CN111190448B - Temperature control system and method for controlling temperature of tested equipment - Google Patents
Temperature control system and method for controlling temperature of tested equipment Download PDFInfo
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- CN111190448B CN111190448B CN202010038261.8A CN202010038261A CN111190448B CN 111190448 B CN111190448 B CN 111190448B CN 202010038261 A CN202010038261 A CN 202010038261A CN 111190448 B CN111190448 B CN 111190448B
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- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D23/00—Control of temperature
- G05D23/19—Control of temperature characterised by the use of electric means
- G05D23/20—Control of temperature characterised by the use of electric means with sensing elements having variation of electric or magnetic properties with change of temperature
- G05D23/22—Control of temperature characterised by the use of electric means with sensing elements having variation of electric or magnetic properties with change of temperature the sensing element being a thermocouple
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Abstract
The invention discloses a temperature control system and a method for controlling the temperature of a tested device, comprising a heating plate for heating the tested device; a temperature sensor for sensing a temperature of the heating plate; the cooling plate is used for cooling the heating plate, and the temperature of the cooling plate is lower than that of the heating plate; the pushing device is connected with the cooling plate and used for controlling the movement of the cooling plate so as to control the heat conduction rate between the cooling plate and the heating plate; the control system is electrically connected with the temperature sensor, receives a signal of the temperature sensor and further controls the pushing device to move; the temperature sensor detects the temperature information of the heating plate, and the control system responds to the temperature information to control the pushing device to move so as to control the temperature of the heating plate; the movement of the cooling plate is controlled through the pushing device, so that the heat conduction speed of the heating plate and the cooling plate is controlled, and the effects of accurately controlling the temperature and having a good refrigeration effect are achieved.
Description
Technical Field
The invention relates to the field of tested equipment, in particular to a temperature control system and a method for controlling the temperature of the tested equipment.
Background
The integrated circuit is a miniature electronic device or component, and the elements such as transistor, resistor, capacitor and inductor, etc. required in a circuit and the wiring are interconnected together by adopting a certain process, and are manufactured on a small piece or a plurality of small pieces of semiconductor wafers or medium substrates, and then are packaged in a tube shell to form a miniature structure with the required circuit function; the performance of the integrated circuit is not constant, but the temperature is an important factor influencing the performance of the integrated circuit, and the conductive capability, the limit voltage, the limit current, the switching characteristic and the like of the integrated circuit are correspondingly changed along with the change of the temperature; therefore, the temperature resistance of the integrated circuit needs to be detected when the integrated circuit leaves a factory;
the existing test system is mostly provided with a heating plate which is directly contacted with a DUT (device to be tested), and the heating plate is also provided with a heater which is used for heating the heating plate so as to achieve the purpose of heating the DUT; meanwhile, the heating plate is also connected with a fixed cooling plate, one side of the cooling plate is provided with an evaporator, the cooling plate is cooled through the evaporator, and then the temperature of the heating plate is reduced through the cooling plate, so that the purpose of cooling the DUT is achieved; however, the evaporator is cooled by evaporating a refrigerant to absorb heat, for example, in the temperature control system of the integrated circuit mentioned in the document with the patent application number of 201410832160.2, the heat-conducting silica gel is cooled by the peltier element, and then the heat-conducting silica gel is cooled for the integrated circuit, so that the cooling of the evaporator is limited in cooling capacity and difficult to achieve the effect of strictly controlling the temperature of the DUT; therefore, the accurate temperature of the circuit board is particularly important for the working parameters (current and voltage) of the circuit board, and in a conventional temperature test, the humidity change is usually accompanied, if the humidity is too high, dew may be condensed on the circuit board, which not only affects the accurate temperature of the circuit board, but also affects the working parameters of the tested circuit board.
Disclosure of Invention
Aiming at the defects in the technology, the invention provides a temperature control system and a method for controlling the temperature of the equipment to be tested, wherein the pushing device is used for controlling the movement of the cooling plate so as to control the heat conduction rate of the heating plate and the cooling plate, thereby achieving the effects of accurately controlling the temperature and having good refrigeration effect.
In order to achieve the purpose, the invention adopts the following technical scheme:
a temperature control system for controlling the temperature of a device under test comprises
The heating plate is used for heating the tested equipment;
a temperature sensor for sensing a temperature of the heating plate;
the cooling plate is used for cooling the heating plate, and the temperature of the cooling plate is lower than that of the heating plate;
the pushing device is connected with the cooling plate and used for controlling the movement of the cooling plate so as to control the heat conduction rate between the cooling plate and the heating plate;
the control system is electrically connected with the temperature sensor, receives a signal of the temperature sensor and further controls the pushing device to move;
a humidity sensor: the humidity sensor is used for detecting the humidity near the tested equipment and transmitting the humidity to the control system;
the temperature sensor detects the temperature information of the heating plate, and the control system responds to the temperature information to control the pushing device to move so as to control the temperature of the heating plate; and the control system calculates humidity deviation according to the humidity information detected by the humidity sensor, and the humidity deviation is used for compensating the detected data.
The heating device comprises a heating plate, a control system and a heating system, wherein the heating plate is used for heating the heating plate, the control system responds to temperature information to control the heater to work, and then the temperature of the heating plate is increased.
The pushing device, the control system and the heater are arranged in the same heat insulation cavity, and the heat dissipated by the pushing device and the control system can be used for improving the temperature of the heater.
Wherein, control system control thrust unit motion, and then promote cooling board and hot plate and support and hold the contact, control thrust unit promotes the thrust of cooling board, and then control the heat conduction rate between hot plate and the cooling board.
The heating plate and the cooling plate are respectively provided with a first spring groove and a second spring groove, one end of the bias spring is contained in the first spring groove, and the other end of the bias spring is contained in the second spring groove.
Wherein, the control system controls the movement of the pushing device, and then controls the distance between the cooling plate and the heating plate, and the heat conduction mode between the cooling plate and the heating plate is air conduction.
Wherein, the hot plate is provided with the heat-conducting layer near one side of cooling board, and the heat-conducting layer is made by the heat conduction material.
Wherein, the heat-conducting layer is made of silica gel, and the thickness of heat-conducting layer is 0.1 mm.
Also provided is a temperature control method for controlling the temperature of a device under test, comprising the following steps:
s1: inserting the tested equipment on the heating plate;
s2: the temperature sensor detects the temperature information of the heating plate and transmits the temperature information to the control system;
s3: the control system responds to the temperature information and controls the movement of the pushing device;
s4: the pushing device pushes the cooling plate to move towards the heating plate, and then the heating plate is cooled.
Also provided is a temperature control method for controlling the temperature of a device under test, comprising the following steps:
s1: inserting the tested equipment on the heating plate;
s2: the temperature sensor detects the temperature information of the heating plate and transmits the temperature information to the control system;
s3: the control system responds to the temperature information and controls the movement of the pushing device;
s4': the pushing device pushes the cooling plate to be far away from the heating plate;
s5: the control system responds to the temperature information and controls the operation of the heater.
The invention has the beneficial effects that: compared with the prior art, the temperature control system and the method for controlling the temperature of the tested equipment comprise a heating plate, a temperature control device and a temperature control device, wherein the heating plate is used for heating the tested equipment; a temperature sensor for sensing a temperature of the heating plate; the cooling plate is used for cooling the heating plate, and the temperature of the cooling plate is lower than that of the heating plate; the pushing device is connected with the cooling plate and used for controlling the movement of the cooling plate so as to control the heat conduction rate between the cooling plate and the heating plate; the control system is electrically connected with the temperature sensor, receives a signal of the temperature sensor and further controls the pushing device to move; the temperature sensor detects the temperature information of the heating plate, and the control system responds to the temperature information to control the pushing device to move so as to control the temperature of the heating plate; the movement of the cooling plate is controlled through the pushing device, so that the heat conduction speed of the heating plate and the cooling plate is controlled, and the effects of accurately controlling the temperature and having a good refrigeration effect are achieved.
Drawings
FIG. 1 is a schematic diagram of the system architecture of the present invention;
FIG. 2 is a schematic representation of the relationship of contact pressure and heat conduction of the present invention;
FIG. 3 is a schematic view of the relationship of the heating plate and cooling plate of the present invention;
FIG. 4 is a schematic view of the relationship of the heating plate, heat conductive layer and cooling plate of the present invention;
fig. 5 is a diagram of the method steps of the present invention.
Description of the main elements
1. Cooling plate 2 and heating plate
3. Heat conducting layer 4 and pushing device
5. Heater 6, temperature sensor
7. DUT 8 and evaporator
9. And (5) controlling the system.
Detailed Description
In order to more clearly illustrate the technical solutions in the present technology, the drawings used in the description of the embodiments or the prior art will be described below.
Most of the existing temperature control systems employ a stationary evaporator 8, which is connected to a refrigeration circuit to form a refrigeration system; and now all use the Peltier element as the heat conducting element, one side of the Peltier element is contacted with evaporator 8 thermally, another side is contacted with hot plate 2 thermally, according to applying the electric current to the Peltier element, can produce the temperature difference between two sides, form the heat flow from one side to another side, therefore when the hot plate 2 needs to absorb the heat from DUT7, namely need to carry on the cooling to DUT7, the control system 9 controls the polarity and magnitude of the electric current flowing through the Peltier element, so as to control the evaporator 8 to absorb the heat of the hot plate 2; when the heater plate 2 needs to absorb heat from the DUT7, i.e. to warm up the DUT7, the control system 9 controls the peltier element current reversal and appropriate magnitude such that the heat flow, including the power dissipation of the peltier element and the heat absorbed from the other side, is reversed to heat the heater plate 2; although this is a convenient way of controlling the temperature, the heat transfer capacity of the peltier element, which is used as the heat conducting layer 3, limits the maximum cooling capacity of the system; there are also temperature control systems that control the flow rate of the refrigerant to control the cooling effect, however, this method can result in too long a time to adjust the temperature, and is not suitable for situations where the temperature needs to be changed frequently during testing.
Referring to fig. 1, the present embodiment provides a temperature control system for controlling the temperature of a device under test, including a heating plate 2 for heating the device under test; a temperature sensor 6 for sensing the temperature of the heating plate 2; the cooling plate 1 is used for cooling the heating plate 2, and the temperature of the cooling plate 1 is lower than that of the heating plate 2; the pushing device 4 is connected with the cooling plate 1 and is used for controlling the movement of the cooling plate 1 so as to control the heat conduction rate between the cooling plate 1 and the heating plate 2; the control system 9 is electrically connected with the temperature sensor 6, receives signals of the temperature sensor 6 and further controls the pushing device 4 to move; a humidity sensor: the humidity sensor is used for detecting the humidity near the tested equipment and transmitting the humidity to the control system; the temperature sensor 6 detects the temperature information of the heating plate 2, and the control system 9 responds to the temperature information to control the pushing device 4 to move so as to control the temperature of the heating plate 2; the control system calculates humidity deviation according to humidity information detected by the humidity sensor, and the humidity deviation is used for compensating detected data so as to reduce the influence of humidity on circuit board testing; the pushing device 4 is used for controlling the cooling plate 1 to move so as to control the heat conduction rate of the heating plate 2 and the cooling plate 1, and the effects of accurately controlling the temperature and having a good refrigeration effect are achieved; an evaporator 8 is arranged at one end of the cooling plate 1, and a refrigerant of the evaporator 8 circulates between a gas phase and a liquid phase to absorb heat, so that the cooling effect is achieved; in order to further reduce the influence of humidity, drying device can also be set up, when humidity check out test set detects near circuit board humidity too high, control system opens drying device, and then reduces inside humidity.
The test device is provided with a card slot, after the DUT7 is inserted into the card slot, an output interface on the card slot is electrically connected with an input contact of the DUT7, the output interface is used for providing electrical stimulation for the input contact, an input interface of the card slot is connected with an output contact of the DUT7, the input interface is used for receiving an electrical signal of the output contact, and the test device records and analyzes the electrical signal; during testing, the temperature control system controls the temperature of the DUT7 and detects the temperature through one or more temperature sensors 6, the temperature sensors 6 include one or more of a bimetallic temperature sensor 6, a thermal resistance temperature sensor 6, a thermocouple temperature sensor 6, a pressure type temperature sensor 6 and a radiation temperature sensor 6, and preferably adopts the infrared temperature sensor 6 as the non-contact temperature sensor 6; collecting temperature information via the temperature sensor 6 and then controlling the temperature of the DUT7 to increase, decrease, or maintain at a set point temperature; and the set point temperature can be set by an operator.
Referring to fig. 1, the present embodiment further includes a heater 5 thermally connected to the heating plate 2, the heater 5 is used for heating the heating plate 2, and the control system 9 responds to the temperature information to control the heater 5 to operate, so as to increase the temperature of the heating plate 2; the pushing device 4, the control system 9 and the heater 5 are arranged in the same heat insulation cavity, and heat dissipated by the pushing device 4 and the control system 9 can be used for improving the temperature of the heater 5, so that the effect of improving energy conversion efficiency can be achieved; the control system 9 of this embodiment controls the movement of the pushing device 4, further pushes the cooling plate 1 to be in contact with the heating plate 2, controls the pushing force of the pushing device 4 to push the cooling plate 1, and further controls the heat conduction rate between the heating plate 2 and the cooling plate 1; the heat transfer rate is determined by the contact pressure of the cooling plate 1 against the heating plate 2, and the increase in the contact pressure significantly enhances the heat transfer rate.
The heating plate 2 and the cooling plate 1 are respectively provided with a first spring groove and a second spring groove which correspond to each other, one end of the biasing spring is accommodated in the first spring groove, and the other end of the biasing spring is accommodated in the second spring groove; when the cooling plate 1 does not move, the cooling plate 1 and the heating plate 2 can be separated by the elasticity of the bias spring, a gap is generated between the cooling plate 1 and the heating plate 2, and the effect of separating the cooling plate 1 can be achieved; even if the cooling plate 1 needs to be pressed onto the heating plate 2, the biasing spring can only continue to be compressed in the first spring groove and the second spring groove, and the biasing spring can never be completely compressed by setting the depths of the first spring groove and the second spring groove, and even after the cooling plate 1 and the heating plate 2 are mutually abutted, the biasing spring only resists but cannot prevent the pressure of the pushing device 4 on the cooling plate 1.
Referring to fig. 1, 3 and 4, the control system 9 of the present embodiment controls the movement of the pushing device 4, so as to control the distance between the cooling plate 1 and the heating plate 2, and the heat conduction manner between the cooling plate 1 and the heating plate 2 is air conduction; in the embodiment, a heat conduction layer 3 is arranged on one side of the heating plate 2 close to the cooling plate 1, and the heat conduction layer 3 is made of a heat conduction material; the heat conduction layer 3 of this embodiment is made for silica gel, and the thickness of heat conduction layer 3 is 0.1mm, and the heat conduction layer can avoid the cooling plate 1 adhesion that removes to on the hot plate 2 to can improve contact surface's heat-conduction ability, be especially that contact surface can't reach flat completely or when contact surface can't be parallel completely because of the microgap, just need set up one deck heat conduction layer 3, can strengthen the heat-conduction ability.
In order to control the temperature of the heating plate 2 and thus the temperature of the DUT7, the control system 9 is capable of controlling the temperature by controlling the heater 5 or the pushing device 4 to push the cooling plate 1 in motion in response to the temperature difference between the set point temperature and the temperature of the heating plate 2 detected by the temperature sensor 6; after the temperature control system is started, the temperature of the cooling plate 1 can be automatically adjusted to the lowest threshold value of the temperature test range, and the nominal temperature of the cooling plate 1 can be adjusted by a user; an evaporator 8 is provided at one side of the cooling plate 1, the evaporator 8 receiving refrigerant liquid from the condenser via a fluid line and absorbing latent heat by evaporating the refrigerant liquid into a low temperature and low pressure refrigerant gas.
Referring to fig. 5, the present embodiment further provides a temperature control method for controlling the temperature of a device under test, including the following steps:
s1: the device to be tested is inserted on the heating plate 2;
s2: the temperature sensor 6 detects the temperature information of the heating plate 2 and transmits the temperature information to the control system 9;
s3: the control system 9 responds to the temperature information and controls the movement of the pushing device 4;
s4: thrust unit 4 promotes cooling plate 1 to the motion of hot plate 2 direction, and then cools down hot plate 2.
The embodiment also provides a temperature control method for controlling the temperature of the tested device, which comprises the following steps:
s1: inserting the tested equipment on the heating plate;
s2: the temperature sensor detects the temperature information of the heating plate and transmits the temperature information to the control system;
s3: the control system responds to the temperature information and controls the movement of the pushing device;
s4': the pushing device pushes the cooling plate to be far away from the heating plate;
s5: the control system responds to the temperature information and controls the operation of the heater.
In conventional temperature testing, it is usually necessary to simulate the working environment of a circuit board along with humidity changes, and in order to ensure the accuracy of measurement data, in a humidity-controlled and temperature-controlled chamber system, a Device Under Test (DUT) can be subjected to different forms of test schemes (registers) under different environments. In a number of these test schemes, it is important that there is no condensation at or near the DUT in order to ensure accurate measurements, prevent the DUT from malfunctioning or being damaged, or for other reasons. In conventional test systems, the temperature of the DUT can be at a temperature below the dew point (dew point) of the controlled chamber environment due to the thermal mass of the DUT or other factors. As a result, condensation can form, which can lead to the destruction of example 1 of this example of the test protocol: the testing temperature of the DUT7 can be set to be-45 ℃ to 150 ℃, when the temperature needs to be adjusted to 150 ℃, the control system 9 controls the heater 5 to work, the heater 5 increases the temperature of the heating plate 2, the cooling plate 1 is far away from the heating plate 2 under the elastic force of the bias spring, and a gap is formed between the heating plate 2 and the cooling plate 1; on the contrary, if the temperature needs to be adjusted to-45 ℃, the control system 9 firstly controls the heater 5 to stop working, then controls the pushing device to push the cooling plate 1 to move towards the heating plate 2, and the heat conduction rate is increased along with the reduction of the distance in the process that the cooling plate 1 is close to but not in contact with the heating plate 2; after the cooling plate 1 contacts the heating plate 2, the pushing device 4 continues to apply pressure, and since the surfaces of the cooling plate 1 and the heating plate 2 cannot be completely smooth, the heat conduction rate of the cooling plate 1 and the heating plate 2 is rapidly increased along with the increase of the contact pressure of the cooling plate 1 and the heating plate 2, and is much greater than the air heat conduction rate.
Example 2: referring to fig. 2, the relationship between heat conduction and force is represented in two different areas, the first area on the left is the "air gap area", the second area on the right is the "contact area", in the air gap area, the force can be increased until the bias spring is compressed into the first spring groove and the second spring groove, that is, the gap distance between the heating plate 2 and the cooling plate 1 is 0, and in the contact area, the heat conduction rate is determined by the contact pressure of the cooling plate 1 to the heating plate 2; the heat absorbed by the cooling plate 1 from the heating plate 2 is determined by the temperature of the cooling plate 1 and the heat transfer rate between the cooling plate 1 and the heating plate 2, and with continued reference to fig. 2, the heat transfer rate before the cooling plate 1 contacts the heating plate 2 is shown on the left, and the heat transfer rate increases rapidly as the applied force F reaches a critical value, i.e., the applied force > — the restoring force of the biasing spring, but the heat transfer rate between the heating plate 2 and the cooling plate 1 reaches a maximum value as the applied force F increases to a maximum value; because cooling plate 1 and heating plate 2's surface can not be smooth completely, in fact be unevenness's rough surface, when heating plate 2 just contacted with cooling plate 1, comparatively prominent position can carry out heat-conduction through the solid contact on cooling plate 1 and the heating plate 2, and sunken position still carries out gaseous heat-conduction through the air, along with cooling plate 1's pressure increase, sunken position also can contact each other on heating plate 2 and the cooling plate 1, carry out contact conduction, the solid area of contact has been increased in other words, heat conduction rate has further been increased.
The invention has the advantages that:
(1) the movement of the cooling plate is controlled by the pushing device, so that the heat conduction rate of the heating plate and the cooling plate is controlled, and the effects of accurately controlling the temperature and quickly refrigerating are achieved;
(2) the heat conduction rate is determined by the contact pressure of the cooling plate to the heating plate, and the heat conduction rate is obviously enhanced by the increase of the contact pressure;
(3) when the cooling plate is not moved, the cooling plate and the heating plate can be separated by the elasticity of the bias spring, a gap is generated between the cooling plate and the heating plate, and the effect of separating the cooling plate can be achieved.
The above disclosure is only one or more specific embodiments of the present invention, but the present invention is not limited thereto, and any variations that can be made by those skilled in the art are intended to fall within the scope of the present invention.
Claims (8)
1. A temperature control system for controlling the temperature of a device to be tested is characterized by comprising a heating plate for heating the device to be tested;
the temperature sensor is used for sensing the temperature of the heating plate;
the cooling plate is used for cooling the heating plate, and the temperature of the cooling plate is lower than that of the heating plate;
the pushing device is connected with the cooling plate and used for controlling the cooling plate to move so as to control the heat conduction rate between the cooling plate and the heating plate;
the control system is electrically connected with the temperature sensor, receives a signal of the temperature sensor and further controls the pushing device to move;
a humidity sensor: the humidity sensor is used for detecting the humidity near the tested equipment and transmitting the humidity to the control system;
the temperature sensor detects the temperature information of the heating plate, and the control system responds to the temperature information to control the pushing device to move so as to control the temperature of the heating plate; the control system calculates humidity deviation according to humidity information detected by the humidity sensor, and the humidity deviation is used for compensating detected data;
the control system controls the pushing device to move, the pushing device controls the cooling plate to move towards the heating plate, and the distance and the contact pressure between the cooling plate and the heating plate are controlled; thereby controlling the heat conduction rate between the cooling plate and the heating plate;
the control system controls the pushing device to move so as to push the cooling plate to be in abutting contact with the heating plate, and controls the pushing device to push the pushing force of the cooling plate so as to control the heat conduction rate between the heating plate and the cooling plate.
2. The temperature control system for controlling the temperature of a device under test according to claim 1, further comprising a heater thermally connected to the heating plate, wherein the heater is used for heating the heating plate, and the control system controls the heater to operate in response to the temperature information, thereby increasing the temperature of the heating plate.
3. The temperature control system for controlling the temperature of a device under test according to claim 2, wherein the pushing device, the control system and the heater are disposed in a same thermal insulation chamber, and the heat dissipated by the pushing device and the control system can be used to increase the temperature of the heater.
4. The temperature control system for controlling the temperature of a device under test according to claim 1, further comprising a bias spring, wherein the heating plate and the cooling plate are respectively provided with a first spring groove and a second spring groove, and one end of the bias spring is accommodated in the first spring groove while the other end is accommodated in the second spring groove.
5. The temperature control system for controlling the temperature of a device under test according to claim 1, wherein a heat conducting layer is disposed on a side of the heating plate close to the cooling plate, and the heat conducting layer is made of a heat conducting material.
6. The temperature control system for controlling the temperature of the device under test according to claim 5, wherein the heat conducting layer is made of silicon gel, and the thickness of the heat conducting layer is 0.1 mm.
7. A temperature control method for controlling the temperature of a device under test, which is applied to the temperature control system for controlling the temperature of the device under test according to any one of claims 1 to 6, is characterized by comprising the following steps:
s1: inserting the tested equipment on the heating plate;
s2: the temperature sensor detects the temperature information of the heating plate and transmits the temperature information to the control system;
s3: the control system responds to the temperature information and controls the movement of the pushing device;
s4: the pushing device pushes the cooling plate to move towards the heating plate, and then the heating plate is cooled.
8. A temperature control method for controlling the temperature of a device under test, which is applied to the temperature control system for controlling the temperature of the device under test according to any one of claims 1 to 6, is characterized by comprising the following steps:
s1: inserting the tested equipment on the heating plate;
s2: the temperature sensor detects the temperature information of the heating plate and transmits the temperature information to the control system;
s3: the control system responds to the temperature information and controls the movement of the pushing device;
s4': the pushing device pushes the cooling plate to be far away from the heating plate;
s5: the control system responds to the temperature information and controls the operation of the heater.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010038261.8A CN111190448B (en) | 2020-01-14 | 2020-01-14 | Temperature control system and method for controlling temperature of tested equipment |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010038261.8A CN111190448B (en) | 2020-01-14 | 2020-01-14 | Temperature control system and method for controlling temperature of tested equipment |
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| CN111190448A CN111190448A (en) | 2020-05-22 |
| CN111190448B true CN111190448B (en) | 2022-03-15 |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05118973A (en) * | 1991-10-28 | 1993-05-14 | Jeol Ltd | Sample cooling device |
| TW200715086A (en) * | 2005-10-13 | 2007-04-16 | Ind Tech Res Inst | Apparatus for controlling fluid temperature and method thereof |
| CN104679059A (en) * | 2014-12-26 | 2015-06-03 | 北京兆易创新科技股份有限公司 | Temperature control system of integrated circuit |
| CN109683080A (en) * | 2017-12-05 | 2019-04-26 | 宿州开拓电子科技有限公司 | A kind of circuit board senile experiment device |
| CN209625065U (en) * | 2019-04-18 | 2019-11-12 | 格云特电子科技(昆山)有限公司 | A kind of heating of chip and temperature control device |
-
2020
- 2020-01-14 CN CN202010038261.8A patent/CN111190448B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05118973A (en) * | 1991-10-28 | 1993-05-14 | Jeol Ltd | Sample cooling device |
| TW200715086A (en) * | 2005-10-13 | 2007-04-16 | Ind Tech Res Inst | Apparatus for controlling fluid temperature and method thereof |
| CN104679059A (en) * | 2014-12-26 | 2015-06-03 | 北京兆易创新科技股份有限公司 | Temperature control system of integrated circuit |
| CN109683080A (en) * | 2017-12-05 | 2019-04-26 | 宿州开拓电子科技有限公司 | A kind of circuit board senile experiment device |
| CN209625065U (en) * | 2019-04-18 | 2019-11-12 | 格云特电子科技(昆山)有限公司 | A kind of heating of chip and temperature control device |
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