CN117369144B - Glasses leg assembly and head-mounted display device - Google Patents
Glasses leg assembly and head-mounted display device Download PDFInfo
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- CN117369144B CN117369144B CN202311671398.7A CN202311671398A CN117369144B CN 117369144 B CN117369144 B CN 117369144B CN 202311671398 A CN202311671398 A CN 202311671398A CN 117369144 B CN117369144 B CN 117369144B
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- key
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- module
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- 239000011521 glass Substances 0.000 title claims abstract description 30
- 238000007789 sealing Methods 0.000 claims abstract description 43
- 239000000178 monomer Substances 0.000 claims abstract description 16
- 238000009434 installation Methods 0.000 claims description 46
- 238000005452 bending Methods 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 6
- 230000008569 process Effects 0.000 claims description 5
- 238000003780 insertion Methods 0.000 claims description 4
- 230000037431 insertion Effects 0.000 claims description 4
- 125000006850 spacer group Chemical group 0.000 claims 2
- 230000005611 electricity Effects 0.000 claims 1
- 238000003825 pressing Methods 0.000 description 20
- 230000003014 reinforcing effect Effects 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 230000005540 biological transmission Effects 0.000 description 5
- 238000013461 design Methods 0.000 description 5
- 239000004744 fabric Substances 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 239000006260 foam Substances 0.000 description 3
- 239000007769 metal material Substances 0.000 description 3
- 239000000741 silica gel Substances 0.000 description 3
- 229910002027 silica gel Inorganic materials 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 230000003993 interaction Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000011900 installation process Methods 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000005236 sound signal Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/01—Head-up displays
- G02B27/017—Head mounted
- G02B27/0176—Head mounted characterised by mechanical features
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/08—Mouthpieces; Microphones; Attachments therefor
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R3/00—Circuits for transducers, loudspeakers or microphones
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/01—Head-up displays
- G02B27/017—Head mounted
- G02B2027/0178—Eyeglass type
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electrophonic Musical Instruments (AREA)
Abstract
The technical scheme of the invention discloses a glasses leg assembly and a head-mounted display device, wherein the glasses leg assembly comprises a glasses leg and a pickup module, the glasses leg comprises a main body part, a mounting cavity is integrally formed in the main body part, the mounting cavity extends along a first direction and penetrates through the end face of the main body part, a mounting opening is formed in the mounting cavity, and a pickup hole is formed in the side wall of the mounting cavity; the pick-up module is arranged in the mounting cavity and comprises a pick-up monomer and a sealing ring, the sealing ring is arranged on one side of the pick-up monomer, which faces the pick-up hole, and after the pick-up module is inserted into the mounting cavity from the mounting hole along the first direction, the pick-up module can move along the second direction and cling to the side wall surface of the mounting cavity, and the sealing ring is adhered to the edge of the pick-up hole; the first direction and the second direction are intersected. The technical scheme of the invention improves the appearance of the glasses leg and realizes the reliable acoustic sealing of the pickup module.
Description
Technical Field
The invention relates to the technical field of intelligent wearing equipment, in particular to a glasses leg assembly and head-mounted display equipment.
Background
The legs of AR glasses are usually mounted with a motherboard, keys, a microphone (pickup), a speaker, a Type-C master, etc. as carriers for functional hardware. The glasses leg of the AR glasses generally has two structural forms, one of which is formed by splicing an inner plastic shell and an outer plastic shell, and the AR glasses leg has the advantages of light weight, easy modeling production and easy assembly of functional hardware. However, the inner and outer shells of the plastic glasses leg are usually assembled by adopting a mode of screws, buckles and glue joint, and the spliced lines of the outer appearance cannot realize the extremely simple appearance of the glasses leg.
The other is an integral temple which has a very simple appearance and good structural strength. When the integrated glasses leg is used for installing functional hardware, a plurality of functional hardware are generally integrated on one functional framework to be assembled into an integral module, and then the integrated glasses leg is directly installed into the glasses leg along a first direction by utilizing an installation opening at the front end of the glasses leg.
The microphone has high requirements on acoustic tightness, and no gap is generally required between the sealing mesh cloth on the lower side of the microphone and the outer shell of the glasses leg. For integral type mirror leg, because the functional module volume of integral type is great, can only adopt the equipment mode of the direct cartridge of unilateral, however this kind of equipment mode, functional skeleton can produce the interference with the inner wall of installation chamber at the in-process that removes along first direction, and the adhesive can cause the influence such as deformation, dislocation to sealed screen cloth, perhaps appear the adhesive inefficacy problem in the friction in-process. Therefore, the functional framework and the sealing mesh cloth cannot be bonded with the inner wall of the mounting cavity by adopting an adhesive, and therefore, the reliable acoustic sealing of the microphone cannot be ensured.
Disclosure of Invention
The main object of the present invention is to propose a temple assembly aimed at improving the appearance of the temple while achieving a reliable acoustic sealing of the pickup module.
The technical scheme of the invention provides a glasses leg assembly, which comprises:
the glasses leg comprises a main body part, wherein an installation cavity is integrally formed in the main body part, extends along a first direction and penetrates through the end face of the main body part, an installation opening is formed in the installation cavity, and a pickup hole is formed in the side wall of the installation cavity; and
the pick-up module is arranged in the mounting cavity and comprises a pick-up monomer and a sealing ring, the sealing ring is arranged on one side of the pick-up monomer, which faces the pick-up hole, and after the pick-up module is inserted into the mounting cavity from the mounting hole along the first direction, the pick-up module can move along the second direction and cling to the side wall surface of the mounting cavity, and the sealing ring is adhered to the edge of the pick-up hole; the first direction and the second direction are intersected.
In an embodiment, the glasses leg assembly further comprises a circuit board, the circuit board is provided with an avoidance hole corresponding to the pickup hole, the pickup monomer is arranged on one side of the avoidance hole away from the pickup hole and is electrically connected with the circuit board, and the sealing ring is arranged on one side of the circuit board close to the pickup hole.
In an embodiment, the pickup module further includes an installation framework attached to a side wall surface of the installation cavity, the installation framework is provided with an embedded hole corresponding to the pickup hole, the circuit board includes a first installation section at least partially embedded in the embedded hole, and the pickup unit is disposed on the first installation section.
In an embodiment, the pickup module further includes a pressure maintaining component, the pressure maintaining component is disposed on the first mounting section and connected to the mounting framework, and the pressure maintaining component is in pressure connection with the pickup unit.
In an embodiment, the pressure maintaining assembly comprises a pressing sheet and a buffer cushion block, wherein the pressing sheet is connected with the installation framework, and the buffer cushion block is clamped between the pressing sheet and the first installation section.
In an embodiment, the mounting skeleton is provided with two limit buckles protruding on one side far away from the pick-up hole, the two limit buckles are respectively arranged on two opposite sides of the embedded hole, a limit slot is formed, and the pressing sheet can be inserted into the limit slot along the first direction.
In an embodiment, the side wall of the mounting cavity is further provided with a key through hole, the glasses leg assembly further comprises a key module mounted on the mounting framework and electrically connected with the circuit board, and the key module is partially exposed in the key through hole.
In an embodiment, the circuit board further includes a second mounting section, a bending section connecting the second mounting section and the first mounting section, the key module is disposed on a side of the second mounting section, which is close to the key via hole, and the bending section extends obliquely from the second mounting section toward the first mounting section and toward a direction close to the pick-up hole.
In an embodiment, the temple assembly further includes a stiffening plate connected to the mounting skeleton, the stiffening plate abutting against a side of the second mounting section remote from the sound pick-up hole;
and/or, the installation framework is provided with an installation hole corresponding to the key through hole, the key module comprises a key monomer, a reset piece and a key shell, the key monomer is arranged on the second installation section, the key shell is partially exposed in the key through hole, and partially penetrates through the installation hole and is movably abutted to the key monomer, and the reset piece is arranged between the key monomer and the key shell.
In one embodiment, the mounting framework is adhered and fixed on the side wall surface of the mounting cavity;
and/or the side wall surface of the mounting cavity is provided with a positioning groove extending along the first direction, the positioning groove is communicated with the mounting opening, the mounting framework is provided with a positioning boss corresponding to the positioning groove, and the positioning boss is embedded into the positioning groove.
In one embodiment, the material of the main body is configured as metal;
and/or the main body part is formed and arranged by adopting an bulging process.
The invention also provides head-mounted display equipment, which comprises the glasses leg assembly.
According to the technical scheme, the main body part is integrally formed, so that the outer surface of the main body part is free of any splicing line, and compared with the method for splicing the left and right shells in the prior art, the novel shell splicing device has a more concise appearance design. On this basis, the pick-up module has less volume as independent module and compare in the integral type functional module that has integrated a plurality of functional module, and the pick-up module can be in the installation intracavity along first direction and second direction and can not interfere with the internal face in installation chamber, also be difficult for receiving bonding material's influence to the pick-up module can adopt the mode of bonding to fix at the installation intracavity, and the sealing washer can bond at the hole edge in pick-up hole, with the gap between sealed pick-up module and the internal face in installation chamber, thereby realized the reliable acoustic seal of pick-up module.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings may be obtained according to the structures shown in these drawings without inventive effort for a person skilled in the art.
FIG. 1 is an exploded view of a temple assembly in accordance with one embodiment of the present invention;
FIG. 2 is a schematic view of the temple structure of FIG. 1;
FIG. 3 is an exploded view of the pickup module and key module of FIG. 1;
FIG. 4 is a schematic diagram of the circuit board in FIG. 1;
FIG. 5 is a cross-sectional view of a pickup module mounted within a temple;
fig. 6 is a cross-sectional view of the key module installed in the temple.
Reference numerals illustrate:
the achievement of the objects, functional features and advantages of the present invention will be further described with reference to the accompanying drawings, in conjunction with the embodiments.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
It should be noted that, if directional indications (such as up, down, left, right, front, and rear … …) are included in the embodiments of the present invention, the directional indications are merely used to explain the relative positional relationship, movement conditions, etc. between the components in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indications are correspondingly changed.
In addition, if there is a description of "first", "second", etc. in the embodiments of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In addition, if the meaning of "and/or" is presented throughout this document, it is intended to include three schemes in parallel, taking "a and/or B" as an example, including a scheme, or B scheme, or a scheme where a and B meet simultaneously. In addition, the technical solutions of the embodiments may be combined with each other, but it is necessary to base that the technical solutions can be realized by those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should be considered to be absent and not within the scope of protection claimed in the present invention.
Referring to fig. 1 to 5, the present invention proposes a temple assembly 10 including a temple 100 and a pickup module 200, wherein the temple 100 includes a main body 110, the main body 110 integrally forms a mounting cavity 111, the mounting cavity 111 extends along a first direction and penetrates an end surface of the main body 110, and is formed with a mounting opening 112, and a pickup hole 113 is provided on a side wall of the mounting cavity 111; the pickup module 200 is arranged in the mounting cavity 111, the pickup module 200 comprises a pickup unit 210 and a sealing ring 220, the sealing ring 220 is arranged on one side of the pickup unit 210 facing the pickup hole 113, and after the pickup module 200 is inserted into the mounting cavity 111 from the mounting port 112 along the first direction, the pickup module 200 can move along the second direction and is abutted against the side wall surface of the mounting cavity 111, and the sealing ring 220 is adhered to the hole edge of the pickup hole 113; the first direction and the second direction are intersected.
Specifically, the temple 100 includes a main body 110 and an end cover 120, where the main body 110 is integrally formed, so that the outer surface of the main body 110 has no splice line, and has a more concise design compared with the prior art in which the left and right housings are spliced. The end cap portion 120 and the main body portion 110 are both made of metal, and the end cap portion 120 may be formed by a metal bulging process. The end cap portion 120 is disposed at the rear end of the body portion 110, and the end cap portion 120 can provide protection against dust, foreign substances or other external substances entering the mounting cavity 111, thereby maintaining the performance and cleanliness of the functional modules inside the temple 100. After the end cover part 120 and the main body part 110 are assembled, the gap between the end cover part 120 and the main body part 110 can be controlled to be small, so that the extremely simple metal appearance is ensured. The overall appearance of the glasses leg 100 has only one unobvious splicing line at the tail, and compared with the method of splicing the left and right shells in the prior art, the glasses leg 100 has a more concise appearance design.
The body 110 has a mounting cavity 111, a mounting opening 112 is formed at a front end of the mounting cavity 111, and a functional module such as the sound pickup module 200 can be mounted in the mounting cavity 111 through the mounting opening 112. The side wall of the mounting cavity 111 is provided with a pickup hole 113, the pickup module 200 is arranged in the mounting cavity 111 at a position corresponding to the pickup hole 113, and sound outside the glasses leg 100 can enter the mounting cavity 111 from the pickup hole 113 and be received by the pickup module 200. The pickup module 200 includes a pickup unit 210 and a sealing ring 220, and the pickup unit 210 is configured to receive sound or sound waves and convert the sound or sound waves into an electrical signal. The sealing ring 220 mainly comprises a mesh cloth layer, a foam layer and a silica gel layer, wherein the sealing ring 220 is provided with a through hole penetrating through the foam layer and the silica gel layer, and the through hole is used as at least part of a transmission channel of an acoustic inlet of the pickup unit 210; the silica gel layer is used as a main sealing main body between the pickup unit 210 and the inner wall surface of the mounting cavity 111, and has certain compressibility; the foam layer plays a role of filling a tiny gap between the pickup unit 210 and the inner wall surface of the mounting cavity 111 to realize an auxiliary sealing effect of final sealing; the mesh cloth layer covers the through holes at least, and provides dust-proof and waterproof protection for the sound inlet holes of the pickup unit 210 and the transmission channels formed by the through holes.
The pickup module 200 has a smaller volume as an independent module than an integrated functional module in which a plurality of functional modules are integrated, and the pickup module 200 can flexibly move in the mounting chamber 111. When the pickup module 200 is installed in the installation cavity 111, the pickup module 200 can be inserted into the installation cavity 111 from the installation port 112 along the first direction, and a certain distance is reserved between the pickup module and the inner wall surface of the installation cavity 111, so that interference between the pickup module 200 and the inner wall surface of the installation cavity 111 in the installation process of the installation cavity 111 is avoided, and the problems of deformation or dislocation of the sealing ring 220 and failure of the bonding material caused by friction or pulling between the bonding material and the sealing ring 220 are avoided. The pickup module 200 can be moved in the second direction and is attached to the side wall surface of the mounting cavity 111 after being mounted in the mounting cavity 111, and the sealing ring 220 is adhered to the hole edge of the pickup hole 113, so that the sealing of the sealing ring 220 to the gap between the pickup module 200 and the inner wall surface of the mounting cavity 111 is completed, the sealing performance of a transmission channel from the pickup hole 113 to the sound inlet hole of the pickup unit 210 is ensured, and thus, the pickup module 200 is reliably acoustically sealed.
According to the technical scheme, the main body 110 is integrally formed, so that the outer surface of the main body 110 is free of any splicing line, and compared with the method for splicing the left shell and the right shell in the prior art, the novel shell splicing device has a more concise appearance design. On this basis, the pickup module 200 has a smaller volume as an independent module than an integrated functional module integrating a plurality of functional modules, and the pickup module 200 can move in the first direction and the second direction within the mounting chamber 111 without interfering with the inner wall surface of the mounting chamber 111, and is also less susceptible to the adhesive material, so that the pickup module 200 can be fixed within the mounting chamber 111 in an adhesive manner, and the sealing ring 220 can be adhered to the hole edge of the pickup hole 113 to seal the gap between the pickup module 200 and the inner wall surface of the mounting chamber 111, thereby achieving reliable acoustic sealing of the pickup module 200.
In an embodiment, the temple assembly 10 further includes a circuit board 300, the circuit board 300 is provided with a pick-up hole 340 corresponding to the pick-up hole 113, the pick-up unit 210 is disposed on a side of the pick-up hole 340 away from the pick-up hole 113 and electrically connected to the circuit board 300, and the sealing ring 220 is disposed on a side of the circuit board 300 close to the pick-up hole 113.
Referring to fig. 3 to 5, the temple assembly 10 further includes a circuit board 300, which may be an FPC (Flexible Printed Circuit, flexible printed circuit board 300) to facilitate stretching, retracting and bending of the circuit board 300 during assembly and to provide mounting locations for electronic components such as the pickup unit 210. The circuit board 300 is provided with the dodge hole 340 corresponding to the position of the pickup hole 113, and the dodge hole 340 forms part of the transmission channel, so that the sound inlet hole of the pickup unit 210 can directly correspond to the Ji Sheyin hole 113. The pickup unit 210 and the sealing ring 220 are separately disposed at opposite sides of the circuit board 300, and the structure thereof is more compact and the installation thereof is more convenient. The pickup unit 210 is mounted at one side of the avoidance hole 340 far away from the pickup hole 113, so that the pickup unit 210 can be effectively electrically connected with the circuit board 300 for transmitting audio signals and the like, so as to achieve capturing and transmitting functions of sound. The sealing ring 220 is provided at one side of the circuit board 300 near the sound pickup hole 113, and ensures effective sealing of the sound pickup module 200, thereby preventing interference of external environments and improving quality and accuracy of audio collection.
In an embodiment, the pickup module 200 further includes a mounting skeleton 230 abutting against a side wall surface of the mounting cavity 111, the mounting skeleton 230 is provided with an insertion hole 231 corresponding to the pickup hole 113, the circuit board 300 includes a first mounting section 310 at least partially inserted into the insertion hole 231, and the pickup unit 210 is disposed on the first mounting section 310.
Referring to fig. 3 to 5, the pickup module 200 further includes a mounting frame 230, and the presence of the mounting frame 230 increases the overall strength of the pickup module 200, so that the pickup module 200 can be more conveniently mounted in the mounting cavity 111. The mounting frame 230 is attached to a side wall surface of the mounting chamber 111 provided with the sound pickup hole 113, and the fitting hole 231 is provided corresponding to the sound pickup hole 113 and communicates with the sound pickup hole 113. The first mounting section 310 is used for mounting and supporting the pickup unit 210, and the pickup unit 210 is embedded in the embedding hole 231 through the first mounting section 310, so that the mounting stability of the pickup unit 210 is ensured, and the pickup unit 210 is ensured to be mounted at a correct position.
In an embodiment, the pickup module 200 further includes a pressure maintaining component, where the pressure maintaining component is disposed on the first mounting section 310 and is connected to the mounting frame 230, and the pressure maintaining component is pressed against the pickup unit 210.
Referring to fig. 3 to 5, the pickup module 200 further includes a pressure maintaining component, where the pressure maintaining component is disposed on the first mounting section 310 and is connected to the mounting frame 230, and the pressure maintaining component can apply pressure to the pickup unit 210 to achieve pressure maintaining on the upper portion of the pickup unit 210, thereby further ensuring reliable acoustic sealing of the pickup module 200. The pressure maintaining component can adopt a stacking structure to fixedly maintain the pressure of the pickup unit 210, and can directly maintain the pressure of the pickup unit 210 through the pressing sheet 240; pressure maintaining can also be performed on the pickup unit 210 through the reinforcing plate 350 on the circuit board 300; the pickup unit 210 may also be pressurized by screw-locking the first mounting section 310.
In one embodiment, the pressure maintaining assembly includes a pressing piece 240 and a buffer pad 250, wherein the pressing piece 240 is connected to the mounting frame 230, and the buffer pad 250 is clamped between the pressing piece 240 and the first mounting section 310.
Referring to fig. 3 to 5, the pressure maintaining assembly includes a pressing sheet 240 and a cushion block 250. The connection of the press sheet 240 to the mounting backbone 230 ensures a cooperation of the pressure maintaining assembly with the mounting backbone 230. Under the action of the pressing sheet 240, the cushion pad 250 compresses and deforms to transfer pressure to the pickup unit 210, so that the pressure maintaining on the upper part of the pickup unit 210 is completed, and further, the sound sealing of the pickup module 200 is realized reliably. In addition, the buffer pad 250 is interposed between the pressing piece 240 and the first mounting section 310, and also can effectively reduce the influence of external impact and vibration on the pickup unit 210, thereby improving the quality and stability of audio capture.
In an embodiment, the mounting skeleton 230 is provided with two limit buckles 232 protruding from one side far away from the pick-up hole 113, the two limit buckles 232 are respectively arranged on two opposite sides of the embedded hole 231, and are provided with limit slots 233, and the pressing sheet 240 can be inserted into the limit slots 233 along the first direction.
Referring to fig. 3 to 5, by providing two limit buckles 232 to form a limit slot 233 into which the pressing piece 240 is inserted, accuracy and stability of mounting the pressing piece 240 are increased. The pressing piece 240 has a structure matched with the limit slot 233, the pressing piece 240 can be easily inserted into the limit slot 233 along the first direction, and the middle part of the pressing piece 240 is pressed against the buffer cushion block 250 so as to maintain the pressure of the pickup unit 210 along the second direction; the two ends of the pressing piece 240 are respectively abutted against the groove walls of the limiting groove 233, so that the pressing piece 240 is prevented from being ejected out along the direction opposite to the second direction, and firm connection between the pressure maintaining assembly and the installation framework 230 is ensured.
In an embodiment, the sidewall of the mounting cavity 111 is further provided with a key via 114, and the temple assembly 10 further includes a key module 400 mounted on the mounting skeleton 230 and electrically connected to the circuit board 300, and a portion of the key module 400 is exposed in the key via 114.
Referring to fig. 3 and 6, a key via 114 is further disposed on a side wall of the mounting cavity 111, and the key via 114 and the pickup hole 113 are disposed on the same side wall of the mounting cavity 111. The key module 400 is installed on the installation framework 230, so that the installation of the key module 400 and the pickup module 200 is more compact, the occupied space is reduced, and more space is saved for the assembly of other functional modules in the installation cavity 111. The presence of the key module 400 provides the user with convenient control options. The user may interact with the head mounted display device through the key module 400 to perform specific functions such as switching modes, adjusting audio settings, or activating other operations. The electrical connection of the key module 400 to the circuit board 300 ensures the transmission and execution of control commands. The design of the portion of the key module 400 exposed at the key via 114 ensures that the user has direct access to the key module 400.
In addition, the key module 400 and the pickup module 200 are integrated on the same circuit board 300, and meanwhile, the circuit board 300 is installed inside the installation cavity 111 by means of the installation framework 230, so that not only is the acoustic sealing of the pickup module 200 in the installation cavity 111 realized, but also the internal structure of the installation cavity 111 is simplified. Moreover, based on such a structure, the key module 400, the pickup module 200 and the circuit board 300 can be directly installed into the installation cavity 111 together from the installation port 112, and only the key via 114 and the pickup hole 113 are required to be formed in the main body 110, thereby maximally ensuring the integrity of the appearance of the main body 110.
In an embodiment, the circuit board 300 further includes a second mounting section 320, a bending section 330 connecting the second mounting section 320 and the first mounting section 310, the key module 400 is disposed on a side of the second mounting section 320 near the key via 114, and the bending section 330 extends obliquely in a direction from the second mounting section 320 toward the first mounting section 310 toward the pick-up hole 113.
Referring to fig. 4, the circuit board 300 includes a first mounting section 310, a bending section 330 and a second mounting section 320, and the bending section 330 is disposed between the first mounting section 310 and the second mounting section 320. The key module 400 is disposed on a side of the second mounting section 320 near the key via 114, so that a user can directly operate the key module 400 through the key via 114. The second mounting section 320 is higher than the first mounting section 310, the bending section 330 extends obliquely from the second mounting section 320 toward the first mounting section 310 toward the direction close to the pick-up hole 113, and the bending section 330 can play a role of pressing the first mounting section 310 to promote sealing of the pick-up unit 210. Moreover, due to the presence of the bending section 330, the first mounting section 310 is not easily moved to be dislocated under external vibration.
In an embodiment, the temple assembly 10 further includes a reinforcing plate 350 connected to the mounting skeleton 230, and the reinforcing plate 350 abuts against a side of the second mounting segment 320 away from the pickup hole 113.
Referring to fig. 3 and 6, the reinforcing plate 350 is connected to the mounting frame 230 through a fastener to lock the second mounting section 320 to the mounting frame 230, so as to enhance the strength of the second mounting section 320 on the one hand and avoid damaging the structure of the circuit board 300 when the key module 400 is pressed; on the other hand, the second mounting section 320 may be fixed on the mounting frame 230, which increases the stability of the connection between the circuit board 300 and the mounting frame 230, and prevents the circuit board 300 from shaking or dislocating. Further, the reinforcing plate 350 and the circuit board 300 are integrally formed, so that the reinforcing plate 350 is more convenient to install, and the fixing effect of the reinforcing plate 350 and the second mounting section 320 is better.
In an embodiment, the mounting skeleton 230 is provided with a mounting hole 234 corresponding to the key through hole 114, the second mounting section 320 is correspondingly provided with the mounting hole 234, the key module 400 includes a key unit 410, a reset member 420 and a key housing 430, the key unit 410 is provided with the second mounting section 320, the key housing 430 is partially exposed at the key through hole 114, and partially penetrates through the mounting hole 234 and movably abuts against the key unit 410, and the reset member 420 is provided between the key unit 410 and the key housing 430.
Referring to fig. 3 and 6, the mounting frame 230 is provided with a mounting hole 234 corresponding to the key via 114, and the mounting hole 234 is communicated with the key via 114. The second mounting section 320 is used for mounting and supporting the key unit 410, and the key unit 410 is disposed in the mounting hole 234 through the second mounting section 320, so as to ensure the stability of the mounting of the key unit 410 and ensure that the key unit 410 can be mounted at a correct position. The mounting holes 234 ensure a secure mounting of the second mounting section 320 and the key module 400 and enable interaction of the key module 400 with the second mounting section 320. The key module 400 includes a key unit 410, a reset member 420, and a key housing 430. The key unit 410 is disposed in the second mounting section 320, and interaction between the key module 400 and other functional modules can be achieved through the circuit board 300, so that functions can be adjusted and controlled through the key module 400. A portion of the key housing 430 is exposed above the key through hole 114, and a portion passes through the mounting hole 234 and is movably abutted against the key unit 410, so that a user can easily touch and press the key housing 430 to achieve a specific function or operation. The position of the reset element 420 is located between the key unit 410 and the key housing 430, and after the user presses the key housing 430, the reset element 420 can help the key housing 430 to restore to its original position, ready for the next operation.
In one embodiment, the mounting backbone 230 is adhesively secured to the sidewall surface of the mounting cavity 111.
Referring to fig. 5, the mounting frame 230 is adhered and fixed on the side wall surface of the mounting cavity 111, so that the mounting frame can be effectively prevented from loosening or moving during use, and the sound pickup module 200 is firmly mounted in the mounting cavity 111, so that the accuracy and the sound pickup performance of the sound pickup module 200 are maintained. In addition, the mounting frame 230 is adhesively fixed to the side wall surface of the mounting chamber 111, and the adhesive seals the gap between the mounting frame 230 and the side wall surface of the mounting chamber 111, ensuring the acoustic sealing of the sound pickup module 200.
In an embodiment, a positioning groove 115 extending along the first direction is provided on a side wall surface of the mounting cavity 111, the positioning groove 115 is communicated with the mounting opening 112, a positioning boss 235 is provided on the mounting skeleton 230 corresponding to the positioning groove 115, and the positioning boss 235 is embedded into the positioning groove 115.
Referring to fig. 1 and 2, a positioning groove 115 extending along a first direction is provided on a side wall surface of the mounting cavity 111, and the positioning groove 115 is in communication with the mounting opening 112, so as to provide accurate positioning for mounting the mounting skeleton 230. The mounting frame 230 is provided with a positioning boss 235 corresponding to the positioning groove 115, and the positioning boss 235 is embedded into the positioning groove 115, so that the mounting frame 230 can be accurately and stably mounted at an accurate position, thereby ensuring the correct mounting of the pickup module 200.
In one embodiment, the material of the main body 110 is configured as metal; and/or the body portion 110 is formed using an bulging process.
The metal material has good durability and can withstand long-term use and environmental impact; electromagnetic interference shielding can be provided, so that stable operation of electronic components in the equipment is facilitated; the metallic temples 100 may also provide a better tactile experience. The body portion 110 is manufactured using an bulging process forming arrangement. This manufacturing process allows the shape and size of the body 110 to be precisely controlled by heating and shape-changing a metal material, and the shape having a complex curved surface is formed at one time to achieve a simple appearance of the temples 100; the structural strength of the metal material can be enhanced, and the durability of the equipment is improved.
The invention also provides a head-mounted display device, which comprises the glasses leg assembly 10, wherein the specific structure of the glasses leg assembly 10 refers to the embodiment, and the head-mounted display device adopts all the technical schemes of all the embodiments, so that the head-mounted display device at least has all the beneficial effects brought by the technical schemes of the embodiments, and the detailed description is omitted.
The foregoing description is only of the optional embodiments of the present invention, and is not intended to limit the scope of the invention, and all equivalent structural modifications made by the present description and accompanying drawings or direct/indirect application in other related technical fields are included in the scope of the present invention.
Claims (11)
1. A temple assembly, the temple assembly comprising:
the glasses leg comprises a main body part, wherein an installation cavity is integrally formed in the main body part, extends along a first direction and penetrates through the end face of the main body part, an installation opening is formed in the installation cavity, and a pickup hole is formed in the side wall of the installation cavity; and
the pick-up module is arranged in the mounting cavity and comprises a pick-up monomer and a sealing ring, the sealing ring is arranged on one side of the pick-up monomer, which faces the pick-up hole, and after the pick-up module is inserted into the mounting cavity from the mounting hole along the first direction, the pick-up module can move along the second direction and cling to the side wall surface of the mounting cavity, and the sealing ring is adhered to the edge of the pick-up hole; the first direction and the second direction are intersected;
the circuit board, the circuit board corresponds the pickup hole is equipped with dodges the hole, the pickup monomer is located the circuit board, and locates dodge the hole keep away from one side in pickup hole, and with the circuit board electricity is connected, the sealing washer is located the circuit board be close to one side in pickup hole.
2. The temple assembly of claim 1 wherein said pickup module further includes a mounting skeleton disposed against a side wall surface of said mounting cavity, said mounting skeleton having an insertion aperture corresponding to said pickup aperture, said circuit board including a first mounting section at least partially inserted into said insertion aperture, said pickup element being disposed in said first mounting section.
3. The temple assembly of claim 2 wherein said pickup module further includes a dwell assembly, said dwell assembly being disposed in said first mounting section and connected to said mounting frame, and said dwell assembly being crimped to said pickup cells.
4. The temple assembly of claim 3 wherein said dwell assembly includes a press tab and a buffer spacer, said press tab being connected to said mounting frame, said buffer spacer being sandwiched between said press tab and said first mounting segment.
5. The temple assembly of claim 4 wherein said mounting skeleton is provided with two limit tabs projecting from a side thereof remote from said sound pick-up opening, said two limit tabs being provided on opposite sides of said mounting opening and defining a limit slot, said press tab being insertable into said limit slot in said first direction.
6. The temple assembly of claim 2 wherein the side wall of the mounting cavity is further provided with a key via, the temple assembly further comprising a key module mounted to the mounting skeleton and electrically connected to the circuit board, the key module portion exposed at the key via.
7. The temple assembly of claim 6 wherein said circuit board further includes a second mounting section, a bending section connecting said second mounting section and said first mounting section, said key module being disposed on a side of said second mounting section adjacent said key via, said bending section extending obliquely in a direction from said second mounting section toward said first mounting section toward a direction adjacent said pickup aperture.
8. The temple assembly of claim 7 further comprising a stiffening plate connected to said mounting skeleton, said stiffening plate abutting a side of said second mounting segment remote from said sound pick-up aperture;
and/or, the installation framework is provided with an installation hole corresponding to the key through hole, the key module comprises a key monomer, a reset piece and a key shell, the key monomer is arranged on the second installation section, the key shell is partially exposed in the key through hole, and partially penetrates through the installation hole and is movably abutted to the key monomer, and the reset piece is arranged between the key monomer and the key shell.
9. The temple assembly of claim 2 wherein said mounting skeleton is adhesively secured to a side wall surface of said mounting cavity;
and/or the side wall surface of the mounting cavity is provided with a positioning groove extending along the first direction, the positioning groove is communicated with the mounting opening, the mounting framework is provided with a positioning boss corresponding to the positioning groove, and the positioning boss is embedded into the positioning groove.
10. The temple assembly of claim 1 wherein said body portion is configured from a metal;
and/or the main body part is formed and arranged by adopting an bulging process.
11. A head mounted display device comprising a temple assembly according to any one of claims 1-10.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311671398.7A CN117369144B (en) | 2023-12-07 | 2023-12-07 | Glasses leg assembly and head-mounted display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311671398.7A CN117369144B (en) | 2023-12-07 | 2023-12-07 | Glasses leg assembly and head-mounted display device |
Publications (2)
| Publication Number | Publication Date |
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| CN117369144A CN117369144A (en) | 2024-01-09 |
| CN117369144B true CN117369144B (en) | 2024-04-09 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311671398.7A Active CN117369144B (en) | 2023-12-07 | 2023-12-07 | Glasses leg assembly and head-mounted display device |
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| CN (1) | CN117369144B (en) |
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| CN115695620A (en) * | 2021-07-22 | 2023-02-03 | 所乐思(深圳)科技有限公司 | Intelligent glasses and control method and system thereof |
| CN219778041U (en) * | 2023-03-17 | 2023-09-29 | 潍坊歌尔电子有限公司 | AR glasses |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US11402668B2 (en) * | 2017-09-25 | 2022-08-02 | Mitsui Chemicals, Inc. | Frame component, temple, frame, and eyewear |
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| CN208672931U (en) * | 2018-06-11 | 2019-03-29 | 北京佳珥医学科技有限公司 | Temple and multi-functional glasses |
| CN108882076A (en) * | 2018-08-24 | 2018-11-23 | 深圳市韶音科技有限公司 | A kind of electronic building brick and glasses |
| CN109407347A (en) * | 2018-11-30 | 2019-03-01 | 歌尔科技有限公司 | Intelligent glasses |
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| CN219778041U (en) * | 2023-03-17 | 2023-09-29 | 潍坊歌尔电子有限公司 | AR glasses |
Also Published As
| Publication number | Publication date |
|---|---|
| CN117369144A (en) | 2024-01-09 |
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