CN107608834A - Electronic equipment and information processing method - Google Patents

Electronic equipment and information processing method Download PDF

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Publication number
CN107608834A
CN107608834A CN201710708397.3A CN201710708397A CN107608834A CN 107608834 A CN107608834 A CN 107608834A CN 201710708397 A CN201710708397 A CN 201710708397A CN 107608834 A CN107608834 A CN 107608834A
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China
Prior art keywords
electronic equipment
chip
detection information
diagnosing
communication interface
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CN201710708397.3A
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Chinese (zh)
Inventor
张安宇
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Lenovo Beijing Ltd
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Lenovo Beijing Ltd
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Priority to CN201710708397.3A priority Critical patent/CN107608834A/en
Publication of CN107608834A publication Critical patent/CN107608834A/en
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Abstract

The embodiment of the invention discloses a kind of electronic equipment and information processing method.The electronic equipment is the first electronic equipment;First electronic equipment includes:Housing and the process chip in housing;First electronic equipment also includes or is connected with diagnosing chip;Diagnosing chip, for the first detection information of reading process chip, and default electric signal is detected to obtain the second detection information when electric on the first electronic equipment and/or after upper electricity, diagnosing chip includes or be connected with external communication interface;The communication interface that external communication interface includes for diagnosing chip itself, or, the communication interface being connected in the first electronic equipment with process chip.External communication interface, it is connected respectively with process chip and diagnosing chip, for by the first detection information and the second detection information, being sent to the second electronic equipment;First detection information and the second detection information, it is provided commonly for the second electronic equipment and carries out accident analysis for the first electronic equipment.

Description

Electronic equipment and information processing method
Technical field
The present invention relates to electronic technology field, more particularly to a kind of electronic equipment and information processing method.
Background technology
If electronic equipment breaks down, equipment is taken field maintenance station by user, if not depot repair, field maintenance station is just Which only can may substantially position failure to occur on chip, then whole chip is replaced.
Such maintenance mode, it is clear that maintenance cost is high, and still available part may be eliminated or return in maintenance station Occurring secondary damage in the transportation of factory causes to scrap;And in some cases, if carrying out first time maintenance to electronic equipment When, it may finely tune and just can continue to use the part, need not absolutely carry out chip replacement.
Therefore the cost of electronic failure maintenance how is reduced, it is prior art urgent problem to be solved.
The content of the invention
In view of this, the embodiment of the present invention it is expected to provide a kind of electronic equipment and information processing method, at least partly solves Above mentioned problem.
To reach above-mentioned purpose, the technical proposal of the invention is realized in this way:
First aspect of the embodiment of the present invention provides a kind of electronic equipment, and the electronic equipment is the first electronic equipment;It is described First electronic equipment includes:Housing and the process chip in the housing;First electronic equipment also includes or is connected with Diagnosing chip;The diagnosing chip is:Embedded diagnosing chip in the housing or the outside outside the housing Diagnosing chip;
The diagnosing chip, it is connected with the process chip, for reading the first detection information of the process chip, and Default electric signal is detected when electric on first electronic equipment and/or after upper electricity to obtain the second detection information, wherein, it is described First detection information includes:The status information of the predetermined function module of first electronic equipment;Second detection information is extremely Include less:The status information of at least part electric signal in first electronic equipment;
The diagnosing chip includes or is connected with external communication interface;The external communication interface be the diagnosing chip from The communication interface that body includes, or, the communication interface being connected in first electronic equipment with the process chip.
External communication interface, it is connected respectively with the process chip and the diagnosing chip, for described first to be detected Information and second detection information, are sent to the second electronic equipment;First detection information and the second detection information, jointly For second electronic equipment accident analysis is carried out for first electronic equipment.
Based on such scheme, first electronic equipment also includes:Built-in power and/or power interface;
The embedded diagnosing chip, is directly connected to built-in power and power interface.
Based on such scheme, the embedded diagnosing chip, specifically for when first electronic equipment starts, monitoring First electronic equipment starts situation, to obtain actual electrifying timing sequence and/or power-up state parameter;Wherein, the upper electric shape State parameter includes:Upper piezoelectric voltage and/or upper electric current.
Based on such scheme, the diagnosing chip, for monitoring the PWM of the functional module group using pulse width modulation (PWM) The dutycycle of signal;
And/or
The diagnosing chip, the status information for the system break of the operating system of first electronic equipment;
And/or
The diagnosing chip, for monitoring the power state information of first electronic equipment, wherein, the power supply status Information includes:At least one of battery size, power supply parameter and charge parameter;The power supply parameter includes:Supply voltage And/or supply current;The charge parameter includes:Charging voltage and/or charging current.
Based on such scheme, the external communication interface, it is additionally operable to receive the control life that second electronic equipment is sent Order;
The diagnosing chip, it is connected with the external communication interface, for responding the control command.
Based on such scheme, the control command includes at least one of:
The power-on command of first electronic equipment;
The shutdown command of first electronic equipment;
The S3 orders of first electronic equipment;
The S4 orders of first electronic equipment;
Fan control order in first electronic equipment;
The keyboard emulation operational order of first electronic equipment;
The breakpoint command of the fault diagnosis of the diagnosing chip;
The WiFi switch commands of first electronic equipment;
The USB switch commands of first electronic equipment;
The screen on-off order of first electronic equipment;
The indicator light switch control command of first electronic equipment.
Based on such scheme, the external communication interface, the adjustment for being additionally operable to receive the second electronic equipment transmission refers to Order;
The diagnosing chip, it is connected with the external communication interface, for performing the adjust instruction of fan, with based on described The radiating effect of fan determines the heat sink conception of first electronic equipment;And/or for diagnosing in first electronic equipment Firmware failure;And/or for diagnosing the service logic failure in first electronic equipment, and/or, for predetermined function The fault diagnosis of module.
Second aspect of the embodiment of the present invention provides a kind of electronic equipment, and the electronic equipment is the 3rd electronic equipment, described 3rd electronic equipment includes:Diagnosing chip and external communication interface;
The diagnosing chip, for being connected with the process chip of the first electronic equipment, for reading the process chip First detection information, and default electric signal is detected when electric on first electronic equipment and/or after upper electricity to obtain the second inspection Measurement information, wherein, first detection information includes:The status information of the predetermined function module of first electronic equipment;Institute The second detection information is stated to comprise at least:The status information of at least part electric signal in first electronic equipment;
The external communication interface, for first detection information and second detection information to be sent into the second electricity Sub- equipment, wherein, first detection information and second detection information, the 3rd electronic equipment is provided commonly for described first Electronic equipment carries out accident analysis.
The third aspect of the embodiment of the present invention provides a kind of information processing method, including:
Obtain the first detection information for voluntarily detecting formation of the process chip of the first electronic equipment;
When electric on the first electronic equipment and/or after upper electricity, the default electric signal of diagnosing chip detection obtains the second detection letter Breath, wherein, the diagnosing chip is located at the embedded diagnosing chip in the housing or the external diagnosis outside the housing Chip;
By first detection information and second detection information, the second electronics is sent to by external communication interface and set It is standby, wherein, the external communication interface is that the external communication interface is the communication interface that the diagnosing chip includes itself, Or, the communication interface being connected in first electronic equipment with the process chip;
First detection information and second detection information, second electronic equipment is provided commonly for described first Electronic equipment carries out accident analysis.
It is described when electric on the first electronic equipment and/or after upper electricity based on such scheme, the default telecommunications of diagnosing chip detection Number obtain the second detection information, including:
When first electronic equipment starts, monitor first electronic equipment and start situation, it is actually electric to obtain Sequential and/or power-up state parameter;Wherein, the power-up state parameter includes:Upper piezoelectric voltage and/or upper electric current.
Based on such scheme, methods described also includes:
The control command of the second electronic equipment transmission is received using the external communication interface being connected with diagnosing chip;
The diagnosing chip responds the control command.
Electronic equipment and information processing method provided in an embodiment of the present invention, it can be introduced in the first electronic equipment embedded Diagnosing chip is so that the external diagnosing chip of the first electronic equipment, and the diagnosing chip can detect the first electronic equipment Detection when upper electric and/or after upper electricity obtains the second inspection beyond the first detection information for supplying the first electronic equipment itself detection Measurement information, such second electronic equipment can obtain the first detection information and the second detection information, according to more detection informations Accident analysis is carried out to the first electronic equipment, more accurately judges whether the first electronic equipment breaks down and guilty culprit Functional module group.Even if so it may not be when electronic equipment occurs abnormal just directly to enter in the maintenance of a line electronic equipment Row is changed, and abnormal functional module group is accurately positioned out with reference to the first detection information and the second detection, so as to targetedly carry out Part substitutes, rather than the direct replacement of whole chip, so as to reduce maintenance cost, reduces material loss in the middle part of maintenance process.
Brief description of the drawings
Figure 1A is the first first electronic devices structure schematic diagram provided in an embodiment of the present invention;
Figure 1B is second of first electronic devices structure schematic diagrames provided in an embodiment of the present invention;
Fig. 1 C are the third the first electronic devices structure schematic diagram provided in an embodiment of the present invention;
Fig. 2 is a kind of structural representation of 3rd electronic equipment provided in an embodiment of the present invention
Fig. 3 is a kind of schematic flow sheet of information processing method provided in an embodiment of the present invention;
Fig. 4 is the connection diagram of a kind of diagnosing chip provided in an embodiment of the present invention, bluetooth module and PCH.
Embodiment
Technical scheme is further elaborated below in conjunction with Figure of description and specific embodiment.
As shown in Figure 1A, Figure 1B and Fig. 1 C, the embodiment of the present invention provides a kind of first electronic equipment;First electronics is set It is standby to include:Housing 110 and the process chip 120 in the housing 110;First electronic equipment also includes or is connected with to examine Disconnected chip 130;The diagnosing chip 130 is:Embedded diagnosing chip 131 in the housing 110 or positioned at the shell External diagnosis chip 132 outside body 110.I.e. described diagnosing chip 130 can be:Positioned at the insertion of first electronic equipment internal Formula diagnosing chip 131 or the external diagnosis chip 132 positioned at first electronic device exterior.
The diagnosing chip 130, it is connected with the process chip 120, for reading the first inspection of the process chip 120 Measurement information, and default electric signal is detected to obtain the second detection information when electric on first electronic equipment and/or after upper electricity, Wherein, first detection information includes:The status information of the predetermined function module of first electronic equipment;Second inspection Measurement information comprises at least:The status information of at least part electric signal in first electronic equipment;
The diagnosing chip 130 includes or is connected with external communication interface 140;The external communication interface 140 is described The communication interface that diagnosing chip 130 includes itself, or, be connected in first electronic equipment with the process chip 120 Communication interface.
External communication interface 140 can be the external communication interface 140 of first electronic equipment or described examine The external communication interface 140 of disconnected chip 130 itself, it can be used for peripheral hardware connection in a word, the external equipment can in the present embodiment For second electronic equipment.Several mouthfuls of the PERCOM peripheral communication, for by first detection information and second detection information, It is sent to the second electronic equipment;First detection information and the second detection information, it is provided commonly for second electronic equipment and enters Row accident analysis.
First electronic equipment can be mobile phone, tablet personal computer, wearable device, notebook computer, desktop computer or Server, there are some to be arranged on various types of electronic equipments such as the processing equipment in electrical equipment.
The process chip 120 can be various integrated circuits, integrated chip, or include the chip of various processors.At this Process chip 120 described in embodiment can be integrated south bridge (PCH).In certain embodiments, the process chip 120 can also be The detection of basic input and output (Basic Input and Output System, BIOS) chip.In the present embodiment, it is described Diagnosing chip 130 can detect the other detection information of BIOS one-levels.First detection information and the second inspection in the present embodiment Measurement information, the first diagnostic message and second opinion information are properly termed as again.
The diagnosing chip 130 can be the embedded chip for being embedded into first electronic equipment internal.It is for example, described embedding Enter formula chip to be on same circuit board with the process chip 120, can be connected by the prefabricated circuit on circuit board Connect, the connections such as flexible PCB or flexible cord can also be passed through.
The diagnosing chip 130 can also be fabricated to the external diagnosis chip 132 of circumscribed in some implementations.It is described outer Portion's diagnosing chip 132 can be to include the inactive component or active equipment with the connecting interface of the first electronic equipment.It is for example, described External diagnosis chip 132 can be fabricated to a USB device;The USB device includes USB plug, can be used for inserting described One electronic equipment.When the external diagnosis chip 132 is inactive component, itself does not carry power supply, during if active equipment, Self-contained built-in power is provided to electric energy for the work of itself.If the external diagnosis chip 132 is self-contained power supply Active equipment, then the outer surface of the external diagnosis chip 132 be also provided with power switch button etc., or, the company of being provided with It is connected to the charging inlet of external power supply (such as civil power).
First electronic equipment is embedded with the EMBEDDED AVIONICS in the present embodiment, or is externally connected to described Diagnosing chip 130.
The process chip 120 can be when electric on the first electronic equipment and/or after upper electricity detection predetermined electrical signals so as to Obtain the second detection information.First detection information can be the detection letter that process chip 120 voluntarily detects in the present embodiment Breath.
The upper electricity of first electronic equipment in the present embodiment can be the first electronic equipment from off-position to complete The handoff procedure of the power supply state of power supply.First electronic equipment is switched in the power up of power supply state from off-position, institute The each functional module group for stating the first electronic equipment is that have certain power supply process.And the process chip 120 or with the place The functional module group of the direct or indirect connection of chip 120 is managed, may have no idea to detect itself during upper electricity, from And some detection informations can not possibly be processed, chip 120 detects itself, introduces diagnosing chip in the present embodiment 130, the diagnosing chip 130 can be embedded diagnosing chip 131, can be to collectively form the first electronics with the process chip 120 Equipment, or, the diagnosing chip 130 can be that external diagnosis chip 132 is straight by the PCI of the first electronic equipment Be connected in succession on first electronic equipment, can to first electronic equipment it is upper electric when detect, form described the Two detection informations.
In the present embodiment, the default electric signal can be:First electronic equipment it is upper electric when various upper telecommunications Number.
The diagnosing chip 130 can also be used to detect the default electric signal in the process chip 120 after electricity.The upper electricity Afterwards can be first electronic equipment from off-position be switched to power supply state completely after default electric signal detection.
Second detection information may include the status information of the default electric signal, and the default electric signal can be institute State the status information of at least part electric signal in the first electronic equipment.The status information may include:The fluctuation status of electric signal, The information of the attribute at the various one or more moment for characterizing the electric signal such as the magnitude of voltage and/or current value of electric signal.
In certain embodiments, the external communication interface 140 can be the wireline interface of first electronic equipment, example Such as, USB interface, or, the interface that serial communication (COM) port etc. can be attached with the 3rd electronic equipment.The outside Communication interface 140 can also be asynchronous transmission standard interface (RS232).
In further embodiments, the external communication interface 140 can also be wave point, described in the present embodiment Wave point can be blue tooth interface, or, the WiFi interfaces, or infrared interface.
If the diagnosing chip 130 is embedded diagnosing chip 130 in the present embodiment, the external communication interface 140 be preferably wireless communication interface, such as can be bluetooth communication interface, the bluetooth communication interface can be sent into described second Electronic equipment.
If the external communication interface 140 is the PERCOM peripheral communication being connected with process chip 120 of first electronic equipment Interface 140, then the diagnosing chip 130 require connect to the external communication interface 140, the diagnosing chip 130, by with The connection line of interface, it can not only utilize the external communication interface 140 transmission data, it may also be used in process chip 120 not When being powered to the external communication interface 140, the external communication interface 140 directly just carried originally to first electronic equipment is powered It is set to carry out information exchange with the second electronic equipment.
As shown in Fig. 2 the present embodiment also provides another electronic equipment, the electronic equipment is the 3rd electronic equipment, described 3rd electronic equipment includes:Diagnosing chip 210 and external communication interface 220;
The diagnosing chip 210, for being connected with the process chip of the first electronic equipment, for reading the process chip The first detection information, and detect default electric signal when electric on first electronic equipment and/or after upper electricity to obtain second Detection information, wherein, first detection information includes:The status information of the predetermined function module of first electronic equipment; Second detection information comprises at least:The status information of at least part electric signal in first electronic equipment;
First detection information and second detection information, are provided commonly for the 3rd electronic equipment to first electronics Equipment carries out accident analysis.
The 3rd electronic equipment can be the electronic equipment for including the external diagnosis chip 210 in the present embodiment, institute State the 3rd electronic equipment not only also includes external communication interface 220 including diagnosing chip 210, the external communication interface 220, can use In connection first electronic equipment, it may also be used for connection second electronic equipment.
In certain embodiments, the 3rd electronic equipment may include two or more external communication interfaces 220, At least one to be used to be connected with the first electronic equipment, another is used to be connected with the second electronic equipment, like this, the described 3rd On the one hand electronic equipment can be used for detecting the first electronic equipment, while will give described second by the information transfer of detection Electronic equipment, it is available for second electronic equipment to be diagnosed.
The external communication interface 220 can be the interfaces such as USB interface in the present embodiment, can also be blue tooth interface etc..
Second electronic equipment can be the monitoring device of first electronic equipment, or, first electronic equipment Diagnostic device.
For example, being configured with monitoring application in second electronic equipment, the diagnosing chip can be according between preset time Every to second electronic equipment transmission first detection information and second detection information, the second electronic equipment root According to first detection information and second detection information, first electronic equipment is diagnosed.In some embodiments In, the transmission frequency of first detection information and second detection information can be with different.For example, the second detection letter Breath may include:The status information of the power on signal detected when electric on first electronic equipment.Diagnosing chip detects the upper telecommunications Number status information after, the second electronic equipment is just immediately sent to, to facilitate first described in second electronics diagnostic The power up of electronic equipment is with the presence or absence of exception, then according to the power on signal or power-on time at the abnormal place of power up Point, the upper electrical anomaly of which functional module group in the first electronic equipment determined.
In another example second electronic equipment can be diagnostic device, the diagnosing chip can be constantly in working condition, It can also be switched to working condition only after the instruction of second electronic equipment is received from off working state, working Second detection information is detected under state, and the first detection information read from process chip, by the first detection information and the Two detection informations are sent to the second electronic equipment simultaneously.
The 3rd electronic equipment may also include in the present embodiment:Built-in power or power interface.The built-in power Or power interface, it is powered available for the diagnosing chip and the external communication interface.
First electronic equipment also includes:Built-in power and/or power interface;The embedded diagnosing chip, it is and interior Put power supply and power interface is directly connected to.Like this, the moment that the embedded diagnosing chip is started shooting in the first electronic equipment It will directly be charged from the built-in power or power interface of the first electronic equipment to it, will not be in the processing core of the first electronic equipment Piece or other functional module groups are restarted after starting, so as to can't detect the power up of the functional module group of the first electronic equipment.
The functional module group may include:Display module, the heat radiation module of the heat abstractor such as fan composition of display screen composition; One or more of the input module of the composition such as keyboard or touch pad, the instruction module being made up of indicator lamp etc..In a word, at this Functional module group described in embodiment may correspond to various hardware components, can realize the component of certain function.
The embedded chip reusable controls first electronic equipment to be powered control in certain embodiments Embedded controller (EC).In the present embodiment by the connection with external communication interface, the second detection can be detected Information, and its first detection information for being read from process chip, are together sent to described by the external communication interface Two electronic equipments.
In certain embodiments, the embedded diagnosing chip, specifically for when first electronic equipment starts, supervising Control first electronic equipment and start situation, to obtain actual electrifying timing sequence and/or power-up state parameter;Wherein, the upper electricity State parameter includes:Upper piezoelectric voltage and/or upper electric current.
The electrifying timing sequence can be:First electronic equipment is suitable to priority in time electric on difference in functionality module Sequence.Upper electricity can be that the power supply of the first electronic equipment is never powered to the process of power supply to corresponding functional module group.The upper electric shape State parameter can be:The quantity of state of power on signal caused by upper electricity.If the power-up state parameter may include:It is initial when upper electric The stabling current after burning voltage, stabilization after voltage, initial current, stabilization, reaches the upper electric duration of burning voltage, reaches steady Determine the parameter of one or more of the stable duration of electric current state.In certain embodiments, the power-up state parameter may be used also Including:The magnitude of voltage of each moment point and/or current value etc. in power-on time.
Alternatively, the diagnosing chip 130 or diagnosing chip 210, the PWM available for monitoring using PWM functional module group The dutycycle of signal.The dutycycle can be part and the ratio in the cycle of whole pwm signal that pwm signal is not 0.Use PWM functional module group may include:The audio module of display module including loudspeaker including shaking for vibrator including display Dynamic model group, the heat radiation module such as including fan.
If the dutycycle exception of the pwm signal, the exception of these functional module groups can be caused, therefore pass through diagnosing chip Two detection informations, it may be determined that it is which functional module group particularly occurd to go out abnormal.So in the maintenance of the first electronic equipment When, just do not have to directly replace whole circuit board, so as to cause the problem of scrapping of other normal functional module groups on circuit board, Abnormal functional module group can only be replaced by abnormal positioning, reduce maintenance cost.
The diagnosing chip 130 or diagnosing chip 210, can be foregoing first electronic equipment in further embodiments The external diagnosis chip or embedded diagnosing chip of middle connection, can also be the diagnosing chip that the 3rd electronic equipment includes, in a word Status information available for the system break of the operating system of first electronic equipment.
The system terminal may include:DOS systems System Control Interrupts (System Control interrupt, SCI) and Windows systems system management interrupt (System Mangment interrupt, SMI).
Here, the status information of the system break of diagnosing chip detection, it may include:Mistake in the implementation procedure of system break The information such as journey information and implementing result.Like this, the exception of operating system itself can be can detect, so as to distinguish It is the software anomaly or other exceptions of system.The status information can be additionally used in the system break by operating system to corresponding Functional module group interruption response, determine it is abnormal which functional module group particularly occurd at, so as to be accurately positioned out first Abnormal module in electronic equipment, to reduce maintenance cost.
The diagnosing chip 130 or diagnosing chip 210, can be foregoing first electronic equipment in further embodiments The external diagnosis chip or embedded diagnosing chip of middle connection, can also be the diagnosing chip that the 3rd electronic equipment includes, are used for The power state information of first electronic equipment is monitored, wherein, the power state information includes:Battery size, power supply ginseng At least one of number and charge parameter;The power supply parameter includes:Supply voltage and/or supply current;The charging ginseng Number includes:Charging voltage and/or charging current.
The power supply parameter may include the voltage parameter outwards powered and/or current parameters.
The charge parameter corresponding voltage ginseng when can be charging of the external power source to the built-in power of the first electronic equipment Number and current parameters.
The voltage parameter may include:Maximum voltage value, average voltage level, voltage from it is above freezing be raised to burning voltage when One or more of parameters such as length, scope range of the fluctuation of voltage, voltage pulsation frequency.
The current parameters may include:Maximum current value, average current value, electric current from it is above freezing be raised to stabling current when One or more of parameter such as length, current fluctuation scope, current fluctuation frequency.
In certain embodiments, the external communication interface, the external communication interface can be in first electronic equipment External communication interface, can also be the external communication interface in the 3rd electronic equipment, available for receive it is described second electricity The control command that sub- equipment is sent;The diagnosing chip, it is connected with the external communication interface, for responding the control life Order.
The control command may include:Diagnosis starts order, detection parameters send order etc..The diagnosis starts order and used Start diagnosis in triggering the diagnosing chip, to obtain first detection information and/or the second detection information.The detection ginseng Number sends order, and the first detection information and/or the second inspection are sent to second electronic equipment for triggering the diagnosing chip Measurement information.
In certain embodiments, the control command may also include:Indicate the diagnosing chip specifically to which function The instruction that part or which running status to the first electronic equipment are detected.
In a word, the diagnosing chip after the control command is received, can perform corresponding control in the present embodiment System order, to assist second electronic equipment to carry out targetedly or comprehensively diagnosing to the first electronic equipment, depending on The abnormal module of the first electronic equipment of position.
Alternatively, the control command includes at least one of:
The power-on command of first electronic equipment;Power-on command can be used for the start of the first electronic equipment of control.
The shutdown command of first electronic equipment;Shutdown command can be used for the shutdown of the first electronic equipment of control.
Whether by the execution of power-on command and shutdown command, it is normal to orient the switching on and shutting down of the first electronic equipment, If there is exception and by the practice condition of power-on command and shutdown command, abnormity point is oriented.
The S3 orders of first electronic equipment;S3 orders are a kind of dormancy instruction, and S3 instructions can control the first electricity Sub- equipment enters the first resting state, part running state information of the meeting by operating system before dormancy under the first resting state Store in random access memory (RAM).
The S4 orders of first electronic equipment;S4 orders are another dormancy instruction, and S4 instructions can control electronics Equipment enters the second resting state;All running state informations of the operating system before dormancy can be answered under the second resting state System storage is into hard disk, and so after resting state exits, the first electronic equipment can be directly returned to the state before dormancy.
Fan control order in first electronic equipment;Fan control life order may include to regulate and control that the first electronics is set The order of the running status of standby internal fan, it may include regulate and control the speed control commands of rotating speed, the startup that control fan is started working Order and ceasing and desisting order of being stopped of control fan etc. one or more.
The keyboard emulation operational order of first electronic equipment;First electronic equipment can include physical keyboard or virtual Keyboard.Here physical keyboard may include:Membrane keyboard or mechanical keyboard etc. include the keyboard of various physical buttons;The keyboard Can be at least one of alphabetic keypad, keyboard symbol and/or numeric keypad.The dummy keyboard can be by showing screen display The keyboard shown or the keyboard for passing through projection transmission.The keyboard emulation operational order in the present embodiment, can be pressed for artificial physical Key and/or virtual key are user-operably caused push button signalling instruction;The place of the first electronic equipment is output to by the instruction Chip or key response chip are managed, the key response of the first electronic equipment is tested, so as to test the first electronic equipment to case Whether the processing of part operation is normal, so that it is determined that orienting the abnormal processing for whether appearing in keyboard either keyboard signal instruction Whether response is normal.
The breakpoint command of the fault diagnosis of the diagnosing chip;The breakpoint command can be in the present embodiment:Carry out event The whole DTC of barrier diagnosis carries out forcing to separate, and by the setting of breakpoint command, which can appear in failure Individual part, so as to be diagnosed to be abnormal point, so as to which that realizes failure is accurately positioned diagnosis.
The WiFi switch commands of first electronic equipment;Here WiFi switch commands include:WiFi open commands and At least one of WiFi shutdown commands.Like this, WiFi that can be by WiFi switch commands by the first electronic equipment Whether the function of module is normal.
The USB switch commands of first electronic equipment;The USB switch commands may include:USB open commands and At least one of USB shutdown command, like this, can be by USB switch commands by the first electronic equipment
The screen on-off order of first electronic equipment;The screen on-off order may include:Screen opening order and/ Or screen shutdown command, whether unusual condition can occur with test screen by the order.
The indicator light switch control command of first electronic equipment.The indicator light switch order, it may include:Indicator lamp Open command and indicator lamp shutdown command.Here indicator lamp may include:Various types of indicator lamps, for example, screen Indicator lamp, the first electronic equipment of instruction are in the breath light of running status, instruction fan is in indicator lamp of normal work etc..It is logical The transmission of the switch control command of the indicator lamp is crossed, controls the first electronic equipment to specify corresponding grasp by the diagnosing chip Make, so as to detect whether indicator lamp exception and out-of-the way position occurs.
Alternatively, methods described also includes:
The external communication interface 140 or external communication interface 220, can be the outside connected in foregoing first electronic equipment Communication interface can also be the external communication interface that the 3rd electronic equipment includes, and be additionally operable to receive the second electronic equipment transmission Adjust instruction;
The diagnosing chip 130 or diagnosing chip 210, can be the external diagnosis chip connected in foregoing first electronic equipment Or embedded diagnosing chip, the diagnosing chip that the 3rd electronic equipment includes is can also be, can be connected with the external communication interface, For performing the adjust instruction of fan, the radiating side of first electronic equipment is determined with the radiating effect based on the fan Case;And/or for diagnosing the firmware failure in first electronic equipment;And/or for diagnosing first electronic equipment Interior service logic failure, and/or, the fault diagnosis for predetermined function module.
The adjust instruction of the fan, it may include at least one of:
Control the startup order of starting fan
What control fan stopped ceasing and desisting order;
Control the adjustment of rotational speed order of rotation speed of the fan;
Control the power adjustment commands of the heat radiation power of fan;
Specify the specified order of the heat sink conception of fan;For example, it may include in the heat sink conception:One or more of fan The various running parameters of individual working hour.For example, the working hour includes:First electronic equipment starts period, underload fortune Row period and heavy-duty service period etc..Different periods, the running parameter of the fan can be different.For example, section can on startup To be radiated with less heat radiation power;The underrun period is radiated with relatively low heat radiation power, is transported in high load capacity Row period fan is radiated etc. with higher or maximum heat radiation power.
The firmware can be to fire code in the electronic device in advance, for example, firmware in BIOS etc., in the present embodiment Described in diagnosing chip can also carry out the diagnosis of the firmware failure in the first electronic equipment.
The diagnosing chip in certain embodiments, it can be also used for examining for the service logic failure in the first electronic equipment It is disconnected.The service logic is generally presented in the first electronic equipment in form of software programs, can pass through the first electronic equipment Operation realize the fault diagnosis of above-mentioned firmware.For example, the service logic may include:The service logic of social networking application, shopping The various logics such as the service logic of application, the service logic of mobile payment application.For example, the industry for the various applications installed on mainboard Business logic be all diagnosed to be occur it is abnormal when, it may be determined that need change mainboard;Like this, the practice condition of service logic is passed through Diagnosis, it may be determined that whether need change mainboard.
The predetermined function module can be the fault diagnosis of various hardware capability modules.The predetermined function module can wrap Include it is following at least one:
Display panel, it is the part of display screen, it may include each display display is used for display image and/or word;
Audio module, for exporting audio.
Hard disk, stored for information;
Touch panel, it may include:The touch panel overlapped with display panel, it can also include being arranged on together with keyboard Nontransparent touch panel of one plane.Here touch panel can be various as Man Machine Interface and carry out information exchange Panel, human-computer interaction interface can be served as, receive the instruction of user's input.
Battery, for detecting whether battery normal and the various condition informations such as aging conditions, so that it is determined that going out the first electricity It is the battery reason such as cell degradation that sub- equipment current standby time is too short, or leaky etc. occurs in mainboard etc..
As shown in figure 3, the present embodiment provides a kind of information processing method, including:
Step S110:Obtain the first detection information for voluntarily detecting formation of the process chip of the first electronic equipment;
Step S120:When electric on the first electronic equipment and/or after upper electricity, the default electric signal of diagnosing chip detection obtains the Two detection informations, wherein, the diagnosing chip is located at embedded diagnosing chip in the housing or outside the housing External diagnosis chip;
Step S130:By first detection information and second detection information, it is sent to by external communication interface Second electronic equipment, wherein, the external communication interface external communication interface is that the diagnosing chip includes itself Communication interface, or, the communication interface being connected in first electronic equipment with the process chip;The first detection letter Breath and second detection information, it is provided commonly for second electronic equipment and accident analysis is carried out to first electronic equipment.
It is the information processing method in operational diagnostics chip in the present embodiment.The diagnosing chip can be the first electronic equipment Embedded diagnosing chip or the external diagnosis chip of first electronic equipment connection,
The external diagnosis chip is connected with the first electronic equipment, can read the of the formation of the first electronic equipment automatic detection One detection information, and can detect and to form the second detection information, and the first detection information and the second detection information are sent to Two electronic equipments, accident analysis is carried out to the first electronic equipment for the second electronic equipment.Here accident analysis may include:Diagnosis Whether the first electronics faulty and abort situation.
The diagnosis when diagnosing chip can be used for carrying out electric on the first electronic equipment in the present embodiment, i.e., to the first electricity Sub- equipment is diagnosed when starting, and can be obtained other chips of the first electronic equipment before upper electricity, be examined caused by it can not go up electricity Survey, so as to obtain the second detection information that the first electronic equipment can not be detected voluntarily.Such second detection information is examined to first Measurement information is supplied, so as to be easy to the accident analysis of the second electronic equipment and fault location.
Further, the step S120 may include:When first electronic equipment starts, first electronics is monitored Equipment starts situation, to obtain actual electrifying timing sequence and/or power-up state parameter;Wherein, the power-up state parameter includes:On Piezoelectric voltage and/or upper electric current.
Here electrifying timing sequence is related to power-up state parameter to be described in detail, and may refer to the description of previous embodiment, Just it is not repeated herein.
Further, methods described also includes:
The control command of the second electronic equipment transmission is received using the external communication interface being connected with diagnosing chip;
The diagnosing chip responds the control command.
For example, the control command includes at least one of:
The power-on command of first electronic equipment;
The shutdown command of first electronic equipment;
The S3 orders of first electronic equipment;
The S4 orders of first electronic equipment;
Fan control order in first electronic equipment;
The keyboard emulation operational order of first electronic equipment;
The breakpoint command of the fault diagnosis of the diagnosing chip;
The WiFi switch commands of first electronic equipment;
The USB switch commands of first electronic equipment;
The screen on-off order of first electronic equipment;
The indicator light switch control command of first electronic equipment.
Further, methods described also includes:
Receive the adjust instruction that second electronic equipment is sent;
The diagnosing chip performs the adjust instruction of fan, and first electricity is determined with the radiating effect based on the fan The heat sink conception of sub- equipment.
In further embodiments, methods described also includes:
The firmware failure that the control command sent according to the second electronic equipment is broken in first electronic equipment.
In further embodiments,
Methods described also includes:
Receive the service logic failure in control command diagnosis first electronic equipment of the second electronic equipment transmission.
In further embodiments, methods described specifically may include:The control sent according to second electronic equipment Order the fault diagnosis to predetermined function module.
In further embodiments, methods described also may particularly include:The control sent according to second electronic equipment Order, monitoring use the dutycycle of the pwm signal of the functional module group of pulse width modulation (PWM);
And/or
To the status information of the system break of the operating system of first electronic equipment;
And/or
The power state information of first electronic equipment is monitored, wherein, the power state information includes:Cell type Number, power supply parameter and charge parameter at least one;The power supply parameter includes:Supply voltage and/or supply current;Institute Stating charge parameter includes:Charging voltage and/or charging current.
Two specific examples are provided below in conjunction with above-described embodiment:
Example 1:
The combination module of embedded controller (EC) and blue tooth interface (Blue Tooth, BT), can help maintenance man or Person's producing line, or even user, to obtain more effective computer problem information, PC failure can be done it is effective/accurately handle.
Detection information (Debug information) caused by EC diagnosis:Compared to the diagnosis of other BIOS or system levels Mode.EC and BT combination module can obtain BIOS level all detection informations, (CPU, register, interior comprising various hardware Deposit, internal communication bus, for example, (high speed serialization computer expansion bus standard, PCIE), detection code, USB, advanced configuration and The information and state of power-management interface (ACPI), heat radiating external communication interface (external equipment interconnection bus, PCI),.
Unique detection information of other EC detections is power on signal etc.., current electric control status signal (Power Control state), the signal value of pwm signal, for example, dutycycle (PWM value), keyboard emulation signal (Keyboard Matrix state), the System Control Interrupts of EC offers or system management interrupt etc., charging current/voltage, battery size etc..
Combinations thereof module has interaction:This, which is one, can really do the function of diagnosing, and mobile phone terminal is (before corresponding to State the second electronic equipment) remotely can directly under various defined orders current system is verified, such as:Switching on and shutting down/S3/ S4 orders, control fan speed or PWM or simulate the action that some button is pressed, EC breakpoint commands are set, close WIFI/ USB, close screen, diode (Led) Ka Guan orders etc..
The combination module can match for dynamic debugging fan speed with the radiating requirements of the first electronic equipment, there is provided close Suitable heat sink conception.
The combination module can be used directly to replace diagnostic card, to do the diagnosis of firmware level.
The combination module also detects service logic etc., the service logic can be system level or application level, from And determine the need for directly changing mainboard.
The combined chip, it may further be used to make other diagnosis, for example, display panel, audio, hard disk, touch panel or battery Diagnosis etc. each side etc..
Example 2:
One kind that Fig. 4 is provided carries out the schematic diagram of PC (PC) diagnosis using diagnosing chip, is shown in figure:It is embedding Enter formula controller (EC, corresponding to foregoing embedded diagnosing chip), mobile phone and PC.EC is by internal communication bus (for example, LPC/ ESPI) it is connected with PCH.
The detection information (general designation of the first detection information and the second detection information) that the EC is obtained, it may include:Centre Manage the temperature value of device, the speed of fan, voltage and current value, hardware store state, BIOS information, system mode and detection code Etc. information.
The EC can be connected by bluetooth module with mobile phone, and bluetooth module can be connected by RS232/COM with EC.
The external diagnosis chip connection that the bluetooth can also be connected by USB interface with PCH in certain embodiments.
In several embodiments provided herein, it should be understood that disclosed apparatus and method, it can be passed through Its mode is realized.Apparatus embodiments described above are only schematical, for example, the division of the unit, is only A kind of division of logic function, there can be other dividing mode when actually realizing, such as:Multiple units or component can combine, or Another system is desirably integrated into, or some features can be ignored, or do not perform.In addition, shown or discussed each composition portion Point mutual coupling or direct-coupling or communication connection can be the INDIRECT COUPLINGs by some interfaces, equipment or unit Or communication connection, can be electrical, mechanical or other forms.
The above-mentioned unit illustrated as separating component can be or may not be physically separate, show as unit The part shown can be or may not be physical location, you can positioned at a place, can also be distributed to multiple network lists In member;Partly or entirely unit therein can be selected to realize the purpose of this embodiment scheme according to the actual needs.
In addition, each functional unit in various embodiments of the present invention can be fully integrated into a processing module, also may be used To be each unit individually as a unit, can also two or more units it is integrated in a unit;It is above-mentioned Integrated unit can both be realized in the form of hardware, can also be realized in the form of hardware adds SFU software functional unit.
One of ordinary skill in the art will appreciate that:Realizing all or part of step of above method embodiment can pass through Programmed instruction related hardware is completed, and foregoing program can be stored in a computer read/write memory medium, the program Upon execution, the step of execution includes above method embodiment;And foregoing storage medium includes:It is movable storage device, read-only Memory (ROM, Read-Only Memory), random access memory (RAM, Random Access Memory), magnetic disc or Person's CD etc. is various can be with the medium of store program codes.
The foregoing is only a specific embodiment of the invention, but protection scope of the present invention is not limited thereto, any Those familiar with the art the invention discloses technical scope in, change or replacement can be readily occurred in, should all be contained Cover within protection scope of the present invention.Therefore, protection scope of the present invention should be based on the protection scope of the described claims.

Claims (10)

1. a kind of electronic equipment, it is characterised in that the electronic equipment is the first electronic equipment;The first electronic equipment bag Include:Housing and the process chip in the housing;First electronic equipment also includes or is connected with diagnosing chip;It is described to examine Disconnected chip is:Embedded diagnosing chip in the housing or the external diagnosis chip outside the housing;
The diagnosing chip, it is connected with the process chip, for reading the first detection information of the process chip, and in institute Default electric signal is detected when stating electric on the first electronic equipment and/or after upper electricity to obtain the second detection information, wherein, described first Detection information includes:The status information of the predetermined function module of first electronic equipment;Second detection information is at least wrapped Include:The status information of at least part electric signal in first electronic equipment;
The diagnosing chip includes or is connected with external communication interface;The external communication interface is wrapped for the diagnosing chip itself The communication interface included, or, the communication interface being connected in first electronic equipment with the process chip.
External communication interface, it is connected respectively with the process chip and the diagnosing chip, for by first detection information And second detection information, it is sent to the second electronic equipment;First detection information and the second detection information, are provided commonly for Second electronic equipment carries out accident analysis for first electronic equipment.
2. electronic equipment according to claim 1, it is characterised in that
First electronic equipment also includes:Built-in power and/or power interface;
The embedded diagnosing chip, is directly connected to built-in power and power interface.
3. electronic equipment according to claim 2, it is characterised in that
The embedded diagnosing chip, specifically for when first electronic equipment starts, monitoring first electronic equipment Startup situation, to obtain actual electrifying timing sequence and/or power-up state parameter;Wherein, the power-up state parameter includes:Upper electricity electricity Pressure and/or upper electric current.
4. according to the electronic equipment described in claim 1,2 or 3, it is characterised in that
The diagnosing chip, the dutycycle of the pwm signal for monitoring the functional module group using pulse width modulation (PWM);
And/or
The diagnosing chip, the status information for the system break of the operating system of first electronic equipment;
And/or
The diagnosing chip, for monitoring the power state information of first electronic equipment, wherein, the power state information Including:At least one of battery size, power supply parameter and charge parameter;The power supply parameter includes:Supply voltage and/or Supply current;The charge parameter includes:Charging voltage and/or charging current.
5. according to the electronic equipment described in claim 1,2 or 3, it is characterised in that
The external communication interface, it is additionally operable to receive the control command that second electronic equipment is sent;
The diagnosing chip, it is connected with the external communication interface, for responding the control command.
6. electronic equipment according to claim 5, it is characterised in that
The control command includes at least one of:
The power-on command of first electronic equipment;
The shutdown command of first electronic equipment;
The S3 orders of first electronic equipment;
The S4 orders of first electronic equipment;
Fan control order in first electronic equipment;
The keyboard emulation operational order of first electronic equipment;
The breakpoint command of the fault diagnosis of the diagnosing chip;
The WiFi switch commands of first electronic equipment;
The USB switch commands of first electronic equipment;
The screen on-off order of first electronic equipment;
The indicator light switch control command of first electronic equipment.
7. according to the electronic equipment described in claim 1,2 or 3, it is characterised in that
The external communication interface, it is additionally operable to receive the adjust instruction that second electronic equipment is sent;
The diagnosing chip, it is connected with the external communication interface, for performing the adjust instruction of fan, with based on the fan Radiating effect determine the heat sink conception of first electronic equipment;And/or for diagnosing consolidating in first electronic equipment Part failure;And/or for diagnosing the service logic failure in first electronic equipment, and/or, for predetermined function module Fault diagnosis.
8. a kind of electronic equipment, it is characterised in that the electronic equipment is the 3rd electronic equipment, the 3rd electronic equipment bag Include:Diagnosing chip and external communication interface;
The diagnosing chip, for being connected with the process chip of the first electronic equipment, for reading the first of the process chip Detection information, and default electric signal is detected when electric on first electronic equipment and/or after upper electricity to obtain the second detection letter Breath, wherein, first detection information includes:The status information of the predetermined function module of first electronic equipment;Described Two detection informations comprise at least:The status information of at least part electric signal in first electronic equipment;
The external communication interface, set for first detection information and second detection information to be sent into the second electronics It is standby, wherein, first detection information and second detection information, the 3rd electronic equipment is provided commonly for first electronics Equipment carries out accident analysis.
A kind of 9. information processing method, it is characterised in that including:
Obtain the first detection information for voluntarily detecting formation of the process chip of the first electronic equipment;
When electric on the first electronic equipment and/or after upper electricity, the default electric signal of diagnosing chip detection obtains the second detection information, its In, the diagnosing chip is located at the embedded diagnosing chip in the housing or the external diagnosis chip outside the housing;
By first detection information and second detection information, the second electronic equipment is sent to by external communication interface, Wherein, the external communication interface is that the external communication interface is the communication interface that the diagnosing chip includes itself, Huo,Wei In the communication interface being connected in first electronic equipment with the process chip;
First detection information and second detection information, second electronic equipment is provided commonly for first electronics Equipment carries out accident analysis.
10. according to the method for claim 9, it is characterised in that
Described when electric on the first electronic equipment and/or after upper electricity, the default electric signal of diagnosing chip detection obtains the second detection letter Breath, including:
When first electronic equipment starts, monitor first electronic equipment and start situation, to obtain actual electrifying timing sequence And/or power-up state parameter;Wherein, the power-up state parameter includes:Upper piezoelectric voltage and/or upper electric current.
CN201710708397.3A 2017-08-17 2017-08-17 Electronic equipment and information processing method Pending CN107608834A (en)

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Application Number Priority Date Filing Date Title
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