CN110776592B - Adhesive and preparation method thereof, pressure-sensitive adhesive tape and preparation method thereof - Google Patents

Adhesive and preparation method thereof, pressure-sensitive adhesive tape and preparation method thereof Download PDF

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Publication number
CN110776592B
CN110776592B CN201910982708.4A CN201910982708A CN110776592B CN 110776592 B CN110776592 B CN 110776592B CN 201910982708 A CN201910982708 A CN 201910982708A CN 110776592 B CN110776592 B CN 110776592B
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adhesive
acrylate
layer
preparation
azobisisobutyronitrile
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CN110776592A (en
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金闯
张自豪
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Taicang Sidike New Material Science and Technology Co Ltd
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Taicang Sidike New Material Science and Technology Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/12—Esters of monohydric alcohols or phenols
    • C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
    • C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/255—Polyesters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385—Acrylic polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/122—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2467/00—Presence of polyester
    • C09J2467/006—Presence of polyester in the substrate

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

The invention relates to an adhesive and a preparation method thereof, and a pressure-sensitive adhesive tape and a preparation method thereof. The adhesive comprises the following raw material components in parts by mass: 20-35 parts of butyl acrylate, 4-10 parts of hard monomer, 0.4-1 part of functional monomer, 0.1-0.5 part of initiator and 60-70 parts of solvent, wherein the hard monomer is selected from at least two of methyl acrylate, methyl methacrylate and glycidyl methacrylate, the functional monomer is selected from at least two of hydroxyethyl acrylate, acrylic acid and acrylamide, and the functional monomer contains hydroxyethyl acrylate. The adhesive disclosed by the invention is prepared by reasonably combining the raw material components of a hard monomer, a functional monomer, a soft monomer butyl acrylate and the like to form good physical crosslinking, so that the heat resistance of the adhesive is obviously improved, and no residual adhesive is left after the adhesive is attached to a product.

Description

Adhesive and preparation method thereof, pressure-sensitive adhesive tape and preparation method thereof
Technical Field
The invention relates to the technical field of pressure-sensitive adhesive tapes, in particular to an adhesive and a preparation method thereof, and a pressure-sensitive adhesive tape and a preparation method thereof.
Background
The solvent type acrylate pressure-sensitive adhesive is mainly formed by polymerizing acrylate substances and other vinyl monomer substances, is a viscoelastic material with liquid and solid characteristics, has liquid fluidity and wettability, has solid cohesive strength, and is widely applied to daily life and commercial products, such as the fields of automobiles, electronics, packaging, medical treatment, transportation and the like.
However, with the development of the pressure sensitive adhesive industry, the application range is continuously expanded, and the pressure sensitive adhesive also faces various challenges, such as poor high temperature resistance, poor electrolyte resistance, poor acid and alkali resistance, and the like. Particularly, the structural characteristics of the simple solvent type acrylic resin pressure-sensitive adhesive determine that the adhesive has poor heat resistance and becomes soft at high temperature, and residual adhesive is left after the product is attached. Therefore, the research on the high-temperature-resistant acrylate pressure-sensitive adhesive has great application value and market value.
Disclosure of Invention
Based on this, it is necessary to provide a novel adhesive which has good heat resistance and does not leave adhesive residue after a product is attached, aiming at the problems that the heat resistance of the traditional pressure-sensitive adhesive is not good and the adhesive residue can be left after the product is attached.
The adhesive comprises the following raw material components in parts by mass:
Figure BDA0002235715920000011
Figure BDA0002235715920000021
the hard monomer is at least two selected from methyl acrylate, methyl methacrylate and glycidyl methacrylate, the functional monomer is at least two selected from hydroxyethyl acrylate, acrylic acid and acrylamide, and the functional monomer contains hydroxyethyl acrylate.
In one embodiment, the functional monomer is a mixed functional monomer consisting of hydroxyethyl acrylate, acrylic acid and acrylamide, and the mass ratio of the hydroxyethyl acrylate to the acrylic acid to the acrylamide is (50-70): (20-25): (10-25).
In one embodiment, the initiator is at least one of azobisisobutyronitrile and azobisisoheptonitrile.
In one embodiment, the solvent is at least one of ethyl acetate and toluene.
The invention also provides a preparation method of the adhesive, which comprises the following steps:
weighing the raw material components according to the corresponding mass parts;
mixing butyl acrylate, a hard monomer, a functional monomer and a part of solvent to obtain a mixture;
adding an initiator to the mixture in stages and mixing, wherein the adding of the initiator to the mixture in stages comprises the following three stages: the first stage is as follows: under the atmosphere of protective gas, adding a part of initiator into the mixture, and reacting at the temperature of 66-67 ℃ for 2-3 h; the second stage is as follows: continuously adding another part of initiator into the mixture, and reacting at 73-75 ℃ for 2-3 h; the third stage is as follows: adding the rest of initiator into the mixture, and reacting at the temperature of 78-80 ℃ for 2-3 h; and
cooling, and adding the residual solvent to obtain the adhesive.
In one embodiment, in the first stage, the added initiator accounts for 0.05-0.1% of the total mass of the butyl acrylate, the hard monomer and the functional monomer, and in the second stage, the added initiator accounts for 0.15-0.25% of the total mass of the butyl acrylate, the hard monomer and the functional monomer.
The present invention also provides a pressure-sensitive adhesive tape comprising:
a substrate layer;
the adhesive layer is arranged on the surface of one side of the base material layer, and the raw material of the adhesive layer comprises the adhesive disclosed by any one of the invention or the adhesive prepared by the preparation method of the adhesive disclosed by any one of the invention; and
and the release film layer is arranged on the surface of one side of the adhesive layer, which is far away from the base material layer.
In one embodiment, the raw material of the adhesive layer further comprises a curing agent, and the curing agent is an isocyanate curing agent.
In one embodiment, the adhesive layer has a thickness of 10 μm to 50 μm.
The invention also provides a preparation method of the pressure-sensitive adhesive tape, which comprises the following steps:
forming an adhesive layer on the substrate layer, wherein the raw material of the adhesive layer comprises the adhesive disclosed by any one of the invention or the adhesive prepared by the preparation method of the adhesive disclosed by any one of the invention;
and forming a release film layer on the adhesive layer, and curing.
In one embodiment, in the step of forming the adhesive layer on the substrate layer, the adhesive prepared by the adhesive according to any one of the present invention or the preparation method of the adhesive according to any one of the present invention is coated on the substrate layer, and baked to form the adhesive layer; in the step of forming a release film layer on the adhesive layer, the release film layer is attached to the adhesive layer.
In one embodiment, the curing treatment condition is that the curing is performed for 70h-74h at 50-60 ℃.
Experiments prove that the adhesive has excellent heat resistance, and residual adhesive cannot be left after the adhesive is attached to a product. The applicant finds that the traditional solvent type acrylate adhesive cannot resist high temperature mainly because the storage modulus of the traditional solvent type acrylate adhesive is low at high temperature, the loss modulus of the traditional solvent type acrylate adhesive is high, the glue cannot keep the original shape, the glue layers are separated, and residual glue is left on an attached object. According to the adhesive disclosed by the invention, raw material components such as a hard monomer, a functional monomer, a soft monomer butyl acrylate and the like are reasonably matched, active functional groups such as hydroxyl, carboxyl, amide and the like are introduced, so that the components in the adhesive can form good physical crosslinking, the storage modulus of the adhesive at high temperature is improved, the loss modulus is reduced, the heat resistance of the adhesive is obviously improved, and no residual adhesive is left after a product is attached.
Detailed Description
The present invention will be described in detail with reference to the following embodiments in order to make the aforementioned objects, features and advantages of the invention more comprehensible. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
The embodiment of the invention provides an adhesive which comprises the following raw material components in parts by mass:
Figure BDA0002235715920000041
the hard monomer is at least two selected from methyl acrylate, methyl methacrylate and glycidyl methacrylate, the functional monomer is at least two selected from hydroxyethyl acrylate, acrylic acid and acrylamide, and the functional monomer contains hydroxyethyl acrylate.
Further, an embodiment of the present invention provides an adhesive, which includes the following raw material components in parts by mass:
Figure BDA0002235715920000051
the hard monomer is at least two selected from methyl acrylate, methyl methacrylate and glycidyl methacrylate, the functional monomer is at least two selected from hydroxyethyl acrylate, acrylic acid and acrylamide, and the functional monomer contains hydroxyethyl acrylate.
In one embodiment, the functional monomer is a mixed functional monomer composed of hydroxyethyl acrylate, acrylic acid and acrylamide, and when the functional monomer is a mixed functional monomer composed of hydroxyethyl acrylate, acrylic acid and acrylamide, the adhesive composed of the functional monomer has a higher storage modulus at high temperature and a lower loss modulus, so that the heat resistance of the adhesive is improved, and no residual adhesive is left after the adhesive is attached to a product. Furthermore, the mass ratio of the hydroxyethyl acrylate to the acrylic acid to the acrylamide is (40-60): (20-30): (20-30).
In one embodiment, the initiator is at least one of azobisisobutyronitrile and azobisisoheptonitrile, and the initiator has a low initiation temperature and can decompose the initiation reaction at 60 ℃.
In one embodiment, the solvent is at least one of ethyl acetate and toluene.
Experiments prove that the adhesive has excellent heat resistance, and residual adhesive cannot be left after the adhesive is attached to a product. The applicant finds that the traditional solvent type acrylate adhesive cannot resist high temperature mainly because the storage modulus of the traditional solvent type acrylate adhesive is low at high temperature, the loss modulus of the traditional solvent type acrylate adhesive is high, the glue cannot keep the original shape, the glue layers are separated, and residual glue is left on an attached object. According to the adhesive disclosed by the invention, raw material components such as a hard monomer, a functional monomer, a soft monomer butyl acrylate and the like are reasonably matched, active functional groups such as hydroxyl, carboxyl, amide and the like are introduced, so that the components in the adhesive can form good physical crosslinking, the storage modulus of the adhesive at high temperature is improved, the loss modulus is reduced, the heat resistance of the adhesive is obviously improved, the adhesive is not easy to soften at high temperature, and residual adhesive cannot be left after a product is attached.
The invention also provides a preparation method of the adhesive, which comprises the following steps:
s1, weighing the raw material components according to the corresponding parts by mass.
Wherein the raw materials comprise the following components in percentage by weight:
Figure BDA0002235715920000061
the hard monomer is at least two selected from methyl acrylate, methyl methacrylate and glycidyl methacrylate, the functional monomer is at least two selected from hydroxyethyl acrylate, acrylic acid and acrylamide, and the functional monomer contains hydroxyethyl acrylate.
S2, mixing butyl acrylate, hard monomer and functional monomer with a part of solvent to obtain a mixture.
The butyl acrylate, the hard monomer and the functional monomer are mixed with a part of the solvent to be uniform, and further, the butyl acrylate, the hard monomer and the functional monomer are mixed with a part of the solvent to be uniform by adopting a stirring mode. Further, the amount of the partial solvent added is 30 to 40 parts.
S3, adding the initiator to the mixture in stages, and mixing, wherein the step of adding the initiator to the mixture in stages comprises the following three stages: the first stage is as follows: under the atmosphere of protective gas, adding a part of initiator into the mixture, and reacting at the temperature of 66-67 ℃ for 2-3 h; the second stage is as follows: continuously adding another part of initiator into the mixture, and reacting at 73-75 ℃ for 2-3 h; the third stage is as follows: adding the rest of initiator into the mixture, and reacting at the temperature of 78-80 ℃ for 2-3 h.
Further, the shielding gas is nitrogen, although it is understood that the shielding gas may be an inert gas. Further, after continuously introducing nitrogen gas for 20min, an initiator was added to the mixture.
In the first stage, the added initiator accounts for 0.15-0.1% of the total mass of the butyl acrylate, the hard monomer and the functional monomer, and in the second stage, the added initiator accounts for 0.15-0.25% of the total mass of the butyl acrylate, the hard monomer and the functional monomer.
And S4, cooling, and adding the residual solvent in parts by mass to obtain the adhesive.
The preparation method of the adhesive is simple, and the method of adding the initiator in a staged manner is favorable for full reaction of all raw material components in the adhesive, so that the adhesive with good heat resistance and no residual adhesive left after a product is attached is obtained.
The present invention also provides a pressure-sensitive adhesive tape comprising: the substrate layer, locate the gluing layer on substrate layer one side surface with locate and keep away from the substrate layer the mould release rete on one side surface on gluing layer.
The base material layer is a main structure of the pressure-sensitive adhesive tape, and is further made of at least one material selected from biaxially oriented polypropylene (BOPP), Polyimide (PI) and polybutylene terephthalate (PET). It will of course be appreciated that the material of the substrate layer includes, but is not limited to, the materials described above.
The raw material of the adhesive layer comprises the adhesive disclosed by any one of the invention or the adhesive prepared by the preparation method disclosed by any one of the invention.
Applicants have found that conventional pressure sensitive adhesive tapes typically use polyimide as the substrate and silicone as the adhesive film. Although the temperature resistance of the pressure-sensitive adhesive tape can be improved to some extent, silicon tends to be easily transferred to the surface of the electronic circuit board, adversely affecting the electronic circuit board.
And the pressure sensitive adhesive tape gluing layer in this application chooses solvent type acrylate gluing agent as the raw materials for use, not only the raw materials low price, has the performance in the aspects such as bond strength, resistant ultraviolet, resistant weatherability simultaneously, more importantly moreover, its heat resistance is good, with appropriate curing agent reasonable collocation, can not leave the cull behind the laminating product.
In one embodiment, the raw material of the adhesive layer further comprises a curing agent, and the curing agent is an isocyanate curing agent. Furthermore, the curing agent is an L-75 type curing agent. Compared with epoxy curing agents (such as GA-514 curing agents), the isocyanate curing agents are more reasonable in matching with the adhesive, free of radical removal and free of residual adhesive. When the epoxy curing agent is matched with the adhesive disclosed by the invention, the prepared pressure-sensitive adhesive tape has the problems of basal removal and reduced adhesive force.
In one embodiment, the adhesive and the curing agent are mixed according to a mass ratio of (100:0.3) - (100: 1.5).
In one embodiment, the adhesive layer has a thickness of 10 μm to 50 μm. The thickness range is reasonable, the base material and the release film layer can be firmly bonded, and the use performance of the pressure-sensitive adhesive tape cannot be influenced due to the fact that the thickness of the adhesive layer is too thick.
The pressure-sensitive adhesive tape is simple in structure, free of base removal and adhesive force reduction in the using process, good in high-temperature resistance and free of residual adhesive residue in peeling.
The invention also provides a preparation method of the pressure-sensitive adhesive tape, which comprises the following steps:
forming an adhesive layer on the substrate layer, wherein the raw material of the adhesive layer comprises the adhesive disclosed by any one of the invention or the adhesive prepared by the preparation method of the adhesive disclosed by any one of the invention;
and forming a release film layer on the adhesive layer, and curing.
The invention also provides a preparation method of the pressure-sensitive adhesive tape, which comprises the following steps:
coating the adhesive prepared by any one of the adhesives or the preparation method of the adhesive on a substrate layer, and baking to form an adhesive layer; and attaching a release film layer on the adhesive layer, and curing.
In one embodiment, the baking condition is baking at 100-120 deg.C for 1-3 min.
In one embodiment, the curing treatment condition is that the curing is performed for 70h-74h at 50-60 ℃.
The preparation method of the pressure-sensitive adhesive tape is simple, the raw material cost is low, the prepared pressure-sensitive adhesive tape is not easy to have the problems of basal removal and adhesive force reduction, and the pressure-sensitive adhesive tape has the advantages of good high temperature resistance and no residual adhesive residue during stripping.
In order that the objects and advantages of the invention will be more clearly understood, the invention is further described in detail below with reference to examples. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Example 1
A preparation method of a high-temperature-resistant acrylate adhesive comprises the following steps:
229g of butyl acrylate, 15g of hydroxyethyl acrylate, 35g of methyl acrylate, 15g of glycidyl methacrylate, 3g of acrylic acid, 3g of acrylamide, 80g of toluene and 320g of ethyl acetate were charged into a reactor. Introducing nitrogen to remove air in the reactor under the stirring condition, adding 0.3g of azobisisobutyronitrile, and reacting at 66-67 ℃ for 2 hours; continuously adding 0.5g of azobisisobutyronitrile, and reacting for 3 hours at 73-75 ℃; adding 0.8g of azobisisobutyronitrile, and reacting for 2 hours at 78-80 ℃; and cooling and adding 300g of ethyl acetate serving as a solvent to obtain the high-temperature-resistant acrylate adhesive.
Example 2
A preparation method of a high-temperature-resistant acrylate adhesive comprises the following steps:
butyl acrylate 217, hydroxyethyl acrylate 21g, methyl acrylate 35g, glycidyl methacrylate 20g, acrylic acid 3.5g, acrylamide 3.5g, toluene 100g, ethyl acetate 300g were charged into the reactor. Introducing nitrogen to remove air in the reactor under the stirring condition, adding 0.2g of azobisisobutyronitrile, and reacting at 66-67 ℃ for 2 hours; continuously adding 0.4g of azobisisobutyronitrile, and reacting for 3 hours at 73-75 ℃; continuously adding 0.8g of azobisisobutyronitrile, and reacting for 2 hours at 78-80 ℃; and cooling and adding 300g of ethyl acetate serving as a solvent to obtain the high-temperature-resistant acrylate adhesive.
Example 3
A preparation method of a high-temperature-resistant acrylate adhesive comprises the following steps:
196g of butyl acrylate, 20g of hydroxyethyl acrylate, 35g of methyl acrylate, 42g of methyl methacrylate, 3.5g of acrylic acid, 3.5g of acrylamide, 80g of toluene and 320g of ethyl acetate were put into a reactor. Introducing nitrogen to remove air in the reactor under the stirring condition, adding 0.3g of azobisisobutyronitrile, and reacting at 66-67 ℃ for 2 hours; continuously adding 0.5g of azobisisobutyronitrile, and reacting for 3 hours at 73-75 ℃; continuously adding 0.8g of azobisisobutyronitrile, and reacting for 2 hours at 78-80 ℃; and cooling and adding 300g of ethyl acetate serving as a solvent to obtain the high-temperature-resistant acrylate adhesive.
Example 4
A preparation method of a high-temperature-resistant acrylate adhesive comprises the following steps:
233g of butyl acrylate, 15g of hydroxyethyl acrylate, 30g of methyl acrylate, 15g of methyl methacrylate, 4g of acrylic acid, 3g of acrylamide, 120g of toluene and 280g of ethyl acetate were charged into a reactor. Introducing nitrogen to remove air in the reactor under the stirring condition, adding 0.3g of azobisisobutyronitrile, and reacting at 66-67 ℃ for 2 hours; continuously adding 0.5g of azobisisobutyronitrile, and reacting for 3 hours at 73-75 ℃; continuously adding 0.8g of azobisisobutyronitrile, and reacting for 2 hours at 78-80 ℃; and cooling and adding 300g of ethyl acetate serving as a solvent to obtain the high-temperature-resistant acrylate adhesive.
Comparative example 1
A preparation method of a high-temperature-resistant acrylate adhesive comprises the following steps:
244g of butyl acrylate, 15g of hydroxyethyl acrylate, 35g of methyl acrylate, 6g of acrylic acid, 80g of toluene and 320g of ethyl acetate were charged into the reactor. Introducing nitrogen to remove air in the reactor under the stirring condition, adding 0.3g of azobisisobutyronitrile, and reacting at 66-67 ℃ for 2 hours; continuously adding 0.5g of azobisisobutyronitrile, and reacting for 3 hours at 73-75 ℃; continuously adding 0.8g of azobisisobutyronitrile, and reacting for 2 hours at 78-80 ℃; and cooling and adding 300g of ethyl acetate serving as a solvent to obtain the high-temperature-resistant acrylate adhesive.
Comparative example 2
A preparation method of a high-temperature-resistant acrylate adhesive comprises the following steps:
237g of butyl acrylate, 21g of hydroxyethyl acrylate, 35g of methyl acrylate, 3.5g of acrylic acid, 3.5g of acrylamide and 400g of ethyl acetate were charged into a reactor. Introducing nitrogen to remove air in the reactor under the stirring condition, adding 0.2g of azobisisobutyronitrile, and reacting at 66-67 ℃ for 2 hours; continuously adding 0.5g of azobisisobutyronitrile, and reacting for 3 hours at 73-75 ℃; continuously adding 0.8g of azobisisobutyronitrile, and reacting for 2 hours at 78-80 ℃; and cooling and adding 300g of ethyl acetate serving as a solvent to obtain the high-temperature-resistant acrylate adhesive.
Comparative example 3
A preparation method of a high-temperature-resistant acrylate adhesive comprises the following steps:
218g of butyl acrylate, 30g of hydroxyethyl acrylate, 35g of methyl acrylate, 20g of glycidyl methacrylate, 80g of toluene and 320g of ethyl acetate were charged into a reactor. Introducing nitrogen to remove air in the reactor under the stirring condition, adding 0.3g of azobisisobutyronitrile, and reacting at 66-67 ℃ for 2 hours; continuously adding 0.5g of azobisisobutyronitrile, and reacting for 3 hours at 73-75 ℃; continuously adding 0.8g of azobisisobutyronitrile, and reacting for 2 hours at 78-80 ℃; and cooling and adding 300g of ethyl acetate serving as a solvent to obtain the high-temperature-resistant acrylate adhesive.
Comparative example 4
A preparation method of a high-temperature-resistant acrylate adhesive comprises the following steps:
241.5g of butyl acrylate, 20g of hydroxyethyl acrylate, 35g of methyl acrylate, 3.5g of acrylic acid, 50g of toluene and 350g of ethyl acetate were charged into a reactor. Introducing nitrogen to remove air in the reactor under the stirring condition, adding 0.3g of azobisisobutyronitrile, and reacting at 66-67 ℃ for 2 hours; adding 0.5g of azobisisobutyronitrile, and reacting for 3 hours at 73-75 ℃; continuously adding 0.8g of azobisisobutyronitrile, and reacting for 2 hours at 78-80 ℃; and cooling and adding 300g of ethyl acetate serving as a solvent to obtain the high-temperature-resistant acrylate adhesive.
Comparative example 5
A preparation method of a high-temperature-resistant acrylate adhesive comprises the following steps:
237g of butyl acrylate, 8g of hydroxyethyl acrylate, 35g of methyl acrylate, 15g of glycidyl methacrylate, 2g of acrylic acid, 3g of acrylamide and 400g of ethyl acetate were charged into a reactor. Introducing nitrogen to remove air in the reactor under the stirring condition, adding 0.3g of azobisisobutyronitrile, and reacting at 66-67 ℃ for 2 hours; continuously adding 0.5g of azobisisobutyronitrile, and reacting for 3 hours at 73-75 ℃; adding 0.8g of azobisisobutyronitrile, and reacting for 2 hours at 78-80 ℃; and cooling and adding 300g of ethyl acetate serving as a solvent to obtain the high-temperature-resistant acrylate adhesive.
Experiment design:
the examples and the comparative examples were mixed with a curing agent L-75 and a curing agent GA-514, coated on a PET substrate of 50 μm in thickness, baked at 110 ℃ for 2min, then attached to a 50T2 release film, cured at 55 ℃ for 72 hours, and taken out for use.
And (3) high temperature resistance test:
according to the sample preparation method, GB/T2792-1998, the sample is placed in a 120 ℃ oven, taken out after 24 hours, stripped from a stainless steel plate after the temperature is reduced to room temperature, and the condition of residual glue on the stainless steel plate is recorded, wherein the experimental results are shown in Table 1.
TABLE 1
Figure BDA0002235715920000131
As can be seen from Table 1, when the curing agent was added in the same amount, the samples were kept at 120 ℃ for 24 hours, and no adhesive residue was left on the stainless steel plate. And the stainless steel plates in the comparative example groups had some residual glue thereon. Therefore, the adhesive has good heat resistance, and the surface of an adherend has no adhesive residue at high temperature. In addition, as can be seen from table 1, the L-75 type curing agent has better matching effect with the adhesive of the present application than the GA-514 type curing agent, and the L-75 type curing agent has good heat resistance after matching with the adhesive in example 1, and no adhesive residue is left on the surface of the adherend at high temperature. On the other hand, group 2 had a problem of radical elimination although the content of the GA-514 type curing agent was increased.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims (10)

1. The adhesive is characterized by comprising the following raw materials:
229g of butyl acrylate, 15g of hydroxyethyl acrylate, 35g of methyl acrylate, 15g of glycidyl methacrylate, 3g of acrylic acid, 3g of acrylamide, 80g of toluene, 620g of ethyl acetate and 1.6g of azobisisobutyronitrile.
2. The adhesive is characterized by comprising the following raw materials:
217g of butyl acrylate, 21g of hydroxyethyl acrylate, 35g of methyl acrylate, 20g of glycidyl methacrylate, 3.5g of acrylic acid, 3.5g of acrylamide, 100g of toluene, 600g of ethyl acetate and 1.4g of azobisisobutyronitrile.
3. The preparation method of the adhesive according to claim 1, which is characterized by comprising the following steps:
229g of butyl acrylate, 15g of hydroxyethyl acrylate, 35g of methyl acrylate, 15g of glycidyl methacrylate, 3g of acrylic acid, 3g of acrylamide, 80g of toluene and 320g of ethyl acetate are put into a reactor; introducing nitrogen to remove air in the reactor under the stirring condition, adding 0.3g of azobisisobutyronitrile, and reacting at 66-67 ℃ for 2 hours; continuously adding 0.5g of azobisisobutyronitrile, and reacting for 3 hours at 73-75 ℃; adding 0.8g of azobisisobutyronitrile, and reacting for 2 hours at 78-80 ℃; and cooling and adding 300g of ethyl acetate serving as a solvent to obtain the high-temperature-resistant acrylate adhesive.
4. The preparation method of the adhesive according to claim 2, which is characterized by comprising the following steps:
217g of butyl acrylate, 21g of hydroxyethyl acrylate, 35g of methyl acrylate, 20g of glycidyl methacrylate, 3.5g of acrylic acid, 3.5g of acrylamide, 100g of toluene and 300g of ethyl acetate are put into a reactor; introducing nitrogen to remove air in the reactor under the stirring condition, adding 0.2g of azobisisobutyronitrile, and reacting at 66-67 ℃ for 2 hours; continuously adding 0.4g of azobisisobutyronitrile, and reacting for 3 hours at 73-75 ℃; continuously adding 0.8g of azobisisobutyronitrile, and reacting for 2 hours at 78-80 ℃; and cooling and adding 300g of ethyl acetate serving as a solvent to obtain the high-temperature-resistant acrylate adhesive.
5. A pressure-sensitive adhesive tape, comprising:
a substrate layer;
the adhesive layer is arranged on the surface of one side of the base material layer, and the raw material of the adhesive layer comprises the adhesive of any one of claims 1-2 or the adhesive prepared by the preparation method of the adhesive of any one of claims 3-4; and
and the release film layer is arranged on the surface of one side of the adhesive layer, which is far away from the base material layer.
6. The pressure-sensitive adhesive tape according to claim 5, wherein the raw material of the adhesive layer further comprises a curing agent, and the curing agent is an isocyanate curing agent.
7. A pressure-sensitive adhesive tape according to claim 5 or 6, wherein the thickness of the adhesive layer is 10 μm to 50 μm.
8. A preparation method of a pressure-sensitive adhesive tape is characterized by comprising the following steps:
forming an adhesive layer on a substrate layer, wherein the raw material of the adhesive layer comprises the adhesive of any one of claims 1-2 or the adhesive prepared by the preparation method of the adhesive of any one of claims 3-4;
and forming a release film layer on the adhesive layer, and curing.
9. The method of producing a pressure-sensitive adhesive tape according to claim 8, wherein in the step of forming the adhesive layer on the substrate layer, the adhesive according to any one of claims 1 to 2 or the adhesive produced by the method of producing an adhesive according to any one of claims 3 to 4 is applied to the substrate layer and baked to form the adhesive layer; in the step of forming a release film layer on the adhesive layer, the release film layer is attached to the adhesive layer.
10. The method of any one of claims 8 or 9, wherein the curing treatment is performed at 50 ℃ to 60 ℃ for 70h to 74 h.
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