CN109079317A - A kind of processing method and device of transparent material - Google Patents
A kind of processing method and device of transparent material Download PDFInfo
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- CN109079317A CN109079317A CN201811053260.XA CN201811053260A CN109079317A CN 109079317 A CN109079317 A CN 109079317A CN 201811053260 A CN201811053260 A CN 201811053260A CN 109079317 A CN109079317 A CN 109079317A
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- laser
- transparent material
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- green light
- train
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
- B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention discloses a kind of processing method of transparent material and devices, train of pulse seed laser of one wavelength between 1020 nanometers~1090 nanometers is provided, after carrying out energy amplification using fiber amplifier, carry out optical frequency-doubling, obtain the output of green light pulse string, it include at least two laser pulses in each train of pulse, pulse width is less than 10ns, the peak power of pulse is greater than 5KW, it is 120ns that the time between each laser pulse in each train of pulse, which is less than, interval time between train of pulse is greater than 300ns, and each second overall pulse number is greater than 100,000；Wherein, the laser beam of optical fiber laser output carries out energy amplification only with fiber amplifier；The position to be processed that above-mentioned green light is focused on to transparent material the processing to transparent material is realized by mobile focal position.The present invention improves process velocity.
Description
Technical field
The present invention relates to a kind of transparent material processing methods, and in particular to a kind of laser processing side for transparent material
Method.
Background technique
Glass and sapphire transparent material have become indispensable a part in people's daily life, with economy
Development, it is growing day by day to the demand of glassware.In glass and sapphire production industry, glass and sapphire processing
It is a particularly significant link.
In general, glass and sapphire processing (cold working) mainly include polishing, cutting, drilling, engraving, edging etc..
For the purpose that the above-mentioned glass of realization of industrialization and sapphire are processed, the processing method used in the prior art mainly has mechanical add
Work method, chemical processes (be mainly used for polishing and etch), high-pressure water jet processing method (are mainly used for cutting and bore
Hole) and laser processing.In this, laser processing will be far superior in terms of process velocity and the degree of automation
Other methods.
That traditional laser glass and sapphire processing are used is CO of the wavelength near 10.6 μm2Laser, output
Power, which generally requires, reaches 100W or more.CO2Laser processing glass and sapphire are after making glass heated by laser light incident
Occur fracture and realize.By taking the cutting of plate glass as an example, by CO2The laser beam focus that laser issues is to plate glass
On, high-power laser is broken glass the focal position of laser is heated, and crack is to the extension of the upper and lower surface of glass
To complete to cut.During by thermal cutting, it usually needs using quenching mouth by cold water or cool air injection to Cutting Road,
Glass is set to split.This method cutting accuracy is lower, while being difficult to complex figure.
With wavelength, the pulse output free space solid state laser of (green light) carries out glass and sapphire near 532nm
Processing can achieve better processing effect.With traditional CO2Laser is different, and this green (light) laser is by micro-explosion
Mode realizes glass processing.Equally by taking the cutting of plate glass as an example, the coke of green laser can be made by 3D scanning galvanometer
Point moves in the vertical direction, and in the place that laser spot is passed through, the explosion of micron dimension, this microlesion can occur for glass
Superposition is in the vertical direction to realize the higher cutting of precision.
However, above-mentioned this green (light) laser is in terms of glass and sapphire processing, there is also some defects.Firstly,
The solid state laser of free space is simultaneously unstable.This is because the inside of the solid state laser of free space is to pass through reflecting mirror
Piece controls optical path, can then influence the defeated of laser to a certain extent when certain vibration or other interference occurs in external environment
Out.Secondly, existing this free space solid green (light) laser output pulse frequency be can not break through 100KHz (when
When pulse recurrence frequency increases to close to 100KHz or is higher than 100KHz, the width for exporting pulse will be will increase).Which also limits
Realize that the glass of faster speed and sapphire are processed using such green (light) laser.Glass and sapphire laser processing efficiency by
To limitation, process velocity, which is restricted, means that processing cost is relatively high.
Therefore, a kind of new glass processing method is found to realize that the raising of transparent material processing technology is very intentionally
Justice.
Summary of the invention
Goal of the invention of the invention is to provide a kind of processing method of transparent material, to overcome process velocity in the prior art
Limited problem improves the accuracy and speed of laser light absorbent material processing.
Another goal of the invention of the invention is to provide a kind of processing unit (plant) of transparent material for realizing the processing method.
To achieve the above object of the invention, the technical solution adopted by the present invention is that: a kind of processing method of transparent material provides
The laser pulse train of seed laser output is used light by optical fiber laser of one wavelength between 1020 nanometers~1090 nanometers
After fiber amplifier carries out energy amplification, optical frequency-doubling is carried out, green light output is obtained, exports the train of pulse of green light, each train of pulse
In include at least two laser pulses, pulse width is less than 10ns, and the peak power of pulse is greater than 5KW, the phase in each train of pulse
Interval time between adjacent laser pulse is less than 120ns, and the interval time between train of pulse is greater than 300ns, each second overall pulse number
Greater than 100000；Wherein, the laser beam of optical fiber laser output carries out energy amplification only with fiber amplifier；
The position to be processed that above-mentioned green light is focused on to transparent material, by mobile focal position, realization adds transparent material
Work.
In above-mentioned technical proposal, pulse output green laser is passed through again with optical fiber laser of the wavelength near 1 μm
It is obtained after frequency.The train of pulse of green light is exported, includes at least two laser pulses in each train of pulse, pulse width is less than
10ns, the peak power of pulse are greater than 5KW, and the time between each laser pulse in each train of pulse is less than 120ns, train of pulse
Between interval time be greater than 300ns.Make material that the quick-fried of micron dimension (5 ~ 50 microns) occur in first impulse action to material
It is broken, it generates material and removes and increase the temperature of adjacent material.Before the heat of adjacent material is released, the second pulse is reached
And the temperature of adjacent material is further quicklyd increase, then generate more material removals.Third pulse can use front two
The waste heat of a pulse effectively generates more material removals, and so on, this train of pulse can greatly improve material removal effect
Rate.Thermal diffusion needs the time horizon of microsecond, but subsequent pulse is usually reached in or so more than ten nanoseconds.The allusion quotation of train of pulse
The type pulse spacing was more than ten nanoseconds, much smaller than gsec needed for thermal diffusion.Therefore it can be effectively utilized from previous arteries and veins
The waste heat of punching.Laser pulse number in train of pulse can be 2,3,4,5 or even 50.
Each second overall pulse number is greater than 100000；Wherein, the laser beam of optical fiber laser output is put only with optical fiber
Big device carries out energy amplification；This laser system based on optical fiber laser possesses more than the solid state laser of free space
High stability, the spectral region for exporting laser is 510nm~545nm.The transparent material of processing can be building glass, substrate
Glass, reinforcing glass, tempered glass, optical glass, quartz glass, ultra-thin glass, sapphire, crystalline material, semiconductor and modeling
Material, etc..The thickness of transparent material can be 0.005mm to 150mm.
In above-mentioned technical proposal, the seed laser is the semiconductor laser of optical fiber laser or fiber coupling.
In above-mentioned technical proposal, the mobile focal position is realized by scanning galvanometer, and the green light of output shakes through scanning
The position to be processed for focusing on transparent material after mirror by condenser lens makes transparent material that the explosion of micron dimension occur, by sweeping
The position for retouching galvanometer moving focal point makes blow-up point in the superposition of the region of required processing to realize processing.
Alternatively, the mobile focal position is real by the relative position for changing condenser lens and transparent material to be processed
Existing, the green light line focus lens focus of output makes material that the explosion of micron dimension occur, leads to the position to be processed of transparent material
It crosses and moves the optical head including laser and lens, or mobile transparent material to be processed, change focus on transparent material
Position, make blow-up point in the superposition of the region of required processing to realizing processing.
In above-mentioned technical proposal, the processing is one of drilling, cutting, edging and chamfering.
Another goal of the invention to realize the present invention, the technical solution adopted is that, a kind of processing unit (plant) of transparent material, by
Green (light) laser, condenser lens and focus adjustment mechanism composition, the green light pulse string laser are mainly existed by output wavelength
Train of pulse seed laser, multistage or single-stage fiber amplifier, collimator and frequency multiplier between 1020 nanometers~1090 nanometers
Part is constituted, and the output light of train of pulse seed laser is after fiber amplifier amplifies, through frequency doubling device times after being collimated by collimator
Frequency output green light pulse string；The green light line focus lens focus is adopted in the position to be processed of transparent material, the transparent material
It is clamped with mechanical clamp, the mechanical clamp is connected on fixed workbench or mobile platform.
The focus adjustment mechanism includes scanning galvanometer, and the scanning galvanometer is located at green light pulse string laser in the optical path
Output and condenser lens between.
The scanning galvanometer is one of 2-D vibration mirror, 2.5 dimension galvanometers or three-dimensional galvanometer.
Alternatively, the green light pulse string laser and the condenser lens constitute optical head, the focus adjustment mechanism packet
Optical head position adjustment mechanism is included, using plane where transparent material to be processed as X-Y plane, Z axis, should perpendicular to X-Y plane
The saturating complete machine structure of optical head position makes optical head have X-axis, Y-axis, the freedom degree of Z axis translation.
Alternatively, the focus adjustment mechanism includes the platform for placing transparent material to be processed, with transparent material to be processed
Plane where material is X-Y plane, and for Z axis perpendicular to X-Y plane, the focus adjustment mechanism makes the platform have X-axis, Y-axis flat
The freedom degree of shifting has the freedom degree along Z axis relative motion between the condenser lens and the platform.
Due to the above technical solutions, the present invention has the following advantages over the prior art:
1, the present invention in green (light) laser output be train of pulse, make in first impulse action to material material occur micron
The explosion of magnitude (5 ~ 50 microns) generates material and removes and increase the temperature of adjacent material.It is released in the heat of adjacent material
Before putting, the second pulse reaches and further quicklys increase the temperature of adjacent material, then generates more material removals, this arteries and veins
Material removal efficiency can be greatly improved by rushing string mode.
2, green light pulse string laser is carried out using optical fiber laser generation seed laser through fiber amplifier in the present invention
Optical frequency-doubling acquisition is carried out after energy amplification, laser no longer carries out any type of energy amplification after fiber amplifier output, no
The solid for reusing free space, laser is disposably to pass through in frequency-doubling crystal, is not vibrated back and forth, therefore laser output can
With highly stable, thereby ensure that the precision of material processing, be processed to various complex patterns.
3, each second overall pulse number of optical fiber green light pulse string laser output light of the invention is greater than 100000,
Each second overall pulse number is greater than 600000 in most cases, thus ensure that process velocity.
4, when only with condenser lens without using scanning galvanometer, due to using optical fiber laser, the device of the invention
It is lighter, it may be mounted in mobile device.
Detailed description of the invention
Fig. 1 is the structural framing schematic diagram of green light pulse string laser in the embodiment of the present invention；
Fig. 2 is the structural schematic diagram of the embodiment of the present invention one；
Fig. 3 is the structural schematic diagram of the embodiment of the present invention two.
Specific embodiment
The invention will be further described with reference to the accompanying drawings and embodiments:
Embodiment one: a kind of shown in Figure 2, processing unit (plant) of transparent material, by green light pulse string laser, scanning galvanometer,
Condenser lens composition, referring to Fig. 1, the green light pulse string laser mainly by output wavelength 1020 nanometers~1090 nanometers it
Between train of pulse seed laser, multistage or single-stage fiber amplifier, collimator and frequency doubling device constitute, train of pulse seed laser
The output light of device exports green light pulse string through frequency doubling device frequency multiplication after being collimated by collimator after fiber amplifier amplifies；It is described
Green light pulse string is focused on the position to be processed of transparent material after scanning galvanometer by condenser lens.
In the present embodiment, scanning galvanometer is three-dimensional galvanometer, and the repetition rate of green laser is that each second overall pulse number is big
In 300,000, the laser pulse number in train of pulse is 2, and the time between each laser pulse in train of pulse is 15ns, light
Spot diameter is 20 microns.The Duplication of laser facula is 50% in the moving process of green light pulse string, therefore laser is in galvanometer
It is moved forward under drive with the speed of 1.5 meter per seconds.When drilling on transparent material, each rotation generates cutting for tens micron thickness
It cuts.Cutting is promoted by mobile galvanometer, realizes high efficiency drilling.
In the present embodiment, transparent material is fixed on workbench after being clamped by mechanical clamp.
Embodiment two: referring to shown in attached drawing 3, a kind of processing unit (plant) of transparent material by green light pulse string laser, is focused
Lens composition, referring to Fig. 1, the green light pulse string laser is mainly by output wavelength between 1020 nanometers~1090 nanometers
Train of pulse seed laser, multistage or single-stage fiber amplifier, collimator and frequency doubling device are constituted, train of pulse seed laser
Output light exports green light pulse string through frequency doubling device frequency multiplication after being collimated by collimator after fiber amplifier amplifies；The green light
Train of pulse is focused on the position to be processed of transparent material by condenser lens.
In the present embodiment, multi-pulsed laser by lens focus on transparent material, install on the moving belt by lens, passes through shifting
It moves lens and realizes linear cutting.Each second overall pulse number 900,000, the laser pulse number in train of pulse is 3, arteries and veins
The time between each laser pulse in punching string is 15ns, and spot diameter is 20 microns, and Duplication is 40%, and laser is with per second
3.6 meters of speed Forward, laser generate removal in transparent material surface.Realize the high-speed cutting of transparent material.
In the present embodiment, transparent material is fixed on a mobile platform after being clamped by mechanical clamp, can be further changed
The relative position of bright material and optical head.
Claims (10)
1. a kind of processing method of transparent material, it is characterised in that:
Optical fiber laser of the wavelength between 1020 nanometers~1090 nanometers is provided, the laser pulse that seed laser is exported
After string carries out energy amplification using fiber amplifier, optical frequency-doubling is carried out, green light output is obtained, exports the train of pulse of green light, often
It include at least two laser pulses in one train of pulse, pulse width is less than 10ns, and the peak power of pulse is greater than 5KW, each pulse
The interval time between adjacent laser pulse in string is less than 120ns, and the interval time between train of pulse is greater than 300ns, each second
Overall pulse number is greater than 100000；Wherein, the laser beam of optical fiber laser output carries out energy amplification only with fiber amplifier；
The position to be processed that above-mentioned green light is focused on to transparent material, by mobile focal position, realization adds transparent material
Work.
2. the processing method of transparent material according to claim 1, it is characterised in that: the seed laser is optical fiber
The semiconductor laser of laser or fiber coupling.
3. the processing method of transparent material according to claim 1, it is characterised in that: the mobile focal position passes through
Scanning galvanometer realizes that the green light of output is focused on the position to be processed of transparent material by condenser lens after scanning galvanometer, makes material
The explosion of micron dimension occurs for material, by the position of scanning galvanometer moving focal point, is superimposed blow-up point in the region of required processing
To realize processing.
4. the processing method of transparent material according to claim 1, it is characterised in that: the mobile focal position passes through
The relative position for changing condenser lens and transparent material to be processed realizes, the green light line focus lens focus of output to transparent material
The position to be processed of material makes material that the explosion of micron dimension occur, by the mobile optical head including laser and lens, or
Mobile transparent material to be processed changes position of the focus on transparent material, is superimposed blow-up point in the region of required processing
To realize processing.
5. according to claim 1 to the processing method of transparent material described in any claim in 4, it is characterised in that: described
Transparent material is one of glass, crystalline material, semiconductor and plastics；The processing is drilling, cutting, edging and chamfering
One of.
6. a kind of processing unit (plant) of transparent material is made of green (light) laser, condenser lens and focus adjustment mechanism, feature exists
In the main train of pulse seed laser by output wavelength between 1020 nanometers~1090 nanometers of: the green light pulse string laser
Device, multistage or single-stage fiber amplifier, collimator and frequency doubling device are constituted, and the output light of train of pulse seed laser is put through optical fiber
After big device amplification, green light pulse string is exported through frequency doubling device frequency multiplication after being collimated by collimator；The green light line focus lens focus
In the position to be processed of transparent material, the transparent material is clamped using mechanical clamp, and the mechanical clamp is connected to fixed
On workbench or mobile platform.
7. the processing unit (plant) of transparent material according to claim 6, it is characterised in that: the focus adjustment mechanism includes sweeping
Galvanometer is retouched, the scanning galvanometer is located in the optical path between the output and condenser lens of green light pulse string laser.
8. the processing unit (plant) of transparent material according to claim 6, it is characterised in that: the scanning galvanometer is two-dimentional vibration
One of mirror, 2.5 dimension galvanometers or three-dimensional galvanometer.
9. the processing unit (plant) of transparent material according to claim 6, it is characterised in that: the green light pulse string laser and
The condenser lens constitutes optical head, and the focus adjustment mechanism includes optical head position adjustment mechanism, with to be processed transparent
Plane where material is X-Y plane, and for Z axis perpendicular to X-Y plane, the saturating complete machine structure of the optical head position makes optical head have X-axis, Y
The freedom degree that axis, Z axis translate.
10. the processing unit (plant) of transparent material according to claim 6, it is characterised in that: the focus adjustment mechanism includes
The platform for placing transparent material to be processed, using plane where transparent material to be processed as X-Y plane, Z axis is flat perpendicular to X-Y
Face, the freedom degree that the focus adjustment mechanism makes the platform that there is X-axis, Y-axis to translate, the condenser lens and the platform it
Between have along Z axis relative motion freedom degree.
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| CN201811053260.XA CN109079317A (en) | 2018-09-10 | 2018-09-10 | A kind of processing method and device of transparent material |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109926736A (en) * | 2019-04-10 | 2019-06-25 | 英诺激光科技股份有限公司 | A kind of device and method using high frequency nanosecond optical-fiber laser cutting battery pole piece |
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