CN110431648B - Laminate and method for manufacturing organic solar cell - Google Patents
Laminate and method for manufacturing organic solar cell Download PDFInfo
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- CN110431648B CN110431648B CN201880017294.5A CN201880017294A CN110431648B CN 110431648 B CN110431648 B CN 110431648B CN 201880017294 A CN201880017294 A CN 201880017294A CN 110431648 B CN110431648 B CN 110431648B
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- resin
- solar cell
- organic solar
- support
- laminate
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- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/20—Light-sensitive devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/542—Dye sensitized solar cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Photovoltaic Devices (AREA)
- Hybrid Cells (AREA)
- Laminated Bodies (AREA)
Abstract
The present invention provides a laminate which, when a resin film is used as a substrate, can reduce the risk of damage to the resin film or to components of an organic solar cell formed on the resin film, or to an organic solar cell, and can efficiently produce an organic solar cell, and a method for producing an organic solar cell using the laminate. The laminate sequentially comprises: a resin film as an organic solar cell substrate; a resin binder layer containing a resin binder; and a support body having a through-hole connecting a surface of the support body in contact with the resin-based adhesive agent layer and a surface of the support body other than the surface.
Description
Technical Field
The present invention relates to a laminate and a method for manufacturing an organic solar cell.
Background
In recent years, organic solar cells such as dye-sensitized solar cells and perovskite solar cells have attracted attention as photoelectric conversion elements for converting light energy into electric power.
A dye-sensitized solar cell generally includes a working electrode (photoelectrode), a counter electrode (counter electrode), a sensitizing dye layer carried on the working electrode, and an electrolyte layer disposed between the working electrode and the counter electrode.
The perovskite type solar cell generally has a working electrode (negative electrode), a counter electrode (positive electrode), a perovskite crystal layer, an electron-receiving layer, and a hole-receiving layer.
In a flexible organic solar cell, a resin film is used as a substrate constituting an electrode, but the flexible organic solar cell is poor in handling properties, is difficult to position, and causes a reduction in production efficiency such as a shift in patterning and bonding.
In order to solve this problem, there is a technique of fixing or holding a resin film by providing an adhesive layer or the like on a support. For example, patent document 1 proposes a technique for holding a working electrode substrate on a transport plate by an ionic liquid.
Documents of the prior art
Patent document
Patent document 1: japanese patent laid-open publication No. 2010-153294.
Disclosure of Invention
Problems to be solved by the invention
However, when the working electrode substrate is held on the transport plate by the ionic liquid as in patent document 1, there is a problem that the back surface of the substrate needs to be cleaned. In addition, in the case of fixing the resin film to the support with the adhesive layer, there are also problems as follows: when the support is peeled from the resin film after the completion of a predetermined manufacturing process of the organic solar cell, a load such as bending is applied to the resin film of the organic solar cell substrate, and the organic solar cell is damaged.
Accordingly, an object of the present invention is to provide a laminate and a method for manufacturing an organic solar cell using the laminate, which can reduce the risk of damage to a resin film or a component of an organic solar cell formed on the resin film, or to an organic solar cell when the resin film is used as a substrate, and can efficiently manufacture the organic solar cell.
Means for solving the problems
The laminate of the present invention comprises in order: a resin film as an organic solar cell substrate; a resin binder layer containing a resin binder; and a support body having a through-hole connecting a surface of the support body in contact with the resin-based adhesive agent layer and a surface of the support body other than the surface. Accordingly, when the resin film is used as the substrate, the risk of damage to the resin film, the constituent members of the organic solar cell formed on the resin film, or the organic solar cell can be reduced, and the organic solar cell can be efficiently manufactured.
In the laminate of the present invention, it is preferable that the resin-based adhesive layer has a through-hole connecting a surface in contact with the support and a surface in contact with the resin film, and the through-hole of the resin-based adhesive layer is preferably located at a position overlapping with a through-hole existing on the surface in contact with the resin-based adhesive layer of the support when viewed in the lamination direction. Thus, the resin adhesive layer can be easily peeled from the resin film without leaving the resin adhesive layer on the resin film.
In the laminate of the present invention, it is preferable that the through-hole present on the surface of the support in contact with the resin-based adhesive layer does not overlap with the portion of the resin film on which the wiring pattern is formed when viewed from the laminating direction.
Preferably, in the laminate of the present invention, the area of the through-hole present in the surface of the support in contact with the resin-based adhesive layer is 0.007mm2Above, and every 200cm of the surface2There are 1 or more through holes.
The method for manufacturing an organic solar cell according to the present invention is a method for manufacturing an organic solar cell including a step of injecting a fluid into a through-hole of the support of the laminate described above. Accordingly, when the resin film is used as the substrate, the risk of damage to the resin film, the constituent members of the organic solar cell formed on the resin film, or the organic solar cell can be reduced, and the organic solar cell can be efficiently manufactured.
Preferably, in the method for manufacturing an organic solar cell according to the present invention, the fluid is air.
Preferably, in the method for manufacturing an organic solar cell according to the present invention, the organic solar cell is a dye-sensitized solar cell.
Effects of the invention
According to the present invention, it is possible to provide a laminate which can reduce the risk of damage to a resin film or a component of an organic solar cell formed on the resin film, or the organic solar cell, and can efficiently produce the organic solar cell, when the resin film is used as a substrate, and a method for producing the organic solar cell using the laminate.
Drawings
Fig. 1 is a schematic perspective view of an example of a laminate of the present invention.
Fig. 2A is a schematic plan view of another example of the laminate of the present invention.
Fig. 2B is a schematic cross-sectional view taken along line a-a of the laminate of fig. 2A.
Fig. 3 is a schematic cross-sectional view of another example of the laminate of the present invention.
Detailed Description
Hereinafter, embodiments of the present invention will be described. The description is intended to be illustrative of the invention and is not intended to limit the invention in any way.
In the present specification, unless otherwise specified, a numerical range includes the lower limit and the upper limit of the range. For example, 2 to 80nm means a value including a lower limit of 2nm and an upper limit of 80nm, that is, 2nm or more and 80nm or less.
< organic solar cell >
Before describing the laminate of the present invention and the method for manufacturing an organic solar cell using the laminate, an example of the structure of a dye-sensitized solar cell, which is a typical organic solar cell, will be described.
A dye-sensitized solar cell typically has a photoelectrode (working electrode), an opposite electrode (counter electrode), and an electrolyte layer. For example, refer to Japanese patent application laid-open No. 2014-120219. In addition, the dye-sensitized solar cell may optionally have a known functional layer such as a protective layer, an antireflection layer, or a gas barrier layer on one or both of the photoelectrode and the counter electrode. In addition, a known spacer for preventing short circuit may be provided.
The photoelectrode may be any electrode capable of releasing electrons to an external circuit upon receiving light, and a known photoelectrode can be used as the photoelectrode of a dye-sensitized solar cell. The photoelectrode typically comprises: the photoelectric device includes a photoelectrode substrate, a conductive film formed on the photoelectrode substrate, a porous semiconductor fine particle layer formed on the conductive film, and a sensitizing dye layer formed by adsorbing a sensitizing dye on the surface of the porous semiconductor fine particle layer.
The photoelectrode substrate plays a role of supporting a porous semiconductor fine particle layer and the like and a role of a current collector. Examples of the photoelectrode substrate include a photoelectrode substrate in which a conductive film is laminated on a resin film described later as a substrate.
As the substrate, a known resin film, a glass substrate, or the like can be used. Examples of the resin film include resin films obtained by molding a resin composition containing a synthetic resin such as polyethylene terephthalate (PET), polyethylene naphthalate (PEN), Syndiotactic Polystyrene (SPS), polyphenylene sulfide (PPS), Polycarbonate (PC), polyarylate (PAr), Polysulfone (PSF), polyester sulfone (PES), Polyetherimide (PEI), transparent Polyimide (PI), or cycloolefin polymer (COP).
Examples of the material constituting the conductive film include metals such as platinum, gold, silver, copper, aluminum, indium, and titanium; conductive metal oxides such as tin oxide and zinc oxide; and a composite metal oxide such as Indium Tin Oxide (ITO) or Indium Zinc Oxide (IZO).
The porous semiconductor fine particle layer is a porous layer containing semiconductor fine particles. Since the layer is porous, a dye-sensitized solar cell having a high conversion efficiency can be easily obtained with an increased amount of the sensitizing dye adsorbed.
Examples of the semiconductor fine particles include particles of metal oxides such as titanium oxide, zinc oxide, and tin oxide. The particle diameter of the semiconductor fine particles (average particle diameter of primary particles) is preferably 2 to 80nm, more preferably 2 to 60 nm. The surface area is large, the amount of the sensitizing dye supported is large, and the electrolyte constituting the electrolyte layer can diffuse to the fine portion of the porous semiconductor fine particle layer. From the viewpoint of dispersion stability, the solid content concentration in the semiconductor fine particle dispersion is 0.1 to 60 wt%, preferably 0.5 to 40 wt%, and more preferably 1.0 to 25 wt%.
The thickness of the porous semiconductor fine particle layer is not particularly limited, but is usually 0.1 to 50 μm, preferably 5 to 30 μm, and more preferably 15 μm or less. Further, the porous semiconductor fine particle layer may be laminated with one layer or two or more layers. The semiconductor particles of the layers may differ in size and composition.
The sensitizing dye layer is a layer formed by adsorbing a compound (sensitizing dye) capable of being excited by light to transfer electrons to the porous semiconductor fine particle layer to the surface of the porous semiconductor fine particle layer.
Examples of the sensitizing dye include organic dyes such as cyanine dyes, merocyanine dyes, oxonol dyes, xanthene dyes, squarylium dyes, polymethine dyes, coumarin dyes, riboflavin dyes, perylene dyes, and the like; and metal complex dyes such as phthalocyanine complexes and porphyrin complexes of metals such as iron, copper, and ruthenium.
Two or more dyes may also be used in combination. The solvent for dissolving the sensitizing dye or the like is not particularly limited as long as it can dissolve the sensitizing dye and does not dissolve or react with the porous semiconductor fine particle layer. The solvent is preferably an alcohol, a nitrile, a halogenated hydrocarbon, an ether, an amide, an ester, a carbonate, a ketone, a hydrocarbon, an aromatic, a nitromethane, or the like. Specific examples of the solvent for dissolving the sensitizing dye in the present invention include methanol, ethanol, isopropanol, 1-methoxy-2-propanol, N-butanol, t-butanol, butoxyethanol, N-dimethylformamide, N-methylpyrrolidone, acetone, methyl ethyl ketone, methyl isobutyl ketone, 3-methoxypropionitrile, butyronitrile, propiolactone, γ -butyrolactone, toluene, and DMSO. These solvents may be used alone or as a mixed solvent using two or more solvents. The concentration of the sensitizing dye in the dye solution is preferably 0.01 mM-10 mM, more preferably 0.1 mM-10 mM. Further, the total adsorption amount of the dye is preferably (1 m) per unit surface area2) The conductive support is 0.01M-100M. The amount of dye adsorbed to the semiconductor fine particles is preferably in the range of 0.001 to 1M per 1g of the semiconductor fine particles.
In the present invention, other materials used in combination (for example, cationic compounds (for example, tertiary ammonium compounds, quaternary ammonium compounds, pyridine compounds, imidazolium cationic compounds, acid compounds (for example, carboxylic acid compounds such as cholic acid and deoxycholic acid, phosphoric acid compounds, phosphonic acid compounds, sulfonic acid compounds, etc.) are preferably used in combination in addition to the sensitizing dye.) the concentration of the above-mentioned materials used in combination in the dye solution is preferably 0.1 mM-100 mM., and the molar equivalent of the dye is preferably 1 molar equivalent-1000 molar equivalents.
After the sensitizing dye is adsorbed to the porous semiconductor fine particle layer, it is preferable to wash the porous semiconductor fine particle layer with a solvent to remove an excess sensitizing dye solution. In this case, the above solvent is recommended as the cleaning solvent. As a cleaning method, there is a method of spraying a solvent onto the dye-sensitized porous semiconductor fine particle layer to wash it, or a method of immersing the substrate on which the dye-sensitized porous semiconductor fine particle layer is formed in a cleaning solvent tank. The substrate having the dye-sensitized porous semiconductor fine particle layer formed thereon obtained in this way can be further subjected to a drying treatment to obtain a photoelectrode. The drying conditions are not particularly limited, but drying at 30 to 150 ℃ for 0.5 to 30 minutes is preferable.
The counter electrode is formed of a counter electrode substrate and a conductive film on the counter electrode substrate. In addition, a catalyst layer may be provided on the conductive film.
The counter electrode substrate is the same as the resin film and glass exemplified in the photoelectrode.
Examples of the material constituting the conductive film include metals such as platinum, gold, silver, copper, aluminum, indium, and titanium; conductive metal oxides such as tin oxide and zinc oxide; complex metal oxides such as Indium Tin Oxide (ITO) and Indium Zinc Oxide (IZO); carbon materials such as carbon nanotubes and fullerenes.
As the catalyst layer, a known catalyst layer such as a conductive polymer such as platinum or Polythiophene (PEDOT), a carbon material such as carbon black, graphene, carbon nanotube, or fullerene can be used, and for example, a catalyst layer containing carbon nanotube (a) described in japanese patent application laid-open No. 2014-120219 can be mentioned.
The electrolyte layer is a layer for separating the photoelectrode and the counter electrode and efficiently transferring electric charges.
The electrolyte layer is not particularly limited, and examples thereof include an electrolytic solution, a gel electrolyte, and a solid electrolyte. For example, the electrolyte solution contains a supporting electrolyte, a redox pair (a pair of chemical species that can reversibly convert into each other in the form of an oxide and a reductant in a redox reaction), a solvent, and the like.
Examples of the supporting electrolyte include cation-containing salts such as lithium ions, imidazolium cations, and quaternary ammonium ions.
As the redox pair, a known redox pair can be used as long as it can reduce the oxidized sensitizing dye. Examples of the redox pair include chlorine compounds, iodine compounds, bromine compounds, thallium ions (iii) and thallium ions (i), ruthenium ions (iii) and ruthenium ions (ii), copper ions (ii) and copper ions (i), iron ions (iii) and iron ions (ii), cobalt ions (iii) and cobalt ions (ii), vanadium ions (iii) and vanadium ions (ii), manganate ions and permanganate ions, ferricyanide and ferrocyanide, quinone and hydroquinone, and fumaric acid and succinic acid.
As the solvent, a known solvent can be used as a solvent for forming an electrolyte layer of a solar cell. Examples of the solvent include acetonitrile, methoxyacetonitrile, methoxypropionitrile, N-dimethylformamide, ethylmethylimidazole bistrifluoromethanesulfonimide, γ -butyrolactone, and propylene carbonate.
The organic solar cell may be a perovskite solar cell, in addition to the dye-sensitized solar cell. Perovskite-type solar cells typically have a perovskite crystalline layer between a working electrode and a counter electrode. In addition, the organic el device may have a hole transport layer and an electron receiving layer provided with a perovskite crystal layer interposed therebetween. Examples of perovskite-type solar cells include perovskite-type solar cells described in, for example, japanese patent laid-open nos. 2014-049631, 2015-046583, 2016-009737, and the like.
(laminated body)
The laminate of the present invention is a laminate comprising, in this order, a resin film as an organic solar cell substrate, a resin-based adhesive layer containing a resin-based adhesive, and a support, wherein the support has a through-hole connecting a surface of the support in contact with the resin-based adhesive layer and a surface of the support other than the surface. Accordingly, when the resin film is used as the substrate, the risk of damage to the resin film, the constituent members of the organic solar cell formed on the resin film, or the organic solar cell can be reduced, and the organic solar cell can be efficiently manufactured.
Fig. 1 is a perspective view schematically showing an example of the laminate of the present invention. The laminate 1 shown in fig. 1 includes a resin film 30, a resin-based adhesive layer 20, and a support 10 in this order. The support 10 has a through-hole 40.
Fig. 2A is a plan view schematically showing another example of the laminate of the present invention. In the laminate 1, a plurality of through holes 40 are arranged at regular intervals in the support body 10.
Fig. 2B is a schematic cross-sectional view taken along line a-a of the laminate of fig. 2A. In the laminate 1, the support 10 has the through-hole 40, and the through-hole 40 connects the surface of the support 10 in contact with the resin-based adhesive layer 20 and the surface of the support 10 opposite to the surface.
Fig. 3 is a schematic cross-sectional view of another example of the laminate of the present invention. In the laminate 1, the support 10 and the resin adhesive layer 20 have through-holes 40, and the through-holes 40 of the resin adhesive layer 20 are positioned so as to overlap the through-holes 40 present on the surface of the support 10 that contacts the resin adhesive layer 20 when viewed in the lamination direction.
< support >
The material of the support is any one selected from glass, plastic and metal. The support may be subjected to surface treatment or the like.
Examples of the glass as a material of the support include borosilicate glass, silicate glass, silica glass, alkali-free glass, and quartz glass.
Examples of the plastic as the material of the support include acrylic plastic, polyethylene terephthalate (PET), polybutylene terephthalate (PBT), polytrimethylene terephthalate (PTT), polyethylene naphthalate (PEN), polyesters such as liquid crystal polyester, polyolefins such as Polyethylene (PE), polypropylene (PP), polybutylene, and polymethylpentene (PMP), cyclic olefin polymers such as cycloolefin polymers (COP and COC), styrene resins, Polyoxymethylene (POM), Polyamide (PA), Polycarbonate (PC), polymethyl methacrylate (PMMA), polyvinyl chloride (PVC), Polyphenylene Sulfide (PPs), polyphenylene ether (PPE), modified PPE, Polyimide (PI), Polyamideimide (PAI), Polyetherimide (PEI), Polysulfone (PSU), polyethersulfone, Polyketone (PK), Polyetherketone (PEK), Polyetheretherketone (PEEK), and the like, Polyether ketone (PEKK), Polyarylate (PAR), polyether nitrile, phenol resin, phenoxy resin, fluorine resin such as polytetrafluoroethylene, and the like. The support is preferably a support having high heat resistance and high transparency. Preferably borosilicate glass or quartz glass.
Examples of the metal as a material of the support include stainless steel, iron, aluminum, brass, and copper.
The thickness of the support body may be, for example, 0.5 to 10mm, and the end surface may be subjected to C-surface processing or R-surface processing as required.
The support has a through-hole for connecting a surface of the support in contact with the resin-based adhesive layer (hereinafter, sometimes referred to as "1 st surface of the support") and a surface of the support other than the surface (the 1 st surface of the support) (hereinafter, sometimes referred to as "2 nd surface of the support"). The number of the through holes may be 1 or more.
When the support has a plurality of through holes, the arrangement of the through holes is not particularly limited and can be set as appropriate. For example, they may be regularly arranged at predetermined intervals, may be irregularly arranged, or may be a combination of these. The combination refers to, for example, a case where a plurality of through holes in a certain row are regularly arranged and a plurality of through holes in another row are irregularly arranged.
The 2 nd surface of the support may be any surface other than the 1 st surface of the support. For example, as shown in fig. 2B, the 2 nd surface may be a surface of the support body opposite to the 1 st surface. When the support has a plurality of through holes, the number 2 of the surface may be 1, or 2 or more.
The shape, size and number of the through holes on the 1 st surface of the support may be the same as or different from the shape, size (hole diameter) and number of the through holes on the 2 nd surface of the support, respectively. For example, the size of the through-hole formed in the 1 st surface of the support may be larger than the size of the through-hole formed in the 2 nd surface of the support. Further, since the through holes in the support body are connected to each other, the number of the through holes existing on the 1 st surface of the support body and the number of the through holes existing on the 2 nd surface of the support body can be different by connecting 1 through hole existing on the 1 st surface of the support body and two through holes existing on the 2 nd surface of the support body, or the like.
The laminate of the present invention is preferably such that the through-hole present on the surface (1 st surface) of the support in contact with the resin adhesive layer does not overlap with the portion of the resin film on which the wiring pattern is formed, when viewed in the lamination direction. This reduces the risk of damage to the resin film, the components of the organic solar cell formed on the resin film, or the organic solar cell, and enables efficient production of the organic solar cell.
The laminate of the present invention preferably has a through-hole having an area of 0.007mm on the surface (1 st surface) of the support in contact with the resin adhesive layer2And every 200cm of the surface (No. 1 surface)2There are 1 or more through holes. The area of the through-hole is more preferably 0.19mm2～320mm2The shape is desirably a circle, a square, or the like, but is not particularly limited. If the area of the through hole is 0.007mm2As described above, the fluid can be easily injected into the through-hole in the peeling step, and the risk of damage to the resin film, the component of the organic solar cell formed on the resin film, or the organic solar cell can be reduced in the peeling step. If the size of the through hole is 320mm2As described below, the strength of the through hole portion can be suppressed from decreasing, and the risk of damage due to deformation of the through hole portion during the production of the organic solar cell can be reduced. Furthermore, the thickness of the first surface 1 is 200cm2Has more than 1 through hole, and can be prevented from being strippedThe concentration of stress applied to the resin film in the process can further reduce the risk of damage to the components of the organic solar cell or the organic solar cell, and the organic solar cell can be efficiently manufactured.
< resin-based adhesive layer >
The resin-based adhesive layer contains a resin-based adhesive. As the resin-based adhesive, a known resin-based adhesive can be used. The resin adhesive layer may or may not have a base material. The light transmittance of the resin adhesive layer including the substrate, regardless of the presence or absence of the substrate, at a wavelength of 400nm is preferably 40% or more, and more preferably 60% or more. Further, the surface may be formed with irregularities by foaming or the like to exhibit an adsorption force.
Examples of the substrate of the resin-based adhesive layer include substrates such as polyester such as polyethylene terephthalate, polyimide, cycloolefin polymer (COP, COC), polymethylpentene, and film glass. In particular, a substrate having excellent heat resistance and transparency is preferable.
The resin binder of the resin binder layer is not particularly limited, and may be selected as appropriate. For example, the resin-based adhesive is preferably at least 1 selected from the group consisting of, for example, a silicone-based adhesive, an acrylic-based adhesive, a urea-based adhesive, a melamine-based adhesive, a phenol-based adhesive, a vinyl acetate-based solvent-based adhesive, a natural rubber-based solvent-based adhesive, a vinyl acetate-based emulsion adhesive, a vinyl acetate copolymer resin-based emulsion adhesive, an EVA (ethylene-vinyl acetate copolymer) resin-based emulsion adhesive, an isocyanate-based adhesive, a synthetic rubber-based emulsion adhesive, an epoxy-based adhesive, a cyanoacrylate-based adhesive, and a polyurethane-based adhesive.
In one embodiment, the resin-based adhesive is selected from 1 or more of a silicone-based adhesive, an acrylic-based adhesive, and a rubber-based adhesive.
The resin-based adhesive is preferably one in which the peel strength is reduced by a temperature change such as heating or cooling or by irradiation with an electromagnetic wave such as ultraviolet light, electron beam, or radiation in a peeling step (step of peeling off the support) after the laminate of the present invention is used or after the organic solar cell is produced by the production method of the present invention described later. These resin binders may be used singly or in combination of two or more. In this way, in the peeling step, the resin-based adhesive layer is heated and cooled or irradiated with electromagnetic waves such as ultraviolet rays, electron beams, or rays to lower the peeling strength, thereby making it easier to peel the organic solar cell or the resin film on which the electrode is formed from the support. Examples of such a resin-based adhesive include a heat-sensitive adhesive sheet (Intelimer tape) manufactured by Nitta, and an SOMATAC (registered trademark) UV manufactured by Somar. The adhesive may be appropriately stimulated during peeling, and in the case of a heat-sensitive adhesive sheet, for example, the temperature may be applied at-20 to 200 ℃ for 0.01 to 10 hours, and in the case of an electromagnetic wave-peeling sheet, electromagnetic waves having a necessary wavelength may be appropriately applied for 0.01 to 10 hours.
The laminate of the present invention may have through holes in the support, and the resin adhesive layer may have through holes connecting a surface in contact with the support (hereinafter, sometimes referred to as "the 1 st surface of the resin adhesive layer") and a surface in contact with the resin film (hereinafter, sometimes referred to as "the 2 nd surface of the resin adhesive layer"). The number of through holes in the resin adhesive layer may be 1 or more.
When the resin adhesive layer has a plurality of through holes, the arrangement of the through holes is not particularly limited and can be set as appropriate. For example, they may be regularly arranged at predetermined intervals, may be irregularly arranged, or may be a combination of these. The combination refers to, for example, a case where a plurality of through holes in a certain row are regularly arranged and a plurality of through holes in another row are irregularly arranged.
The shape, size and number of through holes present on the 1 st surface of the resin adhesive layer may be the same as or different from the shape, size (hole diameter) and number of through holes present on the 2 nd surface of the resin adhesive layer.
The laminate of the present invention is preferably such that the through-hole present on the 1 st surface and/or the 2 nd surface of the resin adhesive layer does not overlap with the portion of the resin film on which the wiring pattern is formed when viewed from the laminating direction. This further reduces the risk of damage to the resin film, the components of the organic solar cell formed on the resin film, or the organic solar cell, and thus enables efficient production of the organic solar cell.
The resin-based adhesive layer of the laminate of the present invention has a through-hole connecting a surface (1 st surface of the resin-based adhesive layer) in contact with the support and a surface (2 nd surface of the resin-based adhesive layer) in contact with the resin film, and the through-hole of the resin-based adhesive layer is preferably located at a position overlapping with the through-hole present on the surface (1 st surface of the support) in contact with the resin-based adhesive layer of the support when viewed from the laminating direction. Thus, the resin adhesive layer can be easily peeled from the resin film without leaving the resin adhesive layer on the resin film.
When the resin adhesive layer has through holes, the size (diameter) of the through holes of the resin adhesive layer may be the same as or different from the size (diameter) of the through holes present on the 1 st surface of the support. In one embodiment, the size of the through-hole of the resin adhesive layer is larger than the size of the through-hole present on the 1 st surface of the support.
The resin adhesive layer formed of the resin adhesive may be 1 layer or 2 or more layers. When the number of layers is 2 or more, the layers may be the same or different from each other.
The thickness of the resin-based adhesive layer is not particularly limited, but is, for example, preferably 1 to 150. mu.m, more preferably 1 to 100. mu.m, and still more preferably 1 to 50 μm.
< resin film >
The resin film is a member serving as a substrate of a working electrode, a counter electrode, or the like of the organic solar cell. In the dye-sensitized solar cell, one or both of the photoelectrode substrate and the counter electrode substrate is preferably a resin film.
As the resin film, a known resin film can be used. Examples of the resin film include resin films obtained by molding a resin composition containing a synthetic resin such as polyethylene terephthalate (PET), polyethylene naphthalate (PEN), Syndiotactic Polystyrene (SPS), polyphenylene sulfide (PPS), Polycarbonate (PC), polyarylate (PAr), Polysulfone (PSF), Polyethersulfone (PES), Polyetherimide (PEI), transparent Polyimide (PI), cycloolefin polymer (COP), polymethylpentene (PMP), and the like.
The light transmittance of the resin film at a wavelength of 400nm is preferably 40% or more, more preferably 70% or more.
The thickness of the resin film may be adjusted as appropriate depending on the application and the like. For example, 10 to 10000 μm.
The laminate may have the conductive film on the surface of the resin film.
The method for forming the laminate is a method for obtaining a laminate having at least a 3-layer structure including a resin film, a resin-based adhesive layer, and a support in this order, and the support is not particularly limited as long as it has the through-holes, and coating, bonding, and the like may be selected as appropriate. When the resin-based adhesive layer is formed by applying a resin-based adhesive, the method is not particularly limited, and a known printing method can be used. Examples thereof include a spin coating method, a dip coating method, an air knife coating method, a curtain coating method, a roll coating method, a wire bar coating method, a gravure coating method, an extrusion coating method using a hopper, a multilayer simultaneous coating method, and the like. In the case where the resin-based adhesive layer is formed by bonding, the resin-based adhesive layer can be bonded to the support or the resin film using, for example, a bonding apparatus. The through-hole may be provided in the support before the support and the resin-based adhesive layer are laminated, after the support and the resin-based adhesive layer are laminated, or before the support, the resin-based adhesive layer, and the resin film are laminated, or after the support, the resin-based adhesive layer, and the resin layer are laminated.
(method for manufacturing organic solar cell)
The method for manufacturing an organic solar cell according to the present invention is a method for manufacturing an organic solar cell including a step of injecting a fluid into the through-hole of the support of the laminate according to any one of the above. Accordingly, when the resin film is used as the substrate, the risk of damage to the resin film, the constituent members of the organic solar cell formed on the resin film, or the organic solar cell can be reduced, and the organic solar cell can be efficiently manufactured.
The method for producing an organic solar cell of the present invention is not particularly limited except that the laminate is used and a fluid is injected into the through-hole from the 2 nd surface of the support, and a known method for producing an organic solar cell can be employed. That is, in the conventional method for manufacturing an organic solar cell, in the step of using a resin film as a substrate, the laminate of the present invention described above may be used instead of the resin film alone to perform various steps such as film formation, fixing, printing, and bonding. In the peeling step (step of peeling the support) after the laminate is used or after the organic solar cell is produced, a fluid may be injected into the through-hole of the support to peel the support and the resin adhesive layer from the resin film.
Examples of the fluid injected into the through-hole of the support include air and dry air, and in addition, inert gases such as nitrogen and argon; and common organic solvents such as water, ethanol, acetonitrile, toluene, and Tetrahydrofuran (THF). The temperature of the fluid is not particularly limited, but is preferably from-80 ℃ to 200 ℃.
In the method for manufacturing an organic solar cell according to the present invention, the fluid is preferably air or dry air.
The fluid injected from the 2 nd surface side may be injected over the entire surface, or may be injected in a part of the central portion, a specific portion, or the like of the support body. Further, the timing of injecting the fluid may be shifted according to the portion to be injected. The fluid may be injected under pressure, preferably 0.001 to 1 MPa.
In the peeling, the laminate and the support may be cooled and heated, or may be performed in a dry atmosphere in the environment during the peeling, or may be performed in an inert gas.
In the method for manufacturing an organic solar cell according to the present invention, the organic solar cell is preferably a dye-sensitized solar cell.
Hereinafter, a method for manufacturing an organic solar cell will be described with reference to a dye-sensitized solar cell having a photoelectrode (working electrode), a counter electrode (counter electrode), and an electrolyte layer, as an example.
Examples of the steps of the method for producing an organic solar cell include a photoelectrode production step such as a step of forming a conductive film on a photoelectrode substrate, a step of forming a porous semiconductor fine particle layer on the conductive film on the photoelectrode substrate, and a step of forming a sensitizing dye layer on the porous semiconductor fine particle layer; a counter electrode manufacturing step such as a step of forming a conductive film on a counter electrode substrate, a step of forming a catalyst layer on the conductive film on the counter electrode substrate, and the like; a step of applying a sealant composition to the photoelectrode and/or the counter electrode and curing the composition by irradiation with energy rays to form a sealant; a general process of a known method for manufacturing an organic solar cell, such as a process of disposing an electrolyte layer between a photoelectrode and a counter electrode. For example, refer to Japanese patent application laid-open No. 2014-120219.
The conductive film can be formed by forming a film on the photoelectrode substrate or the counter electrode substrate by a known method such as a sputtering method, a coating method, a vapor deposition method, a spray pyrolysis method, or a Chemical Vapor Deposition (CVD) method. CO may be used2Or a laser such as YAG, etc., to form a conductive pattern.
The porous semiconductor fine particle layer can be formed by a known method such as a pressing method, a hydrothermal decomposition method, an electrophoretic deposition method, a binderless coating method, and an Aerosol Deposition (AD) method. For example, a porous semiconductor fine particle layer can be formed by applying a titanium oxide slurry using a screen printer or a Baker's type coater, drying the coating film at normal temperature, and then drying it by heating in a constant-temperature layer of 150 ℃.
The sensitizing dye layer can be formed using, for example, a method of immersing the porous semiconductor microparticle layer in a solution of a sensitizing dye, a method of applying a solution of a sensitizing dye onto the porous semiconductor microparticle layer, or the like. In the method of immersion, the sensitizing dye layer can be formed by immersing the porous semiconductor fine particle layer in, for example, an ethanol solution containing a dye.
The catalyst layer can be formed by a known method. For example, a catalyst layer containing carbon nanotubes (a) as described in japanese patent application laid-open No. 2014-120219 can be formed by preparing a dispersion liquid containing carbon nanotubes (a), applying the dispersion liquid to a conductive film on a counter electrode substrate, and drying the obtained coating film.
The electrolyte layer can be formed by applying a solution (electrolyte solution) containing the constituent components thereof to the photoelectrode, or by fabricating a battery cell having the photoelectrode and the counter electrode and injecting the electrolyte solution into the gap therebetween.
As the energy ray for curing the sealant, an energy ray such as ultraviolet ray, visible light, infrared ray, or electron beam can be used. Among these, ultraviolet rays and electron beams are preferable.
As the ultraviolet irradiation device, a device having a light source containing light generally in the range of 200 to 500nm, for example, a high-pressure mercury lamp, an ultra-high-pressure mercury lamp, a metal halide lamp, a gallium lamp, a xenon lamp, a carbon arc lamp, or the like can be used. On the other hand, when the curing is carried out by using an electron beam, an electron beam accelerator having an energy of usually 100 to 500eV can be used.
The curing conditions and the like may be performed under known conditions which are generally performed. The cumulative dose of the energy rays is usually 100 to 5000mJ/cm2Preferably 200 to 4000mJ/cm2。
The method of applying the sealant composition is not particularly limited, and methods such as flexographic printing, gravure printing, screen printing, inkjet printing, offset printing, bar coating, dip coating, flow coating, spray coating, spin coating, roll coating, reverse coating, air knife coating, and dispensing can be used.
The structure of the organic solar cell module is not particularly limited, and may be a Z-type, W-type, parallel-type, current collecting array type, monolithic type, or the like. A plurality of these modules may be connected in series or in parallel by connecting one or more than 2 modules in combination. The module may be formed using a known unit such as a current collecting electrode or an extraction electrode. The connection method may be any known method, and solder, a metal plate, a cable, a flat cable, a flexible substrate, a cable, or the like may be selected as appropriate.
The method of assembling the module is not particularly limited, and the module can be manufactured by a known method such as a vacuum bonding method (an ODF method) or an end sealing method. Examples of the ODF method include the method described in international publication No. 2007/046499. As the end sealing method, for example, a method described in japanese patent application laid-open No. 2006-004827 is cited.
In addition, an ultraviolet shielding layer, an oxygen and moisture shielding layer, an antireflection layer, an antifouling layer, a hard coat layer, a reinforcing member, and the like may be provided around the module or on the outer surface of the module as appropriate. These members may be formed by a known method such as vapor deposition, coating, or sheet-like member.
Examples
The present invention will be described in more detail with reference to examples, which are intended to illustrate the present invention and not to limit the present invention in any way. Unless otherwise specified, the amount to be blended represents parts by mass.
The support, resin-based adhesive, resin film, and UV curable resin used in the examples are as follows.
(support body)
Borosilicate glass: product name TEMPAX glass (thickness 3mm, length 300mm, width 210mm) manufactured by Schott corporation
(resin-based adhesive layer)
Silicone-based binder: silicone rubber double-sided tape 9030W manufactured by Temple manufacturing company
(resin film)
A300 nm ITO film was formed on the surface of a PEN film having a length of 300mm, a width of 210mm and a thickness of 125 μm.
(UV curing resin)
UV curing resin: liquid polyisobutylene sealing material
Example 1
One face and the opposite face have a diameter of 1mm (area 0.79 mm) at a distance of 50mm2) The support of the through-hole of (2) was coated with a silicone adhesive of 30 μm to form a resin adhesive layer, and a resin film was disposed on the resin adhesive layer so that the surface on the ITO film side was opposite to the resin adhesive layer, thereby forming a laminate. The through-hole of the support is formed so as to avoid the printed pattern of the resin film.
Example 2
In example 1, after the resin adhesive layer was formed, through holes having the same diameter as the through holes and penetrating through to the 2 nd surface of the resin adhesive layer were provided in the resin adhesive layer at the same positions overlapping the through holes present on the 1 st surface of the support when viewed in the laminating direction. Thereafter, a resin film was disposed in the same manner as in example 1 to form a laminate.
Example 3
In example 1, an Intelimer tape CS2325NA2 manufactured by Nitta (ltd.) was used as a resin adhesive layer instead of the silicone adhesive, and then resin films were disposed in the same manner as in example 1 to form a laminate.
Example 4
In example 2, Intelimer tape CS2325NA2 manufactured by Nitta (ltd.) was used as the resin adhesive layer instead of the resin adhesive, and then, in the same position as the through hole existing on the 1 st surface of the support when viewed in the laminating direction, a through hole having the same diameter as the through hole and penetrating through to the 2 nd surface of the resin adhesive layer was provided in the resin adhesive layer, and then, a resin film was disposed to form a laminate, as in example 2.
Example 5
In example 1, the through holes were arranged at intervals of 100mm and a diameter of 2mm (area of 3.19 mm)2) Thereafter, a resin film was disposed in the same manner as in example 1 to form a laminate.
Comparative example 1
A comparative laminate was formed in the same manner as in production example 1, except that in example 1, a support having no through-hole was used.
The laminates obtained in examples 1 to 5 or comparative laminates were used to manufacture organic solar cells through the following steps in the manufacture of organic solar cells.
(1) Fabrication of photoelectrode
< Process for Forming porous semiconductor Fine particle layer (heating Process) >
A binderless titanium oxide slurry (PECC-C01-06, manufactured by Peccell Technologies) was applied to the ITO surface of the laminate using a Baker type coater. The obtained coating film was dried at room temperature for 10 minutes, and then further dried by heating in a constant temperature layer at 150 ℃ for 5 minutes to form a porous semiconductor fine particle layer of 7 μm.
< Process for Forming sensitizing dye layer (immersion Process) >
The laminate having the porous semiconductor fine particle layer formed thereon was immersed in a sensitizing dye solution (ruthenium complex (N719, Solaronix Co., Ltd.) containing a sensitizing dye at a concentration of 3X 10) in ethanol at 40 ℃ for 120 minutes to form a sensitizing dye layer, thereby obtaining a photoelectrode-1Obtained by dissolving in mol/L mode.
(2) Manufacture of counter electrode
A platinum nanocolloid solution (made of a noble metal in the field) was applied to the ITO surface of a laminate different from the laminate used for producing the photoelectrode by a bar coating method, and dried. Then, the platinum catalyst was fixed by treatment with heated water vapor (100 ℃ C., 5 minutes) to form a catalyst layer, thereby obtaining a counter electrode.
(3) Preparation of the electrolyte
The respective components were dissolved in methoxyacetonitrile so that the concentrations of the respective components were 0.05mol/L of iodine, 0.1mol/L of lithium iodide, 0.5mol/L of t-butylpyridine, and 0.6mol/L of 1, 2-dimethyl-3-propylimidazolium iodide, thereby obtaining an electrolytic solution.
< step of Forming sealing agent (UV curing step) >
After a UV curable resin as a sealant composition was drawn so as to surround the periphery of the porous semiconductor fine particle layer on the laminate having the sensitizing dye layer formed on the porous semiconductor fine particle layer by a dispensing (dispense) method, the porous semiconductor fine particle layer was coated with an electrolytic solution, the fabricated photoelectrode was bonded to a counter electrode under vacuum using an automatic bonding apparatus, and the UV curable resin was cured by irradiation from the photoelectrode side for 60 seconds with a 100mW metal halide lamp, thereby forming a sealant.
< step of peeling support >
The supports on the photoelectric electrode side and the counter electrode side are peeled off from the laminate bonded with the sealant, thereby obtaining an organic solar cell.
When the laminates of examples 1 and 5 were used, the organic solar cell was obtained by peeling the laminate gradually from the end. When the support was peeled off from the laminated body of example 2 without injecting air into the through-holes, the support was peeled off from the end portions, thereby obtaining an organic solar cell. Further, an organic solar cell was also obtained by using the laminate of example 2 and peeling the support while injecting air into the through-hole. In examples 3 and 4, the laminate was cooled to 5 ℃ and then peeled off, thereby obtaining an organic solar cell. In the case of using the comparative laminate of comparative example 1, the sealant portion was broken and the support could not be peeled off.
Industrial applicability
According to the present invention, it is possible to provide a laminate and a method for manufacturing an organic solar cell using the laminate, which can reduce the risk of damage to a resin film or a component of an organic solar cell formed on the resin film, or to an organic solar cell, and can efficiently manufacture the organic solar cell, when the resin film is used as a substrate.
Description of the reference numerals
1: laminated body
10: support body
20: resin-based adhesive layer
30: resin film
40: through hole
Claims (6)
1. A laminate comprising, in order:
a resin film as an organic solar cell substrate;
a resin binder layer containing a resin binder; and
a support body which is used for supporting the supporting body,
the support body has a through-hole connecting a surface of the support body in contact with the resin-based adhesive layer and a surface other than the surface of the support body,
the through-hole present on the surface of the support in contact with the resin-based adhesive layer does not overlap with the portion of the resin film on which the wiring pattern is formed when viewed from the laminating direction.
2. The laminate according to claim 1, wherein,
the resin adhesive layer has a through-hole connecting a surface in contact with the support and a surface in contact with the resin film,
the through-hole of the resin-based adhesive layer is located at a position overlapping with a through-hole existing on a surface of the support in contact with the resin-based adhesive layer when viewed from the laminating direction.
3. The laminate according to claim 1 or 2,
the area of the through-hole present on the surface of the support in contact with the resin-based adhesive layer was 0.007mm2Above, and every 200cm of said face2Wherein 1 or more through-holes are present.
4. A method for manufacturing an organic solar cell, comprising a step of injecting a fluid into the through-hole of the support of the laminate according to any one of claims 1 to 3.
5. The method for manufacturing an organic solar cell according to claim 4, wherein,
the fluid is air.
6. The method for manufacturing an organic solar cell according to claim 4 or 5, wherein,
the organic solar cell is a dye-sensitized solar cell.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
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| JP2017065565 | 2017-03-29 | ||
| JP2017-065565 | 2017-03-29 | ||
| PCT/JP2018/012571 WO2018181393A1 (en) | 2017-03-29 | 2018-03-27 | Laminate and manufacturing method of organic solar battery |
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| Publication Number | Publication Date |
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| CN110431648A CN110431648A (en) | 2019-11-08 |
| CN110431648B true CN110431648B (en) | 2022-05-13 |
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| JP (2) | JP7070551B2 (en) |
| CN (1) | CN110431648B (en) |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101267934A (en) * | 2005-09-22 | 2008-09-17 | 三菱树脂株式会社 | Perforated laminate and its manufacturing method |
| CN102428052A (en) * | 2009-07-03 | 2012-04-25 | 日本电气硝子株式会社 | Glass film laminate |
| JP2015193101A (en) * | 2014-03-31 | 2015-11-05 | 東洋紡株式会社 | Polymer film laminated body and method for producing flexible electronic device using the same |
| JP2016083926A (en) * | 2014-10-27 | 2016-05-19 | 三菱樹脂株式会社 | Laminate having resin/glass composite |
| TW201627155A (en) * | 2014-11-21 | 2016-08-01 | Asahi Glass Co Ltd | Glass laminate, method for producing same and method for manufacturing electronic device |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003288028A (en) * | 2001-12-25 | 2003-10-10 | Canon Inc | Method for disassembling image display apparatus, method for producing image display apparatus, method for producing support member, method for producing image display unit, method for producing working material, and image display apparatus |
| JP2005228615A (en) * | 2004-02-13 | 2005-08-25 | Bridgestone Corp | Dye-sensitized solar cell and its electrode |
| WO2007129554A1 (en) * | 2006-05-08 | 2007-11-15 | Asahi Glass Company, Limited | Thin-sheet glass laminate, process for manufacturing display apparatus using the laminate, and supporting glass substrate |
| JP2008150694A (en) * | 2006-12-20 | 2008-07-03 | Dainippon Screen Mfg Co Ltd | Plating system, plating method, and manufacturing system and manufacturing method for dye-sensitized solar cell |
| JP2013077521A (en) * | 2011-09-30 | 2013-04-25 | Dainippon Printing Co Ltd | Substrate for electromagnetic wave detachable flexible device and method of manufacturing electronic element using the same |
| JP2013125666A (en) * | 2011-12-15 | 2013-06-24 | Kyodo Printing Co Ltd | Sheet with movable contact, manufacturing method of the same, and electronic apparatus |
| JP2013209484A (en) * | 2012-03-30 | 2013-10-10 | Hitachi Chemical Co Ltd | Adhesive composition, filmy adhesive and method for peeling adherend |
| JP6326815B2 (en) * | 2013-12-27 | 2018-05-23 | 日本ゼオン株式会社 | Solar cell electrode substrate |
-
2018
- 2018-03-27 JP JP2019509933A patent/JP7070551B2/en active Active
- 2018-03-27 WO PCT/JP2018/012571 patent/WO2018181393A1/en active Application Filing
- 2018-03-27 CN CN201880017294.5A patent/CN110431648B/en active Active
- 2018-03-29 TW TW107110931A patent/TW201840403A/en unknown
-
2021
- 2021-12-17 JP JP2021205542A patent/JP2022049017A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101267934A (en) * | 2005-09-22 | 2008-09-17 | 三菱树脂株式会社 | Perforated laminate and its manufacturing method |
| CN102428052A (en) * | 2009-07-03 | 2012-04-25 | 日本电气硝子株式会社 | Glass film laminate |
| JP2015193101A (en) * | 2014-03-31 | 2015-11-05 | 東洋紡株式会社 | Polymer film laminated body and method for producing flexible electronic device using the same |
| JP2016083926A (en) * | 2014-10-27 | 2016-05-19 | 三菱樹脂株式会社 | Laminate having resin/glass composite |
| TW201627155A (en) * | 2014-11-21 | 2016-08-01 | Asahi Glass Co Ltd | Glass laminate, method for producing same and method for manufacturing electronic device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2022049017A (en) | 2022-03-28 |
| TW201840403A (en) | 2018-11-16 |
| JPWO2018181393A1 (en) | 2020-02-06 |
| WO2018181393A1 (en) | 2018-10-04 |
| CN110431648A (en) | 2019-11-08 |
| JP7070551B2 (en) | 2022-05-18 |
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