CN109588016B - Data center and cooling system thereof - Google Patents
Data center and cooling system thereof Download PDFInfo
- Publication number
- CN109588016B CN109588016B CN201811594444.7A CN201811594444A CN109588016B CN 109588016 B CN109588016 B CN 109588016B CN 201811594444 A CN201811594444 A CN 201811594444A CN 109588016 B CN109588016 B CN 109588016B
- Authority
- CN
- China
- Prior art keywords
- cooling system
- liquid
- heat dissipation
- data center
- air
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20763—Liquid cooling without phase change
- H05K7/2079—Liquid cooling without phase change within rooms for removing heat from cabinets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20718—Forced ventilation of a gaseous coolant
- H05K7/20745—Forced ventilation of a gaseous coolant within rooms for removing heat from cabinets, e.g. by air conditioning device
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The embodiment of the invention discloses a heat dissipation system of a data center and the data center, wherein the data center is arranged in a machine room and comprises machine cabinets arranged in parallel in rows, and each machine cabinet comprises a plurality of processing chips and other hardware equipment; the heat dissipation system includes: a liquid cooling system and an air cooling system; the liquid cooling system is arranged in a liquid cooling system air conditioning room which is arranged at one side of the machine room and is used for liquid cooling heat dissipation of each processing chip in the cabinet; the air cooling system is arranged in an air conditioning room of the air cooling system, the air conditioning room of the air cooling system is arranged on the other side of the machine room, and the air cooling system is used for carrying out air cooling heat dissipation on other hardware equipment in the machine room. The technical scheme of the invention provides a data center-level heat dissipation system deployment scheme, and solves the problem that the data center-level heat dissipation system deployment scheme is not provided in the industry due to low industry maturity at present.
Description
Technical Field
The embodiment of the invention relates to the technical field of data center heat dissipation and cooling, in particular to a heat dissipation system of a data center and the data center.
Background
With the advent of the big data era, the scale of the data center is larger and larger, the heat productivity of the data center is increased, and a heat dissipation system needs to be deployed to ensure the normal operation of the data center.
The heat dissipation system of the traditional data center performs unit type planning and layout on a refrigerating unit-a precision air conditioner. However, with the deployment of high-performance processing chips, the power density of a single cabinet is continuously increased, the heat dissipation system of the conventional data center cannot meet the heat dissipation requirement of the data center gradually, and the liquid cooling system becomes the technical development direction of the infrastructure of the data center. The data center of the liquid cooling system directly leads the liquid cooling into the server, so that chip-level cooling is realized, a water chilling unit is not needed, and the integral energy efficiency of the data center can be improved.
However, due to low industry maturity, no data center level heat dissipation system deployment scheme is given in the industry at present.
Disclosure of Invention
The embodiment of the invention provides a data center and a heat dissipation system thereof, and provides a data center-level heat dissipation system deployment scheme.
In a first aspect, an embodiment of the present invention provides a heat dissipation system for a data center, where the data center is disposed in a computer room, and includes cabinets arranged in parallel in rows, and each of the cabinets includes a plurality of processing chips and other hardware devices; the heat dissipation system includes: a liquid cooling system and an air cooling system;
the liquid cooling system is arranged in a liquid cooling system air conditioning room which is arranged at one side of the machine room and is used for liquid cooling heat dissipation of each processing chip in the cabinet;
the air cooling system is arranged in an air conditioning room of the air cooling system, the air conditioning room of the air cooling system is arranged on the other side of the machine room, and the air cooling system is used for carrying out air cooling heat dissipation on other hardware equipment in the machine room.
In a second aspect, an embodiment of the present invention further provides a data center, where the data center uses the heat dissipation system of the data center provided in the first aspect to dissipate heat.
According to the heat dissipation system of the data center provided by the embodiment of the invention, the heat dissipation system of the data center comprises the liquid cooling system and the air cooling system, the liquid cooling system is arranged between the liquid cooling system air conditioners, the liquid cooling system air conditioners are arranged at one side of a machine room, and the liquid cooling system is used for carrying out liquid cooling heat dissipation on each processing chip in a cabinet; the air cooling system is arranged between the air conditioning rooms of the air cooling system, the air conditioning rooms of the air cooling system are arranged on the other side of the machine room, and the air cooling system is used for carrying out air cooling heat dissipation on other hardware equipment in the machine room, so that the data center-level heat dissipation system is provided, and the problem that a data center-level heat dissipation system deployment scheme is not provided in the industry due to low industry maturity at present is solved; from the perspective of scale deployment of the whole data center, the embodiment of the invention has the advantages that the machine room is arranged in the middle, the liquid cooling system air-conditioning room and the air cooling system air-conditioning room are respectively arranged at two sides of the machine room, the liquid cooling system is arranged in the liquid cooling air-conditioning room, and the air cooling system is arranged in the air cooling air-conditioning room, so that the liquid cooling system and the air cooling system can be respectively arranged in independent spaces, namely the liquid cooling system and the air cooling system are not mixed, and convenience is brought.
Drawings
Fig. 1 is a schematic structural diagram of a heat dissipation system of a data center in a first embodiment of the present invention.
Fig. 2 is a schematic structural diagram of a heat dissipation system of a data center in a second embodiment of the present invention.
Fig. 3 is a schematic diagram of a secondary side structure of the liquid cooling system of fig. 2.
Fig. 4 is a schematic diagram of a primary side structure of the liquid cooling system of fig. 2.
FIG. 5 is a flow diagram of the internal functional segments of the indirect evaporative cooling assembly of the air cooling system of FIG. 2.
Fig. 6 is a schematic diagram of the operation of the cross-flow heat exchanger of the indirect evaporative cooling unit of fig. 5.
Fig. 7 is a schematic structural diagram of a heat dissipation system of a data center in a third embodiment of the present invention.
Detailed Description
The embodiments of the present invention will be described in further detail with reference to the drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of and not restrictive on the broad invention. It should be further noted that, for convenience of description, only some structures, not all structures, relating to the embodiments of the present invention are shown in the drawings.
Example one
Fig. 1 is a schematic structural diagram of a heat dissipation system of a data center according to a first embodiment of the present invention, where the heat dissipation system provided in this embodiment can be used for dissipating heat of the data center. Referring to fig. 1, the data center is disposed in a computer room 00, and the data center includes racks 10 arranged in parallel in rows, each rack 10 including a plurality of processing chips (not shown in fig. 1) and other hardware devices; the heat dissipation system 20 of the data center includes: a liquid cooling system 201 and an air cooling system 202; the liquid cooling system 201 is arranged in the liquid cooling system air conditioning room 01, the liquid cooling system air conditioning room 01 is arranged at one side of the machine room 00, and the liquid cooling system 201 is used for performing liquid cooling heat dissipation on each processing chip 101 in the cabinet 10; the air cooling system 202 is arranged in the air cooling system air conditioning room 02, the air cooling system air conditioning room 02 is arranged on the other side of the machine room 00, and the air cooling system 202 is used for cooling and dissipating heat of other hardware equipment in the machine room 00 in an air cooling mode.
The Processing chip may be a Central Processing Unit (CPU) or a Graphics Processing Unit (GPU), and the other hardware devices in the cabinet 10 may include a hard disk, a memory, a north bridge on a motherboard, a south bridge (PCH) on the motherboard, and other components known to those skilled in the art.
The liquid cooling heat dissipation refers to heat removal through cold liquid circulation, and the air cooling heat dissipation refers to heat removal through air circulation. In this embodiment, the liquid cooling system 201 is used to perform liquid cooling heat dissipation on each processing chip with higher calorific value in the cabinet 10, and the air cooling system 202 is used to perform air cooling heat dissipation on other hardware devices with lower calorific value in the cabinet 10, so that the heat dissipation system 20 of the data center is beneficial to reducing the deployment cost and the operation cost of the heat dissipation system 20 of the data center while ensuring that the heat dissipation system 20 has a better heat dissipation effect on the processing chips and the other hardware devices.
In the machine room 00, a plurality of cabinets 10 are arranged in parallel in rows. By way of example, fig. 1 shows 8 rows of racks 10 arranged side by side, where each row of racks 10 includes 20 racks, but this is not a limitation of the present embodiment. In other embodiments, the number of the cabinets 10 in the machine room 00 and the arrangement manner of the cabinets 10 may be set according to actual requirements of the data center and the heat dissipation system 20 of the data center, which is not limited in this embodiment.
For example, the orientation shown in fig. 1 is taken as an example, the liquid cooling system air conditioning room 01 is disposed on the left side of the machine room 00, and the air cooling system air conditioning room 02 is disposed on the right side of the machine room 00, which is only one arrangement of the heat dissipation system 20 of the data center, and is not limited to this embodiment. In other embodiments, the liquid cooling system air conditioning room 01 and the air cooling system air conditioning room 02 may be disposed on other side surfaces of the machine room 00 (it is sufficient that the two are disposed on different side surfaces of the machine room 00) according to the actual requirement of the heat dissipation system 20 of the data center, which is not limited in this embodiment.
This embodiment provides a data center level cooling system deploys scheme, it is concrete, from data center scale deployment angle, be located the middle part through setting up computer lab 00, 01 between the liquid cooling system air conditioner and 02 between the air-cooling system air conditioner are located the both sides of computer lab 00 respectively, can set up 01 between the liquid cooling system air conditioner and 02 between the air-cooling system air conditioner alone, because the liquid cooling system sets up in 01 between the liquid cooling system air conditioner, the air-cooling system sets up in 02 between the air-cooling system air conditioner, thereby can make liquid cooling system and air-cooling system set up respectively in independent air conditioner, two systems do not mix promptly, the later stage fortune of being convenient for is maintained.
Example two
On the basis of the first embodiment, the present embodiment exemplarily shows a specific arrangement manner of the liquid cooling system and the air cooling system. Fig. 2 is a schematic structural diagram of a heat dissipation system of a data center according to a second embodiment of the present invention, fig. 3 is a schematic structural diagram of a secondary side of a liquid cooling system in fig. 2, and fig. 4 is a schematic structural diagram of a primary side of a liquid cooling system in fig. 2. Referring to fig. 2 to 4, in the heat dissipation system 20 of the data center, the liquid cooling system 201 includes: a cold plate 2011, cold liquid lines 2012, a cold liquid distribution unit 2013, and a dry chiller 2014; the cold liquid pipeline 2012 and the cold liquid distribution unit 2013 are arranged in the liquid cooling system air-conditioning room 01, and the dry cooler 2014 is arranged outside the liquid cooling system air-conditioning room 01; the cold plate 2011 is attached to the surface of the processing chip, and the cold plate 2011 is used for absorbing heat of the attached processing chip; the cold liquid pipeline 2012 is connected with each cold plate 2011, and the cold liquid pipeline 2012 is used for circulating the liquid in the cold plates 2011; the cold liquid distribution unit 2013 is connected with the cold liquid pipeline 2012, and the cold liquid distribution unit 2013 is used for distributing the liquid circulated to the cold plate 2011 through the cold liquid pipeline 2012; the dry cooler 2014 is connected with the pipelines in the cold liquid distribution unit 2013, and the dry cooler 2014 is used for cooling the liquid in the pipelines through the outdoor environment and circulating the cooled liquid to the pipelines of the liquid cold distribution unit 2013.
The cooling plate 2012 is closely attached to the processing chip and is used for carrying away heat generated during operation of the processing chip through liquid circulation in an internal pipeline of the cooling plate. For example, the cold plate 2012 may be attached to at least one of the top surface, the bottom surface, or the side surface of the processing chip, which is not limited in this embodiment.
The cold liquid pipeline 2012 is used for taking away the high-temperature liquid in the cold plate 2011 in a liquid circulation manner, and supplementing the low-temperature liquid, so as to continuously take away the heat generated by the processing chip.
It should be noted that, the material and the pipe diameter of the liquid cooling pipeline 2012 can be set according to the actual requirement of the heat dissipation system 20 of the data center, which is not limited in this embodiment.
The cold liquid Distribution Unit (i.e., cold source Distribution Unit, CDU)2013 may adjust the flow rate and flow velocity of the liquid entering each cold plate 2011, so as to facilitate control of the liquid circulating to each processing chip according to the actual operation condition of the processing chip in the cabinet 10, thereby achieving flexible Distribution of the liquid among the cold plates 2011. In this process, the heat exchange between the cold plate 2011 and the cold fluid distribution unit 2013 is equivalent to primary side heat exchange.
For example, when each processing chip in the cabinet 10 is all working, the cold liquid distribution unit 2013 may distribute the liquid entering each cold plate 2011, so as to facilitate uniform liquid distribution of each cold plate 2011, and thus facilitate uniform heat dissipation of each processing chip.
The dry cooler 2014, namely a dry cooler, does not consume water in the working process, and cools the liquid in the pipeline in a mode of circulating air outside the pipeline by means of the liquid in the pipeline, so that the temperature of the liquid in the pipeline is reduced, and the aim of cooling is fulfilled. In the process, the heat exchange between the dry cooler 2014 and the cold liquid distribution unit 2013 is equivalent to secondary side heat exchange.
The liquid cooling system of the embodiment adopts a design without a water chilling unit, and can avoid the problems of complex heat dissipation scheme and poor energy saving effect caused by the adoption of the water chilling unit, thereby facilitating simplification of the deployment scheme of the heat dissipation system 20 of the data center and reduction of energy consumption, and further facilitating optimization of Total Cost of Ownership (TCO) of the data center and the heat dissipation system of the data center to the utmost.
Optionally, with continued reference to fig. 2 and 3, the cold liquid line 2012 includes an inlet line 20121 and an outlet line 20122; inside the machine room 00, a first water collector 1021 and a second water collector 1022 are further disposed outside each cabinet 10, the first water collector 1021 includes a plurality of first valve ports, and the second water collector 1022 includes a plurality of second valve ports; the water inlet pipeline 20121 is connected with the water inlet of the cold plate 2011 through a first valve port; the water outlet pipe 20122 is connected with the water outlet of the cold plate 2011 through a second valve port.
So configured, the liquid in the cold plate 2011 may be discharged to the cold liquid distribution unit 2013 through the second valve port, the second water collector 1022 and the water outlet conduit 20122 in sequence; meanwhile, the liquid distributed by the cold liquid distribution unit 2013 can sequentially enter the cold plate 2011 through the water inlet pipeline 20121, the first water collector 1021 and the first valve port, so that the circulation of the liquid in the cold plate 2011 is realized, and the liquid cooling heat dissipation of the processing chip is realized. In addition, the complexity of the pipeline of the whole liquid cooling system 201 is low, so that the operation and maintenance difficulty is low, and the operation and maintenance cost is reduced.
Illustratively, with continued reference to FIG. 3, the first and second ports may each include a butterfly valve 302, a ball valve 303, a threaded connection 304, and a quick connector 305, each of which is a manual valve; the design of each valve is beneficial to the modularized arrangement of the whole liquid cooling system, on one hand, the modularized rapid deployment of the heat dissipation system 20 of the data center is facilitated, and the construction period and the construction cost are reduced; on the other hand, in the later maintenance process, the problem can be checked and maintained aiming at different modules, so that the later maintenance is facilitated, and the operation and maintenance cost is reduced. In addition, each of the first and second water collectors 1021 and 1022 may further include an exhaust valve 301 or other structures known to those skilled in the art, which is not limited in this embodiment.
Illustratively, with continued reference to fig. 2 and 4, the conduits in the cold liquid dispensing unit 2013 may also include a dispensing unit inlet conduit 20131 for flowing liquid into the cold plate 2011 and a dispensing unit outlet conduit 20132 for flowing liquid out of the cold plate 2011. The connection between the dry cooler 2014 and the lines in the cold liquid dispensing unit 2013 may also be modular in design with a plurality of valves. It should be noted that the type (or specification) of the valve may be any one or more specifications known to those skilled in the art, and the embodiment is not limited thereto. Of course, besides a plurality of valves for modular design, a pipeline check valve, an electric butterfly valve, a Y-type filter or other structures known to those skilled in the art may be disposed on the pipeline between the dry cooler 2014 and the cold liquid distribution unit 2013, which is not limited in this embodiment.
It should be noted that the specifications and functions of the structures shown in fig. 3 and fig. 4 (where "the structures" may include the valves and the Y-filter) may be those known to those skilled in the art, and the embodiments of the present invention are not described in detail and are not limited thereto.
Optionally, the number of cold liquid distribution units 2013 is at least two (for example, 2 cold liquid distribution units 2013 are shown in fig. 3) and the number of dry coolers 2014 is at least four (for example, 4 dry coolers 2014 are shown in fig. 4) in consideration of the economy and reliability of the data center and the heat dissipation system 20 of the data center.
At least one standby cold liquid distribution unit is arranged in the plurality of cold liquid distribution units 2013, and at least one standby dry cooler is arranged in the plurality of dry coolers 2014.
The standby cold liquid distribution unit and the standby dry cooler are both started when the heat production amount of the data center is large, so that the heat dissipation system 20 of the data center is applicable to the data centers of different scales, and the heat dissipation system 20 of the data center is flexibly applicable to different working states of the same data center, so that the heat dissipation system 20 of the data center can be flexibly applied on the premise of meeting the heat dissipation requirement of the data center.
For example, the cold liquid distribution units 2013 may be of a single module "1 + 1" design, i.e., 1 spare cold liquid distribution unit is provided in 2 cold liquid distribution units 2013; the dry chiller 2014 may be a centralized "3 + 1" design, i.e., 4 dry chillers 2014 with 1 spare dry chiller.
It should be noted that this is merely an exemplary illustration of the heat dissipation system 20 of the data center, and does not constitute a limitation of the heat dissipation system 20 of the data center in this embodiment. In other embodiments, the number and design manner of the cold liquid distribution units 2013 and the number and design manner of the dry coolers 2014 may be set according to the actual requirement of the heat dissipation system 20 of the data center, which is not limited by the embodiment.
Optionally, with continued reference to fig. 2, a ventilation channel 001 is further disposed in the machine room 00; the air cooling system 202 is used for cooling and dissipating heat of other hardware devices in the machine room 00 through the ventilation channel 001.
Wherein, ventilation channel 001 can take away the hot-air in the computer lab 00, and the cold air is advanced in the replenishment simultaneously to realize carrying out the process of forced air cooling heat dissipation to other hardware equipment that contact with the air in the computer lab 00.
In the following, the air cooling system 202 including the indirect evaporative cooling unit is taken as an example to illustrate the air cooling heat dissipation process and principle.
Optionally, with continued reference to fig. 2, the air-cooled system 202 includes an indirect evaporative cooling unit; the indirect evaporative cooling unit is arranged in the air-conditioning room 02 of the air-cooling system and is communicated with the ventilation channel 001; the indirect evaporative cooling unit is used for performing air cooling heat dissipation on other hardware equipment in the machine room 00 through the ventilation channel 002.
The air cooling system 202 comprises an indirect evaporative cooling unit, so that the air cooling system 202 can realize a water-free unit design, and the arrangement scheme of the heat dissipation system 20 of the data center can be simplified by combining the water-free unit design scheme of the liquid cooling system, and meanwhile, the energy consumption is favorably reduced.
Illustratively, FIG. 5 is a flow diagram of internal functional segments of an indirect evaporative cooling unit of the air-cooled system of FIG. 2. Referring to fig. 5, the functional segments are: an external circulation air valve section 401, an external circulation primary filter section 402, an external circulation fan section 403, a cross flow heat exchanger section 404, an internal circulation fan section 405, an internal circulation air supply valve section 406, an internal circulation return air valve section 407 and an internal circulation primary filter section 408. Therefore, circulation of cold air and hot air is achieved, and air cooling and heat dissipation of other hardware devices in the machine room 00 are achieved.
Illustratively, FIG. 6 is a schematic diagram of the operation of the cross-flow heat exchanger of the indirect evaporative cooling unit of FIG. 5. Referring to fig. 6, there are two air streams in the brief evaporative cooling process, with the orientation shown in fig. 6 as an example, the transverse air stream being referred to as primary air and the longitudinal air stream being referred to as secondary air; the secondary air flowing through the heat exchange surface is sprayed by circulating water, a layer of water film is formed on the heat exchange surface due to spraying, and the evaporation of water not only absorbs the heat of the water film, but also absorbs the heat of a layer of air, so that the primary air is cooled.
It should be noted that fig. 6 only illustrates the operation principle of an indirect evaporative cooling unit, but does not limit the indirect evaporative cooling unit in the heat dissipation system 20 of the data center provided by the embodiment of the present invention. In other embodiments, an indirect evaporative cooling unit may be arranged to operate according to an actual requirement of the heat dissipation system 20 of the data center by using other operating principles, which is not limited in this embodiment.
Optionally, the indirect evaporative cooling unit includes at least five indirect evaporative coolers 2021 (illustratively, 5 indirect evaporative coolers 2021 are shown in fig. 2) in view of the economy and reliability of the data center and the heat dissipation system 20 of the data center.
The plurality of indirect evaporative coolers 2021 are provided with at least one standby indirect evaporative cooler, and the standby indirect evaporative cooler can be started when the heat generation amount of the data center is large, so that the heat dissipation system of the data center can be suitable for the data centers of different scales, and the heat dissipation system of the data center can be flexibly suitable for different working states of the same data center, thereby being capable of realizing flexible application of the heat dissipation system of the data center on the premise of meeting the heat dissipation requirement of the data center.
As an example, indirect evaporative cooler 2021 may be of a "4 + 1" design, i.e., 1 backup indirect evaporative cooler is provided in 5 indirect evaporative coolers 2021.
It should be noted that this is merely an exemplary illustration of the heat dissipation system of the data center, and does not constitute a limitation of the heat dissipation system of the data center in this embodiment. In other embodiments, the number and design manner of the indirect evaporative coolers 2021 may be set according to the actual requirements of the heat dissipation system of the data center, which is not limited in this embodiment.
EXAMPLE III
Fig. 7 is a schematic structural diagram of a heat dissipation system of a data center in a third embodiment of the present invention, and on the basis of the foregoing embodiments, this embodiment exemplarily shows an arrangement manner of the heat dissipation system when the data center includes a plurality of computer rooms. Referring to fig. 7, if the data center includes a plurality of machine rooms 00 (for example, 2 machine rooms 00 are shown in fig. 7), the liquid cooling systems of two machine rooms 00 disposed adjacent to each other are disposed in the same liquid-cooled air-conditioning room 01 and located between the two machine rooms 00.
So set up, can concentrate on the liquid cooling system air conditioner room 01 outer dry cold ware 2014 continuous with the cold liquid distribution unit 2013 of the liquid cooling system 201 of two adjacent computer rooms 00 to be convenient for simplify the design degree of difficulty of whole liquid cooling system, be favorable to reducing the fortune dimension degree of difficulty simultaneously, thereby reduce fortune dimension cost.
Example four
The embodiment provides a data center, which can adopt any one of the heat dissipation systems of the data center provided in the above embodiments to dissipate heat, so that the rapid deployment and the modular construction of the data center are facilitated, the construction period of the data center and the heat dissipation system is short, the initial investment cost and the operation and maintenance cost (power consumption, consumable items and the like) are low, and the TCO of the data center can be optimized to the utmost.
It is to be noted that the foregoing is only illustrative of the preferred embodiments of the present invention and the technical principles employed. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail by the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the spirit of the present invention, and the scope of the present invention is determined by the scope of the appended claims.
Claims (9)
1. A heat dissipation system of a data center is arranged in a machine room and comprises cabinets arranged in parallel in rows, wherein each cabinet comprises a plurality of processing chips and other hardware equipment; characterized in that, the cooling system includes: a liquid cooling system and an air cooling system;
the liquid cooling system is designed without a water chilling unit and is arranged in a liquid cooling system air conditioning room, the liquid cooling system air conditioning room is arranged on one side of the machine room, and the liquid cooling system is used for carrying out liquid cooling heat dissipation on each processing chip in the cabinet;
the air cooling system is arranged in an air conditioning room of the air cooling system, the air conditioning room of the air cooling system is arranged on the other side of the machine room, and the air cooling system is used for carrying out air cooling heat dissipation on other hardware equipment in the machine room; the air cooling system and the liquid cooling system operate independently; a ventilation channel is further arranged in the machine room, the ventilation channel is adjacent to an air conditioning room of the air cooling system and is communicated with the indirect evaporative cooling unit, and a cold liquid pipeline is not arranged in the ventilation channel;
the liquid cooling system comprises a cold liquid distribution unit and a dry cooler, the dry cooler is arranged outdoors in the air conditioning room of the liquid cooling system and is connected with a pipeline in the cold liquid distribution unit, and the dry cooler is used for cooling liquid in the pipeline through the outdoor environment and then circulating the cooled liquid to the pipeline of the cold liquid distribution unit; the liquid cooling system comprises a cold liquid pipeline, and the cold liquid pipeline comprises a water inlet pipeline and a water outlet pipeline; in the machine room, a first water collector and a second water collector are arranged outside each cabinet, the first water collector comprises a plurality of first valve ports, and the second water collector comprises a plurality of second valve ports; the first valve port and the second valve port respectively comprise a butterfly valve, a ball valve, a screw thread connection and a quick joint;
the number of the machine rooms is one or more, when the number of the machine rooms is multiple, the liquid cooling systems of the two machine rooms which are adjacently arranged are arranged in the same liquid cooling system air-conditioning room and are positioned between the two machine rooms.
2. The heat dissipation system of the data center of claim 1, wherein the liquid cooling system comprises a cold plate; the cold liquid pipeline and the cold liquid distribution unit are arranged in the liquid cooling system air conditioning room;
the cold plate is attached to the surface of the processing chip and used for absorbing heat of the attached processing chip;
the cold liquid pipeline is respectively connected with each cold plate and is used for circulating the liquid in the cold plates;
the cold liquid distribution unit is connected with the cold liquid pipeline and is used for distributing the liquid circulated to the cold plate through the cold liquid pipeline.
3. The heat dissipation system of the data center according to claim 2, wherein the water inlet line is connected to the water inlet of the cold plate via the first valve port; the water outlet pipeline is connected with the water outlet of the cold plate through the second valve port.
4. The heat dissipation system of the data center according to claim 2, wherein the number of the cold liquid distribution units is at least two, and the number of the dry coolers is at least four.
5. The heat dissipation system of the data center of claim 4, wherein at least one backup cold liquid distribution unit is provided in the plurality of cold liquid distribution units and at least one backup dry cooler is provided in the plurality of dry coolers.
6. The heat dissipation system of the data center according to claim 1, wherein the air cooling system is configured to cool the other hardware devices in the machine room by air through the ventilation channel.
7. The heat dissipation system of the data center of claim 6, wherein the air-cooled system comprises an indirect evaporative cooling unit;
the indirect evaporative cooling unit is arranged in the air-conditioning room of the air-cooling system and is communicated with the ventilation channel;
the indirect evaporative cooling unit is used for carrying out air cooling heat dissipation on the other hardware equipment in the machine room through the ventilation channel.
8. The heat dissipation system of the data center of claim 7, wherein the indirect evaporative cooling unit comprises at least five indirect evaporative coolers.
9. A data center, characterized in that the data center employs the heat dissipation system of the data center according to any one of claims 1 to 8 for heat dissipation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811594444.7A CN109588016B (en) | 2018-12-25 | 2018-12-25 | Data center and cooling system thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811594444.7A CN109588016B (en) | 2018-12-25 | 2018-12-25 | Data center and cooling system thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109588016A CN109588016A (en) | 2019-04-05 |
| CN109588016B true CN109588016B (en) | 2020-12-15 |
Family
ID=65931828
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811594444.7A Active CN109588016B (en) | 2018-12-25 | 2018-12-25 | Data center and cooling system thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109588016B (en) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110662395A (en) * | 2019-09-16 | 2020-01-07 | 无锡江南计算技术研究所 | Machine storehouse level flow adjustable mixing pipeline system |
| CN111295080A (en) * | 2020-02-23 | 2020-06-16 | 苏州浪潮智能科技有限公司 | High-performance calculation data center loop system |
| CN112203481A (en) * | 2020-10-30 | 2021-01-08 | 上海德衡数据科技有限公司 | Container module prefabricated data center |
| CN113573545B (en) * | 2021-06-25 | 2024-03-26 | 华为数字能源技术有限公司 | Refrigerating system and data center |
| CN113677159B (en) * | 2021-08-23 | 2023-09-19 | 联想长风科技(北京)有限公司 | Water-cooling and air-cooling compatible heat dissipation device |
| CN113703309B (en) * | 2021-08-31 | 2024-02-06 | 北京无线电测量研究所 | Personnel and equipment mixing cabin with high-integration environmental control system |
| CN115334829B (en) * | 2022-07-07 | 2023-11-14 | 苏州浪潮智能科技有限公司 | Low-carbon data center and operation method thereof |
| CN115334847B (en) * | 2022-08-31 | 2024-01-19 | 苏州浪潮智能科技有限公司 | Liquid cooling data center secondary side pipeline system |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105120637A (en) * | 2015-09-15 | 2015-12-02 | 西安工程大学 | Evaporative-cooling, water-cooling and air-cooling composite cooling system for data center |
| CN105517405A (en) * | 2014-09-22 | 2016-04-20 | 广东申菱环境系统股份有限公司 | Control method of heat pipe internal circulation type server cabinet heat dissipation system |
| CN105682429A (en) * | 2016-03-31 | 2016-06-15 | 华为技术有限公司 | Data center air conditioner equipment chilled water distribution device |
| CN107182191A (en) * | 2017-07-20 | 2017-09-19 | 四川斯普信信息技术有限公司 | It is a kind of to realize the system radiated to cpu chip and server simultaneously |
| CN107940643A (en) * | 2017-11-24 | 2018-04-20 | 北京百度网讯科技有限公司 | Cooling system for data center |
| CN107960049A (en) * | 2017-12-29 | 2018-04-24 | 华南理工大学 | The Intelligent server cabinet and its control method that a kind of liquid is cold, wind-cooling heat dissipating combines |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9670689B2 (en) * | 2010-04-06 | 2017-06-06 | Schneider Electric It Corporation | Container based data center solutions |
| US8913384B2 (en) * | 2012-06-20 | 2014-12-16 | International Business Machines Corporation | Thermal transfer structures coupling electronics card(s) to coolant-cooled structure(s) |
| CN203797865U (en) * | 2014-05-08 | 2014-08-27 | 北京捷通机房设备工程有限公司 | Adiabatic evaporation indirect heat exchange air-side natural cooling system of data center |
-
2018
- 2018-12-25 CN CN201811594444.7A patent/CN109588016B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105517405A (en) * | 2014-09-22 | 2016-04-20 | 广东申菱环境系统股份有限公司 | Control method of heat pipe internal circulation type server cabinet heat dissipation system |
| CN105120637A (en) * | 2015-09-15 | 2015-12-02 | 西安工程大学 | Evaporative-cooling, water-cooling and air-cooling composite cooling system for data center |
| CN105682429A (en) * | 2016-03-31 | 2016-06-15 | 华为技术有限公司 | Data center air conditioner equipment chilled water distribution device |
| CN107182191A (en) * | 2017-07-20 | 2017-09-19 | 四川斯普信信息技术有限公司 | It is a kind of to realize the system radiated to cpu chip and server simultaneously |
| CN107940643A (en) * | 2017-11-24 | 2018-04-20 | 北京百度网讯科技有限公司 | Cooling system for data center |
| CN107960049A (en) * | 2017-12-29 | 2018-04-24 | 华南理工大学 | The Intelligent server cabinet and its control method that a kind of liquid is cold, wind-cooling heat dissipating combines |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109588016A (en) | 2019-04-05 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN109588016B (en) | Data center and cooling system thereof | |
| CN110446396B (en) | Liquid cooling system for data center | |
| CN108012513B (en) | Data center without inter-row air conditioner and heat dissipation system thereof | |
| WO2023124976A1 (en) | Data center cooling system and data center | |
| US20190343026A1 (en) | Liquid cooling system for cabinet server | |
| US11291136B2 (en) | Liquid-cooled cold plate device | |
| US11252844B2 (en) | Liquid distribution for electronic racks | |
| CN110351986B (en) | Partition internal cooling type cabinet heat dissipation system with composite cold source | |
| US10966353B2 (en) | Centralized cooling system for data center | |
| US20100275618A1 (en) | System and method for cooling fluid distribution | |
| WO2024037386A1 (en) | Cooling system | |
| CN202033707U (en) | Container type data system | |
| CN216626506U (en) | Data center cooling system and data center | |
| TWI487473B (en) | Cooling system for date center | |
| CN206895121U (en) | It is a kind of to realize the system to be radiated to cpu chip and server simultaneously | |
| CN113727574A (en) | Electronic rack cooling system based on high elasticity deployment | |
| CN112492841A (en) | Low-energy-consumption data center water cooling system | |
| CN107801362B (en) | Cooling system for data center | |
| CN113271747B (en) | Liquid cooling system of data center and data center | |
| CN213586803U (en) | Cooling system for data center | |
| CN212227305U (en) | Indirect evaporative cooling unit and data center machine room | |
| CN202734073U (en) | Overhead separating type heat pipe heat exchanger | |
| CN214676297U (en) | Cooling system | |
| CN220674184U (en) | Modularized data center with wind-liquid fusion function | |
| CN210900098U (en) | Heat pipe backboard air conditioning system |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |