CN105992492A - Computer heat radiation module assembly of stack type printed circuit boards - Google Patents
Computer heat radiation module assembly of stack type printed circuit boards Download PDFInfo
- Publication number
- CN105992492A CN105992492A CN201510066592.1A CN201510066592A CN105992492A CN 105992492 A CN105992492 A CN 105992492A CN 201510066592 A CN201510066592 A CN 201510066592A CN 105992492 A CN105992492 A CN 105992492A
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- Prior art keywords
- printed circuit
- pcb
- circuit board
- heat
- module assembly
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Abstract
The invention discloses a computer heat radiation module assembly of stack type printed circuit boards. The computer heat radiation module assembly is used for containing a plurality of printed circuit boards which are arranged in a stacking manner. The computer heat radiation module assembly is characterized in that the computer heat radiation assembly has a fin frame, a heat conduction plate and two cover plates, wherein the fin frame is open and is capable of containing the printed circuit boards; the two opposite faces of the fin frame have a plurality of symmetrical and isometric positioning supports, the head conduction plate is used for conducting the heat generated by the electronic components on the printed circuit board to the fin frame and is leaned against the isometric positioning supports, and the cover plates are used for isolating the internal of the fin frame from the external. As a result, the computer heat radiation module assembly of the stack type printed circuit boards can conduct the heat generated by the electronic components on the printed circuit boards to the fin frame and can increase the heat conduction radiation area by maximizing area through the fins of the fin frame in order to achieve the effects of no noise and fast and effective heat radiation.
Description
Technical field
The present invention relates to the computer heat radiation structure of a kind of printed circuit board (PCB), particularly to a kind of stacking-type printing electricity
The computer heat radiation structure of road plate.
Background technology
Owing to the electronic building brick in computer operationally can produce heat, it is therefore necessary to install heat abstractor,
So that its operating temperature is maintained in the range of allowing, the too high meeting of operating temperature causes its degradation even to lose
Effect.But, the higher assembly of middle heating of computer includes the central processing unit being arranged on computer main board
(central processing unit, CPU), display adapter and hard disk (Hard Disk Drive is called for short HDD)
Deng electronic building brick or parts, it all needs after enabling to synchronize to dispel the heat in higher efficiency can continue to transport normally
Make.In order to solve the problem of heat radiation, modal mode utilizes heat transfer and thermal convection current two ways exactly
Dispel the heat.In terms of heat transfer, it will usually at above-mentioned heat generating component radiating fin installed above, and in heat
Convection current aspect, then be to use radiator fan, or use the cooling tube with heat transfer and thermal convection current function
Reach heat radiation.Therefore, after heat produced by the heat generating component in computer or parts is delivered to radiating fin,
The mode of convection current i.e. can be utilized to fall heat dissipation.
It is noted that owing to current science and technology is maked rapid progress, so that central processing unit (central in the past
Processing unit, CPU), the electronics such as display adapter and hard disk (Hard Disk Drive is called for short HDD)
The processing speed of assembly or parts with the processing speed of current Related product cannot compared with, and simply permissible
A world of difference is described, also because so, heat produced by this Related product has also been decades of times in the past
Or more than hundreds times；But, utilize the prior art that heat transfer dispels the heat with thermal convection current mode, be all mainly by
Its design is carried out in computer outer cover；It is to say, the prior art be prior to central processing unit,
Connecing after setting a radiating fin above the electronic building bricks such as hard disk or parts, recycling is arranged in this computer outer cover
Radiator fan running produce convection current and by the ring beyond the heat dissipation of this radiating fin to this computer outer cover
Border.But, owing to the space in this computer outer cover is very limited so that this radiating fin formed dissipate
Hot side is long-pending inevitable relatively small, and this radiating fin is still to be sealed and placed in this computer outer cover, therefore will be tight
Ghost image rings the radiating effect of its heat transfer and thermal convection current；Further, since fan is also divided into two kinds, one is axial flow
Formula fan, another is centrifugal fan.This tube-axial fan is that air-flow leads into blade, then via leaf
The rotation of piece makes air-flow parallel blowout along hub central axle, and its feature is that static pressure is little, air quantity is big；And should be from
Core type fan is then to utilize powered disc type wheel hub to draw fluid into, then via the power rotating air-flow
Blow out along runner to external radiation along blade, be characterized in that static pressure must be high compared to axial-flow type, but should
Noise produced by centrifugal fan then comes compared to axial-flow type must be much bigger.To sum up learn, either profit
Produce convection current with this tube-axial fan or this centrifugal fan and dispel the heat, all have the problem making a noise and produce
Raw, it is not inconsistent consumer demand in fact.
Content of the invention
Present invention is primarily targeted at the above-mentioned problem of the prior art of solution, not only can effectively solve radiating surface
Amass not enough and affect the problem of radiating effect, a kind of noiselessness is also provided and there is bigger heat conducting and radiating area
Radiator structure, to accord with needed for consumer.
According to above-mentioned purpose, the present invention proposes the computer heat radiation module assembly of a kind of stacking-type printed circuit board (PCB),
Described computer heat radiation module assembly is to be installed with multiple printed circuit board (PCB) being set up by stacked manner；It is special
Levy and be: described computer heat radiation module assembly possesses to be had one to open and be installed with the fin of this printed circuit board (PCB)
In framework, and this fin framework, wherein two corresponding surfaces possess the equidistant positioning supporting frame having multiple symmetry；At least
One is able to conduct and by being located at this heat energy produced by electronic building brick on this printed circuit board (PCB) to this fin framework
The heat-conducting plate of equidistant positioning supporting frame；And, two in order to be intercepted this fin lower portion with outside
Cover plate.
Further, the computer heat radiation module assembly of described stacking-type printed circuit board (PCB), it is characterised in that
Possessing between described fin framework and this cover plate has a cooling tube.
Further, the computer heat radiation module assembly of described stacking-type printed circuit board (PCB), it is characterised in that
It is cold in order to connect this that described fin framework and this cover plate are respectively arranged with one with half cambered surface according to this cooling tube shape respectively
But the conduit mounting groove of pipe and conduit compress groove.
Further, the computer heat radiation module assembly of described stacking-type printed circuit board (PCB), it is characterised in that
Described printed circuit board (PCB) have one must with storehouse up or another this printed circuit board (PCB) of lower section be electrically connected with company
Connect device；Described heat-conducting plate then offers the connector fluting that at least one this connector of offer penetrates.
Further, the computer heat radiation module assembly of described stacking-type printed circuit board (PCB), it is characterised in that
Described fin framework also has at least one and connects interface in order to the signal transmitting this printed circuit board signal；And institute
State heat-conducting plate and then offer the wire fluting that the wire of at least one offer this signal connection interface penetrates.
Further, the computer heat radiation module assembly of described stacking-type printed circuit board (PCB), it is characterised in that
Possess between described heat-conducting plate and this equidistant positioning supporting frame and have at least one positioning lock this heat-conducting plate must fixed
Firmware.
Further, the computer heat radiation module assembly of described stacking-type printed circuit board (PCB), it is characterised in that
Described fin framework inner bottom part also has a conducting mount contacting with this heat-conducting plate；And this heat-conducting plate and this print
Have at least one in order to conduct on this printed circuit board (PCB) electronic building brick heat energy to this heat-conducting plate between printed circuit board
Conduction pad.
By technique scheme, the beneficial effect that the present invention is reached compared to prior art essence exists
In: the first, the present invention can by this heat-conducting plate by heat energy produced by electronic building brick on this printed circuit board (PCB) to this
Fin framework conducts, and utilizes the fin of this fin framework to form the surface area of maximum to increase heat conducting and radiating
Area, to reach noiselessness and more rapid radiating effect effectively；Furthermore two, the present invention also can coordinate this
Cooling tube set between fin framework and this cover plate, reaches more rapid and essence radiating effect effectively.
Brief description
Fig. 1 is the stereoscopic schematic diagram of present pre-ferred embodiments.
Fig. 2 is the decomposing schematic representation of Fig. 1 of the present invention.
Fig. 3～Figure 16 is sectional perspective and the floor map of Fig. 1 assembled inside continuous action of the present invention.
Detailed description of the invention
About the computer heat radiation module assembly of stacking-type printed circuit board (PCB) of the present invention, its preferred embodiment and
Detailed technology content, after hereby coordinating graphic explanation such as.First, please refer to shown in Fig. 1 and Fig. 2；For this
The stereoscopic of invention preferred embodiment and decomposing schematic representation.As shown in the figure it can be seen that, described computer dissipate
Thermal modules assembly 10 is to be installed with multiple printed circuit board (PCB) 15 being set up by stacked manner；Possessing has out
Putting and be installed with the fin framework 11 of this printed circuit board (PCB) 15, the outer surface of this fin framework 11 (comprises the end
Face) it is provided with in multiple fin, and this fin framework 11 wherein two corresponding surfaces and possess the equidistant positioning having multiple symmetry
Bracing frame 111；At least one is also had to be able to heat energy produced by electronic building brick on this printed circuit board (PCB) 15 to this fin
Piece framework 11 conducts and by being located at the heat-conducting plate 13 of this equidistant positioning supporting frame 111；Wherein, described heat-conducting plate 13
And possess between this equidistant positioning supporting frame 111 and have at least one positioning lock firmware this heat-conducting plate 13 must fixed
14；Moreover, described fin framework 11 inner bottom part also has a conducting mount 12 contacting with this heat-conducting plate 13,
With profit, the heat energy of this heat-conducting plate 13 of bottom is conducted to this fin framework 11 bottom surface；And this heat-conducting plate 13 with should
Have at least one between printed circuit board (PCB) 15 and lead to this in order to conduct electronic building brick heat energy on this printed circuit board (PCB) 15
The conduction pad 121 of hot plate 13；And, described computer heat radiation module assembly 10 has been also equipped with two in order to by this fin
Internal and the outside cover plate 17 being intercepted of piece framework 11；Between wherein said fin framework 11 and this cover plate 17
Then possess and have a cooling tube 16, this cooling tube 16 be by high elongated, the hollow of heat conductivity, two close
Made by metal tube, this cooling tube 16 pipe can use skill built with fraction of liquid, the inwall of this cooling tube 16
Art processes and makes it have capillary structure；After pyrotoxin is touched in the local of this cooling tube 16, the liquid in pipe is subject to
I.e. reaching boiling point after Re and vaporizing and evaporate, the gas after evaporation moves towards this cooling tube 16 position above, so
After can by tube wall by heat discharge, again revert back to liquid and be attached to tube wall, because inside pipe wall has capillary
Structure, now liquid then can use capillary principle to start down to reflux, and again flows back to below this cooling tube 16 again
Position close to pyrotoxin；So i.e. form the cooling system of a Natural Circulation；In brief, this cooling
The evaporation after vaporization of pipe 16 liquid in pipe, gas starts to flow with convection type and coordinate tube wall to carry out heat transfer
Heat radiation, is re-condensed into liquid after the gas condensation after heat radiation, just can reflux once again in capillary mode；Due to
The heat transfer rate of this cooling tube 16 can reach copper and the hundreds times of silver, and asks without noise produced by radiator fan
Topic, therefore really can effectively make user obtain peace and quiet, the operating environment of low temperature；In addition, described fin
It is cold in order to connect this that piece framework 11 and this cover plate 17 are respectively arranged with one with half cambered surface according to this cooling tube 16 shape respectively
But the conduit mounting groove 113 of pipe 16 compresses groove 171 with conduit；Obtain in addition, described printed circuit board (PCB) 15 has one
With storehouse up or another this printed circuit board (PCB) 15 of lower section be electrically connected with connector 151；And described heat-conducting plate
13 offer the connector fluting 132 that at least one this connector 151 of offer penetrates；And, described fin frame
Frame 11 also has at least one and connects interface 112 in order to the signal transmitting this printed circuit board (PCB) 15 signal；And institute
State heat-conducting plate 13 and then offer the wire fluting that the wire of at least one offer this signal connection interface 112 penetrates
131。
In order to be able to the computer heat radiation module assembly becoming apparent from that stacking-type printed circuit board (PCB) of the present invention is described, then please be with
When refering to shown in Fig. 3～Figure 16；Sectional perspective for the assembled inside continuous action of present pre-ferred embodiments
With floor map.First, as shown in Figure 3 and Figure 4 it can be seen that, in described fin framework 11 wherein
Two corresponding surfaces possess the equidistant positioning supporting frame 111 having multiple symmetry；And this fin framework 11 inner bottom part can be first
One conducting mount 12 contacting with this heat-conducting plate 13 is set, the equidistant positioning above this conducting mount 12
One heat-conducting plate 13 is set on bracing frame 111, and by this heat-conducting plate 13 and is somebody's turn to do with each and every one positioning locking parts 14 many
Equidistant positioning supporting frame 111 is fixing as shown in figs. 5 and 6；Owing to this conducting mount 12 just can be led with this
Hot plate 13 contacts, therefore can be conducive to the heat energy of this heat-conducting plate 13 of bottom to this fin framework 11 bottom surface
Conduction；Then, after this heat-conducting plate 13 is provided above a conduction pad 121, then by printed circuit board (PCB)
15 screw locks are fixed on this conduction pad 121, and this conduction pad 121 i.e. may be used to conduct this printed circuit board (PCB)
On 15, electronic building brick heat energy is to this heat-conducting plate 13 as illustrated in figs. 7 and 8；Then, then offer with another
The heat-conducting plate 13 of connector fluting 132 is arranged at this equidistant positioning supporting frame above this printed circuit board (PCB) 15
On 111, to make the connector 151 on this printed circuit board (PCB) 15 can penetrate in this connector fluting 132,
And make the heat energy of electronic building brick above this printed circuit board (PCB) 15 can conduct to this fin frame via this heat-conducting plate 13
Frame 11 is as shown in Figures 9 and 10；Then, it is important that equally will be with positioning lock firmware 14 by this heat-conducting plate
13 fix with this equidistant positioning supporting frame 111, separately can lock above this heat-conducting plate 13 and set up another
Printed circuit board (PCB) 15, and utilize this connector 151 and this following printed circuit board (PCB) 15 to be electrically connected with such as figure
Shown in 11 and Figure 12；Same, can be set up another again on this printed circuit board (PCB) 15 and offer connector
Fluting 132 and the heat-conducting plate 13 of wire fluting 131, this wire fluting 131 can provide this signal to connect
The wire of mouth 112 penetrates this heat-conducting plate 13 and is electrically connected with this printed circuit board (PCB) 15 of lower section, and should
Above this printed circuit board (PCB) 15, heat energy produced by electronic building brick is to this fin framework 11 side face such as Figure 13 and figure
Shown in 14；Similarly, then with positioning lock firmware 14 by this heat-conducting plate 13 of the top and this equidistant positioning
Support 111 is fixed, and just can admittedly lock other printed circuit board (PCB) 15 above this heat-conducting plate 13 again
Conducted below this printed circuit board (PCB) 15 heat energy produced by electronic building brick to this fin framework 11 side face such as
Shown in Figure 15 and Figure 16；When the heat-conducting plate 13 of the above each layer is by electronics on each layer printed circuit board 15
Heat energy produced by assembly to this fin framework 11 conduction after, institute between this fin framework 11 and this cover plate 17
The radiating rate that the cooling tube 16 arranging just can play its function again and accelerate fin on this fin framework 11；
In this way, the present invention not only can be by this heat-conducting plate 13 by produced by electronic building brick on this printed circuit board (PCB) 15
Heat energy conducts to this fin framework 11, and the surface area utilizing the fin of this fin framework 11 to form maximum comes
Increase heat conducting and radiating area, to reach noiselessness and more rapid radiating effect effectively；The present invention also can join
Close cooling tube 16 set between this fin framework 11 and this cover plate 17, reach more rapid and essence is effective
Ground radiating effect.
Below the present invention is described in detail, only as described above, only presently preferred embodiments of the present invention
, when not limiting, with this, the scope that the present invention implements, i.e. all equalizations made according to claims of the present invention become
Change and modify, all should still belong in the patent covering scope of the present invention.
Claims (10)
1. a computer heat radiation module assembly for stacking-type printed circuit board (PCB), described computer heat radiation module assembly
(10) it is to be installed with multiple printed circuit board (PCB) (15) being set up by stacked manner；It is characterized in that:
Described computer heat radiation module assembly (10) possesses has one open and be installed with this printed circuit board (PCB) (15)
In fin framework (11), and this fin framework (11), wherein two corresponding surfaces possess the equidistant positioning having multiple symmetry
Bracing frame (111)；At least one is able to heat energy produced by upper for this printed circuit board (PCB) (15) electronic building brick to this fin
Piece framework (11) conducts and by being located at the heat-conducting plate (13) of this equidistant positioning supporting frame (111)；And, two in order to
By internal for this fin framework (11) and the outside cover plate (17) being intercepted.
2. the computer heat radiation module assembly of stacking-type printed circuit board (PCB) according to claim 1；Its feature exists
In possessing between described fin framework (11) and this cover plate (17) has a cooling tube (16).
3. the computer heat radiation module assembly of stacking-type printed circuit board (PCB) according to claim 2；Its feature exists
In described fin framework (11) and this cover plate (17) are respectively arranged with half cambered surface according to this cooling tube (16) shape respectively
One compresses groove (171) in order to connect the conduit mounting groove (113) of this cooling tube (16) and conduit.
4. the computer heat radiation module assembly of stacking-type printed circuit board (PCB) according to claim the 1st, 2 or 3；Its
Being characterised by, described printed circuit board (PCB) (15) has one with storehouse up or another this printed circuit of lower section
The connector (151) that plate (15) is electrically connected with；Described heat-conducting plate (13) then offers at least one this connection of offer
Connector fluting (132) that device (151) penetrates.
5. the computer heat radiation module assembly of stacking-type printed circuit board (PCB) according to claim the 1st, 2 or 3；Its
Being characterised by, described fin framework (11) also has at least one in order to transmit this printed circuit board (PCB) (15) signal
Signal connects interface (112)；Described heat-conducting plate (13) then offers at least one this signal of offer and connects interface
(112) wire fluting (131) that wire penetrates.
6. the computer heat radiation module assembly of stacking-type printed circuit board (PCB) according to claim 4；Its feature exists
In described fin framework (11) also has at least one in order to transmit the signal of this printed circuit board (PCB) (15) signal even
Connection interface (112)；Described heat-conducting plate (13) then offers at least one this signal of offer and connects leading of interface (112)
Wire fluting (131) that line penetrates.
7. the computer heat radiation module assembly of stacking-type printed circuit board (PCB) according to claim the 1st, 2 or 3；Its
It is characterised by possessing between described heat-conducting plate (13) and this equidistant positioning supporting frame (111) and have at least one must will be somebody's turn to do
The fixing positioning lock firmware (14) of heat-conducting plate (13).
8. the computer heat radiation module assembly of stacking-type printed circuit board (PCB) according to claim 6；Its feature exists
In possessing between described heat-conducting plate (13) and this equidistant positioning supporting frame (111) that have at least one must be by this heat-conducting plate
(13) the positioning lock firmware (14) fixed.
9. the computer heat radiation module assembly of stacking-type printed circuit board (PCB) according to claim the 1st, 2 or 3；Its
Being characterised by, described fin framework (11) inner bottom part also has a conducting mount contacting with this heat-conducting plate (13)
(12)；And have at least one between this heat-conducting plate (13) and this printed circuit board (PCB) (15) in order to conduct this printed circuit
The upper electronic building brick heat energy of plate (15) is to the conduction pad (121) of this heat-conducting plate (13).
10. the computer heat radiation module assembly of stacking-type printed circuit board (PCB) according to claim 8；Its feature
Being, described fin framework (11) inner bottom part also has a conducting mount (12) contacting with this heat-conducting plate (13)；
And have at least one between this heat-conducting plate (13) and this printed circuit board (PCB) (15) in order to conduct this printed circuit board (PCB)
(15) upper electronic building brick heat energy is to the conduction pad (121) of this heat-conducting plate (13).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510066592.1A CN105992492A (en) | 2015-02-09 | 2015-02-09 | Computer heat radiation module assembly of stack type printed circuit boards |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510066592.1A CN105992492A (en) | 2015-02-09 | 2015-02-09 | Computer heat radiation module assembly of stack type printed circuit boards |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105992492A true CN105992492A (en) | 2016-10-05 |
Family
ID=57038150
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510066592.1A Pending CN105992492A (en) | 2015-02-09 | 2015-02-09 | Computer heat radiation module assembly of stack type printed circuit boards |
Country Status (1)
| Country | Link |
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| CN (1) | CN105992492A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110944491A (en) * | 2019-12-03 | 2020-03-31 | 江苏师范大学 | Radiator for photoelectric device |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5825621A (en) * | 1997-06-12 | 1998-10-20 | Harris Corporation | Closed loop cooling housing for printed circuit card-mounted, sealed heat exchanger |
| US6055157A (en) * | 1998-04-06 | 2000-04-25 | Cray Research, Inc. | Large area, multi-device heat pipe for stacked MCM-based systems |
| US6778394B2 (en) * | 2002-09-25 | 2004-08-17 | Hitachi, Ltd. | Electronic device having a heat dissipation member |
| TWM291553U (en) * | 2005-12-13 | 2006-06-01 | Aaeon Technology Inc | Improved structure of fan-free mini-computer |
| CN204377320U (en) * | 2015-02-09 | 2015-06-03 | 英属维京群岛商百崴宇智股份有限公司台湾分公司 | The computer heat radiation module assembly of stacking-type printed circuit board (PCB) |
-
2015
- 2015-02-09 CN CN201510066592.1A patent/CN105992492A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5825621A (en) * | 1997-06-12 | 1998-10-20 | Harris Corporation | Closed loop cooling housing for printed circuit card-mounted, sealed heat exchanger |
| US6055157A (en) * | 1998-04-06 | 2000-04-25 | Cray Research, Inc. | Large area, multi-device heat pipe for stacked MCM-based systems |
| US6778394B2 (en) * | 2002-09-25 | 2004-08-17 | Hitachi, Ltd. | Electronic device having a heat dissipation member |
| TWM291553U (en) * | 2005-12-13 | 2006-06-01 | Aaeon Technology Inc | Improved structure of fan-free mini-computer |
| CN204377320U (en) * | 2015-02-09 | 2015-06-03 | 英属维京群岛商百崴宇智股份有限公司台湾分公司 | The computer heat radiation module assembly of stacking-type printed circuit board (PCB) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110944491A (en) * | 2019-12-03 | 2020-03-31 | 江苏师范大学 | Radiator for photoelectric device |
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