CN108188590B - Cutting method of flexible medium - Google Patents
Cutting method of flexible medium Download PDFInfo
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- CN108188590B CN108188590B CN201711463521.0A CN201711463521A CN108188590B CN 108188590 B CN108188590 B CN 108188590B CN 201711463521 A CN201711463521 A CN 201711463521A CN 108188590 B CN108188590 B CN 108188590B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
- B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
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Abstract
The invention discloses a cutting method of a flexible medium, which comprises the following steps: providing a flexible medium to be cut, the flexible medium comprising opposing first and second surfaces; attaching a protective film on the first surface of the flexible medium; placing the flexible medium attached with the protective film on a vacuum adsorption platform, wherein the protective film is connected with the vacuum adsorption platform; controlling an adsorption hole of the vacuum adsorption platform to generate vacuum adsorption force, and adsorbing and fixing the protective film and the flexible medium; applying a laser cutting process to cut the flexible media from the second surface; and stripping off the protective film. The cutting method provided by the invention can avoid the problem that the edge of the flexible medium is warped, and can also avoid the damage of the surface of the vacuum adsorption platform due to cutting.
Description
Technical Field
The invention relates to a production process of a flexible display panel, in particular to a cutting method of a flexible medium.
Background
Organic light-emitting diode (OLED) display panels have the advantages of self-luminescence, high contrast, thin thickness, wide viewing angle, fast response speed, etc., and are representative of a new generation of flat panel display technology and are increasingly popular in the industry. The flexible OLED display panel is an important development trend, and the flexible OLED display panel not only can be lighter and thinner in size, but also can reduce power consumption, so that the cruising ability of corresponding products can be improved. Meanwhile, due to the flexibility and the flexibility of the flexible OLED display panel, the durability of the flexible OLED display panel is higher than that of a common hard display panel. The flexible OLED display panel can be widely applied to various products with display functions, such as tablet computers, televisions, mobile terminals and various wearable devices.
The flexible OLED display panel has a series of advantages and also has defects of the flexible OLED display panel, and due to the fact that the flexible substrate has the problems of flexibility, thermal expansibility and the like, inconvenience is brought to processing of a display device, the substrate is prone to sagging and even wrinkles or fractures are generated, and the subsequent film layer preparation process is difficult to accurately perform. In order to solve this problem, it is necessary to attach a flexible substrate to a rigid substrate such as a glass substrate for supporting and fixing the flexible substrate to facilitate the formation of a thin film. After each layer of elements forming the display panel are prepared on the flexible substrate, the rigid substrate is peeled from the flexible substrate through a peeling process, and therefore the preparation work of the flexible display panel is completed.
The currently mainstream manufacturing method of the flexible OLED display panel includes:
and S1, coating a layer of Polyimide (PI) film on the whole glass substrate as a flexible substrate by taking the glass substrate as a carrier, and preparing and forming an OLED display mother board on the flexible substrate, wherein the OLED display mother board comprises a plurality of OLED display panels.
And step S2, cutting the glass substrate and the OLED display mother board to separate the plurality of OLED display panels to form a single OLED display panel.
And S3, aiming at each single OLED display panel, separating the PI film from the glass substrate by using a Laser Lift Off (LLO) process to obtain the flexible OLED display panel.
In the above process steps, for the cutting process of step S2, a laser cutting apparatus is generally used. As is well known, the laser cutting apparatus is relatively expensive and the use cost of the apparatus is high, and in the step S2, the glass substrate needs to be cut when performing the laser cutting process, which not only consumes labor and materials, but also increases the loss and use cost of the laser cutting apparatus.
In order to improve the above mentioned problems, the prior art solutions are: firstly, stripping an OLED display mother board comprising a plurality of OLED display panels from a glass substrate; and then cutting the OLED display mother board to mutually divide the plurality of OLED display panels to form a single flexible OLED display panel. That is, in the above process steps S1 to S3, after the step S1 is performed, the step S3 is performed first and then the step S2 is performed, and the glass substrate does not need to be cut.
In the industry, the OLED display mother board peeled off from the glass substrate is generally called a fully flexible OLED display mother board, and referring to fig. 1 and fig. 2, for a cutting process of the fully flexible display mother board, firstly, a fully flexible OLED display mother board 1 is fixed on a vacuum adsorption platform in an adsorption manner, and the vacuum adsorption platform 1 includes an adsorption hole 2; then, the fully flexible OLED display mother substrate 5 is cut along a predetermined cutting line 4 using a laser cutting device 3, and a plurality of OLED display panels 6 (only one OLED display panel 6 is exemplarily shown in fig. 1 and 2) are separated from each other. This cutting process has the following problems:
(1) referring to fig. 1, the cutting lines 4 (the edges of the OLED display panel 6) are generally located between the absorption holes 2, and the cutting lines 4 have a large distance from the absorption holes 2, so that the absorption force corresponding to the positions of the cutting lines is weak, and the edges of the OLED display panel 6 are easily warped after the laser cutting process.
(2) Referring to fig. 2, when the laser cutting process is performed, the fully flexible OLED display mother substrate 5 needs to be completely cut at a position corresponding to the cutting line 4, and at this time, the surface of the vacuum adsorption platform 1 is often damaged by the laser.
Accordingly, the prior art is yet to be improved and developed.
Disclosure of Invention
In view of the defects in the prior art, the invention provides a cutting method of a flexible medium, which can avoid the problem that the edge of the flexible medium is warped and can also avoid the surface of a vacuum adsorption platform from being cut and damaged.
In order to achieve the purpose, the invention adopts the following technical scheme:
a method of cutting a flexible media, comprising:
providing a flexible medium to be cut, the flexible medium comprising opposing first and second surfaces;
attaching a protective film on the first surface of the flexible medium;
placing the flexible medium attached with the protective film on a vacuum adsorption platform, wherein the protective film is connected with the vacuum adsorption platform;
controlling an adsorption hole of the vacuum adsorption platform to generate vacuum adsorption force, and adsorbing and fixing the protective film and the flexible medium;
applying a laser cutting process to cut the flexible media from the second surface;
and stripping off the protective film.
Wherein a cutting depth of the laser cutting process is not less than a thickness of the flexible medium and less than a sum of thicknesses of the flexible medium and the protective film.
Wherein the thickness of the protective film is more than 100 μm.
Wherein the thickness of the protective film is 100-200 μm.
Wherein, the flexible medium is a flexible OLED display panel.
When the protective film is fixedly adsorbed on the vacuum adsorption platform, the vertical distance between the boundary of the protective film and the adsorption hole which is positioned in the boundary and is closest to the boundary is not more than 5 mm.
The vacuum adsorption platform is provided with a bearing assembly, the flexible medium attached with the protective film is placed on the bearing assembly, and the protective film is connected with the bearing assembly; the bearing assembly is provided with a through hole which is in fluid communication with the adsorption hole, and the through hole transmits the vacuum adsorption force generated by the vacuum adsorption platform to the protective film so as to adsorb and fix the protective film and the flexible medium; the arrangement density of the through holes in the bearing assembly is greater than that of the adsorption holes in the vacuum adsorption platform.
When the protective film is fixed on the bearing assembly in an adsorption mode, the vertical distance between the boundary of the protective film and the through hole which is located in the boundary and is closest to the boundary is not larger than 5 mm.
The bearing assembly comprises an upper surface and a lower surface which are opposite, the protective film is connected to the upper surface, and the lower surface is connected with the vacuum adsorption platform; the lower surface is provided with a groove, the through hole communicates the groove to the upper surface, and an opening of the groove on the lower surface surrounds the plurality of adsorption holes.
The lower surface of the bearing assembly is connected with the vacuum adsorption platform through a sealing piece, and the sealing piece is arranged on the edge of the groove in a surrounding mode.
According to the cutting method of the flexible medium provided by the embodiment of the invention, the protective film is firstly attached to the flexible medium, then the flexible medium and the protective film are adsorbed and fixed on the vacuum adsorption platform together, and the flexible medium and the protective film have stable and uniform adhesive force, so that the flexible medium cannot warp at the edge of the cutting line during the cutting process. In addition, the protective film is connected between the flexible medium and the vacuum adsorption platform, and the parameters of laser cutting are controlled so that the protective film is not penetrated when the flexible medium is cut off and the surface of the vacuum adsorption platform is not damaged.
Drawings
FIG. 1 is a schematic diagram of a prior art top view of a fully flexible display mother board during cutting;
fig. 2 is a schematic cross-sectional view illustrating a full flexible display mother substrate cut in the prior art;
fig. 3 is a process flow diagram of a method for cutting a flexible medium according to embodiment 1 of the present invention;
fig. 4a to 4e are structural diagrams corresponding to various process steps in the method for cutting a flexible medium provided in embodiment 1 of the present invention;
FIG. 5 is a schematic top view of a vacuum chuck table with a flexible medium according to example 1 of the present invention;
FIG. 6 is a schematic structural diagram of a flexible medium connected to a vacuum adsorption platform through a carrying assembly in embodiment 2 of the present invention;
fig. 7 is a schematic top view of a flexible medium placed on a carrier assembly according to embodiment 2 of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, embodiments of the present invention are described in detail below with reference to the accompanying drawings. Examples of these preferred embodiments are illustrated in the accompanying drawings. The embodiments of the invention shown in the drawings and described in accordance with the drawings are exemplary only, and the invention is not limited to these embodiments.
It should be noted that, in order to avoid obscuring the present invention with unnecessary details, only the structures and/or processing steps closely related to the scheme according to the present invention are shown in the drawings, and other details not so relevant to the present invention are omitted.
Example 1
The embodiment provides a cutting method of a flexible medium, and referring to fig. 3 and fig. 4a to 4e, the cutting method includes the steps of:
s11, as shown in fig. 4a, providing a flexible medium 10 to be cut, the flexible medium comprising opposing first and second surfaces 10a, 10 b. The flexible medium 10 is, for example, a flexible OLED display panel, particularly a fully flexible OLED display panel after being peeled off from a glass substrate.
S12, as shown in fig. 4b, a protective film 20 is attached to the first surface 10a of the flexible medium 10. Wherein the protective film 20 is selected to have good adhesion to the flexible medium 10 and can be removed by mechanical peeling, preferably by manual tearing.
Wherein the thickness of the protective film is selected to be greater than 100 μm. In a preferred embodiment, the thickness of the protective film is selected within a range of 100 to 200 μm.
S13, as shown in fig. 4c, the flexible medium 10 with the protective film 20 attached is placed on a vacuum adsorption platform 30, and the protective film 20 is connected to the vacuum adsorption platform 30.
And S14, controlling the adsorption holes 31 of the vacuum adsorption platform 30 to generate vacuum adsorption force, and adsorbing and fixing the protective film 20 and the flexible medium 10.
S15, as shown in fig. 4d, the flexible medium 10 is cut from the second surface 10b of the flexible medium 10 by applying a laser cutting process. Specifically, the flexible medium 10 is cut from the second surface 10b of the flexible medium 10 along a preset cutting line 10c using a laser cutting device 40. Wherein the parameters of the laser cutting are controlled such that the protective film 20 is not penetrated when the flexible medium 10 is cut. That is, the cutting depth of the laser cutting process is controlled to be not less than the thickness of the flexible medium 10 and less than the sum of the thicknesses of the flexible medium 10 and the protective film 20, so that the flexible medium 10 can be cut smoothly without cutting the surface of the vacuum adsorption platform 30 when the cutting process is performed.
S16, as shown in fig. 4e, the protection film 20 is peeled and removed from the cut flexible medium 10. Specifically, manual tearing can be adopted, or peeling removal can be realized by means of some film peeling jigs.
The size of the protective film 20 can be selected according to actual needs, and generally, the size of the protective film 20 is larger than the flexible medium 10 to be cut. In a preferred embodiment, the size of the protective film 20 is designed by referring to the distance between the suction holes 31 of the vacuum suction platform 30, specifically, referring to fig. 5, the size of the protective film 20 is designed as follows: when the protective film 20 is fixedly adsorbed on the vacuum adsorption platform 30, the vertical distances H1 and H2 between the boundary 21 of the protective film 20 and the closest adsorption hole 31a located in the boundary 21 are not more than 5mm, preferably, H1 is equal to H2 is equal to 0, so that the protective film 20 can be better fixedly adsorbed.
In the cutting method of the flexible medium provided by the embodiment, the protective film 20 is firstly attached to the flexible medium 10, then the flexible medium 10 and the protective film 20 are adsorbed and fixed on the vacuum adsorption platform 30 together, and the flexible medium 10 and the protective film 20 have stable and uniform adhesion force, so that the flexible medium 10 does not warp at the edge of the cutting line during the cutting process. In addition, the protective film 20 is connected between the flexible medium 10 and the vacuum adsorption platform 30, and the parameters of laser cutting are controlled so that the protective film 20 is not penetrated when the flexible medium 10 is cut off, and the surface of the vacuum adsorption platform 30 is not damaged.
Example 2
Unlike embodiment 1, in this embodiment, corresponding to step S13 in embodiment 1, the protective film 20 is not directly connected to the vacuum adsorption platform 30, but a carrier assembly is first connected to the vacuum adsorption platform 30, and then the protective film 20 is connected to the carrier assembly.
As shown in fig. 6, a carrier assembly 50 is disposed on the vacuum adsorption platform 30, and the flexible medium 10 with the protective film 20 attached thereto is placed on the carrier assembly 50, and the protective film 20 is connected to the carrier assembly 50. The bearing assembly 50 is provided with a through hole 51 in fluid communication with the adsorption hole 31 of the vacuum adsorption platform 30, and the through hole 51 transmits the vacuum adsorption force generated by the vacuum adsorption platform 30 to the protective film 20 to adsorb and fix the protective film 20 and the flexible medium 10.
The arrangement density of the through holes 51 in the bearing assembly 50 is greater than the arrangement density of the adsorption holes 31 in the vacuum adsorption platform 30, that is, the hole pitch of the through holes 51 is smaller than the hole pitch of the adsorption holes 31. Generally, the vacuum adsorption stage 30 is used in production in which the hole pitch of the adsorption holes 31 is fixed and the pitch is large. If the protection film 20 and the flexible medium 10 are directly connected to the vacuum adsorption platform 30, the adsorption force at the position corresponding to the adsorption hole 31 is larger, and the adsorption force at the position between the two adsorption holes 31 is smaller, when the hole pitch of the adsorption hole 31 is larger, the difference of the adsorption force is particularly obvious, and when the adsorption force applied to each position of the protection film 20 is not uniform, the risk of abnormal cutting process is increased. Therefore, in the embodiment, by providing the carrier assembly 50 and increasing the arrangement density of the through holes 51 therein, the adsorption force applied to each position of the protective film 20 is more stable and uniform, the stability of the cutting process is improved, and the yield is improved. In addition, since the bearing assembly 50 is spaced between the flexible medium 10 and the vacuum adsorption platform 30, the vacuum adsorption platform 30 is less likely to be cut during the cutting process, and the surface of the vacuum adsorption platform 30 is more effectively prevented from being cut and damaged.
Specifically, as shown in fig. 6, the carrier assembly 50 includes an upper surface 50a and a lower surface 50b opposite to each other, the protective film 20 is attached to the upper surface 50a, and the lower surface 50b is attached to the vacuum adsorption platform 30. Further, the lower surface 50b of the carrier assembly 50 is provided with a groove 52, the through hole 51 connects the groove 52 to the upper surface 50a, and the opening of the groove 52 on the lower surface 50b surrounds the plurality of suction holes 31. Further, the lower surface 50b of the bearing assembly 50 is connected to the vacuum suction platform 30 through a sealing member 53, and the sealing member 53 is disposed around the edge of the groove 52. The seal 53 provides a sealing connection between the carrier assembly 50 and the vacuum chuck table 30, preventing air leakage when the vacuum chuck table 30 is vacuumized. Preferably, the sealing member 53 is a sealant.
In this embodiment, the size of the protection film 20 is larger than the flexible medium 10 to be cut, and the size of the protection film 20 is also designed by referring to the pitch size of the through holes 51 of the carrier assembly 50, specifically, referring to fig. 7, the size of the protection film 20 is designed as follows: when the protective film 20 is attached to the carrier assembly 50, the vertical distances H3, H4 between the boundary 21 of the protective film 20 and the nearest through hole 51a located in the boundary 21 are not greater than 5mm, preferably, H1 is equal to H2 is equal to 0, so that the protective film 20 can be attached to the carrier assembly 50.
Except for the above-mentioned different connection method for connecting the protection film 20 and the flexible medium 10 to the vacuum adsorption platform 30, the remaining process steps in this embodiment are the same as those in embodiment 1, and therefore, the description thereof is omitted.
In summary, the method for cutting a flexible medium provided by the embodiment of the invention can avoid the problem that the edge of the flexible medium is warped, and can also avoid the surface of the vacuum adsorption platform from being damaged by cutting.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
The foregoing is directed to embodiments of the present application and it is noted that numerous modifications and adaptations may be made by those skilled in the art without departing from the principles of the present application and are intended to be within the scope of the present application.
Claims (8)
1. A method of cutting a flexible media, comprising:
providing a flexible medium to be cut, the flexible medium comprising opposing first and second surfaces;
attaching a protective film on the first surface of the flexible medium;
placing the flexible medium attached with the protective film on a vacuum adsorption platform, wherein the protective film is connected with the vacuum adsorption platform;
controlling an adsorption hole of the vacuum adsorption platform to generate vacuum adsorption force, and adsorbing and fixing the protective film and the flexible medium;
applying a laser cutting process to cut the flexible media from the second surface;
stripping off the protective film;
the vacuum adsorption platform is provided with a bearing assembly, the flexible medium attached with the protective film is placed on the bearing assembly, and the protective film is connected with the bearing assembly;
the bearing assembly is provided with a through hole which is in fluid communication with the adsorption hole, and the through hole transmits the vacuum adsorption force generated by the vacuum adsorption platform to the protective film so as to adsorb and fix the protective film and the flexible medium; the arrangement density of the through holes in the bearing assembly is greater than that of the adsorption holes in the vacuum adsorption platform;
the bearing assembly comprises an upper surface and a lower surface which are opposite, the protective film is connected to the upper surface, and the lower surface is connected with the vacuum adsorption platform;
the lower surface is provided with a groove, the through hole communicates the groove to the upper surface, and an opening of the groove on the lower surface surrounds the plurality of adsorption holes.
2. The method of cutting a flexible medium according to claim 1, wherein a cutting depth of the laser cutting process is not less than a thickness of the flexible medium and less than a sum of thicknesses of the flexible medium and the protective film.
3. The method of cutting a flexible medium according to claim 2, wherein the thickness of the protective film is greater than 100 μm.
4. The method of cutting a flexible medium according to claim 3, wherein the thickness of the protective film is 100 μm to 200 μm.
5. The method of cutting a flexible medium according to claim 1, wherein the flexible medium is a flexible OLED display panel.
6. The method for cutting the flexible medium according to any one of claims 1 to 5, wherein when the protective film is suction-fixed on the vacuum suction stage, the vertical distance between the boundary of the protective film and the nearest suction hole located in the boundary is not more than 5 mm.
7. The method for cutting the flexible medium according to claim 1, wherein when the protective film is adsorbed and fixed on the bearing component, the vertical distance between the boundary of the protective film and the nearest through hole positioned in the boundary is not more than 5 mm.
8. The method of claim 1, wherein the lower surface of the carrier assembly is coupled to the vacuum suction platform via a seal disposed around an edge of the recess.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711463521.0A CN108188590B (en) | 2017-12-28 | 2017-12-28 | Cutting method of flexible medium |
| PCT/CN2018/086161 WO2019128034A1 (en) | 2017-12-28 | 2018-05-09 | Flexible medium cutting method |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201711463521.0A CN108188590B (en) | 2017-12-28 | 2017-12-28 | Cutting method of flexible medium |
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| CN108188590A CN108188590A (en) | 2018-06-22 |
| CN108188590B true CN108188590B (en) | 2020-02-18 |
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| CN109732227B (en) * | 2019-01-29 | 2020-11-10 | 京东方科技集团股份有限公司 | Flexible display device cutting device and cutting method |
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| CN111730218A (en) * | 2020-06-23 | 2020-10-02 | 深圳市合川医疗科技有限公司 | Laser cutting method for microfluidic chip |
| CN112299696A (en) * | 2020-09-11 | 2021-02-02 | 深圳市吉祥云科技有限公司 | Cutting method and cutting equipment for wave slicing |
| CN113732542A (en) * | 2021-09-24 | 2021-12-03 | 常州英诺激光科技有限公司 | Specific picosecond ultraviolet processing method and system for PI film |
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| Publication number | Publication date |
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| CN108188590A (en) | 2018-06-22 |
| WO2019128034A1 (en) | 2019-07-04 |
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