CN109545450B - Flexible lead, preparation method of flexible electronic device and flexible wireless energy supply device - Google Patents
Flexible lead, preparation method of flexible electronic device and flexible wireless energy supply device Download PDFInfo
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- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
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- H—ELECTRICITY
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- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
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- H—ELECTRICITY
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- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/50—Structural association of antennas with earthing switches, lead-in devices or lightning protectors
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- H01Q21/00—Antenna arrays or systems
- H01Q21/0006—Particular feeding systems
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J50/00—Circuit arrangements or systems for wireless supply or distribution of electric power
- H02J50/20—Circuit arrangements or systems for wireless supply or distribution of electric power using microwaves or radio frequency waves
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Abstract
The disclosure provides a flexible lead, a preparation method of a flexible electronic device and a flexible wireless energy supply device. The preparation method comprises the following steps: providing a base material formed by combining a rigid substrate, a sacrificial layer and a functional film; cutting the functional film of the substrate by femtosecond laser to form a planar wire structure on the functional film; removing the sacrificial layer, thereby separating the planar conductor structure from the rigid substrate; the planar wire structure is formed into a two-dimensional flexible wire; or assembling the planar conductor structure to a pre-stretched flexible substrate, releasing the pre-strain of the flexible substrate, and buckling and assembling the planar conductor structure into the three-dimensional flexible conductor. The preparation method can prepare the flexible conducting wire in a high-precision and large-scale mode without being limited by patterns, has the unique advantages of rapidness, environmental protection, low price, high resource utilization rate and insensitivity to external environment, and is suitable for preparing flexible conducting wires of two-dimensional and three-dimensional types.
Description
Technical Field
The disclosure relates to the technical field of electronics, and in particular relates to a flexible lead, a preparation method of a flexible electronic device and a flexible wireless energy supply device.
Background
In recent years, in order to meet the requirement of people for flexibility of electronic devices, flexible electronic technology has been rapidly developed, and various types of flexible electronic devices, such as flexible sensors, flexible display screens, artificial electronic skins, and various wearable electronic products, are emerging. Among them, wearable electronic devices for health monitoring and medical treatment have already been in the trillion-level market.
Wearable electronic equipment can laminate the biological characteristics of the soft curved surface of human skin, carries out more accurate and continuous monitoring to human physiology signal. One major class of wearable electronic devices is inorganic flexible electronics, which combine traditional high performance electronic materials such as silicon with flexible substrates to take into account both performance and flexibility.
The inorganic flexible device mainly adopts an island bridge type structure, functional parts such as fragile silicon and the like are placed on an 'island' with smaller strain, and the 'island' array is interconnected through a flexible lead serving as a 'bridge', so that the functional integration is realized. In addition, in the field of wearable electronic devices, flexible wires are also often used as functional elements of flexible displays, such as temperature sensors and strain sensors, and the changes of temperature and strain are monitored by measuring the changes of resistance of the flexible wires.
The design and preparation of the flexible lead are one of the keys of the inorganic flexible electronic device, and the design and preparation need to ensure the normal operation of the circuit and have larger ductility.
At present, the preparation method of the flexible lead mainly adopts the traditional planar microelectronic photoetching process, and the process can be used for preparing planar structures in a large scale, has higher precision and can conveniently realize the patterning of microstructures. The conventional photolithography technique uses ultraviolet light having a wavelength of 200nm to 450nm as a light source, and uses a photoresist as an intermediate medium to realize pattern conversion, transfer and processing, and finally transfers image information to a substrate. The general exposure flow comprises eight basic steps of surface treatment and pre-baking, spin coating, pre-baking, alignment, exposure, post-baking, development, film hardening and image detection.
The above photolithographic preparation method has the following disadvantages:
firstly, a special photoetching machine and a clean room are needed, the process is complicated, the requirement on experimental conditions is high, the experimental preparation is difficult and time-consuming, the experimental result is sensitive to the influence of the external environment in photoetching, and a plurality of environmental parameters need to be controlled;
secondly, the preparation process is a chemical treatment process and relates to dangerous chemical reagents such as acetone, photoresist, hydrofluoric acid and the like, and waste liquid needs special treatment and pollutes the natural environment;
thirdly, a special mask needs to be additionally prepared in the photoetching process, and the pattern corresponding to each flexible lead needs to be prepared, so that the price is high and the utilization rate is low.
Disclosure of Invention
The invention aims to provide a preparation method of a flexible lead and a flexible electronic device, which not only has the advantages of high precision, large scale, no pattern limitation and the like of the traditional photoetching process, but also has the unique advantages of rapidness, environmental protection, low price, high resource utilization rate and insensitivity to the external environment. It is also an object of the present disclosure to provide a flexible wireless power supply device.
In order to achieve the above object, the present disclosure provides a method for manufacturing a flexible wire, which is used for manufacturing a two-dimensional flexible wire or a three-dimensional flexible wire, and includes the following steps:
the preparation method comprises the following steps:
providing a base material formed by combining a rigid substrate, a sacrificial layer and a functional film, wherein the functional film is combined with the rigid substrate through the sacrificial layer;
the preparation method comprises the following steps:
cutting the functional film of the substrate by femtosecond laser so as to form a planar wire structure on the functional film;
removing the sacrificial layer, thereby separating the planar wire structure from the rigid substrate;
the planar wire structure is formed as the two-dimensional flexible wire; or assembling the planar lead structure to a pre-stretched flexible substrate, releasing the pre-strain of the flexible substrate, and buckling and assembling the planar lead structure into the three-dimensional flexible lead.
Preferably, the planar conductor structure has a fixing area for assembling to the flexible substrate, and in the preparing step, several planar conductor structures are assembled to the flexible substrate, and the fixing areas of adjacent planar conductor structures are connected to form several planar conductor structures connected together.
Preferably, a predetermined region of the flexible substrate is surface-treated to make the predetermined region of the flexible substrate sticky before assembling the planar conductor structure to the flexible substrate.
Preferably, the surface treatment mode of the flexible substrate comprises one or more of the following modes:
plasma treatment, ozone surface irradiation, and surfactant treatment.
Preferably, the planar wire structure has a fixing area for assembling to the flexible substrate, and the planar wire structure is subjected to a surface treatment, i.e. silicon dioxide is deposited on the fixing area, before assembling to the flexible substrate.
Preferably, the planar wire structure is placed in a magnetron sputtering cavity for sputtering silicon dioxide.
Preferably, before the surface treatment is performed on the planar conducting wire structure, a mask plate covers the planar conducting wire structure, and the mask plate covers the planar conducting wire structure outside the fixed area.
Preferably, after the surface treatment of the flexible substrate and the planar conductor structure, the planar conductor structure is bonded to the flexible substrate and the bonded assembly is heated.
Preferably, in the preparing step, the rigid substrate is cleaved into a plurality of secondary parts, and the secondary parts are stuck to a glass member; in the preparing step, the secondary portion is patterned.
Preferably, the sacrificial layer is formed by spin coating a glue that can be dissolved by a solvent on the rigid substrate.
Preferably, the sacrificial layer is formed by polymethyl methacrylate, and the solvent comprises one or more of the following components:
acetone, ethanol, dichloromethane and anisole.
Preferably, the functional film has buffer layer and functional layer that combine together, the functional film passes through the buffer layer combines with first protective layer, first protective layer with the sacrificial layer combines, first protective layer adopts polyimide to form, the buffer layer adopts chromium to form, the functional layer adopts gold to form.
Preferably, the functional film is combined with a second protective layer through the functional layer, and the second protective layer is formed of polyimide.
Preferably, the preparing step further comprises:
designing the planar conducting wire structure;
calculating the elastic deformation of the flexible lead formed by the planar lead structure in the stretching deformation through simulation software;
optimizing the planar wire structure according to the elastic deformation;
inputting the optimized processing information of the planar wire structure into a femtosecond laser device.
Preferably, the planar conductor structure is assembled to the flexible substrate by a transfer technique.
The present disclosure also provides a method for manufacturing a flexible electronic device, which includes the steps of any one of the above technical solutions, and the method for manufacturing a flexible electronic device further includes:
and connecting the two-dimensional flexible lead or the three-dimensional flexible lead with a functional component.
The present disclosure also provides a flexible wireless energy supply device, including coil and functional block, the functional block includes energy consumption part, wireless energy receiving component and the connecting wire of connecting the two, the functional block is located the center of coil, the connecting wire is three-dimensional flexible wire and has the spiral shape, flexible wireless energy supply device still include by the array that three-dimensional flexible wire formed arranges according to returning the font, the array forms wireless energy receiving component, the connecting wire connects energy consumption part with wireless energy receiving component forms the return circuit.
The technical scheme provided by the disclosure has the following beneficial effects:
the method can prepare the flexible conducting wire with high precision and large scale without being limited by patterns, has the unique advantages of rapidness, environmental protection, low price, high resource utilization rate and insensitivity to external environment, and is suitable for preparing flexible conducting wires of various types of two-dimensional and three-dimensional.
Drawings
Fig. 1 shows an example of a two-dimensional flexible wire manufactured using the method of manufacturing a flexible wire provided by the present disclosure, the flexible wire being arranged in a serpentine shape;
fig. 2 shows yet another embodiment of a two-dimensional flexible wire prepared using the method of preparing a flexible wire provided by the present disclosure, the flexible wire arranged in a split serpentine shape;
fig. 3 is a partial enlarged view of an experimental diagram of one embodiment of a three-dimensional flexible lead manufactured using a method of manufacturing a flexible lead provided by the present disclosure;
fig. 4 is a schematic view of a flexible lead manufactured by applying the method for manufacturing a flexible lead according to the present disclosure;
fig. 5 is a plan design view of an embodiment of a flexible wireless power supply device manufactured by applying the method for manufacturing a flexible lead and a flexible electronic device provided by the present disclosure.
Description of reference numerals:
10 sticking area
11 common connection location
12 reinforced connection location
13 position of joint
20 buckling deformation area
30 non-adhesive area
100 three-dimensional flexible wire array
200 capacitor
30 0LED
Detailed Description
Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated. The implementations described in the exemplary embodiments below are not intended to represent all implementations consistent with the present disclosure. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the present disclosure, as detailed in the appended claims.
The present disclosure provides a flexible wire, a method for manufacturing a flexible electronic device, and a flexible electronic device, wherein the flexible wire has a greater ductility while ensuring normal operation of a circuit.
The flexible wire has two applications: first, it is used as a connecting wire in a line for connecting functional components such as LED, capacitor, etc.; second, for forming functional elements in electronic devices, such as in temperature sensors or strain sensors, temperature changes or strain changes are monitored by measuring changes in the resistance of flexible wires.
The flexible wire may be a two-dimensional flexible wire having a planar structure as shown in fig. 1 and 2 or a three-dimensional flexible wire having a three-dimensional structure as shown in fig. 3.
When the two-dimensional flexible lead is prepared, the preparation method comprises a preparation step and a preparation step.
In the preparation step, a base material is provided, and the base material is formed by combining the rigid substrate, the sacrificial layer and the functional film.
In the preparation steps:
cutting the functional film of the substrate by femtosecond laser to realize wire patterning so that the functional film is formed with a planar wire structure;
removing the sacrificial layer, thereby separating the planar conductor structure from the rigid substrate;
the planar wire structure is formed as a two-dimensional flexible wire.
As shown in fig. 1 and 2, the planar wire structure of the two-dimensional flexible wire may have a fixed region and a non-fixed region. The fixed area may be fixed to the flexible substrate by means of pasting, such that the fixed area is formed as the pasting area 10 and the non-fixed area is formed as the non-pasting area 30. When the two-dimensional flexible wire is used in an application requiring stretch deformation, the non-bonded region 30 is deformed to form a flexible wire having large ductility. Two-dimensional flexible wires may be connected to the functional components on the flexible substrate to form a flexible electronic device.
It should be understood that the pasting mode is a specific implementation mode of fixing the two-dimensional flexible lead and the flexible substrate, and other modes can also be adopted for fixing.
When stretched, the flexible substrate with the two-dimensional flexible wires deforms, such that the two-dimensional flexible wires can form a line on the deformable object, such as can be used in a wearable device to form a line on human skin.
Of course, the planar conductor structure can also be connected directly to the functional component after separation from the rigid substrate to form a flexible electronic device.
Fig. 1 and 2 show a planar lead structure of two-dimensional flexible leads of different types, respectively, and in the case where the length of the lead needs to be extended, the paste areas 10 of a plurality of planar lead structures may be connected to form a two-dimensional flexible lead having a plurality of connected planar lead structures.
When the three-dimensional flexible lead is prepared, the preparation method comprises a preparation step and a preparation step.
In the preparation step, a sacrificial layer is prepared on a rigid substrate, and a functional thin film for forming a three-dimensional flexible wire and bonded to the rigid substrate through the sacrificial layer is prepared on the sacrificial layer.
In the preparation steps:
cutting the functional film by femtosecond laser to realize wire patterning so that the functional film forms a planar wire structure;
removing the sacrificial layer, thereby separating the planar conductor structure from the rigid substrate;
the planar wire structure is assembled to the pre-stretched flexible substrate;
and releasing the prestrain of the flexible substrate, and buckling and assembling the planar lead structure into a three-dimensional flexible lead.
As shown in fig. 5, the planar wire structure of the three-dimensional flexible wire may have a fixing region and a buckling deformation region 20, and the fixing region may be fixed to the flexible substrate by means of pasting, so that the fixing region is formed as a pasting region 10. The buckling deformation region 20 is capable of buckling deformation and mechanically assembled into a three-dimensional structure. When the three-dimensional flexible wire is used in a situation where tensile deformation is required, the three-dimensional structure formed by the buckling deformation region 20 is deformed to form a flexible wire of large ductility. Three-dimensional flexible wires may be connected to functional components on a flexible substrate to form a flexible electronic device.
It should be understood that the pasting mode is a specific implementation mode of fixing the planar conductor structure of the three-dimensional flexible conductor and the flexible substrate, and other modes can also be adopted for fixing.
Fig. 3 shows an array of three-dimensional flexible wires, adjacent wire segments in the array (one wire segment being mechanically assembled by a planar wire structure) being connected by a mutual adhesive area 10, several wire segments being connected to form the array. Where more arrays are desired, multiple arrays of adhesive regions 10 may also be connected to form a three-dimensional flexible conductor having multiple arrays connected together. Of course, the three-dimensional flexible wires may be connected in a straight line shape or a serpentine shape, instead of forming a zigzag array. Then, where it is desired to extend the length of the conductor, the attachment areas 10 of the plurality of conductor segments are connected to form a three-dimensional flexible conductor having a plurality of successive conductor segments.
The length of the wire can be adjusted by connecting the adhesive areas 10 of different wire sections, regardless of the shape of the two-dimensional flexible wire and the three-dimensional flexible wire.
The adhesive area 10 can be used both for attachment to a flexible substrate and as a tab for extending the length of a wire.
In the preparation step, the buckling deformation region 20 mechanically buckles when the pre-strain of the flexible substrate is released, so that the planar conductor structure self-assembles into a three-dimensional flexible conductor. Furthermore, the three-dimensional flexible lead is connected with the functional assembly on the flexible substrate to form the flexible electronic device.
The three-dimensional flexible wires formed on the flexible substrate can also form a line on a deformable object, for example, can be used in a wearable device to form a line on human skin.
In the preparation step, the rigid substrate may also be cleaved into several secondary parts and the secondary parts are attached to a uniform specification of glass pieces. In the preparation step, the glass piece with the secondary part of the rigid substrate is clamped with a gripper, so that the individual secondary parts are patterned on the glass piece.
Therefore, the material of the rigid substrate is saved, and the cost for manufacturing the flexible lead is reduced.
In addition, in the preparation step, a planar lead structure of a two-dimensional flexible lead or a three-dimensional flexible lead can be designed and optimized (optimized by finite element simulation), that is, elastic deformation of the flexible lead formed by the planar lead structure in stretching deformation is calculated by simulation software, whether the elastic deformation is in a preset elastic deformation range is judged, if so, processing information (such as shape and size) of the planar lead structure is input into femtosecond laser equipment, if not, the planar lead structure is optimized, and after the optimization is finished, whether the elastic deformation of the flexible lead is in the preset elastic deformation range is judged again; after iterative optimization, when the elastic deformation of the flexible lead is in a preset elastic deformation range, the processing information (such as shape and size) of the optimized planar lead structure is input into a femtosecond laser device.
In this way, when the wire patterning is performed using the femtosecond laser, the planar wire structure cut by the femtosecond laser can form a two-dimensional flexible wire or a three-dimensional flexible wire having a large ductility. For example, a serpentine two-dimensional flexible wire as shown in FIGS. 1 and 2 and a profiled serpentine two-dimensional flexible wire, such as a helical three-dimensional flexible wire as shown in FIG. 3
It should be understood that the split serpentine shape has side-by-side serpentine shapes connected together.
The femtosecond laser device can adopt industrial grade femtosecond laser device.
The power and the speed of the femtosecond laser can be set according to the thickness of the functional film, so that the resolution of the planar wire structure is improved, and the processing quality is improved.
The preparation method of the flexible lead and the flexible electronic device provided by the disclosure has the following beneficial effects:
the method can prepare the flexible lead with high precision and large scale without being limited by patterns, has the unique advantages of rapidness, environmental protection, low price, high resource utilization rate and insensitivity to external environment, and is suitable for preparing various types of two-dimensional flexible leads and three-dimensional flexible leads.
In the preparation step, a sacrificial layer may be formed on the rigid substrate by spin coating a paste on the rigid substrate, and the paste may be dissolved by a solvent. For example, the sacrificial layer may be formed of polymethyl methacrylate, and the solvent may be formed of one or more of acetone, ethanol, dichloromethane, and anisole.
The solvent is capable of dissolving the glue, thereby separating the planar wire structure formed on the functional film from the rigid substrate.
Of course, the sacrificial layer may also be removed by a robot segment or the like.
The flexible substrate and the planar conductor structure may also be surface treated prior to assembling the planar conductor structure to the flexible substrate.
The flexible substrate has a predetermined area for assembling the planar wire structure, which may be subjected to one or more of the following treatments to render the predetermined area adhesive for adhering to the planar wire structure:
plasma treatment, ozone surface irradiation, and surfactant treatment.
The planar wire structure may have a paste area 10 pasted with a predetermined area of the flexible substrate, and silicon dioxide may be deposited on the paste area 10 by the following process:
and placing the planar conducting wire structure in a magnetron sputtering cavity to sputter silicon dioxide.
Before the surface treatment of the planar wire structure, a mask may be coated on the planar wire structure, and the mask covers the buckling deformation region 20 of the planar wire structure of the three-dimensional flexible wire or the non-adhesive region 30 of the planar wire structure of the two-dimensional flexible wire, so that the silicon dioxide can be more conveniently deposited on the adhesive region 10.
The mask plate related to the present disclosure is prepared by laser engraving, and the material can be common commercial Polyimide (PI) film.
After finishing the surface treatment of the flexible substrate and the planar wire structure, the planar wire structure is adhered to the flexible substrate, and then an assembly formed by the planar wire structure and the flexible substrate is placed in an oven to be heated, so that the planar wire structure and the flexible substrate are bonded (a specific implementation mode that the planar wire structure and the flexible substrate are fixed), a stable covalent bond connection is formed between the planar wire structure and the flexible substrate, and the planar substrate is firmly assembled to the flexible substrate.
The functional film forming a flexible wire provided by the present disclosure may have: the buffer layer is combined with the functional layer. The functional film and the sacrificial layer can be provided with a first protective layer, and the functional film is combined with the first protective layer through the buffer layer.
The first protection layer can be formed on the surface of the sacrificial layer by a spin coating method, and the buffer layer can be formed on the surface of the first protection layer by an evaporation method. The buffer layer and the functional layer may be formed by electron beam evaporation or magnetron sputtering.
The first protective layer may be formed of Polyimide (PI), the buffer layer may be formed of chromium (Cr), and the functional layer may be formed of gold (Au).
Therefore, the functional layer is used for conducting current, and the buffer layer plays a role in buffer transition, so that gold is not easy to fall off. The first protective layer is arranged on one side of the functional layer and plays a role in supporting and protecting, and the first protective layer and the second protective layer enable the gold functional layer to be located at a neutral axis position, so that strain borne by the gold functional layer when the structure is stretched is remarkably reduced.
The first protective layer is positioned on one side of the functional film, the other side of the functional film is also provided with a second protective layer, and the functional film is combined with the second protective layer through the functional layer.
The second protective layer may be formed on the surface of the functional layer by spin coating.
The second protective layer may be formed using Polyimide (PI).
Thus, the protective layers are respectively arranged on the two sides of the functional layer, so that the functional layer can be better prevented from generating plasticity.
In the step of assembling the planar wiring structure to the flexible substrate, a transfer technique may be applied, in which one surface of the planar wiring structure is bonded to a stamp, the above-mentioned surface treatment is performed on the other surface of the planar wiring structure, and then the surface-treated planar wiring structure is transferred to the flexible substrate by the stamp to attach the attachment area 10 of the planar wiring structure to the flexible substrate. The stamp includes, but is not limited to, Polydimethylsiloxane (PDMS).
The planar wire structure can be freely transferred to various types of substrates by a transfer printing technology, and the difficulty of directly preparing the planar wire structure on an unconventional substrate can be effectively avoided.
In the case of pre-stretching the flexible substrate, one or more of a biaxial stretcher, a six-axis stretcher and an eight-axis stretcher may be applied.
In the present disclosure, the flexible substrate may be made of one or more materials such as Polydimethylsiloxane (PDMS), Ecoflex, DragonSkin, etc.
In the present disclosure, the rigid substrate may be formed using a silicon wafer or a glass sheet.
In the present disclosure, the preparation method of the sacrificial layer includes, but is not limited to, coating, spin coating and then curing.
In the present disclosure, the preparation method of the protective layer includes, but is not limited to, coating, spin coating, and then curing.
In the present disclosure, the functional thin film is prepared by methods including, but not limited to, electron beam evaporation and magnetron sputtering.
Examples of two-dimensional flexible wires and three-dimensional flexible wires made using the manufacturing method of the present disclosure are provided below.
First embodiment
In this embodiment, two types of wires as shown in fig. 1 and 2 are processed, i.e., a serpentine wire and a parting serpentine wire, and as shown in fig. 4, the planar wire structure is configured as follows: sacrificial layer, protective layer, buffer layer, functional layer and protective layer that set gradually.
The material of the sacrificial layer adopts polymethyl methacrylate (PMMA); the protective layer adopts PI, and the thickness is 3 microns; the buffer layer is made of Cr and has a thickness of 10 nanometers; the functional layer adopts a gold film, and the thickness is 200 nanometers.
Preparing a sacrificial layer, a protective layer and a functional film on a rigid substrate by adopting a spin coating and film coating method, and transferring a plane lead structure onto a flexible substrate, wherein the method comprises the following steps:
(1) ultrasonically cleaning the silicon wafer with acetone, ethanol and deionized water for 10min, circulating for 3 times, taking out, and drying with nitrogen;
(2) spin-coating PMMA on a clean silicon wafer at the rotating speed of 3000rpm, and performing step curing, namely curing at 110 ℃ for 5min, curing at 150 ℃ for 5min and curing at 180 ℃ for 10 min; spin-coating PI at 6000rpm, and performing stepped curing at 80 deg.C for 20min, at 120 deg.C for 20min, at 150 deg.C for 30min, and at 180 deg.C for 50min to obtain Si/PMMA/PI structure;
(3) putting Si/PMMA/PI into an electron beam evaporation cavity, and evaporating a buffer layer Cr with the thickness of 10 nanometers on the surface; then, evaporating a 200-nanometer-thick functional layer Au to obtain a Si/PMMA/PI/Cr/Au structure;
(4) spin-coating a second layer of PI on the surface of the functional layer at the rotating speed of 6000rpm, and performing step curing, wherein the curing is performed at 80 ℃ for 20min, at 120 ℃ for 20min, at 150 ℃ for 30min and at 180 ℃ for 50min to obtain a Si/PMMA/PI/Cr/Au/PI structure;
(5) cleaving the silicon wafer, and placing the cleaved small wafer in femtosecond laser to realize wire patterning;
(6) placing the patterned rigid substrate in an alcohol solution to dissolve the sacrificial layer;
(7) placing the flexible substrate in an ultraviolet ozone machine for surface treatment of a specific area;
(8) transferring the planar wire structure from a silicon wafer to a PDMS stamp;
(9) covering a mask plate on the surface of the planar lead structure, which is far away from the stamp, placing the stamp and the planar lead structure in a magnetron sputtering cavity, and depositing 50 nanometers of silicon dioxide on the sticking area 10 exposed through the mask plate;
(10) and transferring the surface-treated planar conducting wire structure to the surface-treated flexible substrate through a stamp.
(11) And (3) placing the flexible substrate with the planar wire structure into an oven to be heated for ten minutes, and setting the heating temperature to be 70 ℃.
Second embodiment
In this embodiment, a three-dimensional flexible wire having a spiral shape as shown in fig. 3 and a circuit to which a flexible wireless power supply device is connected as shown in fig. 5 are prepared.
As shown in fig. 4, the planar wire structure is constituted by: sacrificial layer, protective layer, buffer layer, functional layer and protective layer that set gradually.
The material of the sacrificial layer adopts PMMA; the protective layer adopts PI, and the thickness is 3 microns; the buffer layer is made of Cr and has a thickness of 10 nanometers; the functional layer adopts a gold film, and the thickness is 200 nanometers.
The preparation method comprises the following steps of preparing a sacrificial layer, a protective layer and a functional film on a rigid substrate by adopting a spin coating and film coating method, transferring a planar lead structure onto a pre-stretched flexible substrate, and realizing the preparation of a three-dimensional flexible lead by a buckling assembly technology, wherein the preparation method comprises the following steps:
(1) ultrasonically cleaning the silicon wafer with acetone, ethanol and deionized water for 10min, circulating for 3 times, taking out, and drying with nitrogen;
(2) spin-coating PMMA on a clean silicon wafer at the rotating speed of 3000rpm, and performing step curing, namely curing at 110 ℃ for 5min, curing at 150 ℃ for 5min and curing at 180 ℃ for 10 min; spin-coating PI at 6000rpm, and performing stepped curing at 80 deg.C for 20min, at 120 deg.C for 20min, at 150 deg.C for 30min, and at 180 deg.C for 50min to obtain Si/PMMA/PI structure;
(3) putting Si/PMMA/PI into an electron beam evaporation cavity, and evaporating a buffer layer Cr with the thickness of 10 nanometers on the surface; then, evaporating a 200-nanometer-thick functional layer Au to obtain a Si/PMMA/PI/Cr/Au structure;
(4) spin-coating a second layer of PI on the surface of the functional layer at the rotating speed of 6000rpm, and performing step curing, wherein the curing is performed at 80 ℃ for 20min, at 120 ℃ for 20min, at 150 ℃ for 30min and at 180 ℃ for 50min to obtain a Si/PMMA/PI/Cr/Au/PI structure;
(5) the silicon chip is placed in femtosecond laser to realize the patterning of the conducting wire, and the planar conducting wire structure in the embodiment is arranged in a shape of a Chinese character 'hui' while being arranged in a snake shape, so that an array of the planar conducting wire structure is formed.
(6) Placing the patterned rigid substrate in an alcohol solution to dissolve the sacrificial layer;
(7) pre-stretching the flexible substrate to a design strain of 150%, and then placing the flexible substrate in an ultraviolet ozone machine for surface treatment of a specific area;
(8) transferring the planar wire structure from a silicon wafer to a PDMS stamp;
(9) covering a mask plate on the surface of the planar lead structure, which is far away from the stamp, placing the stamp and the planar lead structure in a magnetron sputtering cavity, and depositing 50 nanometers of silicon dioxide on the sticking area 10 exposed through the mask plate;
(10) and transferring the surface-treated planar conducting wire structure to the surface-treated flexible substrate through a stamp.
(11) Placing the flexible substrate with the planar wire structure into an oven to be heated for ten minutes, and setting the temperature to be 70 ℃;
(12) after the planar conducting wire structure is firmly adhered to the flexible substrate through the adhering area 10, the prestrain of the flexible substrate is released, the planar conducting wire structure is compressed, bent and self-assembled into a three-dimensional flexible conducting wire, the array of the planar conducting wire structure forms an array of the three-dimensional flexible conducting wire, and the array of the three-dimensional flexible conducting wire is formed according to a shape of a Chinese character 'hui';
(13) as shown in fig. 5, the capacitor 200 and the LED 300 are connected into the circuit and connected to the array of three-dimensional flexible wires to form a wireless power supply circuit for the LED 300.
The present disclosure also provides a flexible wireless power device that can have an additional circular primary coil, a helical three-dimensional flexible wire array 100 (serving as a wireless energy collector) in the central portion, and power consuming components such as an accessed capacitor 200 and illuminated LEDs 300. The flexible wireless energy supply device is connected with the outside through no conducting wire, energy is supplied through the external main coil, and the array of the three-dimensional flexible conducting wires is used as a receiving antenna to receive energy and supply energy to the LED 300.
Fig. 5 is a plan design view of the flexible wireless energy supply device, and shows that the planar conductor structure of the three-dimensional flexible conductor has an arc shape, and the design size of the planar conductor structure can be as follows: the radius of the central circle is 0.85 mm, the line width is 100 microns, and the central angle is 180 degrees, so that the planar conducting wire structure is assembled into the spiral three-dimensional flexible conducting wire shown in the figures 3 and 5 in a buckling mode.
As shown in fig. 5, the array of three-dimensional flexible conductors has a plurality of connection locations formed by adhesive areas 10, which connection locations comprise common connection locations 11 between the respective conductor segments, and reinforced connection locations 12 formed at the corners of the array, and also joint locations 13 between the connection lines of the flexible wireless energy supply device formed by the array of three-dimensional flexible conductors and the three-dimensional flexible conductors, wherein overlapping adhesive areas 10 are formed at the joint locations 13.
In this embodiment, the three-dimensional flexible wire prepared by the method plays a role in connection, so that connection of each functional component is realized, and meanwhile, the three-dimensional flexible wire in an array form also plays a role in an antenna, so that external electromagnetic energy is received.
It should be understood that, when the flexible electronic device is manufactured, the planar lead structure and the functional component may be connected first, and then the three-dimensional flexible lead may be assembled by buckling; the planar conductor structure can be assembled into the three-dimensional flexible conductor in a buckling mode and then connected with the functional assembly.
It should be understood that the transfer printing is a specific embodiment for assembling the planar wire structure to the assembling platform, and the assembling of the planar wire structure and the assembling platform can be realized by other embodiments.
Other embodiments of the disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure disclosed herein. This application is intended to cover any variations, uses, or adaptations of the disclosure following, in general, the principles of the disclosure and including such departures from the present disclosure as come within known or customary practice within the art to which the disclosure pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the disclosure being indicated by the following claims.
It will be understood that the present disclosure is not limited to the precise arrangements described above and shown in the drawings and that various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.
Claims (14)
1. A preparation method of a flexible lead is used for preparing a two-dimensional flexible lead or a three-dimensional flexible lead, and is characterized by comprising the following steps:
the preparation method comprises the following steps:
providing a base material formed by combining a rigid substrate, a sacrificial layer and a functional film, wherein the functional film is combined with the rigid substrate through the sacrificial layer;
the preparation method comprises the following steps:
cutting the functional film of the substrate by femtosecond laser so as to form a planar wire structure on the functional film;
removing the sacrificial layer, thereby separating the planar wire structure from the rigid substrate;
the planar wire structure is formed as the two-dimensional flexible wire; or assembling the planar lead structure to a pre-stretched flexible substrate, releasing the pre-strain of the flexible substrate, and buckling and assembling the planar lead structure into the three-dimensional flexible lead;
the functional film is provided with a buffer layer and a functional layer which are combined together, the functional film is combined with a first protective layer through the buffer layer, the first protective layer is combined with the sacrificial layer, the first protective layer is formed by polyimide, the buffer layer is formed by chromium, and the functional layer is formed by gold;
the functional film is combined with a second protective layer through the functional layer, and the second protective layer is formed by polyimide;
the first protective layer and the second protective layer are such that the functional layer is in a neutral axis position;
the planar lead structure is provided with a buckling deformation area and a fixing area used for being assembled to the flexible substrate, in the preparation step, the planar lead structures are assembled to the flexible substrate, the fixing areas of the adjacent planar lead structures are connected, so that the planar lead structures connected together are formed, and the buckling deformation area can be buckled and deformed to be mechanically assembled into a three-dimensional structure.
2. The method of claim 1, wherein a predetermined region of the flexible substrate is surface-treated to make the predetermined region of the flexible substrate adhesive before assembling the planar conductor structure to the flexible substrate.
3. The method for preparing the flexible conducting wire according to claim 2, wherein the surface treatment mode of the flexible substrate comprises one or more of the following modes:
plasma treatment, ozone surface irradiation, and surfactant treatment.
4. The method of claim 2, wherein the planar wire structure has a fixed area for assembly to the flexible substrate, and wherein the planar wire structure is surface treated by depositing silicon dioxide on the fixed area prior to assembly of the planar wire structure to the flexible substrate.
5. The method for preparing a flexible conductor according to claim 4, wherein the planar conductor structure is placed in a magnetron sputtering chamber for sputtering silicon dioxide.
6. The method of claim 4, wherein a mask is applied to the planar wire structure before the surface treatment of the planar wire structure, the mask covering the planar wire structure outside the fixing region.
7. The method of claim 4, wherein after the surface treatment of the flexible substrate and the planar wire structure, the planar wire structure is bonded to the flexible substrate and the bonded assembly is heated.
8. The method for manufacturing a flexible wire according to claim 1, wherein in the preparing step, the rigid substrate is cleaved into a plurality of secondary parts, and the secondary parts are stuck to a glass member; in the preparing step, the secondary portion is patterned.
9. The method of manufacturing a flexible wire according to claim 1, wherein the sacrificial layer is formed by spin coating a solvent-soluble glue on the rigid substrate.
10. The method for manufacturing a flexible conductor according to claim 9, wherein the sacrificial layer is formed of polymethyl methacrylate, and the solvent includes one or more of the following:
acetone, ethanol, dichloromethane and anisole.
11. The method for preparing a flexible wire according to claim 1, further comprising, in the preparing step:
designing the planar conducting wire structure;
calculating the elastic deformation of the flexible lead formed by the planar lead structure in the stretching deformation through simulation software;
optimizing the planar wire structure according to the elastic deformation;
inputting the optimized processing information of the planar wire structure into a femtosecond laser device.
12. The method of claim 1, wherein the planar conductor structure is assembled to the flexible substrate by a transfer technique.
13. A method of manufacturing a flexible electronic device having the steps of any one of claims 1 to 12, the method further comprising:
and connecting the two-dimensional flexible lead or the three-dimensional flexible lead with a functional component.
14. A flexible wireless power supply device characterized by comprising a coil and a functional component, the functional component comprising a power consuming part, a wireless power receiving part and a connecting wire connecting the two, the functional component being located at the center of the coil, the connecting wire being prepared by the method for preparing a flexible wire according to any one of claims 1 to 12, the connecting wire being a three-dimensional flexible wire and having a spiral shape, the flexible wireless power supply device further comprising an array formed by the three-dimensional flexible wire arranged in a zigzag shape, the array being formed as the wireless power receiving part, the connecting wire connecting the power consuming part and the wireless power receiving part to form a loop.
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| CN110164678A (en) * | 2019-05-17 | 2019-08-23 | 武汉大学 | Magnetic flexible wireless energy transfer receiving module of one kind and preparation method thereof |
| CN113450951A (en) * | 2020-03-26 | 2021-09-28 | 深圳市柔宇科技有限公司 | Elastic connecting piece and preparation method thereof, elastic electronic equipment and preparation method thereof |
| CN111968776A (en) * | 2020-07-27 | 2020-11-20 | 广东工业大学 | Two-stage snakelike interconnection wire structure with high durability |
| CN112229533B (en) * | 2020-09-29 | 2021-12-28 | 西安交通大学 | Deformation-resistant flexible temperature sensor for temperature detection and preparation method thereof |
| CN113185912A (en) * | 2021-03-16 | 2021-07-30 | 浙江大学 | Flexible thermal protection substrate for wearable electronic equipment and preparation method thereof |
| CN114041799B (en) * | 2021-10-29 | 2023-07-25 | 南京大学 | Stretchable patterned metal wire for electrical interconnection in flexible sensor and processing technology |
| CN114520080B (en) * | 2022-02-11 | 2022-10-04 | 清华大学 | Method for manufacturing flexible electronic device |
| CN114608638A (en) * | 2022-03-10 | 2022-06-10 | 浙江理工大学 | Packaging method of flexible microelectronic sensor |
| CN114999734B (en) * | 2022-06-07 | 2023-07-07 | 复旦大学 | Flexible metal nanowire film and preparation method thereof |
| CN114964400B (en) * | 2022-06-14 | 2023-06-30 | 南京高华科技股份有限公司 | Flow sensor and manufacturing method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7491892B2 (en) * | 2003-03-28 | 2009-02-17 | Princeton University | Stretchable and elastic interconnects |
| CN108012352A (en) * | 2017-11-21 | 2018-05-08 | 上海卫星装备研究所 | The preparation method and electric heater of carbon nano-tube film electric heater |
| CN108417710A (en) * | 2018-04-17 | 2018-08-17 | 中国科学院宁波材料技术与工程研究所 | A kind of preparation method of flexible device |
-
2018
- 2018-10-22 CN CN201811231148.0A patent/CN109545450B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7491892B2 (en) * | 2003-03-28 | 2009-02-17 | Princeton University | Stretchable and elastic interconnects |
| CN108012352A (en) * | 2017-11-21 | 2018-05-08 | 上海卫星装备研究所 | The preparation method and electric heater of carbon nano-tube film electric heater |
| CN108417710A (en) * | 2018-04-17 | 2018-08-17 | 中国科学院宁波材料技术与工程研究所 | A kind of preparation method of flexible device |
Non-Patent Citations (2)
| Title |
|---|
| Experimental and theoretical studies of serpentine microstructures bonded to prestrained elastomer for stretchable electronics;yihui zhang et al;《Advanced functional materials》;20140430;第24卷(第14期);第2028-2037页 * |
| Materials and Designs for Wirelessly Powered Implantable Light-Emitting Systems;Rak-Hwan Kim et al;《small》;20120924;第8卷(第18期);第2814-2815页 * |
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