CN109545450A - Flexible wire, the preparation method of flexible electronic device and flexible wireless energy supply device - Google Patents
Flexible wire, the preparation method of flexible electronic device and flexible wireless energy supply device Download PDFInfo
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- CN109545450A CN109545450A CN201811231148.0A CN201811231148A CN109545450A CN 109545450 A CN109545450 A CN 109545450A CN 201811231148 A CN201811231148 A CN 201811231148A CN 109545450 A CN109545450 A CN 109545450A
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- conductor line
- planar conductor
- line structure
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/50—Structural association of antennas with earthing switches, lead-in devices or lightning protectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/0006—Particular feeding systems
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/0087—Apparatus or processes specially adapted for manufacturing antenna arrays
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J50/00—Circuit arrangements or systems for wireless supply or distribution of electric power
- H02J50/20—Circuit arrangements or systems for wireless supply or distribution of electric power using microwaves or radio frequency waves
Abstract
The disclosure provides a kind of flexible wire, the preparation method of flexible electronic device and flexible wireless energy supply device.The preparation method is the following steps are included: provide the substrate formed together with function film triplicity by rigid substrate, sacrificial layer；Using the function film of femtosecond laser cutting substrate to make function film be formed with planar conductor line structure；Sacrificial layer is removed, so that planar conductor line structure is separated with rigid substrate；Planar conductor line structure is formed as two-dimension flexible conducting wire；Alternatively, planar conductor line structure to be assembled to the flexible substrate of pre-stretching, the prestrain of flexible substrate is discharged, planar conductor line structure buckling is made to be assembled into three-dimension flexible conducting wire.The preparation method can be prepared flexible wire with being limited by pattern with high precision, on a large scale, not, be also equipped with quick, environmentally friendly, cheap, high resource utilization, the unique advantage insensitive to external environment, the preparation suitable for all types of flexible wires of two and three dimensions.
Description
Technical field
This disclosure relates to electronic technology field, in particular to a kind of flexible wire, flexible electronic device preparation method and
Flexible wireless energy supply device.
Background technique
In recent years, to meet the needs of people are for electronic device flexibility, flexible electronic technology is rapidly developed,
The flexible electronic device for emerging all polymorphic types, such as wearing for flexible sensor, flexible display screen, man-made electronic's skin and multiplicity
Wearing electronic product etc..Wherein, the wearable electronic for health monitoring and medical treatment has had been provided with tera-scale market.
Wearable electronic can be bonded the biological characteristic of the soft curved surface of human skin, carry out to physiology signal
More accurate and continuous monitoring.A major class in wearable electronic is inorganic flexible electronic, mainly by silicon etc.
Traditional high-performance electronic material combines to take into account performance and flexible two big advantages with flexible substrate.
Inorganic flexible device mainly uses island bridge-type structure, and the funtion parts such as brittle silicon are placed in and strain lesser " island "
On, by the flexible wire as " bridge " by the array interconnection on " island ", realize the integrated of function.In addition, in wearable electronic device
In part field, flexible wire is also often as the function element of flexible display, such as temperature sensor and strain transducer, all
It is by measuring the resistance variations of flexible wire come the variation of monitoring temperature and strain.
Designing and preparing for flexible wire is the key that one of inorganic flexible electronic, needs guaranteeing that route is normal
Work is provided simultaneously with biggish ductility.
Currently, the preparation method of flexible wire mainly uses traditional plane microelectronics photoetching process, this technique can
With large scale preparation planar structure, precision is higher, can easily realize the patterning of micro-structure.Conventional lithographic techniques use
The ultraviolet light that wavelength is 200nm to 450nm realizes transformation, transfer and the place of pattern using photoresist as intermediary as light source
Reason, is finally transmitted to image information on substrate.General exposure process include surface treatment with prebake conditions, spin coating, front baking,
Alignment, exposure, rear baking, eight development, post bake and image detection basic steps.
Above-mentioned photoetching preparation method has the disadvantages that
The first, need special litho machine and clean room and technique be cumbersome, experiment condition require it is high, experiment preparation difficulty and
Time-consuming, and experimental result influences external environment sensitive in photoetching, needs to control multiple environmental parameters；
The second, the preparation process is chemical treating process, is related to the hazardous chemicals such as acetone, photoresist, hydrofluoric acid,
Waste liquid needs special disposal, exists to natural environment and pollutes；
Third, photoetching process need additionally to prepare dedicated mask plate, and the corresponding pattern of each flexible wire requires to make
Standby dedicated mask plate, price is more expensive and utilization rate is low.
Summary of the invention
The preparation method for being designed to provide a kind of flexible wire and flexible electronic device of the disclosure, the preparation method was both
Have high-precision, extensive, the advantages of conventional lithography process such as not limited by pattern, but also with quick, environmentally friendly, cheap, Gao Zi
Source utilization rate, the unique advantage insensitive to external environment.The purpose of the disclosure, which also resides in, provides a kind of flexible wireless energy supply device
Part.
To achieve the above object, the disclosure provides a kind of preparation method of flexible wire, is used to prepare two-dimension flexible conducting wire
Or three-dimension flexible conducting wire, comprising the following steps:
Preparation process:
The substrate formed together with function film triplicity by rigid substrate, sacrificial layer is provided, the function is thin
Film is by the sacrificial layer in conjunction with the rigid substrate；
Preparation step:
The function film of the substrate is cut using femtosecond laser to lead to make the function film be formed with plane
Cable architecture；
The sacrificial layer is removed, so that the planar conductor line structure is separated with the rigid substrate；
The planar conductor line structure is formed as the two-dimension flexible conducting wire；Alternatively, the planar conductor line structure is assembled to
The flexible substrate of pre-stretching discharges the prestrain of the flexible substrate, is assembled into the planar conductor line structure buckling described
Three-dimension flexible conducting wire.
Preferably, the planar conductor line structure has the fixed area for being assembled to the flexible substrate, in the system
In standby step, several planar conductor line structures are assembled to the flexible substrate, it will be described in adjacent planar conductor line structure
Fixed area is connected, to form several planar conductor line structures in succession together.
Preferably, before the planar conductor line structure is assembled to the flexible substrate, to the pre- of the flexible substrate
Determine region to be surface-treated, makes the presumptive area of the flexible substrate that there is viscosity.
Preferably, include following one or more to the surface treatment mode of the flexible substrate:
Corona treatment, ozone surface radiation, surfactant processing.
Preferably, the planar conductor line structure has fixed area for being assembled to the flexible substrate, will be described
Planar conductor line structure is assembled to before the flexible substrate, is surface-treated to the planar conductor line structure, i.e., described in place
Fixed area deposits silica.
Preferably, the planar conductor line structure is placed in magnetron sputtering cavity and sputters silica.
Preferably, it before being surface-treated to the planar conductor line structure, is covered on the planar conductor line structure
Mask plate, the mask plate cover the planar conductor line structure other than the fixed area.
Preferably, after being surface-treated to the flexible substrate and the planar conductor line structure, by the plane
Conductor structure is Nian Jie with the flexible substrate and heats to the component after bonding.
Preferably, in the preparation process, the rigid substrate is cleaved into several sub-sections, and by the secondary
Bonding partially is in glass workpiece；In the preparation step, the sub-section is patterned.
Preferably, spin coating can be dissolved by the solvent in the rigid substrate glue and form the sacrificial layer.
The preferably described sacrificial layer is formed using polymethyl methacrylate, and the solvent includes following a kind of or several
Kind:
Acetone, ethyl alcohol, methylene chloride, methyl phenyl ethers anisole.
Preferably, the function film has combined buffer layer and functional layer, and the function film passes through institute
Buffer layer is stated in conjunction with the first protective layer, first protective layer is in conjunction with the sacrificial layer, and first protective layer is using poly-
Acid imide is formed, and the buffer layer is formed using chromium, and the functional layer is formed using gold.
Preferably, through the functional layer in conjunction with the second protective layer, second protective layer uses the function film
Polyimides is formed.
Preferably, in the preparation process further include:
Design the planar conductor line structure；
The elasticity by the molding flexible wire of the planar conductor line structure in stretcher strain is calculated by simulation software
Deformation；
Optimize the planar conductor line structure according to the flexible deformation；
The machining information of the optimized planar conductor line structure is inputted into femtosecond laser equipment.
Preferably, the planar conductor line structure is assembled to by the flexible substrate by transfer technique.
The disclosure also provides a kind of preparation method of flexible electronic device, with described in any one of above-mentioned technical proposal
The step of, the preparation method of the flexible electronic device further include:
The two-dimension flexible conducting wire or three-dimension flexible conducting wire are connect with functional unit.
The disclosure also provides a kind of flexible wireless energy supply device, including coil and functional unit, the functional unit include
Energy-consuming parts, wireless energy receiving part and connecting wire connecting the two, the functional unit are located at the center of the coil,
The connecting wire is three-dimension flexible conducting wire and with spiral shape, and the flexibility wireless energy supply device further includes by the three-dimensional
The array arranged according to rectangular-ambulatory-plane that flexible wire is formed, the array are formed as the wireless energy receiving part, the company
It connects conducting wire and connects the energy-consuming parts and wireless energy receiving part forming circuit.
The above-mentioned technical proposal that the disclosure provides has the advantages that
Flexible wire can be prepared with being limited by pattern with high precision, on a large scale, not, be also equipped with quick, environmentally friendly, cheap, high
Resource utilization, the unique advantage insensitive to external environment, the preparation suitable for all types of flexible wires of two and three dimensions.
Detailed description of the invention
Fig. 1 shows an implementation of the two-dimension flexible conducting wire of the preparation method preparation of the flexible wire provided using the disclosure
Example, the flexible wire is with snakelike arrangement；
Fig. 2 shows another reality of the two-dimension flexible conducting wire of the preparation method preparation of the flexible wire provided using the disclosure
Example is applied, the flexible wire is with the snakelike arrangement of parting；
Fig. 3 is one embodiment of the three-dimension flexible conducting wire of the preparation method preparation of the flexible wire provided using the disclosure
Lab diagram partial enlarged view；
Fig. 4 is the composition schematic diagram of the flexible wire of the preparation method preparation of the flexible wire provided using the disclosure；
Fig. 5, which is that the flexibility of the preparation method preparation of the flexible wire and flexible electronic device that provide using the disclosure is wireless, to be supplied
The plane design drawing of one embodiment of energy device.
Description of symbols:
10 sticking areas
11 generic connectivity positions
12 reinforce link position
13 joint locations
20 bending deformation regions
30 non-sticking areas
100 three-dimension flexible wire array
200 capacitors
30 0LED
Specific embodiment
Example embodiments are described in detail here, and the example is illustrated in the accompanying drawings.Following description is related to
When attached drawing, unless otherwise indicated, the same numbers in different drawings indicate the same or similar elements.Following exemplary embodiment
Described in embodiment do not represent all implementations consistent with this disclosure.On the contrary, they be only with it is such as appended
The example of the consistent device and method of some aspects be described in detail in claims, the disclosure.
The disclosure provides preparation method and a kind of flexible electronic device of a kind of flexible wire and flexible electronic device,
Wherein, flexible wire also has biggish ductility while guaranteeing that route works normally.
Flexible wire is with following both sides application: first, as the connecting wire in route, it is used for linkage function group
Part, such as LED, capacitor etc.；Second, the function element being used to form in electronic device, such as in temperature sensor or strain
In sensor, by measuring the resistance variations of flexible wire come monitoring temperature variation or strain variation.
Flexible wire can be two-dimension flexible conducting wire or three-dimension flexible conducting wire, and as depicted in figs. 1 and 2, two-dimension flexible is led
Line has planar structure, as shown in figure 3, three-dimension flexible conducting wire has stereochemical structure.
When preparing two-dimension flexible conducting wire, which includes preparation process and preparation step.
In preparation process, substrate is provided, substrate is combined and shape by rigid substrate, sacrificial layer and function film three
At.
In preparation step:
Femtosecond laser is used to cut the function film of above-mentioned substrate to realize wire patternization to make function film be formed
There is planar conductor line structure；
Sacrificial layer is removed, so that planar conductor line structure is separated with rigid substrate；
Planar conductor line structure is formed as two-dimension flexible conducting wire.
As depicted in figs. 1 and 2, the planar conductor line structure of two-dimension flexible conducting wire can have fixed area and on-fixed area
Domain.Fixed area can be fixed to flexible substrate by way of stickup, so that fixed area is formed as sticking area 10, it is non-solid
Determine region and is formed as non-sticking area 30.When two-dimension flexible conducting wire is used to need the occasion of stretcher strain, non-sticking area 30
Deformation is to form the flexible wire of big ductility.Two-dimension flexible conducting wire can be connect on flexible substrates with functional unit to
Form flexible electronic device.
It should be appreciated that bonding method is two-dimension flexible conducting wire and the specific embodiment that flexible substrate is fixed, may be used also
To be fixed using other modes.
When Tensile, the flexible substrate deformation with two-dimension flexible conducting wire, so that two-dimension flexible conducting wire can be variable
Route is formed on shape object, for example, can be used in wearable device to form route on human skin.
Certainly, planar conductor line structure can also directly connect to be formed with functional unit after separating with rigid substrate
Flexible electronic device.
Fig. 1 and Fig. 2 shows a planar conductor line structure of the two-dimension flexible conducting wire of different patterns respectively, leads needing to extend
The sticking area 10 of multiple planar conductor line structures can also be connected by the occasion of line length, to be formed with multiple a sequence of
The two-dimension flexible conducting wire of planar conductor line structure.
When preparing three-dimension flexible conducting wire, which includes preparation process and preparation step.
In preparation process, sacrificial layer is prepared in rigid substrate, and function film is prepared on sacrificial layer, the function film
It is used to form three-dimension flexible conducting wire and by sacrificial layer in conjunction with rigid substrate.
In preparation step:
Femtosecond laser cutting function film is used to realize wire patternization to which function film is formed with planar conductor line knot
Structure；
Sacrificial layer is removed, so that planar conductor line structure is separated with rigid substrate；
Planar conductor line structure is assembled to the flexible substrate of pre-stretching；
The prestrain of flexible substrate is discharged, planar conductor line structure buckling is assembled into three-dimension flexible conducting wire.
As shown in figure 5, the planar conductor line structure of three-dimension flexible conducting wire can have fixed area and bending deformation region 20,
Fixed area can be fixed to flexible substrate by way of stickup, so that fixed area is formed as sticking area 10.Buckling becomes
Shape region 20 can bending deformation and mechanics is assembled into three-dimensional structure.When three-dimension flexible conducting wire is used to need the occasion of stretcher strain
When, three-dimensional structure deformation is formed by form the flexible wire of big ductility by bending deformation region 20.Three-dimension flexible is led
Line can connect to form flexible electronic device on flexible substrates with functional unit.
It should be appreciated that bonding method be three-dimension flexible conducting wire planar conductor line structure and flexible substrate fixed one it is specific
Embodiment can also be fixed using other modes.
Fig. 3 shows an array of three-dimension flexible conducting wire, and (conducting line segment passes through one to the adjacent conducting line segment in array
Planar conductor line structure mechanics assembles) it is connected by mutual sticking area 10, several conducting line segments are connected and are formed above-mentioned
Array.In the occasion for needing more arrays, the sticking area 10 of multiple arrays can also be connected, so that being formed has multiple companies
The three-dimension flexible conducting wire for the array being connected together.Certainly, three-dimension flexible conducting wire can not also form the array of rectangular-ambulatory-plane, and according to
Linear or the shapes such as snakelike connection.So, in the occasion for needing extension lead length, by the sticking area of multiple conducting line segments
10, which are connected, can form the three-dimension flexible conducting wire with multiple a sequence of conducting line segments.
Shape regardless of two-dimension flexible conducting wire and three-dimension flexible conducting wire, can be by by the stickup of different conductor section
Region 10 connects to adjust the length of conducting wire.
Sticking area 10 can not only be used to fix with flexible substrate, but also as the connector of extension lead length.
In preparation step, the 20 mechanics buckling of bending deformation region when the prestrain of flexible substrate is released, thus flat
Face conductor structure is self-assembled into three-dimension flexible conducting wire.In turn, three-dimension flexible conducting wire connect shape with functional unit on flexible substrates
At flexible electronic device.
The three-dimension flexible conducting wire formed on flexible substrates can also form route on deformable bodies, for example, can
For wearable device to form route on human skin.
In preparation process, rigid substrate can also be cleaved into several sub-sections, and each sub-section is pasted on
The glass workpiece of unified specification.In preparation step, the glass workpiece of the sub-section with rigid substrate is clamped with fixture, thus
Individual sub-section is patterned on glass workpiece.
In this way, saving the materials of rigid substrate, the cost of manufacture flexible wire is reduced.
In addition, in preparation process, can also design and optimize and (optimized using finite element simulation) two-dimension flexible conducting wire or
The planar conductor line structure of person's three-dimension flexible conducting wire is calculated by simulation software and is existed by the molding flexible wire of planar conductor line structure
Flexible deformation in stretcher strain, judges whether the flexible deformation is in scheduled regime of elastic deformation, if so, plane is led
The machining information (such as shape, size) of cable architecture inputs femtosecond laser equipment, if it is not, then optimizing planar conductor line structure, optimizes
After judge whether the flexible deformation of flexible wire is in scheduled regime of elastic deformation again；After iteration optimization, when
When the flexible deformation of flexible wire is in scheduled regime of elastic deformation, by the machining information of the planar conductor line structure optimized
(such as shape, size) inputs femtosecond laser equipment.
In this way, when carrying out wire pattern using femtosecond laser, the planar conductor line structure energy that is cut by femtosecond laser
Enough form the two-dimension flexible conducting wire or three-dimension flexible conducting wire of big ductility.For example, snakelike two dimension as depicted in figs. 1 and 2
Flexible wire and the snakelike two-dimension flexible conducting wire of parting, spiral three-dimension flexible conducting wire as shown in Figure 3
It should be appreciated that parting is snakelike with the snakelike of the arranged in parallel to link together.
Above-mentioned femtosecond laser equipment can use technical grade femtosecond laser equipment.
The power and rate of femtosecond laser can also be set according to the thickness of function film, to improve planar conductor line structure
Resolution ratio, improve processing quality.
The preparation method of flexible wire and flexible electronic device that the disclosure provides has the advantages that
Flexible wire can be prepared with being limited by pattern with high precision, on a large scale, not, be also equipped with quick, environmentally friendly, cheap, high
Resource utilization, the unique advantage insensitive to external environment, lead suitable for all types of two-dimension flexible conducting wires and three-dimension flexible
The preparation of line.
In preparation step, sacrifice can be formed by way of the spin coating glue in rigid substrate and in rigid substrate
Layer, and the glue can be dissolved by solvent.For example, sacrificial layer can be formed using polymethyl methacrylate, solvent
Pass through one of acetone, ethyl alcohol, methylene chloride, methyl phenyl ethers anisole or several formation.
The solvent can dissolve the glue, so that the planar conductor line structure for being formed in function film be made to separate with rigid substrate.
It is, of course, also possible to remove sacrificial layer by mechanical means etc..
Before planar conductor line structure is assembled to flexible substrate, flexible substrate and planar conductor line structure can also be carried out
Surface treatment.
Flexible substrate has the presumptive area for assembling planar conductor line structure, can carry out to presumptive area following a kind of
Or several processing, so that presumptive area has viscosity to paste with planar conductor line structure:
Corona treatment, ozone surface radiation, surfactant processing.
Planar conductor line structure can have the sticking area 10 pasted with the presumptive area of flexible substrate, can be by following
Technique deposits silica in sticking area 10:
Planar conductor line structure is placed in magnetron sputtering cavity and sputters silica.
Before being surface-treated to planar conductor line structure, can on planar conductor line structure mask film covering version, exposure mask
The bending deformation region 20 of the planar conductor line structure of version covering three-dimension flexible conducting wire or the planar conductor line knot of two-dimension flexible conducting wire
The non-sticking area 30 of structure, so as to more easily deposit silica on sticking area 10.
This disclosure relates to mask plate be prepared by laser engraving, material can use common commercial polyimide
(PI) film.
After completing to the surface treatment of flexible substrate and planar conductor line structure, planar conductor line structure is affixed into flexibility
The component that planar conductor line structure is formed with flexible substrate is placed in baking oven heats later by substrate, to make planar conductor line structure
It is bonded (a kind of planar conductor line structure specific embodiment fixed with flexible substrate) with flexible substrate, is formed stablize therebetween
Covalent key connection, planar substrate is assembled to flexible substrate securely.
The function film for the formation flexible wire that the disclosure provides can have: buffer layer and functional layer, buffer layer and function
Ergosphere is combined together.There can also be the first protective layer between function film and sacrificial layer, function film passes through buffer layer
In conjunction with the first protective layer.
First protective layer can be formed in sacrificial layer surface by the method for spin coating, and buffer layer can pass through the method for vapor deposition
It is formed in the first protective layer.Buffer layer can be formed with functional layer by electron beam evaporation plating or magnetically controlled sputter method.
First protective layer can be formed using polyimides (PI), and buffer layer can be formed using chromium (Cr), and functional layer can
To be formed using golden (Au).
In this way, functional layer is for conducting electric current, buffer layer plays the role of buffering transition, so that gold is not easy to fall off.The
The side of functional layer is arranged in one protective layer, plays the role of support protection, the first protective layer and the second protective layer make golden function
Ergosphere is in position of neutral axis, the strain that gold functional layer is born when significantly reducing construction stretch.
First protective layer is located at the side of function film, and the other side of function film also has the second protective layer, and function is thin
Film is by functional layer in conjunction with the second protective layer.
Second protective layer can be formed in the surface of functional layer by the method for spin coating.
Second protective layer can be formed using polyimides (PI).
In this way, a protective layer is respectively arranged in the two sides in functional layer, functional layer can be better protected from and generate plasticity.
In the step of planar conductor line structure is assembled to flexible substrate, transfer technique can be applied, even if planar conductor line
One surface of structure carries out above-mentioned surface treatment in conjunction with seal, to another surface of planar conductor line structure, then passes through
Surface-treated planar conductor line structure is transferred in flexible substrate by seal so that the sticking area 10 of planar conductor line structure glues
It is affixed on flexible substrate.Seal includes but is not limited to dimethyl silicone polymer (PDMS).
Planar conductor line structure can be freely transferred on various types of substrates by transfer technique, it is possible to prevente effectively from
The difficulty directly prepared on unconventional substrate.
It, can be using one of biaxial stretcher, six axis stretching-machines and eight axis stretching-machines when being pre-stretched flexible substrate
Or it is several.
In the disclosure, flexible substrate can use dimethyl silicone polymer (PDMS), Ecoflex, DragonSkin etc.
One of material is several.
In the disclosure, rigid substrate can be formed using silicon wafer, sheet glass.
In the disclosure, the preparation method of sacrificial layer includes but is not limited to coating, spin coating then solidification.
In the disclosure, the preparation method of protective layer includes but is not limited to coating, spin coating then solidification.
In the disclosure, the preparation method of function film includes but is not limited to electron beam evaporation plating, magnetron sputtering.
The embodiment that two-dimension flexible conducting wire and three-dimension flexible conducting wire are prepared using the preparation method of the disclosure is provided below.
First embodiment
In the present embodiment, two class conducting wires as depicted in figs. 1 and 2 are processed, are snakelike conducting wire respectively and parting is snakelike leads
Line, as shown in figure 4, the composition of planar conductor line structure are as follows: sacrificial layer, protective layer, buffer layer, functional layer and the protection set gradually
Layer.
Sacrificial layer material uses polymethyl methacrylate (PMMA)；Protective layer material uses PI, with a thickness of 3 microns；It is slow
Layer material is rushed using Cr, with a thickness of 10 nanometers；Functional layer uses gold thin film, with a thickness of 200 nanometers.
Sacrificial layer, protective layer and function film are prepared in rigid substrate using the method for spin coating and plated film, and by plane
Conductor structure is transferred in flexible substrate, is included the following steps:
(1) silicon wafer is used to acetone, ethyl alcohol, deionized water ultrasonic cleaning 10min respectively, recycles 3 times, is blown after taking-up with nitrogen
It is dry；
(2) with 3000rpm revolving speed spin coating PMMA on clean silicon wafer, use is staged curing, i.e., 110 DEG C solidification 5min,
150 DEG C of solidifications 5min, 180 DEG C of solidification 10min；Then with 6000rpm revolving speed spin coating PI, use is staged curing, 80 DEG C of solidifications
20min, 120 DEG C of solidifications 20min, 150 DEG C of solidifications 30min, 180 DEG C of solidification 50min obtain Si/PMMA/PI structure；
(3) Si/PMMA/PI is put into electron beam evaporation plating cavity, the buffer layer Cr of one layer of 10 nanometer thickness is deposited on surface；
Then the functional layer Au of one layer of 200 nanometer thickness is deposited, obtains Si/PMMA/PI/Cr/Au structure；
(4) in function layer surface with 6000rpm revolving speed spin coating second layer PI, use is staged curing, 80 DEG C of solidification 20min,
120 DEG C of solidifications 20min, 150 DEG C of solidifications 30min, 180 DEG C of solidification 50min obtain Si/PMMA/PI/Cr/Au/PI structure；
(5) by silicon wafer cleavage, the small pieces that cleavage is obtained are placed in realization wire pattern in femtosecond laser；
(6) patterned rigid substrate is placed in alcoholic solution and dissolves sacrificial layer；
(7) flexible substrate is placed in UV ozone machine to the surface treatment for carrying out specific region；
(8) planar conductor line structure is transferred on PDMS seal from silicon wafer；
(9) in the one side mask film covering version away from seal of planar conductor line structure, seal is set together with planar conductor line structure
In magnetron sputtering cavity, 50 nanometers of silica are deposited to the sticking area 10 exposed by mask plate；
(10) planar conductor line structure after surface treatment is transferred in the flexible substrate after surface treatment by seal.
(11) flexible substrate with planar conductor line structure is put into baking oven to heat ten minutes, setting heating temperature is taken the photograph for 70
Family name's degree.
Second embodiment
In the present embodiment, prepare spiral three-dimension flexible conducting wire as shown in Figure 3 and it is as shown in Figure 5 be connected with it is soft
The circuit of property wireless energy supply device.
As shown in figure 4, the composition of planar conductor line structure are as follows: sacrificial layer, protective layer, the buffer layer, functional layer set gradually
And protective layer.
Sacrificial layer material uses PMMA；Protective layer material uses PI, with a thickness of 3 microns；Cushioning layer material uses Cr, thickness
It is 10 nanometers；Functional layer uses gold thin film, with a thickness of 200 nanometers.
Sacrificial layer, protective layer and function film are prepared in rigid substrate using the method for spin coating and plated film, and by plane
Conductor structure is transferred in the flexible substrate of pre-stretching, and the preparation of three-dimension flexible conducting wire is realized by buckling package technique, including
Following steps:
(1) silicon wafer is used to acetone, ethyl alcohol, deionized water ultrasonic cleaning 10min respectively, recycles 3 times, is blown after taking-up with nitrogen
It is dry；
(2) with 3000rpm revolving speed spin coating PMMA on clean silicon wafer, use is staged curing, i.e., 110 DEG C solidification 5min,
150 DEG C of solidifications 5min, 180 DEG C of solidification 10min；Then with 6000rpm revolving speed spin coating PI, use is staged curing, 80 DEG C of solidifications
20min, 120 DEG C of solidifications 20min, 150 DEG C of solidifications 30min, 180 DEG C of solidification 50min obtain Si/PMMA/PI structure；
(3) Si/PMMA/PI is put into electron beam evaporation plating cavity, the buffer layer Cr of one layer of 10 nanometer thickness is deposited on surface；
Then the functional layer Au of one layer of 200 nanometer thickness is deposited, obtains Si/PMMA/PI/Cr/Au structure；
(4) in function layer surface with 6000rpm revolving speed spin coating second layer PI, use is staged curing, 80 DEG C of solidification 20min,
120 DEG C of solidifications 20min, 150 DEG C of solidifications 30min, 180 DEG C of solidification 50min obtain Si/PMMA/PI/Cr/Au/PI structure；
(5) silicon wafer is placed in femtosecond laser to the patterning for realizing conducting wire, the planar conductor line structure in the present embodiment is on one side
It is arranged on one side with rectangular-ambulatory-plane with snakelike arrangement, to form the array of planar conductor line structure.
(6) patterned rigid substrate is placed in alcoholic solution and dissolves sacrificial layer；
(7) flexible substrate prestretching is extended into design strain 150%, is subsequently placed in UV ozone machine and carries out specific region
Surface treatment；
(8) planar conductor line structure is transferred on PDMS seal from silicon wafer；
(9) in the one side mask film covering version away from seal of planar conductor line structure, seal is set together with planar conductor line structure
In magnetron sputtering cavity, 50 nanometers of silica are deposited to the sticking area 10 exposed by mask plate；
(10) planar conductor line structure after surface treatment is transferred in the flexible substrate after surface treatment by seal.
(11) flexible substrate with planar conductor line structure is put into baking oven to heat ten minutes, setting temperature is 70 Celsius
Degree；
(12) flexible substrate is discharged after planar conductor line structure is pasted on flexible substrate securely by sticking area 10
Prestrain, it is three-dimension flexible conducting wire that planar conductor line structure, which compresses buckling and self assembly, and the array of planar conductor line structure is formed as three
The array of flexible wire is tieed up, the array of three-dimension flexible conducting wire is formed according to rectangular-ambulatory-plane；
(13) as shown in figure 5, capacitor 200 and LED 300 are accessed circuit and connect with the array of three-dimension flexible conducting wire, shape
At 300 wireless energy supply circuit of LED.
The disclosure also provides a kind of flexible wireless energy supply device, and it is main that flexible wireless energy supply device can have additional circle
Coil, the spiral three-dimension flexible wire array 100 (as wireless energy harvester) of centrally located part, and energy consumption
Component, such as the capacitor 200 accessed and the LED3 00 lighted.The flexibility wireless energy supply device is connect with the external world without conducting wire, is passed through
Additional main coil energy supply, the array of three-dimension flexible conducting wire receive energy as receiving antenna, energize for LED 300.
Fig. 5 is the plane design drawing of the flexibility wireless energy supply device, shows the planar conductor line structure tool of three-dimension flexible conducting wire
There is arc, the design size of the planar conductor line structure can be with are as follows: 0.85 millimeter of center radius of circle, 100 microns of line width, central angle
The planar conductor line structure buckling is assembled into Fig. 3 and spiral three-dimension flexible conducting wire shown in fig. 5 by 180 degree.
As shown in figure 5, the array of three-dimension flexible conducting wire has multiple link positions formed by sticking area 10, these companies
Connecing position includes generic connectivity position 11 between each conducting line segment, and the reinforcement link position of corner's formation in array
12, further include three-dimension flexible wire array formed flexible wireless energy supply device with three-dimension flexible conducting wire formed connecting line it
Between joint location 13, wherein joint location 13 formed overlapping sticking area 10.
In the present embodiment, the three-dimension flexible conducting wire of this method preparation both plays the role of connection, realizes each functional group
The connection of part, meanwhile, the three-dimension flexible conducting wire of array pattern plays the role of antenna again to receive external electromagnetic energy.
It should be appreciated that first planar conductor line structure can be connect with functional unit, later when preparing flexible electronic device
Buckling is assembled into three-dimension flexible conducting wire again；Planar conductor line structure buckling first can also be assembled into three-dimension flexible conducting wire, Zhi Houzai
It is connect with functional unit.
It should be appreciated that transfer is the specific embodiment that planar conductor line structure is assembled to assembly platform, plane is led
The assembling of cable architecture and assembly platform can also be realized by other embodiments.
Those skilled in the art after considering the specification and implementing the invention disclosed here, will readily occur to its of the disclosure
Its embodiment.This application is intended to cover any variations, uses, or adaptations of the disclosure, these modifications, purposes or
Person's adaptive change follows the general principles of this disclosure and including the undocumented common knowledge in the art of the disclosure
Or conventional techniques.The description and examples are only to be considered as illustrative, and the true scope and spirit of the disclosure are by appended
Claim is pointed out.
It should be understood that the present disclosure is not limited to the precise structures that have been described above and shown in the drawings, and
And it can carry out various modifications and change in the case where without departing from the scope.The scope of the present disclosure is only by the attached claims
To limit.
Claims (17)
1. a kind of preparation method of flexible wire is used to prepare two-dimension flexible conducting wire or three-dimension flexible conducting wire, which is characterized in that
The following steps are included:
Preparation process:
The substrate formed together with function film triplicity by rigid substrate, sacrificial layer is provided, the function film is logical
Cross the sacrificial layer and in conjunction with the rigid substrate；
Preparation step:
The function film of the substrate is cut to make the function film be formed with planar conductor line knot using femtosecond laser
Structure；
The sacrificial layer is removed, so that the planar conductor line structure is separated with the rigid substrate；
The planar conductor line structure is formed as the two-dimension flexible conducting wire；Alternatively, the planar conductor line structure is assembled to prestretching
The flexible substrate stretched discharges the prestrain of the flexible substrate, and the planar conductor line structure buckling is made to be assembled into the three-dimensional
Flexible wire.
2. the preparation method of flexible wire according to claim 1, which is characterized in that the planar conductor line structure, which has, to be used
In the fixed area for being assembled to the flexible substrate, in the preparation step, several planar conductor line structures are assembled to
The fixed area of adjacent planar conductor line structure is connected by the flexible substrate, to form together several in succession
A planar conductor line structure.
3. the preparation method of flexible wire according to claim 1 or 2, which is characterized in that by the planar conductor line knot
Structure is assembled to before the flexible substrate, is surface-treated to the presumptive area of the flexible substrate, and the flexible substrate is made
The presumptive area have viscosity.
4. the preparation method of flexible wire according to claim 3, which is characterized in that at the surface of the flexible substrate
Reason mode includes following one or more:
Corona treatment, ozone surface radiation, surfactant processing.
5. the preparation method of flexible wire according to claim 3, which is characterized in that the planar conductor line structure, which has, to be used
It is right before the planar conductor line structure is assembled to the flexible substrate in the fixed area for being assembled to the flexible substrate
The planar conductor line structure is surface-treated, i.e. the place fixed area deposits silica.
6. the preparation method of flexible wire according to claim 5, which is characterized in that the planar conductor line structure to be placed in
Silica is sputtered in magnetron sputtering cavity.
7. the preparation method of flexible wire according to claim 5, which is characterized in that the planar conductor line structure into
Before row surface treatment, the mask film covering version on the planar conductor line structure, the mask plate is covered other than the fixed area
The planar conductor line structure.
8. the preparation method of flexible wire according to claim 5, which is characterized in that the flexible substrate and described
After planar conductor line structure is surface-treated, by the planar conductor line structure it is Nian Jie with the flexible substrate and to bonding after
Component is heated.
9. the preparation method of flexible wire according to claim 1, which is characterized in that in the preparation process, by institute
It states rigid substrate and is cleaved into several sub-sections, and the sub-section is pasted on glass workpiece；It is right in the preparation step
The sub-section is patterned.
10. the preparation method of flexible wire according to claim 1, which is characterized in that the spin coating in the rigid substrate
The glue that can be dissolved by the solvent and form the sacrificial layer.
11. the preparation method of flexible wire according to claim 10, which is characterized in that the sacrificial layer uses poly- methyl
Methyl acrylate is formed, and the solvent includes following one or several kinds:
Acetone, ethyl alcohol, methylene chloride, methyl phenyl ethers anisole.
12. the preparation method of flexible wire according to claim 1, which is characterized in that the function film, which has, to be combined
Buffer layer and functional layer together, through the buffer layer in conjunction with the first protective layer, described first protects the function film
Sheath is in conjunction with the sacrificial layer, and first protective layer is formed using polyimides, and the buffer layer is formed using chromium, described
Functional layer is formed using gold.
13. the preparation method of flexible wire according to claim 12, which is characterized in that the function film passes through described
In conjunction with the second protective layer, second protective layer is formed functional layer using polyimides.
14. the preparation method of flexible wire according to claim 1, which is characterized in that also wrapped in the preparation process
It includes:
Design the planar conductor line structure；
The flexible deformation by the molding flexible wire of the planar conductor line structure in stretcher strain is calculated by simulation software；
Optimize the planar conductor line structure according to the flexible deformation；
The machining information of the optimized planar conductor line structure is inputted into femtosecond laser equipment.
15. the preparation method of flexible wire according to claim 1 or 2, which is characterized in that will be described by transfer technique
Planar conductor line structure is assembled to the flexible substrate.
16. a kind of preparation method of flexible electronic device, which is characterized in that have according to claim 1 to any one of 15 institutes
The step of stating, the preparation method of the flexible electronic device further include:
The two-dimension flexible conducting wire or three-dimension flexible conducting wire are connect with functional unit.
17. a kind of flexibility wireless energy supply device, which is characterized in that including coil and functional unit, the functional unit includes consumption
Energy component, wireless energy receiving part and connecting wire connecting the two, the functional unit are located at the center of the coil, institute
Stating connecting wire is three-dimension flexible conducting wire and with spiral shape, and the flexibility wireless energy supply device further includes soft by the three-dimensional
Property the array arranged according to rectangular-ambulatory-plane that is formed of conducting wire, the array is formed as the wireless energy receiving part, the connection
Conducting wire connects the energy-consuming parts and wireless energy receiving part forming circuit.
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| CN110164678A (en) * | 2019-05-17 | 2019-08-23 | 武汉大学 | Magnetic flexible wireless energy transfer receiving module of one kind and preparation method thereof |
| CN113450951A (en) * | 2020-03-26 | 2021-09-28 | 深圳市柔宇科技有限公司 | Elastic connecting piece and preparation method thereof, elastic electronic equipment and preparation method thereof |
| CN111968776A (en) * | 2020-07-27 | 2020-11-20 | 广东工业大学 | Two-stage snakelike interconnection wire structure with high durability |
| CN112229533A (en) * | 2020-09-29 | 2021-01-15 | 西安交通大学 | Deformation-resistant flexible temperature sensor for temperature detection and preparation method thereof |
| CN113185912A (en) * | 2021-03-16 | 2021-07-30 | 浙江大学 | Flexible thermal protection substrate for wearable electronic equipment and preparation method thereof |
| CN114041799A (en) * | 2021-10-29 | 2022-02-15 | 南京大学 | Stretchable patterned metal wire for electrical interconnection in flexible sensor and processing technology |
| CN114041799B (en) * | 2021-10-29 | 2023-07-25 | 南京大学 | Stretchable patterned metal wire for electrical interconnection in flexible sensor and processing technology |
| CN114520080A (en) * | 2022-02-11 | 2022-05-20 | 清华大学 | Method for manufacturing flexible electronic device |
| CN114608638A (en) * | 2022-03-10 | 2022-06-10 | 浙江理工大学 | Packaging method of flexible microelectronic sensor |
| CN114999734A (en) * | 2022-06-07 | 2022-09-02 | 复旦大学 | Flexible metal nanowire film and preparation method thereof |
| CN114964400A (en) * | 2022-06-14 | 2022-08-30 | 南京高华科技股份有限公司 | Flow sensor and manufacturing method thereof |
| CN114964400B (en) * | 2022-06-14 | 2023-06-30 | 南京高华科技股份有限公司 | Flow sensor and manufacturing method thereof |
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