CN110299466B - Substrate and stripping method - Google Patents

Substrate and stripping method Download PDF

Info

Publication number
CN110299466B
CN110299466B CN201910521426.4A CN201910521426A CN110299466B CN 110299466 B CN110299466 B CN 110299466B CN 201910521426 A CN201910521426 A CN 201910521426A CN 110299466 B CN110299466 B CN 110299466B
Authority
CN
China
Prior art keywords
substrate
sacrificial layer
openings
flexible
opening
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201910521426.4A
Other languages
Chinese (zh)
Other versions
CN110299466A (en
Inventor
顾辛艳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Najing Technology Corp Ltd
Original Assignee
Najing Technology Corp Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Najing Technology Corp Ltd filed Critical Najing Technology Corp Ltd
Priority to CN201910521426.4A priority Critical patent/CN110299466B/en
Publication of CN110299466A publication Critical patent/CN110299466A/en
Application granted granted Critical
Publication of CN110299466B publication Critical patent/CN110299466B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/841—Self-supporting sealing arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

The invention provides a substrate and a preparation method of a flexible electroluminescent device. The substrate comprises a first surface and a second surface opposite to the first surface, the first surface is provided with a plurality of first openings, the second surface is provided with a plurality of second openings, the first surface is used for bearing a film layer, the first openings and the second openings are in one-to-one correspondence and penetrate through the substrate to form a plurality of pore channels in a communicated manner, the surface energy of the first surface and the surface energy of the film layer are both smaller than the surface energy of the inner surface of the pore channels, and the deviation between the surface energy of the film layer and the surface energy of the first surface is within +/-10%. By changing the surface properties of the surface of the substrate and the inner surface of the substrate pore channel, the flexible device and the substrate are quickly peeled off, and the peeling efficiency is improved. Meanwhile, the acting force of the contact interface of the sacrificial layer material and the substrate is damaged by the erosion medium, so that the device and the substrate can be separated without mechanical damage to the device, the stripping and preparation of the flexible device are completed, and the preparation yield of the flexible device is improved.

Description

Substrate and stripping method
Technical Field
The invention relates to the technical field of display, in particular to a substrate and a preparation method of a flexible electroluminescent device.
Background
The advent of wearable electronics brings a great transition to people's life and perception, mainly because wearable electronics can bring a more perfect experience to the user than traditional electronics. Meanwhile, the wearability of wearable electronic devices requires good flexibility of the related electronic devices. Therefore, in recent years, research on the production of flexible devices has been receiving attention.
The preparation process of the general flexible device mainly comprises the following steps: firstly, manufacturing a flexible material on a rigid substrate to form a flexible base layer; continuously manufacturing an electroluminescent device or other functional layers on the surface of the flexible base layer and packaging; and finally, peeling the electroluminescent device from the substrate to obtain the flexible electroluminescent device. Currently, the most widely used lift-off method is to separate a substrate and a device using a laser, and the substrate used is a conventional substrate. However, since the base material is tightly attached to the substrate during the fabrication process, a large amount of heat is generated during the peeling process to damage the device, thereby reducing the yield of the device during the fabrication process. Meanwhile, the laser stripping equipment is high in price, the effective improvement of the stripping efficiency is limited due to the limitation of the stripping method, and the problems existing in the stripping process cannot be effectively solved by the conventional substrate.
Disclosure of Invention
In order to overcome the defects of the prior art, the invention aims to provide a substrate which can be repeatedly used and can realize simplification of a stripping process.
Another objective of the present invention is to provide a method for manufacturing a flexible electroluminescent device, which is simple in operation, and can improve the yield of the device and reduce the cost in the peeling process.
According to an aspect of the present invention, a substrate is provided, which includes a first surface and a second surface opposite to the first surface, the first surface has a plurality of first openings, the second surface has a plurality of second openings, the first surface is used for supporting a film, the plurality of first openings and the plurality of second openings correspond to each other one by one and penetrate through the substrate to form a plurality of channels, both the surface energy of the first surface and the surface energy of the film are smaller than the surface energy of the inner surfaces of the channels, and the surface energy of the film and the surface energy of the first surface have a deviation within ± 10%.
Preferably, the first surface and the second surface are parallel.
Optionally, the first surface is a hydrophobic surface and the interior surface of the pore channel is a hydrophilic surface.
Further, the surface energy of the first surface is 40mN/m or less.
Furthermore, the shapes of the first opening and the second opening are symmetrical figures, and the distance from the geometric center of the figures of the first opening and the second opening to the outer contour of the figures is 0.1 mu m-5 mm.
Furthermore, the plurality of first openings and the plurality of second openings are respectively distributed on the first surface and the second surface in an axial symmetry manner, the first openings and the second openings correspond to each other in the gravity direction one by one, and the distribution of the first openings and the second openings on the first surface and the second surface is 1-500/square centimeter.
Furthermore, the template material is one of silicon chip, quartz and glass, and the thickness of the template is 0.1-1 mm.
According to another aspect of the present invention, there is provided a method for manufacturing a flexible electroluminescent device, comprising the steps of:
s1, preparing a substrate, arranging sacrificial layer materials on the first surface of the substrate and in the pore channel, so that a sacrificial layer is formed on the first surface and in the pore channel, wherein the surface energy of the first surface and the surface energy of the sacrificial layer are both smaller than the surface energy of the inner surface of the pore channel, the deviation between the surface energy of the sacrificial layer and the surface energy of the first surface is within +/-10%, and the affinity between the sacrificial layer and the first surface is smaller than that between the sacrificial layer and the pore channel;
s2, arranging a flexible material on the surface of the sacrificial layer to form a flexible substrate layer, and continuously arranging and packaging an electroluminescent device on the surface of the flexible substrate layer to form a flexible electroluminescent device;
and S3, enabling the erosion medium to contact with the second surface of the substrate, and eroding the sacrificial layer material in the pore channel by the erosion medium through the second opening, so that the flexible electroluminescent device is separated from the substrate, and the flexible electroluminescent device is obtained.
Further, in step S1, the sacrificial layer is one or more selected from a group consisting of a polymer resin, a metal oxide, a non-metal oxide, and an organic-inorganic hybrid material.
Further, in the step S1, the thickness of the sacrificial layer is 0.5 to 100 μm, and preferably, the preparation method of the sacrificial layer is one of spin coating, blade coating, chemical vapor deposition, and physical vapor deposition.
Further, in the step S2, the flexible material is selected from one or more of polyimide, polyethylene naphthalate, polyethylene terephthalate, polycarbonate, cyclic olefin copolymer, polyethersulfone, polyacrylate, and polyetheretherketone.
Further, in step S3, the erosion medium is one of a liquid medium, a gas medium, and plasma.
Compared with the prior art, the invention has the beneficial effects that: according to the invention, the interface between the sacrificial layer and the channel and the interface between the sacrificial layer and the first surface are damaged by the erosion medium, so that the device and the substrate can be separated without mechanical damage to the device, the stripping and preparation of the flexible device are completed, and the yield of the device in the preparation process is improved. Because the surface energy difference of the first surface of the substrate and the inner surface of the pore channel reduces the stripping difficulty and improves the stripping efficiency in the preparation process. After the preparation process is finished, the substrate can be cleaned to be reusable, and the preparation cost is reduced. In addition, the operation process is simple, the controllability is strong, and the scale is favorably realized.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this application, illustrate embodiments of the invention and, together with the description, serve to explain the invention and not to limit the invention. In the drawings:
FIG. 1 illustrates a top view of a substrate according to an embodiment of the present invention;
FIG. 2 illustrates a cross-sectional view of a substrate according to an embodiment of the present invention;
FIG. 3 illustrates a cross-sectional view after a sacrificial layer is provided on a first surface of a substrate, in accordance with one embodiment of the present invention;
fig. 4 shows a front view of the structure after completion of the positioning of the electroluminescent device on the first surface of the substrate according to an embodiment of the invention;
fig. 5 shows a front view of a flexible electroluminescent device structure according to an embodiment of the present invention;
in the figure: 10. a substrate; 101. a duct; 102a, a first opening; 102b, a second opening; 103a, a first surface; 103b, a second surface; 20. a sacrificial layer; 30. a flexible substrate layer; 40. an electroluminescent device.
Detailed Description
The present invention is further described below with reference to specific embodiments, and it should be noted that, without conflict, any combination between the embodiments or technical features described below may form a new embodiment.
It should be noted that the terms "first," "second," and the like in the description and in the claims of the present application are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It should be understood that the data so used may be interchanged under appropriate circumstances such that embodiments of the application described herein may be used. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
As shown in fig. 1 and fig. 2, the present invention provides a substrate 10, including a first surface 103a and a second surface 103b opposite to the first surface 103a, the first surface 103a is provided with a plurality of first openings 102a, the second surface 103b is provided with a plurality of second openings 102b, the first surface 103a is used for carrying a film layer, the plurality of first openings 102a and the plurality of second openings 102b are in one-to-one correspondence and communicate with each other to form a plurality of channels 101 through the substrate 10, and a surface energy of the first surface 103a is smaller than a surface energy of inner surfaces of the channels 101. The surface energy of the first surface 103a and the surface energy of the film are both less than the surface energy of the inner surface of the channel 101, and the surface energy of the film is within ± 10% of the surface energy of the first surface 103 a.
When the substrate 10 is applied to the preparation of a flexible device, the surface energy of the first surface 103a is reduced or the surface energy of the inner surface of the pore 101 is increased by a surface treatment means, that is, the surface energy of the first surface 103a is smaller than the surface energy of the inner surface of the pore 101, so that the affinity between the film layer (for example, the sacrificial layer 20) and the first surface 103a is reduced, or the affinity between the film layer (the sacrificial layer 20) in the pore 101 and the inner surface of the pore 101 is increased, and in the subsequent stripping process of the electroluminescent device, after the acting force between the film layer (the sacrificial layer 20) and the inner surface of the pore 101 is destroyed, the film layer (the sacrificial layer 20) can be rapidly separated from the substrate 10, so that the stripping efficiency is improved.
In the present invention, the surface treatment means is not particularly limited, and a surface treatment means known to those skilled in the art may be used.
In a preferred embodiment, the first surface 103a and the second surface 103b of the substrate 10 are parallel.
In a preferred embodiment, the surface energy of the first surface 103a and the surface energy of the membrane layer are each less than 15% or more of the surface energy of the inner surface of the channel 101.
In some embodiments, the first surface 103a is a hydrophobic surface and the inner surface of the channel 101 is a hydrophilic surface. A hydrophilic surface refers to the surface of a solid material formed by molecules with polar groups, which is easily wetted by water. The characteristic of being easily wetted by water is the hydrophilicity of the substance. Hydrophobic, in chemistry, refers to the physical property of a molecule (hydrophobe) to repel water, and hydrophobic surfaces refer to the surfaces of solid materials formed from molecules of such physical property that repel water. For example, if a droplet (of water) spreads, wets a large area, and the contact angle is less than 90 degrees, the surface is said to be hydrophilic. If the droplet forms a sphere, hardly touching the surface, the droplet contact angle is larger than 90 degrees, and the surface is said to be hydrophobic, or hydrophobic.
In some embodiments, the inner surface of the channel 101 has a roughness that is greater than the roughness of the first surface 103 a.
In some embodiments, when the first surface 103a is a hydrophobic surface and the inner surface of the pore 101 is a hydrophilic surface, the sacrificial layer material has hydrophilicity, which is beneficial to improve the peeling efficiency between the sacrificial layer 20 and the substrate 10 in the subsequent peeling process.
In a preferred embodiment, the surface energy of the first surface 103a of the substrate 10 is 40mN/m or less.
In some embodiments, the first opening 102a and the second opening 102b are both shaped as a symmetrical pattern, and the distance from the geometric center of the pattern of the first opening 102a and the second opening 102b to the outer contour of the pattern is 0.1 μm to 5 mm.
In some embodiments, the shape of the single first opening 102a and the single second opening 102b may be arranged in a triangle, a circle, a square, etc., and the shape and size of the plurality of first openings 102a and the plurality of second openings 102b may be uniform or non-uniform.
In some embodiments, the plurality of first openings 102a and the plurality of second openings 102b are symmetrically distributed on the first surface 103a and the second surface 103b, respectively, geometric centers of the first openings 102a and the second openings 102b correspond to each other one by one, and the distribution of the first openings 102a and the second openings 102b on the first surface 103a and the second surface 103b, respectively, is 1-500/cm. The distribution density is properly increased, so that the bonding force between the sacrificial layer and the substrate can be enhanced in the early stage, and the contact speed between the erosion medium and the second opening 102b can be increased in the later stage, so that the stripping efficiency is improved.
It should be noted that the symmetric distribution of the plurality of first openings 102a and the plurality of second openings 102b on the first surface 103a and the second surface 103b is favorable for the sacrificial layer to be uniformly stressed on the surface of the substrate 10, so the symmetric axis in the symmetric distribution described in the present invention refers to the central symmetric axis of the pattern of the substrate 10, the plurality of pairs of first openings 102a on the first surface 103a are axisymmetric patterns corresponding to one another, and the plurality of pairs of second openings 102b on the second surface 103b are axisymmetric patterns corresponding to one another.
In addition, the sizes of the first and second openings 102a and 102b distributed on the first and second surfaces 103a and 103b, respectively, may be uniform or nonuniform.
It should be noted that, when the size of the first openings 102a corresponding to one another is larger than that of the second openings 102b, the fast filling of the sacrificial layer material is facilitated; when the size of the first opening 102a corresponding to one-to-one is smaller than that of the second opening 102b, the contact area between the sacrificial layer 20 and the erosion medium is increased; when the size of the first opening 102a is equal to that of the second opening 102b, the preparation of the substrate 10 is facilitated.
In some embodiments, the substrate 10 is made of one of silicon wafer, quartz and glass, and the thickness of the substrate is 0.1-1 mm. The material may be other hard materials.
In some embodiments, the substrate 10 is used to prepare a carrier substrate for use in an intermediate process of a flexible device. Flexible devices include, but are not limited to, flexible electroluminescent devices.
According to another aspect of the present invention, there is provided a method for manufacturing a flexible electroluminescent device, comprising the steps of:
s1, preparing a substrate 10, disposing a sacrificial layer material on the first surface 103a of the substrate 10 and in the hole 101, so that a sacrificial layer 20 is formed on the first surface 103a and in the hole 101, wherein a cross-sectional structure of the sacrificial layer 20 is as shown in fig. 3, a surface energy of the first surface 103a and a surface energy of the sacrificial layer 20 are both less than a surface energy of an inner surface of the hole 101, a deviation between the surface energy of the sacrificial layer 20 and the surface energy of the first surface 103a is within ± 10%, and an affinity between the sacrificial layer material and the first surface 103a is less than an affinity between the sacrificial layer material and the hole 101, wherein the substrate 10 is the substrate 10 provided in any embodiment of the present invention; s2, disposing a flexible material on the surface of the sacrificial layer 20 to form a flexible substrate layer 30, and further disposing and encapsulating the electroluminescent device 40 on the surface of the flexible substrate layer 30 to obtain the structure shown in fig. 4;
s3, contacting the etching medium with the second surface 103b of the substrate 10, and etching the sacrificial layer material in the via 101 by the etching medium through the second opening 102b, so as to separate the flexible electroluminescent device from the substrate 10, thereby obtaining the flexible electroluminescent device, which has a structure shown in fig. 5.
According to the invention, the interface between the sacrificial layer 20 and the inner surface of the pore 101 and the interface between the sacrificial layer 20 and the first surface 103a are damaged by erosion medium, so that the flexible device can be separated from the film layer on the substrate 10 without mechanical damage to the device, the stripping and preparation of the flexible device are completed, and the yield of the flexible device in the preparation process is improved. Meanwhile, because the affinity of the sacrificial layer material to the first surface 103a is smaller than that of the sacrificial layer material to the pore 101, when the affinity of the sacrificial layer material to the pore 101 is damaged, the sacrificial layer can be rapidly separated from the substrate 10, so that the stripping difficulty is reduced, and the stripping efficiency in the preparation process is improved. After the preparation process is completed, the substrate 10 can be cleaned to realize the reusability of the substrate 10, and the preparation cost is reduced. In addition, the inventors design the size and distribution of the openings and the channels 101 of the substrate 10, so that the preparation method of the present invention does not affect the flatness of the flexible material coating.
It should be noted that, the pore passage 101 is not limited to be filled with the water. The filling amount in the via is critical to maintain the first surface of the sacrificial layer not recessed at the first opening 102a during the manufacturing process, and preferably, the via 101 is not filled, thereby facilitating the later peeling of the sacrificial layer.
In some embodiments, in step S1, the sacrificial layer is selected from one or more of polymer resin, metal oxide, non-metal oxide, and organic-inorganic hybrid material. The polymer resin may be, but is not limited to, a photocurable resin such as a photoresist, etc. The organic-inorganic hybrid material may be, but is not limited to, epoxy silica composite, polyimide titania composite, and the like.
In some embodiments, in the step S1, the thickness of the sacrificial layer is 0.5-100 μm. The thickness of the sacrificial layer refers only to the thickness on the first surface 103a and does not include the thickness within the channel.
In some embodiments, the sacrificial layer is prepared by one of spin coating, doctor blading, chemical vapor deposition, and physical vapor deposition.
In some embodiments, in the step S2, the flexible material is selected from one or more of polyimide, polyethylene naphthalate, polyethylene terephthalate, polycarbonate, cyclic olefin copolymer, polyethersulfone, polyacrylate, and polyetheretherketone.
In some embodiments, in step S3, the erosion medium is one of a liquid medium, a gas medium, and a plasma. The liquid medium may be, but is not limited to, an acidic developer, an alkaline developer, an alcohol ether solvent, and the like. The gaseous medium may be, but is not limited to, carbon tetrafluoride, hexafluoroethane, and the like.
Examples
Example 1
(1) Selecting the specification of the substrate: the size is 200 x 0.7mm, the surface energy of the first surface is 28mN/m, the first opening and the second opening are both circular, the radius of the circle is 250 μm, the first opening and the second opening are respectively distributed on the first surface and the second surface in an axisymmetric way, the distribution density is 100 per square centimeter, and the geometric center connecting line of the first opening and the second opening is vertical to the first surface.
(2) Manufacturing a sacrificial layer: a 15 wt% zinc oxide (ZnO) nanocrystal solution having a size of 8nm, a solvent of pentanol, a solution surface tension of 35mN/m was coated on the above substrate using a slit coating apparatus, and a thickness of 300nm was measured on the first surface after drying.
(3) Manufacturing a flexible substrate layer: a Polyimide (PI) solution was coated using a slit coating apparatus in the presence of dimethylacetamide, and dried to obtain a PI film having a thickness of 20 μm on the sacrificial layer.
(4) Manufacturing a device: a silicon nitride layer with the thickness of 50nm, an Indium Tin Oxide (ITO) layer with the thickness of 150nm, a polyethylene dioxythiophene-poly (styrene sulfonate) (PEDOT: PSS) layer with the thickness of 40nm, a poly (9, 9-dioctyl fluorene-CO-N- (4-butyl phenyl) diphenylamine) (TFB) layer with the thickness of 25nm, a Blue Quantum Dot (BQD) with the thickness of 40nm, a ZnO layer with the thickness of 50nm and a silver (Ag) layer with the thickness of 100nm are sequentially manufactured on a PI film by a chemical vapor deposition method. And sequentially arranging four groups of inorganic and organic groups by using an Atomic Layer Deposition (ALD) method and an ink-jet printing technology to obtain a packaging film, wherein the thickness of an aluminum oxide (Al2O3) layer manufactured by using the ALD method is 50nm, the thickness of a polymer film obtained after ink-jet printing and curing is 400nm, and after a Polyester (PET) transparent film with the thickness of 250um is attached to the uppermost layer of the packaging film, the quantum dot electroluminescent device is manufactured.
(5) And (3) stripping the device: and applying an erosion solution on the second surface of the substrate, enabling the erosion solution to sequentially contact the second surface, the pore and the first surface of the substrate, wherein the erosion solution consists of acetic acid, ethanol and propylene glycol methyl ether, the volume ratio of the components is 2:48:50, a separation phenomenon between the substrate and the flexible substrate can be observed after 5min, and the processing time is continuously prolonged until the sacrificial layer is completely removed, so that the stripping of the device is completed. And then attaching a PET film with the thickness of 250um to one side of the exposed PI film to obtain the flexible electroluminescent device.
Example 2
(1) Selecting the specification of the substrate: the size is 200 x 0.7mm, the surface energy of the first surface is 28mN/m, the first opening and the second opening are both circular, the radius of the circle is 100 μm, the first opening and the second opening are respectively distributed on the first surface and the second surface in an axisymmetric way, the distribution density is 500/square centimeter, and the geometric center connecting line of the first opening and the second opening is vertical to the first surface.
(2) The sacrificial layer is fabricated in the same manner as in step (2) of example 1.
(3) The flexible substrate layer was fabricated in the same manner as in step (3) of example 1.
(4) The device fabrication method was the same as in step (4) of example 1.
(5) The device separation method was the same as in step (5) of example 1.
Example 3
(1) Selecting the specification of the substrate: the size is 200 × 0.7mm, the surface energy of the first surface is 28mN/m, the first opening and the second opening are both circular, the radius of the circle is 2mm, the first opening and the second opening are respectively and axially symmetrically distributed on the first surface and the second surface, the distribution density is 4 per square centimeter, and the geometric center connecting line of the first opening and the second opening is vertical to the first surface.
(2) The sacrificial layer manufacturing method is the same as the step (2) of embodiment 1.
(3) The flexible substrate layer was fabricated in the same manner as in step (3) of example 1.
(4) The device fabrication method was the same as in step (4) of example 1.
(5) The device separation method was the same as in step (5) of example 1.
Example 4
(1) Selecting the specification of the substrate: the size is 200 × 0.7mm, the surface energy of the first surface is 28mN/m, the first opening and the second opening are both square, the side length of the first opening is 200 μm, the side length of the second opening is 100 μm, the first opening and the second opening are respectively in axial symmetry distribution on the first surface and the second surface, the distribution density is 200/square centimeter, and the geometric center connecting line of the first opening and the second opening is perpendicular to the first surface.
(2) The sacrificial layer is fabricated in the same manner as in step (2) of example 1.
(3) The flexible substrate layer was fabricated in the same manner as in step (3) of example 1.
(4) The device fabrication method was the same as in step (4) of example 1.
(5) The device separation method was the same as in step (5) of example 1.
Example 5
(1) Selecting the specification of the substrate: the size of the first opening is 200 x 0.7mm, the surface energy of the first surface is 28mN/m, the first opening and the second opening are both square, the side lengths of the first opening and the second opening are both 200 mu m, the first opening and the second opening are respectively distributed on the first surface and the second surface in an axial symmetry manner, in a central area of 100 x 100mm, the distribution of the openings is 400/square centimeter, the distribution of the openings in a peripheral area is 100/square centimeter, and a geometric center connecting line of the first opening and the second opening is vertical to the first surface.
(2) The sacrificial layer is fabricated in the same manner as in step (2) of example 1.
(3) The flexible substrate layer was fabricated in the same manner as in step (3) of example 1.
(4) The device fabrication method was the same as in step (4) of example 1.
(5) The device separation method was the same as in step (5) of example 1.
Comparative example 1
(1) The substrate specification was the same as that of example 1.
(2) The sacrificial layer is fabricated in the same manner as in step (2) of example 1.
(3) The flexible substrate layer was fabricated in the same manner as in step (3) of example 1.
(4) The device fabrication method was the same as in step (4) of example 1.
And (3) performance testing:
the effective light emitting area of the device of each of the above examples and comparative example 1 was selected to be 150 × 150mm, a photoelectric performance test was performed using PR670 of Photo Research to test the External Quantum Efficiency (EQE) at the center position of the device, the light emitting area was equally divided into 9 parts (luminance unit cd/m2), and the luminance at the center position of each part was measured at a current density of 2mA/cm2 to evaluate the light emitting uniformity, and the test results are shown in the following table:
numbering Example 1 Example 2 Example 3 Practice ofExample 4 Example 5 Comparative example 1
EQE％ 6.48 6.51 6.55 6.47 6.5 6.52
Luminance 1 133.2 131.8 131.2 128.7 130.3 132.5
Luminance 2 129.8 128.6 127.9 133.0 128.6 133.1
Luminance 3 131.7 132.7 132.6 130.3 128.7 129.5
Brightness 4 128.9 128.8 130.3 128.8 129.2 128.2
Brightness 5 129.7 131.8 129.2 130.4 130.6 129.9
Brightness 6 132.8 128.6 127.9 130.2 131.8 130.5
Luminance 7 126.9 132.7 130.4 127.2 130.3 127.8
Brightness 8 130.5 128.8 132.9 129.8 132.3 131.2
Luminance 9 127.8 130.8 131.7 128.1 129.2 128.1
Average brightness 130.1 130.5 130.4 129.6 130.1 130.1
As can be seen from the above table, the QLEDs obtained by the substrate and the lift-off method of the present invention (examples 1-5) have substantially no difference in efficiency and brightness uniformity from the un-peeled device (comparative example 1), because the device is not damaged by the relatively simple and mild lift-off method, mainly due to the difference in surface energy between the first surface of the substrate and the channel. By adopting the substrate of the invention, because the surface energy of the first surface of the substrate and the surface energy of the film layer are both less than the surface energy of the inner surface of the hole channel, in embodiments 1 to 5 of the invention, the adhesion force of the zinc oxide nanocrystals on the first surface is weaker, but the zinc oxide nanocrystals penetrate into the hole channel and form good adhesion force with the inner surface of the through hole, after the zinc oxide layer (sacrificial layer) is manufactured, the overall adhesion force of the zinc oxide layer on the substrate is better, the smoothness of the film layer coating is not influenced by reasonably designing the size and distribution of the first opening and the second opening, and meanwhile, the film layer falling-off phenomenon is not observed in the whole manufacturing process. In the device stripping process, an erosion solution enters from the second opening, when the erosion solution dissolves the sacrificial layer material in the pore channel, the adhesion force of the zinc oxide nano-crystal on the first surface is weak, the device is easily stripped from the substrate, and the residual zinc oxide layer can be completely removed after the treatment time is continuously prolonged. In summary, by using the substrate and the stripping method of the invention, the finally prepared flexible device can effectively avoid the mechanical damage to the device caused by the traditional stripping method, and the action time of the device to be stripped and the erosion medium is shortened, thereby improving the stripping efficiency and the yield of the flexible device.
The above embodiments are only preferred embodiments of the present invention, and the protection scope of the present invention is not limited thereby, and any insubstantial changes and substitutions made by those skilled in the art based on the present invention are within the protection scope of the present invention.

Claims (10)

1. A substrate is characterized by comprising a first surface and a second surface opposite to the first surface, wherein the first surface is provided with a plurality of first openings, the second surface is provided with a plurality of second openings, the first surface is used for bearing a film layer, the first openings and the second openings are in one-to-one correspondence and penetrate through the substrate to form a plurality of channels in a communicating mode, the surface energy of the first surface and the surface energy of the film layer are both smaller than the surface energy of the inner surfaces of the channels, the deviation between the surface energy of the film layer and the surface energy of the first surface is within +/-10%, and the surface energy of the first surface is smaller than or equal to 40 mN/m.
2. The substrate of claim 1, wherein the first surface is a hydrophobic surface and the interior surfaces of the channels are hydrophilic surfaces.
3. The substrate according to claim 1, wherein the first opening and the second opening are each in a symmetrical pattern, and a distance from a geometric center of the pattern of the first opening and the second opening to an outer contour of the pattern is 0.1 μm to 5 mm.
4. The substrate according to claim 1, wherein the plurality of first openings and the plurality of second openings are symmetrically distributed on the first surface and the second surface, respectively, and geometric centers of the first opening patterns and geometric centers of the second opening patterns correspond to each other one by one, and the distribution of the first openings and the second openings on the first surface and the second surface, respectively, is 1 to 500/cm.
5. A preparation method of a flexible electroluminescent device is characterized by comprising the following steps:
s1, preparing a substrate, wherein the substrate is the substrate of any one of claims 1 to 4; disposing a sacrificial layer material on the first surface of the substrate and in the via such that a sacrificial layer is formed on the first surface and in the via, the surface energy of the first surface and the surface energy of the sacrificial layer are both less than the surface energy of the inner surface of the via, and the surface energy of the sacrificial layer and the surface energy of the first surface are within ± 10%, and the affinity of the sacrificial layer to the first surface is less than the affinity of the sacrificial layer to the via;
s2, arranging a flexible material on the surface of the sacrificial layer to form a flexible substrate layer, and continuously arranging and packaging an electroluminescent device on the surface of the flexible substrate layer to form a flexible electroluminescent device;
and S3, enabling an erosion medium to contact with the second surface of the substrate, wherein the erosion medium erodes the sacrificial layer material in the pore channel through the second opening, so that the flexible electroluminescent device is separated from the substrate, and the flexible electroluminescent device is obtained.
6. The method for preparing the flexible electroluminescent device as claimed in claim 5, wherein the sacrificial layer is selected from one or more of polymer resin, metal oxide, non-metal oxide, and organic-inorganic hybrid material.
7. The method for manufacturing a flexible electroluminescent device according to claim 5, wherein the thickness of the sacrificial layer is 0.5 to 100 μm.
8. The method of claim 7, wherein the sacrificial layer is formed by one of spin coating, doctor-blading, chemical vapor deposition, and physical vapor deposition.
9. The method for preparing the flexible electroluminescent device according to claim 5, wherein in the step S2, the flexible material is selected from one or more of polyimide, polyethylene naphthalate, polyethylene terephthalate, polycarbonate, cyclic olefin copolymer, polyethersulfone, polyacrylate and polyetheretherketone.
10. The method for manufacturing a flexible electroluminescent device according to claim 5, wherein in step S3, the erosion medium is one of a liquid medium, a gas medium, and a plasma.
CN201910521426.4A 2019-06-17 2019-06-17 Substrate and stripping method Active CN110299466B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201910521426.4A CN110299466B (en) 2019-06-17 2019-06-17 Substrate and stripping method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201910521426.4A CN110299466B (en) 2019-06-17 2019-06-17 Substrate and stripping method

Publications (2)

Publication Number Publication Date
CN110299466A CN110299466A (en) 2019-10-01
CN110299466B true CN110299466B (en) 2022-06-14

Family

ID=68028088

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201910521426.4A Active CN110299466B (en) 2019-06-17 2019-06-17 Substrate and stripping method

Country Status (1)

Country Link
CN (1) CN110299466B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111370596A (en) * 2020-03-09 2020-07-03 福建华佳彩有限公司 Preparation method and preparation equipment of flexible device
CN111477120B (en) * 2020-05-21 2022-07-05 京东方科技集团股份有限公司 Display mother board, separation method and manufacturing method thereof, and display panel
CN112018216A (en) * 2020-10-30 2020-12-01 南昌凯迅光电有限公司 Method for transferring solar cell substrate

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101475509B1 (en) * 2008-02-26 2014-12-24 서울바이오시스 주식회사 Light emitting device and method for manufacturing thereof
KR20150077969A (en) * 2013-12-30 2015-07-08 삼성디스플레이 주식회사 Methods of preparing flexible substrates, flexible display devices and methods of manufacturing flexible display devices
CN105702625B (en) * 2016-04-12 2017-11-03 武汉华星光电技术有限公司 The stripping means of flexible base board
CN106711049B (en) * 2016-12-22 2020-09-29 武汉华星光电技术有限公司 Porous substrate and manufacturing method thereof, and manufacturing method of thin film transistor
CN107742618B (en) * 2017-10-24 2020-07-03 京东方科技集团股份有限公司 Preparation method of flexible panel, flexible panel and display device

Also Published As

Publication number Publication date
CN110299466A (en) 2019-10-01

Similar Documents

Publication Publication Date Title
CN110299466B (en) Substrate and stripping method
KR102307788B1 (en) Nanostructures for oled devices
EP3340330A1 (en) Organic light-emitting diode device, manufacturing method, and display apparatus
US9054345B2 (en) Pixel defining layer, preparation method thereof, organic light-emitting diode substrate and display
US9594193B2 (en) Printing plate, scattering layer, method for fabricating the same, and display apparatus
US6888308B1 (en) Organic LED device
US10923670B2 (en) Method of fabricating rigid island pattern on stretchable layer with low Young's modulus and stretchable electronic device platform using the same
KR20130039702A (en) Method for producing electronic device and method for producing carrier substrate with resin layer
US20150382474A1 (en) Method for fabricating flexible electronic device and substrate for fabricating the same
CN110429100B (en) Display panel and preparation method and application thereof
CN102349131A (en) Large area dissolvable template lithography
US9030746B2 (en) Fabrication method of microlens array and microlens array thereof
CN209357756U (en) Flexible base board, flexible Organic Light Emitting Diode and display device
US8530251B2 (en) Manufacturing method of high-efficiency LED
CN112670411A (en) Full-solution flexible organic thin film transistor array and preparation method and application thereof
CN113782256B (en) Method for manufacturing low-surface-roughness transparent electrode
WO2019148581A1 (en) Flexible led device and manufacturing method thereof
JP2014512075A (en) Surface flattening
KR101705583B1 (en) Manufacturing method of patterned flexible transparent electrode
JP2007201056A (en) Thin-film transistor and manufacturing method thereof
KR101207504B1 (en) Channel structure of organic thin-film solar cell manufacturing method
KR20050012165A (en) Methods and fixtures for facilitating handling of thin films
KR101311450B1 (en) Soft-mold and fabricating method of the same, and fabricating method of optical flim using the same
WO2011027276A1 (en) Oled device with low index material
KR100505343B1 (en) Elastomer mold fabrication method for patterning and method for forming cathode separator wall of organic light emitting device by using it

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant