CN108407281A - A kind of method of the encapsulation of Fused Deposition Modeling 3D printing technique noncontact IC chip and induction antenna - Google Patents
A kind of method of the encapsulation of Fused Deposition Modeling 3D printing technique noncontact IC chip and induction antenna Download PDFInfo
- Publication number
- CN108407281A CN108407281A CN201810170176.XA CN201810170176A CN108407281A CN 108407281 A CN108407281 A CN 108407281A CN 201810170176 A CN201810170176 A CN 201810170176A CN 108407281 A CN108407281 A CN 108407281A
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- Prior art keywords
- chip
- induction antenna
- card
- noncontact
- fused deposition
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- 238000000034 method Methods 0.000 title claims abstract description 40
- 230000006698 induction Effects 0.000 title claims abstract description 36
- 238000010146 3D printing Methods 0.000 title claims abstract description 15
- 230000008021 deposition Effects 0.000 title claims abstract description 15
- 238000005538 encapsulation Methods 0.000 title claims abstract description 12
- 238000007639 printing Methods 0.000 claims abstract description 9
- 238000004806 packaging method and process Methods 0.000 claims abstract description 8
- 238000005516 engineering process Methods 0.000 claims description 15
- 239000000463 material Substances 0.000 claims description 13
- 238000013461 design Methods 0.000 claims description 4
- 239000002390 adhesive tape Substances 0.000 claims description 3
- 229920001971 elastomer Polymers 0.000 claims description 3
- 239000004626 polylactic acid Substances 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 239000004433 Thermoplastic polyurethane Substances 0.000 claims description 2
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- 229920000747 poly(lactic acid) Polymers 0.000 claims description 2
- 229920002803 thermoplastic polyurethane Polymers 0.000 claims description 2
- 239000000806 elastomer Substances 0.000 claims 1
- 230000003796 beauty Effects 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 description 9
- 238000009740 moulding (composite fabrication) Methods 0.000 description 3
- 238000000465 moulding Methods 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 125000000174 L-prolyl group Chemical group [H]N1C([H])([H])C([H])([H])C([H])([H])[C@@]1([H])C(*)=O 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003225 polyurethane elastomer Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000010099 solid forming Methods 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/10—Processes of additive manufacturing
- B29C64/106—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material
- B29C64/118—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using filamentary material being melted, e.g. fused deposition modelling [FDM]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y10/00—Processes of additive manufacturing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y70/00—Materials specially adapted for additive manufacturing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Optics & Photonics (AREA)
Abstract
The present invention devises a kind of method of the encapsulation of Fused Deposition Modeling 3D printing technique noncontact IC chip and induction antenna.The time-out printing process when FDM printers are formed into suitable cross section will connect intact IC chip and after induction antenna be fixed on the cross section, then start subsequent print procedure, completed until model prints.IC chip and induction antenna can be encapsulated in three-dimensional stereo model, is obtained " three-dimensional IC card " by the packaging method.Compared with the standard card chip IC card that conventional packaging method obtains, this method obtains " three-dimensional IC card " pattern beauty, unique outlook, and can be realized and be customized according to the different appearance demand of user, significantly reduces cost that is personalized, customizing.The non-contact radio-frequencies IC card such as public transport, subway all-purpose card, all-in-one campus card, access card in daily life can be shaped by the packaging method, have significant economic benefit.
Description
Technical field
The present invention relates to a kind of Fused Deposition Modeling (Fused Deposition Modeling, FDM) 3D printing technique envelopes
The method for filling noncontact IC chip and induction antenna.
Background technology
3D printing is novel rapid prototyping ＆ manufacturing technology (RP).It is the rapid shaping skill with accumulation method implementation model
Art is an important breakthrough of manufacturing technology field.It can overcome the special construction obstacle that traditional processing cannot achieve, Ke Yishi
The simplification production of incumbent meaning complex components, can it is automatic, directly, accurately by design philosophy from CAD model, be converted into
Mock-up with certain function or device.Fused Deposition Modeling (FDM) technology is that the prominent of 3D printing technique represents, and is passed through
The principle that thermoplastic silk material is superimposed by heating nozzle with Layered manufacturing, successively shapes three-dimension object, is particularly suitable for prototype
Exploitation and culture, consumer product area customization manufacture.
Non-contact radio-frequency IC card, commonly used mass transit card, the mess card in campus, cell exactly in our daily lifes
Access card etc..It is made of IC chip, induction antenna, is encapsulated in the PVC card piece of a standard, is recent years in the world
The new technology to grow up, it successfully combines Radio Frequency Identification Technology and IC card technology, finishes passive (in card
Non-transformer) and contact-free this problem, it is a quantum jump of field of electronic devices.Card (is usually less than in certain distance range
5cm) close to reader surface, the read-write operation of data is completed by the transmission of radio wave.Non-contact radio-frequency IC technologies
Birth bring great convenience to the production and living of people, kernel component IC chip and induction antenna are encapsulated in standard
Although this packing forms are simply and easy to carry in PVC card piece, it be easy to cause card surface wear and card in use
Piece is lost.With the development of economy, the income of people constantly increases, and the demand to personalized customization commodity is continuously increased, mark
The packing forms such as the accurate special-shaped card of PVC card piece and appearance all cannot be satisfied the demand of consumer personalization's customization.
Invention content
For the above content, it is necessary to propose that a kind of use Fused Deposition Modeling (FDM) technology prints personalized, fixed
The three-dimension object of inhibition and generation encapsulates noncontact IC chip and induction antenna as shell, to meet the needs of consumer personalization.
A kind of Fused Deposition Modeling (Fused Deposition Modeling, FDM) 3D printing technique encapsulation is contactless
The method of IC chip and induction antenna should have following device, which includes computer, FDM printers, thermoplasticity silk material, just
The IC chip and induction antenna often to work.
The packaging method includes the following steps：
(1) requirement of the personalization, customization that are provided according to user makes three-dimensional mould in Computerized three-dimensional graphics software
Type；
(2) threedimensional model of customization is preserved to the file at .STL formats；
(3) file of .STL formats is imported in the Slice Software of FDM printers configuration and carries out model filling, compactedness is set
It is 100%, then carries out position and put operation, when the position put is suitble to be put into IC chip and induction antenna in print procedure
It carries out sectioning and preserves the file format identified at FDM printers；
(4) file after slice is imported into FDM printers, starts the three-dimensional real of printing personalization after thermoplasticity silk material is installed
Body；
(5) the time-out printing process when FDM printers print to appropriate cross section, passes through height by IC chip and induction antenna
Warm double faced adhesive tape is fixed on the cross section, then restores printing, completes print job, realizes the envelope of IC chip and induction antenna
Dress.
(6) after the completion of personalized three dimensional model printing, printed entity is removed from forming board, it is extra to remove
Support section completes the read-write operation of data close to reader surface.
The 3 d modeling software can be：3D MAX, Pro/E, solidworks, AUTO CAD etc..
The .STL formatted files are a kind of texts for indicating triangular mesh in computer graphics application system
Part format.
The sectioning refers to that the model of .STL formats is cut into many continuous cross sections by Slice Software, transversal
Include the information of FDM printer head motion tracks on face.
It refer to when only compactedness is 100% inside model is just entity that the setting compactedness, which is 100%, both can be with
The intensity of model after encapsulating can be ensured by providing fixed cross section again for IC chip and induction antenna.
The appropriate cross section refers to that the top of the cross-sectional distance threedimensional model or the distance of lowermost end are less than
2cm, only in this distance range, the circuit that noncontact IC chip and induction antenna are constituted could be by reader identification.
The diameter of the cross section has to be larger than the diameter of induction antenna and the constituted loop of IC chip.
The thermoplasticity silk material refers to polylactic acid (PLA) silk material, ABS plastic silk material, the heat suitable for FDM printing-formings
Plastic polyurethane elastomer rubber (TPU) silk material etc..
The IC chip and induction antenna refers to that select diameter be 0.13mm, total length to induction antenna is 77-78cm
Copper enameled wire is coiled into its round the number of turns that diameter is 20-21mm and totally 12 encloses, and connected induction antenna and IC chip by welding
It connects, the loop resonant frequency of composition is 13.56MHz, can be by reader identification.Only induction antenna is coiled into round diameter
Smaller, the adjustable range of threedimensional model size is bigger.
The support refers to contributing to the structural portion of overhung structure in threedimensional model shaped but be not belonging to threedimensional model
Point.
It is characteristic of the invention that：
Compared with the card form IC card that conventional packaging method obtains, using FDM three-dimensional printing technologies as encapsulation IC chip
With the method for induction antenna, " three-dimensional IC card " can be obtained, while possessing diversified individual stereo shape and with swiping the card
Identification, consumption function.Dull inflexible appearance style has been broken away from, according to the different shape Demand Design of each consumer and can have been led to
FDM printers encapsulation IC chip and induction antenna are crossed, meets the requirement of different user personalization, manufacturing cost can't be increased.
Traditional card form IC card is easy to be lost, is difficult to give for change after loss, and the encapsulation technology obtains " three-dimensional IC card " in modelling rank
Section can not only add anti-lost design and solve the problems, such as easy to be lost during use, and the identity of user can be added on model
Information is easy to give for change after loss.Both functions are all easily achieved using FDM3D printings encapsulation technology can't increase manufacture
Cost.
Description of the drawings
Fig. 1 is Fused Deposition Modeling (FDM) 3D printing technique process principle figure, wherein 1 is the nozzle of amplification, 2 be wire rod,
3 be nozzle, and 4 be Forming Workpiece.
Fig. 2 is the threedimensional model designed in example.
Fig. 3 is the cross section that need to fix noncontact IC chip and induction antenna, wherein 5 be the intact IC chip of connection and
Induction antenna, 6 be it is formed thereby go out cross section.
Specific implementation mode
Method of the present invention using FDM three-dimensional printing technologies as encapsulation non-contact radio-frequency IC chip and induction antenna；
For the schematic diagram of FDM printer printing technology as shown in Figure 1, using Layered manufacturing, the method being successively superimposed carries out 3D solid
Forming, selects the polylactic acid white silk material of a diameter of 1.75mm as moulding material.Personalized model as shown in Figure 2 is selected to make
To encapsulate the entity of IC chip and induction antenna.First by the model import slices software of .STL formats, then in Slice Software
Model after slice, is preserved the format identified at FDM printers simultaneously by 100% compactedness of middle setting and adjustment model placement angle
Start to print after importing FDM printers.When be formed into it is as shown in Figure 3 apart from the cross section of bottom surface 5mm when, time-out printing
Journey will connect the IC chip that intact resonant frequency is 13.56MHz and the height that induction antenna passes through 200 degree of heat resisting temperature or more
Warm double faced adhesive tape is fixed on the cross section, after the completion of fixed, starts subsequent print procedure, is completed until model prints.It will
The bottom surface of the drip molding is close to reader, you can completes the reading writing working of data.It can will be in daily life by the packaging method
The similar non-contact radio-frequency IC chip and sense such as Bus Card chip, all-in-one campus card chip and access card chips
It answers antenna to be packaged by this packaging method, obtains 3D shape different " solid card " and both met user's personalization
Demand, reduces the cost of customization, and reduces the risk of loss.
Claims (4)
1. a kind of method encapsulating noncontact IC chip and induction antenna using Fused Deposition Modeling 3D printing technique, feature
It is：Use FDM technology printing three-dimensional profile during certain cross section position is added and fix with specific dimensions with
The noncontact IC chip and induction antenna of shape, are encapsulated in the inside of threedimensional model；The certain cross section refers to
The peak of the cross-sectional distance model or the vertical range of minimum point are less than 2cm, and cross sectional dimensions is more than a diameter of 21mm
Circle；Contactless IC chip and induction antenna are welded to connect；Induction antenna selects the copper enameled wire of a diameter of 0.13mm, overall length
Degree is 77-78cm, surrounds the circle of a diameter of 20-21mm, and the number of turns 12 is enclosed totally, the resonance frequency of the loop constituted with IC chip
Rate is 13.56MHz.
2. according to Fused Deposition Modeling 3D printing technique encapsulation noncontact IC chip and induction antenna described in claim 1
Method, it is characterised in that：Thermoplasticity silk material used in the Fused Deposition Modeling 3D printing technique include polylactic acid silk material,
ABS plastic silk material or thermoplastic polyurethane elastomer rubber silk material.
3. according to Fused Deposition Modeling 3D printing technique encapsulation noncontact IC chip and induction antenna described in claim 1
Method, it is characterised in that：Noncontact IC chip and induction antenna are fixed on certain cross section using high temperature double faced adhesive tape
On.
4. according to Fused Deposition Modeling 3D printing technique encapsulation noncontact IC chip and induction antenna described in claim 1
Method, it is characterised in that：The shapes and sizes of the 3 D stereo shape are not fixed, the individual demand according to user
It designs and is made by the packaging method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810170176.XA CN108407281A (en) | 2018-03-01 | 2018-03-01 | A kind of method of the encapsulation of Fused Deposition Modeling 3D printing technique noncontact IC chip and induction antenna |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810170176.XA CN108407281A (en) | 2018-03-01 | 2018-03-01 | A kind of method of the encapsulation of Fused Deposition Modeling 3D printing technique noncontact IC chip and induction antenna |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108407281A true CN108407281A (en) | 2018-08-17 |
Family
ID=63129619
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810170176.XA Pending CN108407281A (en) | 2018-03-01 | 2018-03-01 | A kind of method of the encapsulation of Fused Deposition Modeling 3D printing technique noncontact IC chip and induction antenna |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108407281A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1414516A (en) * | 2002-09-20 | 2003-04-30 | 商庆海 | Non-contact type safety card |
| CN106313573A (en) * | 2016-08-31 | 2017-01-11 | 青岛理工大学 | 3D printing method for embedded electronic product |
-
2018
- 2018-03-01 CN CN201810170176.XA patent/CN108407281A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1414516A (en) * | 2002-09-20 | 2003-04-30 | 商庆海 | Non-contact type safety card |
| CN106313573A (en) * | 2016-08-31 | 2017-01-11 | 青岛理工大学 | 3D printing method for embedded electronic product |
Non-Patent Citations (1)
| Title |
|---|
| 李朱峰: "《Linux 2.6嵌入式系统开发与实践》", 31 May 2010, 北京航空航天大学出版社 * |
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| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180817 |