CN108882076B - Electronic component and glasses - Google Patents

Electronic component and glasses Download PDF

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Publication number
CN108882076B
CN108882076B CN201810975494.3A CN201810975494A CN108882076B CN 108882076 B CN108882076 B CN 108882076B CN 201810975494 A CN201810975494 A CN 201810975494A CN 108882076 B CN108882076 B CN 108882076B
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CN
China
Prior art keywords
sound
cover
hole
microphone
cavity
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Active
Application number
CN201810975494.3A
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Chinese (zh)
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CN108882076A (en
Inventor
王跃强
刘银超
李永坚
张浩锋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Voxtech Co Ltd
Original Assignee
Shenzhen Voxtech Co Ltd
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Application filed by Shenzhen Voxtech Co Ltd filed Critical Shenzhen Voxtech Co Ltd
Priority to CN201810975494.3A priority Critical patent/CN108882076B/en
Publication of CN108882076A publication Critical patent/CN108882076A/en
Application granted granted Critical
Publication of CN108882076B publication Critical patent/CN108882076B/en
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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/08—Mouthpieces; Microphones; Attachments therefor
    • G—PHYSICS
    • G02—OPTICS
    • G02C—SPECTACLES; SUNGLASSES OR GOGGLES INSOFAR AS THEY HAVE THE SAME FEATURES AS SPECTACLES; CONTACT LENSES
    • G02C11/00—Non-optical adjuncts; Attachment thereof
    • G02C11/10—Electronic devices other than hearing aids

Abstract

The application discloses electronic component and glasses, this electronic component includes: the device comprises a first microphone element, a containing body and a cover body, wherein the containing body is provided with a cavity with at least one opening for containing the first microphone element; the lid is located on the opening of cavity, wherein, the lid includes stereoplasm support and integrative soft overburden of moulding plastics on the surface of support, the support is used for carrying out the physics with the holding body and is connected, set up the microphone hole on the support, be provided with the first sound guide hole that corresponds with the microphone hole on the overburden, and be provided with first fender sound piece in the position that corresponds the microphone hole, first fender sound piece extends towards the inside of cavity through the microphone hole, and define a sound guide channel, the one end of sound guide channel communicates with the first sound guide hole on the overburden, first microphone element inserts to the sound guide channel from the other end of sound guide channel. Through the mode, the efficiency of the electronic component for receiving the sound signals can be improved.

Description

Electronic component and glasses
Technical Field
The present disclosure relates to electronic devices, and particularly to an electronic component and glasses.
Background
With the development of technology and the increasing demand of people, many electronic devices have a function of receiving sound signals for processing.
In current electronic devices, a sound guide hole corresponding to a microphone element inside the electronic device is generally provided in a housing, and external sound is introduced into the electronic device through the sound guide hole so as to reach the microphone and be received by the microphone.
However, since the sound guide Kong Wangwang is further spaced from the microphone element, a part of the sound will be lost during the propagation of the external sound after entering the sound guide hole, thereby greatly reducing the efficiency of receiving the sound by the electronic device.
Disclosure of Invention
The technical problem that this application mainly solves is to provide an electronic component and glasses, can improve the efficiency that electronic component received sound signal.
In order to solve the technical problems, one technical scheme adopted by the application is as follows: there is provided an electronic component comprising: a first microphone element; the accommodating body is provided with a cavity with at least one opening and is used for accommodating the first microphone element; the cover body is covered on the opening of the cavity, wherein the cover body comprises a hard support and a soft cover layer integrally injection-molded on the surface of the support, the support is used for being physically connected with the accommodating body, a microphone hole is formed in the support, a first sound guide hole corresponding to the microphone hole is formed in the cover layer, a first sound blocking piece is arranged at the position corresponding to the microphone hole, the first sound blocking piece extends towards the inside of the cavity through the microphone hole and is used for defining a sound guide channel, one end of the sound guide channel is communicated with the first sound guide hole in the cover layer, and a first microphone element is inserted into the sound guide channel from the other end of the sound guide channel.
In order to solve the technical problems, another technical scheme adopted by the application is as follows: there is provided a pair of spectacles comprising a spectacle frame and two spectacle legs comprising a leg body connected to the spectacle frame, at least one of the leg bodies comprising an electronic assembly as described above, wherein the receiving body is at least part of the leg body.
The beneficial effects of this application are: in order to solve the problem, the cover layer of the electronic component is provided with a first sound guide hole and a first sound guide channel which passes through the first microphone hole from the periphery of the first sound guide hole to reach the first microphone element and is wrapped around the periphery of the first microphone element, and the first sound guide channel is arranged so that sound signals entering from the first sound guide hole can directly reach the first microphone element through the first sound guide hole and are received by the first microphone element, so that the loss of the sound signals in the transmission process can be reduced, and the efficiency of the electronic component for receiving the sound signals is improved.
Drawings
FIG. 1 is an exploded view of one embodiment of an electronic assembly of the present application;
FIG. 2 is a partial cross-sectional view of an embodiment of an electronic assembly of the present application;
FIG. 3 is an enlarged view of portion A of FIG. 2;
FIG. 4 is a cross-sectional view of the electronic assembly of the present application taken along the A-A axis of FIG. 1 in a combined state;
FIG. 5 is an enlarged view of portion B of FIG. 4;
FIG. 6 is a partial cross-sectional view of an embodiment of an electronic assembly of the present application;
FIG. 7 is a cross-sectional view of the electronic assembly of the present application taken along the B-B axis of FIG. 1 in a assembled state;
FIG. 8 is a cross-sectional view of the electronic assembly of the present application along the C-C axis of FIG. 1 in a combined state;
FIG. 9 is a schematic view of a state of an embodiment of the glasses of the present application;
FIG. 10 is a schematic view of the structure of another state of an embodiment of the glasses of the present application;
FIG. 11 is a cross-sectional view taken along the D-D axis in FIG. 9;
FIG. 12 is a diagram of the original state of the protective sleeve in one embodiment of the glasses of the present application;
FIG. 13 is a partial cross-sectional view of a protective sleeve in its original state in an embodiment of the glasses of the present application;
FIG. 14 is a bending state diagram of a protective sleeve in an embodiment of the glasses of the present application;
FIG. 15 is a partial cross-sectional view of a bent state of a protective sleeve in an embodiment of the eyeglass of the present application;
FIGS. 16-19 are schematic illustrations of the relevant surfaces of an embodiment of the glasses of the present application;
fig. 20 to 21 are schematic views of distances between related elements in an embodiment of the glasses of the present application.
Detailed Description
Referring to fig. 1 to 3, fig. 1 is an exploded view of an embodiment of an electronic component of the present application, fig. 2 is a partial sectional view of an embodiment of an electronic component of the present application, and fig. 3 is an enlarged view of a portion a in fig. 2.
The electronic component in the present application may be applied to an electronic device, where the electronic device may be any electronic device that needs to seal an internal structure, such as a mobile phone, a tablet computer, glasses with a circuit component, an electronic device, and the like, which is not specifically limited herein.
Specifically, the electronic component includes a housing body 11 and a cover 12. The accommodating body 11 is provided with a cavity 111 having at least one opening 112, and the cover 12 is covered on the opening 112 of the cavity 111 and is used for sealing the cavity 111.
The accommodating body 11 may be at least a part of an electronic device. The housing body 11 in the present embodiment may be specifically configured to house, for example, a circuit board, a battery, and an electronic component in an electronic device, and may be, for example, an entire or a part of a housing of the electronic device.
In addition, the accommodating body 11 is used for accommodating the circuit board, the battery, the electronic component and the like through the cavity 111 with the opening 112. Specifically, the number of the openings 112 may be one or more, which is not limited herein.
The shape of the cover 12 at least partially matches the opening 112, so that the cover 12 is placed over the opening 112 to seal the cavity 111. The material of the cover 12 may be different from or partially the same as that of the accommodating body 11.
In the present embodiment, the cover 12 includes a hard mount 121 and a soft cover 122. Wherein, the support 121 is used for physically connecting with the accommodating body 11, and the cover layer 122 is integrally injection molded on the surface of the support 121, so as to provide sealing for the cavity 111 after the support 121 is connected with the accommodating body 11.
Specifically, the material of the support 121 may be hard plastic, and the material of the cover 122 may be soft silica gel, rubber, etc. The shape of the bracket 121 facing the side of the accommodating body 11 may be matched with the opening 112, so as to be fixed on the opening 112 of the cavity 111 by plugging, buckling, and the like, thereby being physically connected with the accommodating body 11. The physical connection between the hard support 121 and the accommodating body 11 is easy to form a gap to reduce the sealing performance of the cavity 111, and further, the soft cover layer 122 is integrally injection molded to be formed on the outer surface of the support 121 far away from the accommodating body 11, so as to further cover the connection between the support 121 and the accommodating body 11, thereby realizing the sealing of the cavity 111.
In the above manner, the cover 12 includes the hard support 121 and the soft cover 122 integrally injection-molded on the surface of the hard support 121, the support 121 is physically connected with the accommodating body 11, the cover 122 further provides sealing for the cavity 111 after the support 121 is connected with the accommodating body 11, and the soft cover 122 is more beneficial to fitting the gap between the support 121 and the accommodating body 11, so as to further improve the tightness of the electronic component and further improve the waterproof effect of the electronic component. Meanwhile, the bracket 121 and the cover 122 are integrally injection-molded, so that the assembly process of the electronic component can be simplified.
In one embodiment, the bracket 121 includes an insertion portion 1211 and a cover portion 1212, the cover portion 1212 is disposed on the opening 112, and the insertion portion 1211 is disposed on one side of the cover portion 1212 and extends into the cavity 111 along an inner wall of the cavity 111 to fix the cover portion 1212 on the opening 112.
In one application scenario, the insertion portion 1211 may also be inserted without passing through the inner wall of the cavity 111, for example, the interior of the cavity 111 may also be provided with an insertion portion matching the shape of the insertion portion 1211 of the bracket 121, so that the insertion portion 1211 can engage with the insertion portion, fixing the insertion portion inside the cavity 111. For example, the insertion portion 1211 may be in the shape of a cylinder, at which time the insertion portion may be a cylindrical ring capable of surrounding the cylindrical insertion portion, wherein the inner diameter of the insertion portion of the cylindrical ring may be suitably smaller than the outer diameter of the insertion portion of the cylinder, such that the insertion portion 1211 is interference fit with the insertion portion when inserted therein to enable the holder 121 to be stably connected with the cavity 111. Of course, other plugging methods may be adopted as long as the insertion portion 1211 can be inserted into the cavity 111 and fixed to the cavity 111.
The cover 1212 is disposed on a side of the insertion portion 1211 facing away from the cavity 111, and covers the opening 112 after the insertion portion 1211 is inserted into the cavity 111. The cover 1212 may be a complete structure, or may further have holes formed therein as needed, so as to perform a certain function.
With further reference to fig. 4, fig. 4 is a cross-sectional view of the electronic assembly of the present application taken along the A-A axis of fig. 1 in the assembled state. In an embodiment, the accommodating body 11 includes an opening edge 113 for defining the opening 112, the covering portion 1212 is pressed onto an inner area 1131 of the opening edge 113, which is close to the opening 112, and the cover layer 122 is covered on an outer surface of the covering portion 1212, which is far from the accommodating body 11, and is pressed onto an outer area 1132 of the periphery of the inner area 1131 of the opening edge 113, so as to achieve a seal with the opening edge 113.
Wherein, the inner region 1131 and the outer region 1132 of the opening edge 113 both belong to the opening edge 113, and are not other regions than the opening edge 113. Wherein, the inner region 1131 of the opening edge 113 is a region of the opening edge 113 close to the opening 112, and the outer region 1132 of the opening edge 113 is a region of the opening edge 113 away from the opening 112.
In the present embodiment, the covering portion 1212 of the holder 121 is pressed against the inner region 1131 of the opening edge 113 near the opening 112, so that the covering portion 1212 can initially seal the opening edge 113. However, since the housing body 11 and the holder 121 are both made of hard materials, the connection between the two and further covering of the covering portion 1212 cannot achieve a good sealing effect, and a gap is easily generated between the end of the covering portion 1212 which is pressed against the opening edge 113 and is away from the opening 112 and the opening edge 113, and the sealing performance is reduced by the gap penetrating the cavity 111.
Therefore, in the present embodiment, the cover layer 122 is covered on the outer surface of the cover portion 1212 far from the accommodating body 11, and is further pressed on the outer region 1132 of the outer periphery of the inner region 1131 of the opening edge 113, so that the gap generated between the cover portion 1212 of the bracket 121 and the opening edge 113 can be further covered, and the cover layer 122 is made of a soft material, so that the sealing effect of the electronic component can be further improved, and the waterproof performance of the electronic component is better.
Referring to fig. 5, fig. 5 is an enlarged view of a portion B in fig. 4, in an application scenario, in a fastened state of the cover 12, an outer periphery of the cover 1212 covers an inner region 1131 of the opening edge 113 and contacts the inner region 1131 of the opening edge 113; and the cap layer 122 is disposed on a side of the cover portion 1212 remote from the accommodating body 11 such that the cover portion 1212 located at the inner side region 1131 of the opening edge 113 is sandwiched between the inner side region 1131 of the opening edge 113 and the cap layer 122, and the cap layer 122 further extends toward the cover portion 1212 away from the opening 112 and toward the opening edge 113 until contacting the outer side region 1132 of the opening edge 113 such that the contact end surfaces of the cover portion 1212 and the opening edge 113 and the contact end surfaces of the cap layer 122 and the opening edge 113 are disposed flush with each other and form a structure of "opening edge 113-cover portion 1212-cap layer 122" on the inner side region 1131 of the opening edge 113.
In another application scenario, please further refer to fig. 6, fig. 6 is a partial cross-sectional view of an electronic component embodiment of the present application. In this application scenario, after the cap layer 122 extends to contact with the outer side region 1132 of the opening edge 113, it further extends to the inner side region 1131 of the opening edge 113 along the region between the cover portion 1212 and the opening edge 113, and then, the structure of "the opening edge 113-cap layer 122-cover portion 1212-cap layer 122" is formed by pressing the cover portion 1212 onto the inner side region 1131 of the opening edge 113 between the inner side region 1131 of the opening edge 113 and the cover portion 1212. In this application scenario, the soft cover layer 122 further extends between the bracket 121 and the opening edge 113 on the basis of covering the covering portion 1212 of the hard bracket 121, so as to further improve the sealing between the cavity 111 and the cover 12, and further improve the waterproof effect of the electronic component.
Further, in an embodiment, referring to fig. 1 to 4, the electronic component further includes a circuit component 13 disposed in the cavity 111, and the switch 1311 is disposed on the circuit component 13.
Specifically, the circuit assembly 13 may include a first circuit board 131, and the switch 1311 is disposed on an outer side of the first circuit board 131 facing the opening 112 of the cavity 111. The number of the switches 1311 may be one or a plurality. When the number of the switches 1311 is plural, they may be provided on the first circuit board 131 at intervals.
Accordingly, the bracket 121 is provided with a switch hole 1213 corresponding to the switch 1311, the cover layer 122 further covers the switch hole 1213, and a pressing portion 1221 is provided at a position corresponding to the switch hole 1213, the pressing portion 1221 extends toward the inside of the cavity 111 through the switch hole 1213, and when the corresponding position of the cover layer 122 is pressed, the pressing portion 1221 presses against the switch 1311 on the circuit assembly 13, thereby triggering the circuit assembly 13 to perform a predetermined function.
Wherein, the pressing portion 1221 provided on the cover layer 122 is formed by the cover layer 122 protruding toward the switch hole 1213 and the switch 1311 toward one side of the bracket 121, and the shape of the pressing portion 1221 matches with the switch hole 1213, so that the pressing portion 1221 can pass through the switch hole 1213 to reach the corresponding switch 1311 on the first circuit board 131 when the corresponding position of the cover layer 122 is pressed. Meanwhile, the length of the pressing portion 1221 in the direction toward the switch 1311 may be set so that the corresponding switch 1311 is not pressed when the corresponding position of the cap layer 122 is not pressed, but can be pressed when pressed.
In one application scenario, the position on the cover layer 122 corresponding to the pressing portion 1221 further protrudes toward the side facing away from the bracket 121 to form a pressing portion 1222 that is convex, so that the user can clearly switch the position of the 1311, and the circuit component 13 performs a corresponding function by pressing the corresponding pressing portion 1222.
Further, in one embodiment, please further refer to fig. 7, fig. 7 is a sectional view of the electronic component of the present application along the B-B axis in fig. 1 in the assembled state. The electronics assembly includes a first microphone element 1312. Specifically, the first microphone element 1312 may also be disposed on the first circuit board 131 of the circuit assembly 13, so as to be accommodated in the cavity 111. For example, the first microphone element 1312 may be provided on the first circuit board 131 at a distance from the switch 1311 in the above-described embodiment. Specifically, the first microphone element 1312 is configured to receive an acoustic signal from outside the electronic component, and convert the acoustic signal into an electrical signal for analysis.
Accordingly, the support 121 is provided with a microphone hole 1214 corresponding to the first microphone element 1312, the cover layer 122 is provided with a first sound guiding hole 1223 corresponding to the microphone hole 1214, and a first sound blocking member 1224 is disposed at a position corresponding to the microphone hole 1214, the first sound blocking member 1224 extends towards the inside of the cavity 111 through the microphone hole 1214, and defines a sound guiding channel 12241, one end of the sound guiding channel 12241 is communicated with the first sound guiding hole 1223 on the cover layer 122, and the first microphone element 1312 is inserted into the sound guiding channel 12241 from the other end of the sound guiding channel 12241.
Where the electronic assembly further includes the switch 1311 of the above embodiment, the switch hole 1213 and the microphone hole 1214 may be provided at a distance on the holder 121.
Specifically, the first sound guiding hole 1223 is disposed through the cover 122 and corresponds to the position of the first microphone element 1312, and the first sound guiding hole 1223 corresponds to the microphone hole 1214 on the support 121, so as to communicate the first microphone element 1312 with the outside of the electronic component, such that the sound outside the electronic component can be received by the first microphone element 1312 through the first sound guiding hole 1223 and the microphone hole 1214.
The shape of the first sound guiding hole 1223 may be any shape as long as it is capable of inputting sound of the outside of the electronic component. In one application scenario, the first sound guiding hole 1223 is a circular hole with a smaller size, and is disposed in an area of the cover layer 122 corresponding to the microphone hole 1214. The small-sized first sound guiding hole 1223 can reduce communication of the first microphone element 1312 and the like in the electronic component with the outside, thereby improving the sealing property of the electronic component.
Correspondingly, the first sound blocking member 1224 extends from the periphery of the first sound guiding hole 1223 through the microphone hole 1214 from the cover 122 to the periphery of the first microphone element 1312 toward the interior of the cavity 111, thereby forming a sound guiding channel 12241 from the first sound guiding hole 1223 to the first microphone element 1312, so that the sound signal entering the sound guiding hole from the electronic component can directly reach the first microphone element 1312 through the sound guiding channel 12241.
Specifically, the shape of the sound guide passage 12241 in a cross section perpendicular to the length direction thereof may or may not coincide with the shape of the microphone hole 1214 or the first microphone element 1312. In one application scenario, the cross-sectional shapes of the microphone hole 1214 and the first microphone element 1312 in the direction perpendicular to the support 121 and toward the cavity 111 are both square, and the size of the microphone hole 1214 is slightly larger than the peripheral size of the sound guiding channel 12241, and the internal size of the sound guiding channel 12241 is not smaller than the peripheral size of the first microphone element 1312, so that the sound guiding channel 12241 can reach the first microphone element 1312 through the first sound guiding hole 1223 and wrap around the periphery of the first microphone element 1312.
In this way, the cover layer 122 of the electronic component is provided with the first sound guiding hole 1223 and the sound guiding channel 12241 passing through the microphone hole 1214 from the periphery of the first sound guiding hole 1223 to reach the first microphone element 1312 and wrapping around the periphery of the first microphone element 1312, and the sound guiding channel 12241 is configured such that the sound signal entering from the first sound guiding hole 1223 can reach the first microphone element 1312 through the first sound guiding hole 1223 and be received by the first microphone element 1312, so that the leakage of the sound signal in the propagation process can be reduced, and the efficiency of receiving the sound signal by the electronic component is further improved.
In one application scenario, the electronic component further includes a waterproof mesh 14 disposed in the sound guide channel 12241, where the waterproof mesh 14 is abutted against a side of the cover layer 122 facing the microphone element by the first microphone element 1312, and covers the first sound guide hole 1223.
Specifically, the support 121 in the sound guide passage 12241 near the first microphone element 1312 may be protruded to form a convex surface opposite to the first microphone element 1312, so that the waterproof mesh 14 is sandwiched between the first microphone element 1312 and the convex surface, or may be directly adhered to the periphery of the first microphone element 1312, and the specific arrangement is not limited herein.
The waterproof mesh cloth 14 in the present embodiment may have a sound-transmitting effect or the like in addition to further performing a waterproof effect on the first microphone element 1312, so as to avoid adversely affecting the sound receiving effect of the sound receiving region 13121 of the first microphone element 1312.
In one embodiment, the cover 12 is disposed in a strip shape, wherein the main axis of the first sound guiding hole 1223 and the main axis of the sound receiving area 13121 of the first microphone element 1312 are disposed at intervals in the width direction of the cover 12. The main axis of the receiving area 13121 of the first microphone element 1312 refers to the main axis of the receiving area 13121 of the first microphone element 1312 in the width direction of the cover 12, such as the axis n in fig. 7, and the main axis of the first sound guiding hole 1223 is such as the axis m in fig. 7.
It should be noted that, due to the requirement of the circuit assembly 13 itself, the first microphone element 1312 may be disposed at the first position of the first circuit board 131, and when the first sound guiding hole 1223 is disposed, the first sound guiding hole 1223 may be disposed at the second position of the cover 12 due to aesthetic and convenience requirements, in this embodiment, the first position and the second position may not correspond in the width direction of the cover 12, so that the main axis of the first sound guiding hole 1223 and the main axis of the sound receiving area 13121 of the first microphone element 1312 are disposed at intervals in the width direction of the cover 12, and thus the sound input by the first sound guiding hole 1223 may not be able to reach the sound receiving area 13121 of the first microphone element 1312 along a straight line.
Further, in order to guide the sound signal entering from the first sound guiding hole 1223 to the first microphone element 1312, the sound guiding passage 12241 may be provided in a curved shape.
Specifically, in one application scenario, the main axis of the first sound guiding hole 1223 is disposed in the middle of the cover 12 in the width direction of the cover 12.
In this embodiment, the cover 12 may be a part of an outer casing of the electronic device, and in order to meet the overall aesthetic requirement of the electronic device, the first sound guiding hole 1223 may be disposed in the middle of the cover 12 in the width direction, so that the first sound guiding hole 1223 looks more symmetrical, and meets the visual requirement of people.
In this application scenario, the corresponding sound guide channel 12241 may be configured to have a stepped cross section along the axis B-B in fig. 1, so that the sound signal introduced by the first sound guide hole 1223 propagates to the first microphone element 1312 through the stepped sound guide channel 12241 and is received by the first microphone element 1312.
Further, referring to fig. 8, fig. 8 is a cross-sectional view of the electronic assembly of the present application taken along the C-C axis of fig. 1 in a combined state. In one embodiment, the electronic assembly further includes a light emitting element 1313. Specifically, the light emitting element 1313 may be disposed on the first circuit board 131 of the circuit assembly 13 to be accommodated in the cavity 111. For example, the light emitting elements 1313 may be disposed on the first circuit board 131 in a certain arrangement together with the switch 1311 and the first microphone elements 1312 in the above embodiment.
Accordingly, the support 121 is provided with a light emitting hole 1215 corresponding to the light emitting element 1313, the cap layer 122 covers the light emitting hole 1215, and the thickness of the region of the cap layer 122 corresponding to the light emitting hole 1215 is set to allow light generated by the light emitting element 1313 to be transmitted through the cap layer 122.
The light emitting elements 1313 may be light emitting diodes, or the like, the number of the light emitting elements 1313 may be one or more, the number of the light emitting holes 1215 on the bracket 121 may be identical to the number of the light emitting elements 1313, and when the number of the light emitting elements 1313 is plural, different light emitting holes 1215 are corresponding to each other, and thus different signals may be transmitted through different light emitting elements 1313.
In this embodiment, the cover layer 122 can still transmit the light emitted by the light emitting element 1313 to the outside of the electronic component by a certain means when covering the light emitting hole 1215.
Specifically, in one application scenario, the thickness of the whole area or a part of the area of the cover layer 122 corresponding to the light-emitting hole 1215 may be set smaller than the thickness of the area of the cover layer 122 corresponding to the periphery of the light-emitting hole 1215, so that the light emitted by the light-emitting element 1313 can pass through the light-emitting hole 1215 and be further transmitted out by the cover layer 122. Of course, the region of the cover layer 122 covering the light exit hole 1215 may be made light transmissive by other means, which is not particularly limited herein.
In the above manner, the cover layer 122 is further disposed so as to enable the light emitted from the light emitting element 1313 to be transmitted from the cover layer 122 to the outside of the electronic component, on the basis of covering the light emitting hole 1215 of the corresponding light emitting element 1313, so that the light emitting element 1313 can be sealed by the cover layer 122 without affecting the light emitting function of the electronic component, to improve the sealability and waterproof performance of the electronic component.
Specifically, in one embodiment, the support 121 is further provided with a light blocking member 1216 extending toward the inside of the cavity 111 at the periphery of the light emitting hole 1215, and the light blocking member 1216 limits the transmission direction of the light generated by the light emitting element 1313.
The shape of the light emitting hole 1215 may be any shape capable of transmitting the light emitted from the light emitting element 1313, such as a circle, a square, a triangle, or the like, and in this embodiment, the shape of the light emitting hole 1215 is a circle.
Since there is a certain distance between the light emitting element 1313 and the light emitting hole 1215, if no constraint is set, a part of the light emitted by the light emitting element 1313 leaks during the process of reaching the light emitting hole 1215, so that the light cannot be effectively transmitted to the light emitting hole 1215, and the brightness of the light visible from the outside of the electronic component is reduced, so that the signal is inconvenient for the user to receive. In the present embodiment, the light blocking member 1216 is configured to limit the transmission direction of the light generated by the light emitting element 1313, so as to reduce light leakage, thereby improving the brightness of the light emitted from the light emitting hole 1215.
Specifically, the light blocking member 1216 in the present embodiment may be partially or entirely formed by the support 121, for example, the support 121 may extend toward the inside of the cavity 111 along the periphery of the light emitting hole 1215 and enclose the light emitting element 1313, thereby forming a light channel through which light generated by the light emitting element 1313 can directly propagate toward the light emitting hole 1215 along the arrangement direction of the channel; alternatively, the support 121 may not form a light channel, but limit the propagation of light from only one direction or several directions, for example, the support 121 may extend into the cavity 111 from only one side of the light outlet 1215 to form a light blocking member 1216 having one side blocking the light emitting element 1313. Or may further cooperate with other components to limit the propagation of light. For example, the support 121 extends from one side of the light outlet 1215 into the cavity 111 to form a light blocking member 1216 having one side blocking the light emitting element 1313, and the light blocking member 1216 further cooperates with an inner wall of the cavity 111 or other structures of the support 121 to limit the transmission direction of the light generated by the light emitting element 1313 from multiple directions.
In one application scenario, the light emitting element 1313 is disposed on the first circuit board 131 adjacent to the first microphone element 1312, and the corresponding light emitting hole 1215 and the microphone hole 1214 are disposed on the support 121 at intervals, as in the above embodiment, the first sound blocking member 1224 formed by the cover layer 122 and defining a sound guiding channel 12241 is disposed on the periphery of the first microphone element 1312, and the first sound blocking member 1224 is disposed through the microphone hole 1214, so that the first microphone element 1312 is disposed at intervals with the light emitting element 1313 and the microphone hole 1214 and the light emitting hole 1215.
Specifically, in this application scenario, the light blocking member 1216 formed by the support 121 is matched with a side wall of the first sound blocking member 1224, which is close to the light emitting element 1313, and both cooperate to limit the transmission direction of the light generated by the light emitting element 1313.
In another application scenario, the cavity 111 is disposed in a strip shape on a cross section perpendicular to the direction of the opening 112, and correspondingly, the bracket 121 is also inserted into the cavity 111 from the opening 112 through the insertion portion 1211 in a strip shape, so as to form a physical connection with the cavity 111. The insertion portions 1211 are disposed at two sides along the length direction of the bracket 121, so that the light emitting element 1313 is also disposed at two sides along the length direction of the bracket 121 with the corresponding insertion portions 1211 of the bracket 121 to limit light at two sides of the light emitting element 1313, further, in the present application scenario, the light blocking member 1216 is further disposed at one side of the light emitting element 1313 perpendicular to the length direction of the bracket 121, and the side wall of the first sound blocking member 1224 is disposed at the other side of the light emitting element 1313 perpendicular to the length direction of the bracket 121, which may be plate bodies parallel to each other, and further limit the transmission direction of the light generated by the light emitting element 1313 together with the insertion portions 1211 at two sides of the light emitting element 1313.
In an embodiment, the circuit assembly 13 of the electronic assembly includes the first circuit board 131 of the above-mentioned electronic assembly embodiment, and may further include the second circuit board 132, and refer to fig. 1, 4, 7 and 8.
The first circuit board 131 is disposed in the cavity 111 parallel to the opening plane of the opening 112, and a first microphone element 1312 is disposed on a surface of the first circuit board 131 facing the cover 12, which is the same as that of the above embodiment, and will not be described herein.
Wherein the opening plane of the opening 112 refers to a plane tangential to a side of the cavity 111 forming the opening 112 facing the opening 112, as shown by a plane θ shown in fig. 1. It should be noted that the plane θ in fig. 1 is merely to illustrate the opening plane of the opening 112, and is not an element that actually exists.
The second circuit board 132 is disposed in the cavity 111 perpendicular to the first circuit board 131, and a second microphone element 1321 is disposed on a side surface of the second circuit board 132 facing the side wall of the accommodating body 11.
The side wall of the accommodating body 11 is correspondingly provided with a second sound guiding hole 114, and as described in the above-mentioned electronic component embodiment of the present application, the cover layer 122 is provided with a first sound guiding hole 1223 corresponding to the first microphone element 1312 and the microphone hole 1214, where the first microphone element 1312 is used for receiving the sound input through the first sound guiding hole 1223, and the second microphone element 1321 is used for receiving the sound input through the second sound guiding hole 114.
Specifically, the first circuit board 131 is parallel to the opening plane of the opening 112 and is disposed close to the opening 112. Further, the first circuit board 131 may further be provided with the switch 1311, the light emitting element 1313, and the like as described above, and the switch 1311, the light emitting element 1313, the first microphone element 1312, and the like may be disposed on the first circuit board 131 in a certain arrangement, and correspondingly, the switch hole 1213, the light emitting hole 1215, the microphone hole 1214, and the like are respectively disposed on the cover 12 at intervals, so as to transmit signals with the outside of the electronic component through the corresponding holes.
Further, the accommodating body 11 extends from the opening 112 along a direction perpendicular to the opening plane to form a cavity 111 with a certain width, and the second circuit board 132 is parallel to the width direction of the cavity 111 and is disposed perpendicular to the opening plane, so that the second circuit board 132 is disposed perpendicular to the first circuit board 131 in the cavity 111. The second circuit board 132 may further be provided with a main control chip, an antenna, and the like.
In one application scenario, the first microphone element 1312 and the second microphone element 1321 are in line with the user's mouth when the user is using the electronic device.
In this embodiment, the first microphone element 1312 and the second microphone element 1321 are disposed on the two circuit boards respectively, and the two microphone elements receive the sound signals through the first sound guiding hole 1223 and the second sound guiding hole 114 respectively, where one microphone element may be used to collect main sounds such as human voice, and the other microphone element may have a background noise collection function, so as to collect ambient noise conveniently, and the two microphone elements cooperate to perform analysis processing on the received sound signals, so as to play a role in noise reduction and so on, thereby improving the processing quality of the sound signals.
Further, in the above manner, the first circuit board 131 and the second circuit board 132 are disposed in the same cavity 111 in a mutually perpendicular manner, and there is no need to expand the space to place the two circuit boards separately, so that the space utilization of the electronic assembly is improved, and when the electronic assembly is further applied to the electronic device, the space of the electronic device can be saved, so as to facilitate the light and thin of the electronic device.
Specifically, in an application scenario, the opening 112 and the cover 12 are disposed in a corresponding strip shape, the shape of the first circuit board 131 matches the shape of the opening 112, and the width d of the first circuit board 131 1 Not greater than the dimension of the opening plane along the width direction of the opening 112, so that the first circuit board 131 can be accommodated in the cavity 111 at a position close to the opening 112, i.e. the first circuit board 131 is also arranged in a strip shape. Correspondingly, the switch 1311, the light emitting element 1313, and the first microphone element 1312 may be disposed on the first circuit board 131 at intervals along the length direction of the first circuit board 131, that is, the length direction of the cover 12.
The cavity 111 is formed by extending the accommodating body 11 from the opening 112 in a direction perpendicular to the opening plane, and the second circuit board 132 is disposed parallel to the width direction of the cavity 111 and perpendicular to the opening plane, and has a certain size in a direction perpendicular to the first circuit board 131. In this application scenario, the dimension of a side of the second circuit board 132 near the first circuit board 131 may be consistent with the dimension of the first circuit board 131 in the length direction.
Further, in the present application scenario, the dimension of the cavity 111 along the direction perpendicular to the opening plane is larger than the width of the opening plane, and correspondingly, the dimension d of the first circuit board 131 along the width direction of the cover 12 1 Smaller than the dimension d of the second circuit board 132 along the vertical direction of the first circuit board 131 2 The dimensions of the two are identical along the length of the cover 12 such that the area of the first circuit board 131 is smaller than the area of the second circuit board 132.
In an embodiment, the accommodating body 11 is provided with a second sound guiding hole 114 penetrating through a sidewall of the cavity 111, and a second sound blocking member 115 is disposed at a position corresponding to the second sound guiding hole 114, and the second sound blocking member 115 extends toward the inside of the cavity 111 through the second sound guiding hole 114 to limit the transmission direction of sound to the second microphone element 1321.
Specifically, in the present embodiment, the second sound guiding hole 114 corresponding to the second microphone element 1321 is disposed on the accommodating body 11 and penetrates the cavity 111 to communicate the second microphone element 1321 with the outside, so that the second microphone element 1321 can receive the sound signal of the outside.
The second sound blocking member 115 may be made of a hard material or a soft material, for example, the second sound blocking member 115 may be formed by extending the accommodating body 11 from one side of the cavity 111 along the periphery of the second sound guiding hole 114 toward the inside of the cavity 111. In the present embodiment, the second sound blocking member 114 may be formed by extending a soft rubber integrally molded with the accommodating body 11 along the periphery of the second sound guiding hole 114 into the cavity 111 at one side of the cavity 111. In an application scenario, the second sound blocking member 115 may extend along the periphery of the second sound guiding hole 114 toward the interior of the cavity 111 and extend to the second microphone element 1321, and further enclose the sound receiving area of the second microphone element 1321, so as to form a channel connecting the second sound guiding hole 114 and the second microphone element 1321, so that the sound signal input from the outside to the second sound guiding hole 114 directly passes through the channel and is received by the sound receiving area of the second microphone element 1321. In another application scenario, the second sound blocking member 115 may not completely surround the second sound guiding hole 114, but only extend along one side or two sides of the second sound guiding hole 114 to the inside of the cavity 111 and extend to the second microphone element 1321, so as to guide the sound input by the second sound guiding hole 114 to propagate to the second microphone element 1321 and be received by the sound receiving area thereof.
Referring to fig. 9 and 10 in combination, fig. 9 is a schematic structural view of one state of an embodiment of the glasses of the present application, and fig. 10 is a schematic structural view of another state of an embodiment of the glasses of the present application. The glasses in the present embodiment are further provided with a circuit configuration, an electronic device, and the like, as compared with conventional glasses, so that they are electronic devices having other functions.
Specifically, the glasses in the present embodiment include a glasses frame 20, the glasses frame 20 includes a glasses frame 21 and two glasses legs 22, the glasses legs 22 include a glasses leg main body 221 connected to the glasses frame 21, and at least one glasses leg main body 221 includes the electronic component in the electronic component embodiment described above.
Specifically, the eyeglass frame 20 in the present embodiment may be a eyeglass frame such as a near-view mirror, a far-view mirror, a sunglass, a smart glasses, a virtual reality glasses, a holographic glasses, an augmented reality glasses, or the like, which is not limited herein.
The accommodating body 11 in the electronic component is a temple body 221, or a part of the temple body 221. In this embodiment, a cavity 111 is disposed in the temple body 221, for accommodating the circuit component 13 corresponding to the above-mentioned electronic component embodiment, so that the glasses have corresponding functions.
It should be further noted that, when the electronic component is used in the present embodiment, the first circuit board 131 and the second circuit board 132 are disposed in the cavity 111 of the same glasses leg 22 when the electronic component is used for wearing the glasses, for example, may be disposed in a right glasses leg, and may be disposed in a left glasses leg. The cover 12, the corresponding light emitting hole 1215, the key, the first sound guiding hole 1223, and the like are all located on the side of the temple body 221 facing the lower part of the user's head, and the side of the temple body 221 facing the upper part of the user's head may be completely surrounded by the casing of the temple body 221, and the second sound guiding hole 114 is located on the side of the temple body 221 facing the outer side of the user's head.
Other relevant structures, functions, etc. of the electronic component are the same as those of the electronic component embodiment described in the present application, and the relevant details are referred to the electronic component embodiment described in the present application and are not repeated here.
In one embodiment, the temple 22 further includes a connector 23 hinged to the end of the temple body 221 remote from the eyeglass frame 21 by a hinge 231. Further, the glasses further include a functional element 30, and the functional element 30 is disposed on the connecting element 23 to implement a corresponding function by accommodating the circuit assembly 13 and the like in the body 11.
Specifically, in one embodiment, the functional element may be a bone conduction speaker 31. In the present embodiment, the connector 23 is provided so that the bone conduction speaker 31 can be switched between the first relative fixed position and the second relative fixed position with respect to the temple body 221, and is attached to the back surface of the auricle of the user through the attaching surface 311 when the bone conduction speaker 31 is in the first relative fixed position.
Specifically, a first relative fixed position of bone conduction speaker 31 with respect to temple body 221 is shown in fig. 9, and a second relative fixed position with respect to temple body 221 is shown in fig. 10.
Wherein the auricle is a part of the outer ear and is mainly composed of cartilage. In this embodiment, the speaker mechanism is attached to the back surface of the auricle, and bone conduction sound and vibration can be transmitted by the cartilage of the auricle. The loudspeaker mechanism is attached to the back of the auricle, so that the influence on the auditory canal in the process of sound transmission can be reduced while the sound quality is improved.
With further reference to fig. 11, fig. 11 is a cross-sectional view taken along the D-D axis in fig. 9. In one embodiment, the accommodating body 11 of the temple body 221 is located on a side of the temple body 221 near the glasses frame 21, the temple body 221 further includes a rod-shaped member 2211 extending from the accommodating body 11 to the connecting member 23, the rod-shaped member 2211 is provided with a weight-reducing groove 22111, and the cover layer 122 further extends outward from the bracket 121 to cover and seal the weight-reducing groove 22111.
In this embodiment, the temple body 221 is divided into two parts, one part is disposed near the frame and the other part is disposed near the connector 23. One side close to the mirror frame is provided with a containing body 11 for containing corresponding circuit components 13. And the rod-like member adjacent to the connecting member 23 is adapted to be at least partially supported on the user's ear when the user wears the spectacles.
Wherein the weight-reducing groove 22111 may be provided inside the temple body 221 and along the extending direction of the rod-like member 2211, thereby providing the rod-like member 2211 in a partially hollow structure. Therefore, the weight of the whole glasses can be reduced to a certain extent, the whole elasticity of the rod-shaped piece can be improved, and the wearing comfort of a user is improved.
In an embodiment, please refer to fig. 12 to 15 together, wherein fig. 12 is an original state diagram of the protective sleeve in an embodiment of the glasses of the present application, fig. 13 is a partial cross-sectional view of the original state of the protective sleeve in an embodiment of the glasses of the present application, fig. 14 is a bending state diagram of the protective sleeve in an embodiment of the glasses of the present application, and fig. 15 is a partial cross-sectional view of the bending state of the protective sleeve in an embodiment of the glasses of the present application. The glasses may further include a protective sleeve 40 disposed around the hinge 231, the protective sleeve 40 being bendable along with the hinge 231 to protect the hinge 231 and to prevent the user from having a bad experience due to the hinge 231 being clipped to the user's hair when wearing the glasses.
Specifically, the protective sleeve bends with hinge 231 as bone conduction speaker 31 switches between the first and second relative fixed positions.
Specifically, the protection sleeve 40 includes a plurality of annular ridge portions 41 disposed at intervals along the length direction of the protection sleeve 40, and annular connecting portions 42 disposed between the annular ridge portions 41 for connecting two annular ridge portions disposed adjacently, wherein the wall thickness of the annular ridge portions 41 is greater than the wall thickness of the annular connecting portions 42.
The length direction of the protection sleeve 40 is identical to the length direction of the hinge 231, and the protection sleeve 40 may be specifically disposed along the length direction of the hinge 231. The protective sleeve 40 may be made of a soft material, such as soft silicone, rubber, or the like.
The annular ridge 41 may be further formed to protrude outward from the outer side wall of the protection sleeve 40, and the shape of the inner side wall of the protection sleeve 40 corresponding to the annular ridge 41 is not particularly limited herein. For example, the inner side wall may be smooth, or a recess or the like may be provided on the inner side wall corresponding to the annular ridge portion 41.
The annular connecting portion 42 is used for connecting adjacent annular ridge portions 41, and is specifically connected to an edge region of the annular ridge portions 41 near the inside of the protection sleeve 40, so that the annular ridge portions 41 can be disposed in a recessed manner on the outer side wall side of the protection sleeve 40.
Specifically, the number of the annular ridge portion 41 and the annular connecting portion 42 may be set according to actual use, for example, according to the length of the protection sleeve 40, the width of the annular ridge portion 41 and the annular connecting portion 42 themselves in the length direction of the protection sleeve 40, and the like.
Further, the wall thicknesses of the annular ridge portion 41 and the annular connecting portion 42 refer to the thicknesses between the inner side wall and the outer side wall of the protection sleeve 40 corresponding to the annular ridge portion 41 and the annular connecting portion 42, respectively. In the present embodiment, the wall thickness of the annular ridge portion 41 is larger than the wall thickness of the annular connecting portion 42.
As shown in fig. 14 and 15, when the protection sleeve 40 is bent along with the hinge 231, the outer region of the bent shape formed by the protection sleeve 40, the annular ridge portion 41 and the annular connecting portion 42 are in a stretched state, and the inner region of the protection sleeve 40 in a bent state, the annular ridge portion 41 and the annular connecting portion 42 are in a pressed state.
In this embodiment, the thickness of the pipe wall of the annular ridge 41 is greater than that of the annular connecting portion 42, so that the annular ridge 41 is harder than the annular connecting portion 42, and when the protection sleeve 40 is in a bent state, the protection sleeve 40 on the outer side of the bent shape is in a stretched state, and the annular ridge 41 can provide a certain strength support for the protection sleeve 40; meanwhile, the protection sleeve 40 area at one side of the inside in the bending state is extruded, and the annular ridge 41 can bear a certain extrusion force, so that the protection sleeve 40 is protected, the stability of the protection sleeve 40 is improved, and the service life of the protection sleeve 40 is prolonged.
Further, it is noted that the bent shape of the protection sleeve 40 coincides with the state in which the hinge 231 is located. In the present embodiment, the functional element 30 and the temple body 221 can be rotated within a range of 180 ° or less by the hinge 231, that is, the protection sleeve 40 can be folded toward only one side, and one side of the protection sleeve 40 in the length direction can be pressed and the other side can be stretched during the use of the glasses.
In one embodiment, the width of the annular ridge 41 along the length of the protective sleeve 40 toward the outside of the bent shape formed by the protective sleeve 40 when the protective sleeve 40 is in the bent state is greater than the width along the length of the protective sleeve 40 toward the inside of the bent shape.
Wherein, increasing the width of the annular ridge portion 41 in the length direction of the protection sleeve 40 can further improve the strength of the protection sleeve. Meanwhile, in the present embodiment, the initial angle between the functional element 30 and the temple body 221 is smaller than 180 °, and if the annular ridge 41 of the protection sleeve 40 is uniformly disposed, the protection sleeve 40 is pressed in the original state. In the present embodiment, the width of the annular ridge portion 41 facing the outside of the bent shape is large in correspondence with the bent state, so that the length of the side protection sleeve 40 can be enlarged, thereby improving the strength of the protection sleeve 40 and reducing the degree of stretching on the stretching side to some extent when the protection sleeve 40 is bent; meanwhile, the width of the annular ridge portion 41 in the longitudinal direction of the protection sleeve 40 toward the inner side of the bent shape when the protection sleeve 40 is in the bent state is small, and the space of the extruded annular connecting portion 42 in the longitudinal direction of the protection sleeve 40 can be increased, so that extrusion on the extrusion side can be relieved to some extent.
Further, in one application scenario, the width of the annular ridge 41 gradually becomes smaller from the side toward the outer region of the folded shape to the side toward the inner region of the folded shape, so that the width of the side toward the outer region of the folded shape formed by the protective sleeve 40 is larger than the width of the side toward the inner region formed by the folded shape when the protective sleeve 40 is in the folded state.
As will be readily understood, the annular ridge portion 41 is provided around the outer periphery of the protection sleeve 40, with one side corresponding to the tension side and the other side corresponding to the compression side in the length direction of the protection sleeve 40. In the present embodiment, the width of the annular ridge portion 41 gradually decreases from the outer side of the bent shape to the inner side of the bent shape, so that the variation in the width of the annular ridge portion 41 is relatively uniform, and the stability of the protection sleeve 40 can be improved to some extent.
In one embodiment, the annular ridge 41 is provided with a groove 411 on the inner circumferential surface of the inside of the protection sleeve 40 facing the outside of the bent shape formed by the protection sleeve 40 when the protection sleeve 40 is in the bent state.
Specifically, the grooves 411 in the present embodiment are provided in a direction perpendicular to the length direction of the protection sleeve 40, thereby enabling the corresponding annular ridge portions 41 to be stretched appropriately when the protection sleeve 40 is stretched in the length direction.
As described above, in the present embodiment, when the protection sleeve 40 is in the folded state, the protection sleeve 40 facing the outer side region of the folded shape formed by the protection sleeve 40 is in the stretched state, and the groove 411 is further provided on the inner circumferential surface of the protection sleeve 40 corresponding to the corresponding annular ridge 41, so that when the protection sleeve on the side is stretched, the annular ridge 41 corresponding to the groove 411 can be stretched appropriately to bear part of the stretching, thereby reducing the tensile force applied to the protection sleeve on the side, and further protecting the protection sleeve 40.
It is to be noted that the annular ridge portion 41 on the side facing the inside region of the bent shape may not be provided with the groove 41 on the inside wall of the corresponding protection sleeve 40 when the protection sleeve 40 is in the bent state. In one embodiment, the width of the groove 41 in the length direction of the protection sleeve 40 is gradually reduced from the side toward the outside region of the bent shape toward the inside of the bent shape, so that no groove 411 is provided on the inner side wall of the protection sleeve 40 corresponding to the annular ridge portion 41 on the side toward the inside region of the bent shape.
Specifically, the protective tube 40 may be connected with the temple body 221 and the bone conduction speaker 31, which are respectively provided at both sides in the length direction of the protective tube 40. In one application scenario, the protective sleeve 40 is integrally formed with the cover 122 in the cover 12, thereby making the eyewear more closed and integral.
In one embodiment, the functional element is the bone conduction speaker 31, the hinge 231 includes a rotation shaft 2311, and the center point O of the joint surface 311 of the bone conduction speaker 31, the symmetry plane β of the connecting element 23, and the center plane α of the rotation shaft 2311 of the hinge 231 are in the same plane or within a predetermined error range of the opposite plane.
The perpendicular plane α of the rotation axis 2311 of the hinge 231 refers to a plane perpendicular to the axial direction of the rotation axis 2311 of the hinge 231 and symmetrically dividing the rotation axis 2311 of the hinge 231, refer to fig. 16.
The symmetry plane β of the connecting member 23 refers to a plane that symmetrically divides the connecting member 23, that is, the connecting member 23 is symmetrically distributed on two sides of the symmetry plane β of the connecting member 23, refer to fig. 17 specifically.
The predetermined error range can be obtained by combining experience, statistical data of materials, specifications and ear shapes of the connecting piece and the like.
It should be noted that, when the center point of the center plane α of the rotation shaft 2311 of the hinge 231, the symmetry plane β of the connection member 23, and the fitting surface 311 of the bone conduction speaker 31 to which the ear is fitted are in the same plane, the bone conduction speaker 31 connected to the connection member 23 can be directly fitted to the back of the auricle of the user, and when the connection member 23 is deformed, the deformation direction and the movement direction of the bone conduction speaker 31 are consistent and all located in the plane, so that when the above-mentioned surfaces and points are not in the same plane, and when the connection member 23 is deformed elastically, the connection member 23 and the bone conduction speaker 31 are twisted, the bone conduction speaker 31 cannot be fitted to the back of the auricle of the user, thereby reducing the sound/vibration transmission efficiency and further reducing the sound quality of the bone conduction sounding device. Of course, the center point of the median plane α of the rotation shaft 2311 of the hinge 231, the symmetry plane β of the connector 23, and the fitting surface 311 of the bone conduction speaker 31 to the ear may be within a predetermined error range of the relative plane, so that the user will not be excessively affected during the actual use, but it should be noted that, at this time, the fitting effect of the fitting surface 311 of the bone conduction speaker 31 to the back of the auricle of the user may be affected to some extent.
Further, when the bone conduction speaker 31 is in the first relative fixed position with respect to the temple bodies 221, the angle between the horizontal reference plane γ defined by the tops of the two temple bodies 221 and the symmetry plane β of the connector 23 is 65 ° to 85 °.
Wherein the horizontal reference plane γ defined by the tops of the two temple bodies 221 refers to a plane tangential to the tops of the two temple bodies 221 at the same time, and in one application scenario, the plane is further perpendicular to the symmetry plane of the glasses frame 21, as shown in fig. 18 in particular; the symmetry plane β of the connecting piece 23 is the same as that shown in fig. 17 described above, and will not be described again here.
As will be readily appreciated, when the bone conduction speaker 31 is in the first relative fixed position with respect to the temple bodies 221, if the angle between the horizontal reference plane γ defined by the tops of the two temple bodies 221 and the symmetry plane β of the connector 23 is large, the bone conduction speaker 31 will be closer to the outside of the back of the auricle, and if it is too large, it cannot even fit to the auricle; if the included angle is smaller, the included angle is too close to the inner side of the back of the auricle, and even the skull of the head is pressed, so that the comfort of a user is reduced on one hand; on the other hand, the bone conduction speaker is affected to transmit sound/vibration through the ear cartilage, and the sound quality of the bone conduction speaker mechanism is further reduced. When the included angle is within the range of 65-85 degrees, the bone conduction loudspeaker mechanism can be attached to a moderate position on the back of the auricle of the user.
In addition, when the bone conduction speaker 31 is in the first relative fixed position with respect to the temple bodies 221, the included angle between the horizontal reference plane γ defined by the top portions of the two temple bodies 221 and the symmetry plane β of the connecting member 23 may be 70 ° to 82 °, so that the fitting surface 311 of the bone conduction speaker 31 is further close to the auricle back area opposite to the auricle foot position.
Specifically, when the bone conduction speaker 31 is in the first relative fixed position with respect to the temple bodies 221, the angle between the horizontal reference plane γ defined by the top portions of the two temple bodies 221 and the symmetry plane β of the connecting piece 23 may be any angle within the above-mentioned range, such as 70 °, 75 °, 80 °, 82 °, and the like, and is not particularly limited herein.
Further, when the bone conduction speaker 31 is in the first relative fixed position with respect to the temple body 221, the angle between the symmetry plane λ of the eyeglass frame 21 and the symmetry plane β of the connector 23 is 5 ° to 30 °.
The symmetry plane λ of the eyeglass frame 21 is a symmetry plane that symmetrically divides the eyeglass frame 21, as shown in fig. 19. The symmetry plane β of the connecting piece 23 is the same as that shown in fig. 17 described above, and will not be described again here.
The angle between the symmetry plane λ of the glasses frame 21 and the symmetry plane β of the connector 23 is related to the head shape of the user, for example, the angle corresponding to the european and asian population is different. When worn by a user, the bottom surface of the temple body 221 is supported by the user's ear, and the bone conduction speaker 31 is fixed in place by the side surface of the temple body 221 abutting against the side surface of the user's head. Thus, if the angle is large, the front portion of the temple body 221 abuts the head, while the rear portion is away from the head; if the angle is large, the front portion of the temple body 221 is away from the head and the rear portion abuts against the head, and in both cases, the temple body 221 cannot be in good contact with the head, and the bonding surface 311 of the bone conduction speaker 31 is easily separated from the back surface of the auricle, so that the sound quality of the bone conduction speaker 31 is reduced, and the use is inconvenient for the user.
When the bone conduction speaker 31 is at the first relative fixed position with respect to the temple body 221, the angle between the symmetry plane λ of the glasses frame 21 and the symmetry plane β of the connector 23 may be 10 ° to 25 °, specifically, may be 10 °, 15 °, 20 °, 25 °, and the like, which is not limited herein.
Further, referring to fig. 20, the distance h between the center points of the rotation shafts 2311 of the hinges 231 corresponding to the two temples 22 1 May be 90 to 150mm. The distance h 1 Corresponding to the left-right width of the user's head.
As can be easily understood, the two temples 22 are placed on the upper part of the user's ears and clamped on both sides of the head, if the distance h between the center points of the rotation shafts 2311 of the hinges 231 corresponding to the two temples 22 1 If the clamping force of the glasses leg 22 towards the head of the user is relatively small, the situation of 'clamping loose' occurs, so that the glasses leg is easy to loosen from the head of the user, and the bone conduction speaker 31 is deviated from the position corresponding to the back of the auricle; if the angle of adduction is small, the temple 22 will grip the user's head too much, which is likely to cause discomfort to the user.
Wherein, the distance h between the center points of the rotating shafts 2311 of the hinges 231 corresponding to the two temples 22 1 The thickness may be 100 to 130mm, specifically 100mm, 110mm, 120mm, 130mm, etc. It should be noted that the distance h can be selected by different head types of different users 1 A more suitable range of headphones. Distance h of e.g. male version 1 The range of female money can be 115-130 mm, and the range of female money can be 100-115 mm, and the female money can be set to be the middle value of the two ranges, so that the female money is suitable for two crowds at the same time.
Alternatively, with continued reference to fig. 20, the vertical distance h of the line connecting the center of symmetry of the eyeglass frame 21 to the center of the rotation shafts 2311 of the two hinges 231 2 105-170 mm.
It should be noted that the center of symmetry of the eyeglass frame 21 is the midpoint of the bridge of the nose located in the middle of the eyeglass frame 21, and the vertical distance corresponds to the front-to-back length of the user's head.
It will be readily appreciated that if the vertical distance h 2 Larger, the frame 21 may be farther from the eyes of the user when the bonding surface 311 of the bone conduction speaker 31 can be bonded to the back of the auricle, and the earphone glassesWhen the frame 21 is properly worn, the bonding surface 311 of the bone conduction speaker 31 cannot be properly bonded to the back surface of the auricle because it is far from the back surface of the auricle; if the distance is small, when the eyeglass function and the earphone function are used simultaneously, the eyeglass frame 21 and the bone conduction speaker 31 simultaneously grip the head in front of and behind the head of the user, which causes discomfort to the user, or even makes it difficult to use both functions simultaneously when the distance is too small.
Wherein, the vertical distance h of the line connecting the symmetrical center point of the glasses frame 21 to the center point of the rotating shaft 2311 of the two hinges 231 2 The diameter may be 130 to 150mm, and may be 130mm, 140mm, 150mm, or the like. It should be noted that different people can be used to correspond to different distance ranges, for example, distance h of male pattern 2 The range of the female pattern can be 140-160 mm, and the range of the female pattern can be 105-135 mm, and the female pattern can be set to be the middle value of the two ranges, so that the female pattern is suitable for two groups of people at the same time.
Alternatively, referring to fig. 20 and 21 together, the distance h between the center point of the rotation shaft 2311 of each hinge 231 and the center point O of the contact surface 311 of the corresponding bone conduction speaker 31 3 Perpendicular distance h from the line connecting the center of symmetry of the eyeglass frame 21 to the center of the rotation axis 2311 of the two hinges 231 2 Ratio h of (2) 3 /h 2 0.1 to 1.5.
Wherein, the distance h between the center point of the rotation shaft 2311 of each hinge 231 and the center point O of the joint surface 311 of the corresponding bone conduction speaker 31 3 A distance from a center point of the rotation shaft 2311 corresponding to the hinge 231 to a joint between the joint surface 311 and the back of the auricle of the user; and the vertical distance h of the line connecting the symmetrical center point of the eyeglass frame 21 to the center point of the rotation shaft 2311 of the two hinges 231 2 Corresponding to the vertical distance from the front of the user's head to behind the ear. When the vertical distance from the front of the user's head to the back of the ear is constant, if the distance from the center point of the rotation shaft 2311 of the hinge 231 to the joint between the joint surface 311 and the back of the auricle of the user is large, that is, if the above ratio is large, it is explained that the distance from the center point of the rotation shaft 2311 of the hinge 231 to the center point O of the joint surface 311 of the corresponding bone conduction speaker 31 is large, the bone conduction speaker 31 is easily attached to the back of the auricleThe lower part of the surface; on the other hand, when the above ratio is small, it is explained that the distance between the center point of the rotation shaft 2311 of the hinge 231 and the center point O of the bonding surface 311 of the corresponding bone conduction speaker 31 is small, the bone conduction speaker 31 is easily bonded to the upper portion of the back surface of the auricle, and thus the transmission efficiency of the bone conduction speaker 31 to the sound and vibration is affected, and the sound quality is further affected.
Wherein h is 3 /h 2 The ratio may be 0.125-0.35, specifically, for example, 0.125, 0.15, 0.20, 0.25, 0.30, 0.35, etc., and different ratios may be designed according to different requirements of users, which is not limited herein.
Furthermore, the bone conduction sounding devices with different specifications can be set according to the different parameters, so that a user can select according to own head types to meet the use requirements of the user.
The foregoing description is only of embodiments of the present application, and is not intended to limit the scope of the patent application, and all equivalent structures or equivalent processes using the descriptions and the contents of the present application or other related technical fields are included in the scope of the patent application.

Claims (10)

1. An electronic assembly, the electronic assembly comprising:
a first microphone element;
the accommodating body is provided with a cavity with at least one opening and is used for accommodating the first microphone element;
a cover body which is covered on the opening of the cavity body,
the cover body comprises a hard support and a soft cover layer integrally injection-molded on the surface of the support, the support is used for being in physical connection with the accommodating body, a microphone hole is formed in the support, a first sound guide hole corresponding to the microphone hole is formed in the cover layer, a first sound blocking piece is arranged at a position corresponding to the microphone hole, the first sound blocking piece is formed by the cover layer, extends towards the inside of the cavity through the microphone hole and defines a sound guide channel, one end of the sound guide channel is communicated with the first sound guide hole in the cover layer, and the first microphone element is inserted into the sound guide channel from the other end of the sound guide channel; the first sound baffle is directly wrapped on the periphery of the first microphone element.
2. The electronic assembly of claim 1, wherein the cover is provided in a strip shape, wherein a main axis of the first sound guiding hole and a main axis of the sound receiving area of the first microphone element are provided at a distance from each other in a width direction of the cover.
3. The electronic component according to claim 2, wherein a principal axis of the first sound guide hole is provided in a middle portion of the cover in a width direction of the cover.
4. The electronic assembly of claim 2, further comprising a light emitting element disposed within the cavity, wherein the support has a light exit aperture disposed therein corresponding to the light emitting element, wherein the cover layer covers the light exit aperture, and wherein a thickness of the cover layer in a region corresponding to the light exit aperture is configured to allow light generated by the light emitting element to be transmitted therethrough.
5. The electronic component according to claim 4, wherein the holder is further provided with a light blocking member extending toward the inside of the cavity at the periphery of the light exit hole, the light blocking member restricting a transmission direction of light generated by the light emitting element.
6. The electronic assembly of claim 1, further comprising a waterproof mesh disposed within the sound guide channel, the waterproof mesh being held against a side of the cover layer facing the first microphone element by the first microphone element and covering the first sound guide hole.
7. The electronic assembly of claim 1, wherein the bracket includes an insert portion and a cover portion, the cover portion being disposed over the opening, the insert portion being disposed on one side of the cover portion and extending into the cavity along an inner wall of the cavity to secure the cover portion over the opening.
8. The electronic assembly of claim 7, wherein the housing body includes an opening edge defining the opening, the cover is pressed against an inner region of the opening edge proximate the opening, and the cover is pressed against an outer surface of the housing body distal from the opening edge and against an outer region of the periphery of the inner region of the opening edge to effect a seal with the opening edge.
9. Glasses comprising a frame and two legs comprising a leg body connected to the frame, at least one of the leg bodies comprising an electronic assembly according to any of claims 1-8, wherein the housing body is at least part of the leg body.
10. The eyewear of claim 9, wherein the temple further comprises a connector hinged to an end of the temple body remote from the eyewear frame by a hinge;
the glasses further comprise a bone conduction speaker arranged on the connecting piece, wherein the connecting piece is arranged to enable the bone conduction speaker to be switched between a first relative fixed position and a second relative fixed position relative to the glasses leg main body, and can be attached to the back of auricle of a user when the bone conduction speaker is in the first relative fixed position;
the accommodation body of the glasses leg main body is located at one side, close to the glasses frame, of the glasses leg main body, the glasses leg main body further comprises a rod-shaped piece extending from the accommodation body to the connecting piece, a weight-reducing groove is formed in the rod-shaped piece, and the cover layer further extends outwards from the support to cover and seal the weight-reducing groove.
CN201810975494.3A 2018-08-24 2018-08-24 Electronic component and glasses Active CN108882076B (en)

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CN109769167A (en) 2019-01-05 2019-05-17 深圳市韶音科技有限公司 Osteoacusis loudspeaker arrangement
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