CN110780718A

CN110780718A - Electronic computing device

Info

Publication number: CN110780718A
Application number: CN201911253293.3A
Authority: CN
Inventors: 陈强; 张文娟; 管健
Original assignee: Beijing Yixian Technology Co Ltd
Current assignee: Beijing Yixian Technology Co Ltd
Priority date: 2019-12-09
Filing date: 2019-12-09
Publication date: 2020-02-11

Abstract

The present disclosure provides an electronic computing device. It includes: a chassis having one or more operation panel groups each including a plurality of operation panels arranged in parallel; and the heat dissipation device comprises a first heat dissipation assembly arranged at an air inlet of the case and a second heat dissipation assembly arranged at an air outlet of the case, and is used for dissipating heat inside the case, wherein the first heat dissipation assembly comprises: the first frame is hinged to the air inlet of the case at one side, so that the first frame can pivot around the case; and the second heat dissipation assembly includes: and one side of the second frame is hinged to the air outlet of the case, so that the second frame can pivot around the case.

Description

Electronic computing device

Technical Field

The present disclosure relates to computing devices, and more particularly to high performance electronic computing devices.

Background

With the demand for high-speed processing of large-scale data operations, research and development of high-performance electronic computing devices has been promoted. For example, in order to meet the processing requirements of a large number of operations for a block-chain device, a plurality of operation boards having a plurality of specialized processing chips are generally used to form such an electronic computing device. Theoretically, the larger the number of chips, the stronger the computing power of the device. On the other hand, since these operation boards with a large number of chips are generally installed in a single chassis, the power consumption of the operation boards with a large number of chips is relatively high, and thus the heat dissipation requirement of the device is very high.

Also, since the heat dissipation of the chip may fail in time, a problem may occur in a long continuous operation of the fan, and thus, periodic or irregular replacement and maintenance of the individual components are also required.

Unless otherwise indicated, it should not be assumed that any of the approaches described in this section qualify as prior art merely by virtue of their inclusion in this section. Similarly, unless otherwise indicated, the problems mentioned in this section should not be considered as having been acknowledged in any prior art.

Disclosure of Invention

The present disclosure provides an electronic computing device, which integrates a plurality of operation board groups, can realize large-scale high-speed operation, and can be conveniently opened and closed to facilitate replacement and maintenance of components because a heat dissipation device is a pivoting structure.

According to one aspect of the present disclosure, there is provided a chassis having one or more operation panel groups each including a plurality of operation panels arranged in parallel; and the heat dissipation device comprises a first heat dissipation assembly arranged at an air inlet of the case and a second heat dissipation assembly arranged at an air outlet of the case, and is used for dissipating heat inside the case, wherein the first heat dissipation assembly comprises: the first frame is hinged to the air inlet of the case at one side, so that the first frame can pivot around the case; and the second heat dissipation assembly includes: and one side of the second frame is hinged to the air outlet of the case, so that the second frame can pivot around the case.

Optionally, the electronic computing device further comprises a general control box, and the general control box comprises: a controller electrically connected to the plurality of operation panels through electric wires to control the respective operation panels; and a power supply electrically connected to the plurality of operation panels through the electric wires.

Preferably, the electric wire is a double-connector multi-cord electric wire having a control signal connector and a power connector.

The first heat sink assembly and the second heat sink assembly may be electrically connected in parallel to the power source.

The one or more operation panel groups may be arranged in a lateral direction and/or a longitudinal direction.

Optionally, the master control box may include a plurality of control signal main interfaces and a plurality of power supply main interfaces, and the plurality of operation boards may include a corresponding plurality of control signal sub-interfaces and a plurality of power supply sub-interfaces. Wherein each control signal primary interface is connectable to a corresponding plurality of control signal secondary interfaces and each power source primary interface is connectable to a corresponding plurality of power source secondary interfaces via the two-terminal multi-wire-on-wire.

Preferably, the first heat dissipation assembly includes a first fan set mounted to the first frame, and the second heat dissipation assembly includes a second fan set mounted to the second frame, wherein the first fan set and the second fan set respectively include at least one fan.

Preferably, the first fan set and the second fan set are symmetrically arranged.

The one side of the first frame may be fixedly hinged to an air inlet of the cabinet.

Preferably, the one side of the first frame is detachably hinged to an air inlet of the cabinet, so that the first heat dissipation assembly can be separated from the cabinet and mounted to the cabinet without tools.

Preferably, one side of the first frame is provided with a first connecting part, and an air inlet of the chassis is provided with a second connecting part, wherein the first connecting part is an insertion shaft or an axle hole, and the second connecting part is an axle hole or an insertion shaft matched with the first connecting part.

Preferably, the hinge structure of the one side of the first frame is identical to the hinge structure of the one side of the second frame.

Preferably, the other side of the first frame is movably connected to the air inlet of the chassis, and the other side of the second frame is movably connected to the air outlet of the chassis.

Preferably, the other side of the first frame is provided with a third connection part having a latch hook; and a fourth connecting part is arranged at the air inlet of the case, and the fourth connecting part is provided with a movable pressing buckle and a locking ring which are matched with the locking hook so as to ensure that the first frame and the case can be locked.

Preferably, the movable connection structure of the other side of the first frame is the same as the movable connection structure of the other side of the second frame.

Drawings

The above and other features, advantages and aspects of various embodiments of the present disclosure will become more apparent from the following detailed description when taken in conjunction with the accompanying drawings. In the drawings, the same or similar reference numerals denote the same or similar elements. It should be understood that the drawings are schematic and that elements and features are not necessarily drawn to scale.

FIG. 1 is a schematic diagram illustrating an electronic computing device in which a first frame and a second frame of a heat sink are both in an open state, according to an example embodiment;

FIG. 2 is a schematic diagram illustrating an electronic computing device in which a first frame and a second frame of a heat sink are both in a closed state, according to an example embodiment;

FIG. 3 is a schematic block diagram illustrating a chassis and a headbox of an electronic computing device in accordance with an illustrative embodiment;

FIG. 4 is a schematic diagram showing an interface between a chassis of an electronic computing device and a headbox according to an example embodiment;

FIG. 5 is a schematic diagram illustrating interface wiring according to an example embodiment;

FIG. 6 is a schematic view illustrating a detachable hinge structure at one side of a heat sink according to another exemplary embodiment;

FIG. 7 is a schematic diagram illustrating an electronic computing device in accordance with another exemplary embodiment in which one side of a heat sink employs a detachable hinge structure as shown in FIG. 6;

fig. 8 is a schematic view illustrating another side of the heat sink in an articulating structure according to still another exemplary embodiment.

Detailed Description

Embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. While certain embodiments of the present disclosure are shown in the drawings, it is to be understood that the present disclosure may be embodied in various forms and should not be construed as limited to the embodiments set forth herein, but rather are provided for a more thorough and complete understanding of the present disclosure. It should be understood that the drawings and embodiments of the disclosure are for illustration purposes only and are not intended to limit the scope of the disclosure.

The term "include" and variations thereof as used herein are open-ended, i.e., "including but not limited to". The term "based on" is "based, at least in part, on". The term "one embodiment" means "at least one embodiment"; the term "another embodiment" means "at least one additional embodiment"; the term "some embodiments" means "at least some embodiments". Relevant definitions for other terms will be given in the following description.

It should be noted that the terms "first", "second", and the like in the present disclosure are only used for distinguishing different devices, modules or units, and are not used for limiting the order or interdependence relationship of the functions performed by the devices, modules or units.

The terminology used in the description of the various described examples in this disclosure is for the purpose of describing particular examples only and is not intended to be limiting. Unless the context clearly indicates otherwise, if the number of elements is not specifically limited, the elements may be one or more. Furthermore, the term "and/or" as used in this disclosure is intended to encompass any and all possible combinations of the listed items.

FIG. 1 is a schematic diagram illustrating an electronic computing device 100 according to an example embodiment. As shown in fig. 1, the electronic computing device 100 includes a chassis 110, a heat sink including a first heat sink 120 and a second heat sink 130, and a general control box 140. The case 110 has a plurality of operation panel groups installed therein, and the plurality of operation panel groups include a plurality of operation panels on which a large number of chips are integrated, thereby greatly improving the computing power of the apparatus.

In the case shown in fig. 1, the first frame 121 of the first heat dissipation assembly 120 and the second frame 131 of the second heat dissipation assembly 130 of the electronic computing device 100 are both in an open state.

Referring to fig. 1, the first heat dissipation assembly 120 includes a first frame 121 adapted to an air inlet of the chassis 110; the second heat dissipation assembly 130 includes a second frame 131 adapted to the air outlet of the chassis 110. The first frame 121 has a first fan group 122 mounted therein, the second frame 131 has a second fan group 132 mounted therein, and each of the first fan group 122 and the second fan group 132 includes at least one fan. Wherein, one side of the first frame 121 and one side of the second frame 131 are respectively hinged to the air inlet and the air outlet of the cabinet 110, so that the frames can pivot around the side of the cabinet. Based on such design, can conveniently change and maintain the operation board in the quick-witted case, and need not to dismantle radiator unit.

Referring to fig. 2, the first frame 121 of the first heat dissipation assembly 120 and the second frame 131 of the second heat dissipation assembly 130 are shown in a closed state.

Referring to fig. 1 and 2, a plurality of interfaces on the central control box 140 are also shown, including the main power socket 20, the main power switch 10, the network cable interface 30, the first heat sink power interface 41, and the second heat sink power interface 42. Preferably, as shown in fig. 2, the first heat sink assembly 121 and the second heat sink assembly 131 are connected in parallel to the power module of the console box by the electric wire 91 plugged into the first heat sink power interface 41 and the electric wire 92 plugged into the second heat sink power interface 42, respectively. Therefore, when the electronic computing device 100 operates, the air duct formed by the parallel arrangement of the operation boards enables the first fan group 122 and the second fan group 132 to form forced convection of air in the chassis 110 when the first fan group 122 and the second fan group 132 operate, so as to achieve heat dissipation to the inside of the chassis.

Preferably, the first fan set 122 and the second fan set 132 are symmetrically arranged, that is, the number of fans of the first fan set 122 is the same as that of the second fan set 132. Also, preferably, at least one fan of the first fan group 122 is connected in series, and at least one fan of the first fan group 122 is connected in series. In addition, notches may be preset on the frame of the heat dissipation assembly, such as the notch 123 on the first frame 121 and the notch 133 on the second frame 131 in fig. 1, to facilitate the positioning and storage of the power cord.

It should be noted that although the electronic computing device 100 is shown in fig. 1 and 2 as having multiple computing board sets, the concepts of the present disclosure are fully applicable to electronic computing devices having one computing board set.

The chassis and the headcontrol of an electronic computing device according to the present disclosure are described in detail below with reference to fig. 3. FIG. 3 is a schematic block diagram illustrating a chassis 310 and a grandmaster box 340 of an electronic computing device according to an example embodiment. The enclosure 310 is provided with a plurality of

operation panel groups

351, 352, 353. Taking the operation board group 351 as an example, it includes a plurality of

operation boards

361, 362, 363 arranged in parallel. According to the example of fig. 2, a plurality of

operation board groups

351, 352, 353 are arranged in the vertical direction. According to another embodiment, the plurality of operation plate groups may be arranged in the lateral direction. According to another embodiment, the plurality of operation plate groups may be arranged in the lateral and longitudinal directions. The number of the operation board groups and the number of the operation boards may be specifically designed according to the size of the whole chassis, and are not limited to the number illustrated in the present disclosure.

According to the example of fig. 3, the general control box 340 is fixedly hung on the side wall of the cabinet 310. According to other embodiments, the main control box may be disposed on the top of the chassis, or in any suitable location.

The master control box 340 includes a control module (not shown) and a power module (not shown). The control module and the power module may be of conventional design. For example, the control module is electrically connected to a plurality of operation panels in the chassis through separate wires, respectively, to control the corresponding operation panels. The power supply module is also electrically connected to the plurality of operation boards through separate electric wires, respectively.

The present disclosure provides an interface design of a master control box and a chassis, which performs grouping control and power supply on an operation panel in the chassis in a one-by-one manner. This will be explained below with reference to fig. 4 and 5.

FIG. 4 is a schematic diagram illustrating an interface between a chassis 410 and a grandmaster box 440 of an electronic computing device, according to an example embodiment. The master control box 440 is provided with a plurality of control signal

main interfaces

61, 62, 63 and a plurality of power supply

main interfaces

71, 72, 73 by group. A plurality of control signal sub-interfaces and a plurality of power supply sub-interfaces are also arranged on each layer of operation panel in the case 410, and are respectively connected with the main interface on the main control box. Taking the operation panel group 451 of the first layer as an example, it includes three

operation panels

461, 462, 463. Wherein, the operation panel 461 is provided with a control signal sub-interface 61a and a power supply sub-interface 71 a; the operation board 462 is provided with a control signal sub-interface 61b and a power supply sub-interface 71 b; the arithmetic board 463 is provided with a control signal sub-interface 61c and a power supply sub-interface 71 c. The main interfaces of the groups on the master control box can be correspondingly and electrically connected with the auxiliary interfaces of the corresponding operation boards on the operation board group through electric wires.

According to some embodiments, a strip-and-multiple wire with a double joint, such as shown in fig. 5, may be used for the connection. Fig. 5 is a schematic diagram illustrating an interface wiring 50 according to an example embodiment. As shown in fig. 5, the line 50 has one primary interface end and three secondary interface ends. The main interface end has a control signal main connector D1 and a power main connector D2. Referring to fig. 4, the control signal main connector D1 can be plugged into the control signal main interface 61 of the console box 440, and the power supply main connector D2 can be plugged into the power supply main interface 71 of the console box 440. The three secondary interface ends also respectively have two connectors which can be respectively plugged into corresponding interfaces on the operation board. Referring again to fig. 4, for example, the control signal sub-connector a1 is plugged into the control signal sub-interface 61a of the computing board 461, and the power supply sub-connector a2 is plugged into the power supply sub-interface 71a of the computing board 461. The rest connectors are correspondingly inserted and connected in an analogized way. Through the double-joint one-strip-multiple-wire shown in fig. 5, the hardware expenditure is saved while the power management and the signal control of the master control box to each layer of operation board group are effectively realized.

For the exemplary chassis 310 and the general control box 340 shown in fig. 3, the chassis 410 includes three computing

board groups

351, 352, and 353, so that only three double connectors shown in fig. 5 are needed to complete the connection with multiple wires, thereby implementing the control of each computing board. According to some embodiments, a plurality of heads with more heads can be designed according to the number of operation boards included in each operation board group. For example, one may include, but is not limited to, one with three, one with four, and so on.

In addition, as shown in fig. 3,

notches

81, 82, and 83 are reserved on the housing 310 for positioning and accommodating the wires of each layer.

Referring back to fig. 1 and 2, it is shown that the hinge structure 12 of one side of the first frame 121 and one side of the second frame 131 and the hinge structure 13 of the cabinet 110 are both fixed hinge structures. It should be noted that the hinge structure of the first frame 121 and the second frame 131 may be the same or different from the hinge structure of the chassis 110, and any manner of pivoting the frames around the chassis may be adopted.

In practice, in order to reduce the cost of electricity, a large amount of equipment needs to be installed in an area where the electricity resources are abundant, such as in the vicinity of a solar power plant, a wind power plant, a hydroelectric power plant, and the like, and thus there is a real need for transportation and racking efficiency of the large amount of equipment. Moreover, these areas often lack a large number of specialized technicians, and thus require ease of operation and maintenance of the equipment.

Based on this, the hinge structure of the frame and one side of the chassis can be set as a detachable hinge structure. Therefore, the heat dissipation device can be separated from the case, and transportation and shelving are facilitated. Fig. 6 is a schematic view illustrating a detachable connection structure on one side of a heat sink according to another exemplary embodiment. The first connecting part 6211 may be a shaft hole provided on a sidewall of the first frame 621 of the first heat dissipation assembly, and the second connecting part 6101 may be a shaft hole provided on a sidewall of the chassis 610. The structure not only can enable the heat dissipation device to pivot around the case, and is convenient to maintain, but also can be convenient for workers to mount and detach the heat dissipation device without tools.

It should be noted that, according to actual conditions, one side of the first heat dissipation assembly and one side of the second heat dissipation assembly may be both hinged to the chassis by using a fixed hinge structure, or both may be hinged to the chassis by using a detachable hinge structure, or one of them may be hinged to the chassis by using a fixed hinge structure while the other is hinged to the chassis by using a detachable hinge structure.

Fig. 7 is a diagram illustrating an electronic computing device 700 according to another exemplary embodiment, wherein a side of the first heat dissipation assembly 720 and a side of the second heat dissipation assembly 730 both employ the plug-in connection structure shown in fig. 6. Specifically, taking the second heat dissipation assembly 730 located at the air outlet as an example, the side wall of the second frame 731 is provided with an insertion shaft 7311, and the side wall of the air outlet of the chassis 710 is provided with a shaft hole 7101. Therefore, when the heat dissipation assembly and the chassis need to be assembled for use, only the insertion shaft needs to be inserted into the shaft hole; when the heat dissipation assembly needs to be detached from the chassis, the insertion shaft only needs to be pulled out of the shaft hole. According to other embodiments, for example, a shaft hole may be disposed on the second frame 731 of the second heat dissipation assembly 730, and a shaft may be disposed at the air outlet of the chassis 710.

With such a design, separate heat sinks can be shipped separately, improving shipping efficiency. After the equipment is moved to the target position, workers can quickly put the equipment on a shelf and conveniently assemble the heat dissipation device to the case of the equipment without tools, and the equipment can be operated and operated simply by connecting the corresponding power line and the corresponding network cable.

Fig. 8 is a schematic view illustrating another side of the heat sink in an articulating structure according to still another exemplary embodiment. Referring to fig. 8, the articulating structures 84 and 85 are in the form of snap locks. Specifically, taking the first heat dissipation assembly 820 disposed at the air inlet as an example, a third connection component 8213 having a locking hook 8214 is disposed on a side wall of the first frame 821 of the first heat dissipation assembly 820, and a fourth connection component 8103 having a movable pressing buckle 8104 and a locking ring 8105 is disposed at the air inlet of the chassis 810. When the first heat dissipation assembly 821 needs to be closed, the locking ring 8105 is only required to be sleeved on the locking hook 8214, and then the movable press buckle 8104 is pressed to enable the locking ring 8105 to be tightly sleeved on the locking hook 8214. When the first heat dissipation assembly 821 needs to be opened, the movable pressing buckle 8104 is lifted, and the lock ring 8105 is separated from the lock hook 8214. It should be noted that the articulating structures 84 and 85 may be the same or different. In addition, according to other embodiments, the movable connection structure may also adopt a manner of a buckle, a slot, or the like.

Although embodiments or examples of the present disclosure have been described with reference to the accompanying drawings, it is to be understood that the above-described methods, systems and apparatus are merely exemplary embodiments or examples and that the scope of the present invention is not limited by these embodiments or examples, but only by the claims as issued and their equivalents. Various elements in the embodiments or examples may be omitted or may be replaced with equivalents thereof. Further, the steps may be performed in an order different from that described in the present disclosure. Further, various elements in the embodiments or examples may be combined in various ways. It is important that as technology evolves, many of the elements described herein may be replaced with equivalent elements that appear after the present disclosure.

Some exemplary aspects of the disclosure are described below.

An electronic computing device, characterized in that the electronic computing device comprises:

a chassis having one or more operation panel groups each including a plurality of operation panels arranged in parallel; and

the heat dissipation device comprises a first heat dissipation component arranged at the air inlet of the case and a second heat dissipation component arranged at the air outlet of the case and used for dissipating heat inside the case, wherein,

the first heat dissipation assembly includes:

the first frame is hinged to the air inlet of the case at one side, so that the first frame can pivot around the case; and

the second heat dissipation assembly includes:

and one side of the second frame is hinged to the air outlet of the case, so that the second frame can pivot around the case.

Aspect 2. the electronic computing device of aspect 1, further comprising a central control box, the central control box comprising:

a controller electrically connected to the plurality of operation panels through electric wires to control the respective operation panels; and

a power supply electrically connected to the plurality of operation panels through the electric wires.

Aspect 3. the electronic computing device of aspect 2, wherein the wire is a two terminal, multiple wire with a control signal terminal and a power terminal.

Aspect 4. the electronic computing device of aspect 3,

the master control box comprises a plurality of control signal main interfaces and a plurality of power supply main interfaces, and

the plurality of operation panels comprise a corresponding plurality of control signal sub-interfaces and a plurality of power supply sub-interfaces,

wherein each control signal primary interface is connected to a corresponding plurality of control signal secondary interfaces and each power source primary interface is connected to a corresponding plurality of power source secondary interfaces through the dual terminal one-to-many electric wire.

Aspect 5 the electronic computing device of any of aspects 2-4, wherein the first heat dissipation assembly and the second heat dissipation assembly are electrically connected to the power source in parallel.

Aspect 6 the electronic computing device of any of aspects 1-4, wherein the one or more computing board sets are arranged in a lateral and/or longitudinal direction.

Aspect 7 the electronic computing device of any of aspects 1-4, wherein the first heat dissipation assembly comprises a first fan set mounted to the first frame and the second heat dissipation assembly comprises a second fan set mounted to the second frame, wherein the first fan set and the second fan set each comprise at least one fan.

The electronic computing device of aspect 7, wherein the first fan set is disposed symmetrically to the second fan set.

Aspect 9 the electronic computing device of any of aspects 1-4, wherein the one side of the first frame is fixedly hinged to an air inlet of the chassis.

Aspect 10 the electronic computing device of any of aspects 1-4, wherein the one side of the first frame is removably hinged to an air inlet of the chassis to enable the first heat dissipation assembly to be separated from the chassis and tool-lessly mounted to the chassis.

Aspect 11 the electronic computing device of aspect 10, wherein the one side of the first frame is provided with a first connection component, the air inlet of the chassis is provided with a second connection component,

the first connecting part is an insertion shaft or a shaft hole, and the second connecting part is a shaft hole or an insertion shaft matched with the first connecting part.

Aspect 12 the electronic computing device of any of aspects 1-4, wherein the hinge structure of the one side of the first frame is the same as the hinge structure of the one side of the second frame.

Aspect 13 is the electronic computing device of any of aspects 1-4, wherein another side of the first frame is movably connected to an air inlet of the chassis, and another side of the second frame is movably connected to an air outlet of the chassis.

Aspect 14, the electronic computing device of aspect 13,

a third connecting part is arranged on the other side of the first frame, and the third connecting part is provided with a locking hook; and is

And a fourth connecting part is arranged at the air inlet of the case, and is provided with a movable pressing buckle and a locking ring which are matched with the locking hook so as to ensure that the first frame and the case can be locked.

Aspect 15 the electronic computing device of aspect 13, wherein the articulating structure of the other side of the first frame is the same as the articulating structure of the other side of the second frame.

Claims

1. An electronic computing device, wherein the electronic computing device comprises:

the first heat dissipation assembly includes:

the second heat dissipation assembly includes:

2. The electronic computing device of claim 1, further comprising a central control box, the central control box comprising:

3. The electronic computing device of claim 2, wherein the wire is a two-terminal, multiple-tap wire having a control signal terminal and a power terminal.

4. The electronic computing device of claim 3,

5. The electronic computing device of any of claims 1-4, wherein the one side of the first frame is fixedly hinged to an air inlet of the chassis.

6. The electronic computing device of any of claims 1-4, wherein the one side of the first frame is removably hinged to an air inlet of the chassis to enable the first heat dissipation assembly to be detached from the chassis and tool-lessly mounted to the chassis.

7. The electronic computing device of claim 6, wherein the one side of the first frame is provided with a first connection component, the inlet of the chassis is provided with a second connection component,

8. The electronic computing device of any of claims 1-4, wherein the hinge structure of the one side of the first frame is the same as the hinge structure of the one side of the second frame.

9. The electronic computing device of any of claims 1-4, wherein another side of the first frame is movably coupled to an air inlet of the chassis and another side of the second frame is movably coupled to an air outlet of the chassis.

10. The electronic computing device of claim 9,