CN110560282A

CN110560282A - Spin coating device

Info

Publication number: CN110560282A
Application number: CN201910780809.3A
Authority: CN
Inventors: 杨进; 郜晨希; 刘金虎
Original assignee: Institute of Microelectronics of CAS
Current assignee: Institute of Microelectronics of CAS
Priority date: 2019-08-22
Filing date: 2019-08-22
Publication date: 2019-12-13
Anticipated expiration: 2039-08-22
Also published as: CN110560282B

Abstract

The invention discloses a spin coating device, which belongs to the technical field of surface coating, and is characterized in that a motor is provided with a rotating shaft arranged in the vertical direction; the sample wafer tray is positioned at the top end of the rotating shaft; the rotary disc is arranged below the sample wafer tray, and a first preset distance is reserved between the rotary disc and the sample wafer tray; the chamber is arranged below the rotary table, and a second preset distance is reserved between the chamber and the rotary table; the elastic component, the elastic component sets up the bottom of cavity, just the elastic component cover is established the axis of rotation is outside to solved the leakproofness of spin coating equipment among the prior art along with the high-speed rotation of motor, often had the technical problem that the gas leakage condition takes place, reached the sealing performance and the reliability that improve spin coating equipment, improved the unblocked of complete machine gas circuit, improved the adsorption efficiency of sample wafer in equipment, extension equipment life's technological effect.

Description

spin coating device

Technical Field

The invention relates to the technical field of surface coating, in particular to a spin coating device.

Background

The spin coating is to uniformly coat a liquid functional material with certain viscosity on a solid surface rotating at high speed through centrifugal action, and the required thickness, uniformity and consistency are realized by adjusting the centrifugal rotation speed and the reaction time; under the condition that the sample wafer rotates at a high speed, the sample wafer forms negative pressure in the air passage channel through an external vacuum pump, and the sample wafer is tightly adsorbed on the sample wafer support, so that the whole gluing process engineering is met. Therefore, the air path tightness determines whether the sample wafer can be tightly attached or not, and whether the adsorption is stable or not under high-speed rotation is critical.

In the mechanism of the existing airtight gas circuit, the lower sealing ring structure is only directly connected with the motor platform in a hard mode through a protruding structure, the sealing performance can be along with the high-speed rotation of the motor, and the gas leakage condition often occurs.

Disclosure of Invention

The invention provides a spin coating device, which solves the technical problem that the sealing performance of spin coating equipment in the prior art often leaks along with the high-speed rotation of a motor, and achieves the technical effects of improving the sealing capability and reliability of the spin coating equipment, improving the smoothness of an air path of the whole machine, improving the adsorption capability of a sample wafer in the equipment and prolonging the service life of the equipment.

the present invention provides a spin coating apparatus, comprising: the motor is provided with a rotating shaft arranged in the vertical direction; the sample wafer tray is positioned at the top end of the rotating shaft; the rotary disc is arranged below the sample wafer tray, and a first preset distance is reserved between the rotary disc and the sample wafer tray; the chamber is arranged below the rotary table, and a second preset distance is reserved between the chamber and the rotary table; the elastic piece is arranged at the bottom end of the cavity and sleeved outside the rotating shaft.

Preferably, the method further comprises the following steps: a first seal disposed at a top end of the chamber; a second seal disposed between a bottom end of the chamber and the resilient member.

Preferably, the first sealing element, the second sealing element, the chamber and the elastic element are all fixedly connected with the motor through the rotating shaft.

Preferably, the first seal and the second seal are both brass rings.

preferably, a cylindrical structure extends vertically outwards from one side wall of the chamber, and the cylindrical structure is an L-shaped structure or a straight-line-shaped structure.

Preferably, a through hole is formed in the center of the sample wafer tray, and a plurality of semi-annular gas path grooves are formed in the sample wafer tray by taking the through hole as the center.

Preferably, a groove is formed in the sample wafer tray, the width range of the groove is 1-2 mm, and the groove enables the semi-annular air path grooves to be communicated with the through holes.

Preferably, an annular platform is arranged at the position of the outer side edge of the sample wafer tray, and the width range of the annular platform is 2-4 mm.

Preferably, the turntable is provided with two gas path channels, and the turntable is provided with two balance holes, wherein a connecting line between the two balance holes is perpendicular to the central lines of the two gas path channels, so that the dynamic balance and stress of the two gas path channels are uniform during high-speed rotation.

Preferably, the elastic member is a spring.

One or more technical solutions in the embodiments of the present invention at least have one or more of the following technical effects:

the embodiment of the invention provides a spin coating device, which comprises: the device comprises a motor, a sample wafer tray, a turntable, a cavity and an elastic piece, wherein the motor is provided with a rotating shaft arranged in the vertical direction, other components of a spin coating device can be arranged outside the rotating shaft, and the sample wafer tray is positioned at the top end of the rotating shaft; the rotary table is positioned below the sample wafer tray, and a certain distance is reserved between the rotary table and the sample wafer tray, the rotary table is sleeved outside the rotary shaft, so that when a motor runs, the sample wafer tray and the rotary table can be driven to rotate at a high speed through the rotary shaft, the cavity is arranged below the rotary table, the elastic piece is arranged at the bottom end of the cavity and sleeved outside the rotary shaft, the elastic piece is pressed down by a second sealing piece with the same aperture as the rotary shaft, and the matching tolerance is realized, so that gas path sealing can be better realized, when the gas path sealing performance meets the requirement, the sample wafer is adsorbed by the sample wafer tray under negative pressure, and the sample wafer cannot be thrown away, so that the technical problem that the sealing performance of spin coating equipment in the prior art frequently generates along with the high-speed rotation of the motor is solved, the sealing performance and the reliability of spin coating equipment are improved, the smoothness of a gas path is improved, and the adsorption capacity, the service life of the equipment is prolonged.

The foregoing description is only an overview of the technical solutions of the present invention, and the embodiments of the present invention are described below in order to make the technical means of the present invention more clearly understood and to make the above and other objects, features, and advantages of the present invention more clearly understandable.

Drawings

FIG. 1 is a schematic structural diagram of a spin coating apparatus according to an embodiment of the present invention;

FIG. 2 is a cross-sectional view of FIG. 1;

FIG. 3 is another cross-sectional view of FIG. 1;

Fig. 4 is a schematic structural view of the dailies tray in fig. 1.

Description of reference numerals: a sample tray 1; a through hole 11; a semi-annular gas path groove 12; a groove 13; an annular platform 14; a ramp 15; a turntable 2; a first seal member 3; a chamber 4; a second seal 5; an elastic member 6; a motor shaft 7; a gas path channel 8; the air passage groove 9 is rotated.

Detailed Description

The embodiment of the invention provides a spin coating device, which is used for solving the technical problem that in the prior art, the sealing performance of spin coating equipment often has air leakage along with high-speed rotation of a motor.

The technical scheme in the embodiment of the invention has the following general idea:

The spin coating device provided by the embodiment of the invention comprises: the motor is provided with a rotating shaft arranged in the vertical direction; the sample wafer tray is positioned at the top end of the rotating shaft; the rotary disc is arranged below the sample wafer tray, and a first preset distance is reserved between the rotary disc and the sample wafer tray; the chamber is arranged below the rotary table, and a second preset distance is reserved between the chamber and the rotary table; the elastic component, the elastic component sets up the bottom of cavity, just the elastic component cover is established the axis of rotation is outside to reached and improved spin coating equipment's sealing ability and reliability, improved the unblocked of complete machine gas circuit, improved the adsorption efficiency of sample wafer in equipment, extension equipment life's technological effect.

in order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Examples

Fig. 1 is a schematic structural diagram of a spin coating apparatus according to an embodiment of the present invention, as shown in fig. 1 to 3:

The spin coating apparatus includes: a motor having a rotation shaft 7 arranged in a vertical direction.

Specifically, the motor is a power mechanism in the spin coating device, that is, the motor provides power for the spin coating device, wherein the motor is an electromagnetic device that realizes electric energy conversion or transmission according to the law of electromagnetic induction, and the motor mainly functions to generate driving torque and is used as a power source for electrical appliances or various machines. The rotating shaft 7 of the motor in this embodiment is installed in the vertical direction, and further, other constituent elements of the spin coating apparatus may be installed outside the rotating shaft 7.

The spin coating apparatus further includes: and the sample wafer tray 1 is positioned at the top end of the rotating shaft 7.

Specifically, sample wafer tray 1 is the part that is used for adsorbing the sample wafer in this spin coating device, and its shape is for having the discoid structure of certain thickness, and sample wafer tray 1 is located the top of axis of rotation 7 simultaneously, and further, sample wafer tray 1 has same the central axis with axis of rotation 7, and sample wafer tray 1 is located the horizontal direction, like this, when the motor operation, can drive sample wafer tray 1 together high-speed rotation through axis of rotation 7.

The spin coating apparatus further includes: the rotary table 2, the rotary table 2 sets up the below of sample tray 1, just the rotary table 2 with first default distance has between the sample tray 1.

Furthermore, two air channel 8 are arranged on the rotary table 2, and two balance holes are arranged on the rotary table 2 in a relatively-opened manner, wherein a connecting line between the two balance holes is perpendicular to the central lines of the two air channel 8, so that the dynamic balance and stress of the two air channel 8 are uniform during high-speed rotation.

Specifically, carousel 2 is the tray that carries out the rotation in the spin coating device, and its shape is the discoid structure that has certain thickness equally, and carousel 2 is located the below of sample tray 1, has certain distance between the two simultaneously, and the outside at axis of rotation 7 is established to carousel 2 cover, and like this, when the motor operation, can drive sample tray 1 and carousel 2 high-speed rotation together through axis of rotation 7. Furthermore, two air passage channels 8 are arranged on the rotary disc 2, namely the air groove in the middle of the rotary disc, and can be connected with the sealed space in the chamber 4. In order to balance the jackscrew of the fixed turntable 2, corresponding balance holes are punched at the vertical positions of the two symmetrical air passages, so that the dynamic balance and the stress of the whole air passage are uniform when the air passage rotates at a high speed, the excellent adsorbability is ensured, the dynamic balance is very important in the gluing process, and the surface of a sample wafer can cause the conditions of uneven film thickness and the like of the sample wafer due to the uneven micro dynamic balance.

The spin coating apparatus further includes: a chamber 4, wherein the chamber 4 is arranged below the rotating disc 2, and a second preset distance is reserved between the chamber 4 and the rotating disc 2.

Furthermore, a cylindrical structure vertically extends outwards from one side wall of the chamber 4, and the cylindrical structure is an L-shaped structure or a straight-line structure.

Specifically, the chamber 4 is internally provided with a certain accommodating space and is positioned below the turntable 2, so that a certain distance is reserved between the chamber 4 and the turntable 2, and meanwhile, the chamber 4 is sleeved outside the rotating shaft 7; furthermore, a hole is formed in one side wall of the chamber 4, a cylinder structure is vertically installed, and the cylinder structure is in a hollow cylinder structure with a certain wall thickness, and the cylinder structure is preferably in an L-shaped structure in this embodiment, that is, the cylinder structure is composed of two parts, wherein the first part is perpendicular to the side wall of the chamber 4, and the second part is perpendicular to the first part and forms an angle of 90 degrees.

Further, the spin coating apparatus further includes: a first seal 3, the first seal 3 being disposed at a top end of the chamber 4; a second sealing member 5, the second sealing member 5 being disposed between the bottom end of the chamber 4 and the elastic member 6.

further, the first sealing member 3 and the second sealing member 5 are both brass rings.

Specifically, the first sealing member 3 and the second sealing member 5 are elements for sealing in a spin coating apparatus, wherein the first sealing member 3 is located at the top of the chamber 4, the turntable 2 is inserted into the chamber 4, and the air passage sealing of the upper part of the chamber 4 is completed by the first sealing member 3; the second sealing element 5 is located at the bottom of the chamber 4, that is, the chamber 4 is located above the second sealing element 5, and the hole diameter at the bottom of the chamber 4 is exactly the same as the diameter of the outer circle of the second sealing element 5, so that the air passage tightness can be further ensured, and in the embodiment, the first sealing element 3 and the second sealing element 5 are preferably selected to be brass rings.

The spin coating apparatus further includes: the elastic piece 6 is arranged at the bottom end of the cavity 4, and the elastic piece 6 is sleeved outside the rotating shaft 7.

Further, the elastic member 6 is a spring.

Specifically, the elastic member 6 is located below the second sealing member 5 and is sleeved outside the rotating shaft 7, so that the elastic member 6 is pressed down by the second sealing member 5 with the same aperture as the rotating shaft 7, and the purpose of ensuring the tightness of the bottom of the air passage is achieved by matching tolerance. Realization gas circuit that like this can be better is sealed, when the gas circuit leakproofness satisfies the demands, sample wafer is then more firm to sample wafer tray 1 negative pressure absorption, the sample wafer can not get rid of and fly, it has certain elastic connection to make cavity 4 and motor platform have simultaneously through this elastic component 6, sealed size also changes to some extent, under the high-speed rotatory condition of motor, the spring coil of elastic component 6 can be different according to external force, keep ascending power to second sealing member 5 always, make equipment under any rotational speed, airtight situation can be guaranteed to the gas circuit homoenergetic.

Further, the first sealing element 3, the second sealing element 5, the chamber 4 and the elastic element 6 are all fixedly connected with the motor through the rotating shaft 7.

Specifically, the sample wafer tray 1, the turntable 2, the first sealing member 3, the chamber 4, the second sealing member 5 and the elastic member 6 are arranged in a certain sequence through the motor shaft 7, that is, all structures of the spin coating device are sequentially combined by taking the motor rotating shaft 7 as a center and are in contact with each other, wherein the chamber 4 is in contact with the first sealing member 3, and the second sealing member 5 is in contact with the elastic member 6, so that the first sealing member 3, the second sealing member 5, the chamber 4 and the elastic member 6 are integrally combined into a whole, only the sample wafer tray 1 and the turntable 2 rotate together with the motor at a high speed in a high-speed state, and the rest parts are in a static state, and each independent accessory comprises the first sealing member 3, the second sealing member 5, the chamber 4, the elastic member 6 and the motor, so that the sealing performance of the gas path is ensured after the combination into a whole. Through the design connection, the gas tightness is realized in the gluing process, the sample wafer can be firmly adsorbed on the sample wafer tray 1, the fixation of the sample wafer position in the gluing process is improved, the sample wafer is prevented from flying under high-speed rotation, the sealing element is not rotated along with the motor, the service life of a sealing gas circuit is prolonged, the reliability of gluing equipment is also improved, and the service life of the whole equipment is prolonged.

Furthermore, a through hole 11 is formed in the center of the sample wafer tray 1, and a plurality of semi-annular air channel grooves 12 are formed in the sample wafer tray 1 by taking the through hole 11 as the center.

Further, a groove 13 is formed in the sample wafer tray, the width range of the groove 13 is 1-2 mm, and the groove 13 is formed so that the semi-annular air path grooves 12 are communicated with the through holes 11.

furthermore, an annular platform 14 is arranged at the position of the outer side edge of the sample wafer tray 1, and the width range of the annular platform 14 is 2-4 mm.

specifically, as shown in fig. 4, a central hole is formed at the center of the sample wafer tray 1, and then a plurality of semi-annular air path grooves 12 are formed outward with the through hole 11 as the center, wherein the semi-annular air path grooves 12 oppositely disposed in the plurality of semi-annular air path grooves 12 have the same size, and two adjacent semi-annular air path grooves 12 have different sizes, that is, the diameter of the semi-annular air path groove 12 close to the through hole 11 is smaller than that of the semi-annular air path groove 12 far from the through hole 11. In this embodiment, the cross-sectional shape of the semi-annular air channel groove 12 is not particularly limited, that is, the cross-sectional shape of the semi-annular air channel groove 12 may be semicircular, square, etc., and in this embodiment, the cross-sectional shape of the semi-annular air channel groove 12 is preferably V-shaped, that is, the semi-annular air channel groove 12 formed on the sample tray 1 is a V-shaped groove, and the inclination angle is 60 °, meanwhile, a groove 13 is formed at the center of the sample tray 1, the width range of the groove 13 is 1 to 2mm, in this embodiment, the width of the groove is 1.5mm is preferably used, so that the through hole 11 is used as the center to form a semi-annular air channel, that is, the rotary air channel groove 9, when the center is located, the air can rapidly pass through the groove 13 and flow into the whole rotary air channel 9, further, an annular platform 14 is reserved at the outermost circle of the extracted sample tray 1, and the width range of the annular platform 14 is 2mm to 4mm, the annular platform 14 can prevent glue from entering the equipment along the air path; the design of sample wafer tray is higher than a platform, can prevent that equipment from advancing gluey, when leaking the gluey condition and exist, accessible 45 slopes 15 this moment, the plane under the platform that flows, that is to say, the height of the semicircular gas circuit on sample wafer tray 1 and slope 15 is higher than other parts of sample wafer tray 1. When the sample wafer is placed on the sample wafer tray 1, the bottom of the sample wafer and the whole gas circuit are connected together by rotating the gas circuit groove 9, and the whole gas circuit is changed into negative pressure to tightly adsorb the sample wafer on the sample wafer tray 1 by an external air pump, so that the communication of the whole gas circuit is completed.

therefore, the cooperation between each independent structure is passed through to the spin coating device in this embodiment, realize the unobstructed of the whole gas circuit of gas in the rubber coating technology, be favorable to improving the adsorption efficiency of sample wafer in equipment, no matter the motor is under high-speed or low rotational speed state, the whole leakproofness homoenergetic of gas circuit obtains guaranteeing, good seal also can be guaranteed with the cavity to the sealing member, be favorable to improving the good sealing capacity of whole gas circuit, the service life of instrument is prolonged, the reliability of spin coating equipment has been promoted, the life of complete machine equipment has been increased.

While preferred embodiments of the present invention have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. Therefore, it is intended that the appended claims be interpreted as including preferred embodiments and all such alterations and modifications as fall within the scope of the invention.

It will be apparent to those skilled in the art that various modifications and variations can be made in the embodiments of the present invention without departing from the spirit or scope of the embodiments of the invention. Thus, if such modifications and variations of the embodiments of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to encompass such modifications and variations.

Claims

1. A spin coating apparatus, comprising:

The motor is provided with a rotating shaft arranged in the vertical direction;

The sample wafer tray is positioned at the top end of the rotating shaft;

The rotary disc is arranged below the sample wafer tray, and a first preset distance is reserved between the rotary disc and the sample wafer tray;

The chamber is arranged below the rotary table, and a second preset distance is reserved between the chamber and the rotary table;

The elastic piece is arranged at the bottom end of the cavity and sleeved outside the rotating shaft.

2. The spin-coating apparatus of claim 1, further comprising:

a first seal disposed at a top end of the chamber;

A second seal disposed between a bottom end of the chamber and the resilient member.

3. The spin-coating apparatus of claim 2, wherein the first sealing member, the second sealing member, the chamber, and the elastic member are fixedly connected to the motor through the rotating shaft.

4. The spin-coating apparatus of claim 2, wherein the first seal and the second seal are both brass rings.

5. the spin-coating apparatus of claim 1, wherein a cylindrical structure extends vertically outward from a sidewall of the chamber, and the cylindrical structure is an L-shaped structure or a straight-line structure.

6. The spin coating apparatus of claim 1, wherein a through hole is formed at a center of the sample tray, and the sample tray is formed with a plurality of semi-annular gas path grooves centered around the through hole.

7. The spin coating apparatus of claim 6, wherein the sample tray has a groove with a width ranging from 1 mm to 2mm, wherein the grooves are configured to allow the semi-annular gas channel grooves to communicate with the through holes.

8. the spin coating apparatus of claim 6, wherein an annular platform is disposed at an outer edge of the sample tray, and the annular platform has a width of 2-4 mm.

9. The spin coating apparatus according to claim 1, wherein the turntable is provided with two air channels, and the turntable is provided with two balance holes, wherein a connecting line between the two balance holes is perpendicular to the center lines of the two air channels, so that the dynamic balance and stress of the two air channels are uniform during high-speed rotation.

10. The spin-coating apparatus of claim 1, wherein the resilient member is a spring.