CN111007924A

CN111007924A - Electronic computing device

Info

Publication number: CN111007924A
Application number: CN201911250351.7A
Authority: CN
Inventors: 陈强; 张文娟; 管健
Original assignee: Beijing Yixian Technology Co Ltd
Current assignee: Beijing Yixian Technology Co Ltd
Priority date: 2019-12-09
Filing date: 2019-12-09
Publication date: 2020-04-14

Abstract

The present disclosure provides an electronic computing device. The electronic computing device includes: a chassis having one or more operation panel groups each including a plurality of operation panels arranged in parallel; and the heat dissipation device comprises a first heat dissipation component arranged at an air inlet of the case and a second heat dissipation component arranged at an air outlet of the case, and is used for dissipating heat inside the case, wherein the first heat dissipation component and the second heat dissipation component can be separated from the case and mounted on the case without tools.

Description

Electronic computing device

Technical Field

The present disclosure relates to computing devices, and more particularly to high performance electronic computing devices.

Background

With the demand for high-speed processing of large-scale data operations, research and development of high-performance electronic computing devices has been promoted. For example, in order to meet the processing requirements of a large number of operations for a block-chain device, a plurality of operation boards having a plurality of specialized processing chips are generally used to form such an electronic computing device. Theoretically, the larger the number of chips, the stronger the computing power of the device. On the other hand, since these operation boards with a large number of chips are generally installed in a single chassis, the power consumption of the operation boards with a large number of chips is relatively high, and thus the heat dissipation requirement of the device is very high.

In addition, in order to reduce the power cost, a large number of facilities need to be installed in areas where power resources are abundant, such as in the vicinity of solar power plants, wind power plants, hydroelectric power plants, and the like. However, these areas often lack a large number of specialized technicians, and therefore, require a large amount of equipment to be transported, installed, used, and maintained.

Unless otherwise indicated, it should not be assumed that any of the approaches described in this section qualify as prior art merely by virtue of their inclusion in this section. Similarly, unless otherwise indicated, the problems mentioned in this section should not be considered as having been acknowledged in any prior art.

Disclosure of Invention

The present disclosure provides an electronic computing device, which integrates a plurality of operation board groups, can implement large-scale high-speed operation, and can improve the transportation and racking efficiency of the device because a heat sink can be transported and racked separately from a case of the device, and can be conveniently mounted on the case in use because the heat sink adopts a tool-free mounting manner.

According to an aspect of the present disclosure, there is provided an electronic computing device comprising: a chassis having one or more operation panel groups each including a plurality of operation panels arranged in parallel; and the heat dissipation device comprises a first heat dissipation component arranged at an air inlet of the case and a second heat dissipation component arranged at an air outlet of the case, and is used for dissipating heat inside the case, wherein the first heat dissipation component and the second heat dissipation component can be separated from the case and mounted on the case without tools.

Optionally, the first heat dissipation assembly includes: the first frame comprises at least one first connecting part arranged on the side wall of the frame. The second heat dissipation assembly includes: and the second frame comprises at least one second connecting part arranged on the side wall of the frame. The case comprises at least one third connecting part arranged at the air inlet and at least one fourth connecting part arranged at the air outlet. Wherein the at least one first connecting component and the at least one third connecting component form at least one first detachable pair, and the at least one second connecting component and the at least one fourth connecting component form at least one second detachable pair, so that the first heat dissipation assembly and the second heat dissipation assembly are respectively tool-lessly mounted to the chassis.

The electronic computing device may further include a master control box, the master control box including: a controller electrically connected to the plurality of operation panels through electric wires to control the respective operation panels; and a power supply electrically connected to the plurality of operation panels through the electric wires.

Optionally, the electrical cord is a two-terminal, multiple-cord electrical cord having a control terminal and a power terminal.

The first heat sink assembly and the second heat sink assembly may be electrically connected in parallel to the power source.

The one or more operation panel groups may be arranged in a lateral direction and/or a longitudinal direction.

The master control box may include a plurality of control signal main interfaces and a plurality of power supply main interfaces, and the plurality of operation boards may include a corresponding plurality of control signal sub-interfaces and a plurality of power supply sub-interfaces. Wherein each control signal primary interface is connected to a corresponding plurality of control signal secondary interfaces and each power source primary interface is connected to a corresponding plurality of power source secondary interfaces through the dual terminal one-to-many electric wire.

Optionally, the first heat dissipation assembly includes a first fan set mounted to the first frame, and the second heat dissipation assembly includes a second fan set mounted to the second frame, wherein the first fan set and the second fan set each include at least one fan.

Optionally, the first fan set and the second fan set are symmetrically arranged.

Optionally, the first connecting part is a hook or a snap groove, and the third connecting part is a snap groove or a hook matching with the first connecting part.

Optionally, the hook has a first claw with a fitting guide surface configured as an inclined surface to lock the first heat dissipation assembly with the chassis.

Wherein the first and second mating pairs may be identical.

Drawings

The above and other features, advantages and aspects of various embodiments of the present disclosure will become more apparent from the following detailed description when taken in conjunction with the accompanying drawings. In the drawings, the same or similar reference numerals denote the same or similar elements. It should be understood that the drawings are schematic and that elements and features are not necessarily drawn to scale.

FIG. 1 is a schematic diagram illustrating an electronic computing device with a heat sink separated from a chassis according to an example embodiment;

FIG. 2 is a schematic diagram illustrating an electronic computing device with a heat sink tool-lessly mounted to a chassis, according to an example embodiment;

FIG. 3 is a schematic block diagram illustrating a chassis and a headbox of an electronic computing device in accordance with an illustrative embodiment;

FIG. 4 is a schematic diagram showing an interface between a chassis of an electronic computing device and a grandmaster, according to an example embodiment;

FIG. 5 is a schematic diagram illustrating interface wiring according to an example embodiment;

fig. 6 is a schematic diagram illustrating an assembly pair structure of a tool-less mounted heat sink according to yet another exemplary embodiment, wherein the assembly pair is designed for reinforcement.

Detailed Description

Embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. While certain embodiments of the present disclosure are shown in the drawings, it is to be understood that the present disclosure may be embodied in various forms and should not be construed as limited to the embodiments set forth herein, but rather are provided for a more thorough and complete understanding of the present disclosure. It should be understood that the drawings and embodiments of the disclosure are for illustration purposes only and are not intended to limit the scope of the disclosure.

The term "include" and variations thereof as used herein are open-ended, i.e., "including but not limited to". The term "based on" is "based, at least in part, on". The term "one embodiment" means "at least one embodiment"; the term "another embodiment" means "at least one additional embodiment"; the term "some embodiments" means "at least some embodiments". Relevant definitions for other terms will be given in the following description.

It should be noted that the terms "first", "second", and the like in the present disclosure are only used for distinguishing different devices, modules or units, and are not used for limiting the order or interdependence relationship of the functions performed by the devices, modules or units.

The terminology used in the description of the various described examples in this disclosure is for the purpose of describing particular examples only and is not intended to be limiting. Unless the context clearly indicates otherwise, if the number of elements is not specifically limited, the elements may be one or more. Furthermore, the term "and/or" as used in this disclosure is intended to encompass any and all possible combinations of the listed items.

FIG. 1 is a schematic diagram illustrating an electronic computing device 100 according to an example embodiment. As shown in fig. 1, the electronic computing device 100 includes a chassis 110, a heat sink including a first heat sink 120 and a second heat sink 130, and a general control box 140. The case 110 has a plurality of operation panel groups installed therein, and the plurality of operation panel groups include a plurality of operation panels on which a large number of chips are integrated, thereby greatly improving the computing power of the apparatus.

In the situation shown in fig. 1, the electronic computing device 100 is in a non-operational state, and the first heat dissipation assembly 120 and the second heat dissipation assembly 130 are separated from the chassis 110. Based on the design, the heat dissipation device and other components of the equipment are respectively arranged in the transportation and carrying processes of the equipment, so that the efficiency can be improved.

Referring to fig. 1, the first heat dissipation assembly 120 includes a first frame 121 adapted to an air inlet of the chassis 110; the second heat dissipation assembly 130 includes a second frame 131 adapted to the air outlet of the chassis 110. The first frame 121 has a first fan group 122 mounted therein, the second frame 131 has a second fan group 132 mounted therein, and each of the first fan group 122 and the second fan group 132 includes at least one fan. At least one first connection component 1211 is disposed on a sidewall of the first frame 121, at least one second connection component 1311 is disposed on a sidewall of the second frame, at least one third connection component 1101 is disposed on a sidewall of the air inlet of the chassis 110, and at least one fourth connection component 1102 is disposed on a sidewall of the air outlet.

Referring to fig. 2, the heat sink is shown tool-lessly mounted to the chassis 110. Specifically, the at least one first connection component 1211 is coupled to the at least one third connection component 1101 to form at least one first detachable pair 12, and the at least one second connection component 1311 is coupled to the at least one fourth connection component 1102 to form at least one second detachable pair 13, so as to tool-lessly mount the first heat dissipation assembly 120 and the second heat dissipation assembly 130 to the chassis 110, respectively.

Referring to fig. 1 and 2, a plurality of interfaces on the central control box 140 are also shown, including the main power socket 20, the main power switch 10, the network cable interface 30, the first heat sink power interface 41, and the second heat sink power interface 42. Preferably, as shown in fig. 2, the first heat sink assembly 121 and the second heat sink assembly 131 are connected in parallel to the power module of the console box by the electric wire 91 plugged into the first heat sink power interface 41 and the electric wire 92 plugged into the second heat sink power interface 42, respectively. Therefore, when the electronic computing device 100 operates, the air duct formed by the parallel arrangement of the operation boards enables the first fan group 122 and the second fan group 132 to form forced convection of air in the chassis 110 when the first fan group 122 and the second fan group 132 operate, so as to achieve heat dissipation to the inside of the chassis.

By means of the design, after the heat dissipation device is transported to the target position, workers can quickly put the equipment on the shelf and conveniently assemble the heat dissipation device to the machine box of the equipment without tools, and the equipment can be operated only by connecting the corresponding power line and the corresponding network cable to the main power socket 20 and the network cable interface 30.

Preferably, the first fan set 122 and the second fan set 132 are symmetrically arranged, that is, the number of fans of the first fan set 122 is the same as that of the second fan set 132. Also, preferably, at least one fan of the first fan group 122 is connected in series, and at least one fan of the first fan group 122 is connected in series. In addition, notches may be preset on the frame of the heat dissipation assembly, such as the notch 123 on the first frame 121 and the notch 133 on the second frame 131 in fig. 1, to facilitate the positioning and storage of the power cord.

It should be noted that although the electronic computing device 100 is shown in fig. 1 and 2 as having multiple computing board sets, the concepts of the present disclosure are fully applicable to electronic computing devices having one computing board set.

The chassis and the headcontrol of an electronic computing device according to the present disclosure are described in detail below with reference to fig. 3. FIG. 3 is a schematic block diagram illustrating a chassis 310 and a grandmaster box 340 of an electronic computing device according to an example embodiment. The enclosure 310 is provided with a plurality of

operation panel groups

351, 352, 353. Taking the operation board group 351 as an example, it includes a plurality of

operation boards

361, 362, 363 arranged in parallel. According to the example of fig. 2, a plurality of

operation board groups

351, 352, 353 are arranged in the vertical direction. According to another embodiment, the plurality of operation plate groups may be arranged in the lateral direction. According to another embodiment, the plurality of operation plate groups may be arranged in the lateral and longitudinal directions. The number of the operation board groups and the number of the operation boards may be specifically designed according to the size of the whole chassis, and are not limited to the number illustrated in the present disclosure.

According to the example of fig. 3, the general control box 340 is fixedly hung on the side wall of the cabinet 310. According to other embodiments, the main control box may be disposed on the top of the chassis, or in any suitable location.

The master control box 340 includes a control module (not shown) and a power module (not shown). The control module and the power module may be of conventional design. For example, the control module is electrically connected to a plurality of operation panels in the chassis through separate wires, respectively, to control the corresponding operation panels. The power supply module is also electrically connected to the plurality of operation boards through separate electric wires, respectively.

The present disclosure provides an interface design of a master control box and a chassis, which performs grouping control and power supply on an operation panel in the chassis in a one-by-one manner. This will be explained below with reference to fig. 4 and 5.

FIG. 4 is a schematic diagram illustrating an interface between a chassis 410 and a grandmaster box 440 of an electronic computing device, according to an example embodiment. The master control box 440 is provided with a plurality of control signal

main interfaces

61, 62, 63 and a plurality of power supply

main interfaces

71, 72, 73 by group. A plurality of control signal sub-interfaces and a plurality of power supply sub-interfaces are also arranged on each layer of operation panel in the case 410, and are respectively connected with the main interface on the main control box. Taking the operation panel group 451 of the first layer as an example, it includes three

operation panels

461, 462, 463. Wherein, the operation panel 461 is provided with a control signal sub-interface 61a and a power supply sub-interface 71 a; the operation board 462 is provided with a control signal sub-interface 61b and a power supply sub-interface 71 b; the arithmetic board 463 is provided with a control signal sub-interface 61c and a power supply sub-interface 71 c. The main interfaces of the groups on the master control box can be correspondingly and electrically connected with the auxiliary interfaces of the corresponding operation boards on the operation board group through electric wires.

According to some embodiments, a strip-by-strip wire with a double joint, such as shown in fig. 5, is used for the connection. Fig. 5 is a schematic diagram illustrating an interface wiring 50 according to an example embodiment. As shown in fig. 5, the line 50 has one primary interface end and three secondary interface ends. The main interface end has a control signal main connector D1 and a power main connector D2. Referring to fig. 4, the control signal main connector D1 can be plugged into the control signal main interface 61 of the console box 440, and the power supply main connector D2 can be plugged into the power supply main interface 71 of the console box 440. The three secondary interface ends also respectively have two connectors which can be respectively plugged into corresponding interfaces on the operation board. Referring again to fig. 4, for example, the control signal sub-connector a1 is plugged into the control signal sub-interface 61a of the computing board 461, and the power supply sub-connector a2 is plugged into the power supply sub-interface 71a of the computing board 461. The rest connectors are correspondingly inserted and connected in an analogized way. Through the double-joint one-strip-multiple-wire shown in fig. 5, the hardware expenditure is saved while the power management and the signal control of the master control box to each layer of operation board group are effectively realized.

For the exemplary chassis 310 and the general control box 340 shown in fig. 3, the chassis 410 includes three computing

board groups

351, 352, and 353, so that only three double connectors shown in fig. 5 are needed to complete the connection with multiple wires, thereby implementing the control of each computing board. According to some embodiments, a plurality of heads with more heads can be designed according to the number of operation boards included in each operation board group. For example, one may include, but is not limited to, one with three, one with four, and so on.

In addition, as shown in fig. 3,

notches

81, 82, and 83 are reserved on the housing 310 for positioning and accommodating the wires of each layer.

Referring back to fig. 1 and 2, there is shown at least one first connection member 1211 forming a removable at least one first assembly pair 12 with at least one third connection member 1101, and at least one second connection member 1311 forming a removable at least one second assembly pair 13 with at least one fourth connection member 1102. The first fitting pair 12 and the second fitting pair 13 may have the same configuration or different configurations. That is, the first heat dissipation assembly 121 at the air inlet and the second heat dissipation assembly 131 at the air outlet may be tool-lessly mounted to the chassis 110 by using the same or different structures.

In fig. 1 and 2, the first assembly pair 12 and the second assembly pair 13 are hook-type, that is, the first connection part 1211 and the second connection part 1311 on the frame of the heat sink are hooks, and the third connection part 1101 and the fourth connection part 1102 on the chassis are card slots.

However, according to other embodiments, it is also possible to employ: the first connection unit 1211 and the second connection unit 1311 of the frame of the heat sink are each a card slot, and the third connection unit 1101 and the fourth connection unit 1102 of the chassis are each a hook. Also, the assembly pairs may be implemented using a variety of tool-less mounting configurations, including but not limited to snap-fit, bayonet, push-slot, and the like.

Fig. 6 is a schematic diagram illustrating an assembly pair configuration of a tool-less mounted heat sink according to another exemplary embodiment, wherein the assembly pair has a reinforced design. Referring to fig. 6, the third connecting part 6101 is still a snap groove, and the first connecting part 6211 is a modified hook having a first jaw 6212. The fitting guide surface on the first claw 6212 is provided as an inclined surface. Therefore, the fan assembly has a guiding function in the assembling process, the gravity of the fan assembly can be dispersed into the locking force of a part of the fan assembly and the case through the inclined plane, and the heat dissipation assembly and the case are assembled more firmly.

Although embodiments or examples of the present disclosure have been described with reference to the accompanying drawings, it is to be understood that the above-described methods, systems, and apparatus are merely exemplary embodiments or examples and that the scope of the present application is not limited by these embodiments or examples, but only by the claims as issued and their equivalents. Various elements in the embodiments or examples may be omitted or may be replaced with equivalents thereof. Further, the steps may be performed in an order different from that described in the present disclosure. Further, various elements in the embodiments or examples may be combined in various ways. It is important that as technology evolves, many of the elements described herein may be replaced with equivalent elements that appear after the present disclosure.

Some exemplary aspects of the disclosure are described below.

An electronic computing device, characterized in that the electronic computing device comprises:

a chassis having one or more operation panel groups each including a plurality of operation panels arranged in parallel; and

the heat dissipation device comprises a first heat dissipation component arranged at the air inlet of the case and a second heat dissipation component arranged at the air outlet of the case and used for dissipating heat inside the case,

wherein the first and second heat dissipation assemblies are separable from the chassis and tool-lessly mounted to the chassis.

Aspect 2. the electronic computing device of aspect 1,

the first heat dissipation assembly includes:

a first frame including at least one first connection part provided to a sidewall of the frame;

the second heat dissipation assembly includes:

a second frame including at least one second connection member provided to a sidewall of the frame;

the case comprises at least one third connecting part arranged at the air inlet, at least one fourth connecting part arranged at the air outlet, and

wherein the at least one first connecting component and the at least one third connecting component form at least one first detachable pair, and the at least one second connecting component and the at least one fourth connecting component form at least one second detachable pair, so that the first heat dissipation assembly and the second heat dissipation assembly are respectively tool-lessly mounted to the chassis.

Aspect 3. the electronic computing device of any of aspects 1-2, further comprising a central control box, the central control box comprising:

a controller electrically connected to the plurality of operation panels through electric wires to control the respective operation panels; and

a power supply electrically connected to the plurality of operation panels through wires.

Aspect 4. the electronic computing device of aspect 3, wherein the wire is a two terminal, multiple wire with a control signal terminal and a power terminal.

Aspect 5. the electronic computing device of aspect 4,

the master control box comprises a plurality of control signal main interfaces and a plurality of power supply main interfaces, and

the plurality of operation panels comprise a corresponding plurality of control signal sub-interfaces and a plurality of power supply sub-interfaces,

wherein each control signal primary interface is connected to a corresponding plurality of control signal secondary interfaces and each power source primary interface is connected to a corresponding plurality of power source secondary interfaces through the dual terminal one-to-many electric wire.

Aspect 6 the electronic computing device of aspect 2, wherein the first connection component is a hook or a card slot and the third connection component is a card slot or a hook that mates with the first connection component.

Aspect 7. the electronic computing device of aspect 6, wherein the hook has a first catch with a mating guide surface configured as a ramp.

Aspect 8 the electronic computing device of any of aspects 1-2, 6-7, wherein the first heat sink assembly and the second heat sink assembly are electrically connected to the power source in parallel.

Aspect 9 the electronic computing device of any of aspects 1-2, 6-7, wherein the one or more computing board sets are arranged in a lateral and/or longitudinal direction.

Aspect 10 the electronic computing device of any of aspects 2, 6-7, wherein the first heat dissipation assembly comprises a first fan set mounted to the first frame and the second heat dissipation assembly comprises a second fan set mounted to the second frame, wherein the first fan set and the second fan set each comprise at least one fan.

The electronic computing device of aspect 10, wherein the first fan set is disposed symmetrically to the second fan set.

Aspect 12 the electronic computing device of any of aspects 2, 6-7, wherein the first assembled pair is identical to the second assembled pair.

Claims

1. An electronic computing device, wherein the electronic computing device comprises:

2. The electronic computing device of claim 1,

the first heat dissipation assembly includes:

a first frame including at least one first connection part provided to a sidewall of the frame; the second heat dissipation assembly includes:

3. The electronic computing device of any of claims 1-2, further comprising a central control box, the central control box comprising:

4. The electronic computing device of claim 3, wherein the wire is a two-terminal, multiple-tap wire having a control signal terminal and a power terminal.

5. The electronic computing device of claim 4,

6. The electronic computing device of claim 2, wherein the first connection component is a hook or a card slot, and the third connection component is a card slot or a hook that mates with the first connection component.

7. The electronic computing device of claim 6, wherein the hook has a first catch with a mating guide surface configured as a ramp.

8. The electronic computing device of any of claims 1-2, 6-7, wherein the first heat dissipation assembly and the second heat dissipation assembly are electrically connected to the power source in parallel.

9. The electronic computing device of any of claims 1-2, 6-7, wherein the one or more computing board sets are arranged in a lateral and/or longitudinal direction.

10. The electronic computing device of any of claims 2, 6-7, wherein the first heat dissipation assembly comprises a first fan set mounted to the first frame and the second heat dissipation assembly comprises a second fan set mounted to the second frame, wherein the first fan set and the second fan set each comprise at least one fan.