CN107995837A - Air-cooled, water cooling two uses radiator - Google Patents
Air-cooled, water cooling two uses radiator Download PDFInfo
- Publication number
- CN107995837A CN107995837A CN201711466082.9A CN201711466082A CN107995837A CN 107995837 A CN107995837 A CN 107995837A CN 201711466082 A CN201711466082 A CN 201711466082A CN 107995837 A CN107995837 A CN 107995837A
- Authority
- CN
- China
- Prior art keywords
- cooled
- air
- banding
- substrate
- radiator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 61
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 title claims abstract description 40
- 239000000758 substrate Substances 0.000 claims abstract description 28
- 230000015572 biosynthetic process Effects 0.000 claims abstract description 4
- 238000007789 sealing Methods 0.000 claims abstract description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 13
- 229910002804 graphite Inorganic materials 0.000 claims description 13
- 239000010439 graphite Substances 0.000 claims description 13
- 238000000034 method Methods 0.000 claims description 8
- 229910000838 Al alloy Inorganic materials 0.000 claims description 5
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 5
- 238000003490 calendering Methods 0.000 claims description 3
- 230000017525 heat dissipation Effects 0.000 abstract description 24
- 230000000694 effects Effects 0.000 abstract description 10
- 230000005855 radiation Effects 0.000 description 10
- 238000005516 engineering process Methods 0.000 description 9
- 239000012530 fluid Substances 0.000 description 9
- 239000000463 material Substances 0.000 description 6
- 239000000956 alloy Substances 0.000 description 4
- 238000009792 diffusion process Methods 0.000 description 4
- 239000010410 layer Substances 0.000 description 4
- 238000004088 simulation Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000002250 absorbent Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 208000020442 loss of weight Diseases 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
- H05K7/20854—Heat transfer by conduction from internal heat source to heat radiating structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
- H05K7/20863—Forced ventilation, e.g. on heat dissipaters coupled to components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
- H05K7/20872—Liquid coolant without phase change
Abstract
The invention discloses a kind of air-cooled, radiator of water cooling two, including substrate, the thermal conductive surface that the outwardly formation of substrate side is in close contact with heater element, the substrate another side has upwardly extended multiple banding fins, the banding fin arrangement is formed on substrate from upper parallel multiple waveform passages up, the banding fin arrangement forms parallel multiple linear passages from left to right on substrate, and the outline border for surrounding banding fin is also removably installed on the substrate another side；The outline border upper and lower side can be respectively arranged with the air-cooled outline border of fan and the water cooled housing that all banding fins are respectively arranged with waterpipe jointing in upper and lower side is surrounded in sealing.The present invention has the advantages that good heat dissipation effect, water-cooling or wind-cooling heat dissipating can be achieved.
Description
Technical field
The present invention relates to heat dissipation element, and more particularly, to a kind of good heat dissipation effect, water-cooling or wind-cooling heat dissipating can be achieved
Air-cooled, water cooling two use radiator.
Background technology
The prior art provides several single types of cooling for controller heat dissipation, there is Water Cooling Technology, air blast cooling skill
Art, natural cooling, heat pipe heat radiation and microchannel heat dissipation etc., use, water cooling is used for high-power dissipate according to actual use situation selection
Heat, air blast cooling are suitable for open space, and natural cooling is used for small-power component, and heat pipe and microchannel are suitable for special feelings
Condition.For several single types of cooling, water-cooling effect is good, but occupied space, increases weight；Air blast cooling technology radiates
Effect is preferable, but needs to arrange fan, also occupied space；Natural cooling is suitable for small space, but heat dissipation effect is poor；Heat pipe dissipates
Thermal technology application range is limited, and microchannel cost is higher.The heavy vehicles such as present high-power electric automobile, fork truck extensively should
With, the increase of electric control system power, but existing heat dissipation technology cannot have been met the requirements, it is necessary to pursue the heat dissipation of performance higher
Device；In addition, controller heat dissipation can only select a kind of type of cooling under normal circumstances, and cannot be big according to service condition, power
Minor adjustment changes radiating mode, and in the case of Hyundai Motor changed power scope is larger, single radiating mode can not
Meet requirement.
The content of the invention
To solve the above problems, present invention aims at provide a kind of good heat dissipation effect, water-cooling or air-cooled can be achieved
Air-cooled, the water cooling two of heat dissipation use radiator.
The present invention passes through following technical measures realization, a kind of air-cooled, radiator of water cooling two, including substrate, the base
The thermal conductive surface that the outwardly formation of plate one side is in close contact with heater element, the substrate another side have upwardly extended multiple bandings
Fin, the banding fin arrangement are formed on substrate from upper parallel multiple waveform passages up, the banding fin
The parallel multiple linear passages formed on substrate from left to right are arranged in, have also been removably installed on the substrate another side
Surround the outline border of banding fin；The outline border upper and lower side can be respectively arranged with the air-cooled outline border of fan and all bandings are surrounded in sealing
Fin is respectively arranged with the water cooled housing of waterpipe jointing in upper and lower side.
As a kind of preferred embodiment, the banding fin is the thin bandlet shape in the thick top in bottom.
As a kind of preferred embodiment, the banding fin is the curved banding fin that waveform matches.
As a kind of preferred embodiment, the banding fin is made using calendering technology.
As a kind of preferred embodiment, the banding fin and substrate are aluminium alloy or copper alloy.
As a kind of preferred embodiment, the thermal conductive surface is graphite heat radiation fin.
As a kind of preferred embodiment, the banding fin is graphite flake.
The linear passage set present invention utilizes waveform passage setting up and down and left and right forms turbulent-flow heat-exchanging technology,
And air blast cooling heat dissipation and water-cooling can be respectively used to, suitable for the big control system of electric automobile of high-power, changed power
Heat dissipation.Waveform passage considers mobile performance and the flow-boundary-layer thickness change of fluid, and fluid flow resistance is down to most
It is low, reduce flow loss and local resistance loss.Using turbulent-flow heat-exchanging mechanism, by waveform channel decomposition into some small band sections,
Linear passage water conservancy diversion is used at the same time, the turbulent flow effect of fluid is improved in the case of drag losses is less, and the solid convection current of increase stream is changed
Hot coefficient.This radiator can be according to applying working condition, operation watt level, in the situation that controller box and radiator do not need to change
Under, change controller radiating mode (air blast cooling heat dissipation and water-cooling) and heat radiation power size, using flexible, application prospect
It is wide, calculated by simulation, compared to the conventional fins radiator of same volume, under the same terms, its water-cooling capability improving
Nearly 1.6 times, nearly 1.8 times of air blast cooling heat-sinking capability lifting, heat dissipation performance is significantly improved, and air blast cooling heat dissipation and water cooling dissipate
Heat can be selected according to actual use situation switching, using flexible, it should wide.Wind-cooling heat dissipating, water-cooling in one, it can be achieved that
The switching at any time of two kinds of radiating modes, need to only spare platform small fan be installed additional air-cooled outline border upper and lower ends, water when air-cooled
Water cooled housing is then installed additional when cold and is connected with water tank, and change is convenient, without more heat exchange radiator, without other around changing
Parts, applicable controller power bracket is very wide, radiates available for big power controller.
Brief description of the drawings
Fig. 1 is the front view that the embodiment of the present invention does not install outline border.
Fig. 2 is the side view that the embodiment of the present invention does not install outline border.
Fig. 3 is the front view that the embodiment of the present invention installs air-cooled outline border.
Fig. 4 is the sectional view that the embodiment of the present invention installs water cooled housing.
Fig. 5 is the front view of water cooled housing of the embodiment of the present invention.
Embodiment
With reference to embodiment and compare attached drawing the present invention is described in further detail.
A kind of air-cooled, radiator of water cooling two of the present embodiment, refer to attached drawing 1 to Fig. 5, including substrate 1, the substrate
The thermal conductive surface 5 that the outwardly formation of 1 one side is in close contact with heater element 12,1 another side of substrate has upwardly extended multiple
Banding fin 2, the banding fin 2 arranges to be formed from upper parallel multiple waveform passages 4 up on substrate 1, described
Banding fin 2 arranges the parallel multiple linear passages 3 formed on substrate 1 from left to right, may be used also on 1 another side of substrate
The outline border for surrounding banding fin 2 is releasably installed；The outline border upper and lower side can be respectively arranged with the air-cooled outline border 6 of fan 7,8
The water cooled housing 9 of waterpipe jointing 10,11 is respectively arranged with upper and lower side with all banding fins of sealing encirclement.
This radiator make use of waveform passage 4 setting up and down and the linear passage 3 of left and right setting to form turbulent-flow heat-exchanging
Technology, and air blast cooling heat dissipation and water-cooling can be respectively used to, suitable for the big Control of Electric Vehicles of high-power, changed power
System radiating.Waveform passage 4 considers mobile performance and the flow-boundary-layer thickness change of fluid, and fluid flow resistance is dropped
To minimum, reduction flow loss and local resistance loss.Using turbulent-flow heat-exchanging mechanism, waveform passage 4 is resolved into some small
Band section, while linear 3 water conservancy diversion of passage is used, the turbulent flow effect of fluid is improved in the case of drag losses is less, increase stream is solid
Convection transfer rate.This radiator can not needed to change according to applying working condition, operation watt level in controller box and radiator
In the case of, change controller radiating mode (air blast cooling heat dissipation and water-cooling) and heat radiation power size, using flexible should
With having a extensive future, calculated by simulation, compared to the conventional fins radiator of same volume, under the same terms, its water-cooling energy
Power lifting it is nearly 1.6 times, air blast cooling heat-sinking capability lifting it is nearly 1.8 times, heat dissipation performance is significantly improved, and air blast cooling heat dissipation and
Water-cooling can be selected according to actual use situation switching, using flexible, it should wide.Wind-cooling heat dissipating, water-cooling in one,
The switching at any time of two kinds of radiating modes can be achieved, need to only 4 spare small fans be installed additional air-cooled 6 upper and lower ends of outline border when air-cooled
, when water cooling then installs water cooled housing 9 additional and is connected with water tank, and change is convenient, without more heat exchange radiator, without change
The other parts of surrounding, applicable controller power bracket is very wide, radiates available for big power controller.
In air-cooled, the radiator of water cooling two a embodiment, please refer to Fig.1 to Fig. 2, on the basis of previous technique scheme
It is specific to be also possible that banding fin 2 for the thin bandlet shape in the thick top in bottom.Gap between banding fin 2 is from bottom to top
Increase, meets hot-air expanded by heating principle, reduces cross-ventilation resistance to greatest extent, increase the same of air flow
When, additionally aid destruction fluid boundary layer so that hot-air can reach turbulent condition under relatively low flow velocity, greatly provide
Convection transfer rate.
In air-cooled, the radiator of water cooling two a embodiment, please refer to Fig.1 to Fig. 2, on the basis of previous technique scheme
It is specific to be also possible that banding fin 2 is the curved banding fin that waveform matches.
In air-cooled, the radiator of water cooling two a embodiment, please refer to Fig.1 to Fig. 2, on the basis of previous technique scheme
Specifically it is also possible that banding fin 2 is made using calendering technology.
In air-cooled, the radiator of water cooling two a embodiment, please refer to Fig.1 to Fig. 2, on the basis of previous technique scheme
Specifically it is also possible that banding fin 2 and substrate 1 are aluminium alloy or copper alloy.Radiator uses property aluminum alloy materials, has
Higher thermal conductivity factor and preferable hardness；Baseplate material --- the property aluminum alloy materials of function admirable are selected, and are set
Counting rational substrate shape reduces diffusion thermal resistance.The direction thermally-conductive interface that substrate shape is spread along hot-fluid progressively reduces, and meets
Hot-fluid progressively spreads the changing rule of reduction, reasonably make use of material, reduces the volume of radiator.For baseplate material and
2 material of curved surface wing heat sink, can also select Cu alloy material as needed, but material processing performance must is fulfilled for requiring, and adopts
It can further improve the heat dissipation performance of radiator with Cu alloy material, but corresponding weight also increases more, this is for system
Adversely affect, should take the circumstances into consideration to select according to actual conditions in terms of loss of weight.
In air-cooled, the radiator of water cooling two a embodiment, please refer to Fig.1 to Fig. 2, on the basis of previous technique scheme
Specifically it is also possible that thermal conductive surface 5 is graphite heat radiation fin, interface Heat Conduction Material selects high performance graphite heat sink, can be fast by heat
Speed is transferred uniformly into whole heat-absorbent surface, reduces diffusion thermal resistance and thermal contact resistance.
In air-cooled, the radiator of water cooling two a embodiment, please refer to Fig.1 to Fig. 2, on the basis of previous technique scheme
Specifically it is also possible that it is square that air-cooled, water cooling two, which uses radiator,.Minimizing, being integrated for radiator can be pushed further into, it is square
Easy to a certain number of small heat-dissipating devices that gather on radiating bottom plate, more preferable heat dissipation effect can be reached.
In air-cooled, the radiator of water cooling two a embodiment, please refer to Fig.1 to Fig. 2, on the basis of previous technique scheme
Specifically it is also possible that banding fin 2 is graphite flake.Graphite heat radiation fin can be used.High performance graphite heat sink is selected to reduce expansion
Heat dissipation resistance and interface contact heat resistance, due to the special lamellar molecular structure of graphite, the thermal conductivity factor in graphite heat radiation fin aspect
Up to 1500W/mK, the thermal conductivity factor of interlayer thermal diffusion are 20W/mK, and thermal conduction resistance make it that heat is uniform rapidly in extremely low layer
Ground is distributed in base plate of radiator plane, greatly reduces diffusion thermal resistance；Graphite heat radiation fin, can be with due to higher thermal conductivity
Heat is rapidly transmitted and distributed, comprehensive heat dissipation effect be metallic copper, more than twice of aluminium；Ultra-thin graphite heat radiation fin
Device weight can also be mitigated, more excellent heat conduction and heat radiation performance can be provided, and there is excellent pliability, can make it is larger compared with
Thin is laminar structured, can be well adapted for any surface, can be effectively reduced thermal contact resistance.
Above is, water cooling two air-cooled to the present invention is set forth with radiator, it is used to help understand the present invention, but this hair
Bright embodiment is simultaneously not restricted to the described embodiments, it is any without departing from the change made under the principle of the invention, modify, replace
Generation, combination, simplify, and should be equivalent substitute mode, is included in the interior of protection scope of the present invention.
Claims (7)
- A kind of 1. air-cooled, radiator of water cooling two, it is characterised in that:Including substrate, the outwardly formation of the substrate side with The thermal conductive surface that heater element is in close contact, the substrate another side have upwardly extended multiple banding fins, the banding fin row It is listed in be formed on substrate and is formed from upper parallel multiple waveform passages up, the banding fin arrangement on substrate from a left side The parallel multiple linear passages turned right, the outline border for surrounding banding fin is also removably installed on the substrate another side； The outline border upper and lower side can be respectively arranged with the air-cooled outline border of fan and sealing is surrounded all banding fins and set respectively in upper and lower side It is equipped with the water cooled housing of waterpipe jointing.
- 2. the air-cooled, radiator of water cooling two according to claim 1, it is characterised in that：The banding fin is thick for bottom The thin bandlet shape in top.
- 3. the air-cooled, radiator of water cooling two according to claim 1, it is characterised in that：The banding fin is waveform The curved banding fin to match.
- 4. the air-cooled, radiator of water cooling two according to claim 1, it is characterised in that：The banding fin is using calendering Technique is made.
- 5. the air-cooled, radiator of water cooling two according to claim 1, it is characterised in that：The banding fin and substrate are Aluminium alloy or copper alloy.
- 6. the air-cooled, radiator of water cooling two according to claim 1, it is characterised in that：The thermal conductive surface is graphite radiating Piece.
- 7. the air-cooled, radiator of water cooling two according to claim 1, it is characterised in that：The banding fin is graphite flake.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711466082.9A CN107995837A (en) | 2017-12-28 | 2017-12-28 | Air-cooled, water cooling two uses radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711466082.9A CN107995837A (en) | 2017-12-28 | 2017-12-28 | Air-cooled, water cooling two uses radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107995837A true CN107995837A (en) | 2018-05-04 |
Family
ID=62043310
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711466082.9A Pending CN107995837A (en) | 2017-12-28 | 2017-12-28 | Air-cooled, water cooling two uses radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107995837A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108882601A (en) * | 2018-06-20 | 2018-11-23 | 安徽恒泰机械股份有限公司 | A kind of mainboard protective cover of new-energy automobile |
| CN112292007A (en) * | 2020-11-02 | 2021-01-29 | 阳光电源股份有限公司 | Water-cooling heat dissipation device and electrical apparatus |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108882601A (en) * | 2018-06-20 | 2018-11-23 | 安徽恒泰机械股份有限公司 | A kind of mainboard protective cover of new-energy automobile |
| CN108882601B (en) * | 2018-06-20 | 2021-01-15 | 安徽恒泰机械股份有限公司 | Mainboard protective cover of new energy automobile |
| CN112292007A (en) * | 2020-11-02 | 2021-01-29 | 阳光电源股份有限公司 | Water-cooling heat dissipation device and electrical apparatus |
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Application publication date: 20180504 |