extending direction is constant, the length of the second conductive pattern directly affects the resistance of the conductive pattern, and thus, the length of each second conductive pattern can be adjusted as required.
It should be understood that fig. 2B only shows a solid line portion in the direction of B-B' of fig. 2A, and a dotted line portion is actually an extending direction of the second conductive pattern, and the extending length of the second conductive pattern can be adjusted as needed in implementation. For example, if it is necessary to provide a second conductive pattern with a larger resistance, the extending direction of the second conductive pattern may be adjusted to make the extending length thereof longer; if it is desired to provide a relatively small resistance, the extended length of the second conductive pattern may be controlled to be relatively short.
The embodiment of the invention also provides a display device which comprises the display substrate.
Since the technical solution of this embodiment includes all technical solutions of the above display substrate embodiment, at least all technical effects can be achieved, and details are not described here.
The embodiment of the present invention further provides a manufacturing method of a display substrate, which is used for manufacturing the display substrate in the embodiment of the display substrate, and the structure of the manufactured display substrate may specifically refer to the embodiment of the display substrate, which is not described herein again.
The manufacturing method of the display substrate includes a step of manufacturing the second conductive layer 204, and the step of manufacturing the second conductive layer 204 specifically includes:
and manufacturing at least part of the first electrode layer and the second conductive layer by a one-time patterning process.
In this embodiment, at least a portion of the first electrode layer 203 and the second conductive layer 204 are fabricated by a single patterning process, that is, the second conductive layer 204 is not separately fabricated by a single exposure etching process, which not only reduces the number of process steps, but also saves the use of a mask, thereby contributing to cost saving.
Optionally, before the first electrode layer and the second conductive layer are manufactured by a single patterning process, the method further includes:
providing a substrate base plate;
manufacturing the first conducting layer on the substrate base plate;
and manufacturing an insulating layer for isolating the first conductive layer and the first electrode layer.
As shown in fig. 3a1 and fig. 3a2, unlike the display substrate in the related art shown in fig. 1A and fig. 1B, the display substrate in this embodiment is manufactured by first manufacturing the first conductive layer 202 on the substrate 201.
As shown in fig. 3B1 and 3B2, an insulating layer 205 separating the first conductive layer 202 and the first electrode layer 203 is next formed.
As shown in fig. 3C1 and fig. 3C2, next, the fabrication of at least a portion of the first electrode layer 203 and the second conductive layer 204 is completed by one patterning process at a time when the insulating layer 205 is far away from the substrate base plate 201, which can save one mask exposure etching process, thereby reducing the fabrication steps and contributing to reducing the fabrication cost.
Finally, as shown in fig. 2A and 2B, the fabrication of the pixel defining layer 206 is completed.
Optionally, the manufacturing the first electrode layer and the second conductive layer by a one-step patterning process includes:
sequentially forming a first electrode sublayer, a second electrode sublayer and a third electrode sublayer on the substrate base plate;
removing the second electrode sublayer and the third electrode sublayer outside the corresponding region of the second conducting layer and the first electrode layer by a first etching process;
and removing parts of the second electrode sublayer and the third electrode sublayer in the region corresponding to the second conductive layer and parts of the first electrode sublayer outside the region corresponding to the second conductive layer and the first electrode layer by a second etching process to form the second conductive layer and the first electrode layer.
As shown in fig. 4A to 4D, it should be understood that other structures of the display substrate are omitted in fig. 4A to 4D. In the technical solution of this embodiment, the first electrode layer 203 includes a first electrode sub-layer 203A, a second electrode sub-layer 203B, and a third electrode sub-layer 203C stacked in sequence along a direction away from the substrate base substrate 201.
In the manufacturing process, the materials of the three electrode sub-layers are sequentially formed, in this embodiment, the material of the first electrode sub-layer 203A and the third electrode sub-layer 203C is ITO, and the material of the second electrode sub-layer 203B is silver (Ag).
As shown in fig. 4A, an ITO layer, an Ag layer, and an ITO layer are first formed on a base substrate 201 in this order. Obviously, in practical implementation, the material can be selected according to the needs, and is not limited to this.
First, a first etching process is performed, specifically, as shown in fig. 4A, a photoresist 401(PR) is coated on a region corresponding to each conductive pattern of the second conductive layer 204 and a region corresponding to the first electrode layer 203.
Next, as shown in fig. 4B, the second electrode sub-layer 203B and the third electrode sub-layer 203C in the region where the photoresist 401 is not coated are removed by an exposure etching process.
In an optional embodiment, the first etching process specifically includes:
and exposing and etching the second electrode sublayer and the third electrode sublayer by using a semitransparent mask.
In this step, the transparency of the region of the semitransparent mask corresponding to the second conductive layer 204 is greater than that of the region corresponding to the first electrode layer 203 and is less than that of the region other than the region corresponding to the second conductive layer 204 and the first electrode layer 203.
It can be understood that, in the mask used in the first etching process, the region corresponding to the first electrode layer 203 is an opaque portion, the region corresponding to the second conductive layer 204 is a semi-transparent portion, and the other regions are transparent portions. In this way, by the first etching process, a portion corresponding to the second conductive layer 204 can be left, and the second electrode sublayer 203B and the third electrode sublayer 203C in the region other than the region corresponding to the second conductive layer 204 and the first electrode layer 203 are removed.
As shown in fig. 4C, after the first etching process, the photoresist 401 is stripped from the region corresponding to the second conductive layer 204.
Further, as shown in fig. 4D, a second etching process is performed, in which the material of the second electrode sub-layer 203B and the material of the third electrode sub-layer 203C above the second conductive layer 204 are etched away, and the remaining material of the first electrode sub-layer 203A forms each second conductive pattern of the second conductive layer 204. The second conductive layer 204 and the region except the first electrode layer 203 are entirely etched away so that each second conductive pattern is electrically connected to each first electrode pattern of the first electrode layer 203 only at a specific position.
The above description is only for the specific embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention, and all the changes or substitutions should be covered within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (10)
1. The display substrate is characterized by comprising a substrate base plate, a driving circuit layer and a light-emitting unit, wherein the driving circuit layer and the light-emitting unit are positioned on the substrate base plate, the driving circuit layer comprises a first conducting layer, the light-emitting unit comprises a first electrode layer, the first conducting layer and the first electrode layer are arranged at intervals through an insulating layer in an insulating mode, the display substrate further comprises a second conducting layer, the second conducting layer is electrically connected with the first conducting layer and the first electrode layer respectively, and at least part of the second conducting layer and at least part of the first electrode layer are arranged on the same layer and are made of the same material.
2. The display substrate of claim 1, wherein the first electrode layer comprises a plurality of electrode sublayers arranged in a stacked manner, and the second conductive layer is arranged in the same material as one of the electrode sublayers.
3. The display substrate according to claim 2, wherein the first electrode layer includes a first electrode sub-layer, a second electrode sub-layer, and a third electrode sub-layer sequentially stacked along a direction away from the substrate, and the second conductive layer and the first electrode sub-layer are disposed in the same layer and the same material.
4. The display substrate of claim 3, wherein the material of the first electrode sub-layer is indium tin oxide.
5. The display substrate according to any one of claims 1 to 4, wherein the first electrode layer includes a plurality of mutually independent first electrode patterns, the second conductive layer includes a plurality of mutually independent second conductive patterns, the second conductive patterns correspond to the first electrode patterns one to one, and each of the second conductive patterns extends along an edge of the corresponding first electrode pattern.
6. A display device comprising the display substrate according to any one of claims 1 to 5.
7. The manufacturing method of the display substrate is characterized by comprising the step of manufacturing a second conducting layer, wherein the display substrate comprises a substrate, a driving circuit layer and a light-emitting unit, the driving circuit layer is positioned on the substrate, the driving circuit layer comprises a first conducting layer, the light-emitting unit comprises a first electrode layer, the display substrate further comprises a second conducting layer, and the second conducting layer is electrically connected with the first conducting layer and the first electrode layer respectively;
the step of manufacturing the second conductive layer comprises the following steps:
and manufacturing at least part of the first electrode layer and the second conductive layer by a one-time patterning process.
8. The method for manufacturing a display substrate according to claim 7, wherein before the first electrode layer and the second conductive layer are manufactured by a single patterning process, the method further comprises:
providing a substrate base plate;
manufacturing the first conducting layer on the substrate base plate;
and manufacturing an insulating layer for isolating the first conductive layer and the first electrode layer.
9. The method for manufacturing a display substrate according to claim 7 or 8, wherein the manufacturing the first electrode layer and the second conductive layer by a single patterning process comprises:
sequentially forming a first electrode sublayer, a second electrode sublayer and a third electrode sublayer on the substrate base plate;
removing the second electrode sublayer and the third electrode sublayer outside the corresponding region of the second conducting layer and the first electrode layer by a first etching process;
and removing parts of the second electrode sublayer and the third electrode sublayer in the region corresponding to the second conductive layer and parts of the first electrode sublayer outside the region corresponding to the second conductive layer and the first electrode layer by a second etching process to form the second conductive layer and the first electrode layer.
10. The method for manufacturing the display substrate according to claim 9, wherein the removing, by the first etching process, the second electrode sub-layer and the third electrode sub-layer outside the region corresponding to the second conductive layer and the first electrode layer includes:
and exposing and etching the second electrode sublayer and the third electrode sublayer by using a semitransparent mask, wherein the transparency of a region of the semitransparent mask corresponding to the second conducting layer is greater than that of a region corresponding to the first electrode layer and is smaller than that of a region outside the region corresponding to the second conducting layer and the first electrode layer.
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050225234A1 (en) * | 2004-04-12 | 2005-10-13 | Eastman Kodak Company | Oled device with short reduction |
| US20180095582A1 (en) * | 2016-09-30 | 2018-04-05 | Lg Display Co., Ltd. | Organic Light Emitting Display Device |
| CN110729337A (en) * | 2019-11-15 | 2020-01-24 | 京东方科技集团股份有限公司 | Display substrate, manufacturing method thereof and electronic device |
| CN210245502U (en) * | 2019-09-27 | 2020-04-03 | 昆山国显光电有限公司 | Display substrate, display panel and display device |
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- 2020-05-25 CN CN202010447638.5A patent/CN111564466B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050225234A1 (en) * | 2004-04-12 | 2005-10-13 | Eastman Kodak Company | Oled device with short reduction |
| CN1969384A (en) * | 2004-04-12 | 2007-05-23 | 伊斯曼柯达公司 | OLED device with short circuit reduction |
| US20180095582A1 (en) * | 2016-09-30 | 2018-04-05 | Lg Display Co., Ltd. | Organic Light Emitting Display Device |
| CN210245502U (en) * | 2019-09-27 | 2020-04-03 | 昆山国显光电有限公司 | Display substrate, display panel and display device |
| CN110729337A (en) * | 2019-11-15 | 2020-01-24 | 京东方科技集团股份有限公司 | Display substrate, manufacturing method thereof and electronic device |
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