CN107742618B - Preparation method of flexible panel, flexible panel and display device - Google Patents
Preparation method of flexible panel, flexible panel and display device Download PDFInfo
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- CN107742618B CN107742618B CN201711002040.XA CN201711002040A CN107742618B CN 107742618 B CN107742618 B CN 107742618B CN 201711002040 A CN201711002040 A CN 201711002040A CN 107742618 B CN107742618 B CN 107742618B
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- 238000002360 preparation method Methods 0.000 title abstract description 9
- 239000000758 substrate Substances 0.000 claims abstract description 98
- 239000000126 substance Substances 0.000 claims abstract description 79
- 238000006243 chemical reaction Methods 0.000 claims abstract description 24
- 238000000034 method Methods 0.000 claims abstract description 20
- 230000008859 change Effects 0.000 claims abstract description 17
- 239000000463 material Substances 0.000 claims abstract description 15
- 238000004519 manufacturing process Methods 0.000 claims abstract description 8
- 239000003054 catalyst Substances 0.000 claims description 11
- 239000000376 reactant Substances 0.000 claims description 8
- 230000008569 process Effects 0.000 abstract description 4
- 238000012545 processing Methods 0.000 abstract description 4
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 9
- 239000007789 gas Substances 0.000 description 6
- 239000010410 layer Substances 0.000 description 5
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical group O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 4
- YRIUSKIDOIARQF-UHFFFAOYSA-N dodecyl benzenesulfonate Chemical compound CCCCCCCCCCCCOS(=O)(=O)C1=CC=CC=C1 YRIUSKIDOIARQF-UHFFFAOYSA-N 0.000 description 4
- 229940071161 dodecylbenzenesulfonate Drugs 0.000 description 4
- 238000000926 separation method Methods 0.000 description 4
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 3
- 230000005684 electric field Effects 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 239000005416 organic matter Substances 0.000 description 3
- 229910000531 Co alloy Inorganic materials 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- PQCCZSBUXOQGIU-UHFFFAOYSA-N [La].[Pb] Chemical compound [La].[Pb] PQCCZSBUXOQGIU-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 229910002092 carbon dioxide Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 229910052451 lead zirconate titanate Inorganic materials 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 1
- 229910007564 Zn—Co Inorganic materials 0.000 description 1
- QXZUUHYBWMWJHK-UHFFFAOYSA-N [Co].[Ni] Chemical compound [Co].[Ni] QXZUUHYBWMWJHK-UHFFFAOYSA-N 0.000 description 1
- QVYYOKWPCQYKEY-UHFFFAOYSA-N [Fe].[Co] Chemical compound [Fe].[Co] QVYYOKWPCQYKEY-UHFFFAOYSA-N 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- KCZFLPPCFOHPNI-UHFFFAOYSA-N alumane;iron Chemical compound [AlH3].[Fe] KCZFLPPCFOHPNI-UHFFFAOYSA-N 0.000 description 1
- 125000000129 anionic group Chemical group 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- PLUHAVSIMCXBEX-UHFFFAOYSA-N azane;dodecyl benzenesulfonate Chemical compound N.CCCCCCCCCCCCOS(=O)(=O)C1=CC=CC=C1 PLUHAVSIMCXBEX-UHFFFAOYSA-N 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 238000003421 catalytic decomposition reaction Methods 0.000 description 1
- 125000002091 cationic group Chemical group 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- GVGUFUZHNYFZLC-UHFFFAOYSA-N dodecyl benzenesulfonate;sodium Chemical compound [Na].CCCCCCCCCCCCOS(=O)(=O)C1=CC=CC=C1 GVGUFUZHNYFZLC-UHFFFAOYSA-N 0.000 description 1
- 125000002485 formyl group Chemical class [H]C(*)=O 0.000 description 1
- 150000002605 large molecules Chemical class 0.000 description 1
- 239000002346 layers by function Substances 0.000 description 1
- JQJCSZOEVBFDKO-UHFFFAOYSA-N lead zinc Chemical compound [Zn].[Pb] JQJCSZOEVBFDKO-UHFFFAOYSA-N 0.000 description 1
- 229920002521 macromolecule Polymers 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 229940080264 sodium dodecylbenzenesulfonate Drugs 0.000 description 1
- 239000006104 solid solution Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1259—Multistep manufacturing methods
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- Power Engineering (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
Abstract
The invention discloses a preparation method of a flexible panel, which comprises the following steps: providing a substrate, wherein holes are distributed on a first surface of the substrate; filling a reaction substance in the hole; forming a flexible substrate on the first surface of the base; forming a display device layer on the flexible substrate; and processing the reaction substance to enable the reaction substance to generate chemical change and/or physical change, and forming a gap between the first surface of the base and the flexible substrate. The method for preparing the flexible panel has the advantages that the process is simple, the flexible substrate is easily separated from the base, poor display caused by damage of the flexible substrate is avoided, the base can be repeatedly utilized, the method is beneficial to mass production, and materials are saved.
Description
Technical Field
The invention relates to the technical field of display, in particular to a preparation method of a flexible panel, the flexible panel and a display device.
Background
With the development of display technology, flexible display panels are gradually applied to the field of display technology, and have the advantages of being ultrathin, light in weight, durable, large in storage, free in design, capable of being rolled and the like.
In the preparation process of the flexible panel, the flexible substrate needs to be adhered to the glass substrate, other structures of the flexible display panel are formed on the flexible substrate, and finally peeling is carried out. However, the conventional stripping process is easy to damage the flexible substrate, or excessive residues are formed on the surface of the flexible substrate, which affects the electrical performance of the flexible panel device and causes the problems of reduced yield and the like.
Disclosure of Invention
The invention provides a preparation method of a flexible panel, the flexible panel and a display device, and aims to solve the problems that in the prior art, a flexible substrate is difficult to separate from a base plate, and poor display is easily caused.
In a first aspect, the present invention provides a method for preparing a flexible panel, comprising: providing a substrate, wherein holes are distributed on a first surface of the substrate;
filling a reaction substance in the hole;
forming a flexible substrate on the first surface of the base;
forming a display device layer on the flexible substrate;
and processing the reaction substance to enable the reaction substance to generate chemical change and/or physical change, and forming a gap between the first surface of the base and the flexible substrate.
Optionally, the reaction mass comprises an organic and a catalyst.
Optionally, the substrate is made of a catalyst material, and the reaction substance is an organic substance.
Optionally, processing the reactive substance to cause a chemical and/or physical change in the reactive substance to form a gap between the first surface of the base and the flexible substrate includes:
and illuminating the reaction substance to decompose the reaction substance to generate gas, and forming a gap between the first surface of the base and the flexible substrate.
Optionally, the reactive species is a retractable species.
Optionally, processing the reactive substance to cause a chemical and/or physical change in the reactive substance to form a gap between the first surface of the base and the flexible substrate includes:
treating the stretchable substance to cause the stretchable substance to stretch, forming a gap between the first surface of the base and the flexible substrate.
Optionally, the stretchable substance is an electrostrictive substance or a magnetostrictive substance or a photo-strictive substance.
Optionally, the substrate is a mesoporous substrate.
In a second aspect, the invention further provides a flexible panel, which is prepared and formed by the method.
In a third aspect, the present invention further provides a display device, including the above flexible panel.
Compared with the prior art, the embodiment of the invention has the following advantages:
according to the preparation method of the flexible panel, the holes of the base are filled with the reaction substances, the reaction substances are acted, the reaction substances are subjected to chemical change and/or physical change, and a gap can be formed between the first surface of the base with the holes and the flexible substrate, so that the flexible substrate is separated from the base.
Drawings
FIG. 1 is a flow chart illustrating a method of making a flexible panel according to an embodiment of the present invention;
FIGS. 2-6 are schematic diagrams illustrating different stages in a process for manufacturing a flexible panel according to an embodiment of the present invention;
FIG. 7 is a schematic view of the separation of a substrate from a flexible substrate by a reactant-generating gas in accordance with an embodiment of the present invention;
FIG. 8 is a schematic diagram of the reactant shrinking to separate the base from the flexible substrate according to one embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Fig. 1 is a flow chart of a method for manufacturing a flexible panel according to an embodiment of the present invention, and fig. 2 to 6 are schematic structural diagrams of different stages in a manufacturing process. Referring to fig. 1 and 2-6, a method of making a flexible panel according to one embodiment of the present invention includes the steps of:
Referring to fig. 2, which is a schematic structural diagram of the substrate corresponding to this step, holes 11 are distributed on the substrate 1, and the size and number of the holes are not limited in the present invention, but the holes are uniformly distributed optimally to ensure a good separation effect. The substrate is usually made of glass, but substrates of different materials can be selected according to actual needs.
Referring to fig. 3, which is a corresponding schematic structural diagram of this step, the hole 11 of the substrate 1 is filled with a reactive substance 12, which can undergo a chemical change and/or a physical change under certain conditions, so that a gap is formed between the first surface of the substrate and the flexible substrate.
Referring to fig. 4, which is a schematic structural diagram corresponding to this step, the flexible substrate 2 may be made of Polyimide (PI), or may be made of other flexible materials, and the present invention is not limited thereto.
At step 400, display device layers are formed on a flexible substrate.
Referring to fig. 5, a schematic structural diagram corresponding to this step is shown, it can be understood that the display device layer 3 may include various functional layer structures such as a thin film transistor driving circuit, a pixel circuit, an organic light emitting layer, a common electrode layer, and the like, and may further include structures such as a detection circuit, a driving circuit, and the like.
Referring to fig. 6, which is a corresponding schematic structural diagram of this step, when the reaction substance 12 filled in the hole 11 undergoes a chemical and/or physical change, a gap is generated between the base 1 and the flexible substrate 2, the adhesion between the two is reduced, and finally the two can be separated.
It can be understood that the generation of the gap between the base 1 and the flexible substrate 2 can reduce the adhesion between the two, if the reactant is chemically and/or physically changed to directly separate the two, the peeling operation is not needed, if the reactant is chemically and/or physically changed to directly separate the two, the base 1 and the flexible substrate 2 need to be separated by the mechanical peeling method in the prior art, because the gap exists between the two, the adhesion is greatly reduced, the internal stress generated during peeling is small, and the flexible substrate is not easily damaged.
According to the preparation method of the flexible panel, the holes of the base are filled with the reaction substances, the reaction substances are processed, the reaction substances are subjected to chemical change and/or physical change, and a gap can be formed between the first surface of the base with the holes and the flexible substrate, so that the flexible substrate is separated from the base.
In an embodiment of the present invention, referring to fig. 7, the substrate 11 may be a mesoporous substrate, the mesoporous substrate has a large specific surface area, a relatively large pore diameter and a regular pore structure, can process large molecules or groups, and is a good shape-selective catalyst, and reactants are filled in the mesoporous substrate, so that the reactants are uniformly distributed, and the stress is uniform during peeling. The reactant 11 is filled in the mesopores of the mesoporous substrate, and the reactant 11 may specifically include an organic substance and a catalyst. The organic matter and the catalyst may be decomposed under certain conditions to generate a gas 13, so that a gap is formed between the base 1 and the flexible substrate 2. Specifically, the organic substance can be anionic sodium Dodecyl Benzene Sulfonate (DBS) or cationic ammonium dodecyl benzene sulfonate (BDDAC), and the catalyst is titanium dioxide (TiO)2) By TiO 22As catalyst, DBS or BDDAC can form oxygen under the condition of illuminationIntermediate products such as compound and aldehyde, and finally completely carbonized into carbon dioxide (CO)2) CO produced by decomposition of organic matter2The gas forms a gap between the base 1 and the flexible substrate 2, and finally separates the base 1 from the flexible substrate 2.
The mesoporous substrate in the above embodiments may be a mesoporous substrate of a catalyst material, for example, TiO2According to the prepared mesoporous substrate, only organic matters are added to the reaction substance 11 in the mesopores, the specific organic matters can be DBS or BDDAC, and similarly, under the condition of illumination, the organic matters in the mesopores such as DBS or BDDAC are TiO2By catalytic decomposition to release CO2A gap is formed between the base 1 and the flexible substrate 2, and finally the base 1 is separated from the flexible substrate 2.
In the above embodiment, the organic matter and the catalyst release the gas 13 under the illumination effect, and the gas is released uniformly, so that the internal stress generated when the base 1 is separated from the flexible substrate 2 is small, the flexible substrate 2 is not damaged, and after the base 1 is separated from the flexible substrate 2 and the preparation of the flexible panel is completed, the base 1 can be reused, which is beneficial to mass production and saves materials.
In another embodiment of the present invention, referring to fig. 8, which is a schematic diagram illustrating the separation of the base and the flexible substrate in which the reactive substance is a stretchable substance, the reactive substance 12 filled in the holes 11 of the base 1 may be a stretchable substance, and the stretchable substance is processed to shrink, so that a gap 14 is formed at the position of the holes 11 of the base 1 and the flexible substrate 2, and finally the base 1 and the flexible substrate 2 can be separated.
In this embodiment, the substrate 1 may be a mesoporous substrate, and the substrate 1 may be a commonly used glass substrate or a substrate made of other materials, which is not limited in this embodiment, and the stretchable substance may specifically be an electrostrictive substance, a magnetostrictive substance, or a photo-strictive substance.
When the telescopic substance is an electrostrictive substance, such as a substance formed by a binary and ternary solid solution material such as lead magnesiosilicate (PMN), lanthanum lead zirconate titanate (PLZT), lead zinc niobate (PZN) and the like, the electrostrictive substance can be contracted to generate uniform gaps when the electric field reaches a preset value by changing the electric field of the environment where the substrate 1 is located, so that the adhesive force between the substrate 1 and the flexible substrate 2 is greatly reduced, and the separation is easier; when the telescopic substance is a magnetostrictive substance, such as a substance formed by a Ni-Zn-Co ferrite magnetostrictive material, pure nickel, a nickel-cobalt alloy, an iron-nickel alloy, an iron-aluminum alloy, an iron-cobalt alloy and the like, the magnetostrictive substance can be contracted to generate a uniform gap when an electric field reaches a preset value by changing the magnetic field intensity of the environment where the substrate 1 is located, so that the substrate 1 is separated from the flexible substrate 2; when the telescopic substance is a photo-telescopic substance, such as a polarized lanthanum lead zirconate titanate (PLZT) material, by changing the light intensity of the environment where the substrate 1 is located, when the light intensity reaches a preset value, the photo-telescopic substance can be contracted to generate a uniform gap, so that the substrate 1 is separated from the flexible substrate 2.
In the embodiment, the holes of the base are filled with the telescopic substances, the telescopic substances can be contracted under certain conditions to form gaps between the base and the flexible substrate, the gaps are more in positions and are uniformly distributed, the adhesive force between the base and the flexible substrate can be greatly reduced, the base and the flexible substrate are easy to separate, the telescopic substances can be restored under other conditions, the base can be recycled, and materials are saved.
It is to be understood that the foregoing is merely illustrative of specific types of stretchable substances and is not to be construed as limiting the invention, as the stretchable substances may be stretchable substances of other materials and the invention is not limited thereto.
The embodiment of the invention also provides a flexible panel, which is prepared by adopting the method of any one of the embodiments.
The embodiment of the invention also provides a display device which comprises the flexible panel.
The embodiments in the present specification are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other. For the system embodiment, since it is basically similar to the method embodiment, the description is simple, and for the relevant points, refer to the partial description of the method embodiment.
While preferred embodiments of the present invention have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. Therefore, it is intended that the appended claims be interpreted as including preferred embodiments and all such alterations and modifications as fall within the scope of the embodiments of the invention.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention, and all the changes or substitutions should be covered within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (9)
1. A method of making a flexible panel, comprising:
providing a substrate, wherein holes are distributed on a first surface of the substrate;
filling a reaction substance in the hole;
forming a flexible substrate on the first surface of the base;
forming a display device layer on the flexible substrate;
treating the reaction substance to cause a chemical and/or physical change in the reaction substance, forming a gap between the first surface of the base and the flexible substrate;
the reaction substance comprises organic matters and a catalyst.
2. The method of claim 1, wherein the substrate is a substrate of a catalyst material and the reactant substance is organic.
3. The method of claim 1 or 2, wherein treating the reactive species to chemically and/or physically change the reactive species to form a gap between the first surface of the base and the flexible substrate comprises:
and illuminating the reaction substance to decompose the reaction substance to generate gas, and forming a gap between the first surface of the base and the flexible substrate.
4. The method of claim 1, wherein the reactive material is a retractable material.
5. The method of claim 4, wherein treating the reactive species to chemically and/or physically change the reactive species to form a gap between the first surface of the base and the flexible substrate comprises:
treating the stretchable substance to cause the stretchable substance to stretch, forming a gap between the first surface of the base and the flexible substrate.
6. The method of claim 4, wherein the stretchable substance is an electrostrictive or magnetostrictive or photo-stretchable substance.
7. The method of claim 1, wherein the substrate is a mesoporous substrate.
8. A flexible panel formed by the method of any one of claims 1 to 7.
9. A display device comprising the flexible panel of claim 8.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201711002040.XA CN107742618B (en) | 2017-10-24 | 2017-10-24 | Preparation method of flexible panel, flexible panel and display device |
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| CN201711002040.XA CN107742618B (en) | 2017-10-24 | 2017-10-24 | Preparation method of flexible panel, flexible panel and display device |
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| CN107742618B true CN107742618B (en) | 2020-07-03 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109037152B (en) * | 2018-08-09 | 2021-01-12 | 京东方科技集团股份有限公司 | Manufacturing method of flexible display panel, flexible display panel and display device |
| CN109216572B (en) * | 2018-09-17 | 2020-06-26 | 京东方科技集团股份有限公司 | Flexible composite film, preparation method thereof, flexible substrate and display device |
| CN110299466B (en) * | 2019-06-17 | 2022-06-14 | 纳晶科技股份有限公司 | Substrate and stripping method |
| CN110310914B (en) | 2019-07-04 | 2021-12-31 | 京东方科技集团股份有限公司 | Flexible device and manufacturing method thereof, and flexible device |
| CN111276637B (en) * | 2020-03-19 | 2023-08-25 | 合肥鑫晟光电科技有限公司 | Flexible display substrate, manufacturing method thereof and display device |
| CN112071796B (en) * | 2020-09-03 | 2023-06-02 | 深圳市华星光电半导体显示技术有限公司 | Flexible substrate, manufacturing method thereof and flexible display device |
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