CN111479380B - Circuit board assembly, and method and device for detecting coding offset - Google Patents
Circuit board assembly, and method and device for detecting coding offset Download PDFInfo
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- CN111479380B CN111479380B CN202010343211.0A CN202010343211A CN111479380B CN 111479380 B CN111479380 B CN 111479380B CN 202010343211 A CN202010343211 A CN 202010343211A CN 111479380 B CN111479380 B CN 111479380B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- General Health & Medical Sciences (AREA)
- Biochemistry (AREA)
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Health & Medical Sciences (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention discloses a circuit board assembly, a method and a device for detecting coding offset, wherein the circuit board assembly comprises: the circuit board is provided with a coding area and a wiring area, and the wiring area is provided with a conductive element; and the boundary component encloses the coding area on the circuit board to form the boundary of the coding area. According to the invention, the code printing area is enclosed by the boundary component, whether the laser code is deviated or not in the code printing process can be confirmed by identifying the code printing boundary, the scheme does not need to detect the circuit of the circuit board, and the process of detecting the code printing deviation is simpler and quicker.
Description
Technical Field
The invention relates to the field of electronic equipment, in particular to a circuit board assembly, a coding offset detection method and a coding offset detection device.
Background
After the production of packaging products, need on the product laser beat sign indicating number in order to record product information, supply the rear end to trace back, the sign indicating number can be beaten on the lid to laser usually, beat on plastic envelope material etc. but some packaging products have the circuit layer under the build-up layer on the circuit board, when beating the sign indicating number skew, can lead to the circuit layer to be beaten by laser for the circuit board inefficacy, prior art often need confirm through confirming whether the circuit board loses efficacy whether appear beating the sign indicating number skew, the process is comparatively loaded down with trivial details.
Disclosure of Invention
The invention mainly aims to provide a circuit board assembly, a method and a device for detecting coding offset, and aims to reduce the detection cost of coding offset.
To achieve the above object, the present invention provides a circuit board assembly comprising:
the circuit board is provided with a coding area and a wiring area, and the wiring area is provided with a conductive element;
and the boundary component encloses the coding area on the circuit board to form the boundary of the coding area.
Optionally, the border assembly comprises a metal frame on the circuit board.
Optionally, the circuit board comprises a substrate and a solder resist layer, and the conductive element comprises a copper wire; the boundary component is a copper wire frame, the copper wire frame is arranged on the substrate, and a through groove communicated with the copper wire frame is formed in the solder mask.
Optionally, the boundary component comprises a cover plate covering the circuit board, a hollow groove is formed in the cover plate, the inner wall of the hollow groove encloses the code printing area, and the cover plate is detachably connected with the circuit board.
Optionally, the circuit board assembly further includes a fixing member, the circuit board and the cover plate are both provided with positioning holes, and the fixing member penetrates through the positioning holes of the circuit board and the cover plate to fix the circuit board and the cover plate.
In addition, in order to achieve the above object, the present invention further provides a method for detecting coding offset, which is applied to the circuit board assembly as described above, and the method for detecting coding offset includes:
after the circuit board is subjected to laser coding, acquiring the boundary of the enclosed coding area;
identifying a laser code on the circuit board;
and determining whether the coding deviation exists according to the boundary and the laser code.
Optionally, the method for detecting a coding offset further includes:
identifying a region to be coded enclosed by the boundary components;
and carrying out laser coding in the region to be coded.
Optionally, the boundary is enclosed by a metal frame, and the step of determining whether to print a code offset according to the boundary and the laser code includes:
determining the boundary and the position information of the laser code;
and determining whether the laser code exceeds the boundary according to the position information, wherein when the laser code exceeds the boundary, the coding offset is determined.
Optionally, the step of determining whether to code the offset according to the boundary and the laser code includes:
acquiring a laser code in the boundary according to the boundary;
and comparing the laser codes in the boundary with preset laser codes to determine whether the code printing is deviated, wherein when the laser codes in the boundary are not matched with the preset laser codes, the code printing is deviated.
In addition, in order to achieve the above object, the present invention further provides a device for detecting coding offset, which is characterized in that the device for detecting coding offset includes a memory, a processor, and a program for detecting coding offset, which is stored in the memory and can be run on the processor, and the program for detecting coding offset is executed by the first processor to perform the method for detecting coding offset.
According to the circuit board assembly and the method, the code printing area is enclosed by the boundary assembly, whether the laser code deviates in the code printing process can be confirmed by identifying the code printing boundary, the circuit of the circuit board does not need to be detected, and the process of detecting the code printing deviation is simple and rapid.
Drawings
FIG. 1 is a schematic structural diagram of a circuit board assembly according to an embodiment of the present invention;
FIG. 2 is a schematic cross-sectional view of the circuit board of FIG. 1;
FIG. 3 is a schematic diagram of a circuit board assembly according to another embodiment of the present invention;
FIG. 4 is a schematic view of a cover plate according to another embodiment of the circuit board assembly of the present invention;
FIG. 5 is a schematic structural diagram of a fixing member in another embodiment of the circuit board assembly of the present invention;
FIG. 6 is a flowchart illustrating a method for detecting coding offset according to a first embodiment of the present invention;
FIG. 7 is a flowchart illustrating a method for detecting coding offset according to a second embodiment of the present invention.
The objects, features and advantages of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Referring to fig. 1 and 2, fig. 1 is a schematic structural diagram of an embodiment of a circuit board assembly according to the present invention; fig. 2 is a schematic cross-sectional view of the circuit board of fig. 1.
The circuit board assembly disclosed in the present embodiment includes:
a circuit board 10, wherein a coding region 11 and a routing region 12 are disposed on the circuit board 10, and the routing region 12 is disposed with a conductive element (not shown in the figure);
and a boundary component (not shown in the figure) surrounding the coding region 11 on the circuit board 10 to form the boundary of the coding region 11.
As shown in fig. 1 and 2, the circuit board 10 includes a substrate 13 and a solder mask layer 14, a conductive element in the trace area 12 is a copper wire 16, and the copper wire is disposed between the substrate 13 and the solder mask layer 14, and the substrate 13 and the solder mask layer 14 of the coding area 11 in the technical solution disclosed in this embodiment are not provided with the copper wire 16, so that after laser coding is performed on the coding area 11, the wire is not damaged, and the circuit board 10 is prevented from being invalid due to coding.
The border assembly (not shown in the figure) in this embodiment may be fixedly connected to the circuit board 10 by welding or bonding, and when the border assembly is fixedly connected to the circuit board 10, the code region may be identified by the border assembly (not shown in the figure), and after the code region 11 is identified, the laser code printing operation is performed in the code region 11, so that the code printing is more accurate.
Alternatively, the border element (not shown) may be detachably connected to the circuit board 10, the border element is connected to the circuit board 10 by a connector, and the border element may be connected to the circuit board 10 by various methods, such as a snap connection, a fixing hole, a connector connection, and the like.
The coding region 11 enclosed by the boundary elements in this embodiment may be shaped as desired, for example, the coding region 11 may be square.
In the technical scheme disclosed in this embodiment, the code printing area 11 is enclosed by the boundary, whether the laser code is offset or not in the code printing process can be confirmed by identifying the code printing boundary, the scheme does not need to detect the line of the circuit board 10, and the process of detecting the code printing offset is simpler and faster.
In one embodiment, as shown in fig. 1, the border assembly may include a metal frame 21, as shown in fig. 2, a circuit board including a substrate 13 and a solder mask 14, and the conductive elements including copper wires 16; the boundary component is a copper wire frame 21, the copper wire frame 21 is arranged on the substrate 13, and a through groove 17 communicated with the copper wire frame 21 is arranged on the solder mask layer 14; the metal frame 21 is exposed through the through-groove 17 so that it can be observed after coding.
The metal frame 21 is formed on the circuit board 10 by copper etching or electroplating, as well as other circuits in the trace area 12, and is formed simultaneously with other circuits in the trace area 12, so as to facilitate the manufacturing process. The metal frame 21 can be formed by enclosing a plurality of copper circuit sections, and the copper circuit sections are disconnected, namely the metal frame 21 is discontinuous; alternatively, the metal frame 21 may be formed by bending a copper wire, i.e., the copper wire frame is continuous.
Further, in order to avoid oxidation of the copper wire frame, the surface of the copper wire frame is plated with an anti-oxidation layer to avoid oxidation of the metal frame 21, and the surface of the copper wire is plated with an anti-oxidation layer, which may be a metal such as nickel that is not easily oxidized.
In the embodiment, a copper wire frame is used as a boundary component, and the material of the copper wire frame is consistent with the material of the conducting wire in the circuit board 10, so that the processing is relatively convenient.
In another embodiment, as shown in fig. 4, the boundary component (not shown) includes a cover plate 22 covering the circuit board 10, a hollow groove 23 is formed on the cover plate 22, an inner wall of the hollow groove 23 encloses the coding region 11, and the cover plate 22 is detachably connected to the circuit board 10.
In another embodiment shown in fig. 3, the circuit board 10 may be formed by splicing a plurality of single boards, and coding is performed in the coding region 11 of the splice, it is understood that the circuit board 10 in this embodiment may also be the circuit board 10 in fig. 1.
In the technical solution disclosed in this embodiment, the connection manner between the cover plate 22 and the circuit board 10 can be implemented by using positioning holes and a fixing member 30, that is, the circuit board assembly further includes a fixing member 30, the circuit board 10 and the cover plate 22 are both provided with positioning holes, and the fixing member 30 passes through the positioning holes of the circuit board 10 and the cover plate 22 to fix the circuit board 10 and the cover plate 22; as shown in fig. 5, the positioning member 30 in the present embodiment includes a positioning base 31 and a positioning column 32, wherein the positioning column 32 penetrates through the circuit board 10 and the cover plate 22 to fix the circuit board 10 and the cover plate 22; alternatively, the connection of the cover plate 22 and the circuit board 10 may also include a detachable connection such as a snap-fit connection.
In the technical scheme disclosed in this embodiment, the cover plate 22 is detachably covered on the circuit board 10, so that the same cover plate 22 is used for sequentially detecting the printing offset condition of a plurality of circuit boards 10, and each circuit board 10 is not required to be separately provided with a boundary component, thereby saving the cost.
Referring to fig. 6, fig. 6 is a flowchart illustrating a method for detecting coding offset according to an embodiment of the present invention.
The method for detecting coding offset disclosed in this embodiment is applied to the circuit board assembly described in the above embodiment, and the method for detecting coding offset in this embodiment includes:
step S10, after the circuit board is printed with codes by laser, the boundary of the enclosed code printing area is obtained;
step S20, identifying the laser code on the circuit board;
and step S30, determining whether the coding offset exists according to the boundary and the laser code.
In the embodiment, when the boundary of the coding region is identified, the boundary can be determined through image identification, namely, the image of the circuit board to be detected is obtained, and the region with the preset shape in the image is identified; identifying the laser code may also be accomplished by image recognition.
In this embodiment, it is determined whether there are multiple ways for determining whether the coding offset exists, and this scheme is applicable to a way in which the boundary is enclosed by a metal frame, and step S30 includes:
determining the boundary and the position information of the laser code;
and determining whether the laser code exceeds the boundary according to the position information, wherein when the laser code exceeds the boundary, the coding offset is determined.
In this embodiment, the boundary and the position information of the laser code may be determined by a preset coordinate system, the position information may be embodied by a coordinate area, and when the coordinate area of the laser code exceeds the coordinate area enclosed by the boundary, the laser code is considered to exceed the boundary;
or after the laser code and the boundary are obtained through identification, the laser code sub-image and the boundary area sub-image can be segmented in the image, then the laser code sub-image and the boundary area sub-image are subjected to overlapping processing, and when the laser code sub-image in the overlapped image exceeds the boundary area sub-image, the laser code is considered to exceed the boundary.
It is understood that only the image within the boundary may be identified, and whether the coding offset is determined by determining whether the image within the boundary is complete, and the scheme may be applied to a manner in which the boundary is enclosed by a metal frame, or a manner in which the boundary is enclosed by a hollow-out groove of a cover plate, that is, step S30 includes:
acquiring a laser code in the boundary according to the boundary;
and comparing the laser codes in the boundary with preset laser codes to determine whether the code printing is deviated, wherein when the laser codes in the boundary are not matched with the preset laser codes, the code printing is deviated.
After step S30, a prompt message may be output, and the output prompt message may be a coding offset or a coding non-offset.
In the technical scheme disclosed by the embodiment, the code printing area is enclosed through the boundary, whether the laser code is offset or not in the code printing process can be confirmed through the identification of the code printing boundary, the scheme does not need to detect the circuit of the circuit board, and the process of detecting the code printing offset is simpler and quicker.
Referring to fig. 7, a second embodiment of the method for detecting a coding offset according to the present invention is proposed based on the first embodiment, and in this embodiment, step S10 includes:
step S40, identifying the area to be coded enclosed by the boundary components;
and step S50, performing laser coding in the region to be coded.
The technical scheme disclosed by the embodiment directly identifies the code printing area and then carries out laser code printing when printing the code, so that the position of the laser code printing is more accurate.
It will be appreciated that to avoid the impact of the border element on subsequent processing and aesthetics, the border element may be removed after determining whether the coding is shifted based on the border and the laser code.
The invention also provides a circuit board assembly comprising a memory, a processor and a coding offset detection method program stored on the memory and capable of running on the processor, wherein the coding offset detection method program is executed by the first processor by the coding offset detection method according to the above embodiment.
It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or system that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or system. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or system that comprises the element.
The above-mentioned serial numbers of the embodiments of the present invention are merely for description and do not represent the merits of the embodiments.
Through the above description of the embodiments, those skilled in the art will clearly understand that the method of the above embodiments can be implemented by software plus a necessary general hardware platform, and certainly can also be implemented by hardware, but in many cases, the former is a better implementation manner. Based on such understanding, the technical solution of the present invention may be embodied in the form of a software product, which is stored in a storage medium (e.g., ROM/RAM, magnetic disk, optical disk) and includes instructions for enabling a terminal device (e.g., a mobile phone, a computer, a server, a controlled terminal, or a network device) to execute the method of each embodiment of the present invention.
The above description is only a preferred embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes, which are made by using the contents of the present specification and the accompanying drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (10)
1. A circuit board assembly, comprising:
the circuit board is provided with a coding area and a wiring area, and the wiring area is provided with a conductive element;
and the boundary component encloses the coding area on the circuit board to form the boundary of the coding area.
2. The circuit board assembly of claim 1, wherein the border assembly comprises a metal frame on the circuit board.
3. The circuit board assembly of claim 2, wherein the circuit board comprises a substrate and a solder mask, the conductive element comprises a copper wire; the boundary component is a copper wire frame, the copper wire frame is arranged on the substrate, and a through groove communicated with the copper wire frame is formed in the solder mask.
4. The circuit board assembly of claim 1, wherein the border assembly comprises a cover plate covering the circuit board, the cover plate is provided with a hollow-out groove, an inner wall of the hollow-out groove encloses the coding region, and the cover plate is detachably connected with the circuit board.
5. The circuit board assembly of claim 4, further comprising a fixing member, wherein the circuit board and the cover plate are each provided with a positioning hole, and the fixing member passes through the positioning holes of the circuit board and the cover plate to fix the circuit board and the cover plate.
6. A method for detecting coding offset, applied to the circuit board assembly according to any one of claims 1 to 5, the method comprising:
after the circuit board is subjected to laser coding, acquiring the boundary of the enclosed coding area;
identifying a laser code on the circuit board;
and determining whether the coding deviation exists according to the boundary and the laser code.
7. The method of detecting a coding offset of claim 6, wherein the method of detecting a coding offset further comprises:
identifying a region to be coded enclosed by the boundary components;
and carrying out laser coding in the region to be coded.
8. The method for detecting coding shift according to claim 6, wherein the boundary is defined by a metal frame, and the step of determining whether to code shift according to the boundary and the laser code comprises:
determining the boundary and the position information of the laser code;
and determining whether the laser code exceeds the boundary according to the position information, wherein when the laser code exceeds the boundary, the coding offset is determined.
9. The method of detecting coding drift of claim 6, wherein said step of determining whether to code drift based on said boundary and said laser code comprises:
acquiring a laser code in the boundary according to the boundary;
and comparing the laser codes in the boundary with preset laser codes to determine whether the code printing is deviated, wherein when the laser codes in the boundary are not matched with the preset laser codes, the code printing is deviated.
10. A coding offset detection apparatus, comprising a memory, a processor, and a coding offset detection program stored in the memory and executable on the processor, wherein the coding offset detection program is executed by the processor to perform the coding offset detection method according to any one of claims 6 to 9.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010343211.0A CN111479380B (en) | 2020-04-26 | 2020-04-26 | Circuit board assembly, and method and device for detecting coding offset |
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| CN202010343211.0A CN111479380B (en) | 2020-04-26 | 2020-04-26 | Circuit board assembly, and method and device for detecting coding offset |
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| CN111479380B true CN111479380B (en) | 2022-04-22 |
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| WO2023039693A1 (en) | 2021-09-14 | 2023-03-23 | 宁德时代新能源科技股份有限公司 | Detection method, electronic device, and computer readable storage medium |
| CN117890377A (en) * | 2024-02-22 | 2024-04-16 | 宁德时代新能源科技股份有限公司 | Battery monomer flexible connecting piece detection system and point detection method |
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| US6991960B2 (en) * | 2001-08-30 | 2006-01-31 | Micron Technology, Inc. | Method of semiconductor device package alignment and method of testing |
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| CN1649114A (en) * | 2004-01-30 | 2005-08-03 | 日本特殊陶业株式会社 | Method for producing wiring base board |
| JP2013008909A (en) * | 2011-06-27 | 2013-01-10 | Hitachi Chem Co Ltd | Wiring board and inspection method thereof |
| WO2013037473A1 (en) * | 2011-09-15 | 2013-03-21 | Giesecke & Devrient Gmbh | Device for placing a marking onto a substrate by means of a laser beam |
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