CN106313573A - 3D printing method for embedded electronic product - Google Patents
3D printing method for embedded electronic product Download PDFInfo
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- CN106313573A CN106313573A CN201610780599.4A CN201610780599A CN106313573A CN 106313573 A CN106313573 A CN 106313573A CN 201610780599 A CN201610780599 A CN 201610780599A CN 106313573 A CN106313573 A CN 106313573A
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- printing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/115—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces by spraying molten metal, i.e. spray sintering, spray casting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y10/00—Processes of additive manufacturing
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- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention discloses a 3D printing method for an embedded electronic product. The 3D printing method for the embedded electronic product includes the following steps that firstly, a base layer and a structure layer of the electronic product are printed in a fused deposition 3D printing mode; secondly, fused deposition 3D printing is paused according to a preset pause position, and electronic elements are embedded in set positions of the structure layer; thirdly, a connecting circuit among the electronic elements is printed in an electronic injection 3D printing mode; fourthly, after the circuit is completely cured, if the electronic product is of a single-layer structure, the fifth step is directly carried out, and if the electronic product is of a multi-layer structure, the first step to the third step are repeated until printing of the last layer structure is completed; and fifthly, the top layer structure of the electronic product is printed in a fused deposition 3D printing mode, and printing of a packaging structure of the electronic product is completed. Integrated manufacturing of the high-efficiency, low-cost and high-resolution embedded electronic product is realized, and integrated manufacturing of materials, structures and elements is also realized.
Description
Technical field
The invention belongs to increase material manufacture and technical field of electronic products, be specifically related to a kind of embedded electronic product 3D and print
Method.
Background technology
3D printing technique achieves the manufacture of the most arbitrarily complicated structure, is applied to Aero-Space, tissue at present
The numerous areas such as engineering, biologic medical, automobile, household electrical appliances, new material, new forms of energy, robot, building, it is shown that wide application
Prospect.Along with the fast development of 3D printing technique, in recent years 3D print have begun to be applied to electron trade, for flexible electronic,
Wearable device, intelligent sensing, embedded electronic product, functional structure electronic product, RFID of Internet-of-things, photoelectron, intelligence
Structure etc. a new generation electronic product exploitation provide a kind of brand-new manufacture method, especially for embedded electronic product exploitation with
Integration manufactures and provides a kind of brand-new solution.
Embedded electronic product (functional structure electronics) is in recent years occurred with the development of increasing material manufacturing technology
Plant novel electronic product, in printing objects structure simultaneously, by electronics units such as sensor, controller, driver, antenna, batteries
Part is simultaneously embedded in the structure printed, and some simple circuit, connection circuit etc. is directly printed, and really realizes
Functional structure electronic product integration manufactures.Compared with traditional electronic product, it is only that embedded electronic product shows some
Special advantage and outstanding feature；(1) compact conformation, lightweight, exempt to assemble, reliability is high, the manufacturing cycle is short, production cost
Low；(2) especially at some special dimension and extreme environment such as Aero-Space, high leakproofness product (embedded electronic product
Whole shell is a seamless entirety, has the most dust-proof, waterproof function) etc. demonstrate some distinctive advantages.This
Outward, embedded electronic product has also overturned traditional electro-mechanical product and the theory of electronic product exploitation, for many creative products
Exploitation provides a kind of brand-new thinking and solution.Electronic product 3D prints and has become as the current printing of 3D in the world field
One of study hotspot.
It is a kind of typical many materials, multiple dimensioned 3D printing technique that embedded electronic product 3D prints, and printed material includes
The multiple materials such as structural material (plastics, polymer, pottery, metal etc.), conductive material, dielectric material (insulant), print
The resolution of figure is high, and the characteristic size of printing relates to grand/micro-across yardstick, especially prints some electronic components and connects circuit
Further relate to sub-micron scale and even receive yardstick graphic printing.But, the most on the one hand can really realize embedded electronic product system
The 3D printer kind made is little, it addition, the electronic product 3D printing device developed is much more expensive, and the resolution especially printed
Rate relatively low (being difficult to the printing of sub-micron scale/receive yardstick figure), the material category being available for printing is limited, it is impossible to meet many
The Practical Project demand of embedded electronic product.Have a strong impact on and constrained the development of embedded electronic product and extensively should
With, print technique, equipment and material in the urgent need to developing novel embedded electronic product 3D.
Summary of the invention
It is an object of the invention to as overcoming above-mentioned the deficiencies in the prior art, solve existing 3D printing technique realize embedded
The technical problem that electronic product integration manufacture view exists, the present invention combines fusion sediment (FDM) and electricity Printing techniques, it is provided that
A kind of embedded electronic product 3D Method of printing, it is achieved efficient, low cost, high resolution built electronic product integration system
Make, provide a kind of novel solution for material, manufacture integrated with device of structure.
For achieving the above object, the present invention uses following technical proposals:
A kind of embedded electronic product 3D Method of printing, comprises the following steps:
Step 1: use fusion sediment 3D to print basal layer and the structure sheaf of electronic product；
Step 2: according to time-out position set in advance, suspends fusion sediment 3D and prints, electronic component is embedded into structure
The setting position of layer；
Step 3: use EFI print 3D to print the connection circuit between electronic component；
Step 4: after circuit is fully cured, if electronic product is single layer structure, then passes directly to step 5；If electronic product
For multiple structure, then repeating step 1-3, printing until completing last Rotating fields；
Step 5: use fusion sediment 3D to print electronic product top level structure, and complete electronic product packaging structure
Print.
The structure manufacturing electronic product is printed initially with fusion sediment 3D；Utilize fusion sediment 3D to print to interrupt suspending merit
Can, it is embedded in electronic component (such as sensor, controller, driver, antenna, battery etc.) at structure sheaf during time-out printing；With
Conductive material is printed material, uses EFI print 3D to print the connection circuit manufactured between electronic component.Fusion sediment 3D is used to beat
Print and EFI print 3D printing technique combine and manufacture embedded electronic product, and print procedure is convenient and swift efficiently.
In described step 3, after having printed connection circuit, it is also possible to be embedded in electronic devices and components at structure sheaf.At structure sheaf
In embedded electronic product can be made more to meet follow-up work with electronic devices and components such as embedded resistor, inductance, electric capacity, antennas
Demand.
In described step 1, during print structure layer, structure sheaf prints the reserved hole slot for embedding electronic component,
The reserved groove connecting circuit is printed between hole slot.Structure sheaf prints reserved hole slot, can be at Subsequent electronic element
Play positioning action during embedding, embed convenient quickly；Structure sheaf prints reserved groove, prints at follow-up connection circuit
Time can play positioning action, make the print position of connection circuit more accurate, it can in addition contain improve print circuit figure point
Resolution.
In described step 2, in the reserved hole slot in electronic component embedded structure layer.Reserved hole slot is that electronic component embeds
Setting position, can quickly find embedded location accurately when electronic component embeds.
The degree of depth of described reserved hole slot is equal with the height of electronic component.It is arranged such, it is ensured that electronic component is fine
Be entrenched in structure sheaf, it is ensured that fusion sediment 3D print suspend follow-up continue print time above reserved hole slot continue print.
In described step 3, with conductive material as printed material, in the reserved groove of structure sheaf, print connection circuit.
Print with conductive material in reserved groove and connect circuit, it is ensured that both sides electronic component is well connected.Further, it is also possible to
Improve the resolution of print circuit figure.
If structure sheaf uses conductive material to be printed material, in described step 4, after every Rotating fields has printed, at knot
Insulating barrier is printed on structure.The structure that can conduct electricity prints insulating barrier, it is ensured that embedded electronic product function in use
Requirement, and improve reliability and the safety of embedded electronic product.
Preferably, in described step 1, print location structure in basal layer or the structure sheaf setting position of electronic product.
In electronic product print procedure, being accurately positioned when changing station or place back in origin-location.
When using EFI print 3D to print, the output pulse of the power supply between printing nozzle and the workbench placing electronic product
Voltage is 0.2-5KV, output pulse frequency 10Hz-1000Hz.
When using fusion sediment 3D to print, the temperature of printed material is less than the fusing point of the conductive material used in step 3.Keep away
The conductive material exempting to have printed melts because of the follow-up printing course of processing, affects the printing of whole electronic product.
Beneficial effects of the present invention:
Present invention achieves efficiently, low cost, high resolution built electronic product integration manufacture, material, structure with
The integration manufacture of device.
The printing of circuit of the present invention uses EFI print 3D to print technique, and print resolution is high, and resolution is not by nozzle diameter
Restriction, can be on the premise of nozzle be not easily blocked, it is achieved submicron, the system of nanoscale resolution complex three-dimensional micro-nano structure
Make；And can be used for the material ranges of EFI print widely, including from insulating polymer to conducting polymer, from suspension to
SWCN solution, from metal material, inorganic functional material to biomaterial etc..Its significant advantage is compatible good
(suitable material extensive, and high viscosity liquid), low cost, simple in construction, resolution advantages of higher, especially for high viscosity
Liquid can print the pattern than nozzle structure size order of magnitude lower；Solve current electronic product 3D print resolution
Low and be available for two difficult problems of printed material limitednumber.
Electronic product structure of the present invention prints and uses fusion sediment 3D to print technique, has stock utilization high, and material becomes
The advantages such as this is low, and optional material category is many, and equipment is simple to operate, and equipment cost is low, and increasing income property of software and hardware is high, popularity rate is wide；And
And it is high with print circuit compatibility.
The present invention is available for that printed material kind is many, circuit print resolution is high, simple to operate, the advantage of low cost, fully
Utilize existing 3D printing device, it is not necessary to special electronic product 3D printer.
The present invention can create the Novel electronic product using currently manufactured technology to realize.
Accompanying drawing explanation
Fig. 1 a-Fig. 1 d is the print procedure schematic diagram of embedded electronic product of the present invention；Wherein, Fig. 1 a is for printing to structure
Layer and hole slot, the schematic diagram of groove；Fig. 1 b is the schematic diagram after embedding electronic component；Fig. 1 c is the signal having printed connection circuit
Figure；Fig. 1 d is the schematic diagram having printed top level structure；
Fig. 2 is the process chart that the present invention prints based on embedded electronic product 3D；
In figure, 1 structure printed, 101 hole slots, 102 hole slots, 103 grooves, 2 electronic components, 3 electronic components, 4 connect electricity
Road, 5 top level structures, 8 electronic products.
Detailed description of the invention
The present invention is further described with embodiment below in conjunction with the accompanying drawings.
As in figure 2 it is shown, the 3D Method of printing of embedded electronic product, it is made up of following steps process:
Step 1: according to electronic product structure, embed connect between positions of electronic parts, electronic component circuit function and
Actual requirement carries out integrated design and optimization, and design result exports the tray of fusion sediment 3D printer requirement
Formula；
Step 2: use fusion sediment 3D printer to manufacture electronic product structure and (include basic function structure, embed electronics
Hole slot structure reserved by element, and connecting electronic component connects the groove structure etc. that circuit is reserved)；
Step 3: according to time-out position set in advance (which layer), interrupts suspending 3D printer, from FDM 3D printer
Unload on workbench by print structure, it would be desirable to the electronic component of embedding is placed into and is pre-designed position (the hole slot knot printed
Structure) in；
Step 4: with electrically conductive ink as printed material, uses EFI print 3D to print and manufactures connection circuit, and embed some letters
Single electron components and parts (such as resistance, inductance, electric capacity, antenna etc.)；
Step 5: after circuit post processing is fully cured, will be printed electronic product and be reapposed FDM 3D printer pause
The front position unloaded from workbench.If being multiple structure by printout, carry out second layer structure printing.Repeat above step
Rapid 2 to 4, until completing last Rotating fields, the embedding of electronic component and connecting the printing of circuit.If not multiple structure,
Pass directly to step 6.
Step 6: complete to remain the printing of other structure (top layer) and the encapsulation of last electronic product.
Fusion sediment 3D print be available for print material include various plastics (ABS, PLA, PC, PET etc.), PEEK, nylon,
Carbon fibre material, wax, metal, dielectric material etc..
EFI print 3D print use conductive ink include electrocondution slurry, silver ink, cuprio 3D print conductive ink,
Nano Dimension company exploitation AgCite ink, liquid metal, UV electrically conductive ink, other nanometer conductive material suspension.
Structural material is if conductive material, after every Rotating fields has printed, in addition it is also necessary to carry out insulating layer material (dielectric material
Material) printing.
Connecting circuit conductive material is some such as silver ink, UV electrically conductive inks etc., and every layer of circuit prints (step 4)
After completing, need to be sintered/solidify the operations such as post processing, improve the electric conductivity of circuit.
When being printed structure design of electron products, need the location structure of Design assistant, and print, for being beaten
Print product is when fusion sediment 3D printer and EFI print and unload and place back in original time-out position on 3D printer workbench
Be accurately positioned.
The voltage pulse output of the power supply between EFI print 3D printing nozzle and workbench is 0.2-5KV, exports pulse frequency
Rate 10Hz-1000Hz, the admission pressure of printing head is 0.1-1bar.
What fusion sediment 3D printed deposits to by the temperature on print structure material not above mating conductive material
Fusing point.
In step 3, after fusion sediment 3D has printed the manufacture of every Rotating fields, unload from FDM 3D printer workbench
By print structure, before placing the electronic component being embedded into, need to remove the support in hole slot.
When physical dimension designs, with time-out layer after design electronic component the to be considered embedding of embedding electronic component hole slot
At same plane, groove depth is the thickness of electronic component, it is ensured that continuing after interrupting suspending to print this aspect is a plane.
When printing based on fusion sediment 3D, set thickness and consideration product practical structures, reasonably arrange and suspend layer
Position, arranging time-out layer height is the integral multiple of thickness.
The structure that printed needs between two 3D printers (FDM 3D printer and EFI print 3D printer) repeatedly
Handling (take off, place back in), it is necessary to the same position before suspending will be again placed in by print structure.
The selection of electrically conductive ink needs to consider the viscosity of electrically conductive ink, surface tension, electric conductivity, cost, Hou Chu
The many factors such as the wellability of reason, ink and substrate.
The present invention is applicable to flexible electronic, wearable device, intelligent sensing, functional structure electronic product, Internet of Things, intelligence
The field such as energy material, composite intelligent structure, photoelectron, intelligence skin, structural health monitoring, robot, unmanned plane, the suitableeest
Close the fields such as embedded electronic product, wearable device, soft robot.
As a example by the electronic product of a Rotating fields, its technical process is as shown in Fig. 1 a-Fig. 1 d, and concrete printing manufacture process is such as
Under:
The present embodiment embedded electronic product is ABS plastic by print structure material, and the material that circuit prints is conductive silver
Slurry.
Select a certain embedded electronic product 8, need the electronic component difference embedded according to the circuit of functional requirement design
It is 2 and 3, the connection circuit 4 of connecting electronic component 2 and 3, the structure 1 of printing, including the hole slot 101 of embedding electronic component 1, embedding
Enter the hole slot 102 of electronic component 2, connect circuitry trenches 103.
The detailed process that the integration of this embedded electronic product 8 manufactures is printed based on 3D:
Step 1: first, according to the functional requirement of electronic product 8, carries out functional structure design and circuit design respectively；So
After, carrying out structure 1, embedding electronic component 2 and 3, the connection integrated design of circuit 4 and optimize design；Finally, according to
Optimizing the result of design, output 3D prints stl file；
Step 2: electronic product structure printed material selects ABS plastic, uses FDM 3D to print and manufactures basal layer (bottom)
With ground floor structure 1, while print structure 1, embed the hole slot 101 of electronic component 2 and electronic component 3 and hole slot by being used for
102, and connect circuit groove 103 print, as shown in Figure 1a simultaneously；
Step 3: print to the time-out position (the 100th layer) of setting, interrupts suspending FDM 3D and prints, from FDM printer work
Take off by print structure 1 in station, after the support of the groove 103 removing hole slot 101 and hole slot 102 and connection circuit, it would be desirable to
The electronic component 2 and the electronic component 3 that embed are placed into and are pre-designed in the hole slot 101 and hole slot 102 printed position, such as Fig. 1 b
Shown in；
Step 4: the printed material connecting circuit selects conductive silver paste, in conjunction with the connection circuitry trenches 103 previously printed, adopts
Electricity consumption spray printing 3D printer produces connection circuit 4, as illustrated in figure 1 c；
Step 5: after connection circuit is fully cured, before being reapposed FDM 3D printer pause by printing electronic product
The position taken off from workbench.If printout is multilayer circuit structure, carry out the printing of second layer circuit structure.Repeat to hold
Row above step 2, to step 4, until completing the printing of last layer of circuit structure, then goes to step 6.If not multilamellar
Structure, passes directly to step 6.The electronic product 8 that the present embodiment is printed is single layer structure 1, passes directly to step 6.
Step 6: use FDM 3D printer to complete the printing of top level structure 5 and last encapsulation, as shown in Figure 1 d；
Step 7: after completing electronic product 8 printing, take off by printout, carry out electronic product 8 performance test, including machinery
Performance and electric property.
Conductive silver paste viscosity 6000～9000cp s used by the present embodiment, vitrification point 55 DEG C, volume resistivity
0.002 Ω/cm, operating temperature-55 DEG C～100 DEG C.Use acetone as diluent preparation conductive silver paste solution, conductive silver paste with
The volume ratio of acetone is 1:3.
The FDM 3D printer Dimension Elite of Stratasys company of the present embodiment FDM 3D printer U.S..
The technological parameter of the present embodiment EFI print: spray printing voltage 2500V, shower nozzle translational speed 20mm/s, shower nozzle and base material
Distance be 0.05mm.After EFI print has printed whole connection circuit, room temperature is placed 2～5 hours so that it is be fully cured.
Although the detailed description of the invention of the present invention is described by the above-mentioned accompanying drawing that combines, but not the present invention is protected model
The restriction enclosed, one of ordinary skill in the art should be understood that on the basis of technical scheme, and those skilled in the art are not
Need to pay various amendments or deformation that creative work can make still within protection scope of the present invention.
Claims (10)
1. an embedded electronic product 3D Method of printing, is characterized in that, comprises the following steps:
Step 1: use fusion sediment 3D to print basal layer and the structure sheaf of electronic product；
Step 2: according to time-out position set in advance, suspends fusion sediment 3D and prints, electronic component is embedded into structure sheaf
Setting position；
Step 3: use EFI print 3D to print the connection circuit between electronic component；
Step 4: after circuit is fully cured, if electronic product is single layer structure, then passes directly to step 5；If electronic product is many
Rotating fields, then repeat step 1-3, prints until completing last Rotating fields；
Step 5: use fusion sediment 3D to print electronic product top level structure, and complete beating of electronic product packaging structure
Print.
2. Method of printing as claimed in claim 1, is characterized in that, in described step 3, after having printed connection circuit, it is also possible to
It is embedded in electronic devices and components at structure sheaf.
3. Method of printing as claimed in claim 1, is characterized in that, in described step 1, during print structure layer, in structure sheaf
Print the reserved hole slot for embedding electronic component, between hole slot, print the reserved groove connecting circuit.
4. Method of printing as claimed in claim 3, is characterized in that, in described step 2, and pre-in electronic component embedded structure layer
Box out in groove.
5. the Method of printing as described in claim 3 or 4, is characterized in that, the degree of depth of described reserved hole slot and the height of electronic component
Spend equal.
6. Method of printing as claimed in claim 3, is characterized in that, in described step 3, with conductive material as printed material,
Connection circuit is printed in the reserved groove of structure sheaf.
7. Method of printing as claimed in claim 1, is characterized in that, if structure sheaf uses conductive material to be printed material, in institute
State in step 4, after every Rotating fields has printed, structurally print insulating barrier.
8. Method of printing as claimed in claim 1, is characterized in that, in described step 1, in basal layer or the structure of electronic product
Location structure is printed in layer setting position.
9. Method of printing as claimed in claim 1, is characterized in that, when using EFI print 3D to print, and printing nozzle and place electricity
The voltage pulse output of the power supply between the workbench of sub-product is 0.2-5KV, output pulse frequency 10Hz-1000Hz.
10. Method of printing as claimed in claim 6, is characterized in that, when using fusion sediment 3D to print, and the temperature of printed material
Fusing point less than the conductive material used in step 3.
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| CN201610780599.4A CN106313573A (en) | 2016-08-31 | 2016-08-31 | 3D printing method for embedded electronic product |
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| CN108901138A (en) * | 2018-08-30 | 2018-11-27 | 西安瑞特三维科技有限公司 | Integral preparation method based on 3D printing ceramics and metallic circuit |
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| CN110893681A (en) * | 2018-08-22 | 2020-03-20 | 恩智浦有限公司 | Method for embedding an integrated circuit into a 3D printed object and 3D printing system |
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