CN110944491A - Radiator for photoelectric device - Google Patents

Radiator for photoelectric device Download PDF

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Publication number
CN110944491A
CN110944491A CN201911217773.4A CN201911217773A CN110944491A CN 110944491 A CN110944491 A CN 110944491A CN 201911217773 A CN201911217773 A CN 201911217773A CN 110944491 A CN110944491 A CN 110944491A
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CN
China
Prior art keywords
heat dissipation
radiating
connecting plate
fixedly connected
joint
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201911217773.4A
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Chinese (zh)
Inventor
王若潼
刘枫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jiangsu Normal University
Original Assignee
Jiangsu Normal University
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jiangsu Normal University filed Critical Jiangsu Normal University
Priority to CN201911217773.4A priority Critical patent/CN110944491A/en
Publication of CN110944491A publication Critical patent/CN110944491A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
    • H05K7/20418—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing the radiating structures being additional and fastened onto the housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/0217—Mechanical details of casings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/0217—Mechanical details of casings
    • H05K5/0234—Feet; Stands; Pedestals, e.g. wheels for moving casing on floor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20309—Evaporators
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20318—Condensers

Abstract

The photoelectric device radiator comprises a vertical cylinder, wherein an outer radiating device is arranged on the outer side wall of the vertical cylinder, the outer radiating device comprises a plurality of radiating aluminum fins, the radiating aluminum fins are vertically and uniformly arranged, an inner radiating device is arranged on the inner side wall of the vertical cylinder, the inner radiating device comprises a group of radiating pipes, radiating media are placed in the radiating pipes, the upper ends of the radiating pipes are connected with condensing plates, the lower end of the vertical cylinder is provided with a connecting plate, and the connecting plate is fixedly connected to a base of the photoelectric device through screws. The high-efficiency heat dissipation device for the photoelectric device is simple in structure, good in heat dissipation effect and good in protection performance.

Description

Radiator for photoelectric device
Technical Field
The invention relates to a heat dissipation device, in particular to a radiator of an optoelectronic device.
Background
Various photoelectric devices often generate a large amount of heat in the working process, and if the heat dissipation is not timely, the temperature of the photoelectric devices rises, so that the stability and the reliability of the photoelectric devices are greatly reduced. Most of the existing heat dissipation devices for photovoltaic devices adopt simple heat dissipation fins or heat pipes, and the heat dissipation efficiency is low.
Disclosure of Invention
The present invention is directed to an optoelectronic device heat sink that solves the problems set forth above in the background.
In order to achieve the purpose, the invention provides the following technical scheme:
the photoelectric device radiator comprises a vertical cylinder, wherein an outer radiating device is arranged on the outer side wall of the vertical cylinder, the outer radiating device comprises a plurality of radiating aluminum fins, the radiating aluminum fins are vertically and uniformly arranged, an inner radiating device is arranged on the inner side wall of the vertical cylinder, the inner radiating device comprises a group of radiating pipes, radiating media are placed in the radiating pipes, the upper ends of the radiating pipes are connected with condensing plates, the lower end of the vertical cylinder is provided with a connecting plate, and the connecting plate is fixedly connected to a base of the photoelectric device through screws.
Preferably, the upper end of the vertical cylinder is provided with an outwards-opened cornice, and the upper ends of the radiating pipes and the condensing plate are arranged on the upper end face of the cornice.
Preferably, on the lower terminal surface of eaves mouth and the up end of connecting plate respectively fixedly connected with go up joint strip and joint strip down, upward be provided with the joint groove in joint strip and the joint strip down, the protection network is installed to the joint between the joint groove of upper and lower both sides, fixedly connected with handle on the outer terminal surface of protection network.
Preferably, the top of the clamping groove on the upper side is fixedly connected with a spring, and the lower end of the spring is fixedly connected with a pressing plate.
Preferably, the bottom of the radiating pipe is provided with an expansion end, and the diameter of the inner cavity of the expansion end is 3-4 times of that of the inner cavity of the other part.
Preferably, a buffer pad is arranged between the connecting plate and the base.
Compared with the prior art, the invention has the beneficial effects that:
according to the invention, the outer heat dissipation device dissipates heat generated by the photoelectric device through the heat dissipation aluminum fins, the liquid heat dissipation medium in the heat dissipation pipe in the inner heat dissipation device absorbs the heat generated by the photoelectric device and evaporates into gas, then the gaseous heat dissipation medium is condensed back to liquid state under the action of the condensation plate and flows back to the bottom of the heat dissipation pipe again, the two heat dissipation modes are carried out synchronously, and the heat dissipation efficiency is greatly improved. The cornice is used for installing the condensation plate. The protection network is used for protecting heat dissipation aluminium fin, and the network structure of protection network does not influence heat dispersion of heat dissipation aluminium fin simultaneously, and its dismouting is convenient for to the joint mounting means of protection network. The diameter of the inner cavity of the expansion end is 3-4 times of that of the inner cavity of other parts, so that more heat dissipation media can be stored conveniently. The high-efficiency heat dissipation device for the photoelectric device is simple in structure, good in heat dissipation effect and good in protection performance.
Drawings
FIG. 1 is a schematic diagram of a heat sink for an optoelectronic device;
fig. 2 is a partially enlarged view of fig. 1 at K.
In FIGS. 1-2: 1-vertical cylinder, 2-connecting plate, 3-cornice, 4-upper clamping strip, 5-lower clamping strip, 6-protective screen, 7-handle, 8-clamping groove, 9-spring, 10-pressing plate, 11-buffer pad, 12-base, 13-screw, 14-photoelectric device, 15-external heat dissipation device, 16-heat dissipation aluminum fin, 17-internal heat dissipation device, 18-heat dissipation device, 19-condensation plate and 20-expansion end.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-2, the present invention provides a technical solution:
the photoelectric device radiator comprises a vertical cylinder 1, wherein an outer radiating device 15 is arranged on the outer side wall of the vertical cylinder 1, the outer radiating device 15 comprises a plurality of radiating aluminum fins 16, the radiating aluminum fins 16 are vertically and uniformly arranged, an inner radiating device 17 is arranged on the inner side wall of the vertical cylinder 1, the inner radiating device 17 comprises a group of radiating pipes 18, radiating media are placed in the radiating pipes 18, the upper ends of the radiating pipes 18 are connected with a condensing plate 19, a connecting plate 2 is arranged at the lower end of the vertical cylinder 1, and the connecting plate 2 is fixedly connected to a base 12 of a photoelectric device 14 through screws 13.
When the heat dissipation device works, the outer heat dissipation device 15 dissipates heat generated by the photoelectric device 14 through the heat dissipation aluminum fins 16, the liquid heat dissipation medium in the heat dissipation tube 18 in the inner heat dissipation device 17 absorbs the heat generated by the photoelectric device 14 and evaporates into gas, then the gaseous heat dissipation medium is condensed back to liquid state under the action of the condensation plate 19 and flows back to the bottom of the heat dissipation tube 18 again, the two heat dissipation modes are performed synchronously, and the heat dissipation efficiency is greatly improved.
Preferably, the upper end of the vertical tube 1 is provided with an cornice 3 which is outwardly opened, and the upper ends of the radiating pipes 18 and the condensing plate 19 are installed on the upper end surface of the cornice 3.
The cornice 3 is used for mounting the condensation plate 19.
Preferably, on the lower terminal surface of eaves mouth 3 and the up end of connecting plate 2 respectively fixedly connected with go up joint strip 4 and joint strip 5 down, upward be provided with joint groove 8 in joint strip 4 and the joint strip 5 down, the protection network 6 is installed to the joint between the joint groove 8 of upper and lower both sides, fixedly connected with handle 7 on the outer terminal surface of protection network 6.
The protective net 6 is used for protecting the heat dissipation aluminum fins 16, meanwhile, the net structure of the protective net 6 does not affect the heat dissipation performance of the heat dissipation aluminum fins, and the protective net 6 is convenient to assemble and disassemble in a clamping installation mode.
Preferably, a spring 9 is fixedly connected to the top of the upper clamping groove 8, and a pressing plate 10 is fixedly connected to the lower end of the spring 9.
During installation, the upper end of the protective net 6 is clamped in the clamping groove 8 on the upper side, then the pressing plate 10 is pushed upwards to move upwards, the lower end of the protective net 6 is clamped in the clamping groove 8 on the lower side, and the pressing plate 10 fixes the protective net 6 in the clamping grooves 8 on the upper side and the lower side under the action of the spring 9.
Preferably, the bottom of the radiating pipe 18 is provided with an expansion end 20, and the inner cavity diameter of the expansion end 20 is 3-4 times that of the other parts.
The inner cavity diameter of the expansion end 20 is 3-4 times of the inner cavity diameter of other parts, so that more heat dissipation media can be stored conveniently.
Preferably, a cushion pad 11 is disposed between the connection plate 2 and the base 12.
The buffer pad 11 is used to improve the connection tightness between the connection plate 2 and the base 12.
The working principle of the invention is as follows:
when the heat dissipation device works, the outer heat dissipation device 15 dissipates heat generated by the photoelectric device 14 through the heat dissipation aluminum fins 16, the liquid heat dissipation medium in the heat dissipation tube 18 in the inner heat dissipation device 17 absorbs the heat generated by the photoelectric device 14 and evaporates into gas, then the gaseous heat dissipation medium is condensed back to liquid state under the action of the condensation plate 19 and flows back to the bottom of the heat dissipation tube 18 again, the two heat dissipation modes are performed synchronously, and the heat dissipation efficiency is greatly improved. The cornice 3 is used for mounting the condensation plate 19. The protective net 6 is used for protecting the heat dissipation aluminum fins 16, meanwhile, the net structure of the protective net 6 does not affect the heat dissipation performance of the heat dissipation aluminum fins, and the protective net 6 is convenient to assemble and disassemble in a clamping installation mode. During installation, the upper end of the protective net 6 is clamped in the clamping groove 8 on the upper side, then the pressing plate 10 is pushed upwards to move upwards, the lower end of the protective net 6 is clamped in the clamping groove 8 on the lower side, and the pressing plate 10 fixes the protective net 6 in the clamping grooves 8 on the upper side and the lower side under the action of the spring 9. The inner cavity diameter of the expansion end 20 is 3-4 times of the inner cavity diameter of other parts, so that more heat dissipation media can be stored conveniently. The buffer pad 11 is used to improve the connection tightness between the connection plate 2 and the base 12.

Claims (6)

1. Photoelectric device radiator, including founding a section of thick bamboo (1), be provided with outer heat abstractor (15) on the lateral wall of founding a section of thick bamboo (1), outer heat abstractor (15) include a plurality of heat dissipation aluminium fins (16), its characterized in that: the vertical align to grid of heat dissipation aluminium fin (16), heat abstractor (17) in being provided with on the inside wall of founding a section of thick bamboo (1), interior heat abstractor (17) are including a set of cooling tube (18), place the radiating medium in cooling tube (18), the upper end of cooling tube (18) is connected with condensing plate (19), and the lower extreme of founding a section of thick bamboo (1) is provided with connecting plate (2), connecting plate (2) are through screw (13) fixed connection on base (12) of photoelectric device (14).
2. The optoelectronic device heat sink of claim 1, wherein: the upper end of the vertical cylinder (1) is provided with an outwards-opened cornice (3), and the upper end of the radiating pipe (18) and the condensing plate (19) are arranged on the upper end surface of the cornice (3).
3. The optoelectronic device heat sink of claim 2, wherein: on the lower terminal surface of eaves mouth (3) and the up end of connecting plate (2) respectively fixedly connected with go up joint strip (4) and joint strip (5) down, go up and be provided with joint groove (8) in joint strip (4) and joint strip (5) down, protection network (6) are installed to the joint between the joint groove (8) of upper and lower both sides, fixedly connected with handle (7) on the outer terminal surface of protection network (6).
4. The optoelectronic device heat sink of claim 3, wherein: the top fixedly connected with spring (9) in the joint groove (8) of upside, the lower extreme fixedly connected with clamp plate (10) of spring (9).
5. The optoelectronic device heat sink of claim 1, wherein: the bottom of the radiating pipe (18) is provided with an expansion end (20), and the diameter of the inner cavity of the expansion end (20) is 3-4 times that of the inner cavities of other parts.
6. The optoelectronic device heat sink of claim 1, wherein: a buffer pad (11) is arranged between the connecting plate (2) and the base (12).
CN201911217773.4A 2019-12-03 2019-12-03 Radiator for photoelectric device Pending CN110944491A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201911217773.4A CN110944491A (en) 2019-12-03 2019-12-03 Radiator for photoelectric device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201911217773.4A CN110944491A (en) 2019-12-03 2019-12-03 Radiator for photoelectric device

Publications (1)

Publication Number Publication Date
CN110944491A true CN110944491A (en) 2020-03-31

Family

ID=69909680

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201911217773.4A Pending CN110944491A (en) 2019-12-03 2019-12-03 Radiator for photoelectric device

Country Status (1)

Country Link
CN (1) CN110944491A (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5825621A (en) * 1997-06-12 1998-10-20 Harris Corporation Closed loop cooling housing for printed circuit card-mounted, sealed heat exchanger
CN201577257U (en) * 2009-09-22 2010-09-08 北京奇宏科技研发中心有限公司 Heat dissipating structure provided with loop heat pipe cavity
CN102238842A (en) * 2010-04-21 2011-11-09 王训忠 Heat dissipation structure of electric device
CN105992492A (en) * 2015-02-09 2016-10-05 丁彥允 Computer heat radiation module assembly of stack type printed circuit boards

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5825621A (en) * 1997-06-12 1998-10-20 Harris Corporation Closed loop cooling housing for printed circuit card-mounted, sealed heat exchanger
CN201577257U (en) * 2009-09-22 2010-09-08 北京奇宏科技研发中心有限公司 Heat dissipating structure provided with loop heat pipe cavity
CN102238842A (en) * 2010-04-21 2011-11-09 王训忠 Heat dissipation structure of electric device
CN105992492A (en) * 2015-02-09 2016-10-05 丁彥允 Computer heat radiation module assembly of stack type printed circuit boards

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Application publication date: 20200331